Display product and heat dissipation method of display product

Abstract

The invention relates to a display product and a heat dissipation method of the display product. The display product comprises a cover plate assembly, a display module and a cooling system, the cover plate assembly comprises two glass plates, the display module and the cover plate assembly are arranged in a stacked mode, the cooling system comprises an interlayer structure, a heat conduction assembly and a heat dissipation assembly, and the interlayer structure is arranged between the two glass plates; the interlayer structure, the heat conduction assembly and the heat dissipation assembly communicate with one another and are filled with cooling liquid, and the heat conduction assembly and the heat dissipation assembly are sequentially arranged on the side, away from the cover plate assembly, of the display module. Through circulation of the cooling liquid, heat can be efficiently conducted to the heat dissipation assembly from the display module and dissipated to the outside. The design can effectively reduce the temperature of a display product, prevents equipment downtime caused by high temperature, has the advantages of low noise, simple maintenance and the like, and is suitable for outdoor highlight display screens and other scenes.

Description

Technical Field

[0001] The present application relates to the technical field of display screen heat dissipation, and in particular to a display product and a heat dissipation method for the display product. Background Art

[0002] With the advancement of display technology, high-brightness displays are increasingly being used in numerous scenarios, including plazas, bus stations, electronic bus stops, displays for new energy charging stations, and smart scenic area guide systems. However, while outdoor displays can maintain a clear display in high-brightness environments, they generate significant heat. Combined with the additional heat from direct sunlight, the screen surface temperature can easily rise sharply, potentially exceeding 80°C. Such high temperatures not only pose a risk of burns to users of touch-enabled display products, but can also cause internal display component failure, resulting in black screens and other malfunctions, seriously impacting device stability and user experience.

[0003] In related technologies, in order to meet the heat dissipation needs of display products, two main methods are passive heat dissipation and air-cooled heat dissipation. Passive heat dissipation achieves heat transfer through the thermal conductivity of the material. Its core principle is to rely on components such as heat sinks and heat pipes to conduct heat directly with the heating element. Air-cooled heat dissipation, on the other hand, uses the principle of forced convection to transfer heat from the heating component to the heat dissipation fins, and then uses a fan to accelerate the air flow to discharge the heat. Its core components include a copper base, aluminum heat dissipation fins, heat pipes and fans. Heat is transferred to the fins through phase change of the heat pipes, and finally the fan accelerates heat exchange to achieve cooling.

[0004] However, all of the above-mentioned heat dissipation methods or related devices have some difficult-to-overcome problems. For passive heat dissipation, its heat dissipation efficiency is extremely low in extremely high temperature environments, and it cannot effectively reduce the temperature of the device, which may cause the device to overheat and affect its normal operation. Although air cooling has certain advantages over passive cooling, it is still limited by the small heat capacity of air and may not be able to effectively dissipate heat in high temperature environments. In addition, high-speed fans will generate loud noise, seriously affecting the user experience. In addition, the heat sink set to increase the heat dissipation area may also have a certain impact on the overall design of the device. Summary of the Invention

[0005] Based on this, it is necessary to provide a display product with efficient heat dissipation and reasonable structure to address the problems of low heat dissipation efficiency of existing display screens, easy overheating and downtime of equipment in high temperature environments, and high noise of heat dissipation devices affecting the user experience.

[0006] A display product, comprising:

[0007] A cover plate assembly, the cover plate assembly comprising two glass plates;

[0008] The display module is stacked with the cover assembly.

[0009] The cooling system includes a sandwich structure, a heat-conducting component, and a heat-dissipating component. The sandwich structure is arranged between the two glass plates. The sandwich structure, the heat-conducting component, and the heat-dissipating component are interconnected. The cooling system is filled with coolant. The heat-conducting component and the heat-dissipating component are arranged in sequence on the side of the display module away from the cover assembly.

[0010] In one embodiment, a first connecting tube, a second connecting tube and a third connecting tube are provided on the heat conducting component, the first connecting tube is connected to the sandwich structure, and the second connecting tube and the third connecting tube are connected to the heat dissipation component.

[0011] In one embodiment, a joint is provided on the sandwich structure, and the joint is connected to the first connecting pipe.

[0012] In one embodiment, the heat dissipation assembly includes a cooling structure and a water pump assembly, a fourth connecting pipe is provided between the cooling structure and the water pump assembly, the second connecting pipe is connected to the cooling structure, and the third connecting pipe is connected to the water pump assembly.

