Blind hole soaking device for circuit board

By setting up a pre-wetting pool and an immersion pool in the immersion box, using spraying, jetting, magnetic field and magnetic drive stirring mechanisms, combined with a detachable conveying mechanism, the problems of poor bubble removal effect and high contamination rate of the blind hole immersion device are solved, and efficient bubble removal and low-pollution maintenance are achieved.

CN120751599APending Publication Date: 2025-10-03SHANGRAO JINDAWEI INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510913611.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-03
Publication Date
2025-10-03

AI Technical Summary

Technical Problem

The existing blind hole immersion device has limited effect on removing bubbles in the blind hole, and the structure inside the immersion chamber is complicated, resulting in poor bubble removal effect and high contamination rate, and difficult maintenance.

Method used

A pre-wetting pool and an immersion pool are set up in the immersion box, and the spray component, the jet component, the magnetic field generating mechanism and the magnetic drive stirring mechanism are used in combination with a detachable conveying mechanism. Through the nozzle, the nozzle, the flexible membrane layer and the detachable conveying plate, the pretreatment of the circuit board and the efficient bubble removal are achieved.

Benefits of technology

It significantly improves the removal of bubbles in blind holes, reduces the risk of immersion liquid contamination, and simplifies the maintenance process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a blind hole soaking device for a circuit board, and the device comprises a soaking box which is internally divided into a pre-soaking pool and a soaking pool, and the wall body of the soaking pool is internally provided with a magnetic field generation mechanism; the pre-infiltrating mechanism comprises a plurality of spraying assemblies which are detachably arranged in the pre-infiltrating pool, and each spraying assembly is provided with a plurality of spray heads which are used for spraying soaking liquid to the circuit board; the high-pressure impact mechanism comprises a plurality of air injection assemblies arranged on the pool edge of the pre-infiltration pool, and each air injection assembly comprises a plurality of nozzles which can move in the circumferential direction and are used for injecting high-pressure air flow to the circuit board, so that the problems that an existing blind hole soaking device is limited in removal effect on bubbles in blind holes, the structure in a soaking bin is too complicated, and the soaking efficiency is poor are solved. The bubble removal effect is poor; the pollution rate is high; and the maintenance difficulty is high.
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Description

Technical Field

[0001] The present invention belongs to the technical field of blind hole immersion devices, and particularly relates to a blind hole immersion device for printed circuit boards. Background Art

[0002] Blind holes are key structures for interlayer connection of printed circuit boards, and the cleanliness and roughness of their inner walls directly affect the quality of the electroplated copper layer. Through blind hole immersion, impurities such as oil stains and oxides on the inner wall can be removed, and the adhesion of the electroplated copper layer can be improved. In the prior art, most blind hole immersion devices are used to immerse printed circuit boards.

[0003] For example, a blind hole immersion device for printed circuit board processing disclosed in the patent with the publication number CN118843262B includes an immersion tank, a lifting cylinder, and a mounting frame. Lifting cylinders are installed on both sides of the immersion tank, and a mounting frame is connected between the telescopic rods of the two lifting cylinders. It also includes a U-shaped placement rack, a导出 structure, and a bubble removal mechanism. A plurality of U-shaped placement racks are evenly spaced and connected inside the mounting frame. A through slot for the printed circuit board to pass through is provided on the U-shaped placement rack. The immersion tank is provided with a导出 structure for assisting in导出 the printed circuit board and a bubble removal mechanism for removing bubbles at the blind holes of the printed circuit board. Although this patent can effectively remove bubbles in the blind holes and avoid damaging the printed circuit board, there are still some potential problems:

[0004] On the one hand, the bubble removal mechanism relies on an air suction pipe and a piston plate to generate negative pressure to extract bubbles in the blind holes, but this design may have limited bubble removal effect for small or deep blind holes. Especially when the blind hole depth is relatively large, the negative pressure may not completely cover the inside of the blind hole.

[0005] On the other hand, the structure of this device arranged inside the immersion tank is too complex, and it is prone to wear or failure during long-term use. This not only increases the risk of the immersion liquid being contaminated but also increases the maintenance difficulty.

