Method and system for cutting circuit through laser and circuit board thereof

Abstract

The invention discloses a method and system for cutting a circuit through laser and a circuit board. The method comprises the steps that circuit pattern information and first pose information of a substrate are obtained; determining a laser marking map according to the circuit pattern information and the first pose information; controlling a laser emitting device to perform laser etching on the substrate according to the laser marking map to obtain line marking points; acquiring copper layer thickness information of the substrate; and according to the copper layer thickness information and the line mark points, controlling a laser emitting device to cut on the substrate to obtain a target circuit board with a target line. According to the method, laser etching is carried out on the substrate according to the laser marking position to obtain the corresponding circuit marking points, copper layer cutting is sequentially carried out according to the circuit marking points to obtain the target circuit, so that circuit cutting is rapidly completed, the circuit manufacturing efficiency and precision of the thick copper circuit board are improved, and the method can be widely applied to the technical field of circuit board manufacturing.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a method and system for laser cutting circuits and a circuit board thereof. Background Art

[0002] In current PCB manufacturing, circuit etching is typically performed by applying a dry film to a copper-clad PCB and then performing a liquid etching process. However, when the copper layer is thick, the etching efficiency is low, and areas of the thick copper not covered by the dry film will also be etched by the liquid etching process, resulting in poor etching accuracy. Summary of the Invention

[0003] In view of this, an object of the embodiments of the present invention is to provide a method and system for laser cutting circuits and a circuit board thereof, which can improve the efficiency and accuracy of circuit production on thick copper circuit boards.

[0004] In a first aspect, an embodiment of the present invention provides a method for laser cutting a circuit, comprising the following steps: Obtaining circuit graphic information and first position information of the substrate; determining a laser marking map according to the circuit graphic information and the first posture information, wherein the laser marking map indicates a laser marking position on the substrate; According to the laser marking pattern, a laser emitting device is controlled to perform laser etching on the substrate to obtain line marking points; Obtain the copper layer thickness information of the substrate; The laser emitting device is controlled according to the copper layer thickness information and the circuit marking points to cut a target circuit board having a target circuit on the substrate.

[0005] Optionally, determining a laser marking map according to the circuit graphic information and the first posture information includes: Determining a plurality of first marking points and a plurality of second marking points according to the circuit graphic information and a preset marking rule, wherein the first marking points are arranged along both sides of the circuit indicated by the circuit graphic information, and the second marking points surround the circuit indicated by the circuit graphic information; Determine a first coordinate position of the first marking point and a second coordinate position of the second marking point according to the first pose information and the mapping ratio; The laser marking map is obtained by respectively making the first marking point correspond to the first coordinate position and the second marking point correspond to the second coordinate position.

[0006] Optionally, determining a plurality of first marking points and a plurality of second marking points according to the circuit graphic information and a preset marking rule includes: Determine a line starting point, a line end point, a line turning point, and a line segment according to the circuit graphic information; Setting a start mark point according to the starting point of the route so that the start mark point indicates the starting position of the route; Setting section marking points according to the line diameter and line spacing of the line section so that the section marking points are arranged on both sides of the line section; Setting a corner marking point according to the corner of the route turning point, so that the corner marking point indicates the arrangement direction of the section marking points on the next route segment; Setting a termination mark point according to the end point of the route, so that the termination mark point indicates the end position of the route, and the start mark point, the section mark point, the corner mark point and the termination mark point all belong to the first mark point; A plurality of second marking points are set at the periphery of the circuit indicated by the circuit pattern information, so that the plurality of second marking points surround the circuit indicated by the circuit pattern information.

[0007] Optionally, controlling a laser emitting device to perform laser etching on a substrate according to the laser marking pattern to obtain line marking points includes: Controlling the laser emitting device to emit a first laser with a first preset laser energy to perform laser etching at the first coordinate position to obtain the first marking point, wherein a first depth of the first marking point is less than or equal to the thickness of the copper layer; The laser emitting device is controlled to emit a second laser with a second preset laser energy to perform laser etching at the second coordinate position to obtain the second marking point. The second depth of the second marking point is less than or equal to the substrate thickness, and the substrate thickness is equal to the plate thickness plus the copper layer thickness. The first marking point and the second marking point both belong to the line marking points.

[0008] Optionally, obtaining the copper layer thickness information of the substrate includes: emitting a first magnetic field having a preset magnetic field strength toward the substrate so as to generate an eddy current magnetic field in the copper layer on the substrate; Superimposing the first magnetic field and the eddy current magnetic field to obtain a second magnetic field; The copper layer thickness information is obtained according to the second magnetic field and a preset thickness relationship table, where the preset thickness relationship table is used to indicate a corresponding relationship between the second magnetic field and the copper layer thickness.

