Method, device and processor for detecting non-hermetic package-on-package devices

Abstract

The application provides a detection method and device for a non-airtight stacked package device and a processor. The method comprises: starting a first detection device to detect a to-be-detected stacked package device in a test box under the condition that the test box meets a first preset condition; the detection process comprises: adjusting the temperature of the test box multiple times, and detecting parameters of the to-be-detected stacked package device to obtain electrical data during the adjustment; controlling the first detection device to detect the to-be-detected stacked package device multiple times in cycles until the detection is stopped under the condition that a second preset condition is met; and under the condition that the second preset condition comprises that the number of cycles meets a preset number, determining whether the completeness of the packaging metal of the to-be-detected stacked package device meets a target completeness, and determining that the to-be-detected stacked package device is qualified under the condition that the determination result is yes, thereby solving the problem that it is difficult to detect the reliability of the stacked package device in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device detection, in particular to a detection method and device for a non-airtight stacked package, a computer readable storage medium, a processor and an electronic device. BACKGROUND

[0002] The silicon-based stacking technology is a method of chip packaging by micro-bump interconnection and layer-by-layer stacking of multiple silicon substrates, which has many advantages such as high precision, high integration and low cost, and is gradually applied in the field of high-performance packaging integration, such as the satellite field. After two silicon substrates are welded by bumps, there will be a gap of 1-5 μm between the two silicon substrates in the area outside the bumps. The existence of these gaps will make the silicon-based stacked package a non-airtight package, which will cause the water vapor in the external atmospheric environment to gradually penetrate into the device from the gap during the production, transportation and installation of the device, causing electrochemical corrosion of the internal chips, bonding wires and adhesive materials, and thus causing the performance parameters of the device to decrease or even fail. Since the silicon-based stacked package is a non-airtight package, it cannot be sealed for fine and coarse inspection according to the method 1014 of GJB548C (a detection method recorded in the “Microelectronic Device Test Methods and Procedures”), and therefore there is no test method to verify the ability of such packaged devices to resist atmospheric water vapor corrosion, resulting in a high risk of reliability of the silicon-based stacked package. SUMMARY

[0003] The main purpose of the present application is to provide a detection method and device for a non-airtight stacked package, a computer readable storage medium, a processor and an electronic device, to at least solve the problem that it is difficult to detect the reliability of the stacked package in the prior art.

[0004] In order to achieve the above object, according to one aspect of the present application, a detection method for a non-hermetic stacked package device is provided, comprising: starting a first detection device to perform detection processing on a to-be-detected stacked package device in a test chamber under a condition that the test chamber satisfies a first preset condition, the first preset condition comprising: a temperature in the test chamber being a first temperature, an air exchange amount of the test chamber per unit time being greater than or equal to a first threshold, and a relative humidity of air in the test chamber being greater than or equal to a second threshold, the first temperature being a highest storage temperature of the to-be-detected stacked package device, the detection processing comprising: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the to-be-detected stacked package device to obtain electrical data during the adjustment; controlling the first detection device to perform the detection processing on the to-be-detected stacked package device for multiple cycles until a second preset condition is satisfied, the second preset condition comprising at least one of: the electrical data not satisfying a target range, and a cycle number of the detection processing satisfying a preset number; in a case where the second preset condition comprises the cycle number satisfying the preset number, judging whether a completeness of a packaging metal of the to-be-detected stacked package device satisfies a target completeness, and in a case where the judgment result is yes, determining that the to-be-detected stacked package device is qualified.

[0005] Optionally, the detection method further comprises: controlling the test chamber to perform pretreatment on the to-be-detected stacked package device, the pretreatment being used to evaporate water vapor adsorbed by the to-be-detected stacked package device, comprising: adjusting the temperature of the test chamber from room temperature to the first temperature at a first temperature change rate, and keeping the temperature of the test chamber at the first temperature for a target time period.

[0006] Optionally, the multiple times of adjusting the temperature of the test chamber, and performing parameter detection on the to-be-detected stacked package device during the adjustment, comprise: adjusting the temperature of the test chamber from the first temperature to a second temperature, the second temperature being a lowest storage temperature of the to-be-detected stacked package device; after a first time period, adjusting the temperature of the test chamber from the second temperature to a third temperature, and controlling the first detection device to apply a voltage to the to-be-detected stacked package device, and performing parameter detection on the to-be-detected stacked package device after a second time period, the third temperature being a lowest working temperature of the to-be-detected stacked package device; adjusting the temperature of the test chamber from the third temperature to the second temperature, and controlling the first detection device to perform parameter detection on the to-be-detected stacked package device after a fourth time period; adjusting the temperature of the test chamber from the second temperature to the first temperature, and controlling the first detection device to perform parameter detection on the to-be-detected stacked package device, and after a fifth time period, adjusting the temperature of the test chamber from the first temperature to room temperature, and controlling the first detection device to perform parameter detection on the to-be-detected stacked package device.

[0007] Optionally, the detection method further comprises: controlling the first detection device to perform the preset number of cycles of the detection process on the to-be-tested stacked package device, in the case that any one of the detection processes before the last detection process is interrupted, re-performing one of the detection processes on the to-be-tested stacked package device; in the case that the last detection process is interrupted, re-performing two consecutive detection processes on the to-be-tested stacked package device, and the number of cycles of the detection process is the preset number plus 1.

[0008] Optionally, the judgment of whether the completeness of the packaging metal of the to-be-tested stacked package device meets the target completeness comprises: controlling a second detection device to detect the corrosion area of the packaging metal of the to-be-tested stacked package device to obtain the completeness of the packaging metal of the to-be-tested stacked package device; judging whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein, in the case that the first judgment result indicates yes, it is determined that the to-be-tested stacked package device is qualified.

[0009] Optionally, the detection method further comprises: obtaining the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes; and detecting the service life of the to-be-tested stacked package device according to the average temperature acceleration factor and the average humidity acceleration factor of the to-be-tested stacked package device to obtain the service life length of the to-be-tested stacked package device.

[0010] Optionally, the obtaining of the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes comprises: determining the average temperature acceleration factor in the preset number of detection processes according to the gas constant, the Arrhenius model, the thermodynamic temperature, and the activation energy of chemical reactions in each detection process; and determining the average humidity acceleration factor in the preset number of detection processes according to a temperature-humidity acceleration test model, the relative humidity when the test chamber has the highest temperature, the relative humidity when the test chamber has the lowest temperature, and a humidity index.

