IC loading and sorting machine

Abstract

The invention discloses an IC loading and sorting machine. The IC loading and sorting machine comprises a rack, a trolley and two pieces of loading and sorting combined equipment, the rack is provided with an upper panel area, a lower panel area and an upper plate area, a sorting area is arranged in the middle, and the trolley is arranged between the upper plate area and the sorting area; the loading and sorting combined equipment, the upper panel area and the lower panel area are symmetrically arranged on the two opposite sides of the sorting area correspondingly. The loading and sorting combined equipment comprises a tray conveying device, a transfer conveying device, an IC transfer manipulator and an IC transfer manipulator; the tray conveying device is connected between the upper tray area and the lower tray area on the same side; the transfer conveying device is provided with a first transfer position and a second transfer position; the IC transfer manipulator is arranged between the tray conveying device and the first transfer position; the transfer conveying device is arranged between the sorting area and the tray conveying device; and the IC transfer manipulator is arranged between the second transfer position and the sorting area. The device has the advantages that the automation degree is high, the production space is saved, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to a semiconductor sorting machine, in particular to an IC loading and sorting machine. Background Art

[0002] In semiconductor production, for example, chips or ICs need to be tested during production. After testing, the chips or ICs need to be sorted based on the test results. These classifications can be categorized into various types, including performance and quality. Therefore, timely sorting of chips or ICs is necessary to provide a reference for subsequent production. However, in the prior art, chip or IC testing often requires manual assistance. For example, a worker must place the chip or IC into a tester for testing. After the test is complete, the worker must remove the chip or IC and place a new one in the tester for retesting. After the test is complete, the worker must manually sort the chips or ICs based on the test results. Therefore, this existing method has a low degree of automation, requires multiple independent devices to operate, and is bulky, occupying a significant amount of production space. Furthermore, the workload is high for workers, resulting in relatively low production efficiency and unsuitable for mass production. Summary of the Invention

[0003] The object of the present invention is to provide an IC loading and sorting machine with a high degree of automation, saving production space, improving production efficiency and reducing production costs.

[0004] In order to achieve the above-mentioned purpose, the IC loading and sorting machine provided by the present invention includes a frame, a trolley arranged on the frame, and two loading and sorting combination devices; the frame is provided with an upper plate area, a lower plate area, an upper plate area, and a sorting area in the middle, and the trolley is arranged between the upper plate area and the sorting area to transfer the test board; the loading and sorting combination equipment, the upper plate area and the lower plate area are respectively symmetrically arranged on the opposite sides of the sorting area; the loading and sorting combination equipment includes a tray conveyor device, a transfer conveyor device, an IC transfer robot and an IC transfer robot; the tray conveyor device is connected between the upper plate area and the lower plate area on the same side , to transport the tray for loading ICs between the upper tray area and the lower tray area; the transfer conveyor device is provided with a first transfer position and a second transfer position; the IC transfer robot is arranged between the tray conveyor device and the first transfer position to transfer the IC between the latter two; the transfer conveyor device is arranged between the sorting area and the tray conveyor device, and enables the jig of the transfer conveyor device to move between the first transfer position and the second transfer position; the IC transfer robot is arranged between the second transfer position and the sorting area to transfer the IC between the second transfer position and the test board on the sorting area.

[0005] Compared to the prior art, the present invention symmetrically arranges a tray conveyor, a transfer conveyor, an IC transfer robot, and an IC transfer robot upper and lower tray areas on either side of the sorting zone. The tray conveyor is connected between the upper and lower tray areas on the same side, thereby utilizing the tray conveyor and transfer conveyor to load ICs from the tray to the transfer position. Furthermore, a trolley is provided on the sorting zone, movable between the upper and sorting zones. The trolley is then used to load test boards onto the sorting zone, and the IC transfer robot is then used to transfer ICs between the tray and the test board. Therefore, the present invention utilizes each of the aforementioned devices for IC loading and unloading, as well as simultaneous loading and unloading of ICs. This allows for diverse production modes, greatly meeting various production requirements, and boasts high adaptability. The entire process is fully automated, requiring no manual operation and resulting in extremely high production efficiency. Furthermore, due to the rational arrangement of the various devices, the overall structure is very compact, small in size, and occupies a small production space, significantly saving labor, equipment, and production space rental costs.

[0006] Preferably, the IC loading and sorting machine further includes a tray transfer device, which is disposed between the two lower tray areas to unload trays delivered by the tray conveyor device to the lower tray area or to transport trays from one tray conveyor device to the other tray conveyor device. By providing the tray transfer device, trays from one tray conveyor device to the other tray conveyor device can be quickly transferred, thereby fully utilizing the empty trays running on the equipment and improving the utilization rate of trays. Thus, ICs can be loaded using the tray transfer device on one side while being unloaded using the tray transfer device on the other side, thereby achieving a synchronous loading and unloading mode for ICs and greatly improving production efficiency.

[0007] Preferably, the IC loading and sorting machine further includes a board supply device and a trolley. The trolley is used to load the test boards. The board supply device is located in the upper board area and is connected to the trolley to transfer the test boards on the trolley to the trolley, or vice versa. By providing the board supply device and trolley, the trolley can be loaded with a large number of test boards at a time, achieving the purpose of long-term stable material supply. The board supply device can remove the test boards from the trolley and transport them to the trolley to achieve the purpose of automatically loading the test boards. Thus, automatic test board loading is achieved, effectively improving board loading efficiency.

[0008] Preferably, the IC loading and sorting machine further includes an NG tray transfer device and an IC sorting robot located between the two tray conveying devices and symmetrically arranged on opposite sides of the trolley. The transfer conveying device is provided with a third transfer position. The IC sorting robot is arranged between one end of the NG tray transfer device and the third transfer position to transfer the ICs on the third transfer position to the material tray of the NG tray transfer device. By providing the third transfer position and the NG tray transfer device, the IC sorting robot is used to transfer the ICs of different polarities obtained after testing on the trolley, so that the tested ICs can be sorted or classified, so that the ICs are automatically graded and processed without manual sorting, which greatly improves production efficiency and can provide accurate information for subsequent reprocessing of the ICs, thereby ensuring the quality of the finished ICs.

[0009] Specifically, the IC loading and sorting machine also includes several tray collection devices, which are located at one end of the NG tray transfer device to collect the trays on the NG tray transfer device. By providing these tray collection devices, the IC sorting robot can distribute different types of ICs to different tray collection devices for collection. This allows for sorting different types of ICs, facilitating subsequent collection and centralized processing of ICs of the same type.

