An automatic wafer box packaging machine and packaging method

Abstract

This invention belongs to the field of wafer box packaging equipment, specifically relating to an automatic wafer box packaging machine and packaging method. The automatic wafer box packaging machine includes a wafer box labeling and inspection station for labeling the wafer boxes, an inner bag filling and heat-sealing station for packaging the labeled wafer boxes, and a desiccant application station for applying desiccant to the inner bag. By defining the structural composition of the packaging machine and setting up the wafer box labeling and inspection station, the inner bag filling and heat-sealing station, and the desiccant application station, this invention stably and automatically completes the labeling, bagging, and desiccant application of the wafer boxes, greatly reducing manpower input, improving production efficiency, and achieving high cleanliness.

Description

Technical Field

[0001] This invention belongs to the field of wafer box packaging equipment, specifically relating to an automatic wafer box packaging machine and packaging method. Background Technology

[0002] Before photolithography, wafers undergo processes such as chamfering, polishing, and cleaning. After these processes, the wafers are packaged into clean wafer cassettes and then vacuum-sealed in double-layered aluminum foil bags for storage and transportation. The vacuum packaging process of the aluminum foil bags for the wafer cassettes is crucial, effectively protecting the wafer cassettes from damage and isolating particulate contamination, thus ensuring the yield rate of subsequent photolithography processes. Currently, the vacuum packaging of wafer cassettes in aluminum foil bags is still done manually, involving tasks such as bagging, vacuuming, folding, sealing with tape, and affixing information labels. This packaging method is inefficient, requires a large amount of manpower, has high labor costs, and makes it difficult to guarantee cleanliness; therefore, it urgently needs improvement. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide an automatic wafer box packaging machine and packaging method.

[0004] The present invention adopts the following technical solution:

[0005] An automatic wafer box packaging machine includes a wafer box labeling and inspection station for labeling wafer boxes, an inner bag filling and heat sealing station for bagging and sealing the labeled wafer boxes, and a desiccant application station for affixing desiccant to the inner bag.

[0006] The inner bag filling and heat sealing station includes a sealing table, a bag filling position set on the sealing table, an inner bag storage rack set on the sealing table, a bag picking device for picking up inner bags from the inner bag storage rack and placing them at the bag filling position, a bag opening device for opening the inner bags at the bag filling position, a pushing device for pushing wafer cassettes into the opened inner bags, and a heat sealing device for heat sealing the opening of the inner bags.

[0007] A desiccant attachment station includes an attachment worktable, an adhesive application position on the attachment worktable, a loading and conveying device for transporting wafer cassettes to the adhesive application position, a first attachment device on the attachment worktable for attaching the opening of an inner bag to one side of the inner bag, and a second attachment device for attaching the desiccant to the inner bag. The first attachment device includes a first adhesive positioning component on the attachment worktable located on one side of the adhesive application position, a flattening frame on the attachment worktable opposite to the first adhesive positioning component, a flattening roller rotatably mounted on the flattening frame, and a folding mechanism mounted on the flattening frame. The inner bag includes an inner bag body for housing a wafer cassette and an edge segment located outside the heat-sealed area. When the loading and conveying device moves the wafer cassette housing the inner bag downwards to the adhesive application position, the flattening roller pushes the edge segment upwards, partially tucking it into the opposite side of the inner bag, while the remaining portion rests on the edge folding assembly. The edge folding assembly folds the remaining portion of the edge segment downwards to the top surface of the inner bag, and the first adhesive tape application assembly applies adhesive tape between the top surface of the inner bag and the end of the edge segment.

[0008] Preferably, the folding assembly includes a folding plate mounted on a flattening frame and movable in the direction close to the first adhesive applicator, and a folding cylinder mounted on the flattening frame and connected to and driving the folding plate to move. The folding plate is provided with a plurality of adhesive applicator clearance areas for the first adhesive applicator to apply adhesive tape. After the folded section is pushed flat and stored on the opposite side of the inner bag by the flattening roller, the remaining part rests on the folding plate. The folding cylinder controls the folding plate to move closer to the first adhesive applicator, so that the remaining part of the folded section is driven by the folding plate to fold downward to the top surface of the inner bag.

[0009] Preferably, the heat-sealing device includes a folding bag seat movable along the direction of approaching the bag filling position, two folding bag knives movably disposed on the sealing platform, a negative pressure tube disposed inside one of the folding bag knives, an upper heat-sealing assembly and a lower heat-sealing assembly disposed vertically opposite each other, a first moving mechanism disposed on the sealing platform to drive the folding bag seat to move, a second moving mechanism disposed on the folding bag seat to drive the two folding bag knives to move towards each other, an upper positioning plate disposed on the upper heat-sealing assembly extending downward and a lower positioning plate disposed on the lower heat-sealing assembly extending upward opposite to the upper positioning plate. The two folding bag knives are respectively opposite to the two sides of the inner bag, and the upper positioning plate and the lower positioning plate are respectively opposite to the top surface and bottom surface of the inner bag. The first moving mechanism drives the folding bag seat to move closer to the bag filling position so that the negative pressure tube extends into the inner bag, and the folding bag knives on the same side are located on the outside of the inner bag. The second moving mechanism drives the two folding bag knives to move towards each other so that the folding bag knives drive the inner bag side that is in contact with them to move inward to complete the folding of the inner bag opening.

[0010] Preferably, the bag-retrieving device includes a first bag-retrieving frame extending along the direction near the bag-filling position on the sealing platform, a second bag-retrieving frame extending along the direction near the inner bag storage rack on the first bag-retrieving frame, a support plate movably disposed on the first bag-retrieving frame for placing the inner bag, a correction mechanism located below the second bag-retrieving frame for correcting the position of the inner bag, a bag-retrieving assembly movably disposed on the second bag-retrieving frame for clamping the inner bag, a first drive assembly disposed on the first bag-retrieving frame for driving the support plate to move, and a second drive assembly disposed on the second bag-retrieving frame for driving the bag-retrieving assembly to move. The bag-retrieving assembly picks up the inner bag from the inner bag storage rack and places it on the support plate, and the first drive assembly drives the support plate containing the inner bag to move to the bag-filling position.

[0011] Preferably, the calibration mechanism includes a calibration frame that can be moved up and down below the second bag-retrieving frame, two first calibration components that are arranged opposite each other on both sides of the calibration frame, two second calibration components that are arranged opposite each other on both sides of the calibration frame, and a calibration lifting cylinder that is connected to and drives the calibration frame to move up and down. The two first calibration components and the two second calibration components are alternately arranged on the four sides of the calibration frame. The first calibration component includes a calibration plate that can move along the opposite side and a first calibration cylinder that is arranged on the calibration frame to drive the calibration plate to move. The second calibration component includes a calibration column that can move along the opposite side and a second calibration cylinder that is arranged on the calibration frame to drive the calibration column to move. The support plate is provided with a strip-shaped moving hole for the opposite calibration column to pass through.

[0012] Preferably, the bag-retrieving assembly includes a movable seat movably disposed on a second bag-retrieving frame, a bag-retrieving plate disposed at the lower end of the movable seat that can extend into an inner bag storage rack, and a plurality of bag-retrieving suction nozzles spaced apart at the lower end of the bag-retrieving plate.