[0013] In one embodiment, the heat-conducting component is a cold head made of copper.

[0014] In one embodiment, optical adhesive is provided between the display module and the cover assembly.

[0015] In one embodiment, a thermal conductive material is provided between the thermal conductive component and the display module.

[0016] In one embodiment, the display product further includes a housing, and the heat dissipation component is arranged on the housing at a side facing away from the heat conduction component.

[0017] In one embodiment, a temperature sensing device is provided on the display module, and the temperature sensing device is used to control the operation of the cooling system.

[0018] This application also provides a heat dissipation method for a display product, comprising the following steps:

[0019] S01. Provide a display product, the display product comprising: a cover plate assembly, the cover plate assembly comprising two glass plates; a display module stacked with the cover plate assembly; a cooling system comprising a sandwich structure, a heat-conducting component, and a heat-dissipating component, the sandwich structure being disposed between the two glass plates, the sandwich structure, the heat-conducting component, and the heat-dissipating component being interconnected, the cooling system being filled with coolant, the heat-conducting component and the heat-dissipating component being disposed, in sequence, on a side of the display module facing away from the cover plate assembly;

[0020] S02: Start the cooling system so that the coolant circulates in the cooling system.

[0021] These display products utilize the interlayer structure between the two glass panels in the cover assembly, the synergistic effects of the thermally conductive and heat dissipating components, and the coolant within the cooling system to efficiently conduct and dissipate heat generated by the display module. Compared to traditional passive cooling or air cooling, this structure significantly improves heat dissipation efficiency, effectively preventing problems such as internal component failure caused by excessive display surface temperatures in high outdoor temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic structural diagram of a cover assembly provided in one embodiment of the present application.

[0023] Figure 2 This is an exploded view of the cover assembly structure provided in one embodiment of the present application.

[0024] Figure 3 An exploded view of a display product provided in one embodiment of the present application.

[0025] Figure 4 An exploded diagram of a cooling system provided in one embodiment of the present application.

[0026] Figure 5 A schematic diagram of a heat conducting assembly provided in one embodiment of the present application.

[0027] Figure 6 A schematic structural diagram of a heat dissipation assembly provided in one embodiment of the present application.

[0028] Figure 7 This is a flow chart of a method for dissipating heat for a display product provided in one embodiment of the present application.

[0029] The reference numerals in the specific embodiment are as follows:

[0030] 10. Cover plate assembly; 20. Cover plate assembly structure; 30. Cooling system; 40. Display module; 50. Thermal conductive material; 60. Housing;

[0031] 11. Glass plate;

[0032] 31. Sandwich structure; 32. Thermal conductive component; 33. Heat dissipation component;

[0033] 311, connector;

[0034] 321, first connecting pipe; 322, second connecting pipe; 323, third connecting pipe; 324, fourth connecting pipe;

[0035] 331. Cooling structure; 332. Water pump assembly. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0042] See Figure 3 , Figure 3 FIG1 shows an exploded view of a display product in an embodiment of the present application. In some embodiments, the display product includes: a cover assembly 10, a display module 40, and a cooling system 30. Figure 1 , Figure 1 The cover assembly 10 in one embodiment of the present invention is shown as a schematic structural diagram. The cover assembly 10 includes two glass plates 11. In the present invention, the display module 40 and the cover assembly 10 are stacked so that heat can be directly transferred from the display module 40 to the cooling system 30, thereby achieving efficient heat conduction. Figure 3 and Figure 4 , Figure 4An exploded view of a cooling system in one embodiment of the present application is shown. The cooling system 30 includes a sandwich structure 31, a heat-conducting assembly 32, and a heat-dissipating assembly 33. The sandwich structure 31, the heat-conducting assembly 32, and the heat-dissipating assembly 33 are interconnected and are sequentially disposed on the side of the display module 40 facing away from the cover assembly 10.

[0043] This application closely integrates the cover assembly 10, display module 40, and cooling system 30 to form an organic whole, which not only improves heat dissipation efficiency but also optimizes the structural layout of the entire display product. By sequentially arranging the components of the cooling system 30—the sandwich structure 31, the heat-conducting component 32, and the heat-dissipating component 33—on the back of the cover module, heat can be efficiently transferred and dissipated along a predetermined path, preventing heat accumulation within the display module 40. This effectively reduces the operating temperature of the display module 40, prolongs its service life, and also helps improve the stability and reliability of the display effect.