[0010] Specifically, the IC loading and sorting machine also includes a tray bin and a tray transfer robot. The tray bin is located on one side of the tray collection device, and the tray transfer robot is located between the bin and the collection device to transfer trays between the two. The tray bin and the tray transfer robot automatically deliver empty trays to the collection device, achieving fully automated sorting and collection of ICs, significantly improving the equipment's automation and production efficiency.

[0011] Preferably, the IC loading and sorting machine further includes a socket opening device, located above the sorting area, for opening the sockets on the test board for connecting ICs. Because each socket on the test board requires opening to allow IC insertion and connection, the provision of the socket opening device allows the socket opening to open automatically, facilitating the placement of ICs onto the test board on the trolley without manual operation, further enhancing the degree of automation.

[0012] Preferably, the trolley includes a transfer device, a trolley device and a prediction device, the transfer device is arranged on the side of the trolley device close to the upper plate area, and the prediction device is arranged at the other end of the trolley device away from the transfer device; the transfer device, trolley device and prediction device respectively have an upper conveying mechanism and a lower conveying mechanism, the upper conveying mechanisms of the transfer device, trolley device and prediction device form an upper conveying channel to send the test plate from the transfer device to the trolley device and the prediction device; a lower conveying channel is formed between the lower conveying mechanisms of the transfer device, trolley device and prediction device to send the test plate from the prediction device to the trolley device and the transfer device. By arranging a transfer device, a trolley device and a prediction device on the trolley, and making the three form an upper and lower conveying structure, the upper conveying channel is used to input the test board into the trolley, and the lower conveying channel is used to output the test board from the trolley. Therefore, the transfer device can automatically transport the test board to the trolley device or the prediction device, and the trolley device can receive ICs from the tray, thereby transferring a large number of ICs to the test board for subsequent IC processing, realizing automatic loading and unloading, and greatly improving automation. In addition, the trolley device can also automatically transport the test board to the prediction device, and the prediction device can perform batch pre-testing of ICs through the test board, thereby preparing for the next step of sorting the ICs, improving the accuracy of IC sorting, and achieving the purpose of IC sorting, so that it is suitable for different production modes.

[0013] Specifically, the transfer device includes a first base, an upper-layer pushing mechanism, a lower-layer pulling mechanism, the upper-layer conveying mechanism and the lower-layer conveying mechanism, the upper-layer conveying mechanism and the lower-layer conveying mechanism being arranged on the first base and in an upper and lower arrangement; the upper-layer pushing mechanism is arranged on the first base and pushes the test plate on the upper-layer conveying mechanism to move to the upper-layer conveying mechanism of the trolley device; the lower-layer pulling mechanism is arranged on the first base and pulls the test plate on the lower-layer conveying mechanism of the trolley device to move to the lower-layer conveying mechanism of the transfer device. The upper-layer pushing mechanism can be used to move the test plate from the upper-layer conveying mechanism of the transfer device to the upper-layer conveying mechanism of the trolley device, thereby realizing automatic loading of the test plate. The lower-layer pulling mechanism can be used to move the test plate from the lower-layer conveying mechanism of the trolley device to the lower-layer conveying mechanism of the transfer device, thereby realizing automatic unloading of the test plate.

[0014] Specifically, the trolley device includes a second base, an X-direction drive mechanism, a Y-direction drive mechanism, a second bearing seat, a second lifting mechanism, a second avoidance cylinder, the upper conveying mechanism and the lower conveying mechanism; the X-direction drive mechanism is arranged on the first base to drive the test board to move along the X direction; the Y-direction drive mechanism is arranged at the output end of the X-direction drive mechanism to drive the test board to move along the Y direction; the second bearing seat is arranged at the output end of the Y-direction drive mechanism; the upper conveying mechanism and the lower conveying mechanism are arranged on the second bearing seat and are arranged in an upper and lower manner; the second lifting mechanism is arranged on the surface of the second bearing seat to drive the test board to rise and fall; the second avoidance cylinder is arranged on the second bearing seat and drives the upper conveying mechanism to avoid when the test board descends. By arranging the X-direction drive mechanism and the Y-direction drive mechanism, the trolley device can adjust the position of the test board in the horizontal plane, so that it can automatically dock with the transfer device, the prediction device and the IC transfer robot, play the role of transfer and docking, and ensure the stable and smooth flow of the test board and IC.

[0015] Specifically, the trolley device also includes a rotary drive mechanism, which is disposed between the Y-axis drive device and the second support base to drive the second support base to rotate horizontally. By providing a rotary drive mechanism, the test board can adapt to different IC placement orientations, improving the adaptability of the device.

[0016] Specifically, the trolley device also includes a front limit cylinder and a rear limit cylinder. The rear limit cylinder is arranged on the second bearing seat and is located at the end of the upper conveying mechanism of the trolley device away from the transfer device and drives the output end to extend and retract to block or release the test board. The front limit cylinder is arranged on the end of the lifting platform of the second jacking mechanism close to the transfer device. The output end of the front limit cylinder and the output end of the rear limit cylinder jointly limit the lateral position of the test board. The front limit cylinder and the rear limit cylinder can be used to accurately place the test board on the trolley device, so that the IC transfer robot can accurately align the IC with the corresponding socket on the test board, greatly improving the accuracy and efficiency of IC loading.

[0017] Specifically, the trolley device further includes side-thrust cylinders, each of which is disposed on either side of the second support base. The output ends of the two side-thrust cylinders extend to jointly limit the longitudinal position of the test board. The provision of the side-thrust cylinders further ensures the accuracy of the position of the test board on the trolley device, thereby ensuring the accuracy of IC board placement.