[0006] Therefore, how to develop a blind hole immersion device with better bubble removal effect and reduced pollution rate and maintenance difficulty has become an urgent problem for those skilled in the art. Summary of the Invention

[0007] The purpose of the present invention is to solve the problems that the existing blind hole immersion devices have limited effect on removing bubbles in the blind holes and the structure inside the immersion tank is too complex, resulting in poor bubble removal effect, high pollution rate, and great maintenance difficulty.

[0008] To achieve the above purpose, the present invention provides a blind hole immersion device for printed circuit boards, including:

[0009] [[ID=�1]]An immersion tank, which is divided into a pre-wetting pool and an immersion pool, and a magnetic field generating mechanism is arranged inside the wall of the immersion pool;

[0010] It should be noted that there may be some inaccuracies in the translation of "导出 structure" as the specific meaning of "导出" is not clear. It may need to be further determined according to the actual context.The pre-wetting mechanism includes a plurality of spray assemblies detachably disposed in the pre-wetting tank, each spray assembly having a plurality of nozzles for spraying the soaking liquid onto the circuit board;

[0011] The high-pressure impact mechanism includes a plurality of jet assemblies arranged on the edge of the pre-wetting tank, each jet assembly including a plurality of nozzles capable of circumferential movement and used to spray high-pressure airflow onto the circuit board;

[0012] The magnetic drive stirring mechanism includes a plurality of magnetic drive assemblies detachably disposed in the immersion tank and capable of moving up and down therein, each magnetic drive assembly including a flexible membrane layer filled with a plurality of magnetic particles, the flexible membrane layer being configured to swing under the drive of the magnetic field generating mechanism and the plurality of magnetic particles;

[0013] The transport mechanism includes several transport plates which are detachably mounted on the soaking tank and can selectively transport the circuit board to the pre-wetting tank or the soaking tank. Each transport plate is provided with a plurality of clamping stations for clamping the circuit board.

[0014] Optionally, each of the spraying assemblies includes a liquid guide plate mounted on the edge of the pre-infiltration tank, a plurality of liquid guide columns are evenly distributed along the length of the lower end of the liquid guide plate, and a plurality of nozzles are provided on each liquid guide column.

[0015] Optionally, the pre-infiltration pool is provided with several mounting components corresponding to each spray component, and each mounting component includes two mounting plates symmetrically arranged on the edge of the pre-infiltration pool and each having a mounting hole, a first connecting piece for connecting to a liquid guide plate is provided in the mounting hole, and a liquid supply connector for supplying liquid to the liquid guide plate is provided on one side thereof.

[0016] Optionally, each of the jet assemblies further comprises a jet pump for providing high-pressure airflow to each nozzle.

[0017] Optionally, the pre-infiltration tank is provided with several drive assemblies corresponding to each jet assembly, and each drive assembly includes a rotating shaft arranged on the edge of the pre-infiltration tank, the driving end of the rotating shaft is connected to the first motor, and its transmission end is connected to the jet pump.

[0018] Optionally, the magnetic field generating mechanism includes a plurality of coils uniformly arranged in the vertical direction within the wall of the immersion tank, each coil being configured to be independently controllable to generate a variable magnetic field within the immersion tank that can cause the flexible membrane layer to swing.

[0019] Optionally, each of the magnetic drive components further includes a limit frame, with limit slots provided at the upper and lower ends of the limit frame, a plurality of second connecting members passing through the limit slots, and both ends of the flexible membrane layer are connected to the limit slots through the second connecting members.

[0020] Optionally, a first slide groove and a second slide groove are symmetrically arranged on the wall of the immersion pool, a first screw rod is arranged in the first slide groove, the upper end of the first screw rod is connected to the second motor, a first guide rod is arranged in the second slide groove, and a movable frame is sleeved on the first screw rod and the first guide rod, and the movable frame is used to drive the limit frame to move up and down in the immersion pool.

[0021] Optionally, a third slide groove and a fourth slide groove are symmetrically arranged on the edge of the immersion box, a second screw rod is arranged in the third slide groove, one end of the second screw rod is connected to a third motor, a second guide rod is arranged in the fourth slide groove, and two sliders are relatively arranged on the second screw rod and the second guide rod, and each slider has a mounting groove for connecting each conveying plate.

