Wafer processing apparatus and loading method

Abstract

The application discloses a wafer processing equipment and a loading method. The equipment comprises a bearing part, a loading assembly and a detection part. A bearing surface of the bearing part is used for bearing a wafer, and the bearing surface is provided with at least two adsorption areas, the at least two adsorption areas comprising a center adsorption area arranged at a horizontal center of the bearing part and a peripheral adsorption area arranged at an edge of the bearing part. The loading assembly comprises a loading part, and the loading part is used for supporting the wafer to place the wafer on the bearing surface. The detection part is used for detecting the position of the wafer placed on the bearing surface. Wherein, the bearing surface is provided with a avoiding groove, and the avoiding groove is provided with an opening for the loading part to enter. The application is beneficial to arranging the wafer and the bearing part concentrically.

Description

Technical Field

[0001] This application relates to the field of wafer processing equipment technology, and in particular to a wafer processing equipment and a feeding method. Background Technology

[0002] During wafer fabrication, high-precision positioning and fixation of the wafer are required to ensure processing quality. In related technologies, wafers are typically fixed using vacuum adsorption through suction holes on a carrier.

[0003] However, after the wafer is placed on the carrier, misalignment between the wafer and the carrier often occurs, resulting in low loading accuracy. This concentricity deviation causes the wafer to fail to completely cover the suction holes on the carrier, or causes some suction holes to be outside the wafer edge, leading to vacuum leakage. Vacuum leakage weakens the suction force, resulting in insecure wafer fixation. This can lead to displacement or even detachment during subsequent processing, affecting the wafer processing quality. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the related technologies, this application provides a wafer processing equipment and a feeding method to solve the problem of misalignment between the wafer and the carrier in the related technologies.

[0005] To address the aforementioned technical problems, in a first aspect, this application provides a wafer processing apparatus, which includes:

[0006] A carrier having a carrier surface for supporting a wafer, the carrier surface having at least two adsorption regions, the at least two adsorption regions including a central adsorption region disposed at the horizontal center of the carrier and a peripheral adsorption region disposed at the edge of the carrier;

[0007] A loading assembly, comprising a loading section for supporting the wafer to place the wafer on the support surface;

[0008] A detection element, used to detect the position of the wafer placed on the bearing surface;

[0009] The bearing surface is provided with a clearance groove, and the side of the clearance groove has an opening for the feeding part to enter.

[0010] In a possible implementation of the first aspect, the clearance groove is located between the peripheral adsorption area and the central adsorption area, and surrounds at least a portion of the circumferential edge of the central adsorption area.

[0011] The peripheral adsorption region surrounds a portion of the central adsorption region circumferentially outside, and the peripheral adsorption region forms the opening at opposite ends of the central adsorption region circumferentially.

[0012] In one possible implementation of the first aspect, each adsorption zone is provided with a plurality of adsorption pores;

[0013] The wafer processing equipment also includes:

[0014] A vacuum pumping assembly is connected to each of the adsorption holes and is used to evacuate each of the adsorption holes to adsorb and fix the wafer.

[0015] In a possible implementation of the first aspect, the plurality of adsorption pores within the central adsorption region form a plurality of circular arrays concentric with the horizontal center; and / or,

[0016] The plurality of adsorption pores in the peripheral adsorption zone are arranged sequentially along the extension direction of the arc, and the arc is concentric with the horizontal center.

[0017] In one possible implementation of the first aspect, the wafer processing equipment further includes:

[0018] A position adjustment component is used to drive the carrier to move, thereby changing the position of the carrier in the horizontal direction;

[0019] The controller is electrically connected to both the detection element and the position adjustment component. The controller is used to drive the carrier to move according to the position information detected by the detection element, so as to adjust the position of the carrier and make the horizontal center of the carrier coincide with the center position of the wafer.

[0020] In a possible implementation of the first aspect, the position adjustment component includes:

[0021] A first adjustment unit is used to drive the carrier to move along a first horizontal direction;

[0022] The second adjustment unit is used to drive the carrier to move along a second horizontal direction, wherein the first horizontal direction is perpendicular to the second horizontal direction.

[0023] In one possible implementation of the first aspect, the carrying device includes:

[0024] Mounting base, the carrier is disposed on the mounting base;

[0025] The first adjustment unit includes:

[0026] The first guide seat guides and engages with the mounting seat in the first horizontal direction;

[0027] A first driving element is electrically connected to the controller and is used to drive the mounting base to move along the first horizontal direction on the first guide seat;

[0028] The second adjustment unit includes:

[0029] The second guide seat is guided and engaged with the first guide seat in the second horizontal direction;

[0030] The second driving element is electrically connected to the controller and is used to drive the first guide seat to move along the second horizontal direction on the second guide seat.