[0009] Optionally, controlling the laser emitting device to cut a target circuit board having a target circuit on a substrate according to the copper layer thickness information and the circuit marking point includes: Determining a first unit laser energy of the laser emitting device according to the copper layer thickness information and a first preset etching time, wherein the first unit laser energy represents the laser energy per unit area; configuring a first laser divergence of the laser emitting device according to a first diameter of the first marking point, wherein the first laser divergence represents an etching area of ​​the laser at the first marking point; Determining a second unit laser energy of the laser emitting device according to the substrate thickness and the second preset etching time, wherein the second unit laser energy represents the laser energy per unit area, and the substrate thickness is equal to the plate thickness plus the copper layer thickness; configuring a second laser divergence of the laser emitting device according to a second diameter of the second marking point, wherein the second laser divergence represents an etching area of ​​the laser at the second marking point; Controlling the laser emitting device to sequentially emit a third laser having the first laser divergence and the first unit laser energy along the first marking point, so that the third laser etches the copper layer within the first preset etching time to obtain the target circuit; The laser emitting device is controlled to sequentially emit a fourth laser having the second laser divergence and the second unit laser energy along the second marking point, so that the fourth laser etches the substrate within the second preset etching time to obtain the target circuit board.

[0010] Optionally, after obtaining the target route, the method further includes: Acquire the copper layer area between the target circuits; determining a third unit laser energy of the laser emitting device according to the copper layer thickness information and a third preset etching time; adjusting the third laser divergence of the laser emitting device according to the copper layer area so that the laser of the laser emitting device adapts to the copper layer area; The laser emitting device is controlled to emit a fifth laser having the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer area within the third preset etching time.

[0011] In a second aspect, an embodiment of the present invention provides a system for laser cutting circuits, including: A first acquiring device, used to acquire circuit pattern information and first pose information of the substrate; a first processing device, configured to determine a laser marking map based on the circuit pattern information and the first posture information, wherein the laser marking map indicates a laser marking position on the substrate; a second processing device for controlling a laser emitting device to perform laser etching on the substrate to obtain line marking points according to the laser marking pattern; A second acquiring device is used to acquire the copper layer thickness information of the substrate; A third processing device is used to control the laser emitting device to cut a target circuit board having a target circuit on the substrate according to the copper layer thickness information and the circuit marking points; A control device is used to control the first acquisition device, the second acquisition device, the first processing device, the second processing device and the third processing device to coordinate their work.

[0012] Optionally, it also includes integrated in the same process machine: a video device for acquiring a video image of the substrate; an eddy current measuring device, configured to emit a first magnetic field having a preset magnetic field strength toward a substrate so as to generate an eddy current magnetic field in a copper layer on the substrate, and to measure thickness information of the copper layer based on the first magnetic field and the eddy current magnetic field; The cleaning device is used to clean the residue on the substrate.

[0013] In a third aspect, an embodiment of the present invention provides a circuit board, which is cut by the above-mentioned method of laser cutting circuits.

[0014] The implementation of the embodiment of the present invention includes the following beneficial effects: The embodiment of the present invention provides a method for laser cutting circuits, including: obtaining circuit graphic information and first posture information of a substrate; determining a laser marking map based on the circuit graphic information and the first posture information, the laser marking map indicating the laser marking position on the substrate; controlling a laser emitting device to perform laser etching on the substrate according to the laser marking map to obtain circuit marking points; obtaining copper layer thickness information of the substrate; controlling the laser emitting device to cut a target circuit board having a target circuit on the substrate according to the copper layer thickness information and the circuit marking points. The laser marking position on the substrate is determined according to the specific circuit graphic and substrate posture, thereby performing laser etching on the substrate to obtain corresponding circuit marking points, and copper layer cutting is performed in sequence according to the circuit marking points to obtain the target circuit. After the substrate is cut, the target circuit board is obtained, thereby quickly completing the cutting of the circuit and circuit board, and improving the circuit production efficiency and accuracy of the thick copper circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic flow chart of the steps of a method for laser cutting a circuit provided by an embodiment of the present invention; Figure 2 is a schematic diagram of laser cutting provided by an embodiment of the present invention; Figure 3 is a schematic diagram of a cross section of a substrate provided by an embodiment of the present invention; Figure 4Schematic diagram of the structure of a system for laser cutting circuits provided by an embodiment of the present invention.

[0016] Reference numerals: substrate 100 , second marking point 110 , target circuit 120 , start marking point 121 , section marking point 122 , corner marking point 123 , end marking point 124 , copper layer area 125 , target circuit board 130 . DETAILED DESCRIPTION

[0017] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0019] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] like Figure 1 As shown, in the first aspect, an embodiment of the present invention provides a method for laser cutting a circuit, which is applied to Figure 2 Laser cutting and Figure 3 The substrate cross section is shown, and the steps involved are as follows.

[0022] S100 , obtaining circuit pattern information and first position information of the substrate 100 .

