heat dissipating device

Abstract

The application discloses a heat dissipation device, and relates to the technical field of server heat dissipation, wherein the refrigerant is a two-phase refrigerant, and the heat dissipation device comprises a shell, a heat spreading plate and a cooling plate. The shell has a containing cavity; the heat spreading plate and the cooling plate are arranged in the containing cavity; the cooling plate is arranged above the heat spreading plate and is spaced from the heat spreading plate to form a refrigerant spacing; a spiral groove is arranged on the cooling plate, the spiral groove is located on a side of the cooling plate away from the heat spreading plate, and an outlet end of the spiral groove is communicated to the refrigerant spacing; and a plurality of heat dissipation fin groups are arranged in the spiral groove along the extension direction of the spiral groove. The heat dissipation device solves the problem that a liquid cooling heat dissipation device in the prior art cannot meet the heat dissipation requirement when high heat flux density heat dissipation is required, and the technical effect of significantly improving the heat dissipation efficiency of the heat dissipation device is achieved.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a heat dissipation device. Background Technology

[0002] In the current field of server thermal management, especially in the heat dissipation of high-power-density electronic devices, traditional air cooling and single-phase liquid cooling technologies face severe challenges. With the continuous improvement of the performance of modern electronic devices, the heat they generate is becoming increasingly concentrated, and the heat flux density is significantly increased, exceeding the effective heat dissipation range of air cooling and single-phase liquid cooling. In these high heat flux density applications, such as high-performance servers and large-scale integrated circuit (IC) chips, air cooling methods struggle to maintain the stable operating temperature of electronic components, thus affecting the overall performance and reliability of the equipment. Therefore, liquid cooling technology is necessary.

[0003] However, while current liquid cooling devices can uniformly heat the surface temperature of the heat source to a certain extent, they often fail to fully utilize the latent heat in the gas-liquid phase change process when achieving high heat flux density heat dissipation. This results in unstable heat dissipation performance, making it difficult to meet the requirements of high-precision temperature control and thus failing to meet the heat dissipation requirements for high heat flux density heat dissipation. Summary of the Invention

[0004] This application provides a heat dissipation device to at least solve the problem that liquid cooling heat dissipation devices in the related art cannot meet the heat dissipation requirements when heat flux density is high.

[0005] This application provides a heat dissipation device, comprising: a heat dissipation device, wherein the refrigerant in the heat dissipation device is a two-phase refrigerant, the heat dissipation device comprising: a shell, the shell having a receiving cavity; a heat spreader and a cooling plate, both disposed in the receiving cavity, the cooling plate being located above the heat spreader and spaced apart from the heat spreader to form a refrigerant gap; a spiral groove being disposed on the cooling plate, the spiral groove being located on the side of the cooling plate away from the heat spreader, the outlet end of the spiral groove being connected to the refrigerant gap; and a plurality of heat dissipation fins being sequentially disposed within the spiral groove along the extension direction of the spiral groove.

[0006] Furthermore, the housing includes an upper cover and a lower cover. The upper cover is provided with a first groove, and the lower cover is provided with a second groove corresponding to the first groove. The upper cover and the lower cover are mutually fitted and detachably connected so that the first groove and the second groove together form a receiving cavity.

[0007] Furthermore, the cooling plate is provided with a lower drainage hole and an upper drainage hole, both of which penetrate the cooling plate. The lower drainage hole is connected to the first end of the spiral groove, and the upper drainage hole is spaced apart from the spiral groove. The upper cover is provided with a refrigerant inlet connected to the second end of the spiral groove and a refrigerant outlet connected to the lower drainage hole.

[0008] Furthermore, the second end of the spiral groove is located in the middle of the cooling plate, and the first end of the spiral groove is located near the edge of the cooling plate.

[0009] Furthermore, the heat sink assembly includes a first heat sink and multiple second heat sinks. The first heat sink is parallel to and attached to the bottom surface of the spiral groove. The multiple second heat sinks are located on the side of the first heat sink away from the bottom surface of the spiral groove. The multiple second heat sinks are spaced apart along the width direction of the spiral groove and are all connected to the first heat sink.

[0010] Furthermore, the cross-section of the spiral groove is rectangular; and / or, the height of the heat sink assembly is less than or equal to the depth of the spiral groove.

[0011] Furthermore, the lower surface of the heat spreader is in contact with the bottom surface of the cavity, the upper surface of the cooling plate is in contact with the top surface of the cavity, and the side of the lower cover away from the upper cover is used to contact the heat-dissipating component; and / or, the cross-section of the cavity is rectangular, and both the heat spreader and the cooling plate are rectangular plates.

[0012] Furthermore, the heat spreader includes a main body and a plurality of protrusions spaced apart on the upper surface of the main body.

[0013] Furthermore, each protrusion is spaced apart from the cooling plate; and / or, multiple protrusions are arranged in a rectangular array; and / or, the protrusions are hemispherical, semi-ellipsoidal, polyhedral, or polyhedral pyramids.

[0014] Furthermore, the heat dissipation device includes: a refrigerant inlet pipe, which is located on the side of the upper cover away from the lower cover, and the outlet of the refrigerant inlet pipe is connected to the refrigerant inlet; and / or, a refrigerant outlet pipe, which is located on the side of the upper cover away from the lower cover, and the inlet of the refrigerant outlet pipe is connected to the refrigerant outlet.

[0015] Furthermore, the refrigerant inlet pipe includes a first long pipe section and a first short pipe section connected together, the first long pipe section being located outside the casing and the first short pipe section being inserted into the refrigerant inlet; and / or, the refrigerant outlet pipe includes a second long pipe section and a second short pipe section connected together, the second long pipe section being located outside the casing and the second short pipe section being inserted into the refrigerant outlet.

[0016] Furthermore, the refrigerant inlet has a rectangular cross-section, and the refrigerant inlet pipe also has a rectangular cross-section that matches the refrigerant inlet; and / or, the refrigerant outlet has a rectangular cross-section, and the refrigerant outlet pipe also has a rectangular cross-section that matches the refrigerant outlet.

[0017] Furthermore, the heat dissipation device includes a stirring component that passes through the upper cover and the cooling plate and is spaced apart from the spiral groove. The first stirring end of the stirring component is located inside the refrigerant inlet pipe, and the second stirring end of the stirring component is located inside the refrigerant gap.

[0018] Furthermore, the stirring component includes: a stirring shaft rotatably passing through the upper cover and the cooling plate; a first stirring element connected to the stirring shaft and located inside the refrigerant inlet pipe; and a second stirring element connected to the stirring shaft and located inside the refrigerant compartment.

[0019] Furthermore, the first stirring element includes at least one stirring plate and a stirring protrusion protruding from one side of the stirring plate, the surface of the stirring plate being arranged parallel to the stirring shaft; and / or, the second stirring element includes at least one stirring blade.

[0020] Furthermore, the heat dissipation device includes a flow regulating block, which is disposed inside the refrigerant inlet pipe. The flow regulating block includes a block body and a flow regulating hole that penetrates the block body; wherein, a stirring component is provided at one end of the flow regulating block near the outlet of the refrigerant inlet pipe.

[0021] Furthermore, the outer peripheral surface of the block body is inserted into the inner wall of the refrigerant inlet pipe, and the diameter of the flow regulating hole gradually decreases along the direction closer to the outlet of the refrigerant inlet pipe.

[0022] Furthermore, there are multiple flow control blocks, which are spaced apart along the extension direction of the refrigerant inlet pipe; a stirring component is provided between any two adjacent flow control blocks.

[0023] Furthermore, the spiral groove includes: a plurality of first groove segments, which are spaced apart along a first direction; a plurality of second groove segments, which are spaced apart along a second direction; wherein the first direction and the second direction are arranged at a predetermined angle and are both parallel to the cooling plate, and the plurality of first groove segments and the plurality of second groove segments are sequentially and alternately connected to form a plurality of annular groove units that are sequentially nested and connected along a direction away from the center line of the cooling plate, and the plurality of annular groove units together form a spiral groove.