[0031] In a possible implementation of the first aspect, the detection element includes a camera positioned above the carrier and configured to detect the position of the wafer by capturing images in a direction toward the wafer; or,

[0032] The detection element includes an edge finder disposed near the edge of the carrier to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

[0033] Secondly, this application also provides a feeding method, which is applied to any of the wafer processing equipment described in the first aspect, and the method includes:

[0034] The wafer is supported by the loading section in the loading assembly so as to place the wafer on the bearing surface of the carrier.

[0035] The wafer is fixed by adsorption using the central adsorption area on the carrier surface, wherein the central adsorption area is located at the horizontal center of the carrier.

[0036] The position of the wafer placed on the bearing surface is detected using a detection device to obtain the position of the center of the wafer;

[0037] The loading section then supports the adsorbed surface of the wafer, thereby detaching the wafer from the supporting surface.

[0038] The system receives the detected position information of the wafer and adjusts the position of the carrier according to the position information so that the horizontal center of the carrier coincides with the center position of the wafer.

[0039] In a possible implementation of the second aspect, after receiving the detected position information of the wafer and adjusting the position of the carrier according to the position information so that the horizontal center of the carrier coincides with the center position of the wafer, the method further includes:

[0040] The wafer is then supported by the loading section to place it on the support surface;

[0041] The wafer is adsorbed and fixed using the central adsorption area and the peripheral adsorption area on the carrier surface, wherein the peripheral adsorption area is located at the edge of the carrier.

[0042] Compared with related technologies, this application has at least the following beneficial effects:

[0043] In this application, when the wafer and the carrier are concentrically positioned, firstly, the wafer is placed on the carrier surface by the loading part of the loading assembly, and then the wafer can be adsorbed by the central adsorption area on the carrier surface. At this time, even if there is a concentricity deviation between the wafer and the carrier, the central adsorption area can still be covered by the wafer because it is located at the horizontal center of the carrier. That is, there will be no vacuum leakage, and the central adsorption area can adsorb and fix the wafer.

[0044] Subsequently, the inspection unit detects the position of the wafer on the carrier. After the inspection is completed and the wafer is removed from the carrier, the position of the carrier can be adjusted based on the position information detected by the inspection unit, so that the horizontal center of the carrier coincides with the center of the wafer placed on the carrier. In this way, while the spatial position of the wafer placed on the carrier by the loading assembly remains unchanged, it is beneficial to ensure that the center of the wafer placed on the carrier again coincides with the horizontal center of the carrier, that is, it is beneficial to arrange the carrier and the wafer concentrically.

[0045] This improves the concentric positioning accuracy between the wafer and the carrier, ensuring the wafer completely covers the adsorption area on the carrier, thus guaranteeing the adsorption force and firmly fixing the wafer. This prevents wafer displacement or detachment during subsequent processing, ensuring the quality of wafer processing. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 A perspective view of a portion of the structure of the wafer processing equipment provided in the embodiments of this application;

[0048] Figure 2 for Figure 1 Top view;

[0049] Figure 3 for Figure 1 The main view;

[0050] Figure 4 A top view of the carrier provided in the embodiments of this application;

[0051] Figure 5 This is one of the flowcharts for the feeding method provided in the embodiments of this application;

[0052] Figure 6 The second flowchart is a process for the feeding method provided in the embodiments of this application.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1-Bearing component; 11-Bearing surface; 111-Central adsorption area; 112-Outer adsorption area; 12-Adsorption hole; 13-Allowing groove; 14-Opening;

[0055] 2-Feeding assembly; 21-Feeding section;

[0056] 3-Inspection Items;

[0057] 4-Position adjustment assembly; 41-First adjustment unit; 411-First guide seat; 42-Second adjustment unit; 421-Second guide seat;

[0058] 5-Mounting base;

[0059] 6- Rotary drive component. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0062] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0063] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0064] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0065] As described in the background section of this application, high-precision positioning and fixation of the wafer are required during wafer fabrication to ensure wafer processing quality. In related technologies, wafers are typically fixed using vacuum adsorption through suction holes on a carrier.

[0066] However, after the wafer is placed on the carrier, misalignment between the wafer and the carrier often occurs, resulting in low loading accuracy. This concentricity deviation causes the wafer to fail to completely cover the suction holes on the carrier, or causes some suction holes to be outside the wafer edge, leading to vacuum leakage. Vacuum leakage weakens the suction force, resulting in insecure wafer fixation. This can lead to displacement or even detachment during subsequent processing, affecting the wafer processing quality.

