Selective brazing apparatus heating module with reflector barrier, selective brazing apparatus, and

Abstract

The invention relates to a heating module with a reflector diaphragm for a selective brazing apparatus, a selective brazing apparatus and an associated method.

Description

Technical Field

[0001] The present invention relates to a heating module for a selective soldering device, namely a heating module for a selective soldering device, a selective soldering device and a related method. Background Art

[0002] In a selective soldering system, printed circuit boards equipped with electrical or electronic components are processed in different or mixed processing modules. Here, the modules form different areas of the selective soldering system, wherein the modules can be realized by individual components.

[0003] The printed circuit boards can also be designed as printed circuit cards which contain a plurality of printed circuit boards which are separated into individual printed circuit boards after soldering.

[0004] In selective soldering, flux is first applied, wetting the areas of the printed circuit board to which the liquid solder is applied during the soldering process. Preheating then takes place in a heating module. The purpose of preheating is to uniformly heat the respective printed circuit board before it is transported to the soldering module where the actual soldering process is carried out. During preheating, it is advantageous to introduce up to 50% of the heat energy into the printed circuit board using infrared heat radiators so that the respective printed circuit board, together with the components in the soldering module, is not heated in a shock-like manner when in contact with the liquid solder. In order to solder the components, brazing crucibles, which are in particular movable independently of one another, are arranged in the soldering module, each of which generates a soldering wave. During the soldering process, the brazing crucibles or soldering waves are moved to the position of the printed circuit board where the components to be soldered are ultimately located. After the soldering process, the soldered printed circuit board is supplied to an outlet, which can also form an inlet.

[0005] A known heating module of a selective soldering system, arranged between the fluxing module and the soldering module, comprises a base, a module inlet, and a module outlet. During operation, the corresponding printed circuit boards are transported along a transport direction (x-direction) from the module inlet to a heating position and from there to the module outlet. The heating module typically also has side walls extending parallel to the transport direction. Heat radiators, in particular infrared heat radiators, are arranged in or on the base. The base with the side walls can form a heating cassette.

[0006] In particular, newer selective soldering systems require a clearance height of 60 mm to 100 mm or more above and below the transport plane, as the size and height of the components to be soldered or already present on the printed circuit boards are increasing, even in view of the power electronics of electric motor vehicles. The clearance height is the height at which the printed circuit board, along with the components arranged thereon, can be transported through the soldering system or heating module without collision. Therefore, the clearance height is specific to the soldering system or heating module.

[0007] It has been found that when a machine has a throughput height of, for example, 100 mm, the printed circuit boards are heated relatively unevenly and non-uniformly at the heating points due to the relatively large distance from the radiant heat source. In particular, the edge areas of the printed circuit board receive less radiant energy than the center area of ​​the printed circuit board, which has a negative impact on the subsequent soldering behavior and thus on the overall process result.

[0008] JPH04-274867A discloses a reflow soldering apparatus. To reduce shielding gas consumption, lower operating costs, and facilitate adjustment of the temperature profile within the reflow channel, the apparatus includes adjustable partition walls along a conveyor device to form a plurality of successive chambers. Heating elements may be provided in the chambers.

[0009] A reflow soldering device is also known from DE 37 24 005 C2, which has a heating element and in which an elliptical reflector is arranged which is adjustable around the heating element.

[0010] An infrared soldering oven is known from DE 37 15 940 C2, which has a sliding drawer with sliding drawer walls and is used for sliding printed circuit boards in and out.

[0011] DE 10 2011 087 704 A1 discloses a reflow soldering system for flexible printed circuit boards. The system has an upper opening. A plurality of adjustable IR diaphragms are positioned at or above the opening to shield the near-infrared radiation emitted upward from the opening. These diaphragms define a soldering field, from which the near-infrared radiation is emitted to heat the flexible printed circuit board.

