Semiconductor laser COS power testing device and method
The heat sink sheet is divided into independent heat sink strips through a high-precision cutting system, which solves the problem of optical path obstruction in semiconductor laser testing, realizes accurate power and wavelength testing, and improves the yield of packaged products.
Patent Information
- Application Number
- CN202511010941.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-22
- Publication Date
- 2025-10-03
AI Technical Summary
In the prior art, the heat sink structure of the semiconductor laser blocks the optical signal, resulting in inaccurate power testing, an inability to effectively eliminate defective products, and a reduction in the yield of packaged products.
A high-precision cutting system is used to divide the heat sink sheet into independent heat sink strips, and precise testing of individual heat sink strips is performed on an independent test platform. Physical separation eliminates optical signal obstruction and enables accurate detection of parameters such as power and wavelength.
By physically separating the heat sink strips, accurate COS testing of semiconductor lasers is achieved, defective products are eliminated in advance, and the qualification rate and product quality of subsequent packaging stages are improved.
Smart Images
Figure CN120740932A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor laser packaging, and in particular to a semiconductor laser COS power testing device and method. Background Art
[0002] With the advancement of society and technology, semiconductor lasers are becoming increasingly prominent and widely used. Their advantages, such as wide wavelength range, compact size, light weight, and long lifespan, have led to their widespread application in lighting, projection, medical treatment, military, and scientific research. However, the waste heat generated by the semiconductor laser chip during operation must be removed promptly and effectively. Otherwise, the laser chip temperature will overheat, reducing the device's luminous efficiency and inducing laser failure. A currently widely used technical solution is to sinter the semiconductor laser chip onto a heat sink with strong heat dissipation capabilities. This heat sink effectively dissipates the heat generated by the chip during operation. The combination of the chip and heat sink sintered together is called a COS.
[0003] One of the most common packaging processes is the indium process. The heat sink block used is typically a heat sink sheet, which undergoes vapor deposition of an indium layer, eutectic bonding, and alloying. After completion, the COS performance test is required, with wavelength, spot size, and voltage being the primary test items. Because the heat sink sheet is composed of multiple parallel strips, COS on adjacent strips can easily block the optical path during power testing, blocking the optical signal and causing inaccurate power testing. This makes power testing impossible for the COS on the heat sink sheet, preventing defective products from being removed, and thus impacting the yield of subsequent packaging products. Summary of the Invention
[0004] To overcome the test obstruction caused by the aforementioned heat sink structure, the present invention provides a semiconductor laser COS power test device. The heat sink sheet is first cut into individual heat sink strips using a high-precision cutting system, and then each individual heat sink strip is tested on an independent test platform. This physically separates the heat sink strips, eliminating optical signal obstruction and enabling precise testing of power, wavelength, and other parameters. This allows for early rejection of defective products, improving the subsequent packaging pass rate.
[0005] The invention also provides a method for testing COS power of a semiconductor laser.
[0006] The technical solutions of the present invention are as follows: A semiconductor laser COS power testing device comprises a base, wherein the upper end of the base is provided with a cutting platform, an automatic cutting system, a piercing and testing platform, an automatic testing system, a blanking platform, and a light source collecting device for collecting light sources; the cutting platform is located at the front end of the base, and a vacuum hole 1 for adsorbing a heat sink is provided on the cutting platform, and the position and number of the vacuum holes 1 correspond one to one with the number of heat sinks; the lower end of the cutting platform is connected to the base through a transmission device I, and the transmission device I can accurately control the movement of the cutting platform on the base; the piercing and testing platform is located at the front end of the base, and a vacuum hole 2 for adsorbing the cut heat sink block is provided on the piercing and testing platform; the blanking platform is connected to the base through a transmission device II and can be moved back and forth, and a vacuum hole 3 for adsorbing a blue film is provided on the blanking platform; the light source collecting device is located directly in front of the piercing and testing platform and is fixed to the base through a fixing column, and the center point of the light source collecting device is flush with the COS light output point.