[0023] Specifically, the circuit graphics information in this application is the circuit information indicated by the vector graphics file exported from the PCB design software, which includes the circuit geometric parameters (line width, path, node coordinates), the design coordinates of the positioning points, etc. A graphics parsing algorithm is used to extract key features (such as the starting / ending points of the circuit, corners, and the theoretical coordinates of the positioning points) and convert them into a coordinate system that can be recognized by the device (such as the mechanical coordinate system of the laser emitting device).

[0024] The first pose information indicates the initial position (X- and Y-axis coordinates) and posture (rotation angle θ, tilt, etc.) of the substrate 100 placed on the laser processing platform. It reflects the deviation between the actual position of the substrate 100 and the platform's reference coordinate system. The pose parameters are calculated by capturing the edges of the substrate 100 or pre-marked features (such as the substrate 100 outline and positioning holes) with an industrial camera and combining them with image recognition algorithms (such as edge detection and Hough transform). If the substrate 100 has positioning holes, the hole coordinates can be detected using a mechanical probe or laser displacement sensor to infer the pose. The specific method for determining the pose is not limited here.

[0025] S200 , determining a laser marking map according to the circuit graphic information and the first posture information, where the laser marking map indicates a laser marking position on the substrate 100 .

[0026] Specifically, based on the specific circuit indicated by the circuit graphic information, the marking points that need to be marked on both sides of the circuit are determined, that is, the specific circuit can be obtained based on the marking points. Based on the substrate posture indicated by the first position information, the layout area of ​​the circuit indicated by the circuit graphic information on substrate 100 is determined, and the coordinates and size of the layout area are matched with the marking points on the circuit, thereby generating a corresponding laser marking map. Based on the laser marking map, the specific laser marking position on substrate 100 and the size of the circuit marking point at the laser marking position can be determined.

[0027] S300 , controlling a laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain line marking points.

[0028] Specifically, according to the laser marking position on the laser marking map and the size of the line marking point at the laser marking position, line marking points of corresponding sizes are etched in sequence at the laser marking position. The marking order of the specific laser marking position is determined according to the specific line and is not specifically limited here. After the laser emitting device completes the marking, the line marking point is photographed by a camera set above the substrate 100, so as to verify the size (such as diameter deviation ≤ 0.05mm) and clarity (no blur or incompleteness) of the line marking point based on the captured video or photo, and measure the deviation between the actual line marking point coordinates and the theoretical value of the map. If it is ≤ 0.03mm, it is qualified (this is only an example, the specific deviation value is determined according to the specific line accuracy and process, and is not limited here). Otherwise, the laser emitting device is controlled to etch and smooth the unqualified line marking points, and re-etch the line marking points.

[0029] S400 , obtaining copper layer thickness information of the substrate 100 .

[0030] Specifically, the copper layer thickness information indicates the specific copper layer thickness on the substrate 100. The copper layer thickness information can be pre-entered and stored based on the different substrate 100 models, so that the corresponding copper layer thickness information is automatically retrieved when the specific substrate 100 model is identified. The copper layer thickness information can also be input in real time through an external input port or measured in real time by a measuring device disposed above the substrate 100. The specific measuring device can be a laser measuring device or an eddy current measuring device. The laser measuring device measures the copper layer thickness by the time difference of reflected light, while the eddy current measuring device uses the principle of electromagnetic induction to measure the copper layer thickness on a non-magnetic substrate 100 (such as FR-4). The specific measurement method is not limited here.

[0031] S500 , controlling the laser emitting device to cut the target circuit board 130 having the target circuit 120 on the substrate 100 according to the copper layer thickness information and the circuit marking points.

[0032] Specifically, the laser emitting device is controlled to perform laser cutting in sequence along the line marking points, and the specific unit laser energy (that is, the laser cutting rate) is determined according to the copper layer thickness indicated by the copper layer thickness information and the preset cutting time of the laser emitting device, and the specific laser divergence is determined according to the size of the line marking point, so as to cut out the specific target line 120; the copper layer and the plate are cut simultaneously at the line marking points around the target line 120, so as to cut the target circuit board 130 with the target line 120 from the substrate 100.

[0033] In some optional embodiments, determining a laser marking map based on the circuit graphic information and the first posture information includes: S210, determining a plurality of first marking points and a plurality of second marking points 110 according to the circuit graphic information and a preset marking rule, wherein the first marking points are arranged along both sides of the circuit indicated by the circuit graphic information, and the second marking points 110 surround the circuit indicated by the circuit graphic information; S220, determining a first coordinate position of the first marking point and a second coordinate position of the second marking point 110 according to the first pose information and the mapping ratio; S230 , respectively matching the first marking point with the first coordinate position and matching the second marking point 110 with the second coordinate position to obtain the laser marking map.

