Thermal management system for battery pack and control method thereof, energy storage system

Abstract

The application relates to the technical field of energy storage, and particularly provides a heat management system for a battery pack, a control method of the heat management system and an energy storage system, and aims to solve the problem of poor heat management effect caused by high energy consumption of an existing heat management system. The heat management system comprises a battery pack, a phase-change heat pipe assembly and a semiconductor temperature control assembly. The phase-change heat pipe assembly has a first heat exchange end and a second heat exchange end. The first heat exchange end is arranged adjacent to the battery pack and is used for heat exchange with the battery pack. The semiconductor temperature control assembly is arranged adjacent to the second heat exchange end and can exchange heat with the second heat exchange end. The heat management system further comprises a temperature detection member which is used for detecting the temperature in the battery pack and is in communication connection with the semiconductor temperature control assembly. The application can cool the battery pack through the semiconductor temperature control assembly when the temperature in the battery pack is too high, and can heat the battery pack through the semiconductor temperature control assembly when the temperature in the battery pack is too low, so that the heat management is more intelligent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of energy storage, and specifically provides a heat management system for a battery pack, a control method thereof, and an energy storage system. BACKGROUND

[0002] In the prior art, a liquid cooling unit is usually used to perform heat management on a battery pack. Specifically, a liquid cooling plate is arranged at the bottom of a battery cell, a cooling liquid flow channel is arranged in the liquid cooling plate, the liquid cooling plate is connected with a liquid cooling main machine through a liquid cooling pipeline to form a liquid cooling loop, and the cooling liquid circulates in the liquid cooling loop under the driving action of the compressor. By controlling the temperature or flow rate of the cooling liquid, heat exchange with the battery cell is achieved, and the temperature of the battery cell body is indirectly controlled.

[0003] Since the liquid cooling unit uses the liquid cooling main machine as the power source of the heat management system, the energy consumption is high. In addition, during the heat management of the battery pack, condensation is prone to occur on the part of the liquid cooling plate in contact with the battery pack, thereby affecting the use safety of the battery pack and leading to poor heat management effect of the battery.

[0004] In addition, although the liquid cooling unit can effectively perform heat management on the battery pack, the battery pack still has the risk of fire caused by thermal runaway, resulting in poor safety of the energy storage system. SUMMARY

[0005] The present application aims to at least partially solve the above technical problems, i.e., at least partially solve the problem of poor heat management effect of the existing heat management system due to high energy consumption and low safety.

[0006] In a first aspect, the present application provides a heat management system for a battery pack, which comprises a battery pack, a phase change heat pipe assembly, and a semiconductor temperature control assembly. The phase change heat pipe assembly is encapsulated with a phase change working medium. The phase change heat pipe assembly has a first heat exchange end and a second heat exchange end. The first heat exchange end is arranged adjacent to the battery pack and is used for heat exchange with the battery pack. The semiconductor temperature control assembly is arranged adjacent to the second heat exchange end and can exchange heat with the second heat exchange end. The heat management system further comprises a temperature detection member for detecting the temperature in the battery pack. The temperature detection member is communicatively connected with the semiconductor temperature control assembly.

[0007] In the preferred technical scheme of the heat management system for the battery pack, the semiconductor temperature control assembly comprises a semiconductor element, a heat sink and a heat dissipation fan, the semiconductor element is arranged adjacent to the second heat exchange end, the heat sink is arranged on a side of the semiconductor element away from the second heat exchange end, the heat sink is used for dissipating heat of the semiconductor element, and the heat dissipation fan is used for accelerating air flow speed around the second heat exchange end; wherein the temperature detection member is in communication connection with the semiconductor element and the heat dissipation fan.

[0008] In the preferred technical scheme of the heat management system for the battery pack, the heat sink is provided with a mounting groove matched with the semiconductor element, and the semiconductor element is mounted in the mounting groove; and / or the number of semiconductor elements is multiple, and the multiple semiconductor elements are distributed along the length direction of the second heat exchange end.

[0009] In the preferred technical scheme of the heat management system for the battery pack, the heat management system further comprises a heat exchange plate and a cover, the heat exchange plate comprises a first plate body and a second plate body connected with each other, the cover is connected with the first plate body to form a containing space, the battery pack is arranged in the containing space, the phase change heat pipe assembly is arranged on the heat exchange plate, the first heat exchange end is formed on the first plate body, the second heat exchange end is formed on the second plate body, and the semiconductor temperature control assembly is connected with the second plate body; wherein the phase change heat pipe assembly comprises an L-shaped heat pipe and / or a loop heat pipe.

[0010] In the preferred technical scheme of the heat management system for the battery pack, the phase change heat pipe assembly comprises an L-shaped heat pipe and a loop heat pipe, the L-shaped heat pipe comprises an L-shaped channel formed in the heat exchange plate and a first phase change working medium encapsulated in the L-shaped channel, wherein: the heat exchange plate is provided with a loop channel, the loop heat pipe comprises a loop pipeline and a second phase change working medium encapsulated in the loop pipeline, the loop pipeline is arranged in the loop channel, and the loop heat pipe is arranged to drive the second phase change working medium to circulate in the loop pipeline; or the loop heat pipe comprises a first pipe segment, a second pipe segment and a second phase change working medium formed in the heat exchange plate, the first pipe segment and the second pipe segment are sequentially communicated to form a loop pipeline, the second phase change working medium is encapsulated in the loop pipeline, and the loop heat pipe is arranged to drive the second phase change working medium to circulate in the loop pipeline.

[0011] In the preferred technical solutions of the above heat management system for the battery pack, the loop heat pipe further comprises an evaporator, two ends of the loop pipe are in communication with an inlet and an outlet of the evaporator to form a circulation loop, and the evaporator is configured to vaporize the phase change working medium to drive the phase change working medium to circulate in the circulation loop; and / or, the loop heat pipe further comprises a wick arranged in the loop pipe, and the wick is configured to drive the second phase change working medium to circulate in the loop pipe; and / or, the filling rate of the first phase change working medium in the L-shaped channel is 40% to 70%; and / or, the filling rate of the second phase change working medium in the loop pipe is 50% to 70%.

[0012] In the preferred technical solutions of the above heat management system for the battery pack, the heat exchange plate further comprises a bending plate arranged between the first plate body and the second plate body, wherein: the L-shaped channel comprises an evaporation channel arranged in the first plate body, a bending channel arranged in the bending plate, and a condensation channel arranged in the second plate body; and / or, the loop channel comprises a first channel, a bending avoiding hole, and a second channel arranged one by one, the first channel is arranged in the first plate body, the bending avoiding hole is arranged on the bending plate, and the second channel is arranged in the second plate body, and the number of the loop channels is at least two; and / or, the number of the L-shaped channels and the loop channels is multiple, and the L-shaped channels and the loop channels are arranged alternately on the heat exchange plate along a direction perpendicular to the L-shaped channels; and / or, the L-shaped channel is provided with a capillary structure, the capillary structure comprises a protruding structure arranged on the inner wall of the L-shaped channel, the protruding structure extends along the axis direction of the L-shaped channel, the number of the protruding structures is multiple, and the multiple protruding structures are arranged along the circumference of the L-shaped channel; or, the capillary structure comprises a gas channel and a liquid channel, the gas channel and the liquid channel extend along the length direction of the L-shaped channel, the number of the liquid channels is multiple, and the multiple liquid channels are distributed along the circumference of the gas channel, and the gas channel and the liquid channel are communicated through a hole; and / or, the heat exchange plate is further provided with a weight reduction channel, the number of the weight reduction channels is multiple, and the L-shaped channels, the weight reduction channels, and the loop channels are arranged alternately on the heat exchange plate along a direction perpendicular to the L-shaped channels; and / or, the flow area of the weight reduction channel on the heat exchange plate is greater than the flow area of the L-shaped channel.

[0013] In the preferred technical solution of the heat management system for the battery pack, the L-shaped channel comprises a connected evaporation channel and condensation channel, the evaporation channel and the first pipe section are arranged on the first plate body, and the condensation channel and the second pipe section are arranged on the second plate body, wherein: the first pipe section comprises a plurality of first U-shaped pipes, the second pipe section comprises a plurality of second U-shaped pipes, the first U-shaped pipes and the second U-shaped pipes are sequentially connected end to end, at least part of the evaporation channel of the L-shaped channel is arranged on the inner side of the first U-shaped pipe and the connected condensation channel is arranged between the adjacent two second U-shaped pipes; and / or, at least part of the evaporation channel of the L-shaped channel is arranged between the adjacent two first U-shaped pipes and the connected condensation channel is arranged on the inner side of the second U-shaped pipe; and / or, the first pipe section is arranged in a bent manner on the first plate body and forms a plurality of first U-shaped pipes sequentially connected end to end, the second pipe section is arranged in a bent manner on the second plate body and forms a plurality of second U-shaped pipes sequentially connected end to end, the openings of the first U-shaped pipes are arranged opposite to the openings of the second U-shaped pipes, and the evaporation channel of the L-shaped channel is arranged on the inner side of the first U-shaped pipe and the connected condensation channel is arranged on the inner side of the second U-shaped pipe.

[0014] In the preferred technical solution of the heat management system for the battery pack, the phase change heat pipe assembly further comprises an adjusting member arranged between the first heat exchange end and the second heat exchange end and used for adjusting the flow of the phase change working medium flowing from the second heat exchange end to the first heat exchange end.

[0015] In the second aspect, the application further provides a control method of a heat management system, the number of battery packs is multiple, and the number of semiconductor temperature control assemblies and phase change heat pipe assemblies is also multiple, and the semiconductor temperature control assemblies and the phase change heat pipe assemblies are arranged in one-to-one correspondence with the battery packs, the semiconductor temperature control assembly comprises a semiconductor element and a cooling fan, the semiconductor element is arranged to heat the corresponding second heat exchange end when it is in a heating mode and to cool the corresponding second heat exchange end when it is in a cooling mode, and the cooling fan is used to cool the corresponding second heat exchange end, the control method comprises the following steps: obtaining the current temperature Tn of each battery pack; determining the highest temperature Tmax of the battery pack according to the current temperature Tn of each battery pack; comparing the highest temperature Tmax with a first preset temperature T1 and a second preset temperature T2; and selectively adjusting the working mode of each semiconductor temperature control assembly according to the comparison result; wherein n≥2, 0

[0016] In the preferred technical scheme of the control method of the thermal management system, if Tmax>T1, the semiconductor elements corresponding to all the battery packs are adjusted to the cooling mode, and the heat dissipation fans corresponding to all the battery packs are turned on.

[0017] In the preferred technical scheme of the control method of the thermal management system, the thermal management system has air inlets arranged one-to-one corresponding to the battery packs, and the heat dissipation fans are used to introduce the airflow at the air inlets into the surroundings of the second heat exchange end to cool the second heat exchange end. The step of selectively adjusting the working mode of each semiconductor temperature control assembly according to the comparison result specifically includes: if T2

[0018] In the preferred technical scheme of the control method of the thermal management system, the step of selectively adjusting the working mode of each semiconductor temperature control assembly according to the temperature difference AT specifically includes: comparing the temperature difference AT with a preset temperature difference AT0; if AT>AT0, determining the battery packs that need to be cooled according to the current temperature Tn and the minimum temperature Tmin of each battery pack, and recording the battery packs as a second group of battery packs; turning on the heat dissipation fans corresponding to the second group of battery packs; and / or if AT≤AT0, turning on the heat dissipation fans corresponding to all the battery packs.

