Manufacturing method of printed circuit board and printed circuit board

Abstract

The invention discloses a manufacturing method of a printed circuit board and the printed circuit board, and the manufacturing method comprises the steps: obtaining a board, and enabling the surface of the board to be provided with a resin layer; etching a circuit pattern on the surface of the plate to form a groove in the resin layer; a copper layer is deposited in the groove to fill the groove, a metal circuit arranged on the resin layer is formed, and the surface of the metal circuit and the surface of the resin layer are located on the same plane. Through the mode, the fine metal circuit can be well prepared, high speed, stability and accuracy of signal transmission can be ensured, the integration level of the printed circuit board can be effectively improved, the flatness of the board is ensured, the problem caused by uneven surface of a subsequent lamination section is avoided, and the reliability of the printed circuit board is ensured.

Description

Technical Field

[0001] The present application relates to the field of printed circuit boards, and in particular to a method for manufacturing a printed circuit board and a printed circuit board. Background Art

[0002] With the continuous advancement of technology, electronic products such as smartphones, tablets, and wearable devices are developing towards smaller sizes and higher performance. With the continuous advancement of integrated circuits and the significant improvement in chip performance and integration, new challenges have been posed to the performance and manufacturing process of printed circuit boards.

[0003] Printed circuit boards are required to achieve more functions within a limited space and carry more electronic components, while also ensuring high-speed, stable and accurate signal transmission.

[0004] Traditional printed circuit board manufacturing technology is unable to meet these increasingly stringent requirements and still needs to be improved. Summary of the Invention

[0005] In order to solve the above technical problems, the present application provides a method for manufacturing a printed circuit board and a printed circuit board, which can better prepare fine metal circuits, not only ensuring high-speed, stable and accurate signal transmission, but also effectively improving the integration of the printed circuit board, ensuring the flatness of the board, avoiding problems caused by uneven surface in the subsequent lamination stage, ensuring the reliability of the printed circuit board, and meeting production needs.

[0006] In order to solve the above technical problems, the technical solution adopted in this application first provides a method for manufacturing a printed circuit board.

[0007] The manufacturing method includes: obtaining a plate with a resin layer on the surface of the plate; etching a circuit pattern on the surface of the plate to form a groove in the resin layer; depositing a copper layer in the groove to fill the groove, forming a metal circuit set on the resin layer, and the surface of the metal circuit and the surface of the resin layer are in the same plane.

[0008] Among them, a metal layer is stacked on the surface of the resin layer; the step of etching a circuit pattern on the surface of the plate to form a groove in the resin layer includes: laminating, developing, exposing, and etching the circuit pattern on the surface of the metal layer to expose the resin layer; based on the circuit pattern of the metal layer, the resin layer is etched using an ion beam to form a groove between the metal layer and the resin layer; the step of depositing a copper layer in the groove to fill the groove to form a metal circuit set in the resin layer includes: removing the metal layer on the surface of the plate to form a metal circuit in the resin layer.

[0009] The step of depositing a copper layer in the groove to fill the groove and forming a metal circuit arranged on the resin layer includes: depositing a copper layer at the bottom of the groove and electroplating the groove to fill the groove.

[0010] Among them, the step of etching a circuit pattern on the surface of the plate to form a groove in the resin layer includes: etching a groove of an electroplating pattern on the surface of the plate to connect the groove of the circuit pattern with the groove of the electroplating pattern, and the width of at least part of the groove of the electroplating pattern is smaller than the width of the groove of the circuit pattern; the step of depositing a copper layer at the bottom of the groove and electroplating the groove to fill the groove includes: depositing a copper layer at the bottom of the groove of the electroplating pattern to form an electroplating circuit, so that during electroplating, the electroplating power supply is connected through the electroplating circuit for electroplating.

[0011] The step of depositing a copper layer in the groove to fill the groove and form a metal circuit arranged on the resin layer also includes: the metal circuit width is 3μm to 8μm, and the ratio of the groove depth to the metal circuit width is in the range of 1:1 to 2:1.

