Scribing crack propagation blocking method and crack blocking structure
By constructing a three-dimensional model and setting modified holes and stress buffer layers, the problem of crack propagation during dicing in semiconductor manufacturing was solved, crack propagation was effectively blocked, and the quality and reliability of semiconductor products were improved.
Patent Information
- Application Number
- CN202510254501.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2025-10-03
AI Technical Summary
During the semiconductor manufacturing process, dicing cracks are prone to expand, affecting the yield and reliability of the effective area. Existing methods for optimizing cutting process parameters have limited effectiveness.
By obtaining parameter information of the workpiece to be cut and the array holes, a three-dimensional model is constructed for dicing simulation, the crack propagation characteristics are evaluated, the target parameter information is selected for preprocessing, and modified holes and stress buffer layers are set in the dicing area to prevent crack propagation.
Accurately simulate the scribing process to effectively block crack propagation, improve the yield and reliability of the effective area, reduce the possibility of cracks extending into the effective area, and protect product performance and quality.
Smart Images
Figure CN120749080A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of semiconductor manufacturing technology, and specifically relates to a dicing crack propagation blocking method and a crack blocking structure. Background Art
[0002] In traditional dicing processes, cracks can easily initiate within the component during dicing due to the combined effects of various factors, including mechanical and thermal stresses. These cracks then propagate perpendicular to the cross-section of the component, forming transverse cracks. These cracks, when propagating into the active area of the component, can affect the yield and reliability of this area.
[0003] In order to deal with the problem of crack propagation during dicing, a common solution is to optimize the cutting process parameters, such as adjusting the cutting speed, cutting depth, type and material of the cutting tool, so as to reduce the generation and concentration of stress during the cutting process. However, this method is often limited by various factors such as the material properties and structural shape of the workpiece to be cut in actual applications, and its effect is limited. Summary of the Invention
[0004] In view of this, the present application provides a dicing crack propagation blocking method and a crack blocking structure, the main purpose of which is to block the dicing crack propagation.
[0005] To achieve the above objectives, this application mainly provides the following technical solutions:
[0006] In one aspect of the present application, a method for blocking dicing crack propagation is provided, comprising:
[0007] Acquiring first parameter information of a workpiece to be cut and multiple sets of second parameter information of array holes serving as crack-blocking structures on the workpiece to be cut, and constructing, based on the first parameter information and in combination with each set of the second parameter information, multiple three-dimensional models of the workpiece to be cut corresponding to each set of the second parameter information;
[0008] Performing a dicing simulation on each of the constructed three-dimensional models of the workpiece to be cut, and evaluating crack propagation characteristics of each three-dimensional model of the workpiece to be cut after completing the dicing simulation for each of the three-dimensional models of the workpiece to be cut;
[0009] The crack propagation characteristics corresponding to different sets of the second parameter information are compared, target parameter information is selected from multiple sets of the second parameter information based on the comparison results, and the workpiece to be cut is preprocessed according to the target parameter information.
[0010] Optionally, the first parameter information includes at least the length, width and thickness of the piece to be cut; and the second parameter information includes at least the shape, size, position and number of the array holes.
[0011] Optionally, after constructing a plurality of three-dimensional models of the workpieces to be cut corresponding to each set of the second parameter information based on the first parameter information and in combination with each set of the second parameter information, the method further includes:
[0012] Material properties are added to the constructed three-dimensional model of each of the parts to be cut, and meshing is carried out, while boundary conditions and loading are set.
[0013] Optionally, the comparing the crack extension characteristics corresponding to different sets of second parameter information and selecting target parameter information from multiple sets of second parameter information based on the comparison results includes:
[0014] A stress distribution cloud map is drawn based on the evaluation results. In the stress distribution cloud map, the crack extension characteristics corresponding to different second parameter information are marked. The crack extension characteristics include at least the crack extension length, so that the second parameter information corresponding to the crack extension length with the shortest length is locked as the target parameter information.
[0015] Another aspect of the present application provides a crack barrier structure for use in a workpiece to be cut, wherein the workpiece to be cut includes an active area and a scribe line area, wherein the crack barrier structure is disposed at an edge portion of the scribe line area adjacent to the active area and surrounds the active area; the crack barrier structure includes:
[0016] The modified holes extend in a direction intersecting with the extension direction of the cracks during the dicing process, and are provided in at least two circles, with the modified holes in two adjacent circles being staggered.