[0067] In view of the above-mentioned problems, this application provides a wafer processing equipment to solve the problem of misalignment between the wafer and the carrier in the related art.

[0068] The technical solution of this application will be further described below with reference to specific embodiments and accompanying drawings:

[0069] like Figure 1 , Figure 2 and Figure 3 As shown, the wafer processing equipment includes a carrier 1, a loading assembly 2, and an inspection assembly 3. Among them, as... Figure 1 and Figure 4 As shown, the carrier 1 has a carrier surface 11 for carrying a wafer. The carrier surface 11 has at least two adsorption regions, including a central adsorption region 111 disposed at the horizontal center of the carrier 1 and a peripheral adsorption region 112 disposed at the edge of the carrier 1.

[0070] like Figure 1 , Figure 2 and Figure 3As shown, the loading assembly 2 includes a loading section 21, which supports the wafer to place it on the support surface 11. The detection element 3 is used to detect the position of the wafer when it is first placed on the support surface 11.

[0071] Among them, such as Figure 1 and Figure 2 As shown, a relief groove 13 is provided on the bearing surface 11, and the side of the relief groove 13 has an opening 14 for the feeding part 21 to enter.

[0072] In this application, when the wafer and the carrier 1 are concentrically positioned, firstly, the wafer is supported by the loading part 21 in the loading assembly 2 and placed on the carrier surface 11 of the carrier 1. Then, the wafer can be adsorbed by the central adsorption area 111 on the carrier surface 11. At this time, even if there is a concentricity deviation between the wafer and the carrier 1, the central adsorption area 111 can still be covered by the wafer because it is located at the horizontal center of the carrier 1. That is, there will be no vacuum leakage, and the central adsorption area 111 can adsorb and fix the wafer.

[0073] Subsequently, the detection component 3 detects the position of the wafer on the carrier 1. After the detection is completed and the wafer is removed from the carrier 1, the position of the carrier 1 can be adjusted according to the position information detected by the detection component 3, so that the horizontal center of the carrier 1 coincides with the center of the wafer placed on the carrier 1. In this way, with the spatial position of the wafer placed on the carrier 1 by the loading component 2 remaining unchanged, it is beneficial to make the center of the wafer placed on the carrier 1 coincide with the horizontal center of the carrier 1, that is, it is beneficial to make the carrier 1 and the wafer concentrically arranged.

[0074] This improves the concentric positioning accuracy between the wafer and the carrier 1, ensuring that the wafer completely covers the adsorption area on the carrier 1, thus guaranteeing the adsorption force on the wafer and firmly fixing it in place. This prevents wafer displacement or detachment during subsequent processing, ensuring the quality of wafer processing.

[0075] As can be seen from the above description, since the carrier 1 and the wafer can be concentrically positioned directly on the carrier 1 through two pick-up and drop operations in this application, there is no need for an additional transfer positioning platform, which simplifies the structural composition and reduces manufacturing costs.

[0076] It should be explained that the horizontal center of the carrier 1 coincides with the center of the wafer, which means that the horizontal center of the carrier 1 and the center of the wafer are located on the same central axis, that is, the center of the wafer is on the rotation axis of the carrier 1.

[0077] In addition, since the side of the clearance groove 13 has an opening 14 for the loading part 21 to enter, during the process of the loading assembly 2 placing the wafer onto the bearing surface 11, the loading part 21 can enter the clearance groove 13 through the opening 14, and at the same time the loading part 21 can also be moved to the placement position, so that the wafer supported on the loading part 21 can be placed on the bearing surface 11.

[0078] As can be seen from the above description, the opening 14 and the clearance groove 13 can prevent interference between the loading part 21 and the bearing surface 11, ensuring that the loading part 21 can stably place the wafer on the bearing surface 11, providing a stable prerequisite for subsequent precise positioning and wafer adsorption and fixation, and improving the smoothness and reliability of the loading process.

[0079] Furthermore, in some optional embodiments, the loading assembly 2 may also include a robotic arm, which may be a four-axis or six-axis robotic arm, etc. In this case, the loading part 21 may be a support claw disposed at the end of the robotic arm.

[0080] This setup allows the robotic arm's high-precision motion control to precisely move the wafer using the support claw, ensuring that the wafer moves smoothly and accurately close to the bearing surface 11.