[0024] Furthermore, at least one heat sink assembly is provided in the first slot segment, and the at least one heat sink assembly is connected sequentially along the extension direction of the first slot segment; and / or, at least one heat sink assembly is provided in the second slot segment, and the at least one heat sink assembly is connected sequentially along the extension direction of the first slot segment.

[0025] According to this application, the refrigerant in the heat dissipation device is a two-phase refrigerant. The heat dissipation device includes: a shell with a receiving cavity; a heat spreader and a cooling plate, both disposed in the receiving cavity, with the cooling plate located above the heat spreader and spaced apart from it to form a refrigerant gap; a spiral groove provided on the cooling plate, the spiral groove being located on the side of the cooling plate away from the heat spreader, and the outlet end of the spiral groove communicating with the refrigerant gap; and multiple heat dissipation fin groups, sequentially disposed within the spiral groove along its extension direction. Therefore, the heat dissipation device for accommodating two-phase refrigerant in this application forms a closed loop system through the heterogeneous integration of a phase change heat spreader and a single-phase cold plate, effectively isolating the external environment and reducing heat loss during heat exchange. The combination of spiral grooves and heat sinks on the cooling plate improves the heat exchange efficiency of the heat dissipation device, especially under high heat flux density, enabling faster heat removal from the heat source. The two-phase refrigerant, as the refrigerant, has a dual function: one is to act as a phase change medium to homogenize the surface temperature of the heat source through gas-liquid phase change, and the other is to act as a single-phase fluid to complete heat exchange inside the liquid cooling plate. This achieves coordinated control of the flow state of the two-phase refrigerant, effectively absorbing the heat generated by the high-performance computing components inside the server, and achieving efficient cooling of the high-performance computing components inside the server. This solves the problem that liquid cooling devices in related technologies cannot meet the heat dissipation requirements under high heat flux density, and achieves the technical effect of significantly improving the heat dissipation efficiency and the uniformity of the heat source surface temperature. Attached Figure Description

[0026] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0028] Figure 2 for Figure 1 The front view of the heat dissipation device is shown.

[0029] Figure 3 for Figure 2 A cross-sectional view of the heat dissipation device shown along the EE direction;

[0030] Figure 4 for Figure 3 A partial enlarged view of point A of the heat dissipation device shown;

[0031] Figure 5 for Figure 3 A cross-sectional view of the heat dissipation device shown along the FF direction;

[0032] Figure 6 for Figure 3 A cross-sectional view of the heat dissipation device shown along the HH direction;

[0033] Figure 7 for Figure 1 The diagram shows the structure of the heat dissipation device after the upper part of the cover has been removed.

[0034] Figure 8 for Figure 1 The diagram shows the installation of the lower cover and heat spreader of the heat dissipation device.

[0035] Figure 9 for Figure 1 A schematic diagram of the heat dissipation device after its first part has been cut open;

[0036] Figure 10 for Figure 9 A partial enlarged view of point B of the heat dissipation device shown;

[0037] Figure 11 for Figure 9 The diagram shows the structure of the second part of the heat dissipation device after it has been cut open.

[0038] Figure 12 for Figure 11 A partial enlarged view of point C of the heat dissipation device shown;

[0039] Figure 13 for Figure 11 The diagram shows the structure of the second part of the heat dissipation device cut open in another direction.

[0040] The above figures include the following reference numerals:

[0041] 1. Top cover; 2. Bottom cover; 3. Refrigerant inlet pipe; 4. Refrigerant outlet pipe; 5. Heat spreader; 6. Cooling plate; 7. Heat sink assembly; 8. Stirring shaft; 9. First stirring component; 10. Flow regulating block; 11. Second stirring component; 13. Lower drain hole; 14. Upper drain hole; 15. Receiving cavity; 16. Refrigerant compartment; 17. Spiral groove; 18. Main body; 19. Protrusion; 20. First groove segment; 21. Second groove segment; 22. Stirring component; 23. Block body; 24. Flow regulating hole; 25. Stirring plate; 26. First heat sink; 27. Second heat sink; 28. Stirring protrusion. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0043] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0044] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] like Figures 1 to 13As shown, this application provides a heat dissipation device. The refrigerant in the heat dissipation device is a two-phase refrigerant. The heat dissipation device includes: a housing with a receiving cavity 15; a heat spreader 5 and a cooling plate 6, both disposed in the receiving cavity 15. The cooling plate 6 is located above the heat spreader 5 and spaced apart from the heat spreader 5 to form a refrigerant gap 16; a spiral groove 17 is provided on the cooling plate 6, the spiral groove 17 is located on the side of the cooling plate 6 away from the heat spreader 5, and the outlet end of the spiral groove 17 is connected to the refrigerant gap 16; and a plurality of heat dissipation fin groups 7 are sequentially disposed in the spiral groove 17 along the extension direction of the spiral groove 17.

[0046] The heat dissipation device for accommodating two-phase refrigerant in this application forms a closed-loop system through the heterogeneous integration of a phase change heat spreader and a single-phase cold plate, effectively isolating the external environment and reducing heat loss during heat exchange. The combination of the spiral groove 17 on the cooling plate 6 and the heat sink assembly 7 improves the heat exchange efficiency of the heat dissipation device, especially under high heat flux density, enabling faster heat removal from the heat source. The two-phase refrigerant, as the refrigerant, has a dual function: one is to act as a phase change medium to homogenize the surface temperature of the heat source through gas-liquid phase change, and the other is to act as a single-phase fluid to complete heat exchange inside the liquid cooling plate. This achieves coordinated control of the flow state of the two-phase refrigerant, effectively absorbing the heat generated by the high-performance computing components inside the server, and achieving efficient cooling of the high-performance computing components inside the server. This solves the problem that liquid cooling devices in related technologies cannot meet the heat dissipation requirements under high heat flux density, and significantly improves the heat dissipation efficiency and the uniformity of the heat source surface temperature.

[0047] like Figure 5 As shown, the housing includes an upper cover 1 and a lower cover 2. The upper cover 1 is provided with a first groove, and the lower cover 2 is provided with a second groove corresponding to the first groove. The upper cover 1 and the lower cover 2 are mutually fitted and detachably connected so that the first groove and the second groove together form a receiving cavity 15.

[0048] The heat dissipation device of this application significantly improves overall heat dissipation performance, manufacturing precision, and ease of maintenance by separating the housing into an independently manufactureable and assembleable upper cover 1 and lower cover 2. Firstly, the separate design of the upper cover 1 and lower cover 2 allows for the selection of materials for different functional areas. The upper cover 1 can be made of lightweight aluminum alloy with built-in honeycomb reinforcing ribs, balancing weight reduction and structural strength. The lower cover 2 can be made of high thermal conductivity copper alloy and directly attached to the heat source, minimizing thermal resistance. Simultaneously, the upper cover 1 and lower cover 2 can be precision-fitted with thermally conductive pads, eliminating thermal resistance caused by assembly gaps and significantly improving the sealing level, enabling the heat dissipation device to operate stably in high humidity and high dust environments. Secondly, the modular housing structure eliminates the need for complete disassembly of the heat dissipation device during later maintenance; only the upper cover 1 needs to be removed for quick fan replacement or dust cleaning, greatly shortening maintenance time. Finally, the separate housing reduces the difficulty of casting individual parts, minimizes raw material waste, and allows for personalized painting or anodizing of the upper cover 1, balancing heat dissipation performance and product aesthetics, achieving a win-win situation in terms of technology, cost, and user experience.

[0049] The cooling plate 6 is provided with a lower drainage hole 13 and an upper drainage hole 14, both of which penetrate the cooling plate 6. The lower drainage hole 13 is connected to the first end of the spiral groove 17, and the upper drainage hole 14 is spaced apart from the spiral groove 17. The upper cover 1 is provided with a refrigerant inlet connected to the second end of the spiral groove 17 and a refrigerant outlet connected to the lower drainage hole 13. In addition, the lower drainage hole 13 and the upper drainage hole 14 on the cooling plate 6 ensure that the refrigerant can effectively enter and exit; the refrigerant inlet and refrigerant outlet on the upper cover 1 ensure smooth flow of the refrigerant.