[0018] Specifically, the prediction device includes a third base, a third lifting mechanism, a push-pull mechanism, a third avoidance cylinder, the upper conveying mechanism, the lower conveying mechanism and a testing device; the testing device is arranged at the end of the upper conveying mechanism away from the trolley to connect with and test the test board; the upper conveying mechanism and the lower conveying mechanism are arranged on the third base and are arranged in an upper and lower position; the third lifting mechanism is arranged on the third base and the output end is connected to the push-pull mechanism to drive the push-pull mechanism and the test board to rise and fall; the push-pull mechanism drives the test board to move along the upper conveying mechanism to connect the test board to the testing device, or drives the test board to leave the testing device and move along the conveying direction of the lower conveying mechanism; the third avoidance cylinder is arranged on the first base and drives the upper conveying mechanism to avoid when the test board descends. By utilizing the third lifting mechanism, the test board can be moved from the upper conveying mechanism to the lower conveying mechanism, and by utilizing the pulling mechanism, the test board can enter the upper conveying mechanism, or be plugged in and out of the testing device, or leave the prediction device from the lower conveying mechanism, thereby achieving the effect of automatic connection, automatic measurement and automatic departure of the test board, without the need for manual transfer, and extremely high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view of the IC loading and sorting machine of the present invention.

[0020] Figure 2 It is a top view of the IC loading and sorting machine of the present invention.

[0021] Figure 3 It is a structural schematic diagram of the IC loading and sorting machine of the present invention.

[0022] Figure 4 It is a structural diagram of the transfer conveying device of the IC loading and sorting machine of the present invention.

[0023] Figure 5 It is a structural diagram of the trolley of the IC loading and sorting machine of the present invention.

[0024] Figure 6 It is a top view of the trolley of the IC loading and sorting machine of the present invention.

[0025] Figure 7 It is a structural diagram of the transfer device of the IC loading and sorting machine of the present invention.

[0026] Figure 8 It is a right side view of the transfer device of the IC loading and sorting machine of the present invention.

[0027] Figure 9 It is a structural diagram of the trolley device of the IC loading and sorting machine of the present invention.

[0028] Figure 10 This is a right side view of the trolley device of the IC loading and sorting machine of the present invention.

[0029] Figure 11 This is an exploded view of the trolley device of the IC loading and sorting machine of the present invention.

[0030] Figure 12 It is a structural diagram of the prediction device of the IC loading and sorting machine of the present invention.

[0031] Figure 13 This is a right side view of the prediction device of the IC loading and sorting machine of the present invention.

[0032] Figure 14 This is a flow chart of the board loading mode of the IC loading and sorting machine of the present invention.

[0033] Figure 15 This is a flow chart of the unloading mode of the IC loading and sorting machine of the present invention.

[0034] Figure 16 It is a flow chart of the loading and unloading synchronization mode of the IC loading and sorting machine of the present invention. DETAILED DESCRIPTION

[0035] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the embodiments and the accompanying drawings.

[0036] like Figures 1 to 4As shown, the present invention discloses an IC loading and sorting machine 100, which is used to load ICs on a tray onto a test board, or load ICs on a test board onto a tray, or sort ICs on a test board and load them onto a tray. The test board is an aging test board, which is used to perform batch aging tests on multiple ICs. The tray is used to load ICs in batches to facilitate the transportation of ICs. The tray is used to load sorted ICs of the same type to facilitate the transportation of ICs. The IC loading and sorting machine 100 includes a rack 1, a trolley 2 and two sets of loading and sorting combination equipment 3 arranged on the rack 1. The rack 1 is divided into an upper layer 1a and a lower layer 1b. The two sets of loading and sorting combination equipment 3 are arranged on the upper layer 1a, and the trolley 2 is arranged on the lower layer 1b. An upper plate area 11 is provided at the left and right ends of the front side of the rack 1, a lower plate area 12 is provided at the left and right ends of the rear side of the rack 1, an upper plate area 13 is provided at the rear right side of the rack 1, and a sorting area 14 is provided in the middle of the rack 1. The trolley 2 is arranged between the upper plate area 13 and the sorting area 14 to transfer the test board; when loading the board, the trolley 2 is located in the upper plate area 13 and loads the test board, and when loading the IC, the trolley 2 drives the test board to be located in the sorting area 14. The loading and sorting combination equipment 3, the upper plate area 11 and the lower plate area 12 are symmetrically arranged on the opposite sides of the sorting area 14. The structures of the two loading and sorting combination equipment 3 are the same. Taking one of the loading and sorting combination equipment 3 as an example, it includes a tray conveyor 4, a transfer conveyor 5, an IC transfer robot 6 and an IC transfer robot 7; the tray conveyor 4 is distributed on the left and right sides of the rack 1 and is connected between the upper plate area 11 and the lower plate area 12 on the same side to transport the tray for loading ICs between the upper plate area 11 and the lower plate area 12. The transfer conveyor 5 is located on the side of the tray conveyor 4 near the sorting area 14. The transfer conveyor 5's conveying direction is parallel to that of the tray conveyor 4 and is equipped with a first transfer position 51 and a second transfer position 52. Specifically, the transfer conveyor 5 is equipped with a jig for positioning the ICs. The jig is movably positioned at the first transfer position 51 or the second transfer position 52 to receive the ICs. The IC transfer robot 6 is positioned horizontally between the tray conveyor 4 and the first transfer position 51 in the left and right directions to transfer ICs between the two positions. The transfer conveyor 5 is located between the sorting area 14 and the tray conveyor 4 and moves the jig between the first transfer position 51 and the second transfer position 52. The IC transfer robot 7 is located between the second transfer position 52 and the sorting area 14 to transfer ICs between the second transfer position 52 and the test board on the trolley 2 located in the sorting area 14.

[0037] For example Figure 3As shown, the IC loading and sorting machine 100 further includes a socket opening device 8, which is located on the upper layer of the rack 1 and above the sorting area 14 to open the sockets on the test board for connecting ICs. Since each socket on the test board requires a socket opening to be opened before an IC is inserted and connected, the socket opening device 8 can automatically open the socket opening, thereby facilitating the placement of ICs onto the test board on the trolley 2 without manual operation, further improving the degree of automation.

[0038] See also Figures 1 to 3 The IC loading and sorting machine 100 also includes a tray transfer device 9, which is arranged on the upper rear side of the frame 1 and is connected between the two lower plate areas 12 to unload the trays sent to the lower plate area 12 by the tray conveyor 4 or to transport the trays of the tray conveyor 4 on one side to the tray conveyor 4 on the other side. The tray transfer device 9 can be a conveyor chain or a robot, etc. By setting up the tray transfer device 9, the trays of the tray conveyor 4 on one side can be quickly transferred to the tray conveyor 4 on the other side, so that the empty trays running on the equipment can be fully utilized and the circulation utilization rate of the trays can be improved. Therefore, the tray conveyor 4 on one side can be used to load ICs, and the tray conveyor 4 on the other side can be used to unload ICs at the same time, realizing the IC synchronous loading and unloading mode, which greatly improves production efficiency.