[0081] In some alternative embodiments, the loading part 21 may also be a vacuum chuck located at the end of the robotic arm. The vacuum chuck can place the wafer on the bearing surface 11 by adsorbing and fixing the side of the wafer away from the carrier 1.

[0082] In other embodiments, the feeding component 2 can also be composed of an XY linear module or an XYZ linear module, wherein the XY linear module has two linear conveying directions, X and Y, and the XYZ linear module has three linear conveying directions, X, Y, and Z. The structure of the feeding component 2 is flexible and can be configured according to actual needs; this application does not impose specific limitations on this.

[0083] Regarding the number of peripheral adsorption regions 112, in this embodiment of the application, there may be one, two or more peripheral adsorption regions 112. The number of peripheral adsorption regions 112 is set flexibly. Specifically, it can be set according to actual needs. This embodiment of the application does not make a specific limitation on this.

[0084] Regarding the shape of the adsorption region, in the embodiments of this application, the shape of the adsorption region includes, but is not limited to, ring, circle, rhombus, rectangle, etc. The shape of the adsorption region is set flexibly. Specifically, it can be set according to actual needs. The embodiments of this application do not make specific limitations in this regard.

[0085] Furthermore, in some optional embodiments, adjacent adsorption regions are spaced apart in the horizontal direction.

[0086] This configuration ensures that the carrier 1 has a large adsorption and fixation range for the wafer, thereby ensuring the firmness of the adsorption and fixation of the wafer by the carrier 1. At the same time, it can reduce the number of adsorption holes 12 to a certain extent, which helps to simplify the configuration of adsorption holes 12 on the carrier 1.

[0087] Furthermore, in some alternative embodiments, such as Figure 1 and Figure 4 As shown, the clearance groove 13 is located between the outer adsorption area 112 and the central adsorption area 111, and surrounds at least part of the circumferential edge of the central adsorption area 111.

[0088] The peripheral adsorption region 112 surrounds the central adsorption region 111 on a portion of its circumferential outer side, and the peripheral adsorption region 112 forms an opening 14 at opposite ends of the central adsorption region 111 in the circumferential direction.

[0089] This arrangement allows for a gap between the adjacent peripheral adsorption area 112 and the central adsorption area 111 through the clearance groove 13. At the same time, the gap between the peripheral adsorption area 112 and the central adsorption area 111 also provides sufficient space to install the clearance groove 13, which facilitates the installation of the clearance groove 13 on the bearing surface 11.

[0090] In other embodiments, the clearance groove 13 may be located on the side of the peripheral adsorption area 112 away from the central adsorption area 111, and the clearance groove 13 may be disposed outside at least a portion of the circumferential edge of the peripheral adsorption area 112.

[0091] This configuration reduces the limitations imposed by the outer adsorption zone 112 and the central adsorption zone 111 on the processing of the clearance groove 13, which facilitates the processing of the clearance groove 13 on the carrier 1.

[0092] In some alternative embodiments, such as Figure 4 As shown, each adsorption zone is provided with multiple adsorption holes 12. The wafer processing equipment also includes a vacuum pumping component (not shown in the figure). The vacuum pumping component is connected to each adsorption hole 12 and is used to evacuate each adsorption hole 12 to adsorb and fix the wafer.

[0093] The design of setting multiple adsorption holes 12 in each adsorption zone and evacuating them with a vacuum pumping component ensures that the adsorption force is evenly distributed on the contact surface of the wafer, avoiding excessive local stress that could cause wafer deformation or damage. At the same time, the synergistic effect of multiple adsorption holes 12 can enhance the overall adsorption strength. Even if the adsorption strength of individual adsorption holes 12 is insufficient, the remaining adsorption holes 12 can still maintain a stable adsorption effect, effectively preventing the wafer from shifting or falling off during processing. This provides a reliable fixation guarantee for high-precision processing and further improves the stability of processing quality.

[0094] In this embodiment, the vacuuming component may include a vacuum pump or a vacuum generator, that is, the vacuum pump or vacuum generator is connected to the adsorption hole 12. The structure of the vacuuming component is flexible and can be set according to actual needs. This embodiment does not limit this in any specific way.

[0095] In other embodiments, the adsorption region can also adsorb and fix the wafer by means of suction cup or air pressure adsorption. The adsorption region adsorbs and fixes the wafer in a flexible manner, and can be determined according to actual needs. This application embodiment does not make specific limitations in this regard.

[0096] Furthermore, in some alternative embodiments, such as Figure 4 As shown, multiple adsorption pores 12 within the central adsorption region 111 form multiple circular arrays concentric with the aforementioned horizontal center.

