Fully-immersed heat dissipation device

Abstract

The invention relates to a full-immersion type heat dissipation device, the full-immersion type heat dissipation device is used for heat dissipation of a power element, the full-immersion type heat dissipation device comprises a main chamber body, a balance channel part, a telescopic cavity and a condensation assembly, the balance channel part communicates with the main chamber body and the telescopic cavity, and the condensation assembly communicates with the main chamber body and the telescopic cavity; and the main chamber body, the balance channel part and the telescopic cavity are communicated to form a sealed cavity without non-condensable gas. The heating surface of the power element is immersed in the liquid working medium in the main chamber body, the condensation surface of the condensation assembly is arranged at the upper end of the main chamber body, and the gaseous working medium can press the liquid working medium in the main chamber body into the telescopic cavity through the balance channel part and enables the telescopic cavity to expand. The gaseous working medium can be liquefied into a liquid working medium, and the liquid working medium in the telescopic cavity can enter the main chamber body through the balance channel part. According to the fully-immersed heat dissipation device provided by the invention, the problem that the heat dissipation interval of the power element cannot be kept stable due to relatively large fluctuation of the pressure in the cooling system is solved.

Description

Technical Field

[0001] The present application relates to the technical field of heat pipe devices, and in particular to a fully immersed heat dissipation device. Background Art

[0002] With the rapid development of artificial intelligence technology, the computing power required by chips has continued to increase, but this has also brought higher energy consumption and heat generation. Even the heat flux density of power components such as chips is growing exponentially. It is expected that in the near future, a single chip will generate more than 2500W of thermal power consumption in a 26×33 (mm) package area, with a heat flux density of approximately 300W / cm². Obviously, traditional water cooling technology can no longer meet such high-density heat dissipation requirements.

[0003] There are currently two main solutions: Option A, which is to modify the liquid cooling plate and replace the coolant in the liquid cooling plate with a cooling medium with phase change characteristics, and use the latent heat of vaporization of the cooling medium to achieve rapid heat dissipation of the chip. It should be noted that the cooling medium and the chip in this solution are not in direct contact, that is, the chip and the cooling medium in Solution A are separated by a liquid cooling plate. Therefore, the heat dissipation capacity of Solution A is also relatively limited; Option B, which is to immerse the chip directly in the cooling medium. All exposed surfaces of the chip are in direct contact with the cooling medium, and efficient heat dissipation is achieved through phase change boiling of the cooling medium. Obviously, the coolant and the chip in this solution are in direct contact.

[0004] The key point is that, regardless of whether it is Option A or Option B, the vaporization or re-liquefaction of the coolant will cause large fluctuations in the pressure within the cooling system. These pressure fluctuations can cause the boiling point (or condensation point) of the coolant to change significantly. For example, when the internal pressure increases, the boiling point of the coolant will increase from 30°C to 40°C. In other words, at temperatures below 40°C, the coolant will not undergo a phase change. At this time, the heat generated by the chip will be difficult to remove through the coolant's latent heat of vaporization. Therefore, large fluctuations in the pressure within the cooling system are not conducive to maintaining a stable heat dissipation range for power components such as chips. They may even cause the chip to fail to dissipate heat in time, causing damage, or the chip to operate at too low a temperature, affecting performance.

[0005] It should be noted that the application of immersion liquid cooling technology has become relatively common, and its sealing problem has long been effectively solved. A leading domestic automobile testing platform published an article entitled "Unlocking Battery Thermal Management Technology: Comparison of Four Cooling Technologies" on 2023-10-20. The article introduced the four major battery cooling technologies, including air cooling, liquid cooling, phase change material cooling and thermoelectric cooling. In addition, in the second part of the liquid cooling section - immersion liquid cooling, the technology of completely immersing the battery in the coolant is introduced in detail. In addition, the article discloses the following two key points through text or pictures: ① Immersion liquid cooling mainly uses insulating oil and fluorinated liquid as coolants, that is, the coolant will not cause the battery to short-circuit; ② As can be seen from the attached figure, the battery transmits electricity to the outside through the copper busbar, and the copper busbar is sealed and penetrates the external liquid storage container, which will not cause leakage. Therefore, it can be seen that the battery is immersed in the coolant without affecting the electrical connection between the battery and external components. Summary of the Invention

[0006] Based on this, it is necessary to provide a fully immersed heat dissipation device to solve the problem that the pressure inside the cooling system fluctuates greatly, which is not conducive to maintaining a stable heat dissipation range of power components such as chips.

[0007] The fully immersed heat dissipation device provided in the present application is used to dissipate heat for one or more power elements. The fully immersed heat dissipation device includes a main chamber body, a balancing channel portion, a telescopic cavity, and a condensation assembly. The balancing channel portion connects the main chamber body and the telescopic cavity, and the main chamber body, the balancing channel portion, and the telescopic cavity are connected to form a sealed cavity without non-condensable gas. The sealed cavity is filled with liquid working medium, and at least the heating surface of the power element is immersed in the liquid working medium. The condensation assembly is provided with a condensation surface, which is arranged at the upper end of the main chamber body. When the liquid working medium in the sealed cavity is vaporized, the gaseous working medium can press the liquid working medium in the main chamber body into the telescopic cavity through the balancing channel portion, causing the telescopic cavity to expand. When the gaseous working medium rises and contacts the condensation surface, the gaseous working medium can liquefy into liquid working medium, and the liquid working medium in the telescopic cavity can enter the main chamber body through the balancing channel portion.

[0008] In one embodiment, the fully immersed heat dissipation device further includes a sub-chamber body, the telescopic cavity is installed in the sub-chamber body, the sub-chamber body is connected to the external space, and the sub-chamber body is a rigid structure.

[0009] In one embodiment, the sub-chamber body is provided with an adjustment baffle, which can be adjusted in a direction close to or away from the telescopic cavity to increase or decrease the maximum expansion space of the telescopic cavity in the sub-chamber body.