[0022] Optionally, each of the clamping stations is evenly distributed along its circumference with four clamping assemblies, and each clamping assembly includes a fixed rod embedded in the wall of each clamping station, on which a spring and a movable rod are sequentially sleeved, and one end of the movable rod extends into each clamping station and is connected to a clamping plate, which is used to clamp the circuit board.

[0023] The beneficial effects of the present invention are:

[0024] The blind hole soaking device for circuit boards proposed in the present invention utilizes a pre-soaking tank and a soaking tank within a soaking tank. Furthermore, a pre-soaking mechanism and a high-pressure impact mechanism are provided within the pre-soaking tank. This allows for the use of multiple nozzles and multiple nozzles to pre-treat the circuit boards. A magnetic field generating mechanism and a magnetically driven stirring mechanism are then provided within the soaking tank to oscillate the soaking liquid using a swingable flexible membrane layer. Furthermore, the present invention also provides a transport mechanism that utilizes multiple detachable transport plates and multiple clamping stations thereon to selectively transport the circuit boards to the pre-soaking tank or soaking tank. Compared to existing blind hole soaking devices, the blind hole soaking device of the present invention offers significant improvements: Firstly, multiple nozzles can be used to pre-soak the circuit board and its blind holes to remove impurities and highlight areas where bubbles may form. Combined with multiple nozzles, this not only further removes residual impurities but also removes any bubbles that may form, effectively reducing the likelihood of bubbles forming within the blind holes of the circuit board in the soaking tank, thereby achieving a better bubble effect. On the other hand, the structures provided in the pre-soaking tank and the soaking tank of the present invention are all detachable, thereby facilitating maintenance and reducing the risk of contamination of the soaking liquid to a certain extent.

[0025] Based on the above content, it can be seen that the technical solution of the present invention can effectively solve the problems that the existing blind hole immersion device has limited effect on removing bubbles in the blind hole and the structure in the immersion chamber is too complicated, resulting in poor bubble removal effect, high contamination rate and maintenance difficulty.

[0026] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention may be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to designate the same or similar parts.

[0028] Figure 1 A schematic structural diagram of a blind hole soaking device for a circuit board according to a first viewing angle is shown;

[0029] Figure 2 A schematic structural diagram of a blind hole soaking device for a circuit board according to a second viewing angle of an embodiment of the present invention is shown;

[0030] Figure 3 A schematic structural diagram of a blind hole soaking device for a circuit board according to a third viewing angle of an embodiment of the present invention is shown;

[0031] Figure 4 A schematic structural diagram of a blind hole immersion device for a circuit board according to a fourth viewing angle of an embodiment of the present invention is shown;

[0032] Figure 5 A schematic structural diagram of a blind hole immersion device for a circuit board according to a fifth viewing angle of an embodiment of the present invention is shown;

[0033] Figure 6 A cross-sectional view of a blind hole soaking device for a circuit board according to an embodiment of the present invention is shown;

[0034] Figure 7 shows a cross-sectional view of a limit frame according to an embodiment of the present invention;

[0035] Figure 8 shows a cross-sectional view of a connecting groove and a connecting portion according to an embodiment of the present invention;

[0036] Figure 9 A schematic structural diagram of each transport plate according to an embodiment of the present invention is shown.

[0037] Reference numerals:

[0038] 1-Immersion tank; 2-Pre-infiltration tank; 3-Immersion tank; 4-Nozzle; 5-Nozzle; 6-Magnetic particles; 7-Flexible membrane layer; 8-Transport plate; 81-Clamping station; 9-Electrical control box; 10-Control panel; 11-Liquid storage tank; 111-Liquid supply pipe; 12-Liquid outlet pipe; 13-Filter plate; 14-Mounting frame; 141-Vertical pole; 15-Liquid guide plate; 16-Liquid guide column; 17-Mounting plate; 171-Mounting hole; 18-First connecting piece; 19-Liquid supply connector; 20-Jet pump; 21-Rotating shaft; 22-Coil; 23-Limiting frame; 231-Limiting slot; 232-Connecting Part; 2321-groove; 24-second connecting piece; 25-first slide; 26-second slide; 27-first screw; 28-second motor; 29-first guide rod; 30-movable frame; 301-connecting groove; 3011-connecting protrusion; 31-rubber buffer layer; 32-third slide; 33-fourth slide; 34-second screw; 35-third motor; 36-second guide rod; 37-slider; 371-installation slot; 38-transport frame; 39-electric push rod; 40-fixed rod; 41-spring; 42-movable rod; 43-clamping plate, 44-heating wire. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to more fully understand the technical solution of the present invention, the exemplary embodiments of the present invention will be described in more comprehensive and detailed in conjunction with the accompanying drawings below. Obviously, the one or more embodiments of the present invention described below are only one or more of the specific ways of implementing the technical solution of the present invention, and are not exhaustive. It should be understood that other ways belonging to a general inventive concept can be used to implement the technical solution of the present invention, and should not be limited by the exemplary embodiments described. Based on one or more embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present invention.