[0034] Specifically, refer to Figure 2 Based on the circuit diagram information, the first and second marking points 110 are set in combination with the preset marking rules. The first marking points must be set closely to the circuit indicated by the circuit diagram, and arranged along both sides of the circuit. The arrangement must follow the spacing and quantity requirements in the preset rules. For example, a pair of marking points should be set at a certain distance every time a straight line is connected, and the number should be appropriately increased at the corners to accurately correspond to the direction and details of the circuit. The second marking points 110 should be arranged around the circuit indicated by the circuit diagram to form an encirclement of the circuit. Key positions on the periphery of the circuit, such as the vertices or edges of the minimum encirclement area, should be selected. At least three marking points should be set to form a stable encirclement structure, thereby achieving positioning of the entire range of the circuit and subsequent circuit board cutting.

[0035] After obtaining the first and second marker points 110, their actual coordinates on the substrate 100 are calculated using the first pose information of the substrate 100 and a preset mapping ratio. The first pose information reflects the initial position and posture of the substrate 100 on the processing platform, including translation, rotation angle, etc.; the mapping ratio is used to convert the dimensional units in the circuit graphic design into actual physical units on the substrate 100. Using the first pose information and the preset mapping ratio, the relative position of the first marker point in the design is converted and calculated to obtain its corresponding first coordinate position on the substrate 100. Similarly, the second marker point 110 is processed in the same manner to determine its corresponding second coordinate position, ensuring that the coordinate position accurately reflects the actual distribution of the marker points on the substrate 100.

[0036] Each first marking point is mapped one-to-one with its calculated first coordinate position, and each second marking point 110 is also mapped with its corresponding second coordinate position. The set of all marking points and their corresponding coordinate positions thus constitutes the desired laser marking pattern. This pattern clearly indicates the specific locations of each marking point on the substrate 100, facilitating subsequent laser etching operations.

[0037] In some optional embodiments, determining the plurality of first marking points and the plurality of second marking points 110 according to the circuit pattern information and a preset marking rule includes: S211, determining a line starting point, a line end point, a line turning point, and a line segment according to the circuit graphic information; S212, setting a start mark point 121 according to the starting point of the route, so that the start mark point 121 indicates the starting position of the route; S213, setting the section marking points 122 according to the line diameter and line spacing of the line segment, so that the section marking points 122 are arranged on both sides of the line segment; S214, setting a corner marking point 123 according to the corner of the route turning point, so that the corner marking point 123 indicates the arrangement direction of the section marking points 122 on the next route segment; S215, setting an end marking point 124 according to the end point of the route, so that the end marking point 124 indicates the end position of the route, and the start marking point 121, the section marking point 122, the corner marking point 123 and the end marking point 124 all belong to the first marking point; S216 , setting a plurality of second marking points 110 at the periphery of the circuit indicated by the circuit graphic information, so that the plurality of second marking points 110 surround the circuit indicated by the circuit graphic information.

[0038] Specifically, key features are first extracted from the circuit graphic information to identify the line starting point, line end point, line inflection point, and line segment. The first marking point is refined and set. A start marking point 121 is set based on the line starting point. This marking point directly corresponds to the starting position of the line and clearly indicates the beginning of the line. Segment marking points 122 are set based on the line diameter and line spacing of the line segment. Segment marking points 122 are arranged in an orderly manner on both sides of the line segment. Their arrangement density and spacing must conform to preset rules to adapt to the actual parameters of the line segment and ensure that they can accurately reflect the direction of the line segment. Corner marking points 123 are set according to the corner characteristics of the line inflection point. Since the line direction changes at the inflection point, the function of corner marking point 123 is to clearly indicate the arrangement direction of segment marking points 122 on the next line segment, ensuring the continuity of the subsequent marking point arrangement. End marking point 124 is set based on the line end point to clearly indicate the end position of the line. The start marker 121, the section marker 122, the corner marker 123, and the end marker 124 collectively constitute the first marker, which comprehensively covers all key parts of the route from its starting point to its end point. Laser cutting based on the first marker can thus yield the corresponding target route 120. The start marker 121, the section marker 122, the corner marker 123, and the end marker 124 can be identified by different colors, shapes, or arrangements, without specific limitation.

[0039] For the second marking points 110, multiple ones are set in the peripheral area of ​​the circuit indicated by the circuit graphic information. The distribution of these second marking points 110 needs to follow preset rules to ensure that they can form an encirclement state of the entire circuit, thereby locating and defining the scope of the circuit as a whole.

[0040] In some optional embodiments, controlling the laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain line marking points includes: S310, controlling the laser emitting device to emit a first laser with a first preset laser energy to perform laser etching at the first coordinate position to obtain the first marking point, wherein a first depth of the first marking point is less than or equal to the thickness of the copper layer; S320, control the laser emitting device to emit a second laser with a second preset laser energy to perform laser etching at the second coordinate position to obtain the second marking point 110, the second depth of the second marking point 110 is less than or equal to the substrate thickness, and the substrate thickness is equal to the plate thickness plus the copper layer thickness; the first marking point and the second marking point 110 both belong to the line marking points.