[0050] In the heat dissipation device of this application, the lower drainage hole 13 and the upper drainage hole 14, which are arranged through the cooling plate 6 along the thickness direction, do not only serve as simple channels, but also establish a stable refrigerant path within the system. When the liquid refrigerant arrives at the cooling plate 6 under pump pressure, it is first uniformly introduced into the refrigerant compartment 16 in a low-turbulence state through the lower drainage hole 13, where it fully exchanges heat with the heat-dissipated component. After absorbing heat, the high-temperature gaseous refrigerant then flows smoothly through the upper drainage hole 14 and the refrigerant outlet, avoiding stagnation, backflow, or air blockage in the refrigerant compartment 16, thus ensuring that a large amount of heat is removed in each cycle. At the same time, the refrigerant inlet and refrigerant outlet on the upper cover 1 are connected to the second end of the spiral groove 17 and the lower drainage hole 13, respectively: the liquid refrigerant enters the second end of the spiral groove 17 in a laminar flow state through the refrigerant inlet, flows through the spiral groove 17 to the first end of the spiral groove 17, and then flows from the lower drainage hole 13 to the refrigerant compartment 16.

[0051] Specifically, the cooling plate 6 is designed with a spiral groove 17, which communicates with the upper surface of the cooling plate 6 but maintains a certain distance from the lower surface to form an effective heat exchange path; multiple heat sink groups 7 are spaced apart along the extension direction of the spiral groove 17, increasing the heat exchange area; through the synergistic effect of the spiral groove 17 and the heat sink group 7, the contact area and flow path length between the fluid and the heat sink group 7 are increased by utilizing the principle of fluid dynamics, which enhances the heat exchange process, significantly improves heat dissipation efficiency, helps to reduce the temperature of the heat source surface, and extends the service life of servers and other equipment.

[0052] Furthermore, the heat exchange performance of the heat dissipation device can be further optimized by changing the cross-sectional shape of the spiral groove 17 or the structural composition of the heat sink assembly 7, so as to adapt to the heat dissipation requirements of different heat sources.

[0053] like Figure 7 As shown, the second end of the spiral groove 17 is located in the middle of the cooling plate 6, and the first end of the spiral groove 17 is located near the edge of the cooling plate 6.

[0054] In this way, by precisely positioning the second end of the spiral groove 17 in the middle of the cooling plate 6, and placing the first end near the edge of the cooling plate 6, the liquid refrigerant forms a controllable forced vortex from the inside to the outside in the spiral progressive path. With the inlet end located in the middle of the cooling plate 6, the liquid refrigerant first flows along the spiral groove 17, quickly covering the entire heating surface, eliminating the heat dissipation blind zone at the edge of the cooling plate 6 that is prone to occur in traditional straight grooves; it also carries away the heat on the central area of ​​the cooling plate 6; at the same time, the outlet end being close to the edge of the cooling plate 6 facilitates the rapid escape of bubbles, avoids air blockage and local boiling, and improves the long-term stability of the heat dissipation device.

[0055] The heat dissipation device of this application is suitable for scenarios such as servers and high-performance computing devices with high heat flux density. It can effectively solve the limitations of traditional heat dissipation methods and improve the operational stability and service life of servers and other devices.

[0056] The two-phase refrigerant in the heat dissipation device of this application can be a mixture of water and ethylene glycol or propylene glycol, which optimizes the latent heat utilization efficiency of gas-liquid phase change. Through the deep integration of fluid dynamics optimization and phase change heat dissipation technology, precise temperature control of heat sources with high heat flux density is achieved in a compact structure.

[0057] like Figure 5 , Figure 6 as well as Figure 11 and Figure 12As shown, the heat sink assembly 7 includes a first heat sink 26 and a plurality of second heat sinks 27. The first heat sink 26 is parallel to and attached to the bottom surface of the spiral groove 17. The plurality of second heat sinks 27 are located on the side of the first heat sink 26 away from the bottom surface of the spiral groove 17. The plurality of second heat sinks 27 are spaced apart along the width direction of the spiral groove 17 and are all connected to the first heat sink 26.

[0058] Specifically, the cross-section of the spiral groove 17 is rectangular; and / or, the height of the heat sink assembly 7 is less than or equal to the depth of the spiral groove 17. This design has significant technical benefits for the heat exchange performance and hydrodynamic characteristics of the microchannel liquid cooling device. The matching design between the height of the heat sink assembly 7 and the depth of the spiral groove 17 optimizes the flow pattern of the refrigerant within the spiral groove. When the height of the heat sink assembly is less than the depth of the spiral groove, the refrigerant flow path is smoother, avoiding flow resistance caused by the heat sink hitting the top of the spiral groove. This ensures that the refrigerant can circulate within the spiral groove with lower energy loss, improving the efficiency of the cooling device. Simultaneously, this design also helps prevent the accumulation of air bubbles within the microchannel, further enhancing the stability of the gas-liquid two-phase flow. Designing the height of the heat sink assembly 7 to be less than or equal to the depth of the spiral groove 17 ensures that the heat sink assembly is completely immersed in the refrigerant, allowing for sufficient contact between the heat sink and the refrigerant even under different operating conditions. Sufficient contact between the heat sink assembly and the refrigerant increases the effective heat exchange area, promoting heat exchange between the heat source and the refrigerant, thereby accelerating heat conduction and dissipation and improving cooling efficiency. This design is particularly crucial for maintaining chip temperatures within a safe range, especially in high heat flux density scenarios. Matching the height of the heat sink assembly 7 to the depth of the spiral groove enhances the compatibility of the cooling system. This design allows for flexible adjustment of the heat sink assembly height without altering the overall housing structure, adapting to chips or heat sources with varying cooling requirements. For example, a lower-height heat sink assembly can be used for chips with low heat flux density, while a higher-density heat sink assembly can be selected for chips with high heat flux density, provided its height does not exceed the depth of the spiral groove. This flexibility is highly beneficial for expanding the application scenarios of liquid cooling devices. By controlling the height of the heat sink assembly 7 to not exceed the depth of the spiral groove 17, the manufacturing process can be simplified and production costs reduced while ensuring cooling performance. The height of the heat sink assembly directly affects its material usage and processing difficulty. A reasonable height design not only reduces material waste but also simplifies the assembly process, reducing energy consumption and time costs during manufacturing. In summary, the proposed technical solution optimizes hydrodynamic performance, increases heat exchange area, improves the compatibility of the heat dissipation device, and reduces manufacturing costs through the matching design of the heat sink assembly height and the spiral groove depth. This is of great significance for improving the cooling efficiency and economy of microchannel liquid cooling devices. This design is not only suitable for servers and high-performance computing devices with high heat flux densities, but can also be flexibly extended to other electronic product fields requiring efficient heat dissipation.

[0059] like Figure 5 As shown, the lower surface of the heat spreader 5 is in contact with the bottom surface of the cavity 15, the upper surface of the cooling plate 6 is in contact with the top surface of the cavity 15, and the side of the lower cover 2 away from the upper cover 1 is used to contact the heat dissipated component; and / or, the cross-section of the cavity 15 is rectangular, and both the heat spreader 5 and the cooling plate 6 are rectangular plates.

[0060] The heat sink assembly 7 of the heat dissipation device of this application is arranged by combining a first heat sink 26 and multiple second heat sinks 27, which increases the number of heat sinks and optimizes the layout of the heat sinks, forming a highly efficient toothed heat dissipation structure. The synergistic effect of the heat sink assembly 7 and the spiral groove 17 utilizes the principles of heat conduction and convection to effectively accelerate the heat exchange between the refrigerant and the heat source, significantly improve the heat dissipation efficiency, reduce the temperature of the heat source surface, and extend the service life of servers and other equipment.