[0007] The cutting platform includes an upper frame, a left frame, a right frame, and a crossbeam frame, wherein the upper frame, the left frame, the right frame, and the crossbeam frame are connected to form a frame structure, a left frame cutting line is provided on the left frame, and a right frame cutting line is provided on the right frame; a positioning column is provided at the bottom end of the cutting platform, and the positioning column is connected to the cutting platform, and each end of the positioning column is connected to a positioning strip for positioning the heat sink, and the positioning strips are of the same height; the spacing between the two positioning strips is consistent with the width of the heat sink; The cut left frame, right frame, heat sink block and crossbeam frame are connected to form a body heat sink strip; The length, width and vacuum hole position of the test platform are designed according to the shape of a single heat sink strip. When the heat sink strip is adsorbed on the platform, the tube die needs to protrude from the front end of the platform to set the size. The width of the cutting platform is smaller than the width of the heat sink. After the heat sink is placed on the platform through the positioning strips, the left and right frames are suspended.
[0008] The lower end of the piercing and testing platform is connected to the base through a transmission device III, and the transmission device III can accurately control the movement of the piercing and testing platform within a set area.
[0009] The automatic cutting system includes a robotic arm scissors I, a robotic arm scissors II, an image recognition device I, and a lead screw I. The robotic arm scissors I, the robotic arm scissors II, and the image recognition device I are all fixed on the lead screw I. The robotic arm scissors I and the robotic arm scissors II are located on the left side of the lead screw I and are respectively located at the two ends of the cutting position. The lead screw I is connected to both sides of the rear end of the base through the fixed brackets I and the fixed brackets II at both ends; The image recognition device I is located at the right end of the screw rod I. The image recognition device I includes a high-definition CCD camera. The high-definition CCD camera of the image recognition device I is used to identify the heat sink fixed on the cutting platform to confirm the position of each heat sink strip, the left frame cutting line, and the right frame cutting line.
[0010] The automatic testing system includes an automatic piercing and testing device, an image recognition system II, a transplanting device, and a screw rod II. The automatic piercing and testing device, the image recognition system II, and the transplanting device are located on the screw rod II. The screw rod II is fixed to both sides of the rear end of the base through a fixing bracket III and a fixing bracket IV. The automatic piercing and testing device is located on the left side of the screw rod II. The image recognition system II includes a high-definition CCD camera. The image recognition system II uses the high-definition CCD camera to identify the cut heat sink strips and accurately locate the position of the tube core.
[0011] The automatic piercing and measuring device includes a driving arm 1 that can move up and down accurately and a piercing and measuring needle. The driving arm 1 is connected to the screw rod II and can move left and right. The adjustable piercing and measuring needle is fixed on the driving arm 1, and the piercing and measuring needle adopts an adjustable piercing and measuring needle.
[0012] The transplanting device is located on the right side of the screw II. The transplanting device includes a driving arm II that can move up and down accurately and a magnetic head for adsorbing the heat sink strip. The driving arm II can move left and right on the screw II, and the magnetic head is fixed to the bottom of the driving arm II.
[0013] A method for testing the COS power of a semiconductor laser, using the semiconductor laser COS power testing device, comprises the following steps: a) Place the alloy rear heat sink on the cutting platform, and place the iron sheet with blue film on the blanking platform; b) Turn on the vacuum adsorption, the unloading platform moves to the unloading position, and the cutting platform moves to the bottom of the image recognition device I to complete the recognition of the cutting line and COS position. After completion, it moves horizontally to the cutting position; c) The cutting platform moves left and right, up and down, and completes the identification and confirmation of the position of each heat sink strip, the left frame cutting line, and the right frame cutting line; d) The cutting platform moves left to the shearing station, and the robotic arm shears I and the robotic arm shears II cut the left and right borders of the heat sink according to the left and right border shearing lines respectively; e) The cutting platform moves up and places the first heat sink strip on the heat sink strip suction position; f) The vacuum on the cutting platform is turned off, and the second driving arm of the transfer device moves downward to make the magnetic head contact with the beam frame; g) The magnetic suction head is powered on to complete the adsorption of the heat sink strip, and then the transfer device moves horizontally to the left to above the test platform; the cutting platform moves upward based on the image recognition results to move the second heat sink strip to the adsorption position; h) Drive arm 2 downward to place the heat sink on the test platform, with the die protruding -mm from the platform. At the same time, the magnetic head is powered off. i) The test platform starts vacuum suction and absorbs the heat sink strip, then moves horizontally to the bottom of the image recognition device II to complete the position confirmation of the tube die and heat sink block; j) The piercing and testing platform continues to move left according to the image recognition results, and the first COS moves to the piercing and testing position directly below the automatic piercing and testing device; k) The automatic puncture test device drives the arm to drive the puncture test needle to press down and contact the tube die; l) Pass the set current to complete the first COS power and wavelength parameter test; m) Then the test platform moves the second COS to the test position and powers on to complete the test; and repeats the entire COS parameter test; n) After completion, the test platform moves horizontally back to the heat sink adsorption area, and the second driving arm of the transfer device moves downward to make the magnetic head contact with the beam frame; o) The magnetic suction head is powered on to complete the adsorption of the heat sink strip, and then the transplanting device is moved horizontally to the top of the unloading platform; p) Drive arm 2 downward to make the heat sink contact with the blue film, and the magnetic suction head is powered off to complete the unloading; q) The transplanting device moves horizontally back to the top of the cutting platform, and the unloading platform moves horizontally forward a set distance; r) Repeat the fm action to complete the power test of the second and remaining heat sink strips; s) Generate COS test data and images after completing all the tests; y) The cutting platform moves back to the loading area, and the iron sheet with the blue film and the heat sink strip is removed from the unloading platform to complete the entire operation process.