[0041] Specifically, the laser emitting device is controlled to emit a first laser having a first preset laser energy, and laser etching is performed on the substrate 100 according to the first coordinate position corresponding to the first marking point in the laser marking pattern. During the etching process, it is necessary to ensure that the first depth formed by the first marking point is less than or equal to the thickness of the copper layer. This is because the first marking point is mainly used for the precise positioning of the auxiliary circuit, and only a recognizable mark needs to be formed on the copper layer to avoid excessive etching depth that may damage the substrate 100 and affect the insulation and mechanical strength of the substrate 100.

[0042] Then, the laser emitting device is controlled to emit a second laser with a second preset laser energy, and an etching operation is performed according to the second coordinate position corresponding to the second marking point 110 in the laser marking pattern, thereby obtaining the second marking point 110. Here, it is required that the second depth of the second marking point 110 is less than or equal to the substrate thickness, and the substrate thickness is the sum of the plate thickness and the copper layer thickness. Since the second marking point 110 plays the role of overall surrounding the circuit and assisting in macro positioning, appropriately deepening the etching depth can make it easier to identify, and the laser emitting device cuts the substrate 100 according to the second marking point 110 to obtain the target circuit board 130. Therefore, the depth of the second marking point 110 does not need to exceed the substrate thickness.

[0043] In some optional embodiments, obtaining the copper layer thickness information of the substrate 100 includes: S410, emitting a first magnetic field having a preset magnetic field strength toward the substrate 100, so as to generate an eddy current magnetic field in the copper layer on the substrate 100; S420, superimposing the first magnetic field and the eddy current magnetic field to obtain a second magnetic field; S430: Obtain copper layer thickness information according to the second magnetic field and a preset thickness relationship table, where the preset thickness relationship table is used to indicate a corresponding relationship between the second magnetic field and the copper layer thickness.

[0044] Specifically, an eddy current measuring device emits a first magnetic field of a preset magnetic field strength toward substrate 100. This first magnetic field acts on the copper layer on the surface of substrate 100. Since copper is a conductive material, the alternating first magnetic field induces induced currents within the copper layer, known as eddy currents. The presence of eddy currents in turn generates an eddy current magnetic field. The strength of this eddy current magnetic field is closely related to the thickness of the copper layer. The thicker the copper layer, the more significant the eddy current effect and the stronger the generated eddy current magnetic field.

[0045] The second magnetic field is generated by superimposing the emitted first magnetic field and the eddy current magnetic field generated by the copper layer. The direction of the eddy current magnetic field is opposite to that of the first magnetic field (according to Lenz's law), so the superimposed second magnetic field is the result of the interaction between the two. Its magnetic field strength will change due to the offsetting effect of the eddy current magnetic field, and this change is specifically related to the thickness of the copper layer.

[0046] The copper layer thickness is determined based on the obtained second magnetic field and a preset thickness relationship table. This table, established through extensive early experiments, details the relationship between the specific parameters (such as magnetic field strength and magnetic induction intensity) of the second magnetic field, formed by the superposition of the first and eddy current magnetic fields, and the corresponding copper layer thicknesses for different copper layer thicknesses. Once the current second magnetic field parameters are obtained, the corresponding entry in this relationship table can be searched to accurately determine the copper layer thickness on substrate 100.

[0047] In some optional embodiments, controlling the laser emitting device to cut the target circuit board 130 having the target circuit 120 on the substrate 100 according to the copper layer thickness information and the circuit marking point includes: S510, determining a first unit laser energy of the laser emitting device according to the copper layer thickness information and a first preset etching time, where the first unit laser energy represents the laser energy per unit area; S520: configuring a first laser divergence of the laser emitting device according to a first diameter of the first marking point, where the first laser divergence represents an etching area of ​​the laser at the first marking point; S530, determining a second unit laser energy of the laser emitting device according to the substrate thickness and the second preset etching time, wherein the second unit laser energy represents the laser energy per unit area, and the substrate thickness is equal to the plate thickness plus the copper layer thickness; S540, configuring a second laser divergence of the laser emitting device according to a second diameter of the second marking point 110, where the second laser divergence represents an etching area of ​​the laser at the second marking point 110; S550, controlling the laser emitting device to sequentially emit a third laser having the first laser divergence and the first unit laser energy along the first marking point, so that the third laser etches the copper layer within the first preset etching time to obtain the target circuit 120; S560, controlling the laser emitting device to sequentially emit a fourth laser having the second laser divergence and the second unit laser energy along the second marking point 110, so that the fourth laser etches the substrate 100 within the second preset etching time to obtain the target circuit board 130.