[0010] In one embodiment, the fully immersed heat dissipation device also includes a power element, a pressure sensor and a controller. The pressure sensor is arranged in the sealed cavity, and the power element is arranged on the side of the regulating baffle away from the telescopic cavity. The controller can control the power element to drive the regulating baffle to move toward or away from the telescopic cavity according to the pressure value of the working medium in the sealed cavity measured by the pressure sensor, so as to adjust the pressure of the working medium in the sealed cavity.

[0011] In one embodiment, the main chamber body and the auxiliary chamber body are distributed along the same horizontal plane, or the main chamber body and the auxiliary chamber body are distributed along the same vertical direction.

[0012] In one embodiment, the fully immersed heat dissipation device also includes a second liquid pump and a spray tube group, both of which are arranged in the main chamber body. The second liquid pump can drive the spray tube group to spray liquid working medium toward the heating surface of the power element, so that the liquid working medium forms a liquid flow on the heating surface of the power element.

[0013] In one embodiment, there are multiple power elements, and the multiple power elements are arranged at intervals in the main chamber. The injection pipe group includes a main pipe, a branch pipe and a nozzle. One end of the main pipe is connected to the second liquid pump, and the other end is connected to each branch pipe respectively. The nozzle is arranged at the end of the corresponding branch pipe away from the main pipe. Each power element is provided with at least one nozzle, so that the liquid working medium can be sprayed onto the heating surface of the corresponding power element through the main pipe, the branch pipe and the nozzle in sequence.

[0014] In one embodiment, the nozzle is provided with a plurality of nozzle holes distributed in an array, and the spraying direction of the nozzle holes is perpendicular to the heating surface of the power element, or the spraying direction of the nozzle holes is inclined relative to the heating surface of the power element.

[0015] In one embodiment, the telescopic cavity is a flexible structure with a built-in return spring, and the elastic coefficient of the return spring is a constant value.

[0016] In one embodiment, the telescopic cavity is an elastic bag or a bellows.

[0017] In one embodiment, the vertical height of the telescopic cavity is greater than the vertical height of the main chamber, and the liquid working medium in the telescopic cavity can flow back into the main chamber by gravity.

[0018] In one embodiment, the power element is embedded in the bottom wall or side wall of the main chamber body, the heating surface of the power element is exposed in the main chamber body and is completely immersed in the liquid working medium of the main chamber body, and the external terminal of the power element is located outside the main chamber body.

[0019] In one embodiment, the power element is completely immersed in the main chamber, and the connecting wires of the power element are sealed and passed through the inner wall of the main chamber.

[0020] In one embodiment, the distance A between the condensing assembly and the top surface of the inner wall of the main chamber satisfies 1 mm ≤ A ≤ 5 mm.

[0021] Compared to existing technologies, the fully submerged heat sink provided in this application utilizes the volumetric adjustment function of the telescopic cavity to actively compensate for volume changes caused by phase changes in the working fluid, stabilizing the system pressure within a set threshold. The sealed cavity, filled with working fluid, eliminates external pressure interference, while the balancing channel ensures directional flow of the liquid working fluid, forming a closed-loop pressure regulation system.

[0022] Through the above technical solution, this application effectively suppresses pressure fluctuations during the working fluid phase change process, maintaining a stable boiling point for the liquid working fluid. The heat continuously generated by the power components can be promptly converted into latent heat of the working fluid phase change, avoiding performance degradation caused by localized excessive temperatures. The elastic deformation characteristics of the telescopic cavity enable adaptive pressure regulation, effectively maintaining the stable operation of the fully immersed heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of a partial structure of a fully immersed heat dissipation device according to an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the partial structure of a fully immersed heat dissipation device according to another embodiment of the present application;

[0026] Figure 3 A schematic diagram of a partial structure of a fully immersed heat dissipation device according to another embodiment of the present application;

[0027] Figure 4 A schematic diagram of a partial structure of a fully immersed heat dissipation device according to another embodiment of the present application;

[0028] Figure 5 This is a schematic diagram of the nozzle structure of an embodiment provided in this application.

[0029] Figure numerals: 100, power element; 110, heating surface; 200, main chamber body; 300, balance channel part; 400, sub-chamber body; 410, telescopic cavity; 420, adjusting partition; 500, condensation component; 510, liquid cooling plate; 511, condensation surface; 600, pressure sensor; 700, second liquid pump; 800, injection pipe group; 810, main pipeline; 820, branch pipeline; 830, nozzle; 831, spray hole. DETAILED DESCRIPTION

[0030] See also Figure 1-Figure 5 The present application provides a fully immersed heat dissipation device for dissipating heat from one or more power elements 100. The power elements 100 may be various heat-generating components such as PCB boards, chips, IGBT modules, gallium nitride modules, silicon carbide modules, motors, or batteries. The fully immersed heat dissipation device includes a main chamber body 200, a balancing channel portion 300, a telescopic cavity 410, and a condensing assembly 500. One end of the balancing channel portion 300 is connected to the lower end of the main chamber body 200, preferably the bottom of the main chamber body 200. Of course, it can also be connected to the middle area of ​​the main chamber body 200 in the height direction, as long as it is ensured that the liquid working medium enters the balancing channel portion 300 before the gaseous working medium. The other end is connected to the telescopic cavity 410. The main chamber body 200, the balancing channel portion 300, and the telescopic cavity 410 are defined as being connected to form a sealed cavity. The sealed cavity is a cavity without non-condensable gases (mainly impurity gases such as air).

[0031] A liquid working medium is provided in the sealed cavity. Preferably, the liquid working medium fills the main chamber body 200, the power element 100 is embedded in the bottom wall or side wall of the main chamber body 200, and the heating surface 110 of the power element 100 is exposed in the main chamber body 200 and is completely immersed in the liquid working medium of the main chamber body 200. The external terminal of the power element 100 is located outside the main chamber body 200, or the power element 100 is completely immersed in the main chamber body 200, and the connecting wire of the power element 100 is sealed and passed through the inner wall of the main chamber body 200. Regardless of the installation form, it can be ensured that at least the heating surface 110 of the power element 100 is immersed in the liquid working medium.

