A square electroplating small plate experimental tank electroplating equipment

Abstract

This invention relates to the field of electroplating equipment technology and discloses an electroplating equipment for a small square electroplating plate experimental tank, comprising: a main body of the equipment; an electroplating tank, internally divided into an anode tank area, a cathode tank area, and a cathode overflow tank area; an anode structure, disposed in the anode tank area, for providing metal ions; a rectifying structure, disposed in the cathode tank area, for adjusting the velocity distribution of the electroplating solution flow field, the rectifying structure including a first guiding structure, a second guiding structure, a guiding connection structure, and an observation structure; a cathode structure, disposed in the cathode tank area, for electroplating wafers; an auxiliary structure, disposed in the cathode overflow tank area, for measuring and heating the electroplating solution; and a circulation structure, disposed inside the main body of the equipment, for circulating the electroplating solution. The rectifying structure of this invention can automatically adjust the velocity distribution of the electroplating solution flow field according to the flow velocity of the electroplating solution, utilizing the impact force of the electroplating solution, and regulate turbulence. Furthermore, it can visualize the electroplating solution flow field, facilitating observation by personnel.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment technology, and in particular to an electroplating equipment for a small square electroplating plate experimental tank. Background Technology

[0002] In the semiconductor cathode tank (wafer electroplating area), the circulation of the electroplating solution is the core operation to ensure the quality (uniformity, purity, and density) and process stability of the plating layer. Its fundamental purpose is to solve the plating defects caused by problems such as "uneven material transport", "local environmental fluctuations" and "impurity accumulation" during the electroplating process. Therefore, whether the electroplating solution flows smoothly when passing through the semiconductor cathode tank is very important.

[0003] Existing wafer electroplating equipment typically uses circulating pumps and rectifiers at the inlet and outlet of the circulating pipeline to adjust the flow field of the electroplating solution. However, this adjustment method cannot directly adjust the flow field of the electroplating solution in the semiconductor cathode tank, thus exhibiting a lag. This results in significant fluctuations in the flow field of the electroplating solution in the semiconductor cathode tank. Furthermore, the irregular shapes of the anode structure and other equipment installed in the tank after the electroplating solution exits the circulating pipeline make it impossible to ensure that the velocity of the electroplating solution flow field is uniformly distributed within the semiconductor cathode tank, preventing the formation of turbulence and eddies. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an electroplating equipment for a small square electroplating plate experimental tank.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An electroplating equipment for a small square electroplating plate experimental tank, comprising:

[0007] The main body of the equipment has an electroplating tank located at the top. The interior is divided into an anode tank area, a cathode tank area, and a cathode overflow tank area. The anode structure is located in the anode tank area, and the cathode structure is located in the cathode tank area.

[0008] The rectifying structure is set in the cathode tank area to adjust the velocity distribution of the electroplating solution flow field. The rectifying structure includes a first flow guiding structure, a second flow guiding structure, a flow guiding connection structure, and an observation structure.

[0009] The first flow guiding structure includes a first flow guiding frame, multiple first flow guiding plates, and a first gear structure; the second flow guiding structure includes a second flow guiding frame, multiple second flow guiding plates, and a second gear structure; and the flow guiding connection structure includes a connecting transmission toothed belt structure.

[0010] Multiple first guide plates are linked to multiple second guide plates through a first gear structure, a second gear structure and a connecting transmission toothed belt structure. The initial angle between the first guide plate and the second guide plate is 90°, and they rotate in opposite directions when impacted by the electroplating solution.

[0011] As a further aspect of the present invention, it also includes:

[0012] An auxiliary structure, located in the cathode overflow tank area, measures and heats the electroplating solution;

[0013] The circulation structure, located inside the main body of the equipment, is used to circulate the electroplating solution.

[0014] As a further embodiment of the present invention, the main body of the equipment includes: an equipment box, and an operating structure is provided on one side of the equipment box. The operating structure is used to control the anode structure and the auxiliary structure.

[0015] As a further aspect of the present invention

[0016] The height of the first flow guide frame corresponds to the height of the electroplating tank, and the top of the first flow guide frame is provided with a first flow guide box.