[0013] Preferably, the second attaching device includes an attaching robot arm disposed on the attaching worktable, a rotating frame disposed at the front end of the attaching robot arm, a tape supply mechanism for supplying tape, a desiccant storage rack disposed on the attaching worktable for storing desiccant, and a second detection component, a desiccant adsorption and transfer component and a tape adsorption and transfer component disposed at intervals around the outer periphery of the rotating frame.

[0014] Preferably, the wafer cassette labeling and inspection station includes a labeling table, a labeling conveyor device disposed on the labeling table for conveying wafer cassettes, a labeling device disposed on the labeling table, and a label printer disposed on the labeling table. The labeling device includes a labeling robot disposed on the labeling table, a mounting plate disposed at the front end of the labeling robot, and a first detection component, a label tearing component, and a labeling component disposed at intervals on the mounting plate.

[0015] Preferably, the device also includes an outer bag filling and heat sealing station and an outer bag labeling and inspection station. The outer bag filling and heat sealing station covers the wafer cassette with an outer bag after the desiccant has adhered to it and performs heat sealing. The outer bag labeling and inspection station labels the outer bag.

[0016] An automated wafer cassette packaging method, based on any one of the packaging machines described above, specifically includes the following steps:

[0017] Step 1: The wafer cassette with the incoming material label on the top surface enters the wafer cassette labeling and inspection station. The wafer cassette labeling station peels off the incoming material label and then affixes an information label.

[0018] Step 2: The wafer cassette with the information label is fed into the feeding device. The bag taking device takes out the inner bag from the inner bag storage rack and moves it to the bagging position. The bag supporting device opens the inner bag at the bagging position. The feeding device then pushes the wafer cassette into the opened inner bag. The heat sealing device first folds the opening of the inner bag and then performs vacuuming. After vacuuming, the heat sealing process is performed immediately.

[0019] Step 3: The wafer cassette with the inner bag installed is transported to the adhesive application position by the loading and conveying device. When the loading and conveying device moves the wafer cassette with the inner bag down to the adhesive application position, the flattening roller pushes the folded edge section upward and flattens it so that part of it is stored on the opposite side of the inner bag, and the rest is placed on the folding edge assembly. The folding edge assembly works to fold the remaining part of the folded edge section downward to the top surface of the inner bag. The first adhesive tape application assembly then applies adhesive tape between the top surface of the inner bag and the end of the folded edge section to fix the folded edge section. The wafer cassette with the inner bag folded edge section fixed is moved to the second application device, and the desiccant is fixed to the top surface of the inner bag by the second application device, completing the application of the desiccant.

[0020] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: The present invention, by limiting the structural composition of the packaging machine, and by setting up a wafer box labeling and inspection station, an inner bag filling and heat sealing station, and a desiccant application station, can stably and automatically complete the labeling, bagging, and desiccant application of wafer boxes, greatly reducing the input of manpower, improving production efficiency, and achieving high cleanliness; the overall equipment has a high degree of automation, operates fully automatically, and avoids the risk of wafer contamination inside the wafer box caused by manual operation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the packaging machine.

[0022] Figure 2 This is a structural diagram of the material loading station;

[0023] Figure 3 A schematic diagram of the wafer box labeling and inspection station;

[0024] Figure 4A partial structural diagram of a wafer box labeling and inspection station;

[0025] Figure 5 This is a partial structural diagram of the labeling device;

[0026] Figure 6 This is a schematic diagram of the first handling mechanism;

[0027] Figure 7 This is a schematic diagram of the labeling conveyor device;

[0028] Figure 8 This is a structural diagram of the inner bag filling and heat sealing station;

[0029] Figure 9 A partial structural diagram of the inner bag heat sealing station. Figure 1 ;

[0030] Figure 10 A partial structural diagram of the inner bag heat sealing station. Figure 2 ;

[0031] Figure 11 A partial structural diagram of the inner bag heat sealing station. Figure 3 ;

[0032] Figure 12 This is a schematic diagram of the bag-removing device;

[0033] Figure 13 This is a schematic diagram of the adsorption bag support assembly;

[0034] Figure 14 This is a schematic diagram of the structure of the first clamping support bag assembly;

[0035] Figure 15 This is a partial structural diagram of a heat sealing device;

[0036] Figure 16 Schematic diagram of part of the desiccant attachment station Figure 1 ;

[0037] Figure 17 Schematic diagram of part of the desiccant attachment station Figure 2 ;

[0038] Figure 18 This is a partial structural schematic diagram of the second attachment device;

[0039] Figure 19 This is a structural diagram of the folded edge assembly;

[0040] Figure 20 A schematic diagram of the structure of the first tape attachment assembly;

[0041] Figure 21A partial structural diagram of the first tape attachment assembly;

[0042] Figure 22 This is a schematic diagram of the desiccant storage silo.

[0043] Figure 23 A partial structural diagram of the outer bag labeling and inspection station;

[0044] Figure 24 This is a schematic diagram of the inner bag structure;