[0012] Among them, resin layers are respectively provided on both sides of the plate; the step of etching a circuit pattern on the surface of the plate to form grooves in the resin layer includes: etching circuit patterns on the surfaces of both sides of the plate to form grooves in the resin layers on both sides; depositing a copper layer in the groove to fill the groove to form a metal circuit provided in the resin layer, including: forming a circuit pattern in the resin layer on both sides of the plate.

[0013] The manufacturing method also includes: setting a second resin layer on the surface of the resin layer formed with the metal circuit, etching grooves in the second resin layer and depositing a copper layer to form a second metal circuit set in the second resin layer; heating and pressurizing the multi-layer board to make a printed circuit board.

[0014] To solve the above technical problems, the second aspect of the present application provides a printed circuit board, wherein the printed circuit board includes: a resin layer, the resin layer is arranged on the surface and / or inside the printed circuit board, the resin layer is provided with a metal route embedded in the resin layer, and the surface of the metal route and the surface of the resin layer are in the same plane; the printed circuit board is manufactured by the printed circuit board manufacturing method as described in any of the above items.

[0015] The printed circuit board comprises: at least two resin layers, which are arranged on the same side and / or two opposite sides of the board, and at least two metal circuits embedded in the surface of the resin layer.

[0016] The printed circuit board includes: a resin layer surface also embedded with electroplating circuits, the electroplating circuits are connected to the metal circuits, and at least part of the electroplating circuits is smaller in width than the metal circuits.

[0017] Different from the existing technology, the printed circuit board and the method for manufacturing the printed circuit board provided by the present application etch a circuit pattern on the surface of the board, so that the resin layer is formed with grooves, and metal circuits are formed in the grooves. It can better prepare fine metal circuits and achieve finer lines and smaller line spacing. It can not only ensure high-speed, stable and accurate signal transmission, but also effectively improve the integration of the printed circuit board, ensure the flatness of the board, avoid problems caused by uneven surface in the subsequent lamination stage, and ensure the reliability of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a partial structural diagram of the first embodiment of the printed circuit board of the present application;

[0019] Figure 2 This is a flow chart of the processing steps of the first embodiment of the method for manufacturing a printed circuit board of the present application;

[0020] Figure 3a to Figure 3c This is a structural schematic diagram group of processing steps of the first embodiment of the method for manufacturing a printed circuit board of the present application;

[0021] Figure 4 This is a flow chart of the processing steps of the second embodiment of the method for manufacturing a printed circuit board of the present application;

[0022] Figure 5a to Figure 5f This is a structural schematic diagram group of processing steps of the second embodiment of the method for manufacturing a printed circuit board of the present application;

[0023] Figure 6 This is a flow chart of the processing steps of the third embodiment of the method for manufacturing a printed circuit board of the present application;

[0024] Figure 7a to Figure 7c This is a structural schematic diagram group of processing steps of the third embodiment of the method for manufacturing a printed circuit board of the present application;

[0025] Figure 8 This is a schematic flow chart of the processing steps of the fourth embodiment of the method for manufacturing a printed circuit board of the present application;

[0026] Figure 9a to Figure 9d This is a structural schematic diagram group of processing steps of a fourth embodiment of the method for manufacturing a printed circuit board of the present application;

[0027] Figure 10 It is a partial structural diagram of an embodiment of the printed circuit board of the present application. DETAILED DESCRIPTION

[0028] The present application is described in detail below with reference to the accompanying drawings and implementation methods.

[0029] This application first provides a method for manufacturing a printed circuit board, which is used to manufacture a printed circuit board with fine metal circuits. Figure 1 , Figure 1 This is a partial structural diagram of an embodiment of the printed circuit board of the present application. The manufacturing method of the printed circuit board 200 of the present application can be used to manufacture the printed circuit board 200 as follows: Figure 1 The metal circuit 102 is disposed in the resin layer 101 . The specific structure of the printed circuit board 200 is determined based on the manufacturing method and production requirements of the printed circuit board 200 and is not limited thereto.