[0011] According to another aspect of the present application, there is provided a detection device for non-hermetic stacked package devices, comprising: a starting module configured to start a first detection device to perform a detection process on a to-be-detected stacked package device in a test chamber under a condition that the test chamber satisfies a first preset condition, the first preset condition comprising that a temperature in the test chamber is a first temperature, an air exchange rate of the test chamber per unit time is greater than or equal to a first threshold value, and a relative humidity of air in the test chamber is greater than or equal to a second threshold value, the first temperature being a highest storage temperature of the to-be-detected stacked package device, the detection process comprising adjusting the temperature of the test chamber multiple times and performing parameter detection on the to-be-detected stacked package device to obtain electrical data during the adjustment; a control module configured to control the first detection device to perform the detection process on the to-be-detected stacked package device for a plurality of cycles until a second preset condition is satisfied, the second preset condition comprising at least one of that the electrical data does not satisfy a target range and that a cycle number of the detection process satisfies a preset number of times; and a determination module configured to determine whether a completeness of a packaging metal of the to-be-detected stacked package device satisfies a target completeness under a condition that the second preset condition comprises that the cycle number satisfies the preset number of times, and determine that the to-be-detected stacked package device is qualified under a condition that the determination result is yes.

[0012] According to still another aspect of the present application, there is provided a computer-readable storage medium comprising a stored program, wherein the computer-readable storage medium performs the detection method for non-hermetic stacked package devices when the program is executed.

[0013] According to yet another aspect of the present application, there is provided a processor configured to execute a program, wherein the processor performs the detection method for non-hermetic stacked package devices when the program is executed.

[0014] With the technical solution of the present application, firstly, the first detection device is started to detect and process the to-be-tested stacked packaging device in the test box when the test box meets the first preset condition. The first preset condition includes that the temperature in the test box is a first temperature, the air exchange amount of the test box per unit time is greater than or equal to a first threshold value, and the relative humidity of the air in the test box is greater than or equal to a second threshold value, and the first temperature is the highest storage temperature of the to-be-tested stacked packaging device. In this way, the use of the device in an extreme atmospheric environment can be simulated, the high-temperature and high-humidity environment can accelerate the process of water vapor penetration and metal corrosion, and the penetration and condensation of water vapor in the device can be facilitated, so that the water vapor corrosion resistance of the device can be detected in a short time. The detection process includes: adjusting the temperature of the test box multiple times, and detecting the parameters of the to-be-tested stacked packaging device to obtain electrical data during the adjustment process; the first detection device is controlled to detect the to-be-tested stacked packaging device multiple times in a cycle until it is stopped when the second preset condition is met. The second preset condition includes at least one of the following: the electrical data does not meet the target range, and the number of cycles of the detection process meets the preset number of times; in the case where the second preset condition includes that the number of cycles meets the preset number of times, it is judged whether the integrity of the packaging metal of the to-be-tested stacked packaging device meets the target integrity, and in the case where the judgment result is yes, it is determined that the to-be-tested stacked packaging device is qualified. By setting specific test box environmental parameters, including temperature, humidity and air exchange amount, the use of the device in an extreme atmospheric environment can be simulated to detect its water vapor corrosion resistance. Through the above detection method, the storage of the device in the atmospheric water vapor can be simulated in a short time. In this simulation process, the corrosion process can be accelerated, and the electrical parameters of the device are detected multiple times in the cycle detection process to discover whether the device has been eroded by water vapor in time. According to the set qualification standard and the detection result, whether the device can maintain good performance and reliability in the simulated harsh environment is accurately evaluated, so as to solve the technical problem that the reliability of the stacked packaging device is difficult to detect in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0015] The drawings accompanying the specification of the present application form a part thereof, serve to provide further understanding of the present application, and together with the specification explain the present application. The use of the same reference numerals in different drawings indicates similar or identical components.

[0016] Figure 1 A hardware structure block diagram of a mobile terminal for performing a detection method of a non-airtight stacked packaging device is shown according to an embodiment of the present application;

[0017] Figure 2 A flowchart of a detection method of a non-airtight stacked packaging device is shown according to an embodiment of the present application;

[0018] Figure 3A flowchart of another method for detecting a non-airtight stacked package device is shown according to an embodiment of the present application.

[0019] Figure 4 A structural block diagram of a detection device for a non-airtight stacked package device is shown according to an embodiment of the present application.

[0020] In the above drawings, reference signs are as follows:

[0021] 102, processor; 104, memory; 106, transmission device; 108, input / output device. DETAILED DESCRIPTION

[0022] It should be noted that the embodiments and features in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should fall within the scope of protection of the present application.

[0024] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0025] As introduced in the background, the silicon-based stacked package device in the prior art is a non-airtight package, which cannot be subjected to fine and coarse inspection according to the method 1014 of GJB548C, and therefore there is no test method to verify the atmospheric environment water vapor corrosion resistance of such package device, resulting in a great risk in the use reliability of the silicon-based stacked package device. To solve the problem that the reliability of the stacked package device cannot be detected in the prior art, the embodiments of the present application provide a detection method for a stacked package device, a detection device for a stacked package device, a computer readable storage medium, a processor and an electronic device.

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] The methods and embodiments provided in this application can be executed on a mobile terminal, computer terminal, or similar computing device. Taking running on a mobile terminal as an example, Figure 1 This is a hardware structure block diagram of a mobile terminal for a method of detecting a non-hermetic stacked packaged device according to an embodiment of the present invention. Figure 1 As shown, a mobile terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The mobile terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the mobile terminal described above. For example, the mobile terminal may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0028] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the detection method for non-hermetic stacked packaged devices in this embodiment of the invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thereby implementing the above-described method. The memory 104 may include high-speed random access memory and non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to the mobile terminal via a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof. The transmission device 106 is used to receive or send data via a network. Specific examples of the aforementioned networks may include wireless networks provided by the mobile terminal's communication provider. In one example, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to communicate with the Internet. In one example, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0029] A method for detecting a non-hermetic stacked package device operating on a mobile terminal, a computer terminal or a similar computing device is provided in the present embodiment. It is noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0030] Figure 2 is a flowchart of a method for detecting a non-hermetic stacked package device according to an embodiment of the present application. As shown in Figure 2 the method comprises the following steps:

[0031] In step S1, when the test chamber meets a first preset condition, a first detection device is started to perform detection processing on the to-be-detected stacked package device in the test chamber. The first preset condition includes that the temperature in the test chamber is a first temperature, the air exchange amount of the test chamber per unit time is greater than or equal to a first threshold value, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold value. The first temperature is the highest storage temperature of the to-be-detected stacked package device. The detection processing includes adjusting the temperature of the test chamber multiple times and performing parameter detection on the to-be-detected stacked package device to obtain electrical data during the adjustment.

[0032] Specifically, multiple to-be-detected stacked package devices can be detected simultaneously during the detection process. The to-be-detected non-hermetic silicon-based stacked package device is placed in a test chamber with controllable environmental parameters. The temperature in the test chamber is ensured to be stable at the first temperature, i.e., the highest storage temperature of the device (for example, 125°C), which is to simulate the storage and working conditions of the device in an extreme high-temperature environment. At the same time, the air exchange amount of the test chamber per unit time is greater than or equal to the first threshold value. The unit time can be per minute, and the first threshold value can be 5 times the volume of the test chamber, i.e., the test chamber has an air flow of at least 5 times its own volume per minute, which ensures that the gas components (such as water vapor) in the environment can fully contact the device, simulating the gas exchange of the real atmospheric environment. Finally, the relative humidity of the air in the test chamber needs to be kept above the second threshold value (such as 80%), to provide sufficient water vapor source to promote possible corrosion reaction. The first threshold value and the second threshold value described above are threshold values confirmed in the process of improving the detection method of the present application, which makes the detection result more accurate. The highest storage temperature of the device will change according to the type of the period, which is not specifically limited.