[0014] The beneficial effects of the present invention are: 1. The COS power test device and method of the present invention uses a high-precision cutting system to divide the heat sink sheet into independent heat sink strips. The individual heat sink strips are then tested on an independent test platform. This eliminates optical signal obstruction by physically separating the heat sink strips, enabling precise testing of power, wavelength, and other parameters. This allows for early rejection of defective products, improving the pass rate of subsequent packaging stages, and enhancing product quality.
[0015] 2. The present invention can reliably adsorb the heat sink sheet, heat sink block, blue film, etc. in the accurate position through vacuum hole 1, vacuum hole 2, and vacuum hole 3, and can accurately move them to the corresponding accurate positions through the transmission device I and transmission device II, thereby realizing accurate testing of power, wavelength, etc., thereby reliably eliminating defective products in advance and improving the qualified rate of the subsequent packaging stage.
[0016] 3. The lower end of the piercing test platform of the present invention is connected to the base through the transmission device III. The transmission device III can accurately control the movement of the piercing test platform within the set area, thereby improving the test accuracy.
[0017] 4. The present invention uses a high-definition CCD camera to identify the cut heat sink strip, accurately locate the position of the tube core, and improve test accuracy.
[0018] 5. The automatic piercing and testing device of the present invention includes a driving arm 1 that can move up and down accurately and a piercing and testing needle. The driving arm 1 is connected to the screw rod Ⅱ and can move left and right. The adjustable piercing and testing needle is fixed on the driving arm 1. The piercing and testing needle adopts an adjustable piercing and testing needle, which can accurately adjust the piercing position and piercing force on the tube core, improve the consistency and accuracy of the test data, accurately eliminate defective products, and improve the qualified rate of the subsequent packaging section. 6. The length, width and vacuum hole position of the piercing test platform are designed according to the shape of a single heat sink bar. When the heat sink bar is adsorbed on the platform, the tube core needs to protrude from the front end of the platform to set the size. During piercing test, the optical signal of a single COS can be completely received by the light source receiving device, avoiding obstruction of the front end of the platform, thereby improving the test accuracy of optical power, light spot, etc.
[0019] 7. The width of the cutting platform is smaller than that of the heat sink. After the heat sink is placed on the platform using the retaining bars, the left and right frames are suspended. This allows the heat sink to be fixed on the platform, improving recognition accuracy. The suspended frames allow for better control of cutting position and force, improving cutting consistency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a front view structural diagram of the automatic test power device; Figure 2 This is a rear view structural diagram of the automatic test power device; Figure 3 This is a schematic diagram of the structure of the automatic power test device from top view; Figure 4 This is a schematic diagram of the COS test structure; Figure 5 This is a schematic diagram of the automatic cutting structure of the heat sink; Figure 6 Schematic diagram of the heat sink strip absorption structure; Figure 7 This is a schematic diagram of the heat sink strip measurement position structure; Figure 8 Schematic diagram of the heat sink assembly structure; Figure 9 It is a structural schematic diagram of the unloading platform 14.