[0030] See also Figure 2 and Figure 3a to Figure 3c , Figure 2 It is a flow chart of the processing steps of an embodiment of a method for manufacturing a printed circuit board of the present application. Figure 3a to Figure 3c This is a structural schematic diagram group of processing steps of the first embodiment of the method for manufacturing a printed circuit board of the present application.

[0031] like Figure 2 As shown, the method for manufacturing the printed circuit board 200 in this embodiment includes:

[0032] S101: Get the plate 100. Figure 3a As shown, a resin layer 101 is provided on the surface of the plate 100 .

[0033] The obtained plate 100 can be a plate 100 that has been pre-treated through multiple steps. It can be metal-plated to increase the hardness of the plate 100 before being made into the resin layer 101, or the surface can be roughened to improve the bonding between the layers of the plate 100. The resin layer 101 can be made of semi-cured sheet, epoxy resin, polyphenylene ether, vinyl resin, or a variety of resins and fillers, such as phthalonitrile-terminated polyphenylene ether, amino-terminated polyetherimide and inorganic fillers.

[0034] like Figure 3b As shown, S102 : etching a circuit pattern on the surface of the plate 100 , so that the resin layer 101 is formed with a groove 103 .

[0035] A groove 103 is processed on the surface of the resin layer 101 by ion beam bombardment or laser etching. The circuit pattern may include a blind hole or through hole pattern interconnected with other metal circuits 102. The depth of the groove 103 can be 3-5μm on the surface of the groove 103. The thickness of the welding resin layer 101 can be 1 to 3 times the thickness of the metal circuit 102. The depth of the etched groove 103 is determined according to the thickness of the metal circuit 102.

[0036] like Figure 3cAs shown, S103: depositing a copper layer in the groove 103 to fill the groove 103, thereby forming a metal circuit 102 disposed on the resin layer 101. The surface of the metal circuit 102 and the surface of the resin layer 101 are in the same plane.

[0037] By depositing a copper layer on a non-conductive surface, a metal circuit 102 with uniform thickness and dense plating can be formed. Before depositing the copper layer, rough grinding, water washing, dilute acid washing or degreasing can be performed to improve the bonding between the deposited copper layer and the resin layer 101.

[0038] The metal circuit 102 formed by the deposited copper layer is directly formed in the resin layer 101, which better ensures the flatness of the surface of the plate 100 and avoids affecting the subsequent lamination process.

[0039] See also Figure 4 and Figure 5a to Figure 5f , Figure 4 It is a flow chart of the processing steps of the second embodiment of the method for manufacturing a printed circuit board of the present application. Figure 5a to Figure 5f This is a structural schematic diagram group of processing steps of the second embodiment of the method for manufacturing a printed circuit board of the present application.

[0040] S201: Obtain a plate 100. A resin layer 101 is provided on the surface of the plate 100. In an optional embodiment, as Figure 5a As shown, a metal layer 104 is laminated on the surface of the resin layer 101 .

[0041] The obtained plate 100 may be a plate 100 that has been pre-processed through multiple steps. Before being made into the resin layer 101 , the plate 100 may be metal-plated to increase its hardness, or surface roughening may be performed to improve the bonding between the layers of the plate 100 .

[0042] The resin layer 101 can be made of prepreg, epoxy resin, polyphenylene ether, vinyl resin, or a variety of resins and fillers, such as phthalonitrile-terminated polyphenylene ether, amino-terminated polyetherimide, and inorganic fillers.

[0043] The metal layer 104 may be a copper layer, a silver layer, a tin layer, or a copper alloy layer, a silver alloy layer, a tin alloy layer, or the like. The metal layer 104 can be formed on the surface of the resin layer 101 by processes such as metal deposition, gluing, and thermal welding, depending on the material of the metal layer 104. The thickness of the metal layer 104 can be 0.1 to 2 μm, and the thickness of the metal layer 104 on the surface of the resin layer 101 can be determined based on the thickness or width of the designed metal circuit 102.

[0044] In an optional embodiment, the step of etching a circuit pattern on the surface of the plate 100 to form the groove 103 on the resin layer 101 includes: Figure 5bAs shown, S202 : performing lamination, development, exposure, and etching of circuit patterns on the surface of the metal layer 104 to expose the resin layer 101 .