[0061] The spiral groove 17 in the heat dissipation device of this application has a rectangular cross-section. Compared with circular or other smooth curved shapes, the rectangular spiral groove 17 generates more boundary layer disturbance when the liquid flows through, thus forming stronger turbulence. The fluid in turbulent state can not only increase the flow velocity, but also significantly improve the heat exchange efficiency between the fluid and the groove wall. This is because the fluid in turbulent state has a stronger mixing ability, which can effectively break the boundary layer and promote rapid heat transfer. It helps to achieve a more uniform distribution when the fluid enters the spiral groove 17. Especially at the corner of the spiral groove 17, the uniformity of fluid distribution plays an important role in preventing local overheating, thereby ensuring that the thermal performance of the entire heat dissipation device is more stable and efficient. It can also make more effective use of the limited space inside the cooling plate 6. Compared with circular flow channels, rectangular flow channels can be arranged more closely to provide a larger heat exchange area, which is very advantageous for achieving efficient heat dissipation in a compact space.

[0062] Specifically, the first heat sink 26 and the multiple second heat sinks 27 are also rectangular. Compared with circular heat sinks, rectangular heat sinks can usually have a larger surface area, which means that more heat can be effectively dissipated. The increased heat exchange area helps to improve the cooling efficiency of the entire heat dissipation device, helps to guide the refrigerant to flow evenly in the spiral groove 17, prevents the fluid from forming dead zones or low flow rate areas in certain areas, and thus avoids the problem of uneven heat dissipation. They can also be arranged closely to reduce the gap between the two heat sink groups 7, which not only helps to improve heat dissipation efficiency, but also makes the entire heat dissipation device more compact and suitable for integration in a limited space.

[0063] In the heat dissipation device of this application, the arrangement of the heat dissipation plate 5 and the cooling plate 6 and the contact method between the lower cover 2 and the heat dissipation component are the core settings for achieving efficient heat conduction and uniform temperature control.

[0064] The side of the lower cover 2 away from the upper cover 1 is used to contact the heat dissipation component. It can directly absorb the heat generated by the high-performance computing component, reduce the heat residence time on the device surface, prevent local overheating, and ensure that the lower cover 2 can quickly conduct the absorbed heat to the heat dissipation plate 5 that is close to its inner side. Then, through the synergistic work of the heat dissipation plate and the cooling plate, the heat is quickly dissipated.

[0065] The lower surface of the heat spreader 5 is in close contact with the bottom surface of the cavity 15, which can minimize the thermal resistance during heat conduction. The lower the thermal resistance, the faster the heat transfer and the higher the heat dissipation efficiency. The heat spreader 5 can cover most of the bottom surface of the cavity 15, which means that it can effectively absorb the heat dissipated from the heat source to the lower cover 2. Regardless of the location of the heat source, the heat accumulated at the heat source can be quickly diffused to the entire surface of the heat spreader 5, thereby achieving temperature uniformity and avoiding device damage or thermal stress concentration caused by local high temperature.

[0066] The upper surface of the cooling plate 6 is attached to the top surface of the cavity 15, and together with the spiral groove 17 and heat sink assembly 7 inside, it forms an efficient and closed hot and cold medium flow path, which increases the contact area and path complexity between the cold medium and the cooling plate 6, thereby improving the heat exchange efficiency.

[0067] like Figure 8 As shown, the heat spreader 5 includes a main body 18 and a plurality of protrusions 19 spaced apart on the upper surface of the main body 18; wherein each protrusion 19 is spaced apart from the cooling plate 6; and / or, the plurality of protrusions 19 are arranged in a rectangular array; and / or, the protrusions 19 are hemispherical or semi-ellipsoidal or polygonal prism or polygonal pyramid.

[0068] In the heat dissipation device of this application, the heat dissipation plate 5 includes a main body 18 and a plurality of protrusions 19. The plurality of protrusions 19 are arranged in a rectangular array on the upper surface of the main body 18, maintaining a certain distance from the cooling plate 6, which increases the structural complexity of the heat dissipation plate, increases the contact area between the heat dissipation plate 5 and the refrigerant, and improves the heat exchange efficiency.

[0069] Specifically, the core component of the heat spreader is the main body 18, which serves as the primary heat conduction platform between the heat source and the refrigerant, responsible for rapidly and evenly distributing the heat emitted by the heat source. The introduction of protrusions 19 increases the structural complexity of the heat spreader 5. By altering the geometry of the main body 18 surface, more diverse fluid flow paths are created, which helps to enhance fluid turbulence and thus improve heat exchange efficiency. Each protrusion 19 provides additional surface area to the heat spreader 5. When in contact with the refrigerant, compared to the flat main body, they significantly increase the heat exchange interface, making... More heat is transferred from the heat spreader to the refrigerant per unit time, thus accelerating the heat dissipation process. Due to the presence of the protrusion 19, the heat spreader 5 can absorb and distribute heat more evenly, reducing the temperature gradient at the heat source and avoiding local overheating, which is crucial for maintaining system stability and extending component lifespan. The protrusion 19 maintains a certain distance from the cooling plate 6, allowing the refrigerant to form a flow space between them. By increasing the flow path and turbulence intensity of the refrigerant, the heat exchange efficiency between the cooling plate 6 and the refrigerant is further improved, thereby enhancing the cooling capacity of the entire heat dissipation system. In this way, not only is the thermal conductivity of the heat spreader itself improved, but its interaction with the refrigerant is also enhanced, ultimately achieving a more efficient and stable heat dissipation effect, especially suitable for heat dissipation scenarios with high heat flux density.

[0070] Specifically, the shape of the protrusions 19 can be selectively configured to further optimize fluid dynamics and enhance heat exchange. A larger surface area of ​​the protrusions 19 results in a larger contact area with the refrigerant, which facilitates rapid heat transfer. Furthermore, a reasonable spacing between the protrusions is also crucial; excessive density restricts fluid flow and reduces heat exchange efficiency, while excessive sparseness reduces the contact surface area, which is also detrimental to heat transfer.

[0071] In the heat dissipation device of this application, the shape of the protrusion 19 can also be designed as streamlined, corrugated, or fin-like, which can reduce the resistance to fluid flow and generate a turbulent effect that is conducive to heat exchange. For example, a sharp leading edge can cause fluid separation, forming eddies, thereby increasing the contact area between the fluid and the heat spreader 5 and improving the heat exchange rate.

[0072] In the heat dissipation device of this application, the shape of the protrusion 19 can also be configured to enhance the formation of boiling nuclei, thereby strengthening the phase change heat transfer of the refrigerant. For example, by using the protrusion 19 with a microstructured surface, the core points for boiling nuclei formation can be increased, the vaporization efficiency can be improved, and thus the heat dissipation capacity of the entire heat spreader 5 can be enhanced.

[0073] Furthermore, the heat exchange performance of the heat spreader 5 can be further optimized by changing the materials of the main body 18 and the protrusion 19 to adapt to the heat dissipation requirements of different heat sources. The choice of materials for the main body 18 and the protrusion 19 also affects its heat exchange performance. Different materials have different thermal conductivity and corrosion resistance. Therefore, the selection of materials should be based on a comprehensive consideration of factors such as thermal conductivity, corrosion resistance, cost, processing difficulty, and compatibility with refrigerants. Moreover, the shape and material of the protrusion need to be matched to each other to ensure that excellent heat exchange performance can be maintained in various refrigerants.

[0074] like Figures 1 to 6 as well as Figure 9 , Figure 11 and Figure 13 As shown, the heat dissipation device includes: a refrigerant inlet pipe 3, which is located on the side of the upper cover 1 away from the lower cover 2, and the outlet of the refrigerant inlet pipe 3 is connected to the refrigerant inlet; and a refrigerant outlet pipe 4, which is located on the side of the upper cover 1 away from the lower cover 2, and the inlet of the refrigerant outlet pipe 4 is connected to the refrigerant outlet.