[0045] In the diagram, 1. Loading station; 2. Wafer box labeling and inspection station; 3. Inner bag heat sealing station; 4. Desiccant application station; 5. Outer bag heat sealing station; 6. Outer bag labeling and inspection station; 7. Unloading station; 8. Inner bag; 11. Loading platform; 111. Transport channel; 12. Loading position; 121. Loading limit block; 13. Attitude detection mechanism; 131. Micro switch; 132. Alarm light; 133. Diffuse reflection photoelectric switch; 14. Transfer mechanism; 141. Transfer platform; 142. Lifting assembly; 143. Moving module; 144. Lifting frame; 145. Loading lifting cylinder; 21. Labeling platform; 211. Labeling position; 212. First moving channel; 213. Buffer position; 214. Transfer position; 215. Second 216. Moving channel; 217. Third moving channel; 218. Waste label rack; 22. Limiting component; 221. Limiting seat; 222. Limiting plate; 223. Limiting cylinder; 23. Labeling conveyor; 231. Conveyor seat; 232. Lifting component; 233. Conveying mechanism; 234. Lifting cylinder; 235. Sliding seat; 24. Labeling device; 241. Labeling robot; 242. Mounting plate; 243. First detection component; 244. Label tearing component; 2441. Label tearing rack; 2442. Label tearing nozzle; 2443. Label tearing positioning plate; 2444. First label tearing cylinder; 2445. Second label tearing cylinder; 245. Labeling component; 2451. Labeling suction head; 2452. Labeling cylinder; 25. Label printer; 2 6. Defective Product Temporary Storage Area; 261. NG Material Placement Position; 262. Temporary Storage Position; 27. Defective Product Handling Device; 271. First Handling Mechanism; 272. Second Handling Mechanism; 273. First Handling Seat; 274. First Driving Component; 275. First Handling Module; 28. Unloading and Handling Device; 281. Unloading Rack; 282. Unloading Pneumatic Gripper; 283. Multi-Axis Moving Module; 29. ​​Label Holder; 291. Label Frame; 292. Label Plate; 293. Label Cylinder; 31. Sealing Platform; 32. Inner Bag Storage Rack; 33. Bag Removal Device; 34. Bag Support Device; 35. Material Pushing Device; 36. Heat Sealing Device; 311. Bagging Position; 321. Storage Rack Body; 322. Bag Pressing Rack; 323. Bag Pressing Roller; 324. Z-axis 331. Moving module; 332. First bag-retrieving frame; 333. Second bag-retrieving frame; 333. Support plate; 3331. Negative pressure suction nozzle; 3332. Strip-shaped moving hole; 334. Correction mechanism; 3341. Correction frame; 3342. First correction component; 3343. Second correction component; 3344. Correction lifting cylinder; 3345. Correction plate; 3346. First correction cylinder; 3347. Correction column; 3348. Second correction cylinder; 335. Bag-retrieving assembly; 3351. Moving seat; 3352. Bag-retrieving plate; 3353. Bag-retrieving suction nozzle; 336. First drive assembly; 337. Second drive assembly; 341. Adsorption bag-supporting assembly; 3411. Adsorption bag-supporting frame; 3412. Lifting plate; 3413. Fixed suction nozzle;3414. Adjusting plate; 3415. Moving suction nozzle; 3416. First lifting cylinder; 3417. Second lifting cylinder; 342. First clamping and supporting bag assembly; 3421. Clamping and supporting bag seat; 3422. Upper clamping component; 3423. Lower clamping component; 3424. First lifting component; 3425. Second lifting component; 3426. Upper clamping frame; 3427. Upper clamping pneumatic gripper; 343. Second clamping and supporting bag assembly; 351. Moving frame; 352. Pushing plate; 353. First pushing cylinder; 354. Second pushing cylinder; 355. Pushing limit cylinder; 356. Pushing linear movement module; 361. Folding bag seat; 362. Folding bag knife; 363. Negative pressure pipe; 3631. Main body section; 3632. Flat section; 3 64. Upper heat-sealing assembly; 3641. Upper heat-sealing seat; 3642. Upper heat-sealing head; 3643. Upper heat-sealing cylinder; 365. Lower heat-sealing assembly; 3651. Lower heat-sealing seat; 3652. Lower heat-sealing head; 3653. First heat-sealing cylinder; 3654. Mounting plate; 3655. Second heat-sealing cylinder; 366. First moving mechanism; 367. Second moving mechanism; 368. Upper positioning plate; 369. Lower positioning plate; 41. Attachment worktable; 42. Glue application position; 43. Feeding and handling device; 44. First attachment device; 45. Second attachment device; 46. Attachment conveying device; 441. First glue application positioning assembly; 4411. First positioning frame; 4412. First positioning plate; 4413. First positioning cylinder; 442. 443. Flattening frame; 444. Flattening roller; 445. Folding assembly; 4441. Folding plate; 4442. Folding cylinder; 4443. Adhesive application clearance area; 445. First tape application assembly; 4451. First tape holder; 4452. First adhesive pressing assembly; 44521. Lower adhesive block; 44522. Upper adhesive block; 44523. First adhesive pressing cylinder; 44524. First guide roller; 4453. First adhesive pulling pneumatic gripper; 4454. First cutting assembly; 44541. First cutting blade; 44542. First cutting cylinder; 4455. First adhesive pulling cylinder; 4456. First adsorption assembly; 44561. First fixing frame; 44562. Adsorption seat; 44563. Tape adsorption head; 44564. 44565, Second Adsorption Cylinder; 4457, Transfer Seat; 4458, First Transfer Module; 4459, Second Transfer Module; 451, Applying Robot; 452, Applying Frame; 453, Second Adhesive Positioning Assembly; 4531, Second Fixed Frame; 4532, Second Positioning Frame; 4533, Second Positioning Plate; 4534, Second Positioning Cylinder; 454, Desiccant Storage Bin; 4541, Storage Rack; 4542, Storage Chamber; 4543, Receiving Plate; 4544, Vertical Moving Module; 455, Tape Supply Mechanism; 456, Detection Camera; 457, Tape Adsorption Assembly; 4571, Fixed Adsorption Head; 4572, Floating Adsorption Head; 458, Desiccant Adsorption Assembly; 461, Receiving Platform;462. Lifting drive assembly; 463. Conveying module; 61. Outer bag labeling table; 62. Gripper handling module; 63. Storage and adhesion device; 64. Laminating device; 641. Laminating robot; 642. Laminating frame; 643. Second detection assembly; 644. First laminating adsorption assembly; 645. Second laminating adsorption assembly; 65. Labeling printer; 66. Transfer and handling module; 81. Top edge; 82. Bottom edge; 83. Inner bag body; 84. Folded edge section. Detailed Implementation

[0046] The present invention will be further described below through specific embodiments.

[0047] Reference Figure 1 As shown, an automatic wafer box packaging machine includes a feeding station 1, a wafer box labeling and inspection station 2 for labeling wafer boxes, an inner bag filling and heat sealing station 3 for bagging and sealing the labeled wafer boxes, a desiccant application station 4 for applying desiccant to the inner bag 8, an outer bag filling and heat sealing station 5 for bagging and sealing the wafer boxes after applying desiccant, an outer bag labeling and inspection station 6 for labeling the outer bag, and a discharging station 7. The feeding station 1 sends the wafer boxes to the wafer box labeling and inspection station 2 for labeling, and the discharging station 7 moves the packaged wafer boxes outward.

[0048] Reference Figure 2 As shown, the loading station 1 includes a loading platform 11, multiple loading positions 12 spaced apart on the loading platform 11, multiple attitude detection mechanisms 13 respectively installed on the multiple loading positions 12 for detecting the attitude of the wafer cassette, and a transfer mechanism 14 for moving the wafer cassette from the loading position 12 outward. The loading position 12 is provided with four loading limit blocks 121 arranged in a matrix, which are supported on the loading platform 11 and located between the four loading limit blocks 121.

[0049] The transfer mechanism 14 includes a transfer platform 141 that moves along the arrangement direction of multiple loading positions 12, a lifting component 142 that can drive the transfer platform 141 to move up and down, and a moving module 143 disposed in the loading platform 11 that drives the lifting component 142 to move the transfer platform 141. The loading platform 11 is provided with a transport channel 111 for the transfer platform 141 to move. The lifting component 142 can drive the transfer platform 141 to move upwards, causing it to move upwards relative to the wafer cassette and detach from the loading position 12. Specifically, the lifting component 142 includes components connected to the moving module 143. The lifting frame 144 connected to the assembly 143 and the loading lifting cylinder 145 connected to the transfer platform 141 on the lifting frame 144 drive the transfer platform 141 to move upward, lifting the wafer cassette on the relative loading position 12. Then, in conjunction with the moving module 143, the wafer cassette is moved outward and transported to the wafer cassette labeling and inspection station 2. Furthermore, the moving module 143 adopts a linear moving module, which is a mature technology in the mechanical field. Its specific structure and working principle will not be further described here.

[0050] The attitude detection mechanism 13 includes four microswitches 131 arranged in a matrix at the loading position 12, a controller connected to the four microswitches 131 and mounted on the loading platform 11, an alarm light 132 connected to the controller, and a diffuse reflection photoelectric switch 133 mounted on the loading platform 11 on one side opposite the loading position 12. The four microswitches 131 are arranged in pairs opposite each other on both sides of the transport channel 111, and the four loading limit blocks 121 are also arranged in pairs opposite each other on both sides of the transport channel 111. The four microswitches 131 are positioned between the four loading limit blocks 121. Specifically, the alarm light 132 is a three-color alarm light. The four microswitches 131 work together to detect the loading attitude information of the wafer cassettes at the loading position 12. Combined with the diffuse reflection photoelectric switch 133, it determines whether there are wafer cassettes at the loading position 12. When a wafer cassette is improperly placed at the loading position 12, the controller activates the alarm light 132 to trigger an audible and visual alarm, prompting staff intervention.