[0017] Optionally, the crack barrier structure is spaced apart from a symmetric center line of the scribe line region by more than 5 μm.
[0018] Optionally, the modified hole extends in a direction perpendicular to the plane where the piece to be cut is located.
[0019] Optionally, the modified hole passes through the piece to be cut.
[0020] Optionally, the pore diameter of the modified pore is ≤500 nm, and the distance between two adjacent modified pores is ≤4 μm.
[0021] Optionally, the crack blocking structure further comprises:
[0022] A stress buffer layer is coated on the dicing street area.
[0023] By means of the above technical solution, this application has at least the following beneficial effects:
[0024] The scribing crack extension blocking method provided in the embodiments of the present application first obtains the first parameter information of the workpiece to be cut and multiple sets of second parameter information of the array holes as crack blocking structures, constructs multiple three-dimensional models of the workpiece to be cut, and performs scribing simulation on them one by one. It can accurately simulate the actual scribing process, and then evaluate the crack extension characteristics of each three-dimensional model to achieve the purpose of accurately understanding the crack extension situation; then compare the crack extension characteristics corresponding to different second parameter information, select target parameter information from it, and pre-process the workpiece to be cut according to the target parameter information. According to the results of the simulation evaluation, the array hole parameters that are most conducive to blocking crack extension can be targetedly selected, so that the workpiece to be cut can be pre-processed before actual cutting, making it more difficult for cracks to extend to the effective area of the workpiece to be cut during the cutting process, thereby improving the yield and reliability of the effective area.
[0025] The crack blocking structure provided in the embodiments of the present application is arranged at the edge of the scribe line area adjacent to the effective area and is arranged around the effective area, which can directly block the crack when it expands from the scribe line area to the effective area. At the same time, the modified holes extend in a direction that intersects with the direction in which the crack extends during the scribe process, which can disrupt the crack expansion path, forcing the crack to change direction when encountering the modified holes, increasing the resistance to crack expansion, thereby effectively slowing the crack expansion speed to the effective area, reducing the possibility of the crack expanding into the effective area, and protecting the performance and yield of the effective area. At the same time, at least two circles of modified holes are arranged, and the two adjacent circles of modified holes are staggered, further enhancing the crack blocking effect. Multiple circles of modified holes form a multi-layer blocking barrier. When the crack breaks through one circle of modified holes, the next circle of staggered modified holes can continue to block the crack, greatly increasing the difficulty of crack expansion. At the same time, the staggered arrangement can more comprehensively cover the edge of the scribe line area adjacent to the effective area, reducing the possibility of the crack bypassing the modified holes and continuing to expand, and more effectively protecting the effective area. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is a process of a dicing crack propagation blocking method according to an optional embodiment of the present application;
[0027] Figure 2 This is a schematic structural diagram of a crack blocking structure according to an optional embodiment of the present application.
[0028] The reference numerals indicate:
[0029] 1. Effective area; 2. Scribing area; 3. Modified hole. DETAILED DESCRIPTION
[0030] The present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that, unless there is a conflict, the embodiments and features in the embodiments of the present application can be combined with each other.
[0031] In this embodiment, a method for blocking the propagation of a dicing crack is provided. Figure 1 As shown, the method includes:
[0032] Step S101: Obtain first parameter information of the workpiece to be cut and multiple sets of second parameter information of array holes on the workpiece to be cut as crack blocking structures, and construct three-dimensional models of multiple workpieces to be cut corresponding to each set of second parameter information based on the first parameter information and combined with each set of second parameter information.
[0033] The scribing crack extension blocking method provided in the embodiment of the present application can be applied to fields such as semiconductor manufacturing, and specifically to integrated circuit packaging. In the integrated circuit packaging process, it is necessary to perform cutting operations on materials such as the packaging substrate. The packaging substrate usually has a multi-layer structure and complex wiring. Scribing cracks may cause problems such as line short circuits and open circuits, affecting the reliability of the packaging. By using this scribing crack extension blocking method, the optimal crack blocking structure parameters can be determined based on the material and structural characteristics of the packaging substrate, reducing crack extension during the cutting process and ensuring the quality and performance of the packaging.