[0017] Multiple first guide plates are symmetrically arranged in pairs and are installed at intervals in the first guide frame. The top of the first guide plate is rotatably inserted into the top of the first guide frame.

[0018] The first gear structure is located inside the first guide channel box. The bottom end of the first gear structure is rotatably inserted into the top end of the first guide frame. The first gear structure includes a first spur gear set, a first T-gear set, and a first end gear set. The bottom ends of the first spur gear set and the first T-gear set are fixedly connected to the top end of the adjacent first guide plate. The first spur gear set and the first T-gear set are meshed. The top of the first T-gear set and the top of the first end gear set are fitted with a first transmission toothed belt. The top end of the first end gear set extends to the outside through the top end of the first guide channel box.

[0019] As a further aspect of the present invention

[0020] The height of the second flow guide frame corresponds to the height of the electroplating tank, and a second flow guide box is provided at the top of the second flow guide frame.

[0021] Multiple second guide vanes are symmetrically arranged in pairs and are installed at intervals in the second guide frame. The top of the second guide vane is rotatably inserted into the top of the second guide frame. The number of second guide vanes is greater than the number of first guide vanes, and the interval between the second guide vanes is smaller than the interval between the first guide vanes.

[0022] The second gear structure is located inside the second guide channel box. The bottom end of the second gear structure is rotatably inserted into the top end of the second guide frame. The second gear structure includes a second spur gear set, a second T gear set, and a second end gear set. The bottom ends of the second spur gear set and the second T gear set are fixedly connected to the top end of the adjacent second guide plate. The second spur gear set and the second T gear set are meshed. The second T gear set is in the opposite position to the first T gear set. The top of the second T gear set and the top of the second end gear set are fitted with a second transmission toothed belt. The top end of the second end gear set extends to the outside through the top end of the second guide channel box.

[0023] As a further aspect of the present invention, the flow guiding connection structure also includes:

[0024] A connecting guide channel box assembly is provided, which is located between the first guide channel box and the second guide channel box. A connecting transmission toothed belt structure is provided inside the connecting guide channel box assembly, and the two ends of the connecting transmission toothed belt structure are fixedly connected to the first end gear set and the second end gear set, respectively.

[0025] As a further aspect of the present invention, the observation structure includes:

[0026] The observation frame is fixedly connected to the second flow guide frame on one side. Multiple observation strips are set on the observation frame, and multiple indicators are installed on the observation strips. The angle between the indicators and the observation strips increases as the flow rate of the electroplating solution increases.

[0027] As a further aspect of the present invention, the anode structure includes:

[0028] An anode base plate has a groove on one side and a conductive plate on the other side.

[0029] The anode copper plate is placed in a plate groove and is electrically connected to the conductive plate. When electricity is applied, electrolysis is performed to release metal ions.

[0030] An anode cover plate is located on one side of the anode copper plate, and one side of it is fixedly abutted against the anode base plate to limit the position of the anode copper plate.

[0031] An ion mounting plate is installed on one side of the anode cover plate, and an ion membrane is installed on the ion mounting plate for filtering metal ions.

[0032] The cathode structure includes:

[0033] A cathode base plate is provided, and a rectifier terminal block assembly is provided on one side of the cathode base plate;

[0034] Electroplating clamps are mounted on the rectifier terminal block assembly and are used to clamp wafers.

[0035] As a further aspect of the present invention, the auxiliary structure includes:

[0036] An overflow plate is located on one side of the cathode structure. The height of the overflow plate is lower than the height of the electroplating tank, and it is used to overflow the electroplating solution.

[0037] A heating structure is installed inside the electroplating tank to heat the electroplating solution.

[0038] Thermocouples are used to measure the temperature of electroplating solutions;

[0039] A float-type liquid level sensor is used to measure the height of the liquid level in an electroplating solution.

[0040] As a further aspect of the present invention, the loop structure includes:

[0041] The circulation pump is installed inside the main body of the equipment and is used to provide power for the circulation of the electroplating solution.