[0019] In the preferred technical scheme of the control method of the thermal management system, the step of determining the battery packs that need to be cooled according to the current temperature Tn and the minimum temperature Tmin of each battery pack specifically includes: comparing the current temperature Ti of the i-th battery pack with Tmin+AT0; if Ti≥Tmin+AT0, determining the i-th battery pack as the battery pack that needs to be cooled; and 0

[0020] In the preferred technical scheme of the control method of the thermal management system, when ΔT≤ΔT0, the control method further comprises the following steps: further comparing the maximum temperature Tmax with a fourth preset temperature T4 and a fifth preset temperature T5; and determining the working gear of the heat dissipation fan according to the comparison result; 0

[0021] In the preferred technical scheme of the control method of the thermal management system, the step of determining the working gear of the heat dissipation fan according to the comparison result specifically comprises: if T4

[0022] In the preferred technical scheme of the control method of the thermal management system, the step of selectively adjusting the working mode of each semiconductor temperature control component according to the comparison result specifically comprises: if Tmax≤T2, further determining the minimum temperature Tmin of each battery pack according to the current temperature Tn of the battery pack; determining the temperature difference ΔT according to the maximum temperature Tmax and the minimum temperature Tmin; and selectively adjusting the working mode of each semiconductor temperature control component according to the temperature difference ΔT.

[0023] In the preferred technical scheme of the control method of the thermal management system, the step of selectively adjusting the working mode of each semiconductor temperature control component according to the temperature difference ΔT specifically comprises: comparing the temperature difference ΔT with a preset temperature difference ΔT0; if ΔT>ΔT0, determining the battery pack that needs to be heated according to the current temperature Tn of each battery pack and the maximum temperature Tmax, and recording the battery pack as a third group of battery packs; adjusting the semiconductor element corresponding to the third group of battery packs to a heating mode; and / or if ΔT≤ΔT0, further comparing the maximum temperature Tmax with a third preset temperature T3; if Tmax>T3, not adjusting the working mode of each semiconductor temperature control component; and if Tmax≤T3, adjusting the semiconductor element corresponding to all the battery packs to a heating mode.

[0024] In the preferred technical scheme of the control method of the thermal management system, the step of determining the battery pack needing heating according to the current temperature Tn of each battery pack and the maximum temperature Tmax specifically comprises: comparing the current temperature Tj of the jth battery pack with Tmax-△T0; if Tj≤Tmax-△T0, the jth battery pack is determined as the battery pack needing heating; wherein 0<j≤n.

[0025] In the preferred technical scheme of the control method of the thermal management system, the step of adjusting the semiconductor element to the cooling mode specifically comprises: forward energizing the semiconductor element; and the step of adjusting the semiconductor element to the heating mode specifically comprises: reverse energizing the semiconductor element.

[0026] In a third aspect, the present application further provides an energy storage system comprising the thermal management system for battery pack according to any one of the first aspect and the controller configured to perform the control method of the thermal management system according to any one of the second aspect.

[0027] In the preferred technical scheme, the present application can manage the battery pack through the phase change heat pipe assembly, reduce the energy consumption of thermal management, set the semiconductor temperature control assembly, exchange heat with the second heat exchange end to cool or heat the second heat exchange end, thereby facilitating the cooling or heating of the battery pack, set the temperature detection member in communication connection with the liquid storage member, on the one hand, cool the battery pack through the semiconductor temperature control assembly when the temperature in the battery pack is too high, on the other hand, heat the battery pack through the semiconductor temperature control assembly when the temperature in the battery pack is too low, so that the thermal management of the battery pack by the thermal management system is more intelligent.

[0028] Further, the first heat exchange end is formed on the first plate body and the second heat exchange end is formed on the second plate body, so that the temperature of the first heat exchange end and the second heat exchange end is more uniform, avoiding the influence of the local overcooling or overheating of the first heat exchange end or the second heat exchange end on the thermal management effect of the battery pack, and the box cover is connected with the first plate body to form a containing space for accommodating the battery pack, thereby protecting the battery pack.

[0029] Further, by setting the phase change heat pipe assembly to include the L-shaped heat pipe and the loop heat pipe, when the battery pack is in a high-temperature environment, the battery pack is cooled by the L-shaped heat pipe, the first heat exchange end of the L-shaped heat pipe absorbs the heat of the battery pack, and the phase change working medium evaporates and flows to the second heat exchange end, the liquid phase change working medium of the second heat exchange end can flow back to the first heat exchange end under the action of gravity, continuously cooling the battery pack, without driving the phase change working medium to flow; when the battery pack is in a low-temperature environment, the battery pack can be heated by the loop heat pipe, which makes up for the disadvantage that the L-shaped heat pipe cannot heat the battery pack against gravity, and in the case of cooling the battery pack, compared with the single heat pipe form, the L-shaped heat pipe and the loop heat pipe can also be used as backup for each other, avoiding the failure to heat manage the battery pack due to failure.

[0030] Further, by setting the bending plate, the phase change working medium of the second heat exchange end can smoothly flow to the first heat exchange end through the bending channel on the bending plate under the action of gravity, avoiding the phase change working medium to stay between the first plate body and the second plate body, and ensuring the heat exchange stability of the heat pipe assembly; by setting the bending avoiding hole on the bending plate, the annular pipeline can be allowed to pass out of the first channel and then pass into the second channel through the bending avoiding hole, so that the phase change working medium of the second heat exchange end of the loop heat pipe can smoothly flow to the first heat exchange end, and the number of loop channels is set to at least two, which can ensure that the annular pipeline is connected at the head to form a circulating loop.

[0031] Further, by setting the number of L-shaped channels and loop channels to be multiple, the L-shaped channels and loop channels can cover as much of the entire area of the heat exchange plate as possible, so that the heat exchange temperature on the heat exchange plate is more uniform, in addition, by setting the L-shaped channels and loop channels on the heat exchange plate in turn and alternately along a direction perpendicular to the L-shaped channels, when the L-shaped heat pipe or the loop heat pipe works alone, the heat exchange of each area on the heat exchange plate is as uniform as possible, and the heat management effect of the battery pack is improved.

[0032] Further, by setting the protruding structure in the L-shaped channel, the contact area between the inner wall of the L-shaped channel and the phase change working medium is increased, so the interaction between the inner wall of the L-shaped channel and the liquid phase change working medium is enhanced, which can improve the flow rate of the phase change working medium in the L-shaped channel, and in turn improve the rate of the phase change working medium from the first heat exchange end to the second heat exchange end for heat release and then back to the first heat exchange end for heat absorption, which is conducive to improving the overall cooling effect of the battery pack.

[0033] Further, by arranging the capillary core structure in the L-shaped channel, the gaseous phase change working medium and the liquid phase change working medium in the L-shaped channel can flow in different channels respectively, thereby helping the phase change working medium to separate into gas and liquid, improving the heat exchange effect, and meanwhile, arranging the liquid channel to be spaced apart along the circumference of the gas channel can make the liquid channel closer to the pipe wall (lower temperature), which is more conducive to the condensation of the phase change medium, and make the gas channel farther away from the pipe wall (higher temperature), which is more capable of preventing the gaseous phase change working medium from condensing, further improving the heat exchange capacity of the phase change heat pipe assembly.

[0034] Further, by arranging the weight reduction channel, on the one hand, the weight of the heat exchange plate can be reduced, thereby helping to realize the lightweight design of the energy storage system, and on the other hand, the L-shaped channel and the loop channel can be spaced apart through the weight reduction channel, preventing the phase change medium in the L-shaped channel and the loop channel from affecting each other and affecting the heat exchange effect.

[0035] Further, by arranging the adjusting member between the first heat exchange end and the second heat exchange end, the flow of the phase change working medium flowing from the second heat exchange end to the first heat exchange end can be adjusted, thereby the heat exchange amount of the phase change heat exchange device can be adjusted, and further, the problem of excessive cooling of the battery pack can be avoided, and in addition, when the external environment temperature is high, the problem that the second heat exchange end absorbs the heat of the surrounding environment and releases the heat to the first heat exchange end to cause the battery pack to be excessively heated can also be prevented.

[0036] In addition, the control method of the heat management system further provided by the application on the basis of the above-mentioned heat management system for battery packs has the beneficial effects of the above-mentioned heat management system for battery packs, and further, by comparing the highest temperature with the first preset temperature and selectively adjusting the working mode of each semiconductor temperature control assembly according to the comparison result, on the one hand, the problem of heat runaway caused by the high temperature of the battery pack can be avoided, thereby improving the safety of the battery pack heat management, and on the other hand, the problem of excessive temperature deviation of each battery pack affecting the heat management effect of the battery pack can also be avoided.

[0037] In addition, the energy storage system further provided by the application on the basis of the above-mentioned heat management system for battery packs has the beneficial effects of the above-mentioned heat management system for battery packs, and the energy storage system of the application is safer, has lower heat management energy consumption, and has better heat management effect on the battery pack. BRIEF DESCRIPTION OF DRAWINGS

[0038] The preferred embodiments of the application will be described below with reference to the accompanying drawings, in which:

[0039] Figure 1is a perspective structural schematic diagram of one embodiment of the heat management system for a battery pack of the present application;

[0040] Figure 2 is Figure 1 is a structural schematic diagram of the second heat exchange end of the semiconductor temperature control assembly in the middle;

[0041] Figure 3 is Figure 1 is a structural schematic diagram of the structure hidden behind the heat dissipation fan in the middle;

[0042] Figure 4 is Figure 3 is a partial enlarged schematic diagram at A in the middle;

[0043] Figure 5 is a structural schematic diagram of another embodiment of the heat management system for a battery pack of the present application, wherein a structural schematic diagram of the semiconductor temperature control assembly hidden behind is shown;

[0044] Figure 6 is a structural schematic diagram of one embodiment of the heat exchange plate of the present application;

[0045] Figure 7 is Figure 6 is a sectional view along the line C-C, wherein a structural schematic diagram of the internal structure of one embodiment of the heat exchange plate is shown;

[0046] Figure 8 is Figure 6 is a sectional view along the line C-C, wherein a structural schematic diagram of the internal structure of another embodiment of the heat exchange plate is shown;

[0047] Figure 9 is Figure 8 is a partial enlarged schematic diagram at D in the middle;

[0048] Figure 10 is a structural schematic diagram of the internal section of yet another embodiment of the heat exchange plate of the present application;

[0049] Figure 11 is a structural schematic diagram of the heat exchange plate and phase-change heat pipe assembly of one embodiment of the present application;

[0050] Figure 12 is a structural schematic diagram of the heat exchange plate and phase-change heat pipe assembly of another embodiment of the present application;

[0051] Figure 13 is a structural schematic diagram of the heat exchange plate and phase-change heat pipe assembly of yet another embodiment of the present application;

[0052] Figure 14 is a right view structural schematic diagram of yet another embodiment of the heat management system for a battery pack of the present application;

[0053] Figure 15 is a flow chart of a control method of the thermal management system of the present application;

[0054] Figure 16 is a flow chart of an embodiment of the control method of the thermal management system of the present application.