[0039] See also Figures 1 to 3 The IC loading and sorting machine 100 further includes a board supply device 10 and a trolley 110. The trolley 110 is used to load the test board. The board supply device 10 is located in the upper board area 13 and is connected to the trolley 110 to transfer the test board on the trolley 110 to the trolley 2 or transfer the test board on the trolley 2 to the trolley 110. By providing the board supply device 10 and the trolley 110, the trolley 110 can load a large number of test boards at a time, achieving the purpose of long-term stable material supply. The board supply device 10 can take the test board from the trolley 110 and transport it to the trolley 2 to achieve the purpose of automatic test board loading, thereby realizing automatic test board loading and effectively improving board loading efficiency.

[0040] Please refer to Figures 1 to 3The IC loading and sorting machine 100 further includes an NG tray transfer device 120 and an IC sorting robot 130, which are located between the two tray conveying devices 4 and symmetrically arranged on opposite sides of the trolley 2. The number of the NG tray transfer devices 120 is multiple, so as to be used for conveying different types of IC trays. The conveying direction of the NG tray transfer device 120 is parallel to the conveying direction of the transfer conveying device 5. The NG tray transfer device 120 and the IC sorting robot 130 are located on the upper layer of the rack 1. The transfer conveying device 5 is provided with a third transfer position 53, which is located on the side of the first transfer position 51 away from the second transfer position 52. The IC sorting robot 130 is arranged between one end of the NG tray transfer device 120 and the third transfer position 53 to transfer the IC on the third transfer position 53 to the tray of one of the NG tray transfer devices 120. By setting up a third transfer position 53 and an NG tray transfer device 120, the IC sorting robot 130 is used to transfer the ICs of different polarities obtained after testing on the trolley 2, so that the tested ICs can be sorted or classified, so that the ICs are automatically graded and processed without manual sorting, which greatly improves production efficiency and can provide accurate information for subsequent reprocessing of the ICs to ensure the quality of the finished IC products.

[0041] See also Figures 1 to 3 The IC loading and sorting machine 100 also includes several tray collection devices 140, a tray bin 150, and a tray transfer robot 160. In this embodiment, the tray collection devices 140 are multiple and arranged in a left and right orientation. Each tray collection device 140 is located at one end of the NG tray transfer device 120 and on the upper front side of the rack 1 to collect trays from the NG tray transfer device 120. By providing the tray collection devices 140, the IC sorting robot 130 can allocate different types of ICs to different tray collection devices 140 for collection. This allows for sorting different types of ICs, facilitating subsequent collection and centralized processing of ICs of the same type. The tray bin 150 is located on one side of the tray collection device 140, and the tray transfer robot 160 is located between the tray bin 150 and the tray collection device 140 to transfer trays between the two. By setting up the tray bin 150 and the tray transfer robot 160, empty trays can be automatically transported to the tray collecting device 140, thereby achieving the purpose of fully automatic classification and collection of ICs, greatly improving the degree of automation of the equipment and improving production efficiency.

[0042] See also Figures 5 and 6The trolley 2 includes a transfer device 21, a trolley device 22, and a prediction device 23. The transfer device 21 is arranged on the side of the trolley device 22 close to the upper plate area 13 to dock with the plate supply device 10; the prediction device 23 is arranged on the other end of the trolley device 22 away from the transfer device 21. The transfer device 21, trolley device 22, and prediction device 23 are arranged in sequence from right to left, and each has an upper conveying mechanism and a lower conveying mechanism. The upper conveying mechanisms of the transfer device 21, trolley device 22, and prediction device 23 form the upper conveying channel of the trolley 2 to convey the test plate from the upper plate area 13 to the transfer device 21, the trolley device 22, or the prediction device 23. The lower conveying channel of the trolley 2 is formed between the transfer device 21, the trolley device 22 and the lower conveying mechanism of the prediction device 23, so as to convey the test board from the prediction device 23 to the trolley device 22, the transfer device 21 and the upper plate area 13. By arranging the transfer device 21, the trolley device 22 and the prediction device 23 on the trolley 2, and making the three form an upper and lower conveying structure, the upper conveying channel is used to input the test board into the trolley 2, and the lower conveying channel is used to output the test board from the trolley 2. Therefore, the transfer device 21 can automatically convey the test board to the trolley device 22 or the prediction device 23, and the trolley device 22 can receive the IC from the tray, thereby transferring a large number of ICs to the test board for subsequent IC processing, realizing automatic loading and unloading, and greatly improving automation. In addition, the trolley device 22 can also automatically transport the test board to the prediction device 23, and the prediction device 23 can perform batch pre-testing on ICs through the test board, thereby preparing for the next step of IC sorting, improving the accuracy of IC sorting, and achieving the purpose of IC sorting, thereby being suitable for different production modes. Specifically, as follows: See also Figure 7 and Figure 8The transfer device 21 includes a first base 213, an upper-layer pushing mechanism 214, a lower-layer pulling mechanism 215, the upper-layer conveying mechanism 211, and the lower-layer conveying mechanism 212. The upper-layer conveying mechanism 211 and the lower-layer conveying mechanism 212 are arranged on the first base 213 and are arranged in an upper and lower position. The upper-layer conveying mechanism 211 and the lower-layer conveying mechanism 212 are composed of a plurality of arranged rollers, which are arranged on opposite sides of the first base 213. The test board is carried on the rollers on both sides. The upper-layer pushing mechanism 214 pushes the test board on the upper-layer conveying mechanism 211 to move to the upper-layer conveying mechanism 221 of the trolley device 22. The lower-layer pulling mechanism 215 is arranged in the middle of the first base 213 and pulls the test board on the lower-layer conveying mechanism 222 of the trolley device 22 to move to the lower-layer conveying mechanism 212 of the transfer device 21. The upper pushing mechanism 214 can be used to move the test plate from the upper conveying mechanism 211 of the transfer device 21 to the upper conveying mechanism 221 of the trolley device 22, thereby realizing automatic loading of the test plate. The lower pulling mechanism 215 can be used to move the test plate from the lower conveying mechanism 222 of the trolley device 22 to the lower conveying mechanism 212 of the transfer device 21, thereby realizing automatic unloading of the test plate. The upper pushing mechanism 214 is driven by a motor to drive a belt, so that the belt drives the push plate, so that the push plate pushes the test plate to move. The lower pushing mechanism can also be driven by a motor to drive a belt or chain, so that the belt or chain drives the hook to move, so that the hook hooks the test plate and moves.