[0042] The cathode circulation pipeline has one end connected to the cathode tank area and is located on the side of the rectifier structure away from the cathode structure. The other end of the cathode circulation pipeline is connected to the discharge port of the circulation pump.

[0043] The overflow circulation pipeline has one end connected to the cathode overflow tank area and the other end connected to the inlet of the circulation pump.

[0044] The overflow drain pipe has one end connected to the middle of the overflow circulation pipe, and the other end of the overflow drain pipe extends out of the main body of the equipment to the outside, and is used to discharge the electroplating solution in the cathode overflow tank area.

[0045] The anode drain line has one end connected to the anode tank area and the other end extending outward through the electroplating tank and the main body of the equipment to drain the electroplating solution from the anode and cathode tank areas.

[0046] The beneficial effects of this invention are:

[0047] This application sets up a first flow guiding structure and a second flow guiding structure, so that when the electroplating liquid impacts the first flow guiding plate double door, as the first flow guiding plate double door gradually opens, the second flow guiding plate double door gradually closes. When the electroplating liquid impacts the second flow guiding plate double door, as the second flow guiding plate double door gradually opens, the first flow guiding plate double door gradually closes. However, at this time, the electroplating liquid continues to impact the first flow guiding plate double door. The two cancel each other out and eventually form a balance. The greater the impact force of the electroplating liquid, the greater the force canceled out by the first flow guiding plate and the second flow guiding plate, so that the flow velocity of the electroplating liquid in the cathode tank is balanced. The first flow guiding plate double door and the second flow guiding plate double door themselves can constrain the velocity distribution of the electroplating liquid flow field, and the constraint is from wide to narrow, which can effectively make the electroplating liquid flow field distribution uniform.

[0048] This application sets up an observation structure. As the electroplating solution flows, the indicator floats up. The greater the flow velocity, the higher the indicator floats up, and the closer the angle between it and the observation bar is to 90 degrees. In addition, the direction in which the indicator is facing can indicate the distribution of the electroplating solution flow field. By observing the indicator, the speed and distribution of the electroplating solution flow can be known, thus realizing the visualization of the electroplating solution flow field. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the overall structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention.

[0050] Figure 2 This is a schematic diagram of the circulation structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention;

[0051] Figure 3 This is a schematic diagram of the electroplating tank of an experimental electroplating tank for a small square electroplating plate proposed in this invention.

[0052] Figure 4 This is a schematic cross-sectional view of the electroplating tank in the experimental electroplating tank of a square electroplating small plate proposed in this invention.

[0053] Figure 5 This is a schematic diagram of the anode base plate of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention;

[0054] Figure 6 This is a schematic diagram of the cathode structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention.

[0055] Figure 7 This is a schematic diagram of the auxiliary structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention;

[0056] Figure 8 This is a schematic diagram of the rectification structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention;

[0057] Figure 9 This is a schematic diagram of the first gear structure of an electroplating equipment for a small square electroplating plate experimental tank proposed in this invention;

[0058] Figure 10 This invention proposes an electroplating equipment for a small square electroplating plate experimental tank. Figure 9 Enlarged diagram of point A in the middle.

[0059] In the diagram: 1. Main body of the equipment; 101. Equipment box; 102. Operating structure; 2. Electroplating tank; 201. Anode tank area; 202. Cathode tank area; 203. Cathode overflow tank area; 3. Anode structure; 301. Anode base plate; 302. Conductive plate; 303. Anode copper plate; 304. Anode cover plate; 305. Ion mounting plate; 306. Ion membrane; 4. Rectifying structure; 400. First flow guiding structure; 401. First flow guiding frame; 402. First flow guiding plate; 403. First flow guiding slot box; 404. First gear structure; 405. First spur gear set; 406. First T-gear set; 407. First end gear set; 408. First transmission toothed belt; 410. Second flow guiding structure; 411. Second flow guiding frame; 412. Second flow guiding plate; 413. Second flow guiding... 414. Flow channel box; 415. Second gear structure; 416. Second spur gear set; 417. Second T gear set; 418. Second transmission toothed belt; 420. Flow guiding connection structure; 421. Connecting flow guiding box group; 422. Connecting transmission toothed belt structure; 430. Observation structure; 431. Observation frame; 432. Observation strip; 5. Cathode structure; 501. Cathode base plate; 502. Rectifier terminal block group; 503. Electroplating clamp group; 6. Auxiliary structure; 601. Overflow plate; 602. Heating structure; 603. Thermocouple; 604. Float level sensor; 7. Circulation structure; 701. Circulation pump; 702. Cathode circulation pipeline; 703. Overflow circulation pipeline; 704. Overflow drainage pipeline; 705. Anode drainage pipeline; 8. Wafer. Detailed Implementation