[0045] In other embodiments, the metal layer 104 may be etched by laser etching, electric discharge machining, or the like, so as to expose the resin layer 101 with a circuit pattern.

[0046] like Figure 5c As shown, S203 : based on the circuit pattern of the metal layer 104 , the resin layer 101 is etched using an ion beam, so that a groove 103 is formed between the metal layer 104 and the resin layer 101 .

[0047] After the metal layer 104 is etched, the exposed resin layer 101 is ion beam etched, which can effectively protect the area covered by the metal layer 104 from being ion beam etched, thereby ensuring the pattern accuracy of the groove 103 formed by the resin layer 101, the clarity of the pattern edge and the flatness of the groove wall of the groove 103, thereby improving the quality of the formed metal circuit 102.

[0048] In an optional embodiment, as Figure 5d As shown, the step of etching a circuit pattern on the surface of the plate 100 to form a groove 103 in the resin layer 101 includes: etching the groove 103 of the electroplating pattern on the surface of the plate 100, so that the groove 103 of the circuit pattern is connected to the groove 103 of the electroplating pattern, and the width of at least part of the groove 103 of the electroplating pattern is smaller than the width of the groove 103 of the circuit pattern; depositing a copper layer at the bottom of the groove 103, and electroplating the groove 103 to fill the groove 103 includes: depositing a copper layer at the bottom of the groove 103 of the electroplating pattern to form an electroplating circuit, so that during electroplating, the electroplating power supply is connected through the electroplating circuit to perform electroplating.

[0049] In an optional embodiment, the step of depositing a copper layer in the groove 103 to fill the groove 103 and forming the metal circuit 102 disposed on the resin layer 101 includes: Figure 5e As shown, S204 : depositing a copper layer at the bottom of the groove 103 , and electroplating the groove 103 to fill the groove 103 .

[0050] The deposited copper layer provides a uniform conductive bottom layer. The copper layer is further thickened by electroplating to form a uniform copper layer, which can ensure that the formed metal circuit 102 has good conductivity and is suitable for metal circuits 102 with complex structures such as blind holes or multiple corners.

[0051] like Figure 5f As shown, S205 : removing the metal layer 104 on the surface of the plate 100 , and forming a metal circuit 102 on the resin layer 101 .

[0052] The metal layer 104 on the surface can be removed by chemical corrosion, physical stripping, plasma etching or laser removal, retaining the resin layer 101 and the metal circuit 102 embedded in the surface of the resin layer 101, ensuring that the surface of the metal circuit 102 and the surface of the resin layer 101 are in the same plane, which can better ensure the flatness of the surface of the board 100 and avoid affecting the subsequent lamination process.

[0053] In an optional embodiment, the width of the formed metal line 102 is 3 μm to 8 μm, and the ratio of the depth of the groove 103 to the width of the metal line 102 is in the range of 1:1 to 2:1.

[0054] The width of the groove 103 is designed based on the width of the metal circuit 102 . The depth and width of the groove 103 formed by the metal layer 104 and the resin layer 101 will affect subsequent processes and the quality of the metal circuit 102 after molding.

[0055] Based on the different depths of the grooves 103, a copper layer is deposited or electroplated on the basis of the deposited copper layer to form the metal circuit 102. The width of the metal circuit 102 is 3 to 8 μm. Based on the different functions of the circuit, it can also range from 3 to 5 μm or 5 to 8 μm, such as 3 μm, 3.5 μm, 4 μm, 5 μm, 6.5 μm, 7.25 μm, 8 μm, etc. The corresponding thickness of the metal circuit 102, i.e., the line height, is 3 to 5 μm, such as 3 μm, 3.25 μm, 3.5 μm, 4 μm, 4.75 μm, and 5 μm.

[0056] In other embodiments, the depth of the groove 103 may also be the depth of the groove 103 formed by the resin layer 101 , that is, the thickness of the metal circuit 102 .