[0055] List of reference signs:

[0056] 1, battery pack; 21, first heat exchange end; 22, second heat exchange end; 23, wick; 24, evaporator; 25, annular pipeline; 251, first pipe section; 252, second pipe section; 3, semiconductor temperature control assembly; 31, semiconductor element; 32, heat sink; 321, mounting groove; 33, heat dissipation fan; 4, heat exchange plate; 40, containing space; 41, first plate body; 411, evaporation channel; 412, first channel; 42, second plate body; 421, condensation channel; 422, second channel; 43, bending plate; 431, bending channel; 432, bending avoiding hole; 433, air inlet; 44, L-shaped channel; 45, loop channel; 46, weight-reducing channel; 471, gas channel; 472, liquid channel; 473, hole; 48, protruding structure; 5, box cover; 6, adjusting member; 7, liquid reservoir. DETAILED DESCRIPTION

[0057] The preferred embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the protection scope of the present application.

[0058] It should be noted that in the description of the present application, the terms "upper", "lower", "inner", "outer" and the like indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings, which is only for the convenience of description, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0059] In addition, it should also be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "setting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0060] Based on the problem that the existing thermal management system for battery pack mentioned in the background art has poor thermal management effect due to high energy consumption and low use safety, the present application provides a thermal management system for battery pack in the first aspect.

[0061] Referring to Figures 1 to 4 As Figures 1 to 4 shown, the heat management system for the battery pack 1 of the present application comprises the battery pack 1, a phase change heat pipe assembly and a semiconductor temperature control assembly 3, the phase change heat pipe assembly is encapsulated with a phase change working medium, the phase change heat pipe assembly has a first heat exchange end 21 and a second heat exchange end 22, the first heat exchange end 21 is arranged adjacent to the battery pack 1 and is used for heat exchange with the battery pack 1, and the semiconductor temperature control assembly 3 is arranged adjacent to the second heat exchange end 22 and is used for heat exchange with the second heat exchange end 22.

[0062] The heat management system further comprises a temperature detection member (not shown in the figure), which is used for detecting the temperature in the battery pack 1 and is in communication connection with the semiconductor temperature control assembly 3, so as to selectively cause the semiconductor temperature control assembly 3 to heat or cool the second heat exchange end 22 according to the detection data of the temperature detection member.

[0063] Through such a setting, the battery pack 1 can be heat managed by the phase change heat pipe assembly, and the energy consumption of heat management is reduced. By arranging the semiconductor temperature control assembly 3, the second heat exchange end 22 can be cooled or heated by heat exchange between the semiconductor temperature control assembly 3 and the second heat exchange end 22, so as to facilitate cooling or heating of the battery pack 1. By arranging the temperature detection member in communication connection with the liquid storage member, on the one hand, the battery pack 1 can be cooled by the semiconductor temperature control assembly 3 when the temperature in the battery pack 1 is too high, and on the other hand, the battery pack 1 can be heated by the semiconductor temperature control assembly 3 when the temperature in the battery pack 1 is too low, so that the heat management of the battery pack 1 by the heat management system is more intelligent.

[0064] It should be noted that in actual application, the temperature detection member can be arranged as a temperature sensor or a thermometer, or can also be arranged as an infrared sensor, etc. Such adjustment and change of the specific type of the temperature detection member do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0065] Preferably, the temperature detection member is a temperature sensor arranged in the battery pack 1.

[0066] It should be noted that in actual application, the specific setting structure of the semiconductor temperature control assembly 3 is not limited by those skilled in the art, as long as it can exchange heat with the second heat exchange end 22. For example, the semiconductor temperature control assembly 3 can be set as a semiconductor element 31 and a heat sink 32, which heats or cools the second heat exchange end 22 through the semiconductor element 31, or the semiconductor temperature control assembly 3 can be set as a semiconductor element 31, a heat sink 32 and a cooling fan 33, the semiconductor element 31 is arranged adjacent to the second heat exchange end 22, the heat sink 32 is arranged on the side of the semiconductor element 31 away from the second heat exchange end 22, the heat sink 32 is used to cool the semiconductor element 31, and the cooling fan 33 is used to accelerate the air flow rate around the second heat exchange end 22, and the like. Such adjustment and change of the specific setting type of the semiconductor temperature control assembly 3 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0067] Preferably, as shown in Figures 1 to 4 The semiconductor temperature control assembly 3 includes a semiconductor element 31, a heat sink 32 and a cooling fan 33, the semiconductor element 31 is arranged adjacent to the second heat exchange end 22, the heat sink 32 is arranged on the side of the semiconductor element 31 away from the second heat exchange end 22, the heat sink 32 is used to cool the semiconductor element 31, and the cooling fan 33 is used to accelerate the air flow rate around the second heat exchange end 22, wherein the temperature detection member is in communication connection with the semiconductor element 31 and the cooling fan 33.

[0068] Through such a setting, the second heat exchange end 22 can be cooled by the semiconductor element 31 to quickly cool the second heat exchange end 22, and the second heat exchange end 22 can be cooled by the cooling fan 33 to improve the cooling efficiency and cooling accuracy of the second heat exchange end 22.

[0069] Specifically, the semiconductor element 31 has a cold end and a hot end, in the case of needing to cool the battery pack 1, when the semiconductor element 31 is forward powered, the side of the semiconductor element 31 close to the second heat exchange end 22 is the cold end, and the end of the semiconductor element 31 close to the heat sink 32 is the hot end. When the semiconductor element 31 is forward powered, the cold end of the semiconductor element 31 absorbs the heat around it, so that the temperature of the second heat exchange end 22 decreases, and the heat sink 32 timely leads out the large amount of heat generated by the hot end, avoiding the heat accumulation to reduce the cooling efficiency of the semiconductor element 31, which helps the gaseous phase change working medium in the second heat exchange end 22 to condense, thereby improving the cooling efficiency of the phase change heat pipe assembly on the battery pack 1.

[0070] In the case where the battery needs to be heated, when the semiconductor element 31 is reversely electrified, the side of the semiconductor element 31 close to the second heat exchange end 22 is the hot end, and the end of the semiconductor element 31 close to the heat sink 32 is the cold end. The cold end of the semiconductor element 31 absorbs the heat from the surroundings, and the heat is conducted out through the hot end, so that the hot end of the semiconductor element 31 heats the second heat exchange end 22, which helps the phase change working medium in the second heat exchange end 22 to be vaporized. The gaseous phase change working medium flows to the first heat exchange end 21 and condenses at the first heat exchange end 21, so as to transfer the heat to the battery pack 1, thereby facilitating the heating of the battery pack 1.

[0071] It should be noted that, in actual application, the semiconductor element 31 can be arranged to be mounted on the heat sink 32, or the semiconductor element 31 can be arranged to be capable of being mounted on the surface of the second heat exchange end 22, or the semiconductor element 31 can be arranged to be capable of being mounted between the heat sink 32 and the second heat exchange end 22, and the like. The adjustment and change of the specific mounting mode between the semiconductor element 31 and the heat sink 32 and the second heat exchange end 22 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0072] Preferably, as shown in the drawings, the heat sink 32 is provided with a mounting groove 321 matched with the semiconductor element 31, and the semiconductor element 31 is mounted in the mounting groove 321. Figure 3

[0073] Through such an arrangement, the installation and fixation of the semiconductor element 31 can be facilitated, and the installation stability of the semiconductor element 31 can be improved.

[0074] It should be noted that the present application does not limit the specific mounting mode of the semiconductor element 31 in the mounting groove 321. For example, the semiconductor element 31 can be arranged to be pasted in the mounting groove 321 by thermal conductive glue, or the semiconductor element 31 can be arranged to be clamped in the mounting groove 321, or the semiconductor element 31 can be arranged to be fixed in the mounting groove 321 by fasteners, and the like. The adjustment and change of the specific mounting mode of the semiconductor element 31 in the mounting groove 321 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0075] Exemplarily, the semiconductor element 31 is pasted in the mounting groove 321 by thermal conductive glue.

[0076] ​It should be noted that in actual application, the number of semiconductor elements 31 can be set to one only, or can be set to two, or can be set to multiple, and the like, and the adjustment and change of the specific number of semiconductor elements 31 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0077] Preferably, as shown in Figure 2 and Figure 3 , the number of semiconductor elements 31 is multiple and the multiple semiconductor elements 31 are distributed along the length direction of the second heat exchange end 22.

[0078] By setting the number of semiconductor elements 31 to multiple, heat exchange with different positions of the second heat exchange end 22 can be more effective, and the heat exchange effect between the first heat exchange end 21 and the battery pack 1 due to uneven heat exchange with the second heat exchange end 22 can be avoided.

[0079] It should be noted that in actual application, the present application does not make any limitation on the connection mode between the heat sink 32 and the second heat exchange end 22, as long as the heat sink 32 can be fixed on the second heat exchange end 22.

[0080] In one specific embodiment, the heat sink 32 is fixedly connected with the second heat exchange end 22.

[0081] Specifically, the heat sink 32 can be arranged to be fixedly connected with the second heat exchange end 22 by fasteners, or the heat sink 32 can be arranged to be snap-connected or plug-connected with the second heat exchange end 22.

[0082] In another specific embodiment, the heat sink 32 is integrally arranged with the second heat exchange end 22.

[0083] In another possible embodiment, heat-conducting glue is further arranged between the heat sink 32 and the second heat exchange end 22, and the heat sink 32 and the second heat exchange end 22 are adhesively connected by the heat-conducting glue.

[0084] It should be noted that in actual application, the heat dissipation fan 33 can be arranged on the side of the second heat exchange end 22, or can be arranged above the second heat exchange end 22, or can be arranged below the second heat exchange end 22, and the like, and the adjustment and change of the specific arrangement position of the second heat exchange end 22 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0085] Preferably, as shown in Figure 1 , the heat dissipation fan 33 is arranged above the second heat exchange end 22.

[0086] It should be noted that in actual application, the number of heat dissipation fans 33 can be set to one only, or can be set to two, or can be set to multiple, and the like, and such adjustment and change of the specific number of heat dissipation fans 33 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0087] Preferably, as shown in Figure 1 the number of heat dissipation fans 33 is multiple and the multiple heat dissipation fans 33 are arranged at intervals along the length direction of the second heat exchange end 22.

[0088] Through such arrangement, different positions of the second heat exchange end 22 can effectively exchange heat with the surrounding environment, thereby improving the heat exchange uniformity and further improving the thermal management effect on the battery pack 1.

[0089] Next, referring to Figure 5 and Figure 6 , the thermal management system of the present application further comprises a heat exchange plate 4 and a box cover 5, the heat exchange plate 4 comprises a first plate body 41 and a second plate body 42 connected together, the box cover 5 is connected with the first plate body 41 to form a containing space 40, the battery pack 1 is arranged in the containing space 40, the phase change heat pipe assembly is arranged on the heat exchange plate 4, the first heat exchange end 21 is formed on the first plate body 41, the second heat exchange end 22 is formed on the second plate body 42 and the semiconductor temperature control assembly 3 is connected with the second plate body 42, wherein the phase change heat pipe assembly comprises an L-shaped heat pipe and / or a loop heat pipe.