[0040] Reference Figure 1-9 , an embodiment of the present invention provides a blind hole soaking device for a circuit board, comprising:

[0041] The soaking box 1 is divided into a pre-soaking tank 2 and a soaking tank 3, and a magnetic field generating mechanism is provided in the wall of the soaking tank 3;

[0042] The pre-wetting mechanism includes a plurality of spraying assemblies detachably arranged in the pre-wetting tank 2, each of which has a plurality of spraying heads 4 for spraying the soaking liquid onto the circuit board;

[0043] The high-pressure impact mechanism includes a plurality of jet assemblies arranged on the edge of the pre-wetting tank 2, each jet assembly including a plurality of nozzles 5 capable of circumferential movement and used to spray high-pressure airflow onto the circuit board;

[0044] The magnetic drive stirring mechanism includes a plurality of magnetic drive components detachably disposed in the immersion tank 3 and capable of moving up and down therein. Each magnetic drive component includes a flexible film layer 7 filled with a plurality of magnetic particles 6. The flexible film layer 7 is configured to swing under the drive of the magnetic field generating mechanism and the plurality of magnetic particles.

[0045] The transport mechanism includes several transport plates 8 detachably mounted on the soaking tank 1 and capable of selectively transporting the circuit board to the pre-wetting tank 2 or the soaking tank 3 . Each transport plate 8 is provided with a plurality of clamping stations 81 for clamping the circuit board.

[0046] In one embodiment, an electric control box 9 and a control panel 10 are respectively provided at the lower end and the side wall of the immersion tank 1. The control panel 10 is electrically connected to the electric control box 9 for electrically controlling the immersion tank 1. Specifically, a controller is provided in the electric control box, which can regulate various mechanisms in the immersion tank according to a preset control program or a personalized control program output by the control panel.

[0047] In one embodiment, a liquid storage tank 11 is provided at the lower end of the soaking box 1 , and the liquid storage tank 11 is connected to the soaking pool 3 for injecting the soaking liquid into the soaking pool 3 or recovering the soaking liquid therein.

[0048] In one specific embodiment, a plurality of liquid outlet pipes 12 are provided on one side of the liquid storage tank 11 for communicating with the immersion tank 3. Each liquid outlet pipe 12 is provided with an electromagnetically controlled throttle valve for regulating the flow of the immersion liquid therein. The electromagnetically controlled throttle valve can be driven by an electronic control box to adjust the valve core opening, thereby achieving precise control of the flow of the immersion liquid within the pipe. The structure and operating principle of the electromagnetically controlled throttle valve are conventional and will not be further described here.

[0049] In a specific embodiment, a liquid supply pipe 111 for injecting or recovering the soaking liquid in the liquid storage tank 11 is provided on one side of the liquid storage tank 11 .

[0050] In one embodiment, both the pre-soaking tank 2 and the soaking tank 3 are provided with a detachable filter plate 13 .

[0051] In a specific embodiment, a mounting frame 14 is provided in both the pre-soaking tank 2 and the soaking tank 3 , and vertical rods 141 for limiting the filter plate 13 are provided at the four corners of the mounting frame 14 .

[0052] Specifically, the filter plates in the pre-soaking tank and the soaking tank can filter impurities to prevent them from flowing into the liquid storage tank and adversely affecting subsequent soaking. The bottom of the pre-soaking tank is connected to the soaking tank, allowing the soaking liquid in the pre-soaking tank to flow back into the liquid storage tank through the soaking tank.