[0097] This configuration allows the adsorption holes 12 within the central adsorption region 111 to exert a uniform and symmetrical adsorption force on the wafer, ensuring a balanced force on the wafer during initial fixation and preventing wafer skewing due to uneven local adsorption forces. Simultaneously, the concentric circular array layout corresponds to the horizontal center of the carrier 1, ensuring that even with slight initial wafer placement deviations, the adsorption holes 12 within the central adsorption region 111 have a higher probability of effectively contacting the wafer, guaranteeing the stability of initial adsorption, laying a solid foundation for subsequent concentric adjustments, and further reducing the risk of vacuum leakage.

[0098] In other embodiments, the plurality of adsorption holes 12 within the central adsorption region 111 can also be arranged in a rectangular array, a pentagonal array, or a triangular array. The arrangement of the adsorption holes 12 is quite flexible and can be set according to actual needs; however, this application does not impose specific limitations on this arrangement.

[0099] In some alternative embodiments, such as Figure 4 As shown, multiple adsorption holes 12 within the outer adsorption zone 112 are arranged sequentially along the extension direction of the arc, and the arc is concentric with the aforementioned horizontal center.

[0100] This configuration allows the adsorption holes 12 within the outer adsorption area 112 to form a uniform and symmetrical adsorption force on the wafer, ensuring that the wafer is subjected to balanced forces during fixation and preventing the wafer from becoming skewed due to uneven local adsorption forces.

[0101] In other embodiments, the multiple adsorption holes 12 within the peripheral adsorption region 112 can also be arranged in a rectangular array, a pentagonal array, or a triangular array. The arrangement of the adsorption holes 12 is quite flexible and can be set according to actual needs; this application embodiment does not impose specific limitations on this.

[0102] In some alternative embodiments, such as Figure 4As shown, multiple adsorption holes 12 in the central adsorption region 111 form multiple circular arrays concentric with the aforementioned horizontal center, and multiple adsorption holes 12 in the outer adsorption region 112 are arranged sequentially along the extension direction of the arc, and the arc is concentric with the aforementioned horizontal center.

[0103] This configuration allows the adsorption holes 12 on the entire bearing surface 11 to form a uniform and symmetrical adsorption force on the wafer, which can further ensure the wafer is under balanced force during fixation and further prevent the wafer from tilting due to uneven local adsorption force.

[0104] In some alternative embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the wafer processing equipment also includes a position adjustment component 4 and a controller (not shown in the figure). The position adjustment component 4 is used to drive the carrier 1 to move, so as to change the position of the carrier 1 in the horizontal direction.

[0105] The controller is electrically connected to both the detection element 3 and the position adjustment component 4. The controller is used to drive the carrier 1 to move according to the position information detected by the detection element 3, so as to adjust the position of the carrier 1 and make the horizontal center of the carrier 1 coincide with the center position of the wafer.

[0106] The controller is electrically connected to the detection component 3 and the position adjustment component 4. Based on the wafer position information obtained by the detection component 3, it can precisely control the position adjustment component 4 to drive the carrier component 1 to move horizontally, thereby achieving the alignment of the horizontal center of the carrier component 1 with the center of the wafer. This automated closed-loop control mode avoids the errors and inefficiencies of manual adjustment, provides a stable benchmark for subsequent adsorption fixation and processing operations, and significantly improves the accuracy and efficiency of wafer processing.

[0107] In other embodiments, the operator can manually adjust the position of the carrier 1 based on the position information detected by the detector 3. This eliminates the need for a controller and position adjustment component 4, simplifying the wafer fabrication equipment and reducing manufacturing costs.

[0108] Furthermore, in some alternative embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the position adjustment assembly 4 includes a first adjustment unit 41 and a second adjustment unit 42. The first adjustment unit 41 is used to drive the carrier 1 along a first horizontal direction (e.g., ...). Figure 2 The second adjustment unit 42 is used to drive the carrier 1 along the second horizontal direction (e.g., the X direction). Figure 2 The first horizontal direction moves in the Y direction and the second horizontal direction is perpendicular to the first horizontal direction.

[0109] This configuration enables precise two-dimensional movement of the carrier 1 in the horizontal direction, allowing for flexible and comprehensive adjustment of its position. It ensures that regardless of whether there is an initial X-direction or Y-direction deviation in the wafer placement, the carrier 1 and the wafer can quickly reach a concentric state through the drive of the corresponding adjustment unit. This significantly improves the accuracy and efficiency of position adjustment, providing a reliable guarantee for the subsequent stable adsorption and fixation of the wafer.