[0090] Through such arrangement, i.e. by forming the first heat exchange end 21 on the first plate body 41 and forming the second heat exchange end 22 on the second plate body 42, the temperature of the first heat exchange end 21 and the second heat exchange end 22 can be more uniform, avoiding affecting the thermal management effect of the battery pack 1 due to local supercooling or overheating of the first heat exchange end 21 or the second heat exchange end 22, and by arranging the box cover 5, the box cover 5 can be connected with the first plate body 41 to form the containing space 40 for accommodating the battery pack 1, thereby playing a role in protecting the battery pack 1.

[0091] It should be noted that in actual application, the phase change heat pipe assembly can be arranged to include only the L-shaped heat pipe, or can be arranged to include only the loop heat pipe, or can be arranged to include the L-shaped heat pipe and the loop heat pipe, and the like, and such adjustment and change of the specific type of the phase change heat pipe assembly do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0092] Preferably, the phase change heat pipe assembly comprises an L-shaped heat pipe and a loop heat pipe.

[0093] By such a setting, that is, by setting the phase change heat pipe assembly to include the L-shaped heat pipe and the loop heat pipe, when the battery pack 1 is in a high-temperature environment, the battery pack 1 is cooled by the L-shaped heat pipe, the first heat exchange end 21 of the L-shaped heat pipe absorbs the heat of the battery pack 1, and the phase change working medium is evaporated and flows to the second heat exchange end 22, the liquid phase change working medium of the second heat exchange end 22 can flow back to the first heat exchange end 21 under the action of gravity, continuously cooling the battery pack 1, without the need to drive the phase change working medium to flow; when the battery pack 1 is in a low-temperature environment, the battery pack 1 can be heated by means of the loop heat pipe, which makes up for the disadvantage that the L-shaped heat pipe cannot heat the battery pack 1 against gravity, and in the case of cooling the battery pack 1, compared with the form of a single heat pipe, the L-shaped heat pipe and the loop heat pipe can also serve as backups for each other, avoiding the failure to heat manage the battery pack 1 due to a fault.

[0094] It should be noted that the present application does not make any limitation on the specific setting form of the L-shaped heat pipe on the heat exchange plate 4, for example, the L-shaped heat pipe can be set as an L-shaped pipeline fixed on the heat exchange plate 4, wherein the L-shaped pipeline is encapsulated with the first phase change working medium, or the L-shaped heat pipe can also be set to include an L-shaped channel 44 formed in the heat exchange plate 4 and the first phase change working medium encapsulated in the L-shaped channel 44.

[0095] Preferably, as shown in Figures 10 to 13 the L-shaped heat pipe is set to include an L-shaped channel 44 formed in the heat exchange plate 4 and the first phase change working medium encapsulated in the L-shaped channel 44.

[0096] It should be noted that the present application does not make any limitation on the specific type of the first phase change working medium filled in the L-shaped channel 44, for example, the first phase change working medium can be set as water, methanol, ethanol, liquid ammonia, acetone, fluorinated hydrocarbon, alkane or a mixed liquid of any two of the above, etc., and such adjustment and change of the specific setting type of the first phase change working medium does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0097] Exemplarily, the first phase change working medium is liquid ammonia.

[0098] Preferably, the first phase change working medium in the L-shaped channel 44 has a filling rate of 40% to 70%. The filling rate is the proportion of the volume of the filled first liquid phase working medium to the total volume of the L-shaped heat pipe.

[0099] It should be noted that the filling rate of the first phase change working medium can be set to 40%, 45%, 50%, 55%, 60%, 65%, 70% or a range formed by any two of them. In some embodiments, the filling rate of the first phase change working medium is 40% to 70%.

[0100] It should be noted that, in practical applications, those skilled in the art do not impose any limitations on the specific arrangement of the loop heat pipe on the heat exchange plate 4. For example, the loop heat pipe can be configured to include an annular pipe 25, with a second phase change working fluid encapsulated within the annular pipe 25, and a heat exchange channel provided on the heat exchange plate 4, with the annular pipe 25 passing through the loop channel 45. Alternatively, the loop heat pipe can be configured as an annular pipe 25 formed on the heat exchange plate 4, wherein the second phase change working fluid is encapsulated within the annular pipe 25, and so on. Such flexible adjustments and changes do not deviate from the principles and scope of the present invention and should all be included within the protection scope of the present invention.

[0101] The following two examples illustrate the concept of a loop heat pipe.

[0102] Example 1:

[0103] like Figure 6 and Figure 10 As shown, a loop channel 45 is provided inside the heat exchange plate 4. The loop heat pipe includes an annular pipe 25. A second phase change working fluid is encapsulated inside the annular pipe 25. The annular pipe 25 passes through the loop channel 45. The loop heat pipe is configured to drive the second phase change working fluid to circulate within the annular pipe 25.

[0104] Understandably, compared to L-type heat pipes, loop heat pipes have a more complex structure. By setting the loop heat pipe to include an annular pipe 25, which is inserted into the loop channel 45, the processing difficulty of the loop heat pipe can be reduced, making it easier to assemble the thermal management system.

[0105] It should be noted that the present invention does not limit the specific type of the second phase change working medium filled in the annular pipeline 25. For example, the second phase change working medium can be water, methanol, ethanol, liquid ammonia, acetone, fluorinated hydrocarbons, alkanes or any mixture of the above, etc. Such adjustments and changes to the specific type of the second phase change working medium do not deviate from the principle and scope of the present invention and should be included within the protection scope of the present invention.

[0106] For example, the working fluid for the second phase change is acetone.

[0107] Preferably, the second phase change working fluid in the annular pipe 25 has a filling rate of 50% to 70%. This filling rate is the ratio of the volume of the filled second liquid working fluid to the total volume within the annular pipe 25.

[0108] It should be noted that the filling rate of the second phase change working fluid can be set to a range of 50%, 55%, 60%, 65%, 70%, or any combination thereof. In some embodiments, the filling rate of the second phase change working fluid is 50% to 70%.

[0109] It should be noted that in actual application, the heat exchange plate 4 can be set to only include the first plate body 41 and the second plate body 42, or can be set to include the first plate body 41, the bending plate and the second plate body 42 connected in sequence, and the like, and such adjustment and change of the specific setting type of the heat exchange plate 4 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0110] Preferably, as shown in Figure 6 and Figure 10 , the heat exchange plate 4 further includes a bending plate 43 arranged between the first plate body 41 and the second plate body 42, and the L-shaped channel 44 includes the evaporation channel 411, the bending channel 431 and the condensation channel 421 communicated in sequence, wherein the evaporation channel 411 is arranged in the first plate body 41, the bending channel 431 is arranged in the bending plate 43, and the condensation channel 421 is arranged in the second plate body 42.

[0111] By arranging the bending plate 43, the phase change working medium of the second heat exchange end 22 can flow to the first heat exchange end 21 through the bending channel 431 on the bending plate 43 under the action of gravity, avoiding the phase change working medium to stay between the first plate body 41 and the second plate body 42, and ensuring the heat exchange stability of the heat pipe assembly.

[0112] Preferably, as shown in Figure 6 and Figure 10 , the loop channel 45 includes the first channel 412, the bending avoiding hole 432 and the second channel 422 arranged one by one, wherein the first channel 412 is arranged in the first plate body 41, the bending avoiding hole 432 is arranged in the bending plate 43, and the second channel 422 is arranged in the second plate body 42, and the number of the loop channel 45 is at least two.

[0113] By such arrangement, that is, by arranging the bending avoiding hole 432 on the bending plate 43, the annular pipeline 25 can be allowed to pass out from the first channel 412 and then pass into the second channel 422 through the bending avoiding hole 432, so that the phase change working medium of the second heat exchange end 22 of the loop heat pipe can flow to the first heat exchange end 21 smoothly, and the number of the loop channel 45 is set to be at least two, which can ensure that the annular pipeline 25 is connected at the head to form a circulating loop.

[0114] In addition, the arrangement of the bending avoiding hole 432 can also form an air inlet 433 (as shown in Figure 2 ) on the side of the second heat exchange end 22 close to the first heat exchange end 21, so that under the action of the heat dissipation fan 33, the airflow flows from the air inlet 433 to the second heat exchange end 22, thereby dissipating heat for the second heat exchange end 22.

[0115] It should be noted that in actual application, the specific bending angle of the bending plate 43 is not limited by those skilled in the art, for example, the bending angle of the bending plate 43 can be set to 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170° or a range formed by any two of the above. In some embodiments, the bending angle of the bending plate 43 is 90°-170°.

[0116] It should be noted that the present application does not limit the specific number of L-shaped channels 44, for example, the L-shaped channel 44 can be set to one, or the number of L-shaped channels 44 can be set to multiple, etc. Such adjustment and change of the specific number of L-shaped channels 44 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0117] It should also be noted that those skilled in the art can set the number of loop channels 45 to two, or the number of loop channels 45 to 2xN (where N≥2 and N is a positive integer), etc. Such adjustment and change of the specific number of loop channels 45 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0118] Preferably, as shown in Figure 6 and Figure 10 , the number of L-shaped channels 44 and loop channels 45 is multiple, wherein the L-shaped channels 44 and loop channels 45 are alternately arranged on the heat exchange plate 4 along a direction perpendicular to the L-shaped channel 44.

[0119] By setting the number of L-shaped channels 44 and loop channels 45 to multiple, the L-shaped channels 44 and loop channels 45 can cover as much of the entire area of the heat exchange plate 4 as possible, making the heat exchange temperature on the heat exchange plate 4 more uniform. In addition, by alternately arranging the L-shaped channels 44 and loop channels 45 on the heat exchange plate 4 along a direction perpendicular to the L-shaped channel 44, the heat exchange of each area on the heat exchange plate 4 can be made more uniform when the L-shaped heat pipe or loop heat pipe works alone, improving the thermal management effect of the battery pack 1.

[0120] It should be noted that in actual application, the specific setting form of the L-shaped channel 44 is not limited by those skilled in the art, for example, the L-shaped channel 44 can be set to a hollow pipe, or a capillary core structure can be arranged in the L-shaped channel 44, etc. Such adjustment and change of the specific setting type of the L-shaped channel 44 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0121] Preferably, a capillary core structure is arranged in the L-shaped channel 44.

[0122] The following two scenarios will be discussed in detail.

[0123] Scenario 1:

[0124] Preferably, such as Figure 7 As shown, the capillary core structure includes a protrusion structure 48 disposed on the inner wall of the L-shaped channel 44. The protrusion structure 48 extends along the axial direction of the L-shaped channel 44, and there are multiple protrusion structures 48 arranged sequentially along the circumference of the L-shaped channel 44.

[0125] By setting the protruding structure 48, the contact area between the inner wall of the L-shaped channel 44 and the phase change working fluid is increased, thus enhancing the interaction between the inner wall of the L-shaped channel 44 and the liquid phase change working fluid. If the inner wall of the L-shaped channel 44 is wetted by the phase change working fluid, the liquid molecules will be subject to stronger attraction from the solid molecules, resulting in a decrease in intermolecular distance and an expansion tendency, thereby promoting the spread of the liquid along the wall surface. Since the L-shaped channel 44 contains a gas-liquid two-phase mixture of phase change working fluid, the liquid phase change working fluid tends to flow along the inner wall of the L-shaped channel 44, causing the gaseous phase change working fluid to flow in the middle of the L-shaped channel 44. This arrangement can increase the flow rate of the phase change working fluid in the L-shaped channel 44, thereby increasing the rate at which the phase change working fluid travels from the first heat exchange end 21 to the second heat exchange end 22 for heat release and then back to the first heat exchange end 21 for heat absorption, which is beneficial to improving the overall cooling effect of the battery pack 1.