[0051] Reference Figures 3 to 7As shown, the wafer cassette labeling and inspection station 2 includes a labeling table 21, a labeling position 211 disposed on the labeling table 21, a limiting component 22 located at the labeling position 211 to limit the wafer cassette, a labeling conveying device 23 disposed on the labeling table 21 to convey the wafer cassette, a labeling device 24 disposed on the labeling table 21, a label printer 25 disposed on the labeling table 21, a defective product temporary storage area 26 disposed on the labeling table 21, and a defective product handling system for transferring defective products to the defective product temporary storage area 26. The device 27 comprises a material handling device 28 that moves the labeled wafer cassettes outwards, and a label holder 29 located on the labeling table 21 in front of the label printer 25. The wafer cassettes have incoming material labels affixed to their upper surfaces. The labeling device 24 peels off the incoming material labels from the wafer cassettes and affixes new information labels. One end of the incoming material label is attached to the wafer packaging box, while the other end is a free end not attached to the wafer packaging box. The bottom surface of the free end of the incoming material label is not coated with adhesive to facilitate peeling by the labeling device 24. The information labels are fully affixed to the center of the top surface of the wafer packaging box, ensuring that the correctly affixed information labels are not easily detached during subsequent transport. Specifically, the label printer 25 has two or more units for printing information labels of different sizes. The label printer 25 is existing technology, and its working principle will not be further elaborated here.

[0052] The limiting assembly 22 includes two limiting seats 221 disposed opposite to each other on both sides of the labeling position 211, two limiting plates 222 disposed on the two limiting seats 221 and movable toward or away from each other, and two limiting cylinders 223 disposed on the two limiting seats 221 and driven to move relative to the limiting plates 222. The wafer cassette located at the labeling position 211 is fixed between the two limiting plates 222. The wafer cassette is fixed at the labeling position 211 by the cooperation of the limiting plates 222 and the limiting cylinders 223, so that the labeling device 24 can perform labeling and labeling work on the wafer cassette.

[0053] The labeling conveying device 23 includes a conveyor seat 231 that can move up and down to receive wafer cassettes, a lifting assembly 232 that connects to and drives the conveyor seat 231 to move up and down, and a conveying mechanism 233 disposed in the labeling table 21 to move the conveyor seat 231 and the lifting assembly 232. The labeling table 21 has a first moving channel 212 for the conveyor seat 231 to move, with a buffer position 213 at the front end and a transfer position 214 at the rear end. During operation, the wafer cassettes are transported to the buffer position 213 by the transfer mechanism 14 in the loading station 1, and then the conveyor seat 231, in conjunction with the lifting assembly 232 and the conveying mechanism 233, transports the wafer cassettes to the labeling position 211 for labeling and peeling / applying. Specifically, the lifting assembly 232 includes a conveyor seat 231 and a lifting assembly 232 that connects to and drives the conveyor seat 231 to move up and down. The lifting cylinder 234 connected to 231 and the sliding seat 235 connected to the conveying mechanism 233 for mounting the lifting cylinder 234 are connected to 231. The conveying mechanism 233 adopts a linear motion module, which is a mature existing technology. Its specific structure and working principle will not be described in detail here. When the conveying seat 231 moves the wafer box, the conveying mechanism 233 first drives the conveying seat 231 to move to the buffer position 213 or the labeling position 211. The lifting component 232 controls the conveying seat 231 to move upward to lift the wafer box. Then, the conveying mechanism 233 controls the conveying seat 231 to move to the labeling position 211 or the transfer position 214. At this time, the lifting component 232 controls the conveying seat 231 to move downward to reset, and the wafer box can be supported at the labeling position 211 or the transfer position 214.

[0054] The labeling device 24 includes a labeling robot 241 mounted on a labeling table 21, a mounting plate 242 at the front end of the labeling robot 241, and a first detection component 243, a label tearing component 244, and a labeling component 245 spaced apart on the mounting plate 242. During operation, the label tearing component 244 tears off the incoming material label, and the labeling component 245 transfers the information label printed by the label printer 25 and affixes it to the top surface of the wafer cassette. The first detection component 243 is used to detect the information of the incoming material label, the status of the information label printed by the label printer 25, and the affixing status of the information label. Specifically, the first detection component 243 can be a CCD camera. The labeling component 245 includes a labeling suction head 2451 and a labeling cylinder 2452 mounted on the mounting plate 242 and connected to the labeling suction head 2451. The labeling suction head 2451 adsorbs and transfers the information label printed by the label printer 25 to the top surface of the wafer cassette for affixing.

[0055] The label-tearing assembly 244 includes a label-tearing frame 2441 connected to the mounting plate 242, a label-tearing suction nozzle 2442 disposed on the label-tearing frame 2441, a label-tearing positioning plate 2443 movable up and down relative to the label-tearing suction nozzle 2442, a first label-tearing cylinder 2444 disposed on the label-tearing frame 2441 to drive the label-tearing positioning plate 2443 to move up and down, and a second label-tearing cylinder 2445 disposed on the label-tearing frame 2441 to drive the first label-tearing cylinder 2444 to move left and right relative to the label-tearing suction nozzle 2442. When the incoming label is torn off, the label-tearing suction nozzle 2444... 2. Adsorbed onto the top surface of the incoming label, the first label-tearing cylinder 2444 and the second label-tearing cylinder 2445 respectively control the label-tearing positioning plate 2443 to move to the bottom surface of the incoming label and cooperate with the label-tearing suction nozzle 2442 to clamp the incoming label. At this time, the labeling robot 241 works, controlling the label-tearing component 244 to move along the X-axis, Y-axis and Z-axis according to the preset trajectory, so as to tear the incoming label from the top surface of the wafer box. Specifically, a waste label rack 217 can be set on the labeling table 21 to place the torn incoming label and the problematic information label.

[0056] The defective product temporary storage area 26 includes an NG material placement position 261 set on the labeling table 21 opposite to the transfer position 214 and multiple temporary storage positions 262 spaced apart along the extension direction of the first moving channel 212. After the information label is affixed, the first detection component 243 detects the information label. When the information label has defects such as severe wrinkles, missing corners, broken corners, blurred information, missing information, or excessive label position offset, the labeling conveying device 23 moves the incorrectly labeled wafer cassette to the transfer position 214. The defective product handling device 27 then moves the defective products from the transfer position 214 to the temporary storage position 262 for subsequent processing by the staff.

[0057] The defective product handling device 27 includes a first handling mechanism 271 that moves defective products from the transfer station 214 to the NG material placement station 261 and a second handling mechanism 272 that moves defective products from the NG material placement station 261 to the temporary storage station 262. The labeling station 21 is provided with a second moving channel 215 arranged perpendicular to the first moving channel 212 and a third moving channel 216 that connects the second moving channel 215 and is arranged parallel to the first moving channel 212. The transfer station 214 is located at the junction of the first moving channel 212 and the second moving channel 215, and the NG material placement station 261 is located at the junction of the second moving channel 215 and the third moving channel 216. Specifically, the structure of the second handling mechanism 272 is the same as that of the labeling conveying device 23, and its specific structure will not be described in detail here.