[0060] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0061] like Figure 1 and Figure 9As shown, an electroplating equipment for a small square electroplating plate experimental tank includes: a main body 1 for supporting various components of the equipment; an electroplating tank 2 located at the top of the main body 1, internally divided into an anode tank area 201, a cathode tank area 202, and a cathode overflow tank area 203; an anode structure 3 located in the anode tank area 201 for providing metal ions; a rectifying structure 4 located in the cathode tank area 202 for adjusting the velocity distribution of the electroplating solution flow field, the rectifying structure 4 including a first guiding structure 400, a second guiding structure 410, a guiding connection structure 420, and an observation structure 430; and a cathode structure 5 located in the cathode tank area 202 for electroplating wafers 8, the rectifying structure 4 located in the cathode tank area 202 for adjusting the velocity distribution of the electroplating solution flow field. The flow structure 4 includes a first flow guiding structure 400, a second flow guiding structure 410, a flow guiding connection structure 420, and an observation structure 430. The first flow guiding structure 400 includes a first flow guiding frame 401, multiple first flow guiding plates 402, and a first gear structure 404. The second flow guiding structure 410 includes a second flow guiding frame 411, multiple second flow guiding plates 412, and a second gear structure 414. The flow guiding connection structure 420 includes a connecting transmission toothed belt structure 422. The multiple first flow guiding plates 402 are linked to the multiple second flow guiding plates 412 through the first gear structure 404, the second gear structure 414, and the connecting transmission toothed belt structure 422. The initial angle between the first flow guiding plate 402 and the second flow guiding plate 412 is 90°. When the electroplating solution impacts, they rotate in opposite directions.

[0062] like Figure 2 and Figure 4 As shown, the auxiliary structure 6 is located in the cathode overflow tank area 203 to measure and heat the electroplating solution; the circulation structure 7 is located inside the main body 1 of the equipment to circulate the electroplating solution.

[0063] like Figure 1 and Figure 2 As shown, the main body of the equipment 1 includes an equipment box 101. An operating structure 102 is provided on one side of the equipment box 101. The operating structure 102 is used to control the anode structure 3 and the auxiliary structure 6.

[0064] like Figures 8 to 10As shown, the height of the first flow guide frame 401 corresponds to the height of the electroplating tank 2. A first flow guide box 403 is provided at the top of the first flow guide frame 401. Multiple first flow guide plates 402 are symmetrically arranged in pairs, forming a shape similar to double doors, and are installed at intervals within the first flow guide frame 401, i.e., multiple double doors are arranged at intervals (each group of double door structures is arranged sequentially at intervals along the central axis of the first flow guide frame 401, and the two first flow guide plates 402 in each group are symmetrically arranged about the central axis between them). The top of the first flow guide plate 402 is rotatably inserted into the top of the first flow guide frame 401. The first gear structure 404 is located in the first flow guide box 403. Inside 03, the bottom end of the first gear structure 404 is rotatably inserted into the top end of the first guide frame 401. The first gear structure 404 includes a first spur gear set 405, a first T gear set 406, and a first end gear set 407. The bottom ends of the first spur gear set 405 and the first T gear set 406 are fixedly connected to the top end of the adjacent first guide plate 402. The first spur gear set 405 and the first T gear set 406 are meshed. The top of the first T gear set 406 and the top of the first end gear set 407 are fitted with a first transmission toothed belt 408. The top end of the first end gear set 407 extends to the outside through the top end of the first guide slot box 403.