[0032] Specifically, when the power element 100 is embedded in the bottom or side wall of the main chamber 200, the heating surface 110 is directly exposed to the liquid working medium, achieving efficient heat dissipation through the phase change heat absorption of the liquid working medium. The external wiring terminals are located outside the main chamber 200 to avoid the risk of short circuits caused by contact between the liquid working medium and external circuits. When the power element 100 is completely immersed in the main chamber 200, the connecting wires are led to the outside through a sealed penetration method, ensuring that the non-condensable gas environment of the sealed cavity is not destroyed, while maintaining direct contact between the power element 100 and the liquid working medium, improving heat dissipation efficiency.

[0033] Compared to the prior art, this application, through embedded or sealed penetration, ensures direct contact between the power element 100 and the liquid working medium while simplifying the sealing structure and preventing pressure fluctuations due to seal failure. Furthermore, the prior art lacks clarity regarding the installation position and sealing method for the power element 100, resulting in insufficient heat dissipation stability. This application, by defining the installation position and sealing process, ensures stable pressure within the sealed cavity.

[0034] It should be noted that the power component 100 (eg, a PCB board) can be fixed in the main chamber 200 by being clamped in a slot on the inner wall of the main chamber 200 .

[0035] The condensing assembly 500 is provided with a condensing surface 511, which is disposed at the upper end of the main chamber body 200. It should be noted that the upper end refers to a relatively high point in the vertical direction. Specifically, in one embodiment, the condensing assembly 500 includes a liquid-cooling plate 510, a first liquid pump (not shown), and a condenser (not shown). The liquid-cooling plate 510 is disposed within the main chamber body 200, and the liquid-cooling plate 510 is connected to the condenser via the first liquid pump. The gaseous working medium can be adsorbed on the surface of the liquid-cooling plate 510 and transfer heat to the liquid-cooling plate 510, thereby heating the coolant within the liquid-cooling plate 510. The coolant is then pumped into the condenser by the first liquid pump, where it releases heat and ultimately returns to the liquid-cooling plate 510. Of course, to further improve heat dissipation efficiency, the condensing assembly 500 may further include a compressor and a throttle valve, utilizing the compressor and throttle valve to directly cool the coolant. Furthermore, it should be noted that the condensation assembly 500 and the top surface of the inner wall of the main chamber body 200 are spaced apart, and the spacing A between the condensation assembly 500 and the top surface of the inner wall of the main chamber body 200 satisfies 1mm≤A≤5mm. In another embodiment, the condensation assembly 500 can also serve as a part of the upper cover of the main chamber body 200. Specifically, the condensation assembly 500 is embedded in the upper cover of the main chamber body 200, and the condensation surface 511 of the condensation assembly 500 is exposed to the main chamber body 200 and in contact with the working medium. The other end of the condensation assembly 500 is provided with heat dissipation fins and is exposed to the atmospheric environment. Regardless of the form, the heat in the liquefaction process of the gaseous working medium can be quickly transferred out of the main chamber body 200, so as to facilitate the rapid liquefaction of the gaseous working medium.

[0036] It should be noted that the coolant can be a variety of refrigerants such as deionized pure water, ethanol, R1233ZD (E) or R1233ZD (Z).

[0037] When the heat generated by the power element 100 is insufficient to vaporize the liquid working medium, or when the power element 100 is stopped, the liquid working medium in the sealed cavity is in an unvaporized state, and the telescopic cavity 410 is in a compressed state. That is, the liquid working medium will not expand the telescopic cavity 410, or at least will not cause the telescopic cavity 410 to be in its most expanded state. When the liquid working medium in the sealed cavity absorbs the heat generated by the power element 100 and vaporizes into a gaseous working medium, the gaseous working medium can press the liquid working medium in the main chamber 200 into the telescopic cavity 410 through the balancing channel portion 300, causing the telescopic cavity 410 to expand under the filling of the liquid working medium. When the gaseous working medium rises and contacts the condensation surface 511, the gaseous working medium can re-liquefy into a liquid working medium. At this time, the liquid working medium in the telescopic cavity 410 can re-enter the main chamber 200 through the balancing channel portion 300.

[0038] Specifically, the heat generated by the power element 100 during operation causes the liquid working medium to boil and vaporize. The volume expansion of the gaseous working medium pushes the liquid working medium in the main chamber body 200 into the telescopic cavity 410 through the balancing channel portion 300. The telescopic cavity 410 is elastically deformed by the hydraulic pressure to expand its volume, thereby preventing a sharp increase in the pressure inside the sealed cavity. When the gaseous working medium rises to the surface of the condensing component 500, it exchanges heat with the coolant and re-liquefies. The liquid working medium then flows back to the main chamber body 200 under the action of gravity. When the gaseous working medium decreases and the pressure drops, the liquid working medium returns to the main chamber body 200 to maintain a dynamic balance of pressure in the cavity.

[0039] It should be noted that the rapid heat dissipation of the power element 100 mainly utilizes the latent heat of vaporization characteristics of the working fluid. Specifically, latent heat refers to the heat absorbed or released by a substance during the phase change process from one phase to another under the condition of constant temperature. Therefore, the latent heat of vaporization refers to the heat absorbed at the moment of the working fluid's vaporization phase change. Taking pure water as an example, when pure water does not undergo phase change, 1 kg of pure water absorbs 420 kJ of heat from 0°C to 100°C. However, the temperature difference before and after cooling of the power element 100 such as the chip is about 5-6°C. Therefore, the heat absorbed by 1 kg of pure water when the temperature rises by 5°C to 6°C is between 21 kJ and 25.2 kJ. Correspondingly, when 1 kg of pure water changes from a liquid phase at a boiling point to a gas phase at a boiling point, the heat that can be absorbed is 2260 kJ. Obviously, the heat absorption capacity of the latter is nearly 100 times that of the former. That is, the present application utilizes the phase change of the working fluid to absorb a huge amount of heat. That is to say, before the phase change, the amount of heat that water can absorb is relatively small, but at the moment of phase change, the amount of heat it can absorb is huge.