[0058] The first conveying mechanism 271 includes a first conveying seat 273 that can be moved up and down in the second moving channel 215, a first driving member 274 that connects to and drives the first conveying seat 273 to move up and down, and a first conveying module 275 that connects to the first driving member 274 to drive the first conveying seat 273 to move in the second moving channel 215. During operation, the first driving member 274 can drive the first conveying seat 273 to move upward to lift the defective product in the intermediate transfer position 214. The first conveying module 275 controls the first driving member 274 to move the defective product to the NG material placement position 261. The first driving member 274 then controls the first conveying seat 273 to move downward so that the defective product is supported in the NG material placement position 261 and is then conveyed by the second conveying mechanism 272 to the designated temporary storage position 262. Specifically, the first driving member 274 can be a cylinder, which controls the up and down movement of the first conveying seat 273. Furthermore, the first conveying module 275 is a linear motion module. The linear motion module is a mature existing technology, and its specific structure and working principle will not be described in detail here.

[0059] The unloading and conveying device 28 moves the labeled wafer cassettes outward from the transfer station 214. It includes an unloading rack 281, two unloading pneumatic grippers 282 arranged opposite to each other on the unloading rack 281 for holding the wafer cassettes, and a multi-axis moving module 283 connected to the unloading rack 281. The multi-axis moving module 283 includes an X-axis moving module, a Y-axis moving module, and a Z-axis moving module to cooperate with the unloading pneumatic grippers 282 to move the labeled wafer cassettes outward.

[0060] The label holder 29 includes a label holder 291 disposed in front of the label printer 25, a label plate 292 that can move back and forth relative to the label printer 25 to receive information labels, and a label cylinder 293 disposed on the label holder 291 to drive the label plate 292 to move. The label plate 292 is coated with an anti-stick coating to prevent the information labels printed by the label printer 25 from not adhering to the label plate 292 and affecting the adsorption and transfer of the labeling component 245.

[0061] Reference Figures 8 to 15 As shown, the inner bagging and heat-sealing station 3 performs bagging and heat-sealing processing on labeled wafer cassettes. It includes a packaging table 31, a bagging position 311 on the packaging table 31, an inner bag storage rack 32 on the packaging table 31, a bag-picking device 33 for picking up inner bags from the inner bag storage rack 32 and placing them at the bagging position 311, a bag-opening device 34 for opening the inner bag 8 at the bagging position 311, a pushing device 35 for pushing the wafer cassette into the opened inner bag 8, and a heat-sealing device 36 for heat-sealing the opening of the inner bag 8. For details, refer to... Figure 24 As shown, the inner bag 8 includes two upper edges 81 opposite to each other on its top surface and two lower edges 82 opposite to each other on its bottom surface.

[0062] The inner bag storage rack 32 includes a storage rack body 321 for placing inner bags 8, two bag pressing frames 322 disposed opposite to each other on both sides of the storage rack body 321, a bag pressing roller 323 disposed vertically between the two bag pressing frames 322, and a Z-axis moving module 324 for driving the storage rack body 321 to move vertically. Multiple unsupported inner bags 8 are stacked sequentially in the storage rack body 321, and the bag pressing roller 323 presses on the inner bags 8. The bag pressing roller 323 prevents one side of the inner bag 8 in the storage rack body 321 from warping or bending. Different weights of bag pressing rollers 323 can be selected according to the softness or hardness of the inner bag 8 to ensure that the bag taking device 33 can only take out one inner bag 8 at a time.

[0063] The bag-retrieving device 33 includes a first bag-retrieving frame 331 extending along the direction near the bag-filling position 311 on the sealing platform 31, a second bag-retrieving frame 332 extending along the direction near the inner bag storage rack 32 on the first bag-retrieving frame 331, a support plate 333 movably disposed on the first bag-retrieving frame 331 for placing the inner bag 8, a correction mechanism 334 located below the second bag-retrieving frame 332 for correcting the position of the inner bag 8, a bag-retrieving assembly 335 movably disposed on the second bag-retrieving frame 332 for clamping the inner bag 8, a first drive assembly 336 disposed on the first bag-retrieving frame 331 for driving the support plate 333 to move, and a second drive assembly 337 disposed on the second bag-retrieving frame 332 for driving the bag-retrieving assembly 335 to move. When retrieving a bag, the bag-retrieving assembly 336... 35. The inner bag 8 is picked up from the inner bag storage rack 32 and placed onto the support plate 333. The first drive assembly 336 drives the support plate 333, on which the inner bag 8 is placed, to move to the bagging position 311. Specifically, the support plate 333 is provided with multiple negative pressure suction nozzles 3331. After the correction mechanism 334 completes the correction of the position of the inner bag 8, the multiple negative pressure suction nozzles 3331 work to adsorb and fix the inner bag 8 on the support plate 333, preventing the inner bag 8 from shifting during the movement of the support plate 333 to the bagging position 311, which would affect the subsequent bag-holding process. Furthermore, both the first drive assembly 336 and the second drive assembly 337 adopt linear motion modules. Linear motion modules are existing technology, and their specific structure and working principle will not be further described here.

[0064] The calibration mechanism 334 includes a calibration frame 3341 that can be moved up and down below the second bag-retrieving frame 332, two first calibration components 3342 that are arranged opposite to each other on both sides of the calibration frame 3341, two second calibration components 3343 that are arranged opposite to each other on both sides of the calibration frame 3341, and a calibration lifting cylinder 3344 that is connected to and drives the calibration frame 3341 to move up and down. The two first calibration components 3342 and the two second calibration components 3343 are alternately arranged on the four sides of the calibration frame 3341. Specifically, the first calibration component 3342 includes a calibration plate 3345 that can move along the opposite side and a first calibration cylinder 3346 that is arranged on the calibration frame 3341 to drive the calibration plate 3345 to move. The second calibration component 3343 includes a calibration column 3347 that can move along the opposite side and a second calibration cylinder 3348 that is arranged on the calibration frame 3341 to drive the calibration column 3347 to move. The support plate 333 is provided with a strip-shaped moving hole 3332 for the opposite calibration column 3347 to pass through.

[0065] The bag-retrieving assembly 335 includes a movable seat 3351 movably mounted on the second bag-retrieving frame 332, a bag-retrieving plate 3352 that can extend into the inner bag storage rack 32 and is located at the lower end of the movable seat 3351, and a plurality of bag-retrieving suction nozzles 3353 spaced apart at the lower end of the bag-retrieving plate 3352. When retrieving a bag, the second drive assembly 337 controls the movable seat 3351 to move closer to the inner bag storage rack 32, so that the plurality of bag-retrieving suction nozzles 3353 are opposite to the front end of the inner bag in the inner bag storage rack 32. At this time, the plurality of bag-retrieving suction nozzles 3353 are controlled to work, which can adsorb the front end of the inner bag 8. Then, in conjunction with the second drive assembly 337 moving in the opposite direction, the inner bag 8 is taken out from the inner bag storage rack 32 and placed on the support plate 333.