[0043] See also Figures 9 to 11The trolley device 22 includes a second base 223, an X-direction drive mechanism 224, a Y-direction drive mechanism 225, a second bearing seat 226, a second lifting mechanism 227, a second avoidance cylinder 228, the upper conveying mechanism 221, and the lower conveying mechanism 222. The X-direction is the left and right direction of the frame 1, and the Y-direction is the front and rear direction of the frame 1. The X-direction drive mechanism 224 is disposed on the first base 213 to drive the test plate to move along the X-direction. The Y-direction drive mechanism 225 is disposed at the output end of the X-direction drive mechanism 224 to drive the test plate to move along the Y-direction. The second bearing seat 226 is disposed at the output end of the Y-direction drive mechanism 225. The upper conveying mechanism 221 and the lower conveying mechanism 222 are disposed on the second bearing seat 226 and are arranged in an upper and lower position. The upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 have the same structure as the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21. The second lifting mechanism 227 is arranged on the surface of the second supporting seat 226 to drive the test board to rise and fall; the second avoidance cylinder 228 is arranged on the second supporting seat 226 and drives the upper conveying mechanism 221 to avoid when the test board descends. By setting the X-direction drive mechanism 224 and the Y-direction drive mechanism 225, the trolley device 22 can adjust the position of the test board in the horizontal plane, so that it can automatically dock with the transfer device 21, the prediction device 23 and the IC transfer robot 7, playing the role of transfer and docking, ensuring the stable and smooth flow of the test board and IC. Specifically, the trolley device 22 also includes a rotation drive mechanism 229, which is arranged between the Y-direction drive mechanism and the second supporting seat 226 to drive the second supporting seat 226 to rotate in the horizontal direction. By providing a rotation drive mechanism 229, the test board can adapt to different IC placement orientations, improving the adaptability of the device. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 are implemented by servo motors driving the lead screw nut. The rotation drive mechanism 229 is achieved by the motor 2291 driving the driving gear 2292, which in turn drives the driven gear 2293 to achieve rotation. The trolley device 22 also includes a front limit cylinder 2210, a rear limit cylinder 2220 and a side push cylinder 2230. The rear limit cylinder 2220 is arranged on the second bearing seat 226, and is located at the upper conveying mechanism 221 of the trolley device 22 at one end away from the transfer device 21 and drives the output end to extend and retract to block or release the test plate; the front limit cylinder 2210 is arranged on the lifting platform of the second jacking mechanism 227 close to the transfer device 21, and the output end of the front limit cylinder 2210 and the output end of the rear limit cylinder 2220 jointly limit the lateral position of the test plate.By using the front limit cylinder 2210 and the rear limit cylinder 2220, the test board can be accurately placed on the trolley device 22, so that the IC transfer robot 7 can accurately align the IC with the corresponding socket on the test board, greatly improving the accuracy and efficiency of IC loading. The side push cylinders 2230 are respectively arranged on both sides of the second bearing seat 226, and the output ends of the two side push cylinders 2230 extend to jointly limit the longitudinal position of the test board. The provision of the side push cylinders 2230 can further ensure the position accuracy of the test board on the trolley device 22, thereby ensuring the accuracy of IC loading. In addition, the trolley device 22 also includes a pressing cylinder 2240, which is respectively arranged on the opposite sides of the second bearing seat 226. When the lifting platform of the second lifting mechanism 227 lifts the test board, the protruding end of the second pressing cylinder drives the pressing block on its protruding end to position the test board on the lifting platform.

[0044] See also Figure 12 and Figure 13The prediction device 23 includes a third base 233, a third lifting mechanism 234, a push-pull mechanism 235, a third avoidance cylinder 236, the upper conveying mechanism 231, the lower conveying mechanism 232 and a testing device 237; the testing device 237 is arranged at the end of the upper conveying mechanism 231 away from the trolley 2 to connect with the test board and test the test board; the upper conveying mechanism 231 and the lower conveying mechanism 232 are arranged on the third base 233 and are arranged in an upper and lower manner; the structure of the upper conveying mechanism 231 and the lower conveying mechanism 232 of the prediction device 23 is the same as the structure of the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21. The third lifting mechanism 234 is disposed in the middle of the third base 233, and its output end is connected to the push-pull mechanism 235 to drive the push-pull mechanism 235 and the test board to rise and fall. The push-pull mechanism 235 drives the test board to move along the upper conveying mechanism 231 so that the test board can connect with the test device 237, or drives the test board to leave the test device 237 and move along the conveying direction of the lower conveying mechanism 232. The push-pull mechanism 235 is implemented by a motor-driven belt, which drives the belt to drive the hook, and the hook drives the test board to move. The third avoidance cylinder 236 is disposed on the first base 213 and drives the upper conveying mechanism 231 to avoid when the test board descends, allowing the test board to smoothly descend to the lower conveying mechanism 232. By utilizing the third lifting mechanism 234, the test board can be moved from the upper conveying mechanism 231 to the lower conveying mechanism 232, and by utilizing the push-pull mechanism, the test board can enter the upper conveying mechanism 231, or be plugged in and out of the testing device 237, or can leave the prediction device 23 from the lower conveying mechanism 232, thereby achieving the effect of automatic connection, automatic measurement and automatic departure of the test board, without the need for manual operation and transfer, and extremely high efficiency.