[0048] Specifically, the first unit laser energy of the laser emitting device is calculated based on the obtained copper layer thickness information and the first preset etching time. The first unit laser energy represents the laser energy of the third laser per unit area. Its value must ensure that the copper layer can be accurately etched within the first preset etching time to form the target circuit 120. The thicker the copper layer, the greater the first unit laser energy required. At the same time, the first preset etching time must be matched to ensure that the etching effect meets the requirements. At the same time, the first laser divergence of the laser emitting device is configured; the first laser divergence is set according to the first diameter of the first marking point. The first laser divergence reflects the etching area of ​​the third laser at the first marking point. By adjusting the first laser divergence, the etching range of the third laser is adapted to the first diameter of the first marking point, ensuring that the etching at the first marking point is accurate and in place.

[0049] The second unit laser energy is calculated based on the substrate thickness (substrate thickness is the sum of the plate thickness and the copper layer thickness) and the second preset etching time. The second unit laser energy represents the laser energy per unit area of ​​the fourth laser. Because the material and thickness of substrate 100 differ from those of the copper layer, the second unit laser energy must be set to effectively etch substrate 100 within the second preset etching time without causing excessive damage to substrate 100.

[0050] Next, configure the second laser divergence. This is set based on the second diameter of the second marking point 110. The second laser divergence reflects the area etched by the fourth laser at the second marking point 110. By adjusting the second laser divergence, the area etched by the fourth laser at the second marking point 110 matches the second diameter of the second marking point 110, ensuring an accurate etching range on the substrate 100 that meets the overall contour requirements of the target circuit board 130.

[0051] Then, the laser emitting device is controlled to emit a third laser along the first marking point. The third laser has the previously configured first laser divergence and first unit laser energy. Within the first preset etching time, the third laser sequentially etches the copper layer at the plurality of first marking points, thereby forming the desired target circuit 120 along the first marking points.

[0052] Finally, the laser emitting device is controlled to emit a fourth laser along the second marking point 110. The fourth laser has a second laser divergence and a second unit laser energy. Within the second preset etching time, the fourth laser sequentially etches the substrate 100 at the second marking point 110, ultimately obtaining a complete target circuit board 130 having the target circuit 120.

[0053] During the laser cutting process, due to the influence of multiple factors such as temperature, air temperature, air humidity and air radiation, the laser may not penetrate the copper layer and / or substrate 100, that is, the laser energy is insufficient. At this time, the laser energy is linearly increased to cut other non-circuit areas on the substrate 100 until the copper layer or substrate 100 is just penetrated, and then return to the cutting point, determine the corresponding laser energy increment, and cut the cutting point that was not cut through by the laser increment, so as to achieve the effect of just cutting through the copper layer or substrate 100; when cutting other points, the laser energy increment is increased synchronously with the originally set laser energy change, so as to achieve the effect of just cutting through the copper layer or substrate 100, and the laser energy at this time is set to the preset laser energy.

[0054] In some optional embodiments, after obtaining the target route 120, the method further includes: S551, obtaining the copper layer area 125 between the target circuits 120; S552, determining a third unit laser energy of the laser emitting device according to the copper layer thickness information and a third preset etching time; S553, adjusting the third laser divergence of the laser emitting device according to the copper layer area 125, so that the laser of the laser emitting device adapts to the copper layer area 125; S554 , controlling the laser emitting device to emit a fifth laser having the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer region 125 within the third preset etching time.

[0055] Specifically, refer to Figure 2 and Figure 3 , obtain the copper layer area 125 between the target circuits 120. The copper layer area 125 is the excess copper layer portion outside the target circuit 120 that needs to be removed. Determine the third unit laser energy of the laser emitting device based on the copper layer thickness information and the third preset etching time. The third unit laser energy represents the laser energy of the fifth laser per unit area. Since the copper layer between the target circuits 120 needs to be etched, its thickness is consistent with the copper layer where the target circuit 120 was previously located. Therefore, it is necessary to combine the copper layer thickness information and match the third preset etching time to set it. Ensure that the third unit laser energy can effectively remove the copper layer in this area within the third preset etching time, while avoiding unnecessary effects on the substrate 100 caused by excessive energy.

[0056] Next, the third laser divergence of the laser emitting device is adjusted based on the copper layer area 125. The third laser divergence determines the area of ​​the laser etching in the copper layer area 125. By adjusting it, the laser coverage is adapted to the size and shape of the copper layer area 125, ensuring that the copper layer in the area can be accurately and comprehensively etched without missing any excess parts or damaging the adjacent target circuit 120.

[0057] Finally, the laser emitting device is controlled to emit a fifth laser beam having a third laser divergence and a third unit laser energy. During the third predetermined etching time, the fifth laser beam is applied to copper layer region 125, etching the copper layer therein. This step removes the excess copper layer between target circuits 120, leaving the structure of target circuits 120 more distinct and meeting the requirements for circuit board use.

[0058] After the target circuit board 130 is cut, there is corresponding residue. The cleaning device is controlled to clean and remove the residue, thereby avoiding affecting the quality of the target circuit board 130.