[0044] According to some embodiments of the present application, see Figure 2 , Figure 2 An exploded view of the cover assembly structure 20 in one embodiment of the present application is shown. The cover assembly includes two glass plates 11 and a sandwich structure 31, which is disposed between the two glass plates 11. The double-layer glass structure of the cover assembly 10 not only provides physical protection for the display module 40, but also provides a spatial foundation for the integration of the cooling system 30. The sandwich structure 31 between the two glass plates 11 is a key part of the cooling system 30. It is connected to the heat conduction component 32 and the heat dissipation component 33 to form a complete cooling circuit. This design makes full use of space, organically combines the heat dissipation function with the display function, and improves the integration and stability of the entire display product.

[0045] In some embodiments of the present application, the cooling system 30 is filled with coolant. Since the interlayer structure 31, the heat-conducting component 32 and the heat-dissipating component 33 are interconnected, the coolant will flow between the interlayer structure 31, the heat-conducting component 32 and the heat-dissipating component 33. Since the interlayer structure 31 is located between the two glass plates 11, when the cooling system 30 of the display product is running, the coolant filled in the interlayer structure 31 can directly absorb the heat generated by the display module 40. The heat-conducting component 32 acts as a bridge for heat transfer, quickly transferring the heat absorbed by the interlayer structure 31 to the heat-dissipating component 33. The heat-dissipating component 33 dissipates the heat to the external environment through its efficient heat dissipation capability. This layered design of the cooling system 30 not only improves the heat dissipation efficiency, but also allows each component to be optimized and improved as needed to adapt to different heat dissipation requirements.

[0046] In some embodiments of the present application, the coolant is typically a liquid with high thermal conductivity and a large specific heat capacity, such as a mixture of distilled water and ethylene glycol. This mixture not only absorbs and transfers heat quickly but also maintains excellent fluidity over a wide temperature range, thereby ensuring that the cooling system 30 can operate efficiently under diverse environmental conditions. The circulation of the coolant within the cooling system 30 is key to achieving heat dissipation. When heat generated by the display module 40 during operation is transferred to the coolant in the sandwich structure 31, the coolant absorbs the heat and its temperature rises. The coolant then flows through the heat-conducting component 32 to the heat dissipation component 33, where the heat is dissipated to the surrounding environment. After releasing heat in the heat dissipation component 33, the coolant's temperature drops and then flows back to the sandwich structure 31 to continue absorbing heat generated by the display module 40. This continuous cycle ensures that the display module 40 remains within a relatively stable temperature range, thereby preventing equipment failure and performance degradation caused by high temperatures. The amount and method of filling the coolant can also affect the performance of the cooling system. Therefore, in actual applications, it is necessary to accurately calculate the coolant filling amount based on the specific structure and size of the cooling system to ensure that the coolant can flow fully in the system while avoiding reduced heat dissipation efficiency or system failure caused by too much or too little coolant.

[0047] Furthermore, the design of cooling system 30 also takes into account the aesthetics and user experience of the entire display product. Since the main components of cooling system 30 are located on the back of display module 40, they do not affect the front appearance of the display product. This allows the display product to maintain efficient heat dissipation while also maintaining a simple and aesthetically pleasing design. This has important practical implications for applications requiring high display quality and design, such as high-end electronic devices and outdoor display screens.

[0048] See Figure 5 , Figure 5A schematic diagram of a heat conducting assembly 32 in one embodiment of the present application is shown. According to some embodiments of the present application, the heat conducting assembly 32 is provided with a first connecting tube 321, a second connecting tube 322, and a third connecting tube 323. The first connecting tube 321 of the heat conducting assembly 32 is connected to the sandwich structure 31, while the second connecting tube 322 and the third connecting tube 323 of the heat conducting assembly 32 are connected to the heat dissipation assembly 33. The first connecting tube 321 is connected to the sandwich structure 31, ensuring that heat generated by the display module 40 is quickly transferred to the heat conducting assembly 32 via the coolant in the sandwich structure 31. Because the heat conducting assembly 32 is typically made of a highly thermally conductive material, it can efficiently transfer absorbed heat to the second connecting tube 322 and the third connecting tube 323 connected to it. The second connecting tube 322 and the third connecting tube 323 are each connected to the heat dissipation assembly 33, further expanding the heat transfer path. This multi-tube connection design allows heat to flow quickly from the heat conducting assembly 32 to the heat dissipation assembly 33, achieving efficient heat transfer. This design not only improves the overall heat dissipation efficiency of the cooling system 30 , but also ensures that heat can be evenly distributed in the cooling system 30 , thereby avoiding the problem of local overheating.