[0053] In one embodiment, each spray assembly includes a liquid guide plate 15 mounted on the edge of the pre-infiltration tank 2, and a plurality of liquid guide columns 16 are evenly distributed along the length direction of the lower end of the liquid guide plate 15, and each liquid guide column 16 is provided with a plurality of nozzles 4.

[0054] In one embodiment, a plurality of mounting assemblies corresponding to each spray assembly are provided on the pre-infiltration pool 2, and each mounting assembly includes two mounting plates 17 symmetrically arranged on the pool edge of the pre-infiltration pool 2 and each having a mounting hole 171. A first connecting member 18 for connecting to the liquid guide plate 15 is provided in the mounting hole 171, and a liquid supply connector 19 for supplying liquid to the liquid guide plate 15 is provided on one side thereof.

[0055] Specifically, the pre-soaking tank's walls house a pump connected to the liquid storage tank. The pump's control end is electrically connected to the electrical control box, and its outlet is connected to the liquid supply connector. The liquid guide plate and each liquid guide column are each equipped with a connected infusion cavity for transferring the soaking liquid from the liquid supply connector to each nozzle, which then sprays it onto the circuit board.

[0056] After the circuit board has undergone the above-mentioned pre-soaking, impurities in the blind holes can be effectively removed to reduce the possibility of bubbles being generated in the blind holes during soaking, thereby achieving a preliminary bubble removal effect.

[0057] The connecting piece can realize the detachability of the liquid guide plate through the internal threads set in the liquid guide plate and each mounting plate, so that when the filter plate in the pre-infiltration tank needs to be taken out, the connecting piece can be removed first, and the liquid guide plate and the liquid guide column can be taken out from the pre-infiltration tank, and then the filter plate can be taken out.

[0058] In one embodiment, each jet assembly further includes a jet pump 20 for providing high-pressure airflow to each nozzle 5 .

[0059] In a specific embodiment, each jet assembly includes two nozzles 5 arranged in a vertical direction, and the two nozzles 5 are arranged on the same jet pump 20 .

[0060] In one embodiment, a plurality of drive assemblies corresponding to each jet assembly are provided on the pre-infiltration tank 2, and each drive assembly includes a rotating shaft 21 provided on the edge of the pre-infiltration tank 2, and the driving end of the rotating shaft 21 is connected to the first motor, and its transmission end is connected to the jet pump 20.

[0061] Specifically, the jet pump of each jet assembly is sleeved on the transmission end of the rotating shaft, and the first motor is embedded in the pool wall of the pre-impregnation tank. When the electrical control box controls the first motor to start, the jet pump can be driven to rotate circumferentially through the rotating shaft, so that the two nozzles can spray high-pressure airflow onto the circuit board from different directions, so as to remove residual impurities on the pre-impregnation circuit board and bubbles generated by the pre-impregnation.

[0062] Moreover, since the rotation angle of the jet pump can be adjusted by the first motor, the jet pump can continuously spray airflow to the circuit board during the process of transporting the circuit board from the pre-wetting tank to the immersion tank through the transport mechanism, so as to further achieve the effect of removing impurities and bubbles on the circuit board.

[0063] In one embodiment, the magnetic field generating mechanism includes a plurality of coils 22 uniformly arranged vertically within the wall of the immersion tank 3. Each coil 22 is configured to be independently controllable to generate a variable magnetic field within the immersion tank 3 that can cause the flexible membrane layer 7 to oscillate. Specifically, each coil is electrically connected to an electrical control box so that, under the control of the electrical control box, it is energized and generates a variable magnetic field.

[0064] In one embodiment, each magnetic drive assembly further includes a limit frame 23 , with limit slots 231 provided at the upper and lower ends of the limit frame 23 , and a plurality of second connecting members 24 are passed through the limit slots 231 , and both ends of the flexible membrane layer 7 are connected to the limit slots 231 through the second connecting members 24 .

