A semiconductor chip and a method of manufacturing the same

Abstract

The present application relates to the field of semiconductor chip and its preparation method, the present application discloses a kind of semiconductor chip and its preparation method, the semiconductor chip includes substrate, component and connector;Component and connector are installed on substrate;Substrate is equipped with predetermined cutting position;Connector is arranged on predetermined cutting position;Connector forms connecting contact point on cutting surface after cutting, for connecting with external electronic component;Substrate, component and connector are covered by encapsulation layer to form encapsulation structure.The present application can solve the problem of low precision of secondary placement or film molding of connector in prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor chips, in particular to a semiconductor chip and a preparation method thereof. BACKGROUND

[0002] As the core component of modern electronic products, the connection technology of semiconductor chips directly affects the performance, reliability and manufacturing process of the products. At present, there are mainly two technical routes for the mounting method of the connectors of semiconductor chips.

[0003] The first technical route is to paste the connector on the back surface of the chip or the non-encapsulated area of the selective encapsulation. The main defect of this method is that the connector needs to be installed in the second placement process, especially in the double-sided encapsulation structure, which not only greatly increases the complexity of the encapsulation design, but also significantly increases the process difficulty. The multiple placement processes may also introduce quality problems such as position deviation and poor contact, reducing the product yield and reliability.

[0004] The second technical route is to expose the interposer by using film molding technology. Although this method avoids the second placement, there are still many technical obstacles in its implementation: first, film molding requires special modification of the standard molding machine, increasing the equipment investment; second, film molding has obvious disadvantages in precision control compared to direct cavity molding, and the formed surface is often not flat enough; third, the overflow problem in the process is difficult to effectively control, which directly affects the product yield and consistency.

[0005] In addition, when the packaged chip needs to be cut into multiple functional units, both of the above two connection methods face the problem of re-establishing electrical connection after cutting. The existing technology usually needs to rewire or add additional connection structures on the surface after cutting, which not only complicates the process, but also may introduce new reliability risks.

[0006] These problems in the existing technology result in complex process, increased cost and unreliable connection of semiconductor chips in the manufacturing process, which limits the use of chips in special application scenarios, especially in application scenarios that require chip segmentation and flexible interconnection. SUMMARY

[0007] The purpose of the present application is to provide a semiconductor chip and a preparation method thereof, which can solve the problem of the need for secondary placement or low precision of film molding of the connector in the prior art.

[0008] To solve the above technical problems, the application provides a semiconductor chip, which comprises a substrate, a component and a connector; the component and the connector are mounted on the substrate; the substrate is provided with a predetermined cutting position; the connector is arranged on the predetermined cutting position; the connector forms a connecting contact on a cutting surface after cutting, which is used for connecting with an external electronic component; the substrate, the component and the connector are covered by a packaging layer to form a packaging structure.

[0009] Further, the connector comprises an internal conductive circuit, and an end of the internal conductive circuit forms the connecting contact; the connector is connected with the component through the internal conductive circuit.

[0010] Further, the internal conductive circuit comprises a copper column structure, and a cutting surface of the copper column structure constitutes the connecting contact.

[0011] Further, the copper column structure comprises a plurality of U-shaped copper columns, the U-shaped copper columns comprise first U-shaped copper columns and second U-shaped copper columns with different sizes, and the first U-shaped copper columns and the second U-shaped copper columns are alternately arranged inside the connector.

[0012] Further, the application further comprises a flexible circuit board; the flexible circuit board is connected with the connecting contact and is used for connecting the external electronic component.

[0013] Further, at least one connector is arranged on each of the predetermined cutting positions.

[0014] In addition, the application provides a preparation method of the semiconductor chip, which is used for preparing the semiconductor chip as described above, and specifically comprises the following steps.

[0015] A substrate is provided, and the substrate is provided with a predetermined cutting position;

[0016] A component is mounted on the substrate;

[0017] A connector is arranged on the predetermined cutting position of the substrate, and the connector is electrically connected with the component;

[0018] A packaging layer is formed, and the packaging layer covers the substrate, the component and the connector to form a packaging structure;

[0019] The packaging structure is cut along the predetermined cutting position, so that the connector forms a connecting contact on a cutting surface.

[0020] Further, the step of arranging the connector on the predetermined cutting position of the substrate specifically comprises the following steps: the internal conductive circuit of the connector is connected with the component by wire bonding, welding or conductive adhesive bonding.