[0066] The bag-supporting device 34 includes an adsorption bag-supporting assembly 341 disposed above the bag-filling position 311 and two clamping bag-supporting assemblies disposed opposite each other on the sealing platform 31 on both sides of the inner bag 8. The two clamping bag-supporting assemblies are respectively disposed on both sides of the inner bag 8, opposite to the two upper edges 81. When supporting the bag, the adsorption bag-supporting assembly 341 adsorbs the top surface of the inner bag 8, and the clamping bag-supporting assemblies clamp the upper edge 81 and lower edge 82 disposed on the same side to open the inner bag 8. Specifically, the clamping bag-supporting assemblies include a first clamping bag-supporting assembly 342 and a second clamping bag-supporting assembly 343 disposed at intervals.

[0067] The adsorption bag support assembly 341 includes an adsorption bag support frame 3411, a lifting plate 3412 that can be moved up and down on the adsorption bag support frame 3411, a fixed suction nozzle 3413 that is mounted on the lifting plate 3412, an adjusting plate 3414 that is mounted on the lifting plate 3412 and can move relative to the fixed suction nozzle 3413, a movable suction nozzle 3415 that is mounted on the adjusting plate 3414 and opposite to the fixed suction nozzle 3413, a first lifting cylinder 3416 that is connected to and drives the lifting plate 3412 to move, and a second lifting cylinder 3417 that is mounted on the adsorption bag support frame 3411 and drives the first lifting cylinder 3416 to move up and down. The movable suction nozzle 3415 and the fixed suction nozzle 3413 can be adsorbed and fixed on the top surface of the inner bag 8. By setting the movable suction nozzle 3415, the adsorption bag support assembly 341 can adapt to inner bags 8 of different sizes.

[0068] The first clamping and supporting bag assembly 342 includes a clamping and supporting bag seat 3421, an upper clamping member 3422 movably mounted on the clamping and supporting bag seat 3421 for clamping the upper edge 81, a lower clamping member 3423 movably mounted on the clamping and supporting bag seat 3421 for clamping the lower edge 82, a first lifting member 3424 mounted on the clamping and supporting bag seat 3421 for driving the upper clamping member 3422 to move, and a second lifting member 3425 mounted on the clamping and supporting bag seat 3421 for driving the lower clamping member 3423 to move; wherein, the upper clamping member 3422 includes an upper clamping frame 3426 connected to the first lifting member 3424 and two upper clamping pneumatic grippers 3427 oppositely mounted on the upper clamping frame 3426. The pneumatic grippers 3427 can grip the upper edge 81 respectively, and move upward with the adsorption bag support assembly 341 to open the inner bag 8. Specifically, the structure of the lower gripper 3423 is the same as that of the upper gripper 3422, and will not be described in detail here. When the lower gripper 3423 grips the lower edge 82 on the same side, it works with the negative pressure suction nozzle 3331 on the support plate 333 to prevent the inner bag 8 from moving upward with the upper gripper 3422, ensuring that the inner bag 8 can be stably opened to the required extent. Furthermore, both the first lifting member 3424 and the second lifting member 3425 adopt a linear movement module that can move vertically. The linear movement module is existing technology, and its specific structure and working principle will not be described in detail here.

[0069] The second clamping and supporting bag assembly 343 has a structure that is basically the same as that of the first clamping and supporting bag assembly 342. The difference is that it does not include the clamping and supporting bag seat 3421, and the first lifting member 3424 and the second lifting member 3425 are vertically opposite each other. It also has a linear movement module that can drive the first lifting member 3424 or the second lifting member 3425 to move along the pushing direction, so that the clamping position of the second clamping and supporting bag assembly 343 can be adjusted according to the inner bag 8 of different sizes.

[0070] The pushing device 35 includes a movable frame 351 mounted on the packaging stage 31 and movable in the direction of approaching the bagging position 311; a pushing plate 352 mounted on the movable frame 351 for placing wafer cassettes; a first pushing cylinder 353 mounted on the movable frame 351 to move the pushing plate 352 closer to the bagging position 311; a second pushing cylinder 354 mounted on the pushing plate 352 to push the wafer cassettes into the inner bag 8; two pushing limit cylinders 355 mounted opposite to the pushing plate 352 to correct the position of the wafer cassettes; and a device mounted on the packaging stage 31. The pusher linear motion module 356, which moves the upper drive moving frame 351 close to the bagging position 311, corrects the position of the wafer box by setting two pusher limiting cylinders 355 to ensure that the wafer box can smoothly enter the inner bag 8. When the inner bag 8 is opened, the first pusher cylinder 353, in conjunction with the pusher linear motion module 356, moves the wafer box to the bag opening of the inner bag 8. The second pusher cylinder 354 then pushes the wafer box into the inner bag 8 so that it is supported on the support plate 333. At this time, the negative pressure suction nozzle 3331 on the support plate 333 stops working.

[0071] The heat sealing device 36 includes two folding bag holders 361 movably mounted on a sealing platform 31, two folding bag cutters 362 respectively mounted on the two folding bag holders 361, a negative pressure tube 363 disposed inside one of the folding bag cutters 362, an upper heat sealing assembly 364 and a lower heat sealing assembly 365 disposed vertically opposite each other, a first moving mechanism 366 mounted on the sealing platform 31 to drive the folding bag holders 361 to move, a second moving mechanism 367 to drive the two folding bag holders 361 to move towards each other, an upper positioning plate 368 extending downward on the upper heat sealing assembly 364, and a lower positioning plate 369 extending upward on the lower heat sealing assembly 365 opposite to the upper positioning plate 368. The two folding bag cutters 362 are respectively opposite to the two sides of the inner bag 8. The first moving mechanism 366 drives the folding bag holders 361 to move closer to the bag filling position 311, causing the negative pressure tube 363 to extend... Inside the inner bag 8, the same-side folding knife 362 is located on the outside of the inner bag 8; the second moving mechanism 367 drives the two folding seats 361 to move towards each other, causing the folding knife 362 to move the side of the inner bag 8 in contact with it inward to complete the folding of the bag opening of the inner bag 8; the upper positioning plate 368 and the lower positioning plate 369 are located opposite each other on one side of the wafer cassette and the negative pressure tube 363, which can limit the wafer cassette when the negative pressure tube 363 is evacuated, preventing the wafer cassette from shifting when the inner bag 8 is evacuated; specifically, the negative pressure tube 363 includes a main body section 3631 connected to an external negative pressure source and a flat section 3632 that can extend into the inner bag 8; furthermore, both the first moving mechanism 366 and the second moving mechanism 367 adopt linear moving modules, which are existing technologies, and their specific structure and working principle will not be further described here.

[0072] The upper heat sealing assembly 364 includes an upper heat sealing seat 3641 disposed on the sealing stage 31, an upper heat sealing head 3642 disposed on the upper heat sealing seat 3641 that can be moved up and down, and an upper heat sealing cylinder 3643 connected to and driving the upper heat sealing head 3642 to move.