[0021] In the figure, 1. Fixed bracket I, 2. Fixed bracket II, 3. Fixed bracket III, 4. Fixed bracket IV, 5. Lead screw I, 6. Lead screw II, 7. Robotic arm scissors I, 8. Robotic arm scissors II, 9. Image recognition device I; 10. Cutting platform, 101. Vacuum hole 1, 102. Positioning column, 103. Positioning bar, 104. Upper frame, 105. Left frame, 106. Right frame, 107. Crossbeam, 108. Left frame cutting line, 109. Right frame cutting line; 11. Automatic puncture and test device, 111. Driving arm 1, 112. Puncture and test needle; 12. Image recognition device II; 13. Transplanting device, 131. Driving arm 2, 132. Moving down to make the magnetic head; 14. Unloading platform, 141. Vacuum hole 3, 142. Blue film 142, 143. Iron sheet 143; 15. Piercing platform, 151. Vacuum hole 2; 16. Light source collecting device, 17. Transmission device I, 18. Transmission device II, 19. Transmission devices I and III, 20. Fixing column, 21. Base; 22. Heat sink block; 23. Tube core. DETAILED DESCRIPTION
[0022] In order to make those skilled in the art better understand the technical solution of the present invention, the following Figure 1-9 , the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0023] Example: A semiconductor laser COS power test device includes a base 21. The upper end of the base 21 is equipped with a cutting platform 10, an automatic cutting system, a test platform 15, an automatic test system, a material unloading platform 14, and a light source collection device 16. The cutting platform 10 is located at the front end of the base and has vacuum holes 101 for absorbing heat sinks. The position and number of vacuum holes 101 correspond to the number of heat sinks. The lower end of the cutting platform 10 is connected to the base 21 via a transmission device 17, which can precisely control the movement of the cutting platform 10 on the base.
[0024] The cutting platform 10 includes an upper frame 104, a left frame 105, a right frame 106, and a crossbeam frame 107. The upper frame 104, the left frame 105, the right frame 106, and the crossbeam frame 107 are connected to form a frame structure. The left frame 105 is provided with a left frame cutting line 108, and the right frame 106 is provided with a right frame cutting line 109; a positioning column 102 is provided at the bottom end of the cutting platform 10, and the positioning column 102 is connected to the cutting platform 10, and the height of the positioning column 102 is 2-3mm; a positioning strip 103 for positioning the heat sink is connected to each end of the positioning column 102, and the positioning strips 103 are consistent in height; the spacing between the two positioning strips 103 is consistent with the width of the heat sink.
[0025] The width of the cutting platform 10 is smaller than the width of the heat sink. After the heat sink is placed on the platform through the positioning strips 103 , the left frame 105 and the right frame 106 are suspended in the air.
[0026] The testing platform 15 is located at the front end of the base 21 . Two rows of vacuum holes 151 are provided on the testing platform 15 . The vacuum holes 151 are used to absorb the cut heat sink 22 and the crossbeam 107 .
[0027] The lower end of the piercing and testing platform 15 is connected to the base 21 through a transmission device III 19, and the transmission device III 19 can accurately control the movement of the piercing and testing platform 15 within a set area.
[0028] The length, width and position of the second vacuum hole 151 of the piercing platform 15 are designed according to the shape of a single heat sink bar, requiring that the tube core should protrude 1-2 mm from the front end of the platform when the heat sink bar is adsorbed on the platform.
[0029] The heat sink strip is a single assembly formed by the cut left frame 105 , right frame 106 , heat sink block 22 and crossbeam frame 107 .
[0030] The automatic cutting system includes robotic shears I7, robotic shears II8, image recognition device I9, and screw I5. These are all fixed to screw I5. Scissors I7 and II8 are located to the left of screw I, at either end of the cutting position. Screw I5 is connected to the rear end of the base via fixed brackets I1 and II2.
[0031] The image recognition device I9 is located at the right end of the screw rod I. The image recognition device I9 includes a high-definition CCD camera. The high-definition CCD camera of the image recognition device I9 is used to identify the heat sink fixed on the cutting platform 10 to confirm the position of each heat sink strip, the left frame cutting line 108, and the right frame cutting line 109.
[0032] The automatic testing system includes an automatic testing device 11, an image recognition system II 12, a transplanting device 13, and a screw rod II 6. The automatic testing device 11, the image recognition system II 12, and the transplanting device 13 are all located on the screw rod II 6. The screw rod II 6 is fixed to both sides of the rear end of the base 21 by fixing brackets III 3 and IV 4.
[0033] The automatic puncture detection device 11 is located to the left of screw II 6. It includes a drive arm 111 that can precisely move up and down, and a puncture detection needle 112. The puncture detection needle 112 is an adjustable puncture detection needle. The drive arm 111 is connected to screw II 6 and can move horizontally. The adjustable puncture detection needle is fixed to the drive arm 111.