[0034] Among them, the packaging substrate is a common type of workpiece to be cut, specifically a glass substrate. The present invention's method for preventing crack propagation during dicing can be used to simulate dicing by constructing a three-dimensional model by acquiring relevant first parameter information of the workpiece to be cut, such as a glass substrate, as well as multiple sets of second parameter information of the array holes on the glass substrate that serve as a crack-blocking structure. This allows the crack propagation characteristics to be evaluated, and ultimately, appropriate parameter information is selected to pre-process the glass substrate to effectively prevent crack propagation and improve packaging quality.
[0035] Specifically, the first parameter information of the workpiece to be cut can be a variety of data related to the properties of the workpiece itself, including but not limited to the material properties (such as hardness, elastic modulus, thermal expansion coefficient, etc.), geometric dimensions (length, width, thickness, etc.), structural shape (whether there are special concave-convex structures, hole distribution, etc.), and other physical properties (such as thermal conductivity, resistivity, etc.). By obtaining this first parameter information, a comprehensive understanding of the workpiece to be cut can be achieved, providing a basis for subsequent precise analysis of crack generation and propagation during the dicing process.
[0036] The second parameter information for the crack-blocking hole array includes at least its shape (circular, square, elliptical, etc.), size (aperture size, depth, etc.), arrangement (rectangular, triangular, etc.), spacing between holes, and distribution on the workpiece. Acquiring multiple sets of different second parameter information provides a foundation for subsequent exploration of the crack-blocking effects of different hole array designs.
[0037] Specifically, after obtaining the first parameter information and each set of second parameter information, professional three-dimensional modeling software or finite element analysis software and other tools can be used to build a three-dimensional model for the workpiece to be cut corresponding to each set of second parameter information.
[0038] Step S102: performing dicing simulation on the constructed three-dimensional models of the multiple parts to be cut one by one, and evaluating the crack propagation characteristics of each three-dimensional model of the part to be cut after completing the dicing simulation for each three-dimensional model of the part to be cut.
[0039] In this embodiment, the three-dimensional models of multiple parts to be cut are constructed, and the relevant parameters of the dicing process, such as cutting speed, cutting depth, type and material of the cutting tool, are set in the simulation software, and then the dicing simulation operation is performed on each three-dimensional model one by one. The simulation process is based on the principles of physical mechanics and numerical calculation methods. A computer program is used to simulate the interaction between the cutting tool and the part to be cut, as well as the generation, distribution and change of stress inside the part to be cut during the cutting process, so as to obtain information such as the possible location, expansion path and expansion speed of the crack. After the dicing simulation is completed for each three-dimensional model of the part to be cut, the crack propagation characteristics are evaluated according to the simulation results. The evaluation indicators include the starting position of the crack, the expansion length, the expansion direction, the expansion rate, the branching of the crack, and the possibility of the crack extending to the effective area 1 of the part to be cut. By analyzing these characteristics, the expansion law of the crack inside the part to be cut under different array hole parameters can be fully understood, providing a basis for the subsequent selection of appropriate array hole parameters.
[0040] Step S103: comparing crack propagation characteristics corresponding to different sets of second parameter information, selecting target parameter information from multiple sets of second parameter information based on the comparison results, and pre-processing the workpiece to be cut according to the target parameter information.
[0041] In this embodiment, the crack propagation characteristics corresponding to different second parameter information are compared and analyzed in detail. The various indicators of crack propagation under different parameters such as array hole shapes, sizes, and arrangements are compared to find out which parameter combinations can make the crack propagation length shorter, the expansion rate slower, the branches less, and less likely to extend to the effective area 1 of the workpiece to be cut, etc., so as to determine the influence pattern and degree of different parameters on crack propagation. Then, based on the comparison results, the group that can most effectively block crack propagation is selected from multiple groups of second parameter information as the target parameter information. This set of target parameter information is considered to be the optimal parameter combination that is most conducive to improving the slicing quality of the workpiece to be cut and reducing the impact of cracks on the effective area 1 after comprehensive consideration of various factors. Finally, according to the selected target parameter information, the actual preprocessing operation is performed on the workpiece to be cut. For example, if the target parameter information determines a specific array hole size and arrangement, then the corresponding array holes need to be processed according to this requirement on the actual workpiece to be cut. The pretreatment process may involve various process methods such as drilling and etching to ensure that the workpiece to be cut has a structure that can effectively prevent crack propagation, thereby minimizing the adverse effects of crack propagation in the subsequent actual dicing process and improving product quality and reliability.