[0040] Compared to existing technologies, this solution utilizes the volumetric adjustment function of telescopic chamber 410 to actively compensate for volume changes caused by phase changes in the working fluid, stabilizing the system pressure within a set threshold. The sealed chamber, filled with working fluid, eliminates external pressure interference, while the balancing channel 300 ensures directional flow of the liquid working fluid, forming a closed-loop pressure regulation system.

[0041] Through the above-mentioned technical solution, the present application effectively suppresses pressure fluctuations during the working fluid phase change process, maintaining a stable boiling point for the liquid working fluid. The heat continuously generated by power element 100 is promptly converted into latent heat of the working fluid phase change, avoiding performance degradation caused by localized excessive temperatures. The elastic deformation characteristics of telescopic cavity 410 enable adaptive pressure regulation, effectively maintaining the stable operation of the fully immersed heat dissipation device.

[0042] In one embodiment, the telescopic cavity 410 has a certain elastic recovery capability. Specifically, the telescopic cavity 410 is a flexible structure with a built-in return spring, which facilitates the telescopic cavity 410 to re-press the liquid working medium into the main chamber 200. The elastic coefficient of the return spring is a fixed value. A flexible structure with a built-in return spring refers to a cavity composed of an elastic material and having an integrated spring. The spring has a fixed elastic coefficient, which can be implemented using a coil spring made of metal or polymer material. The elastic deformation of the spring absorbs or releases pressure changes. In some specific embodiments, the elastic coefficient of the return spring can be selected to be a fixed value, for example, in the range of 1N / mm to 5N / mm.

[0043] However, the present invention is not limited to this. In other embodiments, the telescopic cavity 410 may also be a structure with inherent tension, such as an elastic bag or a bellows. An elastic bag is a telescopic, sealed container made of rubber or silicone, while a bellows is a metal or plastic tube with a folding structure. Both adapt to changes in cavity volume through the material's inherent deformability. In some specific embodiments, the wall thickness of the elastic bag can be set, for example, to 0.5 mm to 2 mm, and the number of folded layers of the bellows can be, for example, 2 to 8.

[0044] In another embodiment, the telescopic chamber 410 can also be a non-elastic flexible bag, with the vertical height of the telescopic chamber 410 being greater than the vertical height of the main chamber 200. The liquid working medium in the telescopic chamber 410 can also flow back into the main chamber 200 through gravity. The vertical height being greater than the main chamber 200 refers to a height difference between the telescopic chamber 410 and the main chamber 200. Specifically, this can be achieved by installing the telescopic chamber 410 above the main chamber 200, utilizing the gravitational potential energy of the liquid working medium to drive its flow. In some specific embodiments, for the height difference design, the vertical distance between the bottom of the telescopic chamber 410 and the top of the main chamber 200 can be set to, for example, 50 mm to 200 mm.

[0045] Specifically, when the liquid working medium in the sealed cavity vaporizes due to heat, the gaseous working medium pushes the liquid working medium in the main chamber 200 into the telescopic cavity 410. If the telescopic cavity 410 is a flexible structure with a built-in return spring, the spring's fixed elastic coefficient can provide a stable restoring force, allowing the cavity to automatically contract after expansion, maintaining pressure balance. If it is an elastic bag or bellows, its deformation properties can absorb volume changes and avoid sudden pressure changes. If the telescopic cavity 410 is higher vertically, the liquid working medium will automatically flow back to the main chamber 200 by gravity after the vaporization pressure disappears, without the need for additional power.

[0046] Compared to existing solutions, where pressure fluctuations in the cooling system lead to unstable working fluid boiling points, this solution actively regulates the volume changes of the liquid working fluid through the elastic deformation of the telescopic cavity 410 or the gravity reflux mechanism, thereby suppressing pressure fluctuations. For example, while the pressure fluctuation range in existing solutions can reach ±2 kPa, this solution can control the fluctuation range to within ±0.5 kPa, reducing the working fluid boiling point fluctuation range from ±2°C in existing solutions to ±0.5°C.

[0047] Through the above technical solution, this application solves the problem of unstable heat dissipation efficiency caused by pressure fluctuations within the cooling system. The fixed elastic coefficient of the return spring or the deformation characteristics of the elastic bag can accurately control the cavity volume compensation capability, ensuring that the working fluid phase transition temperature remains stable. The height difference design uses gravity to achieve automatic circulation of the liquid working fluid, avoiding backflow delays caused by pressure imbalance, thereby ensuring a continuous and efficient heat dissipation process.

[0048] In one embodiment, if Figures 1-4 As shown, the fully immersed heat dissipation device also includes a sub-chamber body 400, and the telescopic cavity 410 is installed in the sub-chamber body 400. The sub-chamber body 400 is connected to the external space (mainly referring to the atmospheric environment), and the sub-chamber body 400 is a rigid structure. It should be noted that the rigid structure does not refer to hardness, but indicates that the sub-chamber body 400 cannot be compressed or expanded, thereby limiting the maximum expansion space of the telescopic cavity 410.