[0045] Based on the above and combined with the above drawings Figure 2 and Figure 3 , the working principle of the present invention is described in detail below: The IC loading and sorting machine 100 of the present invention can operate in multiple modes, such as a loading mode, an unloading mode, and a simultaneous loading and unloading mode. The loading mode involves loading empty test boards onto the trolley device 22 in the sorting area 14, simultaneously loading trays filled with ICs on both sides of the sorting area 14, transferring the ICs on the trays to the test boards, and finally unloading the filled test boards and empty trays. The unloading mode involves loading filled test boards onto the trolley device 22 in the sorting area 14, simultaneously loading empty trays, transferring the ICs on the test boards to the trays, and finally unloading the empty test boards and filled trays. The synchronous loading and unloading mode is to load the fully loaded test board onto the trolley device 22 of the sorting area 14, and at the same time load the fully loaded tray on one side of the sorting area 14 and the empty tray on the other side of the sorting area 14, then transfer the ICs on the test board to the empty tray on the other side of the sorting area 14, and then transfer the ICs on the fully loaded tray on one side of the sorting area 14 to the empty space on the test board, and finally unload the reloaded test board, reloaded tray, and empty tray. More specific steps are as follows: Combine Figure 14As shown, when operating in the upper plate mode, the loading and sorting combination equipment 3 on the left and right sides operate simultaneously with the same action, taking the loading and sorting combination equipment 3 on one side as an example. First, the tray conveyor 4 conveys a tray full of ICs from one end of the upper plate area 11 to the suction position in the middle. After the IC transfer robot 6 absorbs the IC, it places the IC on the jig at the first transfer position 51 of the transfer conveyor 5. Afterwards, the transfer conveyor 5 moves the jig containing the IC to the second transfer position 52. At the same time, the plate supply device 10 hooks out an empty test plate on the material cart 110, and pushes the test plate to the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22 on the trolley 2, driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, approaches the transfer device 21, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are docked with the upper conveying mechanism 211 and the lower conveying mechanism 212 of the transfer device 21 in a one-to-one correspondence. Afterwards, the upper pushing mechanism 214 on the transfer device 21 pushes the test plate onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 drive the second supporting seat 226 to move directly below the socket opening device 8 of the sorting area 14. The front limit cylinder 2210 and the rear limit cylinder 2220 on the conveying device of the trolley 2 limit the test plate in the X direction. Then, the second lifting mechanism 227 lifts the test board, and at the same time, the side push cylinder 2230 positions the test board in the Y direction. Finally, the pressing cylinder 2240 presses and positions the test board. At this time, the output end of the socket opening device 8 moves downward close to the test board and opens the socket opening on the test board. Next, the IC transfer robot 7 absorbs and transfers the IC on the second transfer position 52 and places it on the socket of the test board on the trolley device 22. Afterwards, the socket opening device 8 leaves the test board, so that the socket of the test board fixes the IC. When the test board on the trolley device 22 is fully loaded with ICs, the front limit cylinder 2210, rear limit cylinder 2220, side push cylinder 2230, and pressing cylinder 2240 operate to release the test board. Simultaneously, the second avoidance cylinder 228 drives the rollers of the upper conveying mechanism 221 to withdraw, avoiding the test board. At this time, the second lifting mechanism 227 lowers the test board onto the rollers of the lower conveying mechanism 222. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 again approaches the transfer device 21 and docks with it.Afterwards, the lower-layer pulling mechanism 215 on the transfer device 21 pulls the test board from the lower-layer conveying mechanism 222 of the trolley device 22 to the lower-layer conveying mechanism 212 of the transfer device 21. The lower-layer pulling mechanism 215 then pushes the test board onto the board supply device 10. The board supply device 10 pushes the fully loaded test board onto the material cart 110. Furthermore, after the pallet conveyor 4 has finished feeding the pallets, the pallet conveyor 4 transports the empty pallets to the lower tray area 12 for unloading.

[0046] Combine Figure 15As shown, when operating in the unloading mode, the loading and sorting combination equipment 3 on the left and right sides operate simultaneously with the same action, taking the loading and sorting combination equipment 3 on one side as an example. First, the pallet conveyor device 4 conveys an empty pallet from one end of the lower plate area 12 to the middle thereof. At the same time, the plate supply device 10 hooks out a fully loaded test plate from the material cart 110 and pushes the test plate onto the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22 approaches the transfer device 21 under the drive of the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are docked with the upper conveying mechanism 211 and the lower conveying mechanism 212 on the transfer device 21 in a one-to-one correspondence. Afterwards, the upper pushing mechanism 214 on the transfer device 21 pushes the test plate onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 drive the second carrier 226 to move directly below the socket opening device 8 in the sorting area 14. The output end of the socket opening device 8 then moves downward toward the test board, opening the socket openings on the test board. Next, the IC transfer robot 7 transfers the ICs from the sockets of the test board on the trolley device 22 and places them on the jig at the second transfer position 52 of the transfer conveyor mechanism. The transfer conveyor mechanism then drives the jig to either the first transfer position 51 or the third transfer position 53 based on the test results. The IC transfer robot 7 transfers the ICs from the first transfer position 51 and places them on the tray of the tray conveyor 4. The IC sorting robot 130 transfers the ICs from the third transfer position 53 and places them on the corresponding tray of the tray collection device 140 based on the test category. The tray collection device 140 then transports the fully loaded trays to the tray bin 150 for unloading. In addition, when the tray of the tray conveyor 4 is filled with ICs, the tray conveyor 4 transports the fully loaded tray to the upper tray area 11 for unloading. When all ICs on the test board of the trolley device 22 are removed, the front limit cylinder 2210, rear limit cylinder 2220, side push cylinder 2230, and pressure cylinder 2240 operate to release the test board. At the same time, the second avoidance cylinder 228 drives the rollers of the upper conveying mechanism 221 to withdraw and avoid the test board. At this time, the second lifting mechanism 227 lowers the test board onto the rollers of the lower conveying mechanism 222. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 again approaches the transfer device 21 and docks with the transfer device 21.Afterwards, the lower-level pulling mechanism 215 on the transfer device 21 pulls the test board from the lower-level conveying mechanism 222 of the trolley device 22 to the lower-level conveying mechanism 212 of the transfer device 21, and then, the lower-level pulling mechanism 215 pushes the test board onto the board supply device 10, and the board supply device 10 pushes the empty test board back to the material cart 110.