[0012] A brazing device is known from DE 10 2011 087 704 A1, in which a preheating chamber and a pressure chamber are provided, wherein the pressure chamber is closed by a partition for pressure generation and may have its own heating device. The pressure chamber may be designed as a sintering device or a diffusion brazing device. Summary of the Invention

[0013] The object of the present invention is to provide a heating module for a selective soldering system and a selective soldering system having a heating module, which heating module and selective soldering system lead to optimized process results even at high throughput heights.

[0014] This object is achieved by a heating module for a selective soldering system having the features of claim 1 .

[0015] By adjusting at least one reflector partition into an operating position, the module inlet and / or the module outlet can be closed at least in sections. In this case, the reflector partition can be adjusted in particular independently of the movement or transport of the printed circuit board. The module inlet can in particular be arranged at a position different from the module outlet; however, it is also conceivable that the module inlet also takes on the function of the module outlet, i.e. the printed circuit board is transported out of the module via the module inlet which then functions as the module outlet. By providing at least one reflector partition, the passage height is at least temporarily reduced, which can be done in particular depending on the components to be soldered or components already present on the printed circuit board. As a result, it can be achieved that at the heating point of the printed circuit board, less radiation energy generated by thermal radiation leaves the corresponding heating module. In addition, it can also be achieved that the edge areas of the printed circuit board are sufficiently supplied with radiation energy and the temperature distribution in the plane of the printed circuit board becomes more uniform.

[0016] If the soldering system or heating module has, for example, a clearance height of 100 mm, this clearance height can be reduced to 50 mm or less by means of at least one adjustable reflector partition, if the components present on the printed circuit board or their structural height are permitted. This results in more uniform heating of the printed circuit board and significant energy savings. Thus, if there are components whose structural height is less than the maximum permissible clearance height of the soldering system, better soldering results can be achieved by adjusting the at least one reflector partition into the operating position; even if this reduces the clearance height of the soldering system.

[0017] The radiation emitted by the radiant heater is preferably reflected at least largely by the at least one reflector web so that it remains in the heating module and contributes to preheating the printed circuit board. Furthermore, considerable energy savings can be achieved because less radiant energy leaves the heating module. Ideally, the material and surface of the reflector web are designed to achieve optimal reflection of the emission wavelength of the radiator.

[0018] Advantageously, at least one reflector web can be adjusted in a z-direction extending perpendicularly to the base. This has the advantage that at least a movement in the direction of gravity can be achieved without or with only a small amount of force.

[0019] Furthermore, it can be advantageous if at least one reflector shelf is adjustable in the y-direction, which extends parallel to the base. This has the advantage that at least one reflector shelf can be adjusted from the side, thus eliminating the need for vertical installation space upwards and downwards. In particular, other components (heating elements, ventilators, filters, etc.) cannot be damaged above and / or below the transport plane.

[0020] In order to be able to move the reflector partitions into the operating position despite the presence of transport means for transporting the respective printed circuit board through the soldering device, it is also advantageous if at least one reflector partition has a recess, in particular an open-edged recess, for the transport means extending in the transport direction. Thus, the module inlet and / or module outlet can be at least largely closed despite the presence of the transport means.

[0021] Furthermore, it is advantageous if two reflector partitions are provided at the module inlet and / or at the module outlet, respectively, which can be adjusted towards and away from each other. This allows the module inlet and / or the module outlet to be closed relatively quickly, since each of the two reflector partitions only has to travel half the distance compared to just one reflector partition.

[0022] It has further been found to be advantageous to provide a drive for adjusting at least one reflector partition. The drive can be designed so that it can be manually actuated, for example, by a crank. Furthermore, the drive can be designed so that it can be electrically actuated, in particular by an electric motor, a pneumatic motor, or a pneumatic cylinder.