[0065] Specifically, the two sides of the flexible membrane layer are not connected to the limit frames. When the electrical control box selectively controls each coil to generate a variable magnetic field within the immersion tank, the magnetic particles within the flexible membrane layer are able to move under the influence of the variable magnetic field, causing the flexible membrane layer to swing. The swinging flexible membrane layer can drive the immersion liquid to flow. The flowing immersion liquid can continuously flush the circuit board, thereby colliding and removing bubbles generated in the blind hole, thereby further achieving the bubble removal effect. At the same time, it can also improve the immersion effect of the blind hole.

[0066] In a specific embodiment, the pore size of the flexible membrane layer 7 is set to be smaller than the diameter of each magnetic particle 6, so as to prevent each magnetic particle from breaking through the flexible membrane layer and entering the soaking liquid, thereby contaminating the soaking liquid.

[0067] In a specific embodiment, the first connecting member 18 and the second connecting member 24 are bolts.

[0068] In one embodiment, a first slide groove 25 and a second slide groove 26 are symmetrically arranged on the wall of the immersion pool 3, a first screw rod 27 is arranged in the first slide groove 25, the upper end of the first screw rod 27 is connected to the second motor 28, a first guide rod 29 is arranged in the second slide groove 26, and a movable frame 30 is sleeved on the first screw rod 27 and the first guide rod 29. The movable frame 30 is used to drive the limit frame 23 to move up and down in the immersion pool 3.

[0069] Specifically, one end of the movable frame is threadedly connected to the first screw rod, which drives the limit frame to move up and down while also driving the flexible membrane layer to move, so that the flexible membrane layer can swing to achieve the flow of the immersion liquid, and the movement of the flexible membrane layer can further increase the flow amplitude of the immersion liquid to achieve a better circuit board immersion effect.

[0070] In a specific embodiment, a connection groove 301 is provided on one side of the movable frame 30 . A plurality of connection protrusions 3011 for connecting with the limiting frame 23 and having a rubber buffer layer 31 on the surface are provided in the connection groove 301 .

[0071] In a specific embodiment, the upper end of the limit frame 23 is provided with a connecting portion 232, and a plurality of grooves 2321 are arranged on the connecting portion 232. When the connecting portion 232 is extended into the connecting groove 301, the plurality of connecting protrusions 3011 are connected to the plurality of grooves 2321 in a one-to-one correspondence. Figure 8 shown.

[0072] Specifically, by providing the connecting groove and the connecting portion, the limit frame can be disassembled to facilitate taking out the filter plate in the soaking tank.

[0073] The rubber buffer layer utilizes the high elasticity and viscoelasticity of rubber to buffer the connection part, and each connecting protrusion can recover its deformation after entering each groove one by one, so that it can be more tightly connected with each groove to limit the connection part.

[0074] In one embodiment, a third slide groove 32 and a fourth slide groove 33 are symmetrically arranged on the edge of the immersion box 1, a second screw rod 34 is arranged in the third slide groove 32, one end of the second screw rod 34 is connected to a third motor 35, a second guide rod 36 is arranged in the fourth slide groove 33, and two sliders 37 are relatively arranged on the second screw rod 34 and the second guide rod 36, and each slider 37 has a mounting groove 371 for connecting each conveying plate 8.

[0075] In one embodiment, the transport mechanism further includes a transport frame 38 whose end is clamped in the mounting groove 371 , and two groups of electric push rods 39 for connecting with each transport plate 8 are provided on the transport frame 38 .

[0076] In a specific embodiment, each group of electric push rods 39 includes two electric push rods 39 arranged opposite to each other.

[0077] Specifically, two sliders on the second screw are threadedly connected to it. When the second screw rotates under the drive of the third motor, each slider can move along the edge of the immersion tank. At the same time, the electric push rod can drive each transport plate to move up and down to selectively transport circuit boards in multiple clamping stations to the pre-impregnation tank or the immersion tank.

[0078] In addition, the first motor, the second motor and the third motor are all servo motors, which and the electric push rod are all existing technologies. Their structures and working principles are the same as those of the existing technologies and will not be described in detail here.

[0079] In one embodiment, each clamping station 81 is evenly distributed along its circumference with four clamping assemblies, each clamping assembly includes a fixed rod 40 embedded in the wall of each clamping station 81, a spring 41 and a movable rod 42 are sequentially sleeved on the fixed rod 40, one end of the movable rod 42 extends into each clamping station 81 and is connected to a clamping plate 43, the clamping plate 43 is used to clamp the circuit board, such as Figure 9 shown.