[0042] By applying the technical solution of this embodiment, firstly, by obtaining the first parameter information of the workpiece to be cut and multiple sets of second parameter information of the array holes as crack blocking structures, three-dimensional models of multiple workpieces to be cut are constructed, and slicing simulation is performed on them one by one. The actual slicing process can be accurately simulated, and then the crack propagation characteristics of each three-dimensional model are evaluated to achieve the purpose of accurately understanding the crack propagation situation; then, the crack propagation characteristics corresponding to different second parameter information are compared, and the target parameter information is selected therefrom. The workpiece to be cut is preprocessed according to the target parameter information. According to the results of the simulation evaluation, the array hole parameters that are most conducive to blocking crack propagation can be targetedly selected, so that the workpiece to be cut can be preprocessed before actual cutting, making it more difficult for cracks to extend to the effective area 1 of the workpiece to be cut during the cutting process, thereby improving the yield and reliability of the effective area 1.
[0043] Furthermore, as a refinement and extension of the specific implementation of the above embodiment, in order to fully illustrate the specific implementation process of this embodiment, another method for blocking the propagation of a dicing crack is provided, which includes:
[0044] Step S201: Obtain first parameter information of the workpiece to be cut and multiple sets of second parameter information of array holes on the workpiece to be cut as crack blocking structures, and construct three-dimensional models of multiple workpieces to be cut corresponding to each set of second parameter information based on the first parameter information and combined with each set of second parameter information.
[0045] Step S202: Add material properties to the constructed three-dimensional model of each part to be cut, perform meshing, and set boundary conditions and loading.
[0046] Here, the addition of material properties in step S202 is to assign material properties to each model after the three-dimensional model of the piece to be cut is constructed. Material properties include but are not limited to the elastic modulus of the material (a measure of the material's ability to resist elastic deformation), Poisson's ratio (the ratio of the material's lateral strain to the longitudinal strain), density, thermal expansion coefficient, yield strength (the stress when the material begins to produce obvious plastic deformation), etc. In practical applications, for the different materials involved in the piece to be cut and the array holes as crack blocking structures, their corresponding property parameters need to be input so that the three-dimensional model can more realistically reflect the mechanical behavior and response characteristics of the material during the actual slicing process. Meshing is the process of dividing the three-dimensional model into many small units, which are usually tetrahedrons, hexahedrons, etc. Through reasonable meshing, a complex three-dimensional model can be simplified into a series of unit combinations that can be numerically calculated. When dividing the mesh, factors such as the geometric shape of the model, stress concentration areas, and calculation accuracy requirements are considered. For areas with large stress changes (such as near the cutting part, around the array holes, etc.), a finer grid division can be used to improve the accuracy of the calculation; in areas with small stress changes, a coarser grid can be used to reduce the amount of calculation. Boundary conditions refer to the setting of constraints and restrictions on the model in actual conditions. For example, in the dicing simulation, certain boundaries of the workpiece to be cut are set as fixed boundaries, that is, the boundary is not allowed to displace; or certain boundaries are set as free boundaries, allowing them to move freely in a certain direction. Loading refers to the application of force, heat and other loads similar to those in the actual dicing process on the model. For example, according to the cutting process parameters, the corresponding cutting force is applied to simulate the effect of the cutting tool on the workpiece to be cut; or considering the heat generated during the cutting process, a thermal load is applied to simulate the influence of thermal stress.
[0047] Step S203: performing dicing simulation on the constructed three-dimensional models of the multiple parts to be cut one by one, and evaluating the crack growth characteristics of each three-dimensional model of the part to be cut after the dicing simulation is completed for each three-dimensional model of the part to be cut.