[0073] The lower heat-sealing assembly 365 includes a lower heat-sealing seat 3651 mounted on a sealing platform 31, a lower heat-sealing head 3652 movably mounted on the lower heat-sealing seat 3651, a first heat-sealing cylinder 3653 connected to and driving the lower heat-sealing head 3652, a mounting plate 3654 for mounting the first heat-sealing cylinder 3653, and a second heat-sealing cylinder 3655 mounted on the lower heat-sealing seat 3651 and connected to the mounting plate 3654. A lower positioning plate 369 extends upwards from the mounting plate 3654. After the inner bag 8 is folded, the upper heat-sealing cylinder 3653 drives the upper heat-sealing head 3652 downwards to contact the top surface of the folded inner bag 8, and the second heat-sealing cylinder 3655 drives the upper heat-sealing head 3652 to move downwards. The mounting plate 3654 moves upward, causing the lower heat sealing head 3652 to contact the bottom surface of the inner bag 8. The negative pressure tube 363 can then begin to vacuum the inner bag 8. The moment the negative pressure tube 363 completes the vacuuming, the vacuum is closed and the nitrogen control valve is opened to fill a small amount of nitrogen. After completion, the first moving mechanism 366 drives the folding bag seat 361 to move, causing the negative pressure tube 363 to be pulled out of the inner bag 8. At this time, the first heat sealing cylinder 3653 drives the lower heat sealing head 3652 to move upward and cooperate with the upper heat sealing head 3642 to clamp the bag opening of the inner bag 8 for heat sealing. After the heat sealing heating is completed, a pressure holding process is performed. After the pressure holding is completed, the upper heat sealing assembly 364 and the lower heat sealing assembly 365 move in opposite directions to the standby state.

[0074] Reference Figures 16 to 22 As shown, the desiccant application station 4 applies desiccant to wafer cassettes fitted with inner bags 8. It includes an application worktable 41, an adhesive application station 42 on the application worktable 41, a loading and conveying device 43 for transporting the wafer cassette to the adhesive application station 42, a first application device 44 on the application worktable 41 for attaching the opening of the inner bag 8 to one side of the inner bag 8, a second application device 45 for applying the desiccant to the inner bag 8, and an application conveying device 46 for moving the wafer cassette from the adhesive application station 42 to the second application device 45; wherein, referring to… Figure 24 As shown, the inner bag 8 includes an inner bag body 83 for housing the wafer cassette and a folded edge section 84 located outside the heat seal.

[0075] The loading and handling device 43 uses a pneumatic gripper in conjunction with a multi-axis moving module to move the wafer cassette to the adhesive application position 42. The structure of using a pneumatic gripper in conjunction with a multi-axis moving module to hold and move items is a mature technology in the mechanical field. Its specific structure and working principle will not be described in detail here.

[0076] The first attaching device 44 includes a first adhesive positioning component 441 located on one side of the adhesive application position 42 on the attaching worktable 41, a flattening frame 442 located on the attaching worktable 41 opposite to the first adhesive positioning component 441, a flattening roller 443 rotatably located on the upper end of the flattening frame 442, a folding component 444 located on the flattening frame 442 to fold the end of the folded edge section 84 downwards, and a first tape attaching component 445 located on the attaching worktable 41. During operation, when the loading and conveying device 43 moves the wafer cassette with the inner bag 8 down to the adhesive application position 42, the flattening roller 443 pushes the folded edge section 84 upwards to flatten it so that part of it is housed on the opposite surface of the inner bag 8, and the rest of it is placed on the folding component 444. The folding component 444 works to fold the remaining part of the folded edge section 84 downwards to the top surface of the inner bag 8, and the first tape attaching component 445 then attaches the tape between the top surface of the inner bag 8 and the end of the folded edge section 84.

[0077] The first adhesive application positioning assembly 441 includes a first positioning frame 4411 disposed on the application worktable 41 and opposite to the pusher frame 442, a first positioning plate 4412 movable in the direction close to the pusher frame 442, and a first positioning cylinder 4413 disposed on the first positioning frame 4411 to drive the first positioning plate 4412 to move. When the loading and conveying device 43 moves the wafer cassette with the inner bag 8 to the adhesive application position 42, the first positioning cylinder 4413 drives the first positioning plate 4412 close to the wafer cassette to limit the wafer cassette between the first positioning plate 4412 and the pusher frame 442, ensuring the operation of the first adhesive tape application assembly 445.

[0078] The folding assembly 444 includes a folding plate 4441 mounted on a flattening frame 442 and movable in a direction close to the first adhesive positioning assembly 441, and a folding cylinder 4442 mounted on the flattening frame 442 and connected to and driving the folding plate 4441 to move. The folding plate 4441 is provided with a plurality of adhesive relief areas 4443 at intervals for the first adhesive tape attaching assembly 445 to attach adhesive tape. During operation, the folded section 84 is partially pushed upward and flattened by the flattening roller 443 and stored on the opposite side of the inner bag 8, while the remaining part rests on the folding plate 4441. The folding cylinder 4442 controls the folding plate 4441 to move closer to the first adhesive positioning assembly 441, so that the remaining part of the folded section 84 is driven by the folding plate 4441 to fold downward to the top surface of the inner bag 8.

[0079] The first tape application assembly 445 includes a first tape holder 4451 for holding a roll of tape, a first pressing assembly 4452 disposed on the first tape holder 4451 for pressing the tape, a first pneumatic gripper 4453 movable back and forth relative to the first pressing assembly 4452, a first cutting assembly 4454 disposed on the first tape holder 4451 outside the first pressing assembly 4452 for cutting the tape, a first pulling cylinder 4455 disposed on the first tape holder 4451 to drive the first pneumatic gripper 4453 to move, a first adsorption assembly 4456 disposed on the first tape holder 4451 for adsorbing the tape, a transfer seat 4457 for mounting on the first tape holder 4451, a first transfer module 4458 connected to and driving the transfer seat 4457 to move closer to the first tape application positioning assembly 441, and a driving cylinder disposed on the application worktable 41. The first transfer module 4458 moves to the second transfer module 4459. The first adhesive-pulling cylinder 4455 controls the first adhesive-pulling pneumatic gripper 4453 to pull the tape outwards to the outside of the first adsorption component 4456. The first adsorption component 4456 adsorbs and fixes the tape, allowing the first cutting component 4454 to cut the pulled-out tape. The first transfer module 4458 and the second transfer module 4459 then work separately to move the cut tape to the top surface of the wafer cassette, fixing the end of the folded section 84 to the top surface of the inner bag 8. Specifically, the moving direction of the second transfer module 4459 is perpendicular to the moving direction of the first transfer module 4458. Both the first transfer module 4458 and the second transfer module 4459 can be linear motion modules. Linear motion modules are a mature technology in the mechanical field. The specific structure and working principle of the folding process will not be further elaborated upon.

[0080] The first pressing assembly 4452 includes a lower pressing block 44521 disposed on the first tape holder 4451, an upper pressing block 44522 that can move back and forth relative to the lower pressing block 44521, a first pressing cylinder 44523 disposed on the first tape holder 4451 and connected to drive the upper pressing block 44522 to move up and down, and a first guide roller 44524 disposed on the first tape holder 4451 and located inside the lower pressing block 44521, wherein one end of the tape roll passes around the lower end of the first guide roller 44524 and then passes between the upper pressing block 44522 and the lower pressing block 44521 and is pressed.

[0081] The first cutting assembly 4454 includes a first cutting blade 44541 that is movable up and down on the first tape holder 4451 and a first cutting cylinder 44542 that is connected to the first tape holder 4451 and drives the first cutting blade 44541 to move up and down. The first cutting blade 44541 is located between the first pressing assembly 4452 and the first adsorption assembly 4456.