[0021] Further, the cutting of the packaging structure along the predetermined cutting position specifically comprises: forming two independent semiconductor units by the packaging structure along the predetermined cutting position, the connector is divided into two parts and attached to the cutting surface of the two semiconductor units respectively, and the connecting contacts on the cutting surface of the two semiconductor units are arranged in a symmetrical manner.

[0022] Further, after the cutting of the packaging structure along the predetermined cutting position, the flexible circuit board is connected with the connecting contacts.

[0023] By the above technical solution, the present application has the following beneficial effects:

[0024] By arranging the connector on the predetermined cutting position and forming the connecting contacts on the cutting surface after cutting, the semiconductor chip of the present application does not need to be attached with the connector on the back surface or the non-packaging area, avoids the secondary mounting process, and simplifies the manufacturing process; meanwhile, the film molding to expose the interposer is not needed, avoiding the modification of the molding machine and the overflow control problem. In addition, the semiconductor chip of the present application can be directly connected with the external electronic components through the connecting contacts on the cutting surface after cutting, without the additional wiring process, which not only reduces the manufacturing cost, but also improves the connection reliability. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 FIG. 1 is a schematic diagram of the overall structure of a semiconductor chip before packaging according to an embodiment of the present application;

[0026] Figure 2 FIG. 2 is a schematic diagram of the structure of a semiconductor chip after packaging according to an embodiment of the present application;

[0027] Figure 3 FIG. 3 is a schematic diagram of the structure of a semiconductor chip after cutting according to an embodiment of the present application;

[0028] Figure 4 FIG. 4 is a schematic diagram of the overall structure of a semiconductor chip after cutting according to an embodiment of the present application;

[0029] Figure 5 FIG. 5 is a schematic diagram of the structure of a semiconductor chip after mounting a flexible circuit board according to an embodiment of the present application.

[0030] In the drawings, 1 is a substrate, 2 is a component, 3 is a connector, 4 is a first U-shaped copper column, 5 is a second U-shaped copper column, 6 is a flexible circuit board, and 7 is a packaging layer. DETAILED DESCRIPTION

[0031] Based on the inspiration of the present specification, the person skilled in the art can cross combine different embodiments to form new technical solutions without causing technical contradictions, and such variations should be considered to fall within the protection scope of the present application.

[0032] The semiconductor chip and its fabrication method according to the present invention will now be described in more detail with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0033] The invention is described more specifically by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of the invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0034] like Figures 1-5 As shown, an embodiment of the present invention proposes a semiconductor chip, including a substrate 1, components 2 and connector 3.

[0035] Specifically, the component 2 and the connector 3 are mounted on the substrate 1; the substrate 1 has a predetermined cutting position; the connector 3 is disposed at the predetermined cutting position; after cutting, the connector 3 forms a connection contact point on the cut surface for connecting with external electronic components; the substrate 1, the component 2 and the connector 3 are covered by the encapsulation layer 7 to form an encapsulation structure.

[0036] Preferably, the connector 3 includes internal conductive lines, the ends of which form the connection contacts; the connector 3 is connected to the component 2 through the internal conductive lines. Specifically, the internal conductive lines can establish an electrical connection with the component 2 through various methods such as wire bonding, soldering, or conductive adhesive bonding, and these connection methods can be flexibly selected according to the actual application scenario and process requirements. This internal conductive line design enhances the reliability of the electrical connection between the connector 3 and the component 2, while simplifying the manufacturing process and eliminating the need for additional wiring steps.

[0037] In one embodiment, the internal conductive circuit includes a copper pillar structure, the cross-section of which forms the connection contact point. Specifically, the copper pillar structure can be formed by electroplating, drilling and filling, etc. Copper material has good conductivity and processing performance, facilitating the formation of a smooth and flat connection contact point after cutting. Those skilled in the art will know that, in addition to copper, the internal conductive circuit can also use other conductive materials such as aluminum, gold, and silver, which can be set according to actual needs. Furthermore, the materials of the internal conductive circuit also include those from other embodiments besides this one. The design of the copper pillar structure improves the conductivity and mechanical strength of the connection contact point, while also facilitating subsequent cutting and processing.

[0038] In the embodiment, the copper column structure comprises a plurality of U-shaped copper columns, the U-shaped copper columns comprise first U-shaped copper columns 4 and second U-shaped copper columns 5 with different sizes, and the first U-shaped copper columns 4 and the second U-shaped copper columns 5 are arranged alternately inside the connector 3. Specifically, the first U-shaped copper columns 4 have a larger size, the second U-shaped copper columns 5 have a smaller size, and a comb-shaped structure is formed by the alternate arrangement. By using the alternate arrangement structure of U-shaped copper columns with different sizes, the number of contact points per unit area is increased, and the tensile strength and stability of the connection are improved, effectively avoiding connection failure caused by vibration or tension during use.