[0110] In other embodiments, the position adjustment component 4 may include only the first adjustment unit 41 or the second adjustment unit 42. This configuration simplifies the structure of the position adjustment component 4, facilitates its manufacture, and helps reduce manufacturing costs.

[0111] Furthermore, in some alternative embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the wafer processing equipment includes a mounting base 5, and a carrier 1 is disposed on the mounting base 5.

[0112] like Figure 1 , Figure 2 and Figure 3 As shown, the first adjustment unit 41 includes a first guide seat 411 and a first driving member (not shown in the figure). The first guide seat 411 is guided and engaged with the mounting base 5 in the first horizontal direction. The first driving member is electrically connected to the controller and is used to drive the mounting base 5 to move along the first horizontal direction on the first guide seat 411.

[0113] like Figure 1 , Figure 2 and Figure 3 As shown, the second adjustment unit 42 includes a second guide seat 421 and a second driving member (not shown in the figure). The second guide seat 421 is guided and engaged with the first guide seat 411 in the second horizontal direction. The second driving member is electrically connected to the controller and is used to drive the first guide seat 411 to move on the second guide seat 421 in the second horizontal direction.

[0114] This configuration ensures the stability and accuracy of the movement of the support component 1 in two vertical and horizontal directions, while also making the structure of the position adjustment component 4 more compact, which helps to reduce the space occupied by the position adjustment component 4.

[0115] In this embodiment, the guiding engagement between the first guide seat 411 and the mounting base 5, and the guiding engagement between the second guide seat 421 and the first guide seat 411, can be achieved through a guide rail and guide groove, or through a guide rod and guide hole. The guide rail can be an air-bearing guide rail.

[0116] As can be seen from the above description, the structure of the guide coordination is quite flexible. Specifically, it can be set according to actual needs, and the embodiments of this application do not impose specific limitations on it.

[0117] In this embodiment, the first driving component and the second driving component can be a linear motor, a cylinder, or a hydraulic cylinder, etc. The selection of the type of the first driving component and the second driving component is flexible. Specifically, they can be selected according to actual needs. This embodiment does not impose any specific limitations on this.

[0118] In this embodiment, the first driving member and the second driving member can be directly connected to the corresponding mounting base 5 or the first guide seat 411, or they can be indirectly connected to the corresponding mounting base 5 or the first guide seat 411 through a screw and nut mechanism, a gear and rack mechanism or a synchronous belt mechanism, etc.

[0119] The connection method between the first and second driving components and the corresponding mounting base 5 or first guide seat 411 is relatively flexible. Specifically, it can be selected according to actual needs. This application embodiment does not make specific limitations in this regard.

[0120] In other embodiments, the first adjustment unit 41 may include only the first driving member, and the second adjustment unit 42 may include only the second driving member, and the driving ends of both the first driving member and the second driving member abut against the mounting base 5.

[0121] With this configuration, on the one hand, when the first driving component is driven, the driving end of the second driving component is fixed and does not move, and the mounting base 5 can move relative to the driving end of the second driving component in the first horizontal direction; on the other hand, when the second driving component is driven, the driving end of the first driving component is fixed and does not move, and the mounting base 5 can move relative to the driving end of the first driving component in the second horizontal direction.

[0122] On the other hand, it can simplify the structural composition of the first adjustment unit 41 and the second adjustment unit 42, which is beneficial to facilitate the manufacturing of the first adjustment unit 41 and the second adjustment unit 42 and reduce manufacturing costs.

[0123] In some alternative embodiments, the detection element 3 includes a camera positioned above the carrier 1 and used to detect the position of the wafer by taking images in a direction toward the wafer.

[0124] With this setup, the camera captures images of the wafer placed on the support 1, obtaining its contour features (such as edges and notches). Based on these images, image recognition algorithms can be used to analyze the contours, extract the wafer's geometric center parameters, and thus accurately determine its center position.

[0125] This non-contact inspection method does not cause physical damage to the fragile wafer, which helps reduce costs. At the same time, based on the partitioned adsorption in the central adsorption area 111 and the peripheral adsorption area 112, combined with the visual positioning of the camera, it helps to solve the problems of low wafer placement accuracy and inability to autonomously position and inspect.

[0126] In some alternative embodiments, the detection element 3 includes an edge finder disposed near the edge of the carrier 1 to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

[0127] With this setup, the edge finder can obtain the coordinate information of at least three non-collinear points on the edge by contacting or non-contact sensing with the edge of the wafer. Based on the coordinate information of these points, the center position of the wafer can be calculated using geometric calculations (such as determining the center of a circle by three points). This provides a valid basis for the controller to adjust the position of the carrier 1 to achieve concentric arrangement.