[0126] Preferably, the L-shaped channel 44 has a dimension of 8 mm in the thickness direction of the heat exchange plate 4. The thickness of the heat exchange plate 4 is 12 mm.

[0127] It should be noted that the present invention does not limit the specific structural form of the protrusion structure 48. For example, the cross-section of the protrusion structure 48 can be set to an arc shape, or the cross-section of the protrusion structure 48 can be set to a triangle, or the cross-section of the protrusion structure 48 can be set to any other possible shape, etc. Such adjustments and changes to the specific structural form of the protrusion structure 48 do not deviate from the principle and scope of the present invention and should be included within the protection scope of the present invention.

[0128] Preferably, such as Figure 7 As shown, the cross-section of the protruding structure 48 is arc-shaped.

[0129] Scenario 2:

[0130] like Figure 8 and Figure 9As shown, the capillary core structure includes a gas passage 471 and a liquid passage 472, both of which extend along the length direction of the L-shaped passage 44, the liquid passage 472 is in a plurality and is spaced apart along the circumferential direction of the gas passage 471, and the gas passage 471 and the liquid passage 472 are communicated through a hole 473.

[0131] Through such a setting, the gaseous phase change working medium and the liquid phase change working medium in the L-shaped passage 44 can flow in different passages respectively, thereby helping the phase change working medium to be separated into gas and liquid, improving the heat exchange effect, and at the same time, the liquid passage 472 is arranged to be spaced apart along the circumferential direction of the gas passage 471, which can make the liquid passage 472 closer to the pipe wall (lower temperature) and more conducive to the condensation of the phase change medium, and make the gas passage 471 farther away from the pipe wall (higher temperature) and more capable of preventing the gaseous phase change working medium from condensing, thereby further improving the heat exchange capacity of the phase change heat pipe assembly.

[0132] It should be noted that although the L-shaped heat pipe is introduced in the above two cases, this is not limiting, and any other possible setting form does not deviate from the principles and scope of the present application.

[0133] It should also be noted that the capillary core structure as described in case 1 and case 2 can also be arranged in the annular pipeline 25, which will not be described here.

[0134] In some embodiments, as shown in Figure 7 and Figure 8 As shown, the heat exchange plate 4 is further provided with a weight reduction passage 46, the number of the weight reduction passage 46 is a plurality, and the L-shaped passage 44, the weight reduction passage 46 and the loop passage 45 are sequentially and alternately arranged on the heat exchange plate 4 along a direction perpendicular to the L-shaped passage 44.

[0135] Through such a setting, that is, by arranging the weight reduction passage 46, on the one hand, the weight of the heat exchange plate 4 can be reduced, thereby helping to realize the lightweight design of the energy storage system, and on the other hand, the L-shaped passage 44 and the loop passage 45 can be spaced apart through the weight reduction passage 46, thereby preventing the phase change medium in the L-shaped passage 44 and the loop passage 45 from affecting each other and affecting the heat exchange effect.

[0136] It should be noted that in actual application, the weight reduction passage 46 can be arranged as a long passage extending along the extending direction of the L-shaped passage 44, or the weight reduction passage 46 can be arranged as a plurality of short passages spaced apart along the extending direction of the L-shaped passage 44, or the weight reduction passage 46 can be arranged in the form of coexistence of the above long passage and short passage, etc., and such adjustment and change of the specific setting type of the weight reduction passage 46 does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0137] Preferably, the lightening channel 46 is a long channel extending along the direction in which the L-shaped channel 44 extends.

[0138] In some preferred embodiments, the lightening channel 46 is a closed channel, preventing external foreign matters from entering into the lightening channel 46 and increasing the weight of the heat exchange plate 4.

[0139] Preferably, as shown in Figure 7 and Figure 8 , the flow area of the lightening channel 46 on the heat exchange plate 4 is greater than the flow area of the L-shaped channel 44. In this way, the L-shaped channel 44 and the loop channel 45 can be more effectively isolated from each other, not only avoiding the phase change of the phase change medium in the L-shaped channel 44 due to the influence of the phase change working medium in the loop channel 45, thereby reducing the cooling effect of the battery pack 1, but also avoiding the phase change of the phase change medium in the loop channel 45 due to the influence of the phase change working medium in the L-shaped channel 44, thereby affecting the heating effect on the battery pack 1.

[0140] Embodiment Two:

[0141] As shown in Figures 11 to 13 , the loop heat pipe includes a first pipe section 251, a second pipe section 252 and a second phase change working medium formed in the heat exchange plate 4, the first pipe section 251 and the second pipe section 252 are sequentially communicated to form a loop pipe 25, the second phase change working medium is encapsulated in the loop pipe 25, and the loop heat pipe is configured to drive the second phase change working medium to circulate in the loop pipe 25.

[0142] Preferably, the L-shaped channel 44 includes an evaporation channel 411 and a condensation channel 421 connected in series, the evaporation channel 411 and the first pipe section 251 are both arranged on the first plate body 41, and the condensation channel 421 and the second pipe section 252 are both arranged on the second plate body 42.

[0143] It should be noted that the present application does not make any limitation on the forming method of the L-shaped channel 44 and the loop pipe 25 on the heat exchange plate 4, as long as the L-shaped channel 44 and the loop pipe 25 are both formed on the heat exchange plate 4.

[0144] In one specific embodiment, as shown in Figure 11 and Figure 12 , the first pipe section 251 includes a plurality of first U-shaped pipes, the second pipe section 252 includes a plurality of second U-shaped pipes, the first U-shaped pipes and the second U-shaped pipes are sequentially communicated in series, at least part of the evaporation channel 411 of the L-shaped channel 44 is arranged on the inner side of the first U-shaped pipe and the condensation channel 421 connected thereto is arranged between adjacent two second U-shaped pipes; at least part of the evaporation channel 411 of the L-shaped channel 44 is arranged between adjacent two first U-shaped pipes and the condensation channel 421 connected thereto is arranged on the inner side of the second U-shaped pipe.

[0145] In another possible embodiment, the first pipe section 251 comprises a plurality of first U-shaped pipes, the second pipe section 252 comprises a plurality of second U-shaped pipes, the first U-shaped pipes and the second U-shaped pipes are sequentially connected in a head-to-tail manner, the evaporation passage 411 of the L-shaped passage 44 is arranged at the inner side of the first U-shaped pipe and the condensation passage 421 connected with the evaporation passage 411 is arranged at the inner side of the second U-shaped pipe (not shown in the figure).

[0146] In another possible embodiment, the first pipe section 251 comprises a plurality of first U-shaped pipes, the second pipe section 252 comprises a plurality of second U-shaped pipes, the first U-shaped pipes and the second U-shaped pipes are sequentially connected in a head-to-tail manner, the evaporation passage 411 of the L-shaped passage 44 is arranged at the inner side of the first U-shaped pipe and the condensation passage 421 connected with the evaporation passage 411 is arranged at the inner side of the second U-shaped pipe (not shown in the figure).

[0147] In another possible embodiment, as shown in Figure 13 , the first pipe section 251 is arranged on the first plate body 41 in a curved manner and forms a plurality of first U-shaped pipes sequentially connected in a head-to-tail manner, the second pipe section 252 is arranged on the second plate body 42 in a curved manner and forms a plurality of second U-shaped pipes sequentially connected in a head-to-tail manner, the openings of the first U-shaped pipes are arranged opposite to the openings of the second U-shaped pipes, the evaporation passage 411 of the L-shaped passage 44 is arranged at the inner side of the first U-shaped pipe and the condensation passage 421 is arranged at the inner side of the second U-shaped pipe.

[0148] It should be noted that for the above-mentioned embodiment one and embodiment two, the specific driving mode of the loop heat pipe for driving the second phase change working medium to circulate in the annular pipe 25 is not limited in the present application.

[0149] In one possible embodiment, as shown in Figure 5 and Figure 12 , the loop heat pipe further comprises an evaporator 24, the two ends of the annular pipe 25 are respectively connected with the inlet and outlet of the evaporator 24 to form a circulation loop, and the evaporator 24 is used for vaporizing the phase change working medium to drive the phase change working medium to circulate in the circulation loop.

[0150] In another possible embodiment, as shown in Figure 11 and Figure 13 , the loop heat pipe further comprises a wick 23 arranged in the annular pipe 25 (not shown in the figure), and the wick 23 is used for driving the second phase change working medium to circulate in the annular pipe 25.

[0151] It should be noted that in actual application, the present application does not limit the specific setting position of the wick 23, as long as the second phase change working medium can be circulated and flowed in the annular pipeline 25, for example, the wick 23 can be set on the whole annular pipeline 25, or the wick 23 can be set on only part of the annular pipeline 25, and the like, and the adjustment and change of the specific setting position of the wick 23 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0152] Preferably, the wick 23 is set on only part of the annular pipeline 25.

[0153] It should be noted that the present application does not limit the specific structure of the wick 23, for example, the wick 23 can be set as a porous structure formed by sintering process (powder particles are fused under high temperature and pressure) of metal powder (such as copper, aluminum, nickel) or ceramic powder (such as aluminum oxide), or the wick 23 can be set as a structure of "mesh hole + sintering pore" formed by sintering of a plurality of metal mesh (such as copper mesh) after lamination, or the wick 23 can be set as a nano structure, for example, a nano-scale porous structure (such as nano-pore array, nano-groove) is formed on the metal inner wall through anode oxidation, chemical etching and the like, and the like, and the specific structure of the wick 23 is not limited as long as the liquid phase change working medium at the condensing end can be delivered to the evaporating end.

[0154] It should be noted that although the present application is introduced above with the above-mentioned several embodiments to introduce the forming way of the L-shaped channel 44 and the annular pipeline 25 on the heat exchange plate 4, but this is not restrictive, and any other possible forming way does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0155] It should be further noted that the type and filling rate of the second phase change working medium in the first embodiment are applicable to the second embodiment, the L-shaped channel 44 in the first embodiment is also applicable to the second embodiment, and the structure of the heat exchange plate 4 in the first embodiment is also applicable to the second embodiment, and details are not repeated here.

[0156] Preferably, as shown in FIG. 1, Figure 14 The phase change heat pipe assembly further comprises an adjusting member 6, which is arranged between the first heat exchange end 21 and the second heat exchange end 22 and is used to adjust the flow of the phase change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21.

[0157] By such a setting, that is, by setting the adjusting member 6 between the first heat exchange end 21 and the second heat exchange end 22, the flow rate of the phase-change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21 can be adjusted, so that the heat exchange amount of the phase-change heat exchange device can be adjusted, and further, the problem of overcooling of the battery pack 1 can be avoided, and in addition, when the external environment temperature is relatively high, the problem that the second heat exchange end 22 absorbs heat from the surrounding environment and releases the heat to the first heat exchange end 21 to cause the battery pack 1 to be over-heated can also be prevented.