[0049] Specifically, the rigid structure of the sub-chamber body 400 can resist the internal pressure generated by the expansion of the telescopic cavity 410, thereby limiting the maximum expansion space of the telescopic cavity 410 and preventing excessive deformation of the telescopic cavity 410 from obstructing the backflow of the liquid working medium. When the pressure of the gaseous working medium in the sealed cavity increases, the characteristic of the sub-chamber body 400 being connected to the outside can quickly release excess pressure, preventing the pressure from continuing to rise and causing the working medium boiling point to shift. At the same time, the rigid sub-chamber body 400 provides fixed support for the telescopic cavity 410, ensuring that its expansion and contraction process always proceeds in the predetermined direction, avoiding uneven distribution of the liquid working medium due to the deviation of the telescopic cavity 410.

[0050] Specifically, in one embodiment, Figure 1As shown, the auxiliary chamber body 400 and the main chamber body 200 can be separately arranged. In this case, the balancing channel portion 300 serves as a pipeline to connect the telescopic cavity 410 arranged in the auxiliary chamber body 400 and the main chamber body 200. Obviously, such an arrangement can improve the assembly flexibility between the main chamber body 200 and the auxiliary chamber body 400.

[0051] In another embodiment, Figure 2-Figure 4 As shown, the auxiliary chamber body 400 and the main chamber body 200 can also be provided in an integrated manner, that is, a box body is divided by a partition to form the main chamber body 200 and the auxiliary chamber body 400. In this case, the balancing channel portion 300 serves as a through hole provided in the partition to connect the telescopic cavity 410 and the main chamber body 200. Obviously, such a configuration greatly improves the integration of the fully immersed heat dissipation device.

[0052] In one embodiment, if Figure 1-Figure 2 As shown, the main chamber body 200 and the auxiliary chamber body 400 are distributed along the same horizontal plane, that is, the auxiliary chamber body 400 is distributed on one side of the main chamber body 200 in the horizontal direction. In this case, the telescopic cavity 410 can be distributed above, below, or in the middle area of ​​the auxiliary chamber body 400 in the vertical direction. The "same horizontal plane distribution" means that the main chamber body 200 and the auxiliary chamber body 400 are at the same height in the horizontal direction. Specifically, they can be fixed by rigid connectors or support frames. This layout can simplify the flow path of the liquid working medium inside the sealed cavity and reduce energy loss during pressure transmission.

[0053] In another embodiment, Figure 3-Figure 4 As shown, the main chamber body 200 and the auxiliary chamber body 400 are arranged at different heights. Preferably, the main chamber body 200 and the auxiliary chamber body 400 are distributed along the same vertical direction, that is, the auxiliary chamber body 400 is distributed on one side of the main chamber body 200 along the vertical direction. In this case, the telescopic cavity 410 can be distributed above, below, or in the middle area of ​​the auxiliary chamber body 400 along the vertical direction. Of course, in other embodiments, the main chamber body 200 and the auxiliary chamber body 400 can also be arranged obliquely along the vertical direction. For example, the auxiliary chamber body 400 is arranged obliquely above the main chamber body 200, and there are many other situations that are not listed here. Among them, the same vertical direction distribution means that the main chamber body 200 and the auxiliary chamber body 400 are arranged up and down in the vertical direction. Specifically, the installation can be achieved through a vertical bracket or a layered structure. This layout can use the effect of gravity to promote the natural flow of liquid working medium between the main chamber body 200 and the telescopic cavity 410, reducing the pressure fluctuation caused by the obstruction of the liquid working medium backflow.

[0054] Compared with the existing technology, the present application can select the layout of the main chamber body 200 and the auxiliary chamber body 400 according to the actual installation space requirements, simplify the system structure and improve the pressure response speed in the horizontal distribution scenario, and use gravity to optimize the liquid working fluid circulation efficiency in the vertical distribution scenario, thereby maintaining the dynamic balance of pressure in the sealed cavity under various application environments and ensuring the stable heat dissipation performance of the power element 100.

[0055] It should be noted that when the auxiliary chamber body 400 is located above the main chamber body 200, the balancing channel portion 300 needs to extend downward from the telescopic cavity 410 and connect to the bottom area of ​​the main chamber body 200 to prevent the gaseous working medium from entering the telescopic cavity 410 through the balancing channel portion 300.

[0056] In addition, it should be noted that when the auxiliary chamber body 400 is located below the main chamber body 200, and the telescopic cavity 410 is located below the auxiliary chamber body 400, the balancing channel portion 300 needs to extend all the way down from the bottom of the main chamber body 200 and connect to the telescopic cavity 410. The telescopic cavity 410 is located at the lower end or bottom of the auxiliary chamber body 400, and the balancing channel portion 300 needs to extend all the way down from the bottom of the main chamber body 200 and connect to the bottom of the telescopic cavity 410. In this way, the telescopic cavity 410 can freely expand and contract within the auxiliary chamber body 400. If the balancing channel portion 300 extends all the way down from the bottom of the main chamber body 200 and connects to the top of the telescopic cavity 410, the expansion and contraction of the telescopic cavity 410 will be restricted, or the balancing channel portion 300 needs to be made into a flexible structure.

[0057] In one embodiment, if Figure 4 As shown, the sub-chamber body 400 is provided with an adjusting baffle 420, which is movably arranged relative to the inner wall of the sub-chamber body 400, and the adjusting baffle 420 can be movably adjusted in a direction close to or away from the telescopic cavity 410 to increase or decrease the maximum expansion space of the telescopic cavity 410 in the sub-chamber body 400, that is, the adjusting baffle 420 is used to adjust the maximum expansion volume of the telescopic cavity 410 in the sub-chamber body 400, so that the boiling point of the liquid working medium can be adjusted according to different operating temperature ranges of the power element 100.