[0033] Specifically, in the detection process, the temperature of the test box is periodically adjusted from high temperature to low temperature, from low temperature to high temperature, and the electrical parameters of the device, such as current, voltage, resistance, leakage, etc., are detected multiple times during the temperature change. According to the characteristics of the device, it is not specifically limited. This step helps to observe and record the changes in electrical performance of the device under temperature fluctuations, especially when the ambient temperature drops from high temperature to low temperature, the water vapor in the test box can condense on the surface of the device and may penetrate into the interior of the device. At this time, the change of electrical parameters can represent the water vapor corrosion resistance of the device.

[0034] Step S2, control the first detection device to perform a cycle of detection processing on the to-be-tested stacked package device, and stop when a second preset condition is met, the second preset condition including at least one of the following: the electrical data does not meet the target range, and the number of cycles of detection processing meets a preset number;

[0035] Specifically, the detection processing of the test equipment on the device should be performed for multiple consecutive cycles, each cycle including at least a temperature change process from room temperature to the lowest and then to the highest, accompanied by parameter detection. The detection processing will continue until the second preset condition is met, that is, when the detected electrical data deviates significantly from the target performance range, or the predetermined number of detection cycles is completed. Wherein, the detected electrical data deviates significantly from the target performance range indicates that the device has been eroded by water vapor and cannot work normally, and it can no longer be subjected to subsequent detection processing, which can more accurately determine the time when the device is damaged, and can be targeted to strengthen the packaging of the device or improve other aspects to improve the reliability of the device; the predetermined number of detection cycles is completed, indicating that the device maintains good performance during the entire cycle of detection processing, and the device is not eroded by water vapor. The design of this cycle test simulates the temperature and humidity fluctuations that the device often encounters in the real working environment, which can more accurately evaluate its corrosion resistance. In the process of improving the detection method of the present application, it is confirmed that the above-mentioned predetermined number of detection cycles can be about 16.

[0036] Step S3, in the case where the second preset condition includes that the number of cycles meets the preset number, determining whether the integrity of the packaging metal of the to-be-tested stacked package device meets a target integrity, and in the case where the determination result is yes, determining that the to-be-tested stacked package device is qualified.

[0037] Specifically, after completing all the predetermined number of cycle detection processes, it indicates that the remaining device is not eroded by water vapor, and the integrity of the packaging metal of the device needs to be further checked, that is, whether there are obvious corrosion traces or metal layer damage. Only when the integrity of the packaging metal also meets a specific target standard, it is considered that the device withstands the accelerated corrosion test, thereby determining that the device is qualified. This check can be completed through a specific electrical test.

[0038] By the embodiment, firstly, in the case that the test box meets the first preset condition, the first detection device is started to perform detection processing on the to-be-tested stacked packaging device in the test box. The first preset condition includes that the temperature in the test box is a first temperature, the air exchange amount of the test box per unit time is greater than or equal to a first threshold, and the relative humidity of the air in the test box is greater than or equal to a second threshold. The first temperature is the highest storage temperature of the to-be-tested stacked packaging device. In this way, the use of the device in an extreme atmospheric environment can be simulated. The high-temperature and high-humidity environment can accelerate the process of water vapor penetration and metal corrosion, which is helpful for the penetration and condensation of water vapor in the device, so that the water vapor corrosion resistance of the device can be obviously detected in a short time. The detection processing includes: adjusting the temperature of the test box multiple times, and detecting the parameters of the to-be-tested stacked packaging device to obtain electrical data during the adjustment process; controlling the first detection device to perform cyclic detection processing on the to-be-tested stacked packaging device multiple times until it is stopped in the case that the second preset condition is met. The second preset condition includes at least one of the following: the electrical data does not meet the target range, and the number of cycles of the detection processing meets a preset number of times; in the case that the second preset condition includes that the number of cycles meets the preset number of times, it is judged whether the integrity of the packaging metal of the to-be-tested stacked packaging device meets a target integrity, and in the case that the judgment result is yes, it is determined that the to-be-tested stacked packaging device is qualified. By setting specific test box environmental parameters including temperature, humidity and air exchange amount, the use of the device in an extreme atmospheric environment is simulated to detect the water vapor corrosion resistance of the device. Through the above detection method, the storage of the device in the atmospheric water vapor can be simulated in a short time. In this simulation process, the corrosion process can be accelerated. The electrical parameters of the device are detected multiple times in the cyclic detection processing, which can timely discover whether the device has been eroded by water vapor. According to the set qualification standard and the detection result, whether the device can maintain good performance and reliability in the simulated harsh environmental conditions is accurately evaluated, so as to solve the technical problem that the stacked packaging device is difficult to be reliably detected in the prior art.

[0039] In the specific implementation process, before the above step S1, other steps can also be performed. The detection method further includes: controlling the test box to perform pretreatment on the to-be-tested stacked packaging device. The pretreatment is used to evaporate the water vapor adsorbed by the to-be-tested stacked packaging device, including: adjusting the temperature of the test box from room temperature to the first temperature at a first temperature change rate, and keeping the temperature of the test box at the first temperature for a target time period.

[0040] In the above embodiment, as Figure 3As shown, the above-mentioned to-be-tested stacked package device is subjected to electrical testing in advance to ensure that the function and performance of the to-be-tested stacked package device are qualified. The above-mentioned pre-processing process is to bake the to-be-tested stacked package device in a test box, and the temperature of the AB section is gradually increased from room temperature to T0 at a temperature change rate of not higher than 10 ℃ / min, so that the water vapor adsorbed inside and outside the device is fully vaporized and discharged. T0 is the highest storage temperature of the device (for example, 125 ℃ for military product devices), the baking time of the BC section is not less than 24 h, and the device is not powered on during the baking process. The water vapor adsorbed inside and outside the device is effectively removed in the pre-processing stage, which avoids the influence of the water vapor on the subsequent test results, and ensures that the device is in a dry state at the beginning of the test, so that the test results are more accurate and can truly reflect the corrosion resistance of the device in a water vapor environment.

[0041] The above step S2 of the present application adjusts the temperature of the test box multiple times, and in the adjustment process, the to-be-tested stacked package device is subjected to parameter detection, such as Figure 3 As shown, it comprises:

[0042] Step S21, the temperature of the test box is adjusted from the first temperature to the second temperature, and the second temperature is the lowest storage temperature of the to-be-tested stacked package device; this part is a high-temperature cooling stage (CD section), the temperature is decreased from the first temperature T0 to the second temperature T1 at a temperature change rate of 100 ℃ / min, so that the environmental water vapor condenses on the surface of the device and penetrates into the inside of the device through the gap between the two silicon substrates of the device; T1 is the lowest storage temperature of the device (for example, -55 ℃ for military product devices). The test box is subjected to low-temperature holding (DE section), and the temperature of the test box is maintained at T1 for 0.5 h, so that the temperature inside and outside the device reaches equilibrium and remains stable. The rapid change of the above-mentioned temperature simulates the environmental change that the device may encounter in actual use, which can comprehensively detect the electrical performance of the device at different temperatures and better verify the stability of the device in a water vapor corrosion environment.