[0075] In the heat dissipation device of this application, by setting a refrigerant inlet pipe 3 and a refrigerant outlet pipe 4, liquid refrigerant is introduced into the heat dissipation device through the refrigerant inlet pipe 3. Since the liquid refrigerant has a high heat capacity, it can maintain a relatively low temperature even after absorbing a large amount of heat. Therefore, by continuously supplying liquid refrigerant, the heat dissipation device can be ensured to have a continuous and efficient heat absorption capacity. After absorbing heat, part of the refrigerant in the heat dissipation device is converted into gaseous refrigerant. The gaseous refrigerant floats due to the decrease in density and is discharged from the heat dissipation device through the refrigerant outlet pipe 4. This process not only removes the refrigerant that has absorbed heat, but also reduces the risk of pressure buildup in the heat dissipation device by separating and discharging the gaseous refrigerant, maintaining the stable operation of the heat dissipation system in which the heat dissipation device is located, ensuring smooth circulation of the two-phase refrigerant, improving heat dissipation efficiency, reducing the temperature of the heat source surface, and extending the service life of servers and other equipment.

[0076] like Figure 5 and Figure 13 As shown, the refrigerant inlet pipe 3 includes a first long pipe section and a first short pipe section connected together. The first long pipe section is located outside the casing, and the first short pipe section is inserted into the refrigerant inlet; and / or, the refrigerant outlet pipe 4 includes a second long pipe section and a second short pipe section connected together. The second long pipe section is located outside the casing, and the second short pipe section is inserted into the refrigerant outlet.

[0077] In this way, the refrigerant inlet pipe 3 adopts an integrated structure in which the first long pipe section and the first short pipe section are coaxially welded. The first long pipe section is completely exposed outside the shell, which can directly connect to the external pipes or quick connectors, and avoids the space encroachment and increased flow resistance caused by the traditional "pipe running inside the shell". The first short pipe section is precisely inserted into the refrigerant inlet in the form of interference fit or stepped shaft, and two sealing rings can be set on its outer wall to form a double seal with the shell. This not only prevents micro-leakage caused by vibration, but also allows the shell and pipe to undergo millimeter-level relative displacement due to thermal expansion and contraction without damaging the seal. Similarly, the refrigerant outlet pipe 4 consists of a second long pipe section and a second short pipe section. The second long pipe section remains outside the casing, allowing for flexible placement of return hoses or quick-connect fittings, while the second short pipe section extends into the refrigerant outlet. This ensures that the high-temperature refrigerant, after leaving the cooling plate 6, first passes through the second short pipe section before entering the second long pipe section, significantly suppressing turbulent noise and pressure pulsation. This coaxial design, with its "long outer and short inner" configuration, moves the pipe vibration node outside the casing, maintaining a static seal between the cooling plate 6 and the top cover 1, thus reducing the overall noise of the server. Furthermore, the second long pipe section can be bent into an S-shape or spiral shape depending on the available space, while the second short pipe section remains straight, reducing the number of bends inside the casing and lowering the refrigerant pressure drop. The above technical solution describes a design for the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4, each comprising a connected first long pipe section (corresponding to the refrigerant inlet pipe) and a second long pipe section (corresponding to the refrigerant outlet pipe), as well as a first short pipe section and a second short pipe section respectively inserted into the refrigerant inlet and refrigerant outlet. This structural design is aimed at liquid-cooled heat dissipation devices, especially those involving microchannels or complex heat exchange structures. By directly inserting the first short section of the refrigerant inlet pipe 3 and the second short section of the refrigerant outlet pipe 4 into the refrigerant inlet and outlet of the casing, the sealing performance of the heat dissipation device is greatly enhanced. This direct insertion method reduces the number of connection points between the pipes and the casing, thereby reducing potential leakage points and enhancing the stability and safety of the entire liquid-cooled heat dissipation device. The first and second long pipe sections are located outside the casing, while the first and second short pipe sections are inserted into the corresponding refrigerant inlet and outlet of the casing. This structure simplifies the installation and maintenance process of the heat dissipation device. During installation, the short pipe sections can be directly inserted into the casing, reducing the need for special interfaces or complex pipe connections. Disassembly is also more convenient during maintenance or replacement, requiring no complex tools or additional sealing measures. The connection between the first long and first short pipe sections, and the connection between the second long and second short pipe sections, optimizes the hydrodynamic performance of the refrigerant as it enters and exits the heat dissipation device. Longer pipe sections can serve as stable fluid inlets and outlets, while the direct insertion of shorter pipe sections into the casing helps the refrigerant form a smoother flow transition before entering the cooling channels, reducing turbulence and resistance, ensuring uniform distribution of the refrigerant within the microchannels, and thus improving heat exchange efficiency. Further improvements in the heat exchange efficiency of the heat dissipation device can be achieved by optimizing the design of the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4.The precise positioning of the first and second short pipe sections ensures optimal hydrodynamic characteristics of the refrigerant when entering and exiting the casing, facilitating more thorough contact between the refrigerant and the heat sink assembly, thereby achieving more efficient heat transfer. The design of the refrigerant inlet pipe 3 and refrigerant outlet pipe 4 in the described technical solution, through the combination of long and short pipe sections, not only enhances the sealing and maintenance convenience of the heat dissipation device but also optimizes the hydrodynamic performance of the refrigerant within the heat dissipation device, improving heat exchange efficiency. This has a significant positive impact on liquid cooling devices, especially in high heat flux density scenarios, effectively enhancing the heat dissipation capacity and operational performance of electronic equipment.

[0078] In other words, both the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4 are L-shaped. The longer section of the L-shaped pipe is parallel to the upper cover 1, while the shorter section is inserted into the refrigerant inlet or outlet. This guides the refrigerant to flow smoothly into and out of the heat dissipation system along a specific path, avoiding fluid impact and eddies that might occur with straight pipes, reducing flow resistance, and ensuring uniform distribution and efficient circulation of the refrigerant within the liquid cooling plate. The special geometry of the L-shaped pipe also facilitates gas-liquid separation. When the gaseous and liquid refrigerants mix and flow to the L-shaped bend, the fluid velocity and direction change. Due to centrifugal force, the heavier liquid refrigerant tends to flow along the pipe wall, while the lighter gaseous refrigerant is more easily carried to the top of the pipe, helping to reduce noise and vibration during refrigerant flow and improving the overall stability of the system. This natural gas-liquid separation mechanism helps maintain refrigerant phase balance, thereby improving heat dissipation efficiency. Furthermore, the "L"-shaped design, compared to a straight tube, allows for more flexible arrangement within limited space, reducing the overall volume of the liquid cooling system. This is particularly important for space-constrained applications such as server racks and high-performance computers, helping to achieve more compact and efficient heat dissipation solutions.

[0079] In addition, the flow rate and pressure of the refrigerant can be further optimized by adjusting the size or shape of the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4 to meet the heat dissipation needs of different heat sources.

[0080] Specifically, the cross-section of the refrigerant inlet is rectangular, and the cross-section of the refrigerant inlet pipe 3 is also rectangular to match the refrigerant inlet; and / or, the cross-section of the refrigerant outlet is rectangular, and the cross-section of the refrigerant outlet pipe 4 is also rectangular to match the refrigerant outlet.