[0047] Combine Figure 16As shown, when operating in a synchronous loading and unloading mode, the test board that is about to be fully loaded with ICs that have completed testing is transported to the trolley 2, and then the ICs are transferred to the empty IC tray provided by the loading and sorting combination device 3 on the left. Afterwards, the ICs to be tested on the loading and sorting combination device 3 on the right are transferred to the empty test board. Specifically, first, the board supply device 10 hooks out a test board that is fully loaded with tested ICs on the trolley 110, and pushes the test board to the upper conveying mechanism 211 of the transfer device 21. At this time, the trolley device 22 on the trolley 2 is driven by the X-direction drive mechanism 224 and the Y-direction drive mechanism 225 to approach the transfer device 21, so that the upper conveying mechanism 221 and the lower conveying mechanism 222 of the trolley device 22 are docked with the upper conveying mechanism 211 and the lower conveying mechanism 212 on the transfer device 21 in a one-to-one correspondence. Afterwards, the upper pushing mechanism 214 on the transfer device 21 pushes the test board onto the upper conveying mechanism 221 of the trolley device 22. The X-axis drive mechanism 224 and the Y-axis drive mechanism 225 drive the second bearing seat 226 to move directly below the socket opening device 8 of the sorting area 14. The front limit cylinder 2210 and the rear limit cylinder 2220 on the trolley 2 conveying device limit the test board in the X direction. Then, the second lifting mechanism 227 lifts the test board, while the side push cylinder 2230 positions the test board in the Y direction. Finally, the pressing cylinder 2240 presses the test board to position it. At this time, the output end of the socket opening device 8 moves downward close to the test board and opens the socket opening on the test board. At the same time, the tray conveying device 4 on the left side conveys an empty tray from one end of the upper plate area 11 on this side to the suction position in the middle. The IC transfer robot 6 on the left side absorbs the IC and places it on the jig at the first transfer position 51 of the transfer conveyor device 5 on the left side. Thereafter, the transfer conveyor device 5 on the left side moves the jig loaded with ICs to the second transfer position 52. Next, the IC transfer robot 7 on the left side absorbs and transfers the ICs from the test board on the trolley device 22 and places them on the jig at the second transfer position 52. After the jig on the transfer conveyor device 5 on the left side is filled with ICs, the transfer conveyor device 5 on the left side drives the jig back to the first transfer position 51 or the third transfer position 53. The IC transfer robot 7 on the left side absorbs and transfers the ICs from the first transfer position 51 and places them on the tray of the left tray conveyor device 4. Alternatively, the IC sorting robot 130 on the left side absorbs the ICs from the third transfer position 53 and places them on the corresponding tray of the tray collection device 140 according to the test category of the IC. The tray collection device 140 then transports the fully loaded trays to the tray bin 150 for unloading. In addition, when the tray of the left tray conveyor 4 is fully loaded with ICs, the left tray conveyor 4 conveys the fully loaded tray to the upper tray area 11 for unloading.At the same time, the tray conveyor 4 on the right side conveys a tray full of ICs to be tested from one end of the upper plate area 11 to the suction position in the middle thereof. The IC transfer robot 6 on the right side sucks the IC and places the IC on the jig at the first transfer position 51 of the transfer conveyor 5 on the right side. Afterwards, the transfer conveyor 5 on the right side moves the jig containing the IC to the second transfer position 52. Next, the IC transfer robot 7 on the right side sucks and transfers the IC on the second transfer position 52 and places it on the socket of the empty test board on the trolley device 22. Afterwards, the socket opening device 8 leaves the test board, so that the socket of the test board fixes the IC. When the test board on the trolley device 22 is fully loaded with ICs, the trolley device 22 moves and docks with the prediction device 23. The push-pull mechanism 235 on the prediction device 23 pulls the test board from the upper conveying mechanism 221 of the trolley device 22 onto the upper conveying mechanism 231 of the prediction device 23 and inserts the test board into the testing device 237, which then tests the ICs on the test board. After the test is complete, the push-pull mechanism 235 removes the test board from the testing device 237. The third avoidance cylinder 236 then drives the rollers of the upper conveying mechanism 231 of the testing device 237 to avoid the test board, and the third lifting mechanism 234 lowers the test board onto the lower conveying mechanism 232. The push-pull mechanism 235 then pushes the test board from the lower conveying mechanism 232 of the testing device 237 to the lower conveying mechanism of the trolley device 22. Driven by the X-axis drive mechanism 224 and the Y-axis drive mechanism 225, the trolley device 22 again approaches the transfer device 21 and docks with it. Subsequently, the lower-layer pulling mechanism 215 on the transfer device 21 pulls the test board from the lower-layer conveying mechanism 222 of the trolley device 22 to the lower-layer conveying mechanism 212 of the transfer device 21. The lower-layer pulling mechanism 215 then pushes the test board onto the board supply device 10, which pushes the fully loaded test board onto the material cart 110. Furthermore, after the pallet conveyor 4 on the right side has finished feeding the pallets, it transports the empty pallets to the lower tray area 12 for unloading.

[0048] Compared to the prior art, the present invention symmetrically arranges a tray conveyor 4, a transfer conveyor 5, an IC transfer robot 6, and an IC transfer robot 7, an upper plate area 11, and a lower plate area 12, on either side of a sorting area 14. The tray conveyor 4 is connected between the upper plate area 11 and the lower plate area 12 on the same side, thereby utilizing the tray conveyor 4 and transfer conveyor 5 to load ICs from the tray to the transfer position. Furthermore, by arranging a trolley 2 on the sorting area 14 so that the trolley 2 is movably disposed between the upper plate area 13 and the sorting area 14, the trolley 2 is utilized to load test boards onto the sorting area 14, and the IC transfer robot 7 is then utilized to transfer ICs between the tray and the test board. Therefore, the present invention can utilize the aforementioned devices to perform IC loading and unloading, as well as simultaneous IC loading and unloading production. This is applicable to different production modes, greatly meeting various production requirements, and possesses strong applicability. Furthermore, the entire process is fully automated, requiring no manual operation, resulting in extremely high production efficiency. In addition, due to the reasonable layout of each device, the structure of the whole machine is very compact, small in size, and occupies less production space, thus greatly saving the cost of labor, equipment, and production space rental.

[0049] The structures of the tray conveying device 4, IC transfer robot 6, IC transfer robot 7, socket opening device 8, tray transfer device 9, board supply device 10, material cart 110, NG tray transfer device 120, IC sorting robot 130, tray collection device 140, tray bin 150 and tray transfer robot 160 involved in the IC loading and sorting machine of the present invention are not the focus of this patent, and their structures are well known to ordinary technicians in this field, and will not be described in detail here.

[0050] The above disclosure is merely a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made within the scope of the present invention are still within the scope of the present invention.