[0043] Step S22, after the first time period (0.5 h), the temperature of the test box is adjusted from the second temperature to the third temperature, and the first detection device is controlled to apply a voltage to the to-be-tested stacked package device, and the to-be-tested stacked package device is subjected to parameter detection after the second time period, and the third temperature is the lowest working temperature of the to-be-tested stacked package device; this step is a low-temperature heating (EF section), and the temperature is gradually increased from the second temperature T1 to the third temperature T2 at a temperature change rate of 3-5 ℃ / min, wherein T2 is the lowest working temperature of the device (for example, -45 ℃ for military product devices); then low-temperature holding is performed, and the to-be-tested stacked package device is maintained at T2 for 0.5 h, so that the water vapor inside the device is uniformly diffused, and the device is subjected to power-on testing from point F to verify whether the function and performance of the device are qualified.

[0044] The above power-on test can be to apply a bias voltage to the device, in order to improve the test effect, the selected bias condition should use as many leads as possible to maximize the potential difference between the metallization lines (conductor circuits) in the device or between the external leads, and to minimize power consumption.

[0045] In step S23, the temperature of the test chamber is adjusted from the third temperature to the second temperature, and the first detection device is controlled to detect parameters of the to-be-tested stacked package device after a fourth time period; low-temperature cooling (GH section) is performed to gradually reduce the temperature of the test chamber from the third temperature T2 to the second temperature T1 at a temperature change rate of 3-5 ℃ / min, the device remains in the power-on state, and whether the device function and performance are qualified is verified; and low-temperature holding (HI section) is performed to continuously detect the to-be-tested stacked package device at T1 for 0.5 h, so that the water vapor in the device is balanced and reaches a maximum value, the device remains in the power-on state, and whether the device function and performance are qualified is verified.

[0046] In step S24, the temperature of the test chamber is adjusted from the second temperature to the first temperature, and the first detection device is controlled to detect parameters of the to-be-tested stacked package device, and after a fifth time period, the temperature of the test chamber is adjusted from the first temperature to room temperature, and the first detection device is controlled to detect parameters of the to-be-tested stacked package device. The low-temperature heating (IJ section) is performed to increase the temperature from the second temperature T1 to the first temperature T0 at a temperature change rate of 100 ℃ / min, the device remains in the power-on state, and whether the device function and performance are qualified is verified. Then, the high-temperature holding (JK section) is performed to keep the to-be-tested stacked package device at T0 for the fifth time period (1 h), the device remains in the power-on state, and whether the device function and performance are qualified is verified; then, the high-temperature cooling (KL section) is performed to reduce the temperature of the test chamber from the first temperature T0 to room temperature at a temperature change rate of 100 ℃ / min, the device remains in the power-on state, and whether the device function and performance are qualified is verified. The rapid change of the above temperature and the power-on detection at high and low temperatures simulate the environmental changes that the device may encounter in actual use, accelerate the corrosion process, and can comprehensively detect the electrical performance of the device at different temperatures, and better verify the stability of the device in the water vapor corrosion environment.

[0047] The first cycle detection process is completed, as shown in Figure 3 The second to Nth cycles are started from the L point (the device always remains in the power-on state), and the steps S21-S24 are cycled until all cycle tests are completed, wherein the difference between the step S21 in the second to Nth cycles and the first cycle is that in the high-temperature cooling stage, the temperature is reduced from room temperature to the second temperature T1 at a temperature change rate of 100 ℃ / min.

[0048] By simulating the working and storage conditions of the device in high and low temperature environment in the above-mentioned cycle detection process, the corrosion process caused by water vapor penetration is accelerated, so that the corrosion phenomenon that may occur in the long-term use environment can be observed within a limited time. During the cycle test process, the continuous application of voltage for parameter detection can make the test continuous and improve the reliability of the evaluation.

[0049] During the multiple cycle detection process, unexpected test interruption (such as power interruption or device failure) may occur. In order to maintain a high accuracy of the detection method after interruption, in some optional embodiments, the detection method further comprises: controlling the first detection device to detect the cycle of the to-be-tested stacked package device for a preset number of times, and in the case that interruption occurs at any detection process before the last detection process, re-performing a detection process on the to-be-tested stacked package device; in this way, the continuity of the detection process can be ensured, and even if interruption occurs, the integrity of the test can be maintained through supplementary cycles, so that the effectiveness of the final monitoring data is ensured.

[0050] In the case that interruption occurs in the last detection process, the to-be-tested stacked package device is re-detected for two consecutive times, and the number of cycles of the detection process is the preset number plus 1. If interruption occurs in the last cycle, in addition to re-executing the cycle, another cycle without interruption should also be performed, so that the integrity of the test can be maintained. And in this cycle, any intentional interruption or accidental interruption exceeding 24h requires the test to be redone from beginning to end.

[0051] The above-mentioned detection method can also detect the electrical parameters of the device after a preset number of detection processes of the device, and the interruption process in this process is as shown above.

[0052] In some optional embodiments, judging whether the completeness of the packaging metal of the to-be-tested stacked package device meets the target completeness comprises: controlling the second detection device to detect the corrosion area of the packaging metal of the to-be-tested stacked package device to obtain the completeness of the packaging metal of the to-be-tested stacked package device; judging whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein in the case that the first judgment result indicates yes, it is determined that the to-be-tested stacked package device is qualified. According to the final detection result, it is judged whether the area of the plated or base metal of any packaging part of the device is ≤ the third threshold value (5%), and whether all electrical characteristics and parameter tests of the device are qualified. By taking the electrical characteristics (internal) and the corrosion area (external) of the device as the judgment standard at the same time, the water vapor protection capability of the non-airtight packaging can be accurately evaluated. The above-mentioned third threshold value is a qualified standard obtained according to experience, which provides a clear evaluation basis for the use reliability of the device.

[0053] In some optional embodiments, the detection method further comprises: obtaining the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes; and detecting the service life of the to-be-detected stacked packaging device according to the average temperature acceleration factor and the average humidity acceleration factor of the to-be-detected stacked packaging device, to obtain the service life length of the to-be-detected stacked packaging device. By using the acceleration factor, the complex environmental effect is converted into a specific numerical value, the service life of the device under normal temperature and humidity conditions can be predicted, the quantitative analysis of the life prediction is facilitated, and an important basis for the reliability evaluation of the device is provided.