[0081] The design of the cross-sectional shapes of the refrigerant inlet and refrigerant inlet pipe 3, and the refrigerant outlet and refrigerant outlet pipe 4, significantly improves the overall heat exchange efficiency and system performance of the heat dissipation device. When both the refrigerant inlet and refrigerant inlet pipe 3 have rectangular cross-sections, this design ensures the refrigerant enters the heat dissipation device smoothly, reducing turbulence during entry and thus lowering fluid resistance, maintaining the continuity and stability of refrigerant flow. Compared to a circular cross-section, a rectangular cross-section provides a larger surface area for the same volume, facilitating initial heat exchange between the refrigerant and the heat dissipation structure. Similarly, when the refrigerant outlet and refrigerant outlet pipe 4 also have rectangular cross-sections, the fluid flows more smoothly to the outlet shape as it leaves the spiral channel or other cooling structure, avoiding dead zones or turbulence at the outlet, reducing unnecessary pressure loss, and ensuring efficient operation of the cooling system. The rectangular cross-section design allows for more efficient refrigerant distribution, especially in multi-channel or microchannel heat dissipation structures. When the refrigerant enters the rectangular cross-section spiral groove or cooling plate, it can be more evenly distributed throughout the flow channel, increasing the contact area between the refrigerant and the heat sink, thereby improving heat exchange efficiency. Simultaneously, the slight eddy current effect generated at the corners and edges of the rectangular flow channel further promotes heat transfer in the refrigerant, enhancing heat dissipation performance. The rectangular cross-section of the refrigerant inlet pipe 3 and refrigerant outlet pipe 4 matches the corresponding refrigerant inlet and outlet, simplifying the assembly process of the heat dissipation device, ensuring a tight fit between the pipes and interfaces, and reducing the risk of leakage. Furthermore, the rectangular interfaces are easy to position and fix, contributing to the overall stability and reliability of the heat dissipation system. During maintenance and troubleshooting, the rectangular design also facilitates quick identification and replacement of corresponding pipe fittings. In summary, by designing the cross-sections of the refrigerant inlet, refrigerant inlet pipe 3, refrigerant outlet, and refrigerant outlet pipe 4 as rectangular, not only are the fluid dynamics performance optimized and heat exchange efficiency improved, but the assembly and maintenance process is also simplified, ensuring the high efficiency, stability, and reliability of the heat dissipation device. This design innovation is particularly important in high heat flux density heat dissipation applications, enabling servers and other electronic devices to maintain high performance while effectively controlling internal temperature, extending device lifespan, and improving overall system energy efficiency.

[0082] like Figures 2 to 7 , Figures 9 to 11 as well as Figure 13 As shown, the heat dissipation device includes a stirring component 22, which passes through the upper cover 1 and the cooling plate 6 and is spaced apart from the spiral groove 17. The first stirring end of the stirring component 22 is located in the refrigerant inlet pipe 3, and the second stirring end of the stirring component 22 is located in the refrigerant interval 16.

[0083] In the heat dissipation device of this application, when the refrigerant passes through the refrigerant inlet pipe 3, the first stirring end of the stirring component 22 begins to rotate under the impetus of the refrigerant, causing the second stirring end of the stirring component 22 to rotate synchronously. This results in a complex flow pattern of the refrigerant within the refrigerant interval 16, forming vortices, breaking the laminar flow state of the refrigerant, and promoting turbulence. Turbulent fluid has a higher heat exchange coefficient, increasing the contact area and time between the refrigerant and the heat dissipation component. This allows for faster and more uniform transfer of heat generated by the heat source to the refrigerant, making heat exchange more complete and efficient. This reduces the surface temperature of the heat source, extends the service life of servers and other equipment, and allows these devices to operate in optimal condition for extended periods. It also reduces the need for frequent maintenance due to insufficient thermal management, lowers maintenance costs, and improves the overall availability and economy of the equipment. Furthermore, the formation and movement of bubbles in the two-phase refrigerant have a significant impact on heat dissipation efficiency. The stirring component 22 can control the size and distribution of bubbles, further improving the efficiency of gas-liquid phase change heat transfer by optimizing the contact at the gas-liquid interface.

[0084] like Figure 4 , Figure 5 and Figure 10 As shown, the stirring component 22 includes: a stirring shaft 8, which is rotatably mounted on the upper cover 1 and the cooling plate 6; a first stirring element 9, which is connected to the stirring shaft 8 and located inside the refrigerant inlet pipe 3; and a second stirring element 11, which is connected to the stirring shaft 8 and located inside the refrigerant spacer 16.

[0085] Specifically, the rotation of the first stirring element 9 drives the stirring shaft 8 and the second stirring element 11 to rotate, causing the refrigerant to form a vortex within the refrigerant interval 16. The formation of the vortex breaks the original laminar flow state of the refrigerant, making the refrigerant exhibit a complex turbulent flow pattern in this region. Compared with laminar flow, turbulence increases the contact frequency between the fluid and the solid surface, which can increase the collision and bursting frequency of bubbles, accelerate the detachment of bubbles, and promote effective heat exchange between the gas and liquid phases, thereby significantly improving the heat dissipation efficiency of the entire liquid cooling plate and significantly increasing the heat exchange efficiency between the refrigerant and the heat dissipation structure.

[0086] Specifically, the rotational speed of the stirring component 22 directly affects the intensity of the eddy current and the degree of turbulence of the refrigerant. The size, shape and layout of the first stirring component 9 and the second stirring component 11 can be appropriately adjusted with reference to the flow rate and viscosity of the refrigerant to optimize the stirring effect, further enhance the degree of turbulence of the refrigerant, and thus achieve more heat transfer per unit time.

[0087] like Figure 4 , Figure 5 and Figure 10As shown, the first stirring component 9 includes at least one stirring plate 25 and a stirring protrusion 28 protruding from one side of the stirring plate 25, the surface of the stirring plate 25 being arranged parallel to the stirring shaft 8; and / or, the second stirring component 11 includes at least one stirring blade.

[0088] In the heat dissipation device of this application, the first stirring member 9 is provided with at least one stirring plate 25 and a stirring protrusion 28 protruding on one side of the stirring plate 25. The stirring protrusion 28 is hemispherical, forming a fluid-driven spherical arc turbulence structure. Through the vortex effect generated by the flow of refrigerant in the refrigerant inlet pipe 3, the second stirring member 11, which includes at least one stirring blade, is driven to rotate, thereby enhancing the turbulence of the refrigerant in the refrigerant interval 16, increasing the boiling core density of the refrigerant in the refrigerant interval 16, strengthening the phase change efficiency of the refrigerant in the refrigerant interval 16, and significantly improving the heat exchange efficiency.

[0089] Thus, the structural design of the first stirring component 9 and the second stirring component 11 increases the complexity of the stirring component 22, improves the stirring effect, significantly enhances heat dissipation efficiency, reduces the temperature of the heat source surface, and extends the service life of the equipment.

[0090] In addition, the stirring effect can be further optimized by changing the shape or material of the stirring plate 25, the stirring protrusion 28 and the stirring blades to adapt to the heat dissipation requirements of different heat sources.

[0091] like Figure 4 , Figure 5 , Figures 9 to 11 as well as Figure 13 As shown, the heat dissipation device includes a flow regulating block 10, which is disposed inside the refrigerant inlet pipe 3. The flow regulating block 10 includes a block body 23 and a flow regulating hole 24 that penetrates the block body 23. The outer peripheral surface of the block body 23 is inserted into the inner wall surface of the refrigerant inlet pipe 3. The diameter of the flow regulating hole 24 gradually decreases along the direction close to the outlet of the refrigerant inlet pipe 3. A stirring component 22 is provided at one end of the flow regulating block 10 near the outlet of the refrigerant inlet pipe 3.

[0092] In the heat dissipation device of this application, by setting the flow regulating block 10, the flow rate of the refrigerant in the refrigerant inlet pipe 3 is precisely controlled, the flow rate and pressure distribution of the refrigerant flowing to the stirring component 22 are optimized, the heat exchange efficiency is improved, and the stability and efficiency of the system operation are ensured. The aperture change of the flow regulating hole 24, using the principle of fluid dynamics, can control the flow rate and pressure of the refrigerant, ensuring the uniform distribution of the refrigerant in the refrigerant interval 16 and enhancing the heat exchange effect.

[0093] Specifically, the change in the diameter of the flow regulating orifice 24 follows the principles of fluid dynamics. A smaller orifice diameter will lead to an increase in the refrigerant flow rate, while a larger orifice diameter will lead to a decrease in the flow rate but an increase in the flow volume. It can be adjusted according to different heat loads to achieve the best heat exchange effect.