[0049] In practical applications, the design and material selection of the connecting pipe are also crucial. The connecting pipe is typically made of corrosion-resistant and high-temperature-resistant materials to ensure it is not damaged by the chemical effects of the coolant or high temperatures during long-term use. Furthermore, the inner diameter and length of the connecting pipe are optimized based on the coolant flow rate and flow rate to ensure smooth coolant flow through the system, further improving the performance of cooling system 30.

[0050] Continue reading Figure 2 In some embodiments of the present application, a joint 311 is provided on the sandwich structure 31, through which the sandwich structure 31 is connected to the first connecting pipe 321 on the heat conducting assembly 32. The design of the joint 311 facilitates the assembly and maintenance of the cooling system 30, making the entire cooling system 30 easier to install and disassemble.

[0051] See Figure 6 , Figure 6 A schematic diagram of the structure of a heat dissipation assembly 33 in one embodiment of the present application is shown. In some embodiments of the present application, the heat dissipation assembly 33 includes a cooling structure 331 and a water pump assembly. A fourth connecting pipe 324 is provided between the cooling structure 331 and the water pump assembly. The second connecting pipe 322 on the heat conducting assembly 32 is connected to the cooling structure 331, and the third connecting pipe 323 on the heat conducting assembly 32 is connected to the water pump assembly.

[0052] In some embodiments of the present application, the heat conducting component 32 is a cold head made of copper. Copper, as a metal with extremely high thermal conductivity, has a much higher thermal conductivity than many other materials. This enables the copper cold head to quickly transfer the heat transferred from the display module 40 to the coolant, thereby ensuring that the entire cooling system 30 can operate efficiently. This efficient heat conduction capability not only helps to quickly reduce the temperature of the display module 40, but also prevents heat from accumulating inside the display module 40, thereby avoiding equipment failure and performance degradation caused by high temperature. In addition, the stability and corrosion resistance of copper also enable it to maintain good performance under long-term contact with the coolant, extending the service life of the cooling system 30.

[0053] In some embodiments of the present application, the cooling structure 331 includes a radiator and a silent fan. The radiator is composed of high-efficiency heat dissipation fins, which have a large heat dissipation surface area and can quickly absorb heat from the coolant and dissipate it into the surrounding air. The silent fan is installed on the rear side of the radiator to accelerate the air flow by forced convection, further improving the heat dissipation efficiency. This combination not only ensures that the coolant can be cooled quickly, but also ensures the quietness of the display product during use through the low-noise operation of the silent fan, and is particularly suitable for noise-sensitive environments. According to some embodiments of the present application, optical glue is provided between the display module and the cover assembly. Optical glue can not only firmly fix the display module to the cover assembly, ensuring a close combination between the two, thereby improving the structural stability of the entire display product, but also effectively prevent external impurities such as dust and moisture from entering the interior of the display module, protecting the display module from interference from environmental factors.

[0054] In some embodiments of the present application, a thermally conductive material 50 is disposed between the thermally conductive component 32 and the display module 40. The thermally conductive material 50 typically has high thermal conductivity and can fit tightly between the display module 40 and the thermally conductive component 32, filling the tiny gap between them. This reduces thermal resistance and ensures that heat can be transferred from the display module 40 to the thermally conductive component 32 more quickly and evenly. In the present application, the thermally conductive material 50 can be a highly thermally conductive material such as silicone grease, silicon wafer, or liquid metal.

[0055] In some embodiments of the present application, the display product further includes a housing 60, with the heat dissipation component 33 disposed on the housing 60 on a side facing away from the heat conductive component 32. By combining the heat dissipation component 33 with the housing 60, heat can be quickly dissipated into the surrounding environment through the high thermal conductivity material of the housing 60, further improving heat dissipation efficiency. Furthermore, the design of the housing 60 can be adjusted to suit different application scenarios. For example, when used outdoors, the housing 60 can be waterproof and dustproof to improve the protection level of the display product and ensure its stable operation in harsh environments.