[0065] like Figures 8 to 10As shown, the height of the second flow guide frame 411 corresponds to the height of the electroplating tank 2. A second flow guide box 413 is provided at the top of the second flow guide frame 411. Multiple second flow guide plates 412 are symmetrically arranged in pairs, forming a shape similar to double doors (as described in the installation structure of the first flow guide plate 402). They are installed at intervals within the second flow guide frame 411, i.e., multiple double doors are spaced apart. The top of the second flow guide plate 412 is rotatably inserted into the top of the second flow guide frame 411. The number of second flow guide plates 412 is greater than the number of first flow guide plates 402, and the interval between the second flow guide plates 412 is smaller than the interval between the first flow guide plates 402. That is, the density of the double doors of the second flow guide plate 412 is higher than that of the first flow guide plate 402. It is worth noting that the initial angle of the second flow guide plate 412 is different from that of the first flow guide plate 402; they form a 90-degree angle. The second gear structure 414 is located inside the second guide channel box 413. The bottom end of the second gear structure 414 is rotatably inserted into the top end of the second guide frame 411. The second gear structure 414 includes a second spur gear set 415, a second T-gear set 416, and a second end gear set 417. The bottom ends of the second spur gear set 415 and the second T-gear set 416 are fixedly connected to the top end of the adjacent second guide plate 412. The second spur gear set 415 and the second T-gear set 416 are meshed. The second T-gear set 416 is in the opposite position to the first T-gear set 406, that is, the first spur gear set 405 and the first T-gear set 406 are arranged on the left and right sides respectively. The top of the second T-gear set 416 and the top of the second end gear set 417 are fitted with a second transmission toothed belt 418. The top end of the second end gear set 417 extends to the outside through the top end of the second guide channel box 413 (e.g., Figure 9 and Figure 10 The aforementioned gear structures and gear sets are all made of corrosion-resistant stainless steel to resist corrosion from electroplating solutions.

[0066] like Figures 8 to 10 As shown, a connecting guide box assembly 421 is provided, which is located between the first guide box 403 and the second guide box 413. A connecting transmission toothed belt structure 422 is provided inside the connecting guide box assembly 421, and the two ends of the connecting transmission toothed belt structure 422 are fixedly connected to the first end gear set 407 and the second end gear set 417, respectively.

[0067] When the electroplating solution enters the cathode tank area 202 from the cathode circulation pipe 702, the electroplating solution first impacts the double door of the first guide plate 402, causing the double door of the first guide plate 402 to open. As the first guide plate 402 rotates, it will drive the corresponding first spur gear set 405 and first T gear set 406 to rotate. The rotation of the first T gear set 406 drives the first end gear set 407 through the first transmission toothed belt 408. The rotation of the first end gear set 407 drives the second end gear set 417 through the connecting transmission toothed belt structure 422. The rotation of the second end gear set 417 drives the second T gear set 416 through the second transmission toothed belt 418. The rotation of the second T gear set 416 drives the second spur gear set 415. Together, they drive the double door of the second guide plate 412 to rotate.

[0068] Since the second T-gear set 416 is in the opposite position to the first T-gear set 406, that is, if the first spur gear set 405 and the first T-gear set 406 are set to the left and right, the second spur gear set 415 and the second T-gear set 416 are set to the right and left, the rotation directions of the first guide plate 402 and the second guide plate 412 are opposite, and the initial angle of the second guide plate 412 is different from that of the first guide plate 402, and the two form a 90-degree angle. Therefore, when the double doors of the first guide plate 402 are closed, the double doors of the second guide plate 412 are opened to the maximum. As the double doors of the first guide plate 402 gradually open, the double doors of the second guide plate 412 gradually close.