[0158] It should be noted that in actual applications, the adjusting member 6 can be arranged between the evaporation passage 411 and the condensation passage 421 of the L-shaped heat pipe, or the adjusting member 6 can also be arranged between the first pipe section 251 and the second pipe section 252 of the loop heat pipe, or the adjusting member 6 can also be arranged between the evaporation passage 411 and the condensation passage 421 of the L-shaped heat pipe and between the first pipe section 251 and the second pipe section 252 of the loop heat pipe, and the like, and such adjustment and change of the specific arrangement position of the adjusting member 6 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0159] Preferably, the adjusting member 6 is arranged between the evaporation passage 411 and the condensation passage 421 of the L-shaped heat pipe and between the first pipe section 251 and the second pipe section 252 of the loop heat pipe.

[0160] It should be noted that in actual applications, the adjusting member 6 can be arranged as an adjusting valve, and the flow rate of the phase-change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21 can be adjusted by adjusting the flow area or flow resistance of the phase-change working medium, or the adjusting member 6 can also be arranged as a high-frequency on-off valve, and the flow rate of the phase-change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21 can be adjusted by adjusting the duty cycle of the open state of the high-frequency on-off valve, or the adjusting member 6 can also be arranged as a diaphragm valve, and the flow rate of the phase-change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21 can be adjusted by adjusting the passage cross-sectional area of the phase-change working medium, or the adjusting member 6 can also be arranged as an electromagnetic valve, and the flow rate of the phase-change working medium flowing from the second heat exchange end 22 to the first heat exchange end 21 can be adjusted by adjusting the opening degree of the electromagnetic valve, and the like, and such flexible adjustment and change do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0161] Preferably, as shown in Figure 14 The phase-change heat pipe assembly further includes a liquid reservoir 7, which is arranged on the side of the adjusting member 6 away from the first heat exchange end 21, and the liquid reservoir 7 is arranged to cause the phase-change working medium to undergo gas-liquid separation to prevent gaseous phase-change working medium from flowing from the second heat exchange end 22 to the first heat exchange end 21.

[0162] By setting the liquid accumulator 7, the phase change working medium can be separated into gas and liquid, and when the phase change working medium flows from the second heat exchange end 22 to the first heat exchange end 21, the gaseous phase change working medium can be prevented from flowing from the second heat exchange end 22 to the first heat exchange end 21 through the adjusting member 6, thereby improving the adjusting accuracy of the adjusting member 6.

[0163] In a second aspect, the present application further provides a control method for the thermal management system of the first aspect.

[0164] Specifically, the number of the battery packs 1 is multiple, and the number of the semiconductor temperature control assemblies 3 and the phase change heat pipe assemblies is also multiple, and the semiconductor temperature control assemblies 3 and the phase change heat pipe assemblies are arranged one-to-one corresponding to the battery packs 1, the semiconductor temperature control assembly 3 comprises a semiconductor element 31 and a cooling fan 33, the semiconductor element 31 is arranged to heat the second heat exchange end 22 corresponding thereto when it is in a heating mode and to cool the second heat exchange end 22 corresponding thereto when it is in a cooling mode, and the cooling fan 33 is used to cool the second heat exchange end 22 corresponding thereto.

[0165] Please refer to 15, the control method of the present application comprises the following steps:

[0166] S1: obtaining the current temperature Tn of each battery pack 1;

[0167] S2: determining the highest temperature Tmax of the battery pack 1 according to the current temperature Tn of each battery pack 1;

[0168] S3: comparing the highest temperature Tmax with the first preset temperature T1 and the second preset temperature T2;

[0169] S4: selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the comparison result;

[0170] Wherein, n≥2, 0

[0171] Through such a setting, that is, by comparing the highest temperature with the first preset temperature, and selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the comparison result, on the one hand, it can avoid the temperature of the battery pack 1 being too high to cause the battery pack 1 to trigger thermal runaway, thereby improving the safety of the thermal management of the battery pack 1, on the other hand, it can also avoid the temperature deviation of each battery pack 1 being too large to affect the thermal management effect of the battery pack 1.

[0172] It should be noted that the first preset temperature T1 is not higher than the upper limit temperature that the battery pack can withstand, and the second preset temperature T2 is not lower than the lower limit temperature that the battery pack can withstand.

[0173] It should be noted that the specific temperature of the first preset temperature T1 and the second preset temperature T2 can be set by the person skilled in the art according to experience or experiment.

[0174] For example, the first preset temperature T1 can be set to 35℃, 36℃, 37℃, 38℃, 39℃, 40℃, 41℃, 42℃, 43℃, 44℃, 45℃, 46℃, 47℃, 48℃, 49℃, 50℃ or a range formed by any two of these values. In some embodiments, the first preset temperature T1 is 40℃.

[0175] For example, the second preset temperature T2 can be set to 5℃, 8℃, 10℃, 12℃, 15℃, 18℃, 20℃, 22℃, 25℃ or a range formed by any two of these values. In some embodiments, the second preset temperature T2 is 25℃.

[0176] It should be noted that in actual application, the person skilled in the art can detect the temperature of one detection point in each battery pack 1 as the current temperature, or detect the temperature of multiple points in each battery pack 1 and determine the current temperature according to the temperature of multiple points (for example, select the average value of multiple points as the current temperature, or select the maximum value of multiple points as the current temperature), etc. The adjustment and change of the specific acquisition method of the current temperature of each battery pack 1 do not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0177] Preferably, the temperature of multiple detection points in the battery pack 1 is detected, and the current temperature is determined according to the detected temperature of multiple detection points.

[0178] Specifically, the step of "determining the highest temperature Tmax of the battery pack 1 according to the current temperature Tn" specifically includes:

[0179] Among the detected current temperatures of each battery pack 1, the current temperature of the battery pack 1 with the highest temperature is selected as the highest temperature Tmax.

[0180] Continuing to refer to Figure 16 The step of "selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the comparison result" specifically includes:

[0181] S5: If Tmax>T1, the semiconductor elements 31 corresponding to all battery packs 1 are adjusted to the cooling mode, and the heat dissipation fans 33 corresponding to all battery packs 1 are turned on.

[0182] By such an arrangement, in the case of Tmax>T1, it is indicated that the temperature of the battery pack 1 is relatively high, at this time, all the semiconductor elements 31 are adjusted to the cooling mode, the semiconductor elements 31 can cool the second heat exchange end 22, at the same time, all the heat dissipation fans 33 are turned on, the second heat exchange end 22 is cooled by the heat dissipation fans 33, so that the phase change working medium in the second heat exchange end 22 is condensed, the liquid phase change working medium is transported to the evaporation end, and evaporates by absorbing the heat of the battery pack 1, thereby effectively cooling the battery pack 1, and avoiding thermal runaway caused by the temperature of the battery pack 1 being too high.

[0183] Preferably, the heat management system has an air inlet 433 corresponding to each battery pack 1, and the heat dissipation fan 33 is used to introduce the airflow at the air inlet 433 into the surrounding of the second heat exchange end 22, so as to cool the second heat exchange end 22;

[0184] The step of "selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the comparison result" specifically includes:

[0185] S61: If T2

[0186] S62: Determine whether the air inlet temperature Td is greater than a preset air inlet temperature Td0;

[0187] S63: If the determination result is "yes", the semiconductor elements 31 corresponding to the first group of battery packs are adjusted to the cooling mode;

[0188] Wherein, the first group of battery packs are the battery packs 1 corresponding to the air inlets 433 with the air inlet temperature Td greater than the preset air inlet temperature Td0;

[0189] S64: If the determination result is "no", further determine the lowest temperature Tmin of the battery pack 1 according to the current temperature Tn of each battery pack 1;

[0190] S65: Determine the temperature difference AT according to the highest temperature Tmax and the lowest temperature Tmin;

[0191] According to the temperature difference AT, the working mode of each semiconductor temperature control assembly 3 is selectively adjusted.

[0192] By such an arrangement, in the case of T2 < Tmax≤ T1, it is illustrated that the temperature of the battery pack 1 is not obviously too high, but the temperature of the battery pack 1 is still high, at this time, the air inlet temperature at the air inlet 433 of each air duct is further detected, if the air inlet temperature Td > the preset air inlet temperature Td0, it is illustrated that the second heat exchange end 22 cannot be effectively cooled by the heat dissipation fan 33 alone, at this time, the semiconductor element 31 corresponding to the first group of battery packs needs to be adjusted to the cooling mode, so as to quickly cool the second heat exchange end 22 by the semiconductor element 31, thereby more effectively performing thermal management on the battery pack 1; if the air inlet temperature Td≤ the preset air inlet temperature Td0, then according to the temperature difference AT, the working mode of each semiconductor temperature control assembly 3 is selectively adjusted, which can avoid that the temperature deviation between the battery packs 1 is too large, thereby improving the temperature uniformity of the battery pack 1.

[0193] Preferably, the step of “selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the temperature difference AT” specifically comprises:

[0194] S66: comparing the temperature difference AT with a preset temperature difference AT0;

[0195] S67: if AT > AT0, then according to the current temperature Tn of each battery pack 1 and the minimum temperature Tmin, determining the battery pack 1 that needs to be cooled, denoted as a second group of battery packs;

[0196] S68: turning on the heat dissipation fan 33 corresponding to the second group of battery packs;

[0197] S69: if AT≤ AT0, then turning on the heat dissipation fan 33 corresponding to all the battery packs 1.

[0198] By such an arrangement, in the case of AT > AT0, it is illustrated that the temperature deviation between the battery packs 1 is large, and at this time, the highest temperature of the battery pack 1 is also high, at this time, the battery pack 1 that needs to be cooled is screened out, and the heat dissipation fan 33 corresponding to the battery pack 1 that needs to be cooled is turned on, so as to cool the battery pack 1 with the high temperature, thereby avoiding that the temperature deviation between the battery packs 1 is too large; in the case of AT≤ AT0, it is illustrated that the temperature deviation between the battery packs 1 is not large, but at this time, the highest temperature of the battery pack 1 is high, at this time, the heat dissipation fan 33 corresponding to all the battery packs 1 is turned on, which can cool the second heat exchange end 22 corresponding to all the battery packs 1, thereby cooling all the battery packs 1, which is helpful to reduce the highest temperature of all the battery packs 1 to an appropriate temperature.

[0199] Preferably, the step of “determining the battery pack 1 that needs to be cooled according to the current temperature Tn of each battery pack 1 and the minimum temperature Tmin” specifically comprises:

[0200] comparing the current temperature Ti of the i-th battery pack 1 with Tmin+△T0;

[0201] If Ti≥Tmin+△T0, the i-th battery pack 1 is determined as a battery pack 1 needing to be cooled down.

[0202] Wherein, 0

[0203] By such a setting, the current temperature Ti of each battery pack 1 is compared with Tmin+△T0, and in the case of Ti≥Tmin+△T0, it is indicated that the temperature of this battery pack 1 is higher than the set battery pack 1 temperature, i.e. the deviation of this battery pack 1 from the set battery pack 1 temperature is larger, and therefore this battery pack 1 is determined as a battery pack 1 needing to be cooled down.