[0048] Step S204: comparing crack propagation characteristics corresponding to different sets of second parameter information, selecting target parameter information from multiple sets of second parameter information based on the comparison results, and pre-processing the workpiece to be cut according to the target parameter information.
[0049] Step S2041: Draw a stress distribution cloud map based on the evaluation results. In the stress distribution cloud map, mark the crack extension characteristics corresponding to different second parameter information. The crack extension characteristics include at least the crack extension length, and the second parameter information corresponding to the shortest crack extension length is locked as the target parameter information.
[0050] Here, drawing a stress distribution cloud map based on the evaluation results is to draw a stress distribution cloud map based on the stress data obtained by simulation calculation after completing the dicing simulation of each three-dimensional model of the part to be cut and evaluating its crack propagation characteristics. The stress distribution cloud map is a graphic that intuitively displays the size and distribution of stress inside the model, and represents different stress values by different colors or grayscales. For example, darker areas indicate greater stress, and lighter areas indicate smaller stress. Through the stress distribution cloud map, one can clearly observe the concentrated areas and changing trends of stress inside the part to be cut during the dicing process, as well as the relationship between crack propagation and stress distribution. Marking crack propagation characteristics is to mark the corresponding crack propagation characteristics on the stress distribution cloud map for different second parameter information (i.e., different array hole parameter combinations). The crack propagation characteristics here include at least the crack propagation length, and may also include the starting position, propagation direction, branching of the crack, etc. By marking these features, one can intuitively compare the differences in crack propagation under different array hole parameters, as well as the relationship between crack propagation and stress distribution. For example, the crack propagation path can be represented by lines or arrows on the cloud map, and the crack propagation lengths corresponding to different second parameter information can be marked with different symbols or colors. Locking the target parameter information is to compare the crack propagation characteristics corresponding to different second parameter information on the stress distribution cloud map, and find the set of second parameter information with the shortest crack propagation length. Because the shorter the crack propagation length, it means that the crack propagation is more effectively suppressed under this set of parameters, which is more beneficial to improving the quality and reliability of the workpiece to be cut. Therefore, this set of second parameter information corresponding to the shortest crack propagation length is locked as the target parameter information, so that in actual operation, the workpiece to be cut can be pre-processed according to this parameter information, thereby achieving the purpose of preventing crack propagation.
[0051] Furthermore, as a specific implementation of the above-mentioned dicing crack propagation blocking method, the present application embodiment provides a crack blocking structure, see Figure 2 As shown, the crack blocking structure is applied to a workpiece to be cut, which includes an effective area 1 and a dicing street area 2. The crack blocking structure is arranged at an edge portion of the dicing street area 2 adjacent to the effective area 1 and is arranged around the effective area 1; the crack blocking structure includes: modified holes 3, which extend in a direction intersecting with the extension direction of the crack during the dicing process, and are provided in at least two circles, with adjacent two circles of modified holes 3 staggered.
[0052] In this embodiment, the crack blocking structure is arranged at the edge of the dicing track area 2 adjacent to the effective area 1, and is arranged around the effective area 1, which can play a direct blocking role when the crack extends from the dicing track area 2 to the effective area 1. At the same time, the modified hole 3 extends in a direction that intersects with the extension direction of the crack during the dicing process, which can disrupt the crack expansion path, so that the crack needs to change direction when encountering the modified hole 3, increasing the resistance to crack expansion, thereby effectively slowing down the crack expansion speed to the effective area 1, reducing the possibility of the crack extending to the effective area 1, and protecting the performance and yield of the effective area 1. At the same time, at least two circles of modified holes 3 are set, and the two adjacent circles of modified holes 3 are staggered, which further enhances the crack blocking effect. Multiple circles of modified holes 3 form a multi-layer blocking barrier. When the crack breaks through one circle of modified holes 3, the next circle of staggered modified holes 3 can continue to block the crack, greatly increasing the difficulty of crack expansion. At the same time, the staggered arrangement can more comprehensively cover the edge portion of the dicing street area 2 adjacent to the effective area 1, reduce the possibility of cracks continuing to extend around the modified hole 3, and more effectively protect the effective area 1.
[0053] Active Area 1 is the area of the part to be cut that has a specific function and needs to be retained and function after cutting. Specifically, Active Area 1 can be a portion containing various electronic components, circuit patterns, or other functional structures. Its performance and integrity determine the quality and function of the final product.