[0094] In the described technical solution, the outer peripheral surface of the block body 23 and the inner wall surface of the refrigerant inlet pipe 3 are connected by an insertion joint. Simultaneously, the diameter of the flow regulating hole 24 gradually decreases towards the outlet of the refrigerant inlet pipe 3. This design has a positive technical effect on the fluid dynamics control and heat exchange efficiency of the heat dissipation system. The gradually decreasing diameter design effectively controls the flow velocity and flow rate of the refrigerant as it flows through the flow regulating hole. When the diameter decreases, the resistance of the refrigerant increases as it passes through the flow regulating hole, and the flow velocity decreases accordingly. This allows the refrigerant to undergo a gradual deceleration process before entering the cooling plate, thereby achieving precise control of the refrigerant flow rate. This flow rate control is particularly important for two-phase liquid cooling systems because it ensures the uniform distribution of the refrigerant in different phases, avoids local overheating or vaporization, and improves the stability and efficiency of heat exchange. The close contact between the insertion-fitted block body 23 and the inner wall surface of the refrigerant inlet pipe 3 optimizes the pressure distribution when the refrigerant enters the system. On the one hand, this close fit reduces leakage and turbulence in refrigerant flow, which helps maintain the system's hydrodynamic stability. On the other hand, the gradually decreasing diameter of the flow-regulating orifice 24 gradually increases fluid resistance as the refrigerant flows, forming a gradual pressure gradient. This helps to evenly distribute the refrigerant in the subsequent cooling structure, avoiding a decrease in heat exchange efficiency due to uneven pressure distribution. The gradual diameter design of the flow-regulating orifice allows the refrigerant to form specific hydrodynamic effects, such as vortices or jets, when entering the cooling plate. These effects increase the contact area and contact time between the refrigerant and the heat sink assembly, thereby enhancing the heat dissipation effect. Especially in two-phase liquid cooling, this design ensures that the liquid and gaseous mixture of the refrigerant is evenly dispersed within the cooling plate, improving heat exchange between the heat source and the refrigerant, effectively reducing the heat source temperature, and ensuring the stable operation of electronic equipment. The gradual diameter design and the insertion fit method enhance the stability of the entire heat dissipation system. On the one hand, precise orifice control helps maintain stable refrigerant flow and pressure balance, reducing fluctuations within the system. On the other hand, a tight fit enhances the stability of the block body within the refrigerant inlet pipe, preventing component displacement due to vibration or temperature changes, and further enhancing system stability. In summary, the proposed technical solution, through the gradual design of the flow-regulating orifice diameter and the tight fit between the block body and the refrigerant inlet pipe, can precisely control the refrigerant flow rate and pressure distribution, enhance heat dissipation, and improve system stability and reliability. This offers significant technical advantages for optimizing two-phase liquid cooling systems for high heat flux density electronic devices.

[0095] like Figure 4 , Figure 5 , Figures 9 to 11 as well as Figure 13As shown, there are multiple flow regulating blocks 10, which are spaced apart along the extension direction of the refrigerant inlet pipe 3; and / or, a stirring component 22 is provided between any two adjacent flow regulating blocks 10.

[0096] In the heat dissipation device of this application, the combined and synergistic effect of multiple flow regulating blocks 10 and stirring components 22 enhances the stirring effect. By utilizing the principle of fluid dynamics, the flow rate and pressure of the refrigerant can be precisely controlled, as well as the degree of turbulence of the refrigerant can be increased, ensuring the uniform distribution of the refrigerant and efficient heat exchange, significantly improving the heat dissipation efficiency, adapting to the heat dissipation needs of different heat sources, reducing the temperature of the heat source surface, and extending the service life of equipment such as servers.

[0097] like Figure 7 As shown, the spiral groove 17 includes: a plurality of first groove segments 20, which are spaced apart along a first direction; a plurality of second groove segments 21, which are spaced apart along a second direction; wherein the first direction and the second direction are arranged at a predetermined angle and are both parallel to the cooling plate 6, and the plurality of first groove segments 20 and the plurality of second groove segments 21 are sequentially and alternately connected to form a plurality of annular groove units that are sequentially nested and connected along a direction away from the center line of the cooling plate 6, and the plurality of annular groove units together form the spiral groove 17.

[0098] In the heat dissipation device of this application, by setting the complex structure of the spiral groove 17, the length and complexity of the flow path of the refrigerant are increased, ensuring full contact between the refrigerant and the heat sink assembly 7 and the cooling plate 6, enhancing the heat exchange effect, significantly improving the heat dissipation efficiency, reducing the temperature of the heat source surface, and extending the service life of servers and other equipment.

[0099] Specifically, the first direction and the second direction are perpendicular to each other.

[0100] like Figure 5 As shown, at least one heat sink group 7 is provided in the first slot segment 20, and the at least one heat sink group 7 is connected sequentially along the extension direction of the first slot segment 20; and / or, at least one heat sink group 7 is provided in the second slot segment 21, and the at least one heat sink group 7 is connected sequentially along the extension direction of the first slot segment 20.

[0101] In the described technical solution, at least one heat sink group 7 is respectively arranged in the first tank section 20 and the second tank section 21, and these heat sink groups 7 are connected sequentially along the extension direction of the tank section. This design has a significant effect on improving the heat exchange efficiency and performance of the heat dissipation device. The sequential connection of the heat sink groups 7 along the extension direction of the tank section can significantly increase the contact area between the refrigerant and the heat sink. During the two-phase refrigerant circulation process, the heat exchange area of ​​the heat sink group 7 is directly related to the efficiency of heat transfer from the heat source to the coolant. By arranging multiple heat sink groups in the tank section, the heat exchange interface can be effectively increased, thereby improving the overall heat transfer speed and efficiency; the layout and connection method of the heat sink groups 7 can optimize the flow pattern of the refrigerant in the tank section. The sequentially connected heat sink groups 7 can guide the refrigerant to form more complex streamlines, increase the turbulence of the fluid, which helps to enhance the heat exchange between the refrigerant and the heat sink. In addition, this design can also promote the uniform distribution of the refrigerant in the tank section, avoid local overheating and concentrated bubble formation, and improve the stability and reliability of the heat dissipation device. The sequential connection of multiple heat sink groups 7 forms a continuous heat exchange path, effectively dispersing the heat generated by the heat source even in high heat flux density scenarios. Each heat sink group 7 participates in the heat exchange process, ensuring rapid heat transfer and immediate refrigerant response, thereby improving heat dissipation efficiency, reducing the temperature gradient on the heat source surface, maintaining efficient equipment operation, and extending service life. The arrangement of the heat sink groups 7 within the first slot section 20 and the second slot section 21 can be flexibly adjusted according to the size and heat flow distribution of the specific heat source. Designers can set different numbers and layouts of heat sink groups within the slots as needed to adapt to heat sources of different shapes and power, achieving more precise matching of heat dissipation requirements and improving the heat dissipation performance and flexibility of the heat dissipation device. In summary, this application, by setting sequentially connected heat sink groups within the first and second slot sections, effectively increases the heat exchange area, optimizes the refrigerant flow pattern, improves heat dissipation efficiency, and ensures the stability and reliability of the heat dissipation device. This design flexibility allows it to adapt to different types and power heat sources, which is of significant value for the thermal management of high-performance electronic equipment.

[0102] In addition, the flow path of the refrigerant can be further optimized by adjusting the shape or size of the spiral groove 17 to adapt to the heat dissipation requirements of different heat sources.

[0103] The working process of the heat dissipation device in this application is as follows:

[0104] When the liquid refrigerant enters the refrigerant inlet pipe 3, it passes through the flow regulating hole 24 of the flow regulating block 10 and the stirring component 22, which optimizes the flow rate and pressure of the liquid refrigerant. Subsequently, the liquid refrigerant enters the spiral groove 17 and comes into full contact with the heat sink assembly 7 for heat exchange. During this process, the liquid refrigerant drives the first stirring element 9 at the first stirring end and the second stirring element 11 at the second stirring end of the stirring component 22 to rotate, enhancing the turbulence of the two-phase refrigerant and further improving the heat exchange efficiency.