[0059] Implementation of the embodiments of the present invention provides the following beneficial effects: The embodiments of the present invention provide a method for laser cutting circuits, comprising: obtaining circuit pattern information and first pose information of a substrate 100; determining a laser marking pattern based on the circuit pattern information and the first pose information, the laser marking pattern indicating the position of the laser mark on the substrate 100; controlling a laser emitting device to perform laser etching on the substrate 100 based on the laser marking pattern to obtain circuit marking points; obtaining copper layer thickness information of the substrate 100; and controlling the laser emitting device to cut the substrate 100 based on the copper layer thickness information and the circuit marking points to obtain a target circuit board 130 having a target circuit 120. The laser marking position on the substrate 100 is determined based on the specific circuit pattern and substrate pose, thereby performing laser etching on the substrate 100 to obtain the corresponding circuit marking points, and then sequentially cutting the copper layer based on the circuit marking points to obtain the target circuit 120. After cutting the substrate 100, the target circuit 120 board is obtained, thereby rapidly completing the cutting of circuits and circuit boards, and improving the efficiency and accuracy of circuit production for thick copper circuit boards.

[0060] like Figure 4 As shown, in a second aspect, an embodiment of the present invention further provides a system for laser cutting circuits, including: A first acquiring device, configured to acquire circuit pattern information and first pose information of the substrate 100; a first processing device, configured to determine a laser marking pattern according to the circuit pattern information and the first posture information, wherein the laser marking pattern indicates a laser marking position on the substrate 100; A second processing device, configured to control a laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain line marking points; A second acquiring device, configured to acquire the copper layer thickness information of the substrate 100; A third processing device is used to control the laser emitting device to cut the target circuit board 130 having the target circuit 120 on the substrate 100 according to the copper layer thickness information and the circuit marking point; A control device is used to control the first acquisition device, the second acquisition device, the first processing device, the second processing device and the third processing device to coordinate their work.

[0061] In some optional embodiments, the following are also integrated on the same process tool: a video device for acquiring a video image of the substrate 100; An eddy current measuring device is used to emit a first magnetic field having a preset magnetic field strength toward the substrate 100 so as to generate an eddy current magnetic field in the copper layer on the substrate 100, and measure the thickness information of the copper layer based on the first magnetic field and the eddy current magnetic field; The cleaning device is used to clean the residue on the substrate 100 .

[0062] In a third aspect, an embodiment of the present invention provides a circuit board, which is cut by the above-mentioned method of laser cutting circuits.

[0063] It can be seen that the contents of the above method embodiments are all applicable to the present system embodiments. The functions specifically implemented by the present system embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0064] It is understood that all or some steps, systems in the disclosed method above can be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital information processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application specific integrated circuit. Such software can be distributed on a computer-readable medium, and the computer-readable medium can include computer storage media (or non-transitory media) and communication media (or temporary media). As known to those of ordinary skill in the art, the term computer storage medium is included in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data) and is volatile and non-volatile, removable and non-removable media. Computer storage media includes but is not limited to RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, disk storage or other magnetic storage device, or can be used to store desired information and any other medium that can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically embodies computer-readable instructions, data structures, program modules, or other data in modulated data information such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0065] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the spirit of the present invention.

Claims

1. A method for laser cutting a circuit, characterized in that: include: Obtaining circuit graphic information and first position information of the substrate; determining a laser marking map according to the circuit graphic information and the first posture information, wherein the laser marking map indicates a laser marking position on the substrate; According to the laser marking pattern, a laser emitting device is controlled to perform laser etching on the substrate to obtain line marking points; Obtain the copper layer thickness information of the substrate; The laser emitting device is controlled according to the copper layer thickness information and the circuit marking points to cut a target circuit board having a target circuit on the substrate.

2. The method for laser cutting a circuit according to claim 1, characterized in that: The determining of the laser marking map according to the circuit graphic information and the first posture information includes: Determining a plurality of first marking points and a plurality of second marking points according to the circuit graphic information and a preset marking rule, wherein the first marking points are arranged along both sides of the circuit indicated by the circuit graphic information, and the second marking points surround the circuit indicated by the circuit graphic information; Determine a first coordinate position of the first marking point and a second coordinate position of the second marking point according to the first pose information and the mapping ratio; The laser marking map is obtained by respectively making the first marking point correspond to the first coordinate position and the second marking point correspond to the second coordinate position.