[0057] Please refer to Figure 6 and Figure 7a to Figure 7c , Figure 6 It is a flow chart of the processing steps of the third embodiment of the method for manufacturing a printed circuit board of the present application. Figure 7a to Figure 7c This is a structural schematic diagram group of processing steps of the third embodiment of the method for manufacturing a printed circuit board of the present application.

[0058] S301: Obtain the plate 100. In an optional embodiment, as Figure 7a As shown, resin layers 101 are provided on both surfaces of the plate 100 .

[0059] The steps of etching circuit patterns on both sides of the plate 100 to form grooves 103 on the resin layers 101 on both sides include: Figure 7b As shown, S302 : etching a circuit pattern on the surface of the plate 100 , so that the resin layer 101 is formed with a groove 103 .

[0060] The two sides of the plate 100 can be processed simultaneously, or one side can be processed sequentially. Steps S301 and S302 of obtaining the plate 100 and etching the groove 103 in the resin layer 101 can refer to steps S101 and S102 and will not be described in detail here.

[0061] In some optional embodiments, a metal layer 104 can be stacked on the resin layer 101 of the plate 100. Referring to steps S201 and S202, grooves 103 are etched on the metal layer 104 and the resin layer 101. The single-sided plate 100 can be processed first, or the grooves 103 on the metal layers 104 on both sides can be etched first, and then the metal layers 104 on both sides can be processed.

[0062] like Figure 7c As shown, S303: depositing a copper layer in the groove 103 to fill the groove 103, forming metal circuits 102 on both sides of the plate 100. The surface of the metal circuit 102 and the surface of the resin layer 101 are in the same plane.

[0063] In some optional embodiments, referring to steps S201 to S203, a metal layer 104 is stacked on the resin layer 101 of the obtained plate 100 to effectively protect the area covered by the metal layer 104 from being ion beam etched, thereby ensuring the pattern accuracy of the groove 103 formed by the resin layer 101, the clarity of the pattern edge and the flatness of the groove 103 wall, thereby improving the quality of the formed metal circuit 102.

[0064] In other embodiments, the plate 100 having double-sided metal circuits 102 can be cut and then surface treated to produce a printed circuit board 200 having only single-sided metal circuits 102. This production of single-sided metal circuits 102 can improve the efficiency of depositing the copper layer or electroplating when producing the printed circuit board 200.

[0065] See also Figure 8 and Figure 9a to Figure 9d , Figure 8 It is a flow chart of the processing steps of the fourth embodiment of the method for manufacturing a printed circuit board of the present application. Figure 9a to Figure 9d This is a structural schematic diagram group of processing steps of the fourth embodiment of the method for manufacturing a printed circuit board of the present application.

[0066] S401: Obtain a plate 100. A resin layer 101 is provided on the surface of the plate 100. S402: Etch a circuit pattern on the surface of the plate 100, forming grooves 103 in the resin layer 101. S403: Deposit a copper layer in the grooves 103 to fill them, forming metal circuits 102 disposed on the resin layer 101. The surface of the metal circuits 102 is flush with the surface of the resin layer 101. Steps S401-S403 can be referred to as S101-S103 and are not further described here.

[0067] In an optional embodiment, the manufacturing method further includes: S404: Figure 9a As shown, a second resin layer 1011 is provided on the surface of the resin layer 101 on which the metal circuit 102 is formed. Figure 9b As shown, a groove 103 is etched in the second resin layer 1011 and a copper layer is deposited, as shown in FIG. Figure 9c As shown, a second metal line 1021 is formed on the second resin layer 1011 .

[0068] The multi-layer metal circuit 102 layer can integrate more metal circuits 102. The metal circuit 102 of this embodiment is formed on the resin layer 101, and its line width and line spacing can be very fine, providing better circuit performance, improving the circuit's current load capacity and conductive speed, and improving the quality of the finished printed circuit board 200.

[0069] In other embodiments, a resin layer 101 may be further added on the second resin layer 1011 to prepare a multi-layer metal circuit 102 .

[0070] like Figure 9d As shown, S405: the multi-layer plate 100 is heated and pressurized to form a printed circuit board 200.