[0058] Specifically, when the operating temperature range of the power element 100 is less than 20°C, the maximum expansion space of the telescopic cavity 410 in the auxiliary chamber 400 can be appropriately increased. Since the total amount of the liquid working medium is constant, such a setting can reduce the maximum pressure in the entire sealed cavity, thereby reducing the boiling point of the liquid working medium in the sealed cavity, so that the liquid working medium can begin to boil at around 20°C. Conversely, when the operating temperature range of the power element 100 is less than 25°C, the maximum expansion space of the telescopic cavity 410 in the auxiliary chamber 400 can be appropriately reduced. Since the total amount of the liquid working medium is constant, such a setting can increase the maximum pressure in the entire sealed cavity, thereby increasing the boiling point of the liquid working medium in the sealed cavity, so that the liquid working medium only begins to boil at around 25°C. In summary, such a setting enables the fully immersed heat dissipation device to adapt to various types of power elements 100 with different operating temperature ranges, greatly improving the application universality and convenience of the fully immersed heat dissipation device.

[0059] It should be noted that the refrigerant is an insulating liquid that conducts heat but not electricity. Specifically, it can be various new refrigerants such as R1233ZD(E) or R1233ZD(Z). R1233ZD(E) and R1233ZD(Z) are two isomers of 1-chloro-3,3,3-trifluoropropene, differing primarily in the cis-trans (Z / E) configuration of the double bond in their molecular structure. Specifically, R1233ZD(E) is the trans isomer and has a more stable molecular structure. R1233ZD(Z) is the cis isomer and has a slightly higher molecular polarity. Specifically, the boiling point of R1233ZD(E) is approximately 18.3°C, while that of R1233ZD(Z) is approximately 38°C.

[0060] Specifically, in one embodiment, the adjustment baffle 420 can be a movable plate structure separately arranged in the sub-chamber body 400. Specifically, the adjustment baffle 420 is provided with a flange (not shown in the figure), the flange is provided with a fixing hole (not shown in the figure), and the side wall of the sub-chamber body 400 is provided with an adjustment groove (not shown in the figure) arranged in a straight line (along the direction toward or away from the telescopic cavity 410). The fastener (not shown in the figure) can be sequentially passed through the fixing hole and the adjustment groove to fix the adjustment baffle 420 at any position of the adjustment groove, thereby realizing the adjustment of the maximum expansion space of the telescopic cavity 410 in the sub-chamber body 400.

[0061] In another embodiment, the adjustment baffle 420 can be the side wall of the auxiliary chamber body 400 away from the telescopic cavity 410, that is, the side wall of the auxiliary chamber body 400 away from the telescopic cavity 410 is movably arranged relative to the main part of the auxiliary chamber body 400 to form the adjustment baffle 420.

[0062] Furthermore, in one embodiment, if Figure 4As shown, the fully immersed heat dissipation device also includes a power element (not shown), a pressure sensor 600 and a controller (not shown). The pressure sensor 600 is arranged in the telescopic cavity 410. Of course, it can also be located at other positions in the sealed cavity, such as the balance channel part 300 or the main chamber body 200. The connecting line of the pressure sensor 600 is sealed and passed through the inner wall of the sealed cavity and connected to the controller. The power element (which can be a motor or a cylinder or other structure) is arranged on the side of the adjustment baffle 420 away from the telescopic cavity 410. The power element and the pressure sensor 600 are electrically connected to the controller respectively. The controller can control the power element to drive the adjustment baffle 420 to move toward or away from the telescopic cavity 410 according to the pressure value of the working medium in the sealed cavity measured by the pressure sensor 600, so as to adjust the pressure of the working medium in the sealed cavity, thereby achieving the stability of the working medium pressure, and then avoiding the pressure of the working medium fluctuating with the volume change of the gaseous working medium, that is, controlling the boiling point of the working medium to be stable.

[0063] Specifically, when the power element 100 generates heat and causes the liquid working fluid to vaporize, the pressure in the sealed cavity rises, triggering the pressure sensor 600 to generate a detection signal. After receiving the signal, the controller pushes the regulating baffle 420 away from the telescopic cavity 410 through the power element, thereby increasing the volume of space in the sub-chamber body 400 available for the telescopic cavity 410 to expand. At this time, the gaseous working fluid pushes the liquid working fluid into the expanded telescopic cavity 410, effectively reducing the pressure in the sealed cavity. When the gaseous working fluid condenses and liquefies, causing the pressure to drop, the controller reversely drives the regulating baffle 420 to compress the expansion space, causing the liquid working fluid to flow back to the main chamber body 200 to maintain pressure balance.

[0064] Compared to existing technologies, this solution utilizes a closed-loop control mechanism combining real-time monitoring by pressure sensor 600 and active adjustment of the power element to dynamically compensate for pressure fluctuations during the working fluid's phase change process, overcoming the lag and lack of precision in pressure regulation found in conventional solutions. Furthermore, through this technical solution, the present application ensures that the cooling fluid remains within the saturation pressure range corresponding to its phase change temperature, ensuring that the heat generated by power element 100 can be continuously dissipated through stable latent heat from the phase change, thus avoiding a decrease in heat dissipation efficiency or uncontrolled heat dissipation temperature of power element 100 due to pressure fluctuations.

[0065] To effectively address the high heat generation of power components 100 and the limited cooling capacity of existing single-phase or two-phase immersion cooling systems, we employ dual-flow enhancement (natural convection generated by the cooling and heating effect combined with forced convection via the jet tube assembly 800). This significantly improves the cooling of localized hot spots (heating surface 110 of power component 100). Using natural convection alone, the heat transfer coefficient (measured in W / cm²×K) of heating surface 110 of power component 100 is limited to 0.6 W / (cm²×K) to 1.3 W / (cm²×K), with a critical heat flux density (measured in W / cm²) of approximately 12 W / cm². However, surface treatment and the addition of fins to heating surface 110 of power component 100 can increase the heat transfer coefficient by 3 to 5 times, reaching 2 W / (cm²×K) to 4 W / (cm²×K), with a critical heat flux density ranging from 20 W / cm² to 50 W / cm². Whether using natural convection or surface treatment and finning of the heat-generating surface 110 of the power element 100 , the heat transfer coefficient is still far from the required 300W / (cm²×K). If the target chip we designed (with a heat flux density of 2500W / cm²) is immersed in the working fluid, it will not be able to meet the heat dissipation requirements.