[0054] After the water vapor corrosion resistance test is completed according to the above method, the acceleration corrosion time of each cycle at the highest temperature of 125℃ for 2h is calculated. If the preset number is 16 times, the duration at the highest temperature of 125℃ is 32h in total. Based on the conditions of 125℃ and relative humidity of 80% (RH), the specific time equivalent to the normal environmental conditions of 25℃ and relative humidity of 30% (RH) is calculated. In some optional embodiments, the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes are obtained, including:

[0055] According to the gas constant, the Arrhenius model, the thermodynamic temperature, and the activation energy of the chemical reaction in each detection process, the average temperature acceleration factor in the preset number of detection processes is determined. According to the Arrhenius model, the activation energy E a is 0.6eV, the gas constant R is 8.617×10 -5 eV / K, and the calculation is 357;

[0056] According to the temperature-humidity acceleration test model, the relative humidity at the highest temperature in the test chamber, the relative humidity at the lowest temperature in the test chamber, and the humidity index, the average humidity acceleration factor in the preset number of detection processes is determined. Based on the temperature-humidity acceleration test model (Peck humidity correction model), the humidity index empirical value n is 3, and the calculation is 23.7. Thus, the comprehensive acceleration factor = temperature acceleration factor × humidity acceleration factor = 6767, and the time equivalent to 25℃ for 32h at 125℃ = 32h×6767 = 216544h (about 24.7 years). Through the above detection of the device, the storage life of the device can be predicted, frequent detection of the storage device is not needed, and human cost and time are saved.

[0057] The non-hermetic packaging device can also face other corrosive environments, such as salt spray environment, acidic gas environment, alkaline gas environment, etc. By adjusting the test conditions, such as changing the relative humidity and changing the test gas composition, the present application can also be used for testing in these corrosive environments to comprehensively evaluate the corrosion resistance of the device under different environmental conditions.

[0058] The test method can also be used to evaluate the corrosion resistance of different materials in non-hermetic packaging. For example, by replacing the micro-bump material (such as Au, Cu / Ni / Au, Sn / Pb, Sn / Ag / Cu, etc.) in a stacked package device, the performance of different materials under water vapor corrosion can be compared, thereby providing a basis for device design and material selection.

[0059] The test method of the non-hermetic stacked package device of the present application can also be applied to other devices that belong to water-tight but not air-tight packaging.

[0060] The embodiments of the present application also provide a stacked package device detection apparatus. It should be noted that the stacked package device detection apparatus of the embodiments of the present application can be used to execute the test method for non-hermetic stacked package devices provided by the embodiments of the present application. The apparatus is used to implement the above embodiments and preferred embodiments, which have been described. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware implementation is also possible and contemplated.

[0061] The stacked package device detection apparatus provided by the embodiments of the present application is described below.

[0062] Figure 4 is a schematic diagram of the non-hermetic stacked package device detection apparatus according to the embodiments of the present application. As Figure 4As shown, the device comprises: a starting module 10, configured to start a first detection device to perform detection processing on a to-be-tested stacked package device in a test box under the condition that the test box meets a first preset condition, the first preset condition comprising: a temperature in the test box being a first temperature, an air exchange amount of the test box per unit time being greater than or equal to a first threshold value, and an air relative humidity in the test box being greater than or equal to a second threshold value, the first temperature being a highest storage temperature of the to-be-tested stacked package device, the detection processing comprising: adjusting the temperature of the test box multiple times, and performing parameter detection on the to-be-tested stacked package device to obtain electrical data during the adjustment; a control module 20, configured to control the first detection device to perform the detection processing on the to-be-tested stacked package device for a plurality of cycles until stopping under the condition that a second preset condition is met, the second preset condition comprising at least one of: the electrical data not meeting a target range, and a cycle number of the detection processing meeting a preset number; and a determination module 30, configured to, under the condition that the second preset condition comprises the cycle number meeting the preset number, judge whether a completeness of a packaging metal of the to-be-tested stacked package device meets a target completeness, and determine that the to-be-tested stacked package device is qualified under the condition that the judgment result is yes.

[0063] The first detection device is started to detect the to-be-tested stacked packaging device in the test box under the condition that the test box meets the first preset condition by the starting module. The first preset condition includes that the temperature in the test box is a first temperature, the air exchange amount of the test box per unit time is greater than or equal to a first threshold, and the relative humidity of the air in the test box is greater than or equal to a second threshold. The first temperature is the highest storage temperature of the to-be-tested stacked packaging device. In this way, the use of the device in an extreme atmospheric environment can be simulated. The high-temperature and high-humidity environment can accelerate the process of water vapor penetration and metal corrosion, which is helpful for the penetration and condensation of water vapor in the device, so that the water vapor corrosion resistance of the device can be detected in a short time. The detection process includes: adjusting the temperature of the test box multiple times, and detecting the parameters of the to-be-tested stacked packaging device to obtain electrical data during the adjustment process; the control module controls the first detection device to detect the to-be-tested stacked packaging device multiple times in a cycle until it stops under the condition that the second preset condition is met. The second preset condition includes at least one of the following: the electrical data does not meet the target range, and the number of cycles of the detection process meets the preset number of times; the determination module determines whether the completeness of the packaging metal of the to-be-tested stacked packaging device meets the target completeness under the condition that the second preset condition includes that the number of cycles meets the preset number of times, and determines that the to-be-tested stacked packaging device is qualified under the condition that the determination result is yes. By setting specific test box environmental parameters, including temperature, humidity and air exchange, the use of the device in an extreme atmospheric environment is simulated to detect its water vapor corrosion resistance. The above detection method can simulate the storage of the device in the atmospheric water vapor in a short time. In this simulation process, the corrosion process can be accelerated. Detecting the electrical parameters of the device multiple times in the cycle detection process can timely detect whether the device has been eroded by water vapor. According to the set qualification standard and the detection result, whether the device can maintain good performance and reliability under the simulated harsh environmental conditions is accurately evaluated to solve the technical problem that the stacked packaging device is difficult to detect reliability in the prior art.

[0064] An optional solution, the detection device further includes a first control module, the first control module is used for controlling the test box to pre-treat the to-be-tested stacked packaging device. The pre-treatment is used for evaporating water vapor adsorbed by the to-be-tested stacked packaging device, including: adjusting the temperature of the test box from room temperature to the first temperature at a first temperature change rate, and keeping the temperature of the test box at the first temperature for a target time period.

[0065] An optional solution, the starting module includes a first sub-regulation module, a second sub-regulation module, a third sub-regulation module and a fourth sub-regulation module, wherein the first sub-regulation module is used to adjust the temperature of the test chamber from the first temperature to the second temperature, and the second temperature is the minimum storage temperature of the to-be-tested stacked package device; the second sub-regulation module is used to adjust the temperature of the test chamber from the second temperature to the third temperature after a first time period, and control the first detection device to apply voltage to the to-be-tested stacked package device, and perform parameter detection on the to-be-tested stacked package device after a second time period, and the third temperature is the minimum working temperature of the to-be-tested stacked package device; the third sub-regulation module is used to adjust the temperature of the test chamber from the third temperature to the second temperature, and control the first detection device to perform parameter detection on the to-be-tested stacked package device after a fourth time period; the fourth sub-regulation module is used to adjust the temperature of the test chamber from the second temperature to the first temperature, and control the first detection device to perform parameter detection on the to-be-tested stacked package device, and adjust the temperature of the test chamber from the first temperature to room temperature after a fifth time period, and control the first detection device to perform parameter detection on the to-be-tested stacked package device.