[0039] In addition, the embodiment also comprises a flexible circuit board 6; the flexible circuit board 6 is connected with the connection contact for connecting the external electronic components. Specifically, the flexible circuit board 6 comprises a T-shaped structure. The horizontal part of the T-shaped structure is aligned and fixed with the connection contact, and the vertical part of the flexible circuit board 6 extends to the outside for electrical connection. The flexible circuit board 6 can be connected with the connection contact by conductive glue, welding or crimping, etc. By using the flexible circuit board 6 for connection, the flexibility of the connection between the semiconductor chip and the external device is enhanced, which meets the needs of different installation spaces and application environments, and the T-shaped structure design of the flexible circuit board 6 increases the connection area and improves the connection reliability.

[0040] In an embodiment, at least one connector 3 is arranged at each predetermined cutting position. Specifically, the number and arrangement of the connectors 3 can be designed according to the function and connection requirements of the chip, which can be single-row, double-row or matrix arrangement. In a specific example, the connectors 3 can be evenly distributed along the predetermined cutting position, and the interval can be set according to the actual requirements. By arranging a plurality of connectors 3 at the predetermined cutting position, the current carrying capacity of the connection is increased, which meets the different electrical performance requirements, and provides redundant connection of signals and power supply, and enhances the system reliability.

[0041] In addition, the embodiment provides a preparation method of a semiconductor chip, which prepares the semiconductor chip as described above, and specifically comprises the following steps:

[0042] S1, providing a substrate 1, wherein the substrate 1 is provided with a predetermined cutting position;

[0043] S2, mounting components 2 on the substrate 1;

[0044] S3, arranging a connector 3 at the predetermined cutting position of the substrate 1, wherein the connector 3 is electrically connected with the components 2;

[0045] S4, forming a packaging layer 7, wherein the packaging layer 7 covers the substrate 1, the components 2 and the connector 3 to form a packaging structure; and

[0046] S5, cutting the packaging structure along the predetermined cutting position, so that the connector 3 forms connecting contacts on the cutting surface.

[0047] Preferably, the connector 3 is arranged on the predetermined cutting position of the substrate 1, specifically including: connecting the internal conductive circuit of the connector 3 with the component 2 by wire bonding, soldering or conductive adhesive bonding. Those skilled in the art can know that the connection mode also includes other embodiments in addition to the present embodiment. Through these connection modes, the firmness and conductivity of the connection between the connector 3 and the component 2 are improved, which is suitable for different manufacturing environments and product requirements.

[0048] In the present embodiment, the packaging structure is cut along the predetermined cutting position, specifically including: forming two independent semiconductor units along the predetermined cutting position, and the connector 3 is divided into two parts and attached to the cutting surface of the two semiconductor units respectively, so that the connecting contacts on the cutting surface of the two semiconductor units are arranged in a symmetrical manner.

[0049] In an embodiment, after the packaging structure is cut along the predetermined cutting position, the flexible circuit board 6 is connected with the connecting contacts. Specifically, the connection can be achieved by hot pressing, conductive adhesive or micro soldering, etc. Through the process sequence of cutting and then connecting the flexible circuit board 6, the damage to the flexible circuit board 6 during the cutting process is avoided, and the firmness and reliability of the connection are enhanced.

[0050] In the present embodiment, the packaging structure is cut to form two independent semiconductor units, and the connector 3 is divided into two parts and attached to the cutting surface of the two semiconductor units respectively. The connecting contacts on the cutting surface of the two semiconductor units are arranged in a symmetrical manner. Specifically, the cutting can be carried out by precise sawing, laser cutting, etc., and the cutting width is usually controlled within a specified range. By cutting the packaging structure into two independent semiconductor units, the effect of one-time packaging and multiple uses is achieved, the manufacturing efficiency is improved, and at the same time, since the connecting contacts are directly formed on the cutting surface, the subsequent connection process is simplified, and the manufacturing steps are reduced.