Claims

1. An IC loading and sorting machine, characterized by: The invention comprises a frame, a trolley arranged on the frame and two loading and sorting combination devices; the frame is provided with an upper plate area, a lower plate area, an upper plate area, and a sorting area in the middle; the trolley is arranged between the upper plate area and the sorting area to transfer the test board; the loading and sorting combination device, the upper plate area and the lower plate area are respectively symmetrically arranged on the opposite sides of the sorting area; the loading and sorting combination device comprises a tray conveyor, a transfer conveyor, an IC transfer manipulator and an IC transfer manipulator; the tray conveyor is connected between the upper plate area and the lower plate area on the same side to transfer the test board between the upper plate area and the lower plate area The transfer conveyor is provided with a first transfer position and a second transfer position; the IC transfer robot is arranged between the tray conveyor and the first transfer position to transfer the IC between the latter two; the transfer conveyor is arranged between the sorting area and the tray conveyor, and enables the fixture of the transfer conveyor to move between the first transfer position and the second transfer position; the IC transfer robot is arranged between the second transfer position and the sorting area to transfer the IC between the second transfer position and the test board on the sorting area.

2. The IC loading and sorting machine according to claim 1, wherein: The IC loading and sorting machine also includes a pallet transfer device, which is arranged between the two lower plate areas to unload the pallets sent to the lower plate area by the pallet conveying device or to transport the pallets of the pallet conveying device on one side to the pallet conveying device on the other side.

3. The IC loading and sorting machine according to claim 1, wherein: The IC loading and sorting machine also includes a board supply device and a trolley. The trolley is used to load the test board. The board supply device is located in the upper plate area and is connected to the trolley to transfer the test board on the trolley to the trolley or transfer the test board on the trolley to the trolley.

4. The IC loading and sorting machine according to claim 1, wherein: The IC loading and sorting machine also includes an NG pallet transfer device located between the two pallet conveying devices and symmetrically arranged on opposite sides of the trolley, and an IC sorting robot. The transfer conveying device is provided with a third transfer position. The IC sorting robot is arranged between one end of the NG pallet transfer device and the third transfer position to transfer the IC on the third transfer position to the material tray of the NG pallet transfer device.

5. The IC loading and sorting machine according to claim 4, wherein: The IC loading and sorting machine further includes a plurality of tray collecting devices, which are arranged at one end of the NG tray transferring device to collect the trays on the NG tray transferring device.

6. The IC loading and sorting machine according to claim 4, wherein: The IC loading and sorting machine also includes a tray bin and a tray transfer robot. The tray bin is arranged on one side of the tray collecting device, and the tray transfer robot is arranged between the tray bin and the tray collecting device to transfer the tray between the latter two.

7. The IC loading and sorting machine according to claim 1, wherein: The IC loading and sorting machine further includes a socket opening device, which is disposed above the sorting area to open the sockets on the test board for connecting ICs.

8. The IC loading and sorting machine according to claim 1, wherein: The trolley includes a transfer device, a trolley device and a prediction device. The transfer device is arranged on one side of the trolley device close to the upper plate area, and the prediction device is arranged at the other end of the trolley device away from the transfer device; the transfer device, trolley device and prediction device respectively have an upper conveying mechanism and a lower conveying mechanism, and the upper conveying mechanisms of the transfer device, trolley device and prediction device form an upper conveying channel to send the test plate from the transfer device to the trolley device and the prediction device; a lower conveying channel is formed between the lower conveying mechanisms of the transfer device, trolley device and prediction device to send the test plate from the prediction device to the trolley device and the transfer device.

9. The IC loading and sorting machine according to claim 8, wherein: The transfer device includes a first base, an upper pushing mechanism, a lower pulling mechanism, the upper conveying mechanism and the lower conveying mechanism. The upper conveying mechanism and the lower conveying mechanism are arranged on the first base and are arranged in an upper and lower position; the upper pushing mechanism is arranged on the first base and pushes the test plate on the upper conveying mechanism to move to the upper conveying mechanism of the trolley device; the lower pulling mechanism is arranged on the first base and pulls the test plate on the lower conveying mechanism of the trolley device to move to the lower conveying mechanism of the transfer device.

10. The IC loading and sorting machine according to claim 8, wherein: The trolley device includes a second base, an X-direction drive mechanism, a Y-direction drive mechanism, a second bearing seat, a second lifting mechanism, a second avoidance cylinder, the upper conveying mechanism and the lower conveying mechanism; the X-direction drive mechanism is arranged on the first base to drive the test plate to move along the X direction; the Y-direction drive mechanism is arranged at the output end of the X-direction drive mechanism to drive the test plate to move along the Y direction; the second bearing seat is arranged at the output end of the Y-direction drive mechanism; the upper conveying mechanism and the lower conveying mechanism are arranged on the second bearing seat and are arranged in an upper and lower manner; the second lifting mechanism is arranged on the surface of the second bearing seat to drive the test plate to rise and fall; the second avoidance cylinder is arranged on the second bearing seat and drives the upper conveying mechanism to avoid when the test plate descends.

11. The IC loading and sorting machine according to claim 9, wherein: The trolley device further includes a rotation drive mechanism, which is disposed between the Y-direction drive device and the second supporting seat to drive the second supporting seat to rotate in a horizontal direction.

12. The IC loading and sorting machine according to claim 9, wherein: The trolley device also includes a front limit cylinder and a rear limit cylinder. The rear limit cylinder is arranged on the second bearing seat and is located at the end of the upper conveying mechanism of the trolley device away from the transfer device and drives the output end to extend and retract to block or release the test plate; the front limit cylinder is arranged on the end of the lifting platform of the second jacking mechanism close to the transfer device, and the output end of the front limit cylinder and the output end of the rear limit cylinder jointly limit the lateral position of the test plate.

13. The IC loading and sorting machine according to claim 9, wherein: The trolley device further includes side-pushing cylinders, which are respectively arranged on both sides of the second bearing seat. The output ends of the two side-pushing cylinders extend to jointly limit the longitudinal position of the test plate.

14. The IC loading and sorting machine according to claim 8, wherein: The prediction device includes a third base, a third lifting mechanism, a push-pull mechanism, a third avoidance cylinder, the upper conveying mechanism, the lower conveying mechanism and a testing device; the testing device is arranged at the end of the upper conveying mechanism away from the trolley to connect with the test board and test; the upper conveying mechanism and the lower conveying mechanism are arranged on the third base and are arranged in an upper and lower position; the third lifting mechanism is arranged on the third base and the output end is connected to the push-pull mechanism to drive the push-pull mechanism and the test board to rise and fall; the push-pull mechanism drives the test board to move along the upper conveying mechanism to connect the test board to the testing device, or drives the test board to leave the testing device and move along the conveying direction of the lower conveying mechanism; the third avoidance cylinder is arranged on the first base and drives the upper conveying mechanism to avoid when the test board descends.

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