[0066] An optional solution, the detection device further includes a first sub-starting module and a second sub-starting module, wherein the first sub-starting module is used to control the first detection device to perform the detection process on the to-be-tested stacked package device for a preset number of cycles, and in the case that any one of the detection processes before the last detection process is interrupted, the detection process is performed on the to-be-tested stacked package device again; the second sub-starting module is used to perform the detection process on the to-be-tested stacked package device for two consecutive times again in the case that the last detection process is interrupted, and the number of cycles of the detection process is the preset number plus 1.

[0067] An optional solution, the determination module includes a first sub-control module and a first sub-determination module, wherein the first sub-control module is used to control the second detection device to detect the corrosion area of the packaging metal of the to-be-tested stacked package device, and obtain the integrity of the packaging metal of the to-be-tested stacked package device; the first sub-determination module is used to determine whether the corrosion area is less than or equal to a third threshold value, and obtain a first determination result, wherein in the case that the first determination result indicates yes, it is determined that the to-be-tested stacked package device is qualified.

[0068] In an optional solution, the detection device further comprises a first sub-acquisition module and a third sub-activation module, wherein the first sub-acquisition module is configured to acquire the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes; and the third sub-activation module is configured to detect the service life of the to-be-tested stacked packaging device according to the average temperature acceleration factor and the average humidity acceleration factor of the to-be-tested stacked packaging device, and obtain the service life of the to-be-tested stacked packaging device.

[0069] In an optional solution, the first sub-acquisition module comprises a first determination unit and a second determination unit, wherein the first determination unit is configured to determine the average temperature acceleration factor in the preset number of detection processes according to the gas constant, the Arrhenius model, the thermodynamic temperature, and the activation energy of the chemical reaction in each detection process; and the second determination unit is configured to determine the average humidity acceleration factor in the preset number of detection processes according to the temperature-humidity acceleration test model, the relative humidity when the test chamber has the highest temperature, the relative humidity when the test chamber has the lowest temperature, and the humidity index.

[0070] The detection device of the stacked packaging device comprises a processor and a memory, and the activation module and the like are stored in the memory as program units, and the corresponding functions are realized by the processor executing the program units stored in the memory. The modules are located in the same processor, or the modules are located in different processors in any combination.

[0071] The processor comprises a core, and the core retrieves the corresponding program units from the memory. The core can be one or more, and the reliability of the stacked packaging device is detected by adjusting the core parameters.

[0072] The memory can include a non-permanent memory in a computer readable medium, a random access memory (RAM), and / or a non-volatile memory such as a read-only memory (ROM) or a flash memory (flash RAM), and the memory comprises at least one memory chip.

[0073] The embodiment of the present application provides a computer readable storage medium, and the computer readable storage medium comprises a stored program, wherein when the program runs, the computer readable storage medium controls the device where the computer readable storage medium is located to execute the detection method of the non-airtight stacked packaging device.

[0074] Specifically, the detection method of the non-airtight stacked packaging device comprises:

[0075] Step S1, in a case where a test chamber meets a first preset condition, a first detection device is started to perform detection processing on a to-be-tested stacked package device in the test chamber, the first preset condition includes that a temperature in the test chamber is a first temperature, an air exchange amount of the test chamber per unit time is greater than or equal to a first threshold value, and a relative humidity of air in the test chamber is greater than or equal to a second threshold value, the first temperature is a highest storage temperature of the to-be-tested stacked package device, and the detection processing includes: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the to-be-tested stacked package device to obtain electrical data during the adjustment.

[0076] Step S2, the first detection device is controlled to perform the detection processing on the to-be-tested stacked package device for multiple cycles until a second preset condition is met, the second preset condition includes at least one of the following: the electrical data does not meet a target range, and a cycle number of the detection processing meets a preset number;

[0077] Step S3, in a case where the second preset condition includes that the cycle number meets the preset number, it is judged whether a completeness of a packaging metal of the to-be-tested stacked package device meets a target completeness, and in a case where the judgment result is yes, it is determined that the to-be-tested stacked package device is qualified.

[0078] Optionally, the detection method further includes: controlling the test chamber to perform pretreatment on the to-be-tested stacked package device, the pretreatment is used to evaporate water vapor adsorbed by the to-be-tested stacked package device, and includes: adjusting a temperature of the test chamber from room temperature to the first temperature at a first temperature change rate, and keeping the temperature of the test chamber at the first temperature for a target time period.

[0079] Optionally, the temperature of the test chamber is adjusted multiple times, and the parameter detection of the to-be-tested package device is performed during the adjustment, including: adjusting the temperature of the test chamber from the first temperature to a second temperature, the second temperature being the lowest storage temperature of the to-be-tested package device; after a first time period, adjusting the temperature of the test chamber from the second temperature to a third temperature, and controlling the first detection device to apply a voltage to the to-be-tested package device, and performing the parameter detection of the to-be-tested package device after a second time period, the third temperature being the lowest working temperature of the to-be-tested package device; adjusting the temperature of the test chamber from the third temperature to the second temperature, and controlling the first detection device to perform the parameter detection of the to-be-tested package device after a fourth time period; adjusting the temperature of the test chamber from the second temperature to the first temperature, and controlling the first detection device to perform the parameter detection of the to-be-tested package device, and after a fifth time period, adjusting the temperature of the test chamber from the first temperature to room temperature, and controlling the first detection device to perform the parameter detection of the to-be-tested package device.

[0080] Optionally, the detection method further includes: controlling the first detection device to perform the detection processing on the to-be-tested package device for the preset number of cycles, in a case where any one of the detection processing before the last detection processing is interrupted, re-performing the detection processing on the to-be-tested package device once; in a case where the last detection processing is interrupted, re-performing the detection processing on the to-be-tested package device twice continuously, the number of cycles of the detection processing being the preset number plus 1.

[0081] Optionally, the judgment on whether the completeness of the packaging metal of the to-be-tested package device meets the target completeness includes: controlling a second detection device to detect a corrosion area of the packaging metal of the to-be-tested package device to obtain the completeness of the packaging metal of the to-be-tested package device; judging whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein, in a case where the first judgment result indicates yes, it is determined that the to-be-tested package device is qualified.

[0082] Optionally, the detection method further includes: obtaining an average temperature acceleration factor and an average humidity acceleration factor in the test chamber in the preset number of detection processing; and detecting the service life of the to-be-tested package device according to the average temperature acceleration factor and the average humidity acceleration factor of the to-be-tested package device to obtain the service life length of the to-be-tested package device.