[0080] It is noteworthy that the nozzle, the nozzle and the flexible membrane layer of the present invention are all arranged on both sides of the conveyor plate to ensure the effect on the blind holes on both sides of the circuit board.

[0081] In one embodiment, a plurality of heating wires 44 are provided in the wall of the soaking pool 3, and the control ends of the plurality of heating wires 44 are electrically connected to the electric control box 9 for heating the soaking liquid. Figure 9 shown.

[0082] When the blind hole soaking device of the present invention soaks the circuit board:

[0083] First, several circuit boards are placed one by one into each clamping station and clamped by the clamping plates. Then, the electric push rod moves the transport plate down to the pre-wetting tank.

[0084] Then, the PCB is sprayed with soaking liquid through the liquid supply connector, liquid guide plate, liquid guide column and each nozzle to remove impurities on the PCB. Then the transport plate is moved up and the jet pump and each nozzle are used to spray high-pressure airflow on the PCB to further remove impurities and bubbles.

[0085] Then, each transport plate is driven toward the immersion tank by the third motor, the second screw rod, the second guide rod, and the slider until it reaches the top of the immersion tank. During this process, the jet pump located between the pre-immersion tank and the immersion tank can be rotated by the first motor and the rotating shaft to continuously spray air on the circuit board.

[0086] Next, the electric push rod drives the transport plate down into the immersion tank. The liquid reservoir introduces immersion liquid into the immersion tank via an electromagnetically controlled throttle valve. The immersion liquid gradually submerges the circuit board from bottom to top. The electric control box then regulates each coil to generate a variable magnetic field, causing the flexible membrane to drive the immersion liquid to flow, continuously flushing the circuit board. At the same time, the second motor, the first screw rod, and the first guide rod can also drive the limit frame upward to further increase the flow range of the immersion liquid.

[0087] Finally, the feed plate can be driven upward to recover the soaked circuit boards. After this, the transport frame can be removed from the mounting slot to move the transport boards out of the soaking tank. The limit frame is then separated from the movable frame, and the liquid guide plate is separated from the mounting plate. These are then removed in sequence to remove the filter plates from the pre-soaking tank and soaking tank, clean out impurities, and prepare for reuse.

[0088] The blind hole soaking device for circuit boards proposed in the present invention utilizes a pre-soaking tank and a soaking tank within a soaking tank. Furthermore, a pre-soaking mechanism and a high-pressure impact mechanism are provided within the pre-soaking tank. This allows for the use of multiple nozzles and multiple nozzles to pre-treat the circuit boards. A magnetic field generating mechanism and a magnetically driven stirring mechanism are then provided within the soaking tank to oscillate the soaking liquid using a swingable flexible membrane layer. Furthermore, the present invention also provides a transport mechanism that utilizes multiple detachable transport plates and multiple clamping stations thereon to selectively transport the circuit boards to the pre-soaking tank or soaking tank. Compared to existing blind hole soaking devices, the blind hole soaking device of the present invention offers significant improvements: Firstly, multiple nozzles can be used to pre-soak the circuit board and its blind holes to remove impurities and highlight areas where bubbles may form. Combined with multiple nozzles, this not only further removes residual impurities but also removes any bubbles that may form, effectively reducing the likelihood of bubbles forming within the blind holes of the circuit board in the soaking tank, thereby achieving a better bubble effect. On the other hand, the structures provided in the pre-soaking tank and the soaking tank of the present invention are all detachable, thereby facilitating maintenance and reducing the risk of contamination of the soaking liquid to a certain extent.