[0204] Preferably, in the case of △T≤△T0, the control method of the application further comprises the following steps:

[0205] further comparing the highest temperature Tmax with a fourth preset temperature T4 and a fifth preset temperature T5;

[0206] determining the working gear of the cooling fan 33 according to the comparison result;

[0207] 0

[0208] By such a setting, i.e. by comparing the highest temperature Tmax with a fourth preset temperature T4 and a fifth preset temperature T5, and determining the working gear of the cooling fan 33 according to the comparison result, not only can the cooling efficiency be affected due to too low cooling gear, thereby affecting the cooling efficiency of the battery pack 1, but also can the cooling range be too large due to too high cooling gear, thereby affecting the temperature control accuracy of the battery pack 1.

[0209] Preferably, the step of "determining the working gear of the cooling fan 33 according to the comparison result" specifically comprises:

[0210] If T4

[0211] If T5

[0212] If T2

[0213] Wherein, the air volume of the first preset gear is greater than that of the second preset gear, and the air volume of the second preset gear is greater than that of the third preset gear.

[0214] Through the arrangement, the working gear of the heat dissipation fan 33 can be determined according to the range where the highest temperature of the battery pack 1 is located, so that the second heat exchange end 22 can be cooled more accurately, and the battery pack 1 can be cooled more accurately, and the temperature control accuracy of the battery pack 1 is avoided from being affected by too large cooling range.

[0215] Preferably, the step of "selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the comparison result" specifically comprises:

[0216] S71: If Tmax≤T2, further determine the lowest temperature Tmin of the battery pack 1 according to the current temperature Tn of each battery pack 1;

[0217] S72: Determine the temperature difference AT according to the highest temperature Tmax and the lowest temperature Tmin;

[0218] According to the temperature difference AT, the working mode of each semiconductor temperature control assembly 3 is selectively adjusted.

[0219] Through the arrangement, in the case of Tmax≤T2, it is indicated that the highest temperature of the battery pack 1 is not too high, at this time, the temperature difference AT is determined according to the highest temperature Tmax and the lowest temperature Tmin, and the working mode of each semiconductor temperature control assembly 3 is selectively adjusted according to the temperature difference AT, so that the overall temperature of the battery pack 1 can be prevented from being too low, and the temperature deviation between the battery packs 1 can be prevented from being too large.

[0220] It should be noted that in actual application, the temperature difference AT and the preset temperature difference AT0 can be directly compared by those skilled in the art, and the working mode of each semiconductor temperature control assembly 3 is selectively adjusted according to the comparison result, or the difference between the temperature difference AT and the preset temperature difference AT0 can be calculated first, and then the difference value is compared with the preset value, and the working mode of each semiconductor temperature control assembly 3 is selectively adjusted according to the comparison result, or the ratio between the temperature difference AT and the preset temperature difference AT0 can be calculated first, and then the ratio value is compared with the preset value, and the working mode of each semiconductor temperature control assembly 3 is selectively adjusted according to the comparison result, and so on. Such flexible adjustment and change does not deviate from the principles and scope of the present application, and should be included in the protection scope of the present application.

[0221] Preferably, the step of "selectively adjusting the working mode of each semiconductor temperature control assembly 3 according to the temperature difference AT" specifically comprises:

[0222] S73: Compare the temperature difference AT with the preset temperature difference AT0;

[0223] S74: If AT > AT0, determine the battery pack 1 needing heating according to the current temperature Tn of each battery pack 1 and the highest temperature Tmax, and mark as a third group of battery packs;

[0224] S75: Adjust the semiconductor element 31 corresponding to the third group of battery packs to the heating mode;

[0225] S76: If AT ≤ AT0, further compare the highest temperature Tmax with a third preset temperature T3;

[0226] S77: If Tmax > T3, do not adjust the working mode of each semiconductor temperature control assembly 3;

[0227] S78: If Tmax ≤ T3, adjust the semiconductor element 31 corresponding to all battery packs 1 to the heating mode.

[0228] Through such a setting, in the case of AT > AT0, it is indicated that the temperature deviation between the battery packs 1 is large, at this time, the battery pack 1 with low temperature is screened out as the battery pack 1 needing heating, and the semiconductor element 31 corresponding to the battery pack 1 needing heating is adjusted to the heating mode, so that only the battery pack 1 with low temperature is heated, and the temperature difference between the battery packs 1 is reduced; in the case of AT ≤ AT0, it is indicated that the temperature deviation between the battery packs 1 is small, at this time, the highest temperature Tmax of the battery pack 1 is further compared with the third preset temperature T3, when Tmax > T3, it is indicated that the highest temperature of the battery pack 1 is appropriate and the deviation between the battery packs 1 is also small, at this time, the working mode of each semiconductor temperature control assembly 3 is not adjusted, so that each battery pack 1 can be maintained at a more appropriate temperature, when Tmax ≤ T3, it is indicated that although the temperature deviation between the battery packs 1 is small, the temperature of the battery pack 1 is generally low, at this time, the semiconductor element 31 corresponding to all battery packs 1 needs to be adjusted to the heating mode to heat all battery packs 1, so as to prevent the temperature of the battery pack 1 from being too low to affect the normal operation of the battery pack 1.

[0229] Preferably, the step of "determining the battery pack 1 needing heating according to the current temperature Tn of each battery pack 1 and the highest temperature Tmax" specifically comprises:

[0230] comparing the current temperature Tj of the jth battery pack 1 with Tmax- AT0;

[0231] If Tj ≤ Tmax- AT0, the jth battery pack 1 is determined as the battery pack 1 needing heating;

[0232] Wherein, 0 < j ≤ n.

[0233] By such an arrangement, the current temperature of each battery pack 1 is compared with Tmax-△T0, and if the current temperature of the battery pack 1 is ≤Tmax-△T0, it is determined that the current temperature of the battery pack 1 is significantly lower than the set temperature, and the battery pack 1 needs to be heated. At this time, the battery pack 1 is determined as a battery pack 1 that needs to be heated.

[0234] It should be noted that in actual applications, the specific adjustment manner of adjusting the semiconductor element 31 to the cooling mode and adjusting the semiconductor element 31 to the heating mode is not limited by those skilled in the art, as long as the semiconductor element 31 can be adjusted to the cooling mode or the heating mode.

[0235] In one specific embodiment, two groups of semiconductor elements 31 can be provided, wherein the first group of semiconductor elements 31 is used to cool the second heat exchange end 22, and the second group of semiconductor elements 31 is used to heat the second heat exchange end 22. The step of adjusting the semiconductor element 31 to the cooling mode includes: starting the first group of semiconductor elements 31 and closing the second group of semiconductor elements 31.

[0236] The step of adjusting the semiconductor element 31 to the heating mode includes: closing the first group of semiconductor elements 31 and starting the second group of semiconductor elements 31.

[0237] In another specific embodiment, the semiconductor element 31 can be arranged to be able to cool the second heat exchange end 22 when it is forward energized and to be able to heat the second heat exchange end 22 when it is reverse energized. The step of adjusting the semiconductor element 31 to the cooling mode specifically includes:

[0238] Forward energizing the semiconductor element 31;

[0239] The step of adjusting the semiconductor element 31 to the heating mode specifically includes:

[0240] Reverse energizing the semiconductor element 31.

[0241] By such an arrangement, the semiconductor element 31 can be switched between the cooling mode and the heating mode more conveniently.

[0242] Of course, preferably, the step of adjusting the semiconductor element 31 to the cooling mode specifically includes:

[0243] Forward energizing the semiconductor element 31;

[0244] The step of adjusting the semiconductor element 31 to the heating mode specifically includes:

[0245] Reverse energizing the semiconductor element 31.

[0246] In a third aspect, the present application also provides an energy storage system comprising the thermal management system for the battery pack 1 and the controller of any of the first aspect, the controller being configured to perform the control method of the thermal management system of any of the second aspect.

[0247] So far, the technical solutions of the present application have been described in combination with the preferred embodiments shown in the drawings, but it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to the related technical features without departing from the principles of the present application, and the technical solutions after these changes or replacements will all fall within the protection scope of the present application.

Claims

1. A thermal management system for a battery pack, the system comprising: The heat management system comprises a battery pack (1), a phase change heat pipe assembly and a semiconductor temperature control assembly (3), the phase change heat pipe assembly is encapsulated with a phase change working medium, the phase change heat pipe assembly has a first heat exchange end (21) and a second heat exchange end (22), the first heat exchange end (21) is arranged adjacent to the battery pack (1) and is used for heat exchange with the battery pack (1), and the semiconductor temperature control assembly (3) is arranged adjacent to the second heat exchange end (22) and can exchange heat with the second heat exchange end (22); The heat management system further comprises a temperature detection member, which is used for detecting the temperature in the battery pack (1) and is in communication connection with the semiconductor temperature control assembly (3). The phase change heat pipe assembly comprises an L-shaped heat pipe and a loop heat pipe, when the battery pack (1) is in a high-temperature environment, the first heat exchange end (21) of the L-shaped heat pipe absorbs the heat of the battery pack and makes the phase change working medium evaporate and flow to the second heat exchange end (22), and the liquid working medium of the second heat exchange end (22) returns to the first heat exchange end (21) under the action of gravity, when the battery pack (1) is in a low-temperature environment, the loop heat pipe can heat the battery pack (1).

2. The thermal management system for a battery pack of claim 1, wherein, The semiconductor temperature control assembly (3) comprises a semiconductor element (31), a heat sink (32) and a cooling fan (33), the semiconductor element (31) is arranged adjacent to the second heat exchange end (22), the heat sink (32) is arranged on the side of the semiconductor element (31) away from the second heat exchange end (22), the heat sink (32) is used for heat dissipation of the semiconductor element (31), and the cooling fan (33) is used for accelerating the air flow speed around the second heat exchange end (22). The temperature detection member is in communication connection with the semiconductor element (31) and the cooling fan (33).

3. The thermal management system for a battery pack of claim 2, wherein, The heat sink (32) is provided with a mounting groove (321) matched with the semiconductor element (31), and the semiconductor element (31) is mounted in the mounting groove (321). Furthermore, the semiconductor element (31) can be multiple in number and spaced along the length direction of the second heat exchange end (22).

4. The thermal management system for a battery pack of claim 1, wherein, The heat management system further comprises a heat exchange plate (4) and a box cover (5), the heat exchange plate (4) comprises a first plate body (41) and a second plate body (42) connected with each other, the box cover (5) is connected with the first plate body (41) to form a containing space (40), the battery pack (1) is arranged in the containing space (40), the phase change heat pipe assembly is arranged on the heat exchange plate (4), the first heat exchange end (21) is formed on the first plate body (41), the second heat exchange end (22) is formed on the second plate body (42), and the semiconductor temperature control assembly (3) is connected with the second plate body (42).

5. The thermal management system for a battery pack of claim 4, wherein, The phase change heat pipe assembly comprises an L-shaped heat pipe and a loop heat pipe, the L-shaped heat pipe comprises an L-shaped channel (44) formed in the heat exchange plate (4) and a first phase change working medium encapsulated in the L-shaped channel (44), wherein: The heat exchange plate (4) is provided with a loop channel (45), the loop heat pipe comprises a loop pipe (25) and a second phase change working medium encapsulated in the loop pipe (25), the loop pipe (25) is arranged in the loop channel (45), and the loop heat pipe is arranged to drive the second phase change working medium to circulate in the loop pipe (25); Alternatively, the loop heat pipe comprises a first pipe section (251), a second pipe section (252) and a second phase change working medium formed in the heat exchange plate (4), the first pipe section (251) and the second pipe section (252) are sequentially communicated to form a loop pipe (25), the second phase change working medium is encapsulated in the loop pipe (25), and the loop heat pipe is arranged to drive the second phase change working medium to circulate in the loop pipe (25).