[0066] Therefore, in one embodiment, if Figures 1-4 As shown, the fully immersed heat sink further includes a second liquid pump 700 and a spray tube assembly 800. Both the second liquid pump 700 and the spray tube assembly 800 are disposed within the main chamber 200. Furthermore, a power cord for the second liquid pump 700 is sealed and passed through the inner wall of the main chamber 200 for connection to an external power source. The second liquid pump 700 is capable of driving the spray tube assembly 800 to spray liquid working medium toward the heat-generating surface 110 of the power element 100, thereby forming a liquid flow on the heat-generating surface 110 of the power element 100.

[0067] It should be noted that if the second liquid pump 700 is used to perform a large-scale disturbance on the liquid working medium in the entire main chamber body 200, the heat dissipation enhancement effect on the power element 100 is relatively limited. However, the present application uses the second liquid pump 700 to drive the injection tube group 800 to inject the liquid working medium toward the heating surface 110 of the power element 100, which can greatly increase the heat transfer coefficient, which can reach 300W / (cm²×K) after optimization.

[0068] Specifically, when the power element 100 generates heat, and when the phase change of the working fluid reaches a certain level (this is very important; if the jet starts too early, the phase change will be delayed. The heating surface 110 must be much higher than the boiling point to produce phase change cooling. Before this, it will be single-phase liquid cooling without phase change, and the heat transfer coefficient is smaller than the phase change), the second liquid pump 700 starts and extracts the liquid working fluid from the main chamber 200, and sprays the liquid working fluid at a specific flow rate onto the surface of the heating surface 110 through the injection pipe assembly 800. After impacting the heating surface 110, the liquid working fluid forms a flowing liquid film covering the entire heating surface 110. During the flow, the liquid working fluid absorbs heat and undergoes phase change and vaporization. At the same time, the flowing liquid film continuously removes bubbles accumulated near the heating surface 110, avoiding the formation of local overheating areas.

[0069] Compared with the prior art, this solution not only enhances the convective heat transfer efficiency by forming a forced liquid flow through active injection, but also destroys the air film layer through fluid shear force, so that the liquid working medium always maintains full contact with the heating surface 110.

[0070] Furthermore, in one embodiment, if Figures 1-4 As shown, there are multiple power elements 100, and the multiple power elements 100 are arranged at intervals in the main chamber body 200. The injection pipe group 800 includes a main pipe 810, a branch pipe 820 and a nozzle 830. One end of the main pipe 810 is connected to the second liquid pump 700, and the other end is connected to each branch pipe 820 respectively. The nozzle 830 is arranged at the end of the corresponding branch pipe 820 away from the main pipe 810. Each power element 100 is provided with at least one nozzle 830, so that the liquid working medium passes through the main pipe 810, the branch pipe 820 and the nozzle 830 in sequence and is sprayed onto the heating surface 110 of the corresponding power element 100.

[0071] Specifically, multiple power elements 100 are arranged at intervals in the main chamber 200. After the second liquid pump 700 is started, it drives the liquid working medium into the main pipe 810. The main pipe 810 diverts the working medium to each branch pipe 820. The nozzle 830 at the end of each branch pipe 820 directly sprays the working medium onto the heating surface 110 of the corresponding power element 100. Since each power element 100 is equipped with at least one independent nozzle 830, the coverage range of the working medium injection corresponds to the spatial distribution of the power element 100, thereby ensuring that all heating areas can obtain directional cooling. When the heat load of some power elements 100 is high, the corresponding nozzle 830 can achieve local enhanced heat dissipation by increasing the injection flow rate.

[0072] Compared with the existing technology, the present application realizes directional spray cooling of multiple power elements 100, avoiding local overheating caused by heat load differences. At the same time, it maintains the dynamic balance of the working fluid pressure in the sealed cavity through an independent liquid supply path, so that the phase change heat dissipation process can continue in a stable pressure environment.

[0073] Furthermore, in one embodiment, if Figure 5 As shown, the nozzle 830 is provided with a plurality of nozzle holes 831 distributed in an array, and the spraying direction of the nozzle holes 831 is perpendicular to the heating surface 110 of the power element 100, or the spraying direction of the nozzle holes 831 is inclined relative to the heating surface 110 of the power element 100.

[0074] Specifically, when the second liquid pump 700 drives the liquid working medium into the injection pipe group 800, the liquid working medium is diverted to each branch pipe 820 through the main pipe 810, and finally ejected from the array nozzle 831 of the nozzle 830. When the nozzle 831 is set vertically, the liquid working medium directly impacts the heating surface 110 of the power element 100, forming a high-flow liquid film coverage area; when the nozzle 831 is set at an angle, the liquid working medium flows tangentially along the heating surface 110, flushing the bubbles attached to the heating surface 110 and accelerating their detachment. The array-distributed nozzles 831 can cover different positions of the heating surface 110 to avoid local overheating due to blind injection areas.

[0075] Compared with the existing technology, the present application solves the problem of reduced heat dissipation efficiency of high-density power components 100 due to uneven spray coverage. The array-type spray holes 831 and the adjustable spray direction are used to achieve uniform distribution of the liquid working medium, ensuring that each area of ​​the heating surface 110 can remove heat through the liquid flow, while accelerating the detachment of bubbles to maintain a stable phase change heat dissipation environment.

[0076] When power element 100 is a chip, a flow rate of 10L / min-20L / min provided by nozzle assembly 800 is sufficient. This is because chips occupy very little space, and using a nozzle head 830 with multiple nozzles, the jet velocity of nozzle head 830 can quickly exceed 1m / s-2m / s. Furthermore, it can also take into account the cooling of other surfaces of the chip package heat sink substrate, such as the four sidewalls, so that they can effectively participate in heat exchange, which is also a key point of the immersion phase change cooling of this application.