[0128] Furthermore, in some alternative embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the wafer processing equipment also includes a rotary drive 6, which is disposed on the mounting base 5. The rotary drive 6 is used to drive the carrier 1 to rotate, and the carrier 1 is disposed on the mounting base 5 through the rotary drive 6.

[0129] With this configuration, when the rotary drive 6 drives the carrier 1 to rotate, it can drive the wafer to rotate synchronously. This not only facilitates the detection of the coordinate information of at least three non-collinear points on the wafer edge, but also allows the detection element 3 to perform multiple detections on its edge or contour at different angles. By acquiring multiple sets of position data, the error of a single detection is reduced, and the accuracy of the center position calculation is improved.

[0130] Especially when there are local defects at the edge of the wafer or the detection angle is limited, resulting in incomplete detection in a single test, the rotation process allows the detection component 3 to capture more comprehensive edge information, ensuring a more reliable judgment of the center position and providing a more accurate basis for the subsequent concentric adjustment of the carrier component 1 and the wafer.

[0131] In this embodiment, the rotary drive 6 can be a DD motor (Direct Drive Motor), a servo motor, or a stepper motor, etc. The type of rotary drive 6 is flexible and can be selected according to actual needs. This embodiment does not impose any specific limitations on this.

[0132] In addition, the wafer processing equipment also includes a processing device for processing the wafer supported on the support surface 11. The processing device can be a laser processing device. The type of processing device can be selected flexibly. Specifically, it can be selected according to actual needs. This application embodiment does not make specific limitations in this regard.

[0133] Figure 5 This is a flowchart of a material loading method provided in an embodiment of this application. This method can be applied to any of the wafer processing equipment in the above embodiments, and as follows... Figure 5 As shown, the method includes:

[0134] S501: The wafer is supported by the loading part 21 in the loading assembly 2 so as to place the wafer on the bearing surface 11 of the carrier 1.

[0135] S502: The wafer is fixed by adsorbing the central adsorption region 111 on the bearing surface 11. The central adsorption region 111 is located at the horizontal center of the bearing 1.

[0136] S503: Use the detection element 3 to detect the position of the wafer placed on the bearing surface 11 to obtain the position of the center of the wafer.

[0137] S504: The loading section 21 is used to support the adsorbed surface of the wafer so that the wafer is detached from the bearing surface 11.

[0138] S505: Receive the detected wafer position information and adjust the position of the carrier 1 according to the position information so that the horizontal center of the carrier 1 coincides with the center position of the wafer.

[0139] This configuration improves the concentric positioning accuracy of the wafer and carrier 1 during concentric positioning, ensuring that the wafer completely covers the adsorption area on the carrier 1. This guarantees the adsorption force on the wafer and firmly fixes it in place. Consequently, wafer displacement or detachment is prevented during subsequent processing, ensuring the quality of wafer processing.

[0140] Furthermore, in some alternative embodiments, such as Figure 6 As shown, S505: After receiving the detected wafer position information and adjusting the position of the carrier 1 according to the position information so that the horizontal center of the carrier 1 coincides with the center position of the wafer, it further includes:

[0141] S506: The wafer is then supported by the loading section 21 to place it on the support surface 11.

[0142] S507: The wafer is fixed by adsorbing the central adsorption region 111 and the peripheral adsorption region 112 on the support surface 11. The peripheral adsorption region 112 is located at the edge of the support 1.

[0143] With this setup, the wafer is first placed on the carrier 1, the central adsorption area 111 adsorbs the wafer, and the position of the wafer center is obtained through the detection element 3. After the loading part 21 removes the wafer, the position of the carrier 1 is adjusted according to the position of the wafer center. Then, the wafer is placed on the carrier 1 for the second time, achieving the coincidence of the wafer center and the horizontal center of the carrier 1. Furthermore, through the combined action of the central adsorption area 111 and the peripheral adsorption area 112, a uniform and strong adsorption force can be formed, which can further strengthen the fixation of the wafer and further prevent it from shifting or falling off in subsequent processing, thus effectively ensuring the stability of wafer processing quality.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer processing equipment, characterized in that, include: The carrier (1) has a carrier surface (11) for carrying a wafer. The carrier surface (11) has at least two adsorption regions, including a central adsorption region (111) disposed at the horizontal center of the carrier (1) and a peripheral adsorption region (112) disposed at the edge of the carrier (1). The loading assembly (2) includes a loading section (21) for supporting the wafer to place the wafer on the bearing surface (11). The detection element (3) is used to detect the position of the wafer placed on the bearing surface (11); Position adjustment component (4) is used to drive the carrier (1) to move so as to change the position of the carrier (1) in the horizontal direction; The controller is electrically connected to both the detection element (3) and the position adjustment component (4). The controller is used to drive the carrier (1) to move according to the position information detected by the detection element (3), so as to adjust the position of the carrier (1) and make the horizontal center of the carrier (1) coincide with the center position of the wafer. The bearing surface (11) is provided with a relief groove (13), and the side of the relief groove (13) has an opening (14) for the feeding part (21) to enter. When the wafer and the carrier (1) are concentrically positioned, the wafer is adsorbed through the central adsorption region (111).