6. The thermal management system for a battery pack of claim 5, wherein, The loop heat pipe further comprises an evaporator (24), two ends of the loop pipe (25) are communicated with an inlet and an outlet of the evaporator (24) to form a circulation loop, and the evaporator (24) is used for vaporizing the phase change working medium to drive the phase change working medium to circulate in the circulation loop; And / or, the loop heat pipe further comprises a wick (23) arranged in the loop pipe (25), and the wick (23) is used for driving the second phase change working medium to circulate in the loop pipe (25); And / or, the filling rate of the first phase change working medium in the L-shaped channel (44) is 40% to 70%; And / or, the filling rate of the second phase change working medium in the loop pipe (25) is 50% to 70%.

7. The thermal management system for a battery pack of claim 5, wherein, The heat exchange plate (4) further comprises a bending plate (43) arranged between the first plate body (41) and the second plate body (42), wherein: The L-shaped channel (44) comprises an evaporation channel (411) arranged in the first plate body (41), a bending channel (431) arranged in the bending plate (43) and a condensation channel (421) arranged in the second plate body (42); And / or, the loop channel (45) comprises a first channel (412), a bending avoiding hole (432) and a second channel (422) arranged one by one, the first channel (412) is arranged in the first plate body (41), the bending avoiding hole (432) is arranged on the bending plate (43), the second channel (422) is arranged in the second plate body (42), and the number of the loop channels (45) is at least two; And / or, the number of the L-shaped channels (44) and the loop channels (45) is multiple, and the L-shaped channels (44) and the loop channels (45) are sequentially and alternately arranged on the heat exchange plate (4) in a direction perpendicular to the L-shaped channels (44). And / or, the L-shaped channel (44) is provided with a capillary core structure, the capillary core structure comprises a protruding structure (48) arranged on the inner wall of the L-shaped channel (44), the protruding structure (48) extends along the axis direction of the L-shaped channel (44), the number of the protruding structure (48) is multiple, and multiple protruding structures (48) are sequentially arranged along the circumference of the L-shaped channel (44); or the capillary core structure comprises a gas channel (471) and a liquid channel (472), the gas channel (471) and the liquid channel (472) both extend along the length direction of the L-shaped channel (44), the number of the liquid channel (472) is multiple, and multiple liquid channels (472) are distributed along the circumference of the gas channel (471) at intervals, and the gas channel (471) and the liquid channel (472) are communicated through a hole (473); And / or, the heat exchange plate (4) is further provided with a weight reduction channel (46), the number of the weight reduction channel (46) is multiple, and the L-shaped channel (44), the weight reduction channel (46) and the loop channel (45) are sequentially and alternately arranged on the heat exchange plate (4) in the direction perpendicular to the L-shaped channel (44); And / or, the flow area of the weight reduction channel (46) on the heat exchange plate (4) is greater than the flow area of the L-shaped channel (44).

8. The thermal management system for a battery pack of claim 5, wherein, The L-shaped channel (44) comprises a connected evaporation channel (411) and a condensation channel (421), the evaporation channel (411) and the first pipe section (251) are both arranged on the first plate body (41), and the condensation channel (421) and the second pipe section (252) are both arranged on the second plate body (42), wherein: The first pipe section (251) comprises multiple first U-shaped pipes, the second pipe section (252) comprises multiple second U-shaped pipes, the first U-shaped pipes and the second U-shaped pipes are sequentially and circularly connected, at least part of the evaporation channel (411) of the L-shaped channel (44) is arranged on the inner side of the first U-shaped pipe and the connected condensation channel (421) is arranged between adjacent two second U-shaped pipes; and / or, at least part of the evaporation channel (411) of the L-shaped channel (44) is arranged between adjacent two first U-shaped pipes and the connected condensation channel (421) is arranged on the inner side of the second U-shaped pipe; And / or, the first pipe section (251) is bent on the first plate body (41) and forms multiple first U-shaped pipes which are sequentially and circularly connected, the second pipe section (252) is bent on the second plate body (42) and forms multiple second U-shaped pipes which are sequentially and circularly connected, the opening of the first U-shaped pipe is arranged opposite to the opening of the second U-shaped pipe, the evaporation channel (411) of the L-shaped channel (44) is arranged on the inner side of the first U-shaped pipe and the connected condensation channel (421) is arranged on the inner side of the second U-shaped pipe.

9. The thermal management system for a battery pack of any one of claims 1 to 8, wherein, The phase change heat pipe assembly further comprises an adjusting member (6) arranged between the first heat exchange end (21) and the second heat exchange end (22) and used for adjusting the flow of the phase change working medium flowing from the second heat exchange end (22) to the first heat exchange end (21).

10. A control method for the thermal management system of any one of claims 1 to 9, characterized in that, The number of the battery packs (1) is multiple, and the number of the semiconductor temperature control assemblies (3) and the phase change heat pipe assemblies is also multiple, and the semiconductor temperature control assemblies (3) and the phase change heat pipe assemblies are arranged in one-to-one correspondence with the battery packs (1), the semiconductor temperature control assembly (3) comprises a semiconductor element (31) and a cooling fan (33), the semiconductor element (31) is arranged to heat the second heat exchange end (22) corresponding thereto when it is in a heating mode and to cool the second heat exchange end (22) corresponding thereto when it is in a cooling mode, and the cooling fan (33) is used to cool the second heat exchange end (22) corresponding thereto, and the control method comprises the following steps: obtaining the current temperature Tn of each battery pack (1); determining the highest temperature Tmax of the battery pack (1) according to the current temperature Tn of each battery pack (1); comparing the highest temperature Tmax with a first preset temperature T1 and a second preset temperature T2; selectively adjusting the working mode of each semiconductor temperature control assembly (3) according to the comparison result; wherein n≥2, 0 11. The control method of the thermal management system according to claim 10, characterized by, The step of selectively adjusting the working mode of each semiconductor temperature control assembly (3) according to the comparison result specifically comprises: if Tmax>T1, adjusting the semiconductor elements (31) corresponding to all battery packs (1) to the cooling mode, and turning on the cooling fans (33) corresponding to all battery packs (1).

12. The control method of the thermal management system according to claim 10, characterized by, The heat management system has an air inlet (433) arranged in one-to-one correspondence with the battery pack (1), and the cooling fan (33) is used to introduce the airflow at the air inlet (433) into the surrounding of the second heat exchange end (22) so as to cool the second heat exchange end (22), The step of selectively adjusting the working mode of each semiconductor temperature control assembly (3) according to the comparison result specifically comprises: if T2 judging whether the air inlet temperature Td is greater than a preset air inlet temperature Td0; if the judgment result is yes, adjusting the semiconductor elements (31) corresponding to a first group of battery packs to the cooling mode; wherein the first group of battery packs are the battery packs (1) corresponding to the air inlets (433) with the air inlet temperature Td greater than the preset air inlet temperature Td0; and / or, if the judgment result is no, further determining the lowest temperature Tmin of the battery pack (1) according to the current temperature Tn of each battery pack (1); determining the temperature difference AT according to the highest temperature Tmax and the lowest temperature Tmin; According to the temperature difference ΔT, the working mode of each semiconductor temperature control component (3) is selectively adjusted.

13. The control method of the thermal management system according to claim 12, characterized by, The step of selectively adjusting the working mode of each semiconductor temperature control component (3) according to the temperature difference ΔT specifically comprises: comparing the temperature difference ΔT with a preset temperature difference ΔT0; if ΔT>ΔT0, determining the battery pack (1) that needs to be cooled according to the current temperature Tn of each battery pack (1) and the minimum temperature Tmin, and recording it as a second group of battery packs; turning on the cooling fan (33) corresponding to the second group of battery packs; and / or, if ΔT≤ΔT0, turning on the cooling fan (33) corresponding to all battery packs (1).

14. The control method of the thermal management system according to claim 13, characterized by, The step of determining the battery pack (1) that needs to be cooled according to the current temperature Tn of each battery pack (1) and the minimum temperature Tmin specifically comprises: comparing the current temperature Ti of the i-th battery pack (1) with Tmin+ΔT0; if Ti≥Tmin+ΔT0, determining the i-th battery pack (1) as the battery pack (1) that needs to be cooled; wherein 0 15. The control method of the thermal management system according to claim 13, characterized by, In the case of ΔT≤ΔT0, the control method further comprises the following steps: further comparing the maximum temperature Tmax with a fourth preset temperature T4 and a fifth preset temperature T5; determining the working gear of the cooling fan (33) according to the comparison result; 0 16. The control method of the thermal management system according to claim 15, characterized by, The step of determining the working gear of the cooling fan (33) according to the comparison result specifically comprises: if T4 if T5 if T2 Wherein, the air volume of the first preset gear is greater than that of the second preset gear, and the air volume of the second preset gear is greater than that of the third preset gear.

17. The control method of the thermal management system according to claim 10, characterized by, The step of selectively adjusting the working mode of each semiconductor temperature control component (3) according to the comparison result specifically comprises: if Tmax≤T2, further determining the minimum temperature Tmin of the battery pack (1) according to the current temperature Tn of each battery pack (1); determining the temperature difference ΔT according to the maximum temperature Tmax and the minimum temperature Tmin; According to the temperature difference ΔT, the working mode of each semiconductor temperature control component (3) is selectively adjusted.

18. The control method of the thermal management system according to claim 17, characterized by, The step of selectively adjusting the working mode of each semiconductor temperature control component (3) according to the temperature difference ΔT specifically comprises: comparing the temperature difference ΔT with a preset temperature difference ΔT0; if ΔT>ΔT0, determining the battery pack (1) that needs to be heated according to the current temperature Tn of each battery pack (1) and the maximum temperature Tmax, and recording it as a third group of battery packs; adjusting the semiconductor elements (31) corresponding to the third group of battery packs to a heating mode; and / or, if AT ≤ AT0, further comparing the maximum temperature Tmax with a third preset temperature T3; if Tmax > T3, not adjusting the operation mode of each semiconductor temperature control component (3); if Tmax≤ T3, adjusting the semiconductor elements (31) corresponding to all the battery packs (1) to a heating mode.

19. The control method of the thermal management system according to claim 18, characterized by, The step of determining the battery packs (1) that need to be heated according to the current temperature Tn of each battery pack (1) and the maximum temperature Tmax specifically comprises: comparing the current temperature Tj of the jth battery pack (1) with Tmax- AT0; if Tj≤ Tmax- AT0, determining the jth battery pack (1) as a battery pack (1) that needs to be heated; wherein 0 < j≤ n.

20. The control method of the thermal management system according to any one of claims 11 to 19, characterized by, The step of adjusting the semiconductor elements (31) to the cooling mode specifically comprises: forwardly energizing the semiconductor elements (31); The step of adjusting the semiconductor elements (31) to the heating mode specifically comprises: reverse energizing the semiconductor elements (31).

21. An energy storage system characterized by, The energy storage system comprises the thermal management system for battery packs (1) according to any one of claims 1 to 9 and a controller configured to be capable of executing the control method of the thermal management system according to any one of claims 10 to 20.

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