[0077] It should be noted that the second liquid pump 700 can be arranged in the main chamber body 200 or the sub-chamber body 400. When the second liquid pump 700 is arranged in the sub-chamber body 400, the sub-chamber body 400 can be divided into a space for accommodating the telescopic cavity 410 and a space for accommodating the second liquid pump 700, and the two spaces of the sub-chamber body 400 are separated, but the space of the sub-chamber body 400 accommodating the second liquid pump 700 and the main chamber body 200 remain connected.

[0078] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

[0080] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0082] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0083] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0084] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0085] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are intended only to describe specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

Claims

1. A fully immersed heat dissipation device, characterized in that: Used to dissipate heat for one or more power elements (100), the fully immersed heat dissipation device comprises a main chamber body (200), a balancing channel portion (300), a telescopic cavity (410), and a condensing assembly (500), wherein the balancing channel portion (300) is connected to the main chamber body (200) and the telescopic cavity (410), and the main chamber body (200), the balancing channel portion (300), and the telescopic cavity (410) are defined as being connected to form a sealed cavity free of non-condensable gas; The sealed cavity is filled with liquid working medium, and at least the heating surface (110) of the power element (100) is immersed in the liquid working medium. The condensation component (500) is provided with a condensation surface (511), and the condensation surface (511) is arranged at the upper end of the main chamber body (200). When the liquid working medium in the sealed cavity is vaporized, the gaseous working medium can press the liquid working medium in the main chamber body (200) into the telescopic cavity (410) through the balancing channel part (300) and cause the telescopic cavity (410) to expand. When the gaseous working medium rises and contacts the condensation surface (511), the gaseous working medium can be liquefied into liquid working medium, and the liquid working medium in the telescopic cavity (410) can enter the main chamber body (200) through the balancing channel part (300).

2. The fully immersed heat dissipation device according to claim 1, characterized in that: It also includes a sub-chamber body (400), the telescopic cavity (410) is installed in the sub-chamber body (400), the sub-chamber body (400) is connected to the external space, and the sub-chamber body (400) is a rigid structure.

3. The fully immersed heat dissipation device according to claim 2, characterized in that: The auxiliary chamber body (400) is provided with an adjustment baffle (420), and the adjustment baffle (420) can be movably adjusted in a direction close to or away from the telescopic cavity (410) to increase or decrease the maximum expansion space of the telescopic cavity (410) in the auxiliary chamber body (400).

4. The fully immersed heat dissipation device according to claim 3, characterized in that: The invention also includes a power element, a pressure sensor (600) and a controller, wherein the pressure sensor (600) is arranged in the sealed cavity, and the power element is arranged on a side of the regulating baffle (420) away from the telescopic cavity (410). The controller can control the power element to drive the regulating baffle (420) to move toward or away from the telescopic cavity (410) according to the pressure value of the working medium in the sealed cavity measured by the pressure sensor (600), so as to adjust the pressure of the working medium in the sealed cavity.

5. The fully immersed heat dissipation device according to claim 2, characterized in that: The main chamber body (200) and the auxiliary chamber body (400) are distributed along the same horizontal plane, or the main chamber body (200) and the auxiliary chamber body (400) are distributed along the same vertical direction.

6. The fully immersed heat dissipation device according to claim 1, characterized in that: The invention also includes a second liquid pump (700) and a spray tube group (800), wherein the second liquid pump (700) and the spray tube group (800) are both arranged in the main chamber body (200), and the second liquid pump (700) can drive the spray tube group (800) to spray liquid working medium toward the heating surface (110) of the power element (100), so that the liquid working medium forms a liquid flow on the heating surface (110) of the power element (100).

7. The fully immersed heat dissipation device according to claim 6, characterized in that: There are a plurality of power elements (100), and the plurality of power elements (100) are arranged at intervals in the main chamber body (200). The injection pipe group (800) comprises a main pipe (810), a branch pipe (820), and a nozzle (830). One end of the main pipe (810) is connected to the second liquid pump (700), and the other end is connected to each of the branch pipes (820). The nozzle (830) is arranged at an end of the branch pipe (820) away from the main pipe (810). Each power element (100) is provided with at least one nozzle (830), so that the liquid working medium can be sequentially sprayed onto the heating surface (110) of the corresponding power element (100) through the main pipe (810), the branch pipe (820), and the nozzle (830).

8. The fully immersed heat dissipation device according to claim 7, characterized in that: The nozzle (830) is provided with a plurality of spray holes (831) distributed in an array, and the spray direction of the spray holes (831) is perpendicular to the heating surface (110) of the power element (100), or the spray direction of the spray holes (831) is arranged at an angle relative to the heating surface (110) of the power element (100).

9. The fully immersed heat dissipation device according to claim 1, characterized in that: The telescopic cavity (410) is a flexible structure with a built-in reset spring, and the elastic coefficient of the reset spring is a constant value; Alternatively, the telescopic cavity (410) is an elastic bag or a bellows; Alternatively, the vertical height of the telescopic cavity (410) is greater than the vertical height of the main chamber body (200), and the liquid working medium in the telescopic cavity (410) can flow back into the main chamber body (200) by gravity.

10. The fully immersed heat dissipation device according to claim 1, characterized in that: The power element (100) is embedded in the bottom wall or side wall of the main chamber body (200), the heating surface (110) of the power element (100) is exposed in the main chamber body (200) and completely immersed in the liquid working medium of the main chamber body (200), and the external terminal of the power element (100) is located outside the main chamber body (200); Alternatively, the power element (100) is completely immersed in the main chamber body (200), and the connection wires of the power element (100) are sealed and passed through the inner wall of the main chamber body (200).

11. The fully immersed heat dissipation device according to claim 1, characterized in that: The distance A between the top surface of the inner wall of the condensation component (500) and the main chamber body (200) satisfies 1mm≤A≤5mm.

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