[0069] Therefore, when the electroplating solution impacts the double-door of the first guide plate 402, as the double-door of the first guide plate 402 gradually opens, the double-door of the second guide plate 412 gradually closes. When the electroplating solution impacts the double-door of the second guide plate 412, as the double-door of the second guide plate 412 gradually opens, the double-door of the first guide plate 402 gradually closes. However, at this time, the electroplating solution continues to impact the double-door of the first guide plate 402. The two cancel each other out and eventually form a balance. The greater the impact force of the electroplating solution, the greater the force canceled out by the first guide plate 402 and the second guide plate 412, so that the flow velocity of the electroplating solution in the cathode tank area 202 is balanced. The double-door of the first guide plate 402 and the double-door of the second guide plate 412 can constrain the velocity distribution of the electroplating solution flow field, and the constraint gradually narrows, which can effectively make the flow field distribution of the electroplating solution uniform.

[0070] like Figure 3 and Figure 8As shown, the observation structure 430 includes an observation frame 431. One side of the observation frame 431 is fixedly connected to the second flow guide frame 411. Multiple observation strips 432 are provided on the observation frame 431, and multiple indicators are installed on the observation strips 432. The indicators are ribbon-shaped or jellyfish-shaped. As the electroplating liquid flows, the indicators float up. The greater the flow velocity, the higher the indicators float up, and the closer the angle between them and the observation strips 432 is to ninety degrees. In addition, the direction in which the indicators face can indicate the distribution of the electroplating liquid flow field. By observing the indicators, the speed and distribution of the electroplating liquid flow can be known, thus realizing the visualization of the electroplating liquid flow field.

[0071] like Figure 4 and Figure 5 As shown, the anode structure 3 includes an anode base plate 301, a groove is provided on one side of the anode base plate 301, and a conductive plate 302 is provided on one side of the anode base plate 301; an anode copper plate 303 is placed in the groove and is electrically connected to the conductive plate 302. After being energized, it electrolyzes and releases metal ions; an anode cover plate 304 is located on one side of the anode copper plate 303 and its side is fixedly abutted against the anode base plate 301 to limit the anode copper plate 303; an ion mounting plate 305 is provided on one side of the anode cover plate 304, and an ion membrane 306 (the ion membrane 306 is a cation exchange membrane) is installed on the ion mounting plate 305 to filter metal ions. The metal ions generated after the anode copper plate 303 is electrolyzed enter the cathode tank area 202 through the ion membrane 306, and impurities are filtered by the ion membrane 306.

[0072] like Figure 6 As shown, the cathode structure 5 includes a cathode base plate 501, and a rectifier terminal block assembly 502 is provided on one side of the cathode base plate 501; the electroplating clamp assembly 503 is provided on the rectifier terminal block assembly 502 and is used to clamp the wafer 8.

[0073] like Figure 7 As shown, the auxiliary structure 6 includes an overflow plate 601, which is disposed on one side of the cathode structure 5. The height of the overflow plate 601 is lower than the height of the electroplating tank 2 and is used to overflow the electroplating solution; a heating structure 602, which is disposed inside the electroplating tank 2 and is used to heat the electroplating solution; a thermocouple 603, which is used to measure the temperature of the electroplating solution; and a float level sensor 604, which is used to measure the height of the electroplating solution level.

[0074] like Figure 2 and Figure 4As shown, the circulation structure 7 includes: a circulation pump 701, which is installed inside the main body 1 of the equipment and is used to provide power for the circulation of the electroplating solution; one end of the cathode circulation pipe 702 is connected to the cathode tank area 202 and is located on the side of the rectifier structure 4 away from the cathode structure 5, and the other end of the cathode circulation pipe 702 is connected to the drain port of the circulation pump 701; one end of the overflow circulation pipe 703 is connected to the cathode overflow tank area 203, and the other end of the overflow circulation pipe 703 is connected to the inlet of the circulation pump 701.

[0075] In this application, the electroplating solution circulates along the route of circulation pump 701, cathode circulation pipeline 702, cathode tank area 202, cathode overflow tank area 203, overflow circulation pipeline 703, and circulation pump 701. After exiting the cathode circulation pipeline 702, the electroplating solution will not only flow through the cathode tank area 202 but also spread to the anode tank area 201.