[0034] The image recognition system II 12 includes a high-definition CCD camera. The image recognition system II 12 recognizes the cut heat sink strips through the high-definition CCD camera and accurately locates the position of the tube core 23.
[0035] The transfer device 13 is located to the right of the lead screw II 6 and includes a second drive arm 131 that can move precisely up and down, and a magnetic head 132. The second drive arm 131 can move horizontally on the lead screw II 6, and the magnetic head 132 is fixed to the bottom of the second drive arm 131 to absorb the heat sink strip.
[0036] The unloading platform 14 is connected to the base 21 through the transmission device II 18 and can move forward and backward. The unloading platform 14 is provided with a vacuum hole 3 141 for adsorbing the blue film 142.
[0037] The light source collecting device 16 is fixed to the base 21 via a fixing column 20 and is located directly in front of the measuring platform 15. The center point of the light source collecting device 16 is flush with the COS light exit point and is used to collect light.
[0038] A method for testing the COS power of a semiconductor laser comprises the following steps: a) Place the alloy rear heat sink on the cutting platform 10 and place the iron sheet 143 with the blue film 142 attached on the blanking platform 14; b) Vacuum adsorption is turned on, the unloading platform 14 moves to the unloading position, and the cutting platform 10 moves to the bottom of the image recognition device I 9 to complete the recognition of the cutting line and COS position, and then moves horizontally to the cutting position after completion; c) The cutting platform 10 moves left and right, and up and down, to identify and confirm the positions of the heat sink strips, the left frame cutting line 108, and the right frame cutting line 109 of the heat sink; d) The cutting platform 10 moves left to the shearing station, and the robotic arm shears I7 and the robotic arm shears II8 cut the left frame 105 and the right frame 106 of the heat sink according to the left frame shearing line 108 and the right frame shearing line 109 respectively; e) The cutting platform 10 moves upward to place the first heat sink strip at the heat sink strip suction position; f) The vacuum on the cutting platform 10 is turned off, and the second driving arm 131 of the transplanting device 13 moves downward so that the magnetic head 132 contacts the crossbeam 107; g) The magnetic head 132 is energized to complete the adsorption of the heat sink strip, and the transfer device 13 then moves horizontally to the left to above the detection platform 15; the cutting platform 10 moves upward based on the image recognition results to move the second heat sink strip to the adsorption position; h) driving the second arm 131 downward to place the heat sink on the test platform 15, with the die 23 protruding 1-2 mm from the platform, while the magnetic head 132 is powered off; i) The test platform 15 starts vacuum suction to fix the heat sink strip, and then moves horizontally to the bottom of the image recognition device II 12 to complete the position confirmation of the tube die 23 and the heat sink block 22; j) The piercing and testing platform 15 continues to move left according to the image recognition result, and the first COS moves to the piercing and testing position directly below the automatic piercing and testing device 11; k) The automatic puncture detection device 11 drives the arm 111 to drive the puncture detection needle 112 to press down and contact the tube core 23; l) Pass the set current to complete the first COS power, wavelength and other parameter tests; m) Then the testing platform 15 moves the second COS to the testing position and powers on to complete the test; and the entire COS parameter test is repeated; n) After completion, the testing platform 15 moves horizontally back to the heat sink adsorption area, and the driving arm 2 131 of the transplanting device 13 moves downward so that the magnetic head 132 contacts the crossbeam 107; o) The magnetic suction head 132 is powered on to complete the adsorption of the heat sink strip, and then the transplanting device 13 is moved horizontally to above the unloading platform 14; p) driving the second arm 131 downward to make the heat sink bar contact with the blue film 142, and the magnetic suction head 132 is powered off to complete the unloading; q) The transplanting device 13 moves horizontally back to above the cutting platform 10, and the unloading platform 14 moves horizontally forward a certain distance, such as about 3-4 cm; r) Repeat the fm action to complete the power test of the second and remaining heat sink strips; s) Generate COS test data and images after completing all the tests; y) The cutting platform 10 is moved back to the loading area, and the iron sheet 143 with the blue film 142 attached and the heat sink strip is removed from the unloading platform 14, completing the entire operation process.