[0083] Optionally, the obtaining the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes comprises: determining the average temperature acceleration factor in the preset number of detection processes according to a gas constant, an Arrhenius model, a thermodynamic temperature, and an activation energy of a chemical reaction occurring in each detection process; and determining the average humidity acceleration factor in the preset number of detection processes according to a temperature-humidity acceleration test model, a relative humidity when the test chamber has the highest temperature, a relative humidity when the test chamber has the lowest temperature, and a humidity index.

[0084] The embodiment of the present application provides a processor, which is used for running a program, wherein the program performs the detection method of the non-airtight stacked package device when running.

[0085] Specifically, the detection method of the non-airtight stacked package device comprises:

[0086] In step S1, when the test chamber meets a first preset condition, a first detection device is started to perform a detection process on a to-be-detected stacked package device in the test chamber, and the first preset condition comprises that a temperature in the test chamber is a first temperature, an air exchange amount of the test chamber per unit time is greater than or equal to a first threshold, and an air relative humidity in the test chamber is greater than or equal to a second threshold, the first temperature is a highest storage temperature of the to-be-detected stacked package device, and the detection process comprises: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the to-be-detected stacked package device to obtain electrical data during the adjustment.

[0087] In step S2, the first detection device is controlled to perform the detection process on the to-be-detected stacked package device for a plurality of cycles until a second preset condition is met, and the second preset condition comprises at least one of that the electrical data does not meet a target range and a cycle number of the detection process meets a preset number.

[0088] In step S3, when the second preset condition comprises that the cycle number meets the preset number, it is judged whether the integrity of the packaging metal of the to-be-detected stacked package device meets a target integrity, and when the judgment result is yes, the to-be-detected stacked package device is determined to be qualified.

[0089] The embodiment of the present application provides a device, which comprises a processor, a memory and a program stored in the memory and executable on the processor, and at least the following steps are implemented when the processor executes the program: in the case that a test box meets first preset conditions, starting a first detection device to perform detection processing on a to-be-tested stacked package device in the test box, wherein the first preset conditions comprise that a temperature in the test box is a first temperature, an air exchange amount of the test box per unit time is greater than or equal to a first threshold value, and an air relative humidity in the test box is greater than or equal to a second threshold value, the first temperature is a highest storage temperature of the to-be-tested stacked package device, and the detection processing comprises: adjusting the temperature of the test box for multiple times, and performing parameter detection on the to-be-tested stacked package device to obtain electrical data during the adjustment; controlling the first detection device to perform the detection processing on the to-be-tested stacked package device for multiple cycles until stopping in the case that second preset conditions are met, wherein the second preset conditions comprise at least one of the following: the electrical data does not meet a target range, and a cycle number of the detection processing meets a preset number; in the case that the second preset conditions comprise that the cycle number meets the preset number, judging whether the completeness of a packaging metal of the to-be-tested stacked package device meets a target completeness, and determining that the to-be-tested stacked package device is qualified in the case that the judgment result is yes.

[0090] The device in the present application can be a server, a PC, a PAD, a mobile phone or the like.

[0091] The present application further provides a computer program product, which is suitable for executing a program initialized with at least the following method steps when executed on a data processing device: in the case that a test box meets first preset conditions, starting a first detection device to perform detection processing on a to-be-tested stacked package device in the test box, wherein the first preset conditions comprise that a temperature in the test box is a first temperature, an air exchange amount of the test box per unit time is greater than or equal to a first threshold value, and an air relative humidity in the test box is greater than or equal to a second threshold value, the first temperature is a highest storage temperature of the to-be-tested stacked package device, and the detection processing comprises: adjusting the temperature of the test box for multiple times, and performing parameter detection on the to-be-tested stacked package device to obtain electrical data during the adjustment; controlling the first detection device to perform the detection processing on the to-be-tested stacked package device for multiple cycles until stopping in the case that second preset conditions are met, wherein the second preset conditions comprise at least one of the following: the electrical data does not meet a target range, and a cycle number of the detection processing meets a preset number; in the case that the second preset conditions comprise that the cycle number meets the preset number, judging whether the completeness of a packaging metal of the to-be-tested stacked package device meets a target completeness, and determining that the to-be-tested stacked package device is qualified in the case that the judgment result is yes.

[0092] It should be apparent to those skilled in the art that the modules or steps of the application described above can be implemented with general computing devices, which can be centralized on a single computing device or distributed across a network of multiple computing devices, which can be implemented with program code executable by a computing device, which can be stored in a storage device for execution by a computing device, and in some cases, the steps shown or described can be performed in a different order than shown, or can be implemented as separate integrated circuit modules, or as a single integrated circuit module, and thus the application is not limited to any particular combination of hardware and software.

[0093] As will be appreciated by one skilled in the art, embodiments of the present application can be provided as a method, system, or computer program product. Accordingly, the present application can take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application can take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, magnetic disks, CD-ROMs, optical storage media such as DVD s, etc.) embodying computer readable program code.

[0094] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. Figure 1 The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. Figure 1 The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above.

[0095] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. Figure 1 The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. Figure 1 The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above. The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions specified in the flowchart block or blocks or in conjunction with the flowcharts described above.

[0096] These computer program instructions can also be loaded into a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 Figure 1

[0097] In one typical configuration, the computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0098] The memory can include non-persistent memory and / or volatile memory, such as random access memory (RAM) about which the processor can execute instructions. The memory can also include non-volatile memory, such as read only memory (ROM), electrically programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), flash memory, or other memory technologies, about which the processor can execute instructions. The memory is an example of computer readable media.

[0099] Computer readable media includes permanent and non-permanent, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read only memory (ROM), electrically programmable read only memory (EEPROM), flash memory or other memory technologies, compact disc read only memory (CD-ROM), digital versatile disc (DVD), or other optical storage, magnetic cassette, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible to a computing device. According to the definition herein, computer readable media does not include transitory media, such as modulated data signals and carrier waves.

[0100] The technical features of the above-described embodiments can be combined in any manner, and for the sake of brevity, not all possible combinations are described, however, as long as the combinations of the technical features do not exist contradictions, it should be considered within the scope of the present disclosure.

[0101] ​​It should also be noted that the terms "comprising", "comprises" or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0102] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

[0103] 1) The detection method of the non-airtight stacked packaging device of the present application simulates the use of the device in extreme atmospheric environment by setting specific test box environmental parameters, including temperature, humidity and air exchange rate, to detect its water vapor corrosion resistance. The above detection method can simulate the storage of the device in the atmospheric water vapor in a short time, and the corrosion process can be accelerated in this simulation process. Detecting the electrical parameters of the device multiple times in the cycle detection process can timely find out whether the device has been eroded by water vapor. According to the set qualification standard and the detection result, the performance and reliability of the device under simulated harsh environmental conditions can be accurately evaluated, so as to solve the technical problem that it is difficult to detect the reliability of the stacked packaging device in the prior art.

[0104] 2) The detection method of the non-airtight stacked packaging device of the present application can also detect the reliability of the device, and estimate the storage life of the device. Within the storage life, the memory device does not need to be frequently detected, which saves the labor cost and time.