[0076] like Figure 2 and Figure 4 As shown, one end of the overflow drain pipe 704 is connected to the middle of the overflow circulation pipe 703, and the other end of the overflow drain pipe 704 extends to the outside through the main body of the equipment 1 to discharge the electroplating solution in the cathode overflow tank area 203; the anode drain pipe 705 has one end connected to the anode tank area 201, and the other end of the anode drain pipe 705 extends to the outside through the electroplating tank 2 and the main body of the equipment 1 in sequence to discharge the electroplating solution in the anode tank area 201 and the cathode tank area 202.

[0077] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. An electroplating equipment for a small square electroplating plate experimental tank, characterized in that, include: Equipment body (1); The electroplating tank (2) is located at the top of the main body (1) of the equipment and is divided into an anode tank area (201), a cathode tank area (202) and a cathode overflow tank area (203). An anode structure (3) is disposed within the anode tank area (201); A cathode structure (5) is disposed within the cathode trench area (202); A rectifier structure (4) is disposed in the cathode tank area (202) for adjusting the velocity distribution of the electroplating solution flow field. The rectifier structure (4) includes a first flow guiding structure (400), a second flow guiding structure (410), a flow guiding connection structure (420), and an observation structure (430). The first flow guiding structure (400) includes a first flow guide frame (401), a plurality of first flow guide plates (402) and a first gear structure (404). The second flow guiding structure (410) includes a second flow guide frame (411), multiple second flow guide plates (412), and a second gear structure (414). The flow guiding connection structure (420) includes a connecting transmission toothed belt structure (422); Multiple first guide plates (402) are linked to multiple second guide plates (412) through a first gear structure (404), a second gear structure (414) and a connecting transmission toothed belt structure (422). The initial angle between the first guide plate (402) and the second guide plate (412) is 90°, and they rotate in opposite directions when the electroplating liquid impacts.

2. The electroplating equipment for a small square electroplating plate experimental tank according to claim 1, characterized in that, Also includes: An auxiliary structure (6) is provided in the cathode overflow tank area (203) to measure and heat the electroplating solution; A circulation structure (7) is provided inside the main body (1) of the equipment to allow the electroplating solution to circulate.

3. The electroplating equipment for a small square electroplating plate experimental tank according to claim 2, characterized in that, The main body of the equipment (1) includes: an equipment box (101), and an operating structure (102) is provided on one side of the equipment box (101). The operating structure (102) is used to control the anode structure (3) and the auxiliary structure (6).

4. The electroplating equipment for a small square electroplating plate experimental tank according to claim 1, characterized in that, The height of the first flow guide (401) corresponds to the height of the electroplating tank (2), and the top of the first flow guide (401) is provided with a first flow guide box (403). Multiple first guide plates (402) are symmetrically arranged in pairs and are installed at intervals in the first guide frame (401). The top end of the first guide plate (402) is rotatably inserted into the top end of the first guide frame (401). The first gear structure (404) is located inside the first flow guide box (403). The bottom end of the first gear structure (404) is rotatably inserted into the top end of the first flow guide frame (401). The first gear structure (404) includes a first spur gear set (405), a first T gear set (406), and a first end gear set (407). The bottom ends of the first spur gear set (405) and the first T gear set (406) are fixedly connected to the top end of the adjacent first flow guide plate (402). The first spur gear set (405) and the first T gear set (406) are meshed. The top of the first T gear set (406) and the top of the first end gear set (407) are fitted with a first transmission toothed belt (408). The top end of the first end gear set (407) extends to the outside through the top end of the first flow guide box (403).

5. The electroplating equipment for a small square electroplating plate experimental tank according to claim 4, characterized in that, The height of the second flow guide (411) corresponds to the height of the electroplating tank (2), and the top of the second flow guide (411) is provided with a second flow guide box (413). Multiple second guide plates (412) are symmetrically arranged in pairs and are installed at intervals in the second guide frame (411). The top end of the second guide plate (412) is rotatably inserted into the top end of the second guide frame (411). The number of second guide plates (412) is greater than the number of first guide plates (402). The interval between the second guide plates (412) is smaller than the interval between the first guide plates (402). The second gear structure (414) is located inside the second guide box (413). The bottom end of the second gear structure (414) is rotatably inserted into the top end of the second guide frame (411). The second gear structure (414) includes a second spur gear set (415), a second T gear set (416), and a second end gear set (417). The bottom ends of the second spur gear set (415) and the second T gear set (416) are fixedly connected to the top end of the adjacent second guide plate (412). The second spur gear set (415) and the second T gear set (416) are meshed. The second T gear set (416) is opposite in position to the first T gear set (406). The top of the second T gear set (416) and the top of the second end gear set (417) are fitted with a second transmission toothed belt (418). The top end of the second end gear set (417) extends to the outside through the top end of the second guide box (413).