[0054] The scribing lane area 2 is an area on the workpiece to be cut specifically for cutting operations, located between or around the effective area 1, providing operating space for the cutting tool so as to divide the workpiece to be cut into multiple separate units or components.
[0055] Among them, the crack blocking structure is arranged at the edge of the dicing street area 2 adjacent to the effective area 1, and is arranged around the effective area 1. During the dicing process, when a crack is generated in the dicing street area 2 and attempts to expand to the effective area 1, the crack can be blocked in the first time, thereby protecting the effective area 1 from the influence of the crack to the greatest extent.
[0056] Specifically, the crack blocking structure includes modified holes 3, which extend in a direction that intersects with the direction in which the crack extends during the dicing process. During dicing, due to factors such as cutting force, cracks usually extend in a direction perpendicular to the cross-section of the workpiece to be cut. The modified holes 3 intersect with the crack extension direction, so that when the crack encounters the modified holes 3 during the expansion process, it cannot continue to expand directly forward, but needs to change direction, increasing the path length and difficulty of crack expansion. At the same time, at least two circles of modified holes 3 are set. The multiple circles form a multi-layer blocking defense line. When the crack breaks through the first circle of modified holes 3, it will encounter the second circle or even more circles of modified holes 3 to block it, further reducing the possibility of the crack extending to the effective area 1 and enhancing the crack blocking effect. At the same time, the two adjacent circles of modified holes 3 are staggered, so that the modified holes 3 can more comprehensively cover the edge portion adjacent to the dicing track area 2 and the effective area 1, avoiding the formation of gaps or weak areas that cracks can easily bypass. The staggered layout requires cracks to constantly change direction during their expansion, which adds more obstacles and more effectively consumes the energy of crack expansion, thereby better blocking the cracks.
[0057] In the above embodiment, see Figure 2 As shown, the modified hole 3 extends in a direction perpendicular to the plane of the workpiece to be cut.
[0058] Here, the modified holes 3, extending perpendicular to the plane of the workpiece, form a complete physical barrier perpendicular to crack propagation. Since cracks generally propagate within the plane of the workpiece, the perpendicular modified holes 3 directly intercept the crack propagation path, making it difficult for the crack to bypass it. Compared to holes with angled or other orientations, this more effectively blocks crack propagation and minimizes the risk of crack propagation into the active area 1. Furthermore, the vertically extending modified holes 3 disperse the stress generated during the dicing process more evenly in directions perpendicular and parallel to the plane of the workpiece. When stress acts on the workpiece, the modified holes 3 direct the stress in a perpendicular direction, preventing stress concentration within the plane. This reduces the likelihood of rapid crack propagation and the formation of new cracks caused by stress concentration, thereby improving the overall stability of the workpiece. Furthermore, machining the modified holes 3 perpendicular to the plane of the workpiece is relatively easy, with a lower process complexity and easier precision control. Whether using laser drilling, mechanical drilling, or other processing methods, machining in a perpendicular direction is more convenient and ensures better quality, which helps improve production efficiency and product consistency, while reducing production costs and defect rates. Furthermore, the vertically extending modified holes 3 have minimal impact on the material's in-plane properties, preserving the original physical and chemical properties of the material in the active area 1 of the workpiece to be cut to the greatest extent possible. For example, in semiconductor manufacturing, the presence of the modified holes 3 does not significantly interfere with the circuit or optical performance within the active area 1, ensuring the functional integrity and reliability of the product.
[0059] In some possible implementations disclosed in this application, see Figure 2 As shown, the crack barrier structure is spaced apart from the symmetry center line of the scribe line region 2 by more than 5 μm.
[0060] In this embodiment, by setting the distance between the crack barrier structure and the symmetric centerline of the scribe street area 2 to be greater than 5 μm, it can better play a blocking role when cracks originate from the scribe street area 2 and attempt to propagate toward the active area 1. It should be noted that if the distance is too close, the crack propagation trend may not be effectively addressed. However, the appropriate distance ensures that the crack barrier structure is effective in the critical area, reducing the possibility of crack propagation into the active area 1 and protecting the performance and yield of the active area 1.