[0023] If the drive is electrically driven, a controller for controlling the drive is advantageously provided, the controller being configured such that the at least one reflector web is adjusted into the operating position depending on the overall height of the respective printed circuit board and the components arranged thereon. Thus, the height is reduced depending on the overall height of the printed circuit board, more specifically to a value such that the printed circuit board and the components can still be transported through the heating module or soldering system without collision. If relatively tall components are arranged on the printed circuit board, a larger clearance height can be maintained; if only relatively flat components are provided, the clearance height can be reduced to achieve better heating of the printed circuit board.

[0024] Advantageously, the controller is further configured such that the adjustment is such that, in the first operating position, the distance between the at least one reflector partition and the transport plane is equal to or slightly greater than the structural height of the corresponding printed circuit board, thereby ensuring that as little heat radiation as possible is discharged from the heating module.

[0025] It is particularly advantageous if the controller is further configured such that, after the respective printed circuit board has reached the heating position, the at least one reflector panel is adjusted to a second operating position in which the module inlet and / or the module outlet are at least largely closed. As a result, after each entry of a printed circuit board into the heating module, the heating module can be preferably closed to the greatest extent possible, so that as little radiation as possible escapes from the heating module during the heating phase. After preheating is complete, the at least one reflector panel is adjusted to an open position, allowing the heated printed circuit board to exit the heating module and / or allowing printed circuit boards to enter the heating module.

[0026] The object mentioned at the outset is also achieved by a selective soldering device for soldering components present on a printed circuit board, which comprises a heating module according to the invention.

[0027] Furthermore, the aforementioned object is achieved by a method for operating a selective soldering system, wherein the selective soldering system comprises a heating module, wherein when the printed circuit board is in the heating position in the heating module, the heating module is closed by means of an adjustable reflector partition. Here, the closing is performed at least slightly and preferably to a maximum extent. Preferably, the heating module is a heating module according to the present invention.

[0028] Further advantages and advantageous embodiments of the present invention can be gathered from the following description, based on which different exemplary embodiments of the present invention are described and explained in more detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In the attached figure: Figure 1 The selective soldering apparatus according to the invention is shown in side view; Figure 2 A view showing a first heating module according to the invention is shown in an isometric view; Figure 3 Shown according to Figure 3 A longitudinal section of a heating module; Figure 4 shows an isometric view of a second heating module according to the present invention; and Figure 5 An isometric view of a third heating module according to the present invention is shown. DETAILED DESCRIPTION

[0030] exist Figure 1 FIG. 1 shows a selective soldering device 10 for selective soldering components present on a printed circuit board 16. The soldering device 10 has an inlet 12 and an outlet 14. Figures 2 to 5The printed circuit board shown and designated by reference numeral 16 is fed to the soldering apparatus 10. Figure 2 、 Figure 4 and Figure 5 The transport system denoted by reference numeral 18 transports the printed circuit boards 16 in a transport direction 20 along the x-axis through the soldering system 10 to the outlet 14. The transport system 18 can have two guide rails running parallel to one another, in which transport chains, conveyor belts or conveyor rollers are arranged, on which the printed circuit boards 16 rest or which carry the respective printed circuit boards 16.

[0031] The soldering system 10 comprises various modules, including hybrid modules with hybrid processing capabilities. Downstream of the inlet 12 is a fluxing module 22, in which the areas of the printed circuit board 16 to which liquid solder is applied during the soldering process are moistened with flux. Downstream of the fluxing module 22 is a heating module 24, which preheats the printed circuit board 16. Downstream of the heating module 24 are two brazing modules 26 and 28, in which the printed circuit boards 16 can be brazed independently of one another. To this end, independently movable brazing crucibles (not shown) are located in the brazing modules 26 and 28, each generating a brazing wave. During the brazing process, the brazing crucibles or waves are moved to the location of the final component of the printed circuit board 16 to be soldered. After the brazing process, the brazed printed circuit boards are fed to the outlet 14, which also serves as the inlet.