[0051] In the embodiment, during the chip manufacturing process, the connector 3 is arranged in advance at the predetermined cutting position of the substrate 1, and the conductive circuit inside the connector 3 is electrically connected with the internal components 2 of the chip. After the packaging is completed, cutting is performed along the predetermined cutting position, so that the connector 3 forms a connecting contact on the cutting surface. The independent semiconductor unit after cutting can be connected with the flexible circuit board 6 through the connecting contact on the cutting surface, and electrical connection with external electronic components is realized. Different from the traditional connection mode which needs secondary placement or film molding, the embodiment directly forms the connecting contact on the cutting surface, so that the manufacturing process is simplified, and the connection reliability and manufacturing efficiency are improved.

[0052] In summary, the semiconductor chip provided by the application has the following advantages:

[0053] By arranging the connector at the predetermined cutting position and making the connector form the connecting contact on the cutting surface after cutting, the semiconductor chip of the application does not need to be attached with the connector on the back surface or the non-packaging area, the secondary placement process is avoided, and the manufacturing process is simplified. Meanwhile, the film molding is not needed to expose the interlayer, and the problems of molding machine modification and glue overflow control are avoided. In addition, the semiconductor chip of the application can be directly connected with external electronic components through the connecting contact on the cutting surface after cutting, without the need of additional wiring process, so that the manufacturing cost is reduced, and the connection reliability is improved.

[0054] Obviously, those skilled in the art can make various modifications and variations to the application without departing from the spirit and scope of the application. Thus, if these modifications and variations of the application belong to the scope of the claims of the application and the equivalent technology thereof, the application also intends to include these modifications and variations.

Claims

1. A semiconductor chip, characterized by, The application relates to a semiconductor device, which comprises a substrate, components and connectors; the components and the connectors are mounted on the substrate; the substrate is provided with predetermined cutting positions; the connectors are arranged on the predetermined cutting positions; the connectors form connecting contacts on the cutting surface after cutting, and are used for connecting with external electronic components; The substrate, the components and the connectors are covered by a packaging layer to form a packaging structure; The connector comprises an internal conductive circuit, and the end of the internal conductive circuit forms the connecting contact; the connector is connected with the components through the internal conductive circuit; The internal conductive circuit comprises a copper column structure, and the cutting surface of the copper column structure constitutes the connecting contact; The copper column structure comprises a plurality of U-shaped copper columns, the U-shaped copper columns comprise first U-shaped copper columns and second U-shaped copper columns with different sizes, and the first U-shaped copper columns and the second U-shaped copper columns are alternately arranged in the connector; the first U-shaped copper columns have larger sizes, the second U-shaped copper columns have smaller sizes, and the comb-shaped structure is formed through the alternate arrangement.

2. The semiconductor chip of claim 1, wherein, The application further relates to a flexible circuit board; the flexible circuit board is connected with the connecting contact and is used for connecting the external electronic components.

3. The semiconductor chip of claim 1, wherein, At least one connector is arranged on each of the predetermined cutting positions.

4. A method of manufacturing a semiconductor chip, manufacturing a semiconductor chip according to any one of claims 1 to 3, characterized in that, The application specifically comprises the following steps: A substrate is provided, and the substrate is provided with predetermined cutting positions; Components are mounted on the substrate; Connectors are arranged on the predetermined cutting positions of the substrate, and the connectors are electrically connected with the components; A packaging layer is formed, the packaging layer covers the substrate, the components and the connectors, and a packaging structure is formed; The packaging structure is cut along the predetermined cutting positions, so that the connectors form connecting contacts on the cutting surface.

5. The method of claim 4, wherein the semiconductor chip is prepared by a method comprising: The step of arranging the connectors on the predetermined cutting positions of the substrate specifically comprises the following steps: the internal conductive circuit of the connector is connected with the components by wire bonding, welding or conductive adhesive bonding. ​ 6. The method of claim 4, wherein the semiconductor chip is prepared by a method comprising: The step of cutting the packaging structure along the predetermined cutting positions specifically comprises the following steps: the packaging structure is cut along the predetermined cutting positions to form two independent semiconductor units, the connectors are cut into two parts and are respectively attached to the cutting surfaces of the two semiconductor units, and the connecting contacts on the cutting surfaces of the two semiconductor units are arranged in a symmetrical manner. ​ 7. The method of claim 4, wherein the semiconductor chip is prepared by a method comprising: forming a semiconductor wafer; forming a plurality of semiconductor chips on the semiconductor wafer; and separating the plurality of semiconductor chips from the semiconductor wafer. After the step of cutting the packaging structure along the predetermined cutting positions, a flexible circuit board is connected with the connecting contacts.

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