[0061] The symmetry center line of the scribe street region 2 is a virtual line that symmetrically divides the scribe street region 2 along the length direction or the width direction.
[0062] Specifically, in practical applications, the minimum safe distance between the crack barrier structure and the symmetric centerline of the scribe street area 2 is greater than 5 μm. This ensures a relatively stable stress distribution near the symmetric centerline of the scribe street area 2, reduces the adverse effects of stress concentration, and improves the overall stability of the workpiece being cut.
[0063] In some possible implementations disclosed in this application, see Figure 2 As shown, the modified hole 3 passes through the workpiece to be cut.
[0064] In this embodiment, the modified hole 3 passes through the workpiece to be cut, which means that the crack encounters a completely through obstacle during the expansion process, and cannot bypass the modified hole 3 inside the workpiece to be cut and continue to extend to the effective area 1. Compared with non-through holes, through holes can more effectively block cracks in the dicing area 2, greatly reducing the probability of cracks extending to the effective area 1, and better protecting the integrity of the effective area 1 of the workpiece to be cut. At the same time, the penetrating modified hole 3 provides a direct release channel for the stress generated during the dicing process. Stress can be released to the outside of the workpiece to be cut through the through hole, avoiding the accumulation of stress inside and causing further crack expansion or the generation of new cracks, fundamentally reducing the driving force for crack expansion, and enhancing the inhibitory effect on crack expansion.
[0065] Specifically, in this embodiment, the modified hole 3 starts from the upper surface of the workpiece to be cut, passes through the thickness direction of the entire workpiece to be cut, and extends to the lower surface of the workpiece to be cut in a direction perpendicular to the plane where the workpiece to be cut is located, so that the workpiece to be cut is completely penetrated by the hole at this position, forming a continuous channel structure from one side to the other.
[0066] In some possible implementations disclosed in this application, see Figure 2As shown, the pore diameter of the modified pore 3 is ≤500 nm, and the distance between two adjacent modified pores 3 is ≤4 μm.
[0067] In this embodiment, the pore size of the modified hole 3 is ≤500nm, and the amount of surrounding material removed is relatively small, thereby minimizing the impact on the overall structure and performance of the material, so that the mechanical properties, physical properties, etc. of the workpiece to be cut can be better maintained, and there will be no significant decrease in material strength or toughness due to a large number of holes, thereby ensuring the performance stability of the workpiece to be cut before and after cutting. The spacing between two adjacent modified holes 3 is ≤4μm, which can form a high-density array of modified holes 3 in the workpiece to be cut, just like building a tight "protective net". When a crack is generated, it encounters such a dense array of modified holes 3, and it needs to constantly change the direction of expansion, consuming a lot of energy, thereby greatly increasing the difficulty of crack expansion, effectively preventing the crack from spreading further, and protecting the integrity of the workpiece to be cut.
[0068] The pore diameter of the modified pore 3 can be 500 nm, 400 nm, 300 nm, 200 nm, etc.
[0069] Specifically, in actual application scenarios, when the crack expands to the position of the modified hole 3, due to the very small aperture, the crack needs to overcome more energy and resistance to cross these holes, which is equivalent to setting up dense "obstacles" at the microscopic scale, making the crack expansion direction easier to change or terminate, thereby more effectively protecting the effective area 1 of the workpiece to be cut.
[0070] The distance between two adjacent modified holes 3 can be 4 μm, 3 μm, or 2 μm.
[0071] Specifically, in actual application scenarios, when the crack expands to the vicinity of a modified hole 3, since the adjacent modified holes 3 are very close to each other, the stress field will be superimposed and interfered, making the stress distribution around the crack more complicated and making it more difficult for the crack to find a continuous expansion path. The adjacent modified holes 3 work together to play the role of blocking the crack, thereby improving the overall resistance to crack expansion.
[0072] In some possible implementations disclosed in this application, see Figure 2 As shown, the crack barrier structure further includes a stress buffer layer, which is coated on the dicing street area 2 .
[0073] In this embodiment, a stress buffer layer is provided in the dicing lane area 2, which can disperse the stress generated by the contact between the cutting tool and the workpiece to be cut to a larger area, avoid excessive accumulation of stress at a certain point or area, and reduce the risk of cracks caused by stress concentration.