[0105] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for detecting non-hermetic stacked packaged devices, characterized in that, The method comprises the following steps: In the case that the test chamber meets a first preset condition, a first detection device is started to perform detection processing on a to-be-tested stacked package device in the test chamber, the first preset condition comprises that a temperature in the test chamber is a first temperature, an air exchange amount of the test chamber per unit time is greater than or equal to a first threshold value, and a relative humidity of air in the test chamber is greater than or equal to a second threshold value, the first temperature is a highest storage temperature of the to-be-tested stacked package device, and the detection processing comprises the following steps: The temperature of the test chamber is adjusted from the first temperature to a second temperature, and the second temperature is a lowest storage temperature of the to-be-tested stacked package device; After a first time period, the temperature of the test chamber is adjusted from the second temperature to a third temperature, and the first detection device is controlled to apply a voltage to the to-be-tested stacked package device, and after a second time period, the to-be-tested stacked package device is subjected to parameter detection, and the third temperature is a lowest working temperature of the to-be-tested stacked package device; The temperature of the test chamber is adjusted from the third temperature to the second temperature, and the first detection device is controlled to perform parameter detection on the to-be-tested stacked package device after a fourth time period; The temperature of the test chamber is adjusted from the second temperature to the first temperature, and the first detection device is controlled to perform parameter detection on the to-be-tested stacked package device, and after a fifth time period, the temperature of the test chamber is adjusted from the first temperature to room temperature, and the first detection device is controlled to perform parameter detection on the to-be-tested stacked package device; The first detection device is controlled to perform the detection processing on the to-be-tested stacked package device for a plurality of cycles until the detection processing is stopped in the case that a second preset condition is met, and the second preset condition comprises at least one of the following: the electrical data does not meet a target range, and a cycle number of the detection processing meets a preset number; In the case that the second preset condition comprises that the cycle number meets the preset number, it is judged whether the completeness of a packaging metal of the to-be-tested stacked package device meets a target completeness, and in the case that the judgment result is yes, it is determined that the to-be-tested stacked package device is qualified.

2. The method of claim 1, wherein, The method further comprises the following steps: The test chamber is controlled to perform pretreatment on the to-be-tested stacked package device, and the pretreatment is used to evaporate water vapor adsorbed by the to-be-tested stacked package device, and the method comprises the following steps: The temperature of the test chamber is adjusted from room temperature to the first temperature at a first temperature change rate, and the temperature of the test chamber is maintained at the first temperature for a target time period.

3. The method of claim 1, wherein, The method further comprises the following steps: The first detection device is controlled to perform the detection processing on the to-be-tested stacked package device for the preset number of cycles, and in the case that any one of the detection processing before the last time of the detection processing is interrupted, the to-be-tested stacked package device is subjected to the detection processing again. In the case that the last detection process is interrupted, the detection process is performed on the to-be-tested stacked package device for two times again, and the number of cycles of the detection process is the preset number of times plus 1.

4. The method of claim 1, wherein, The judgment on whether the completeness of the packaging metal of the to-be-tested stacked package device meets a target completeness comprises: The control of the second detection equipment to detect the corrosion area of the packaging metal of the to-be-tested stacked package device to obtain the completeness of the packaging metal of the to-be-tested stacked package device; The judgment on whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein, in the case that the first judgment result indicates yes, it is determined that the to-be-tested stacked package device is qualified.

5. The method of claim 1, wherein, The detection method further comprises: The acquisition of an average temperature acceleration factor and an average humidity acceleration factor in the test chamber in the preset number of times of detection processes; The detection of the service life of the to-be-tested stacked package device according to the average temperature acceleration factor and the average humidity acceleration factor of the to-be-tested stacked package device to obtain the service life length of the to-be-tested stacked package device.

6. The method of claim 5, wherein, The acquisition of the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of times of detection processes comprises: The determination of the average temperature acceleration factor in the preset number of times of detection processes according to a gas constant, an Arrhenius model, a thermodynamic temperature and an activation energy of a chemical reaction in each detection process; The determination of the average humidity acceleration factor in the preset number of times of detection processes according to a temperature-humidity acceleration test model, a relative humidity when the test chamber has a highest temperature, a relative humidity when the test chamber has a lowest temperature and a humidity index.

7. A testing device for a non-hermetic stacked packaged device, characterized in that, Comprise: The starting module is used for starting the first detection equipment to perform a detection process on a to-be-tested stacked package device in a test chamber in the case that the test chamber meets a first preset condition, the first preset condition comprises that a temperature in the test chamber is a first temperature, an air exchange amount of the test chamber per unit time is greater than or equal to a first threshold value, and an air relative humidity in the test chamber is greater than or equal to a second threshold value, the first temperature is a highest storage temperature of the to-be-tested stacked package device, and the detection process comprises multiple times of adjustment of the temperature of the test chamber and parameter detection on the to-be-tested stacked package device to obtain electrical data in the adjustment process. The starting module comprises a first sub-regulating module, a second sub-regulating module, a third sub-regulating module and a fourth sub-regulating module, wherein the first sub-regulating module is configured to regulate the temperature of the test chamber from the first temperature to a second temperature, the second temperature being the lowest storage temperature of the to-be-tested stacked package device; the second sub-regulating module is configured to regulate the temperature of the test chamber from the second temperature to a third temperature after a first time period, and control the first detection device to apply a voltage to the to-be-tested stacked package device, and perform parameter detection on the to-be-tested stacked package device after a second time period, the third temperature being the lowest working temperature of the to-be-tested stacked package device; the third sub-regulating module is configured to regulate the temperature of the test chamber from the third temperature to the second temperature, and control the first detection device to perform parameter detection on the to-be-tested stacked package device after a fourth time period; and the fourth sub-regulating module is configured to regulate the temperature of the test chamber from the second temperature to the first temperature, and control the first detection device to perform parameter detection on the to-be-tested stacked package device, and regulate the temperature of the test chamber from the first temperature to room temperature after a fifth time period, and control the first detection device to perform parameter detection on the to-be-tested stacked package device; The control module is configured to control the first detection device to perform the detection process on the to-be-tested stacked package device for a plurality of cycles until a second preset condition is met, the second preset condition comprising at least one of the following: the electrical data does not meet a target range, and a cycle number of the detection process meets a preset number. The determination module is configured to, in a case where the second preset condition comprises that the cycle number meets the preset number, judge whether the completeness of the packaging metal of the to-be-tested stacked package device meets a target completeness, and determine that the to-be-tested stacked package device is qualified in a case where the judgment result is yes.

8. A computer-readable storage medium, characterized in that, The computer readable storage medium comprises a stored program, wherein the program controls the device where the computer readable storage medium is located to perform the detection method of the non-hermetic stacked package device according to any one of claims 1 to 6 when the program is running.

9. A processor, comprising: The processor is configured to run a program, wherein the program performs the detection method of the non-hermetic stacked package device according to any one of claims 1 to 6 when the program is running.

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