[0071] Under high temperature and high pressure conditions, the resin layer 101 and the second resin layer 1011 formed in stages are melted, thereby bonding the layers into a whole to form a finished printed circuit board 200 .

[0072] In order to solve the above technical problems, the second aspect of the present application provides a printed circuit board 200.

[0073] See also Figure 10 , Figure 10 It is a partial structural diagram of an embodiment of a printed circuit board 200 of the present application.

[0074] The printed circuit board 200 includes: a resin layer 101, the resin layer 101 is arranged on the surface and / or inside the printed circuit board 200, the resin layer 101 is provided with a metal line embedded in the resin layer 101, and the surface of the metal line 102 is in the same plane as the surface of the resin layer 101; the printed circuit board 200 is manufactured by any of the above-mentioned methods for manufacturing the printed circuit board 200.

[0075] In an optional embodiment, the printed circuit board 200 includes: a surface of the resin layer 101 further embedded with an electroplating circuit, the electroplating circuit is connected to the metal circuit 102 , and at least part of the electroplating circuit is smaller in width than the metal circuit 102 .

[0076] The metal circuit 102 is formed by a groove 103 that connects the circuit pattern and the electroplating pattern. The width of the groove 103 of at least part of the electroplating pattern is smaller than the width of the groove 103 of the circuit pattern. During electroplating, the electroplating power supply is connected to the electroplating circuit to form the metal circuit 102. The specific structure can be referred to Figure 5d Schematic diagram of the structure of the processing steps of the second embodiment of the method for manufacturing the printed circuit board 200 of the present application.

[0077] In an optional embodiment, the width of the formed metal circuit 102 is 3 to 8 μm, and can range from 3 to 5 μm or 5 to 8 μm based on the function of the circuit, and can be 3 μm, 3.5 μm, 4 μm, 5 μm, 6.5 μm, 7.25 μm, 8 μm, etc. The corresponding thickness of the metal circuit 102 line, that is, the line height, is 3 to 5 μm, and can be 3 μm, 3.25 μm, 3.5 μm, 4 μm, 4.75 μm, or 5 μm.

[0078] During the manufacturing process, the surface of the metal circuit 102 and the surface of the resin layer 101 are ensured to be in the same plane, which can better ensure the flatness of the surface of the board 100, avoid affecting the subsequent lamination process, and improve the quality of the formed printed circuit board 200.

[0079] In an optional embodiment, the printed circuit board 200 includes: at least two resin layers 101, the resin layers 101 are arranged on the same side and / or opposite sides of the board 100, and at least two layers of metal circuits 102 are embedded in the surface of the resin layer 101.

[0080] In other embodiments, the formed printed circuit board 200 may be a multi-layer printed circuit board 200, or a double-sided printed circuit board 200 having metal traces. The specific structure can be referred to Figure 7c A structural schematic diagram of the processing steps of the third embodiment of the method for manufacturing a printed circuit board of the present application.

[0081] In a specific embodiment, the printed circuit board 200 includes a metal circuit 102 and a second metal circuit 1021 provided on the resin layer 101. The specific structure can be referred to Figure 9d A structural schematic diagram of the processing steps of the fourth embodiment of the method for manufacturing a printed circuit board of the present application.

[0082] The multi-layer metal circuit 102 can integrate more metal circuits 102. The metal circuit 102 of this embodiment is formed on the resin layer 101, and its line width and line spacing can be very fine, providing better circuit performance, improving the circuit's current load capacity and conductive speed, and improving the quality of the finished printed circuit board 200.

[0083] Through the above-mentioned method, a printed circuit board and a method for manufacturing the printed circuit board are provided, which can better prepare fine metal circuits, realize finer circuits and smaller line spacing, and through the metal layer-assisted etching of the resin layer, can ensure the high precision and uniformity of the formed metal circuits, which can not only ensure high-speed, stable and accurate signal transmission, but also effectively improve the integration of the printed circuit board, ensure the flatness of the board, avoid the problems caused by uneven surface in the subsequent lamination stage, and ensure the reliability of the printed circuit board.