[0074] The stress buffer layer can be made of a polymer material, a rubber material, or a metal film. It is understood that the polymer material can be polyimide, epoxy resin, etc.; the rubber material can be silicone rubber, styrene-butadiene rubber, etc.; and the metal film can be a film of a metal such as copper or aluminum.
[0075] Specifically, in practical applications, the material for the stress buffer layer is evenly sprayed onto the scribe street area 2 in liquid or gaseous form using a spray gun or other equipment. Spin coating is then performed, and the workpiece is rotated to spread the coating material evenly across the surface of the scribe street area 2 due to centrifugal force. Alternatively, printing or other processes may be used for coating. The specific process chosen depends on factors such as the characteristics of the stress buffer layer material, the shape and size of the scribe street area 2, and the production process requirements, and is not limited in this embodiment.
[0076] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.
[0077] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application. The above are merely preferred embodiments of the present application. It should be noted that those skilled in the art may make various improvements and variations without departing from the technical principles of the present application, and such improvements and variations shall also be considered within the scope of protection of the present application.
Claims
1. A method for blocking crack propagation during dicing, characterized in that: include: Acquiring first parameter information of a workpiece to be cut and multiple sets of second parameter information of array holes serving as crack-blocking structures on the workpiece to be cut, and constructing, based on the first parameter information and in combination with each set of the second parameter information, multiple three-dimensional models of the workpiece to be cut corresponding to each set of the second parameter information; Performing a dicing simulation on each of the constructed three-dimensional models of the workpiece to be cut, and evaluating crack propagation characteristics of each three-dimensional model of the workpiece to be cut after completing the dicing simulation for each of the three-dimensional models of the workpiece to be cut; The crack propagation characteristics corresponding to different sets of the second parameter information are compared, target parameter information is selected from multiple sets of the second parameter information based on the comparison results, and the workpiece to be cut is preprocessed according to the target parameter information.
2. The method for blocking dicing crack propagation according to claim 1, wherein: The first parameter information includes at least the length, width and thickness of the piece to be cut; the second parameter information includes at least the shape, size, position and number of the array holes.
3. The method for blocking dicing crack propagation according to claim 1, wherein: After constructing a plurality of three-dimensional models of the workpieces to be cut corresponding to each set of the second parameter information based on the first parameter information and in combination with each set of the second parameter information, the method further includes: Material properties are added to the constructed three-dimensional model of each of the parts to be cut, and meshing is carried out, while boundary conditions and loading are set.
4. The method for blocking dicing crack propagation according to claim 1, wherein: The comparing the crack propagation characteristics corresponding to different sets of the second parameter information, and selecting target parameter information from multiple sets of the second parameter information based on the comparison results, includes: A stress distribution cloud map is drawn based on the evaluation results. In the stress distribution cloud map, the crack extension characteristics corresponding to different second parameter information are marked. The crack extension characteristics include at least the crack extension length, so that the second parameter information corresponding to the crack extension length with the shortest length is locked as the target parameter information.
5. A crack barrier structure, characterized in that: Applied to a workpiece to be cut, the workpiece to be cut includes an effective area and a scribe line area, the crack barrier structure is arranged at an edge portion of the scribe line area adjacent to the effective area and surrounds the effective area; the crack barrier structure includes: The modified holes extend in a direction intersecting with the extension direction of the cracks during the dicing process, and are provided in at least two circles, with the modified holes in two adjacent circles being staggered.
6. The crack barrier structure according to claim 5, characterized in that: The crack barrier structure is spaced apart from a symmetric center line of the scribe line region by more than 5 μm.
7. The crack barrier structure according to claim 5, characterized in that: The modified hole extends in a direction perpendicular to the plane where the workpiece to be cut is located.
8. The crack barrier structure according to claim 5, characterized in that: The modified hole passes through the workpiece to be cut.
9. The crack barrier structure according to claim 5, characterized in that: The pore diameter of the modified pore is ≤500 nm, and the distance between two adjacent modified pores is ≤4 μm.
10. The crack barrier structure according to claim 5, characterized in that: Also includes: A stress buffer layer is coated on the dicing street area.