6. The electroplating equipment for a small square electroplating plate experimental tank according to claim 5, characterized in that, The flow guiding connection structure (420) further includes: A connecting guide box assembly (421) is provided, which is located between the first guide box (403) and the second guide box (413). A connecting transmission toothed belt structure (422) is provided inside the connecting guide box assembly (421). The two ends of the connecting transmission toothed belt structure (422) are fixedly connected to the first end gear set (407) and the second end gear set (417), respectively.

7. The electroplating equipment for a small square electroplating plate experimental tank according to claim 6, characterized in that, The observation structure (430) includes: An observation frame (431) is fixedly connected to a second flow guide frame (411) on one side. The observation frame (431) is provided with multiple observation strips (432), and multiple indicators are installed on the observation strips (432). The angle between the indicators and the observation strips (432) increases as the flow rate of the electroplating solution increases.

8. The electroplating equipment for a small square electroplating plate experimental tank according to claim 1, characterized in that, The anode structure (3) includes: An anode base plate (301) is provided with a plate groove on one side and a conductive plate (302) is provided on one side of the anode base plate (301). Anode copper plate (303) is placed in a plate groove and electrically connected to conductive plate (302). When energized, it electrolyzes and releases metal ions. An anode cover plate (304) is located on one side of the anode copper plate (303), and one side of the cover plate is fixedly abutted against the anode base plate (301) to limit the anode copper plate (303). An ion mounting plate (305) is disposed on one side of an anode cover plate (304), and an ion membrane (306) is mounted on the ion mounting plate (305) for filtering metal ions. The cathode structure (5) includes: A cathode base plate (501) is provided with a rectifier terminal block assembly (502) on one side of the cathode base plate (501). Electroplating clamp (503), which is disposed on rectifier terminal block assembly (502) and is used to clamp wafer (8).

9. The electroplating equipment for a small square electroplating plate experimental tank according to claim 2, characterized in that, The auxiliary structure (6) includes: Overflow plate (601), the overflow plate (601) is disposed on one side of the cathode structure (5), the height of the overflow plate (601) is lower than the height of the electroplating tank (2), and is used to overflow the electroplating solution; A heating structure (602) is provided in the electroplating tank (2) for heating the electroplating solution; Thermocouple (603) is used to measure the temperature of electroplating solution; A float level sensor (604) is used to measure the height of the electroplating solution.

10. The electroplating equipment for a small square electroplating plate experimental tank according to claim 2, characterized in that, The loop structure (7) includes: A circulation pump (701) is installed inside the main body of the equipment (1) to provide power for the circulation of the electroplating solution; The cathode circulation pipeline (702) is connected at one end to the cathode tank area (202) and is located on the side of the rectifier structure (4) away from the cathode structure (5). The other end of the cathode circulation pipeline (702) is connected to the discharge port of the circulation pump (701). An overflow circulation pipeline (703) is provided, one end of which is connected to the cathode overflow tank area (203), and the other end of which is connected to the inlet of the circulation pump (701). An overflow drain pipe (704) is provided, one end of which is connected to the middle of the overflow circulation pipe (703), and the other end of which is inserted through the main body of the equipment (1) and extends to the outside, for discharging the electroplating solution in the cathode overflow tank area (203). Anode drain pipe (705), one end of which is connected to the anode tank area (201), and the other end of which is inserted through the electroplating tank (2) and the main body of the equipment (1) to extend to the outside, for discharging the electroplating solution in the anode tank area (201) and the cathode tank area (202).

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