[0084] In the several embodiments provided in this application, it should be understood that the disclosed systems and devices can be implemented in other ways. For the technical solutions in the embodiments of this application, it is obvious that the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. For example, the device implementation methods described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0085] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0086] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "coupled," "connected," "connected," "set," and "installed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0087] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of this embodiment.

[0088] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0089] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that: The production method comprises: Obtaining a plate, wherein a resin layer is provided on the surface of the plate; Etching a circuit pattern on the surface of the plate to form a groove on the resin layer; A copper layer is deposited in the groove to fill the groove, forming a metal circuit arranged on the resin layer, wherein the surface of the metal circuit and the surface of the resin layer are in the same plane.

2. The production method according to claim 1, characterized in that A metal layer is laminated on the surface of the resin layer; The step of etching a circuit pattern on the surface of the plate to form a groove in the resin layer includes: laminating, developing, exposing, and etching the circuit pattern on the surface of the metal layer to expose the resin layer; etching the resin layer using an ion beam based on the circuit pattern on the metal layer to form a groove between the metal layer and the resin layer; The step of depositing a copper layer in the groove to fill the groove and forming the metal circuit provided on the resin layer includes: removing the metal layer on the surface of the plate and forming the metal circuit on the resin layer.

3. The production method according to claim 1, characterized in that The step of depositing a copper layer in the groove to fill the groove and forming the metal circuit provided in the resin layer comprises: A copper layer is deposited at the bottom of the groove, and the groove is electroplated to fill the groove.

4. The production method according to claim 3, characterized in that: The step of etching a circuit pattern on the surface of the plate to form grooves in the resin layer includes: etching grooves of an electroplating pattern on the surface of the plate so that the grooves of the circuit pattern are connected to the grooves of the electroplating pattern, and the width of at least part of the grooves of the electroplating pattern is smaller than the width of the grooves of the circuit pattern; The steps of depositing a copper layer at the bottom of the groove and electroplating the groove to fill the groove include: depositing a copper layer at the bottom of the groove of the electroplating pattern to form an electroplating circuit, and connecting an electroplating power supply through the electroplating circuit for electroplating.

5. The production method according to claim 1, characterized in that: The step of depositing a copper layer in the groove to fill the groove and forming the metal circuit provided on the resin layer further comprises: The width of the metal line is 3 μm to 8 μm, and the ratio of the groove depth to the metal line width is in the range of 1:1 to 2:

1.

6. The production method according to claim 1, characterized in that: Resin layers are respectively provided on both sides of the plate; The step of etching a circuit pattern on the surface of the plate to form a groove on the resin layer comprises: etching a circuit pattern on both sides of the plate to form the grooves on the resin layers on both sides; The step of depositing a copper layer in the groove to fill the groove and form the metal circuit arranged in the resin layer includes: forming circuit patterns in the resin layer on both sides of the plate.

7. The production method according to claim 1, characterized in that: The production method further comprises: Disposing a second resin layer on the surface of the resin layer on which the metal circuit is formed, etching a groove in the second resin layer and depositing a copper layer to form a second metal circuit disposed in the second resin layer; The multi-layered plates are bonded together by heating and pressing to form the printed circuit board.

8. A printed circuit board, characterized in that: The printed circuit board comprises: A resin layer, the resin layer being disposed on a surface and / or inside the printed circuit board, the resin layer being provided with a metal line embedded in the resin layer, the surface of the metal line being in the same plane as the surface of the resin layer; The printed circuit board is manufactured by the method for manufacturing a printed circuit board according to any one of claims 1 to 7.

9. The printed circuit board according to claim 8, characterized in that The printed circuit board comprises: The resin layers are at least two layers, and the resin layers are arranged on the same side and / or two opposite sides of the plate. At least two layers of metal circuits are embedded in the surface of the resin layers.

10. The printed circuit board according to claim 8, characterized in that The printed circuit board comprises: Electroplating circuits are also embedded on the surface of the resin layer. The electroplating circuits are connected to the metal circuits, and at least a portion of the electroplating circuits is smaller in width than the metal circuits.

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