2. The wafer processing equipment according to claim 1, characterized in that, The clearance groove (13) is located between the peripheral adsorption area (112) and the central adsorption area (111), and surrounds at least part of the circumferential edge of the central adsorption area (111). The peripheral adsorption region (112) surrounds the central adsorption region (111) on a portion of its circumferential outer side, and the peripheral adsorption region (112) forms the opening (14) at opposite ends of the central adsorption region (111) in the circumferential direction.

3. The wafer processing equipment according to claim 1 or 2, characterized in that, Each of the adsorption zones is provided with multiple adsorption pores (12); The wafer processing equipment also includes: A vacuum assembly is connected to each of the adsorption holes (12) and is used to evacuate each of the adsorption holes (12) to adsorb and fix the wafer.

4. The wafer processing equipment according to claim 3, characterized in that, The plurality of adsorption pores (12) within the central adsorption region (111) form a plurality of circular arrays concentric with the horizontal center; and / or, The plurality of adsorption holes (12) in the peripheral adsorption zone (112) are arranged sequentially along the extension direction of the arc, and the arc is concentric with the horizontal center.

5. The wafer processing equipment according to claim 1 or 2, characterized in that, The position adjustment component (4) includes: The first adjustment unit (41) is used to drive the carrier (1) to move along the first horizontal direction; The second adjustment unit (42) is used to drive the carrier (1) to move along the second horizontal direction, the first horizontal direction being perpendicular to the second horizontal direction.

6. The wafer processing equipment according to claim 5, characterized in that, The wafer processing equipment also includes: Mounting base (5), the carrier (1) is disposed on the mounting base (5); The first adjustment unit (41) includes: The first guide seat (411) is guided and engaged with the mounting seat (5) in the first horizontal direction; The first driving element is electrically connected to the controller and is used to drive the mounting base (5) to move along the first horizontal direction on the first guide seat (411); The second adjustment unit (42) includes: The second guide seat (421) is guided and engaged with the first guide seat (411) in the second horizontal direction; The second drive unit is electrically connected to the controller and is used to drive the first guide seat (411) to move along the second horizontal direction on the second guide seat (421).

7. The wafer processing equipment according to claim 1 or 2, characterized in that, The detection element (3) includes a camera, which is positioned above the carrier (1) and is used to detect the position of the wafer by taking images in a direction facing the wafer; or, The detection element (3) includes an edge finder, which is disposed near the edge of the carrier (1) to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

8. A feeding method, applied to the wafer processing equipment according to any one of claims 1-7, characterized in that, The feeding method includes: The wafer is supported by the loading part (21) in the loading assembly (2) so as to place the wafer on the bearing surface (11) of the carrier (1); The wafer is adsorbed and fixed by the central adsorption area (111) on the bearing surface (11), wherein the central adsorption area (111) is located at the horizontal center of the bearing (1); The position of the wafer placed on the bearing surface (11) is detected using the detection element (3) to obtain the position of the center of the wafer; The loading section (21) is then used to support the adsorbed surface of the wafer so that the wafer is detached from the bearing surface (11). The detected position information of the wafer is received, and the position of the carrier (1) is adjusted according to the position information so that the horizontal center of the carrier (1) coincides with the center position of the wafer.

9. The feeding method according to claim 8, characterized in that, After receiving the detected position information of the wafer and adjusting the position of the carrier (1) according to the position information so that the horizontal center of the carrier (1) coincides with the center position of the wafer, the method further includes: The wafer is then supported by the loading section (21) and placed on the bearing surface (11); The wafer is adsorbed and fixed by the central adsorption area (111) and the peripheral adsorption area (112) on the bearing surface (11), wherein the peripheral adsorption area (112) is disposed at the edge of the bearing (1).

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