[0032] exist Figure 2 and Figure 3 1 and 2. The heating module 24 or its key components are shown in a simplified manner. Firstly, the transport system 18 extending through the soldering device 10 can be seen, with which the printed circuit boards 16 can be transported along the transport direction 20 in the transport plane E into and out of the heating module 24.

[0033] from Figure 3As can be clearly seen in the figure, electrical or electronic components 25 are arranged on the top side of the printed circuit board 16, which are to be soldered in the soldering device 10. The components 25 have feet that extend through the printed circuit board 16 and are soldered to the printed circuit board 16 from below in a soldering module 28 (through-hole technology). Electrical or electronic components 27 can also be arranged on the bottom side of the printed circuit board. These electrical or electronic components 27 are not soldered in the soldering device 10, but have already been fastened to the printed circuit board 16 in some other way, for example, by pressing or another soldering process, or are pre-mounted there before the printed circuit board 16 is transported into the soldering device 10.

[0034] The heating module 24 comprises a module inlet 30 and a module outlet 32, wherein the module inlet and the module outlet can also be the same or at the same location. The printed circuit board 16 can be moved into the heating module 24 through the module inlet 30 and there moved to Figure 2 The heating position shown is where the actual heating process takes place. If the preheating of the printed circuit board 16 is complete, the printed circuit board 16 can be removed from the heating position. Figure 2 and Figure 3 The heating position shown is transported from the heating module 24 to the following brazing modules 26, 28 along the transport direction 20 via the module outlet 32. A reversal of the transport direction or a different transport direction is also conceivable.

[0035] Also from Figure 2 and Figure 3 As can be clearly seen in FIG, the heating module 34 has a bottom 34 in which or on which a heat radiator 36 is arranged, which heat radiator 36 can be designed in the form of a tube. Figure 2 and Figure 3 In the illustrated embodiment, the radiant heat element 36 extends transversely to the transport direction 20, along the y-axis. It is also conceivable that the radiant heat element 36 be positioned parallel to the transport direction or deviating therefrom. During operation, the radiant heat element 36 emits infrared radiation, in particular, toward the printed circuit board 16, thereby heating the printed circuit board 16. In order to heat the printed circuit board not only superficially, it is advantageous to introduce thermal energy into the printed circuit board via the infrared radiation.

[0036] exist Figure 2 and Figure 3In the embodiment shown, the radiant heat 36 is located below the printed circuit board 16 in order to preheat the printed circuit board 16 from below. This is reasonable because the soldering of the component 25 takes place with the aid of the soldering wave from below the printed circuit board 16. However, it is also conceivable to provide a further radiant heat 36 on the cover element 38 opposite the base 34 in order to also heat the printed circuit board 16 from above. In this case, it is useful to provide further reflector webs 56, 58 above the printed circuit board 16, such as those shown in FIG4 and described further below, which cover the entire inlet and outlet area as much as possible in terms of height.

[0037] Further from Figure 2 and Figure 3 As can be clearly seen in the figure, a reflector baffle 40 and 52 are respectively provided at the module inlet 30 and at the module outlet 32, and the reflector baffle 40 and 52 can be adjusted to a position along a z axis extending transversely to the x axis and the y axis. Figure 3 The operating position shown, in which the printed circuit board 16 is in a heating position. Figure 3 As can be clearly seen in the diagram, in the operating position, a distance D1 exists between the transport plane E and the reflector partition 40 or its upper edge 42. In the open position of the reflector partition 40, which completely frees the module access opening 30, the distance between the transport plane E and the reflector partition 40 or the wall 44 delimiting the module access opening 30 downwards is D2, with D2 being greater than D1. The value D2 corresponds to the maximum throughput height specified by the machine, with D2 preferably ranging from 60 mm to 100 mm or more. This ensures that the printed circuit board 16 can be soldered to components 27 having a relatively large overall height.

[0038] The distance D1 can be arranged in such a way that a reduced clearance height is produced which is only slightly greater than the maximum (here pointing downward) structural height H of the printed circuit board 16 or of the components 27 located thereon.