[0105] Liquid refrigerant enters the refrigerant compartment 16 through the lower drain hole 13. Inside the refrigerant compartment 16, it is agitated by the second stirring end of the stirring component 22 and the second stirring component 11. After absorbing heat, it is converted into gaseous refrigerant. The gaseous refrigerant is discharged through the upper drain hole 14 and finally leaves the heat dissipation device through the refrigerant outlet pipe 4.

[0106] Specifically, a flow rate sensor is installed inside the refrigerant inlet pipe 3 to detect the flow rate of the refrigerant entering the refrigerant inlet pipe 3. Together with the stirring component 22, it achieves precise matching of the flow field and temperature field within the heat dissipation device.

[0107] The above provides a detailed description of a heat dissipation device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation device, characterized in that, The refrigerant in the heat dissipation device is a two-phase refrigerant, and the heat dissipation device includes: A housing having a receiving cavity (15); A heat spreader (5) and a cooling plate (6) are both disposed in the receiving cavity (15). The cooling plate (6) is located above the heat spreader (5) and spaced apart from the heat spreader (5) to form a refrigerant spacer (16). A spiral groove (17) is provided on the cooling plate (6). The spiral groove (17) is located on the side of the cooling plate (6) away from the heat spreader (5). The outlet end of the spiral groove (17) is connected to the refrigerant spacer (16). Multiple heat sink groups (7) are sequentially arranged in the spiral groove (17) along the extension direction of the spiral groove (17); The housing includes an upper cover (1) and a lower cover (2). The upper cover (1) is provided with a first groove, and the lower cover (2) is provided with a second groove corresponding to the first groove. The upper cover (1) and the lower cover (2) are mutually fitted and detachably connected so that the first groove and the second groove together form the receiving cavity (15). The cooling plate (6) is provided with a lower drain hole (13) and an upper drain hole (14), both of which penetrate the cooling plate (6). The lower drain hole (13) is connected to the first end of the spiral groove (17), and the upper drain hole (14) is spaced apart from the spiral groove (17). The upper cover (1) is provided with a refrigerant inlet connected to the second end of the spiral groove (17) and a refrigerant outlet connected to the lower drain hole (13). The heat dissipation device includes: A refrigerant inlet pipe (3) is provided on the side of the upper cover (1) away from the lower cover (2), and the outlet of the refrigerant inlet pipe (3) is connected to the refrigerant inlet; and / or, Refrigerant outlet pipe (4), the refrigerant outlet pipe (4) is located on the side of the upper cover (1) away from the lower cover (2), and the inlet of the refrigerant outlet pipe (4) is connected to the refrigerant outlet; The heat dissipation device includes a stirring component (22), which penetrates the upper cover (1) and the cooling plate (6) and is spaced apart from the spiral groove (17). The first stirring end of the stirring component (22) is located inside the refrigerant inlet pipe (3), and the second stirring end of the stirring component (22) is located inside the refrigerant interval (16). The heat dissipation device includes a flow regulating block (10), which is disposed inside the refrigerant inlet pipe (3). The flow regulating block (10) includes a block body (23) and a flow regulating hole (24) that penetrates the block body (23). The stirring component (22) is disposed at one end of the flow regulating block (10) near the outlet of the refrigerant inlet pipe (3).

2. The heat dissipation device according to claim 1, characterized in that, The second end of the spiral groove (17) is located in the middle of the cooling plate (6), and the first end of the spiral groove (17) is located near the edge of the cooling plate (6).

3. The heat dissipation device according to claim 1, characterized in that, The heat sink assembly (7) includes a first heat sink (26) and a plurality of second heat sinks (27). The first heat sink (26) is parallel to and attached to the bottom surface of the spiral groove (17). The plurality of second heat sinks (27) are located on the side of the first heat sink (26) away from the bottom surface of the spiral groove (17). The plurality of second heat sinks (27) are spaced apart along the width direction of the spiral groove (17) and are all connected to the first heat sink (26).

4. The heat dissipation device according to claim 1, characterized in that, The cross-section of the spiral groove (17) is rectangular; and / or, The height of the heat sink assembly (7) is less than or equal to the depth of the spiral groove (17).

5. The heat dissipation device according to claim 1, characterized in that, The lower surface of the heat spreader (5) is in contact with the bottom surface of the cavity (15), the upper surface of the cooling plate (6) is in contact with the top surface of the cavity (15), and the lower side of the outer surface of the housing is used to contact the heat-dissipating component; and / or, The cross-section of the cavity (15) is rectangular, and both the heat spreader (5) and the cooling plate (6) are rectangular plates.

6. The heat dissipation device according to claim 1, characterized in that, The heat spreader (5) includes a main body (18) and a plurality of protrusions (19) spaced apart on the upper surface of the main body (18).

7. The heat dissipation device according to claim 6, characterized in that, Each of the protrusions (19) is spaced apart from the cooling plate (6); and / or, The plurality of protrusions (19) are arranged in a rectangular array; and / or, The protrusion (19) is a hemisphere, a semi-ellipsoid, a prism, or a pyramid.

8. The heat dissipation device according to claim 1, characterized in that, The refrigerant inlet pipe (3) includes a first long pipe section and a first short pipe section connected to each other. The first long pipe section is located outside the housing, and the first short pipe section is inserted into the refrigerant inlet; and / or, The refrigerant outlet pipe (4) includes a second long pipe section and a second short pipe section connected together. The second long pipe section is located outside the housing, and the second short pipe section is inserted into the refrigerant outlet.

9. The heat dissipation device according to claim 1, characterized in that, The refrigerant inlet has a rectangular cross-section, and the refrigerant inlet pipe (3) also has a rectangular cross-section that matches the refrigerant inlet; and / or, The cross-section of the refrigerant outlet is rectangular, and the cross-section of the refrigerant outlet pipe (4) is also rectangular to match the refrigerant outlet.

10. The heat dissipation device according to claim 1, characterized in that, The stirring component (22) includes: A stirring shaft (8) is rotatably inserted through the upper cover (1) and the cooling plate (6). The first stirring element (9) is connected to the stirring shaft (8) and located inside the refrigerant inlet pipe (3); The second stirring element (11) is connected to the stirring shaft (8) and located within the refrigerant interval (16).

11. The heat dissipation device according to claim 10, characterized in that, The first stirring component (9) includes at least one stirring plate (25) and a stirring protrusion (28) protruding from one side of the stirring plate (25), wherein the surface of the stirring plate (25) is arranged parallel to the stirring shaft (8); and / or, The second stirring component (11) includes at least one stirring blade.

12. The heat dissipation device according to claim 1, characterized in that, The outer peripheral surface of the block body (23) is inserted into the inner wall of the refrigerant inlet pipe (3), and the diameter of the flow regulating hole (24) gradually decreases along the direction close to the outlet of the refrigerant inlet pipe (3).

13. The heat dissipation device according to claim 1, characterized in that, The number of the flow regulating blocks (10) is multiple, and the multiple flow regulating blocks (10) are spaced apart along the extension direction of the refrigerant inlet pipe (3); The stirring component (22) is provided between any two adjacent flow regulating blocks (10).

14. The heat dissipation device according to claim 1, characterized in that, The spiral groove (17) includes: Multiple first groove segments (20) are spaced apart along a first direction; Multiple second groove segments (21) are spaced apart along a second direction; The first direction and the second direction are set at a predetermined angle and are both parallel to the cooling plate (6). The plurality of first groove segments (20) and the plurality of second groove segments (21) are connected alternately in sequence to form a plurality of annular groove units that are sequentially nested and connected along the direction away from the center line of the cooling plate (6). The plurality of annular groove units together form the spiral groove (17).

15. The heat dissipation device according to claim 14, characterized in that, At least one heat sink assembly (7) is provided within the first slot segment (20), and the at least one heat sink assembly (7) is sequentially connected along the extending direction of the first slot segment (20); and / or, At least one heat sink assembly (7) is provided in the second slot segment (21), and at least one heat sink assembly (7) is connected sequentially along the extension direction of the first slot segment (20).

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