[0039] In summary, through the above steps, the COS is placed on the cutting platform 10, the blue film 142 and the iron sheet 143 are placed on the unloading platform 14, and the switch is activated to activate vacuum suction. The cutting platform 10 moves below the image recognition device I9 to complete the identification of the cutting line and the COS position. Once completed, it moves horizontally to the cutting position. The robotic shears I7 and II8 cut the heat sink sheet frame based on the identification of the left and right border cutting lines 108 and 109. The cutting platform 10 then moves to the suction zone and the platform vacuum is turned off. The transfer device 13 moves downward so that the magnetic head 132 contacts the first heat sink strip and is energized. The heat sink strip is then attracted and horizontally placed on the testing platform 15, with the die protruding 1-2 mm from the platform. Simultaneously, the cutting platform 10 moves the second heat sink strip into position based on the image recognition results. The testing platform 15 activates the vacuum and moves horizontally below the image recognition device II12 to complete the COS die position identification. It then continues to move horizontally to position the first COS die in the automatic testing position. The automatic testing device 11 presses down, bringing the testing needle into contact with the die and applying the specified current to complete the wavelength and power test. The testing platform 15 continues to move the remaining COS to the automatic testing position and completes all tests. The transfer device 13 moves down, contacts the heat sink, energizes it, and then suction-places it onto the blue film 142 on the unloading platform 14.
[0040] The above description is a preferred embodiment of the present invention, and the description of the specific embodiment is only for a better understanding of the concept of the present invention. For those skilled in the art, according to the principles of the present invention, several improvements or equivalent substitutions can be made, and these improvements or equivalent substitutions are also considered to fall within the scope of protection of the present invention.
Claims
1. A semiconductor laser COS power test device, comprising a base, characterized in that: The upper end of the base is provided with a cutting platform, an automatic cutting system, a piercing and testing platform, an automatic testing system, a blanking platform, and a light source collecting device for collecting light sources; the cutting platform is located at the front end of the base, and a vacuum hole 1 for adsorbing the heat sink is opened on the cutting platform, and the position and number of the vacuum holes correspond one to one with the number of heat sinks. The lower end of the cutting platform is connected to the base through a transmission device I, and the cutting platform is precisely controlled to move on the base through the transmission device I; the piercing and testing platform is located at the front end of the base, and a vacuum hole 2 for adsorbing the cut heat sink block is provided on the piercing and testing platform; the blanking platform is connected to the base through the transmission device II and can be moved back and forth, and the blanking platform is provided with a vacuum hole 3 for adsorbing the blue film; the light source collecting device is located directly in front of the piercing and testing platform and is fixed to the base through a fixing column, and the center point of the light source collecting device is flush with the COS light output point.
2. The semiconductor laser COS power test device according to claim 1, characterized in that: The cutting platform includes an upper frame, a left frame, a right frame, and a crossbeam frame, wherein the upper frame, the left frame, the right frame, and the crossbeam frame are connected to form a frame structure, a left frame cutting line is provided on the left frame, and a right frame cutting line is provided on the right frame; a positioning column is provided at the bottom end of the cutting platform, and the positioning column is connected to the cutting platform, and each end of the positioning column is connected to a positioning strip for positioning the heat sink, and the positioning strips are of the same height; the spacing between the two positioning strips is consistent with the width of the heat sink; The cut left frame, right frame, heat sink block and crossbeam frame are connected to form a body heat sink strip; The length, width and vacuum hole position of the test platform are designed according to the shape of a single heat sink strip. When the heat sink strip is adsorbed on the platform, the tube die needs to protrude from the front end of the platform to set the size. The width of the cutting platform is smaller than the width of the heat sink. After the heat sink is placed on the platform through the positioning strips, the left and right frames are suspended.
3. The semiconductor laser COS power test device according to claim 2, characterized in that: The lower end of the piercing and testing platform is connected to the base through a transmission device III, and the transmission device III controls the piercing and testing platform to move within a set area.
4. The semiconductor laser COS power test device according to claim 3, characterized in that: The automatic cutting system includes a robotic arm scissors I, a robotic arm scissors II, an image recognition device I, and a lead screw I. The robotic arm scissors I, the robotic arm scissors II, and the image recognition device I are all fixed on the lead screw I. The robotic arm scissors I and the robotic arm scissors II are located on the left side of the lead screw I and are respectively located at the two ends of the cutting position. The lead screw I is connected to both sides of the rear end of the base through the fixed brackets I and the fixed brackets II at both ends; The image recognition device I is located at the right end of the screw rod I. The image recognition device I includes a high-definition CCD camera. The high-definition CCD camera of the image recognition device I is used to identify the heat sink fixed on the cutting platform to confirm the position of each heat sink strip, the left frame cutting line, and the right frame cutting line.