[0039] This ensures that the printed circuit board 16 can be transported through the module entry 30 into the heating module 24 without collisions when the reflector partition 40 is in the operating position. If a plurality of identically equipped printed circuit boards 16 are transported sequentially into the heating module 24, the reflector partition 40 remains in its operating position. Only when the printed circuit board 16 is to be introduced into the heating module together with components whose overall height H exceeds the distance D1 is the reflector partition 40 lowered to such an extent that the printed circuit board 16 together with the components can be transported into the heating module 24 without collisions.

[0040] For adjusting the reflector screen 40, drives 48 in the form of electric motors or pneumatic motors / cylinders are provided, which can be controlled by a controller 50. The controller 50 can be configured such that, depending on the overall height of the printed circuit board 16, it adjusts the reflector screen 40 into an operating position, so that the printed circuit board, together with the component 27 arranged thereon, can be transported into the heating module 24 in a collision-free manner, but preferably at a short distance from the reflector screen 40 or its upper edge 42. Thus, if a relatively flat component 27 is provided on the printed circuit board 16, a low clearance height D1 can be adjusted; if a relatively high component 27 is provided on the printed circuit board 16, the reflector screen can be adjusted so that a larger desired clearance height D1 is achieved.

[0041] Drive 48 can also be a manually actuable drive, for example, manually actuated by means of a crank. Furthermore, it is conceivable that the reflector panels 40 and 52 can be adjusted without a drive. For example, it is conceivable that the reflector panels are provided with elongated holes extending in the z-direction, through which fastening screws extend. These fastening screws are fastened to suitable components on heating module 24. By loosening the screws, the respective reflector panel 40 and 52 can be adjusted. Once the desired or specified height is reached, the screws can be tightened.

[0042] from Figure 2 and Figure 3 As can be clearly seen in the figure, not only is a reflector baffle 40 provided at the module inlet 30, but also another corresponding reflector baffle 52 is provided at the module outlet 32. Reflector baffle 52 can be adjusted in the z-direction corresponding to reflector baffle 40. To this end, a drive (not shown) corresponding to drive 48 at the module inlet is preferably provided, and these drives are correspondingly controlled by controller 50.

[0043] exist Figure 3FIGURE 5 illustrates how the heat radiator 36 also radiates heat toward the module inlet 30 or module outlet 32. This heat radiation is indicated by arrows 54. With the reflector panels 40 or 52 in their operational positions, the radiation 54 directed toward the module inlet 30 or module outlet 32 ​​is reflected by the reflector panels 40, 52 toward the printed circuit board 16 or the interior of the heating module. Heat radiation that would otherwise have exited the heating module 24 through the opening at a height D2, as reflected by the respective reflector panels 40, 52, is retained within the heating module 24 and thus contributes to uniform heating of the printed circuit board 16. The printed circuit board 16 can be heated sufficiently well, particularly in its edge region 53, due to the reflection of the heat radiation 54 by the reflector panels 40, 52. Furthermore, the provision of the reflector panels 40, 52 ensures that less heat radiation leaves the heating module 24. This prevents undesirable heating of components located outside the heating module 24. Furthermore, the brazing device 10 or the heating module 24 can be operated in a more energy-efficient manner.

[0044] exist Figure 4 The heating element 124 with upper heating and lower heating is shown in FIG. Figure 2 and Figure 3 The components corresponding to the heating element 24 are provided with corresponding reference numerals. Figure 2 and Figure 3 In the embodiment in which the reflector partitions 40, 52 are each arranged only below the transport plane E or below the respective printed circuit board 16, upper reflector partitions 56 and 58 are additionally provided in the heating module 124. Arranging the reflector partitions 56, 58 above the transport plane E is particularly advantageous when the radiant heat is not only arranged on the base 34 but also in or on the cover element 38 above the printed circuit board 16. Arranging the reflector partitions 56, 58 above the transport plane ensures that the heat radiation from the radiant heat arranged above the transport plane remains within the respective heating module. Furthermore, the heated air is better enclosed in the heating region, which is beneficial for heat transfer.