3. The method for laser cutting a circuit according to claim 2, characterized in that: The determining of the plurality of first marking points and the plurality of second marking points according to the circuit graphic information and a preset marking rule includes: Determine a line starting point, a line end point, a line turning point, and a line segment according to the circuit graphic information; Setting a start mark point according to the starting point of the route so that the start mark point indicates the starting position of the route; Setting section marking points according to the line diameter and line spacing of the line section so that the section marking points are arranged on both sides of the line section; Setting a corner marking point according to the corner of the route turning point, so that the corner marking point indicates the arrangement direction of the section marking points on the next route segment; Setting a termination mark point according to the end point of the route, so that the termination mark point indicates the end position of the route, and the start mark point, the section mark point, the corner mark point and the termination mark point all belong to the first mark point; A plurality of second marking points are set at the periphery of the circuit indicated by the circuit pattern information, so that the plurality of second marking points surround the circuit indicated by the circuit pattern information.

4. The method for laser cutting a circuit according to claim 2, wherein: The method of controlling the laser emitting device to perform laser etching on the substrate according to the laser marking pattern to obtain line marking points includes: Controlling the laser emitting device to emit a first laser with a first preset laser energy to perform laser etching at the first coordinate position to obtain the first marking point, wherein a first depth of the first marking point is less than or equal to the thickness of the copper layer; The laser emitting device is controlled to emit a second laser with a second preset laser energy to perform laser etching at the second coordinate position to obtain the second marking point. The second depth of the second marking point is less than or equal to the substrate thickness, and the substrate thickness is equal to the plate thickness plus the copper layer thickness. The first marking point and the second marking point both belong to the line marking points.

5. The method for laser cutting a circuit according to claim 1, characterized in that: The obtaining of the copper layer thickness information of the substrate includes: emitting a first magnetic field having a preset magnetic field strength toward the substrate so as to generate an eddy current magnetic field in the copper layer on the substrate; Superimposing the first magnetic field and the eddy current magnetic field to obtain a second magnetic field; The copper layer thickness information is obtained according to the second magnetic field and a preset thickness relationship table, where the preset thickness relationship table is used to indicate a corresponding relationship between the second magnetic field and the copper layer thickness.

6. The method for laser cutting a circuit according to claim 2, characterized in that: The method of controlling the laser emitting device to cut a target circuit board having a target circuit on the substrate according to the copper layer thickness information and the circuit marking point includes: Determining a first unit laser energy of the laser emitting device according to the copper layer thickness information and a first preset etching time, wherein the first unit laser energy represents the laser energy per unit area; configuring a first laser divergence of the laser emitting device according to a first diameter of the first marking point, wherein the first laser divergence represents an etching area of ​​the laser at the first marking point; Determining a second unit laser energy of the laser emitting device according to the substrate thickness and the second preset etching time, wherein the second unit laser energy represents the laser energy per unit area, and the substrate thickness is equal to the plate thickness plus the copper layer thickness; configuring a second laser divergence of the laser emitting device according to a second diameter of the second marking point, wherein the second laser divergence represents an etching area of ​​the laser at the second marking point; Controlling the laser emitting device to sequentially emit a third laser having the first laser divergence and the first unit laser energy along the first marking point, so that the third laser etches the copper layer within the first preset etching time to obtain the target circuit; The laser emitting device is controlled to sequentially emit a fourth laser having the second laser divergence and the second unit laser energy along the second marking point, so that the fourth laser etches the substrate within the second preset etching time to obtain the target circuit board.

7. The method for laser cutting a circuit according to claim 6, characterized in that: After obtaining the target route, the method further includes: Acquire the copper layer area between the target circuits; determining a third unit laser energy of the laser emitting device according to the copper layer thickness information and a third preset etching time; adjusting the third laser divergence of the laser emitting device according to the copper layer area so that the laser of the laser emitting device adapts to the copper layer area; The laser emitting device is controlled to emit a fifth laser having the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer area within the third preset etching time.

8. A system for laser cutting circuits, characterized in that: Including integrated on the same process machine: A first acquiring device, used to acquire circuit pattern information and first pose information of the substrate; a first processing device, configured to determine a laser marking map based on the circuit pattern information and the first posture information, wherein the laser marking map indicates a laser marking position on the substrate; a second processing device for controlling a laser emitting device to perform laser etching on the substrate to obtain line marking points according to the laser marking pattern; A second acquiring device is used to acquire the copper layer thickness information of the substrate; A third processing device is used to control the laser emitting device to cut a target circuit board having a target circuit on the substrate according to the copper layer thickness information and the circuit marking points; A control device is used to control the first acquisition device, the second acquisition device, the first processing device, the second processing device and the third processing device to coordinate their work.

9. The system according to claim 8, characterized in that Also included are the following integrated into the same process machine: a video device for acquiring a video image of the substrate; an eddy current measuring device, configured to emit a first magnetic field having a preset magnetic field strength toward a substrate so as to generate an eddy current magnetic field in a copper layer on the substrate, and to measure thickness information of the copper layer based on the first magnetic field and the eddy current magnetic field; The cleaning device is used to clean the residue on the substrate.

10. A circuit board, characterized in that: The circuit is cut by the laser cutting method according to any one of claims 1 to 7.

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