5. The semiconductor laser COS power test device according to claim 4, characterized in that: The automatic testing system includes an automatic piercing and testing device, an image recognition system II, a transplanting device, and a screw rod II. The automatic piercing and testing device, the image recognition system II, and the transplanting device are located on the screw rod II. The screw rod II is fixed to both sides of the rear end of the base through a fixing bracket III and a fixing bracket IV. The automatic piercing and testing device is located on the left side of the screw rod II. The image recognition system II includes a high-definition CCD camera. The image recognition system II uses the high-definition CCD camera to identify the cut heat sink strips and accurately locate the position of the tube core.
6. The semiconductor laser COS power test device according to claim 5, characterized in that: The automatic piercing and measuring device includes a driving arm 1 that can move up and down accurately and a piercing and measuring needle. The driving arm 1 is connected to the screw rod II and can move left and right. The adjustable piercing and measuring needle is fixed on the driving arm 1, and the piercing and measuring needle adopts an adjustable piercing and measuring needle.
7. The semiconductor laser COS power test device according to claim 6, characterized in that: The transplanting device is located on the right side of the screw II. The transplanting device includes a driving arm II that can move up and down accurately and a magnetic head for adsorbing the heat sink strip. The driving arm II can move left and right on the screw II, and the magnetic head is fixed to the bottom of the driving arm II.
8. A method for testing COS power of a semiconductor laser, characterized in that: The semiconductor laser COS power test device according to claim 7 comprises the following steps: a) Place the alloy rear heat sink on the cutting platform, and place the iron sheet with blue film on the blanking platform; b) Turn on the vacuum adsorption, the unloading platform moves to the unloading position, and the cutting platform moves to the bottom of the image recognition device I to complete the recognition of the cutting line and COS position. After completion, it moves horizontally to the cutting position; c) The cutting platform moves left and right, up and down, and completes the identification and confirmation of the position of each heat sink strip, the left frame cutting line, and the right frame cutting line; d) The cutting platform moves left to the shearing station, and the robotic arm shears I and the robotic arm shears II cut the left and right borders of the heat sink according to the left and right border shearing lines respectively; e) The cutting platform moves up and places the first heat sink strip on the heat sink strip suction position; f) The vacuum on the cutting platform is turned off, and the second driving arm of the transfer device moves downward to make the magnetic head contact with the beam frame; g) The magnetic suction head is powered on to complete the adsorption of the heat sink strip, and then the transfer device moves horizontally to the left to above the test platform; the cutting platform moves upward based on the image recognition results to move the second heat sink strip to the adsorption position; h) Drive arm 2 downward to place the heat sink on the test platform, with the die protruding -mm from the platform. At the same time, the magnetic head is powered off. i) The test platform starts vacuum suction and absorbs the heat sink strip, then moves horizontally to the bottom of the image recognition device II to complete the position confirmation of the tube die and heat sink block; j) The piercing and testing platform continues to move left according to the image recognition results, and the first COS moves to the piercing and testing position directly below the automatic piercing and testing device; k) The automatic puncture test device drives the arm to drive the puncture test needle to press down and contact the tube die; l) Pass the set current to complete the first COS power and wavelength parameter test; m) Then the test platform moves the second COS to the test position and powers on to complete the test; and repeats the entire COS parameter test; n) After completion, the test platform moves horizontally back to the heat sink adsorption area, and the second driving arm of the transfer device moves downward to make the magnetic head contact with the beam frame; o) The magnetic suction head is powered on to complete the adsorption of the heat sink strip, and then the transplanting device is moved horizontally to the top of the unloading platform; p) Drive arm 2 downward to make the heat sink contact with the blue film, and the magnetic suction head is powered off to complete the unloading; q) The transplanting device moves horizontally back to the top of the cutting platform, and the unloading platform moves horizontally forward a set distance; r) Repeat the fm action to complete the power test of the second and remaining heat sink strips; s) Generate COS test data and images after completing all the tests; y) The cutting platform moves back to the loading area, and the iron sheet with the blue film and the heat sink strip is removed from the unloading platform to complete the entire operation process.