[0045] This arrangement allows the reflector panels 40, 56 to be moved toward and away from each other in the z-direction. Accordingly, the reflector panels 42, 58 can also be moved toward and away from each other in the z-direction.

[0046] exist Figure 4In the illustrated heating module 124, the partitions are adjusted to a minimum distance so that the product can still enter for heating. Alternatively, the two reflector partitions 40, 56 are adjusted to an open position to transport the respective printed circuit board 16 into the heating module 124. After the printed circuit board 16 has reached its heating position, the two reflector partitions 40, 56 are moved toward each other, so that the module entrance 30 is at least largely closed.

[0047] Here, the two reflector partitions 40, 56 have open-edged recesses 60, which are arranged so that when the module entrance is closed, i.e., when the two reflector partitions 40, 56 have reached their operating position, the transport means 18 is located in the recesses 60. This has the advantage that the module entrance 30 can be largely closed despite the provision of the transport means 18. Additional recesses are also possible, for example due to special product geometries.

[0048] Corresponding to the reflector baffles 40, 56, the reflector baffles 52, 58 can also have such a recess 60 at the module outlet 32. This has the advantage that both the module inlet 30 and the module outlet 32 ​​can be closed at least largely in the operating position of the reflector baffles 52, 58.

[0049] The heating module 124 may have a drive 48 and a controller 50 (not shown in FIG. 4 ) corresponding to the heating module 24, wherein the controller 50 is configured to move the reflector baffles 40, 56 to an open position during the transport of the corresponding printed circuit board 16 into the heating module 24, and to move the reflector baffles 40, 56 to an operational position closing the module entrance 30 after the corresponding printed circuit board 16 has reached its heating position. Correspondingly, the drive may drive the reflector baffles 52, 58 at the module exit so that the reflector baffles 52, 58 are moved from their closed operational position to the open position when the corresponding printed circuit board 16 is moved from the heating module 24 to the subsequent brazing module 26.

[0050] exist Figure 5 , a further embodiment of a heating module 224 is shown, wherein corresponding components with corresponding reference numerals are provided in the heating module 124. The heating module 224 differs from the heating module 124 in that reflector baffles 62, 64 are provided which are not arranged adjustably toward and away from each other in the vertical z-direction, but are arranged adjustably toward and away from each other in the y-direction. Figure 5In the shown open position of the reflector partitions 62, 64, the printed circuit board 16 can be transported along the transport direction 20 into the heating module 224. After having reached the heating position, the reflector partitions 62 and 64 are moved toward each other, so that the module entrance 30 is at least largely completely closed. During the heating of the printed circuit board 16, no significant heat radiation is discharged from the heating module 224. Even during Figure 5 While reflector baffles 62 , 64 are shown only at the module inlet, it is also conceivable within the scope of the invention to provide corresponding reflector baffles at the module outlet 32 ​​as well.

Claims

1. A heating module (24, 124, 224) of a selective soldering device for preheating a printed circuit board (16) equipped with components (25, 27), comprising: a bottom (34); a module inlet (30) and a module outlet (32), wherein: In operation, the corresponding printed circuit board (16) is transported along a transport direction (20) from the module inlet (30) to a heating position and from the heating position to the module outlet (32); and a heat radiator (36) arranged in or on the bottom (34), characterized in that at least one reflector partition (36) is provided at the module inlet (30) and / or at the module outlet (32), which is adjustable to an operating position and at least partially closes the module inlet (30) and / or the module outlet (32). 40, 52, 56, 58, 62, 64), in which, in the operating position, the corresponding printed circuit board (16) is in the heating position, wherein the at least one reflector partition (40, 52, 56, 58, 62, 64) is designed so that the reflector partition (40, 52, 56, 58, 62, 64) reflects the radiation emitted by the heat radiator (36) in the operating position so that the radiation remains in the heating module (24, 124) and helps to preheat the corresponding printed circuit board (16).