[0089] Although one or more embodiments of the present invention have been described above, it should be understood by those skilled in the art that the present invention can be implemented in any other form without departing from its spirit and scope. Therefore, the embodiments described above are illustrative and not restrictive, and many modifications and substitutions will be apparent to those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A blind hole soaking device for circuit boards, characterized in that: include: The immersion box is divided into a pre-immersion tank and an immersion tank, and a magnetic field generating mechanism is provided in the wall of the immersion tank; The pre-wetting mechanism includes a plurality of spray assemblies detachably disposed in the pre-wetting tank, each spray assembly having a plurality of nozzles for spraying the soaking liquid onto the circuit board; The high-pressure impact mechanism includes a plurality of jet assemblies arranged on the edge of the pre-wetting tank, each jet assembly including a plurality of nozzles capable of circumferential movement and used to spray high-pressure airflow onto the circuit board; The magnetic drive stirring mechanism includes a plurality of magnetic drive assemblies detachably disposed in the immersion tank and capable of moving up and down therein, each magnetic drive assembly including a flexible membrane layer filled with a plurality of magnetic particles, the flexible membrane layer being configured to swing under the drive of the magnetic field generating mechanism and the plurality of magnetic particles; The transport mechanism includes several transport plates which are detachably mounted on the soaking tank and can selectively transport the circuit board to the pre-wetting tank or the soaking tank. Each transport plate is provided with a plurality of clamping stations for clamping the circuit board.

2. The blind hole immersion device for circuit boards according to claim 1, characterized in that: Each of the spraying components comprises a liquid guide plate mounted on the edge of the pre-infiltration pool, a plurality of liquid guide columns are evenly distributed along the length direction of the lower end of the liquid guide plate, and a plurality of nozzles are arranged on each liquid guide column.

3. The blind hole immersion device for circuit boards according to claim 2, characterized in that: The pre-infiltration pool is provided with several mounting components corresponding to each spray component. Each mounting component includes two mounting plates symmetrically arranged on the edge of the pre-infiltration pool and each having a mounting hole. A first connecting piece for connecting to a liquid guide plate is provided in the mounting hole, and a liquid supply connector for supplying liquid to the liquid guide plate is provided on one side.

4. The blind hole immersion device for circuit boards according to claim 3, characterized in that: Each of the jet assemblies further includes a jet pump for providing a high-pressure air flow to each nozzle.

5. The blind hole immersion device for circuit boards according to claim 4, characterized in that: The pre-infiltration tank is provided with a plurality of drive assemblies corresponding to each jet assembly. Each drive assembly includes a rotating shaft arranged on the edge of the pre-infiltration tank. The driving end of the rotating shaft is connected to the first motor, and its transmission end is connected to the jet pump.

6. The blind hole immersion device for circuit boards according to claim 5, characterized in that: The magnetic field generating mechanism includes a plurality of coils uniformly arranged in the vertical direction within the wall of the soaking tank, and each coil is configured to be independently controllable to generate a variable magnetic field within the soaking tank that can cause the flexible membrane layer to swing.

7. The blind hole immersion device for circuit boards according to claim 6, characterized in that: Each of the magnetic drive components further comprises a limit frame, wherein upper and lower ends of the limit frame are provided with limit slots, and the limit slots are penetrated by a plurality of second connecting members, and both ends of the flexible membrane layer are connected to the limit slots through the second connecting members.

8. The blind hole immersion device for circuit boards according to claim 7, characterized in that: A first slide groove and a second slide groove are symmetrically arranged on the wall of the immersion pool, a first screw rod is arranged in the first slide groove, the upper end of the first screw rod is connected to the second motor, a first guide rod is arranged in the second slide groove, and a movable frame is sleeved on the first screw rod and the first guide rod, and the movable frame is used to drive the limit frame to move up and down in the immersion pool.

9. The blind hole immersion device for circuit boards according to claim 8, characterized in that: A third slide groove and a fourth slide groove are symmetrically arranged on the edge of the immersion box, a second screw rod is arranged in the third slide groove, one end of the second screw rod is connected to a third motor, a second guide rod is arranged in the fourth slide groove, and two sliders are relatively arranged on the second screw rod and the second guide rod, and each slider has a mounting groove for connecting each conveying plate.

10. The blind hole immersion device for circuit boards according to claim 9, characterized in that: Each of the clamping stations is evenly distributed along its circumference with four clamping assemblies, and each clamping assembly includes a fixed rod embedded in the wall of each clamping station, on which a spring and a movable rod are sequentially sleeved, and one end of the movable rod extends into each clamping station and is connected to a clamping plate, which is used to clamp the circuit board.

Citation Information

Patent Citations

  • A blind hole soaking device for circuit board processing

    CN118843262B