[0056] In some embodiments of the present application, a temperature sensing device is provided on the display module 40, which is used to control the operation of the cooling system 30. This design enables the cooling system 30 to intelligently start or stop according to the actual temperature of the display module 40, thereby achieving more accurate and efficient heat dissipation management. The temperature sensing device can monitor the temperature changes of the display module 40 in real time. When the temperature rises to a set threshold, the temperature sensing device will automatically trigger the start of the cooling system 30, causing the coolant to begin circulating, thereby quickly removing the heat generated by the display module 40. Conversely, when the temperature drops to a safe range, the temperature sensing device will stop the operation of the cooling system 30 to save energy and extend the service life of the cooling system 30.

[0057] See Figure 7 , the present application also provides a heat dissipation method for a display product, comprising the following steps:

[0058] S01. Provide a display product, comprising: a cover assembly 10, comprising two glass plates 11; a display module 40 stacked with the cover assembly 10; a cooling system 30 comprising a sandwich structure 31, a heat-conducting assembly 32, and a heat-dissipating assembly 33; the sandwich structure 31 being disposed between the two glass plates 11, the sandwich structure 31, the heat-conducting assembly 32, and the heat-dissipating assembly 33 being interconnected; the cooling system 30 being filled with a coolant; and the heat-conducting assembly 32 and the heat-dissipating assembly 33 being sequentially disposed on a side of the display module 40 facing away from the cover assembly 10.

[0059] S02 : Start the cooling system 30 so that the coolant circulates in the cooling system 30 .

[0060] In practice, this heat dissipation method efficiently conducts heat generated by the display module 40 to the heat dissipation assembly 33 through the circulation of coolant within the cooling system 30, where it is dissipated into the external environment. After absorbing heat in the sandwich structure 31, the coolant is rapidly transferred to the heat dissipation assembly 33 via the heat conduction assembly 32, ultimately dissipating the heat through the heat dissipation structure of the heat dissipation assembly 33. This process not only effectively reduces the operating temperature of the display module 40 but also ensures that the display product maintains stable operation in high-temperature environments. In this way, the service life of the display product is extended.

[0061] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display product, characterized in that: The display products include: A cover plate assembly, the cover plate assembly comprising two glass plates; The display module is stacked with the cover assembly. The cooling system includes a sandwich structure, a heat-conducting component, and a heat-dissipating component. The sandwich structure is arranged between the two glass plates. The sandwich structure, the heat-conducting component, and the heat-dissipating component are interconnected. The cooling system is filled with coolant. The heat-conducting component and the heat-dissipating component are arranged in sequence on the side of the display module away from the cover assembly.

2. The display product according to claim 1, wherein: A first connecting tube, a second connecting tube and a third connecting tube are provided on the heat conducting component. The first connecting tube is connected to the sandwich structure, and the second connecting tube and the third connecting tube are connected to the heat dissipation component.

3. The display product according to claim 2, wherein: The sandwich structure is provided with a joint, and the joint is connected to the first connecting pipe.

4. The display product according to claim 2, wherein: The heat dissipation assembly includes a cooling structure and a water pump assembly. A fourth connecting pipe is provided between the cooling structure and the water pump assembly. The second connecting pipe is connected to the cooling structure, and the third connecting pipe is connected to the water pump assembly.

5. The display product according to claim 2, wherein: The heat conducting component is a cold head made of copper.

6. The display product according to claim 1, wherein: Optical adhesive is provided between the display module and the cover assembly.

7. The display product according to claim 1, wherein: A heat-conducting material is provided between the heat-conducting component and the display module.

8. The display product according to claim 1, wherein: The display product further comprises a housing, and the heat dissipation component is arranged on the housing at a side facing away from the heat conduction component.

9. The display product according to claim 1, wherein: The display module is provided with a temperature sensing device, which is used to control the operation of the cooling system.

10. A heat dissipation method for a display product, characterized in that: The steps include: S01. Provide a display product, the display product comprising: a cover plate assembly, the cover plate assembly comprising two glass plates; a display module stacked with the cover plate assembly; a cooling system comprising a sandwich structure, a heat-conducting component, and a heat-dissipating component, the sandwich structure being disposed between the two glass plates, the sandwich structure, the heat-conducting component, and the heat-dissipating component being interconnected, the cooling system being filled with coolant, the heat-conducting component and the heat-dissipating component being disposed, in sequence, on a side of the display module facing away from the cover plate assembly; S02: Start the cooling system so that the coolant circulates in the cooling system.

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