2. The heating module (24, 124) according to claim 1, wherein The at least one reflector partition (40, 52, 56, 58) is adjustable along a z-direction extending perpendicularly to the base.

3. The heating module (224) according to claim 1 or 2, wherein: The at least one reflector web (62, 64) is adjustable along a y-direction extending parallel to the base.

4. The heating module (24, 124, 224) according to claim 1, 2 or 3, wherein: The at least one reflector partition (40, 52, 56, 58, 62, 64) has an open-edged recess (60) for a transport device (18) extending in the transport direction, so that in the operating position the transport device (18) is located in the recess (60) and the module inlet (30) and / or the module outlet (32) are at least largely closed.

5. The heating module (24, 124, 224) according to any one of the preceding claims, wherein At least two reflector baffles (56, 58, 62, 64) are each provided at the module inlet (30) and / or at the module outlet (32), the reflector baffles (56, 58, 62, 64) being adjustable towards and away from each other.

6. The heating module (24, 124, 224) according to any one of the preceding claims, wherein At least one drive (48) is provided for adjusting the at least one reflector partition (40, 52, 56, 58, 62, 64).

7. The heating module (24, 124, 224) according to claim 6, wherein A controller (50) is provided for controlling the drive (48), the controller (50) being configured such that the at least one reflector partition (40, 52, 56, 58, 62, 64) is adjusted to the operating position as a function of the structural height (H) of the corresponding printed circuit board (16).

8. The heating module (24, 124, 224) according to claim 7, wherein: The controller (50) is further configured such that the adjustment is such that, in a first operating position, the distance (D1) between the at least one reflector partition (40, 52, 56, 58) and the transport plane (E) is equal to or slightly greater than the structural height (H) of the corresponding printed circuit board (16).

9. The heating module (24, 124, 224) according to claim 7 or 8, wherein: The controller (50) is further configured such that the adjustment causes the at least one reflector baffle (40, 52, 56, 58, 62, 64) to be adjusted to a second operating position after the corresponding printed circuit board (16) reaches the heating position, in which the module inlet (30) and / or the module outlet (32) are at least largely closed.

10. A selective soldering device (10) for soldering components present on a printed circuit board (16), comprising a flux application module (22), a soldering module (28), and a heating module (24, 124, 224) according to any one of the preceding claims, arranged between the flux application module (22) and the soldering module (28).

11. A method for operating a selective soldering apparatus (10), wherein: The selective soldering device (10) comprises a heating module (24, 124, 224) and a heat radiator (36) arranged in the heating module (24, 124, 224), characterized in that when a printed circuit board (16) is in a heating position in the heating module (24, 124, 224), the heating module (24, 124, 224) is at least slightly closed in an operating position by means of an adjustable reflector baffle (40, 52, 56, 58, 62, 64), so that the reflector baffle (40, 52, 56, 58, 62, 64) reflects radiation emitted by the heat radiator (36) in the operating position in such a way that the radiation remains in the heating module (24, 124) and contributes to preheating the corresponding printed circuit board (16).

12. The method according to claim 11, wherein The at least one reflector web (40, 52, 56, 58, 62, 64) is adjusted into the operating position depending on the structural height (H) of the corresponding printed circuit board (16).

13. The method according to claim 12, wherein: In a first operating position, the distance (D1) between the at least one reflector partition (40, 52, 56, 58) and the transport plane (E) is equal to or slightly greater than the structural height (H) of the corresponding printed circuit board (16), and The adjustment further causes the at least one reflector partition (40, 52, 56, 58, 62, 64) to be adjusted to a second operating position after the corresponding printed circuit board (16) reaches the heating position, in which the module inlet (30) and / or the module outlet (32) are at least largely closed.

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