[0082] The first adsorption assembly 4456 includes a first fixing frame 44561 disposed on the first tape holder 4451, an adsorption seat 44562 disposed on the first fixing frame 44561 that can be moved up and down, a tape adsorption head 44563 disposed on the adsorption seat 44562 for adsorbing tape, a first adsorption cylinder 44564 disposed on the first fixing frame 44561 and connected to and pneumatically moving the adsorption seat 44562 up and down, and a second adsorption cylinder 44565 disposed on the adsorption seat 44562 and connected to and driving the tape adsorption head 44563 to move up and down.

[0083] The second application device 45 includes an application robot 451 mounted on an application worktable 41, an application frame 452 mounted at the front end of the application robot 451, a second adhesive positioning assembly 453 mounted on the application worktable 41 opposite to the application robot 451, a desiccant storage bin 454 mounted on the application worktable 41 and located on one side of the second adhesive positioning assembly 453, an adhesive tape supply mechanism 455 mounted on the application worktable 41 for supplying adhesive tape, and detection cameras 456 spaced around the outer periphery of the application frame 452, an adhesive tape adsorption assembly 457, and a desiccant adsorption assembly 458. The application robot 451 controls the desiccant adsorption assembly 458. 58 adsorbs the desiccant onto the surface of the inner bag 8, and then controls the tape adsorption component 457 to adsorb the tape from the tape supply mechanism 455 to the wafer cassette to adhere and fix the desiccant; wherein, the tape supply mechanism 455 is basically the same as the first tape attaching component 445, the difference being that: the first adsorption component 4456, transfer seat 4457, first transfer module 4458 and second transfer module 4459 are not provided; because the tape adsorption component 457 is set on the attaching frame 452 and moves with the attaching robot 451, the first adsorption component 4456, transfer seat 4457, first transfer module 4458 and second transfer module 4459 are not provided.

[0084] The second adhesive positioning assembly 453 includes a second fixing frame 4531 disposed on the attachment worktable 41, a second positioning frame 4532 disposed on the attachment worktable 41 opposite to the second fixing frame 4531, a second positioning plate 4533 movable in a direction close to the second fixing frame 4531, and a second positioning cylinder 4534 disposed on the second positioning frame 4532 to drive the second positioning plate 4533 to move. The wafer packaging box is fixed by the cooperation between the second positioning plate 4533 and the second fixing frame 4531 to facilitate the placement of desiccant and the application of adhesive tape.

[0085] The desiccant storage bin 454 includes a storage rack 4541 mounted on the attachment worktable 41, a storage cavity 4542 for storing desiccant mounted in the storage rack 4541, a receiving plate 4543 that can be moved up and down in the storage cavity 4542, and a vertical moving module 4544 mounted on the storage rack 4541 and connected to and driving the receiving plate 4543 to move up and down; specifically, the vertical moving module 4544 is a linear moving module that can realize the up and down movement of the receiving plate 4543.

[0086] The tape adsorption assembly 457 includes a fixed adsorption head 4571 disposed on the attachment frame 452 and two floating adsorption heads 4572 disposed on both sides of the fixed adsorption head 4571 on the attachment frame 452. The two floating adsorption heads 4572 are respectively adsorbed and connected to both ends of the tape. When the desiccant is fixed, the fixed adsorption head 4571 presses the adsorbed tape portion onto the upper surface of the desiccant, and the two floating adsorption heads 4572 press the two ends of the tape onto the surface of the inner bag 8 to achieve the fixation of the desiccant.

[0087] The bonding and conveying device 46 includes a receiving platform 461 that is movable up and down on the bonding worktable 41 for receiving wafer cassettes, a lifting drive assembly 462 that connects to and drives the receiving platform 461 to move up and down, and a conveying module 463 that conveys the lifting drive assembly 462 and the receiving platform 461 from the first adhesive positioning assembly 441 to the second bonding device 45. The lifting drive assembly 462 may be a cylinder, and the conveying module 463 may be a linear motion module.

[0088] The outer bag heat sealing station 5 is used to cover and seal the wafer cassette after the desiccant has been applied. The structure and working principle of this station are the same as those of the inner bag heat sealing station 3. The specific structure and working principle will not be described in detail here. Specifically, the outer bag structure is the same as that of the inner bag 8, and the folding edge will not be described in detail here.

[0089] Reference Figure 23As shown, the outer bag labeling inspection station 6 performs labeling processing on wafer cassettes that have completed outer bag fitting. It includes an outer bag labeling table 61, a gripper transport module 62 that moves the wafer cassettes from the outer bag filling and heat sealing station 5 to the outer bag labeling table 61, a storage and adhesion device 63 that stores and fixes the folded edge of the outer bag to the top surface of the outer bag body, an adhesion device 64 on the outer bag labeling table 61 for labeling the outer bag, two label printers 65 located on both sides of the adhesion device 64 on the outer bag labeling table 61, and a transfer transport module 66 that moves the labeled wafer cassettes outwards. The two label printers 65 are used to print outer bag labels and RoHS labels, respectively. Specifically, the storage and adhesion device 63 has the same structure as the first adhesion device 44 in the desiccant adhesion station 4; its specific structure and working principle will not be further described here. The transfer transport module 66 has the same structure as the label conveying device 23; its specific structure and working principle will not be further described here.

[0090] The bonding device 64 includes a bonding robot 641, a bonding frame 642 disposed at the front of the bonding robot 641, and a second detection component 643, a first bonding adsorption component 644, and a second bonding adsorption component 645 disposed at intervals on the bonding frame 642. During operation, the first bonding adsorption component 644 adsorbs and bonds the outer bag label to the top surface of the outer bag, and the second bonding adsorption component 645 adsorbs and bonds the ROSH label to the top surface of the outer bag. Specifically, the second detection component 643 can be a CCD camera. Furthermore, both the first bonding adsorption component 644 and the second bonding adsorption component 645 are composed of a bonding adsorption head and a bonding cylinder. Their specific structure and working principle will not be further described here.

[0091] After the outer bag's folded edge is secured, both label printers 65 simultaneously print labels. The second detection component 643 photographs the outer label to determine its quality. If the outer bag label is defective, the first bonding and adsorption component 644 moves the defective label to the defective label rack and simultaneously reprints the outer bag label relative to the label printer 65. If the outer bag label is acceptable, the first bonding and adsorption component 644 transfers and secures the outer bag label to the top surface of the outer bag. After the outer bag label is applied, the second detection component 643 checks the labeling process. When the labeling fails, the transfer and handling module 66 transports the defective product outward for processing. When the labeling passes, the second bonding and adsorption component 645 transfers the printed RoHS label to the top surface of the outer bag, and the second detection component 643 checks for the presence of the RoHS label. If no RoHS label is detected, the labeling and affixing process is repeated. If the process is repeated more than twice, the equipment alarms and manual observation is required. When a RoHS label is detected, the transfer and handling module 66 transports the defective product outward to the unloading station 7 for unloading processing.

[0092] The automated wafer cassette packaging method based on the above-mentioned device specifically includes the following steps:

[0093] Step 1: The wafer cassette with the incoming material label affixed to its top surface enters the wafer cassette labeling and inspection station 2 via the transfer mechanism 14 in the loading station 1. The wafer cassette labeling and inspection station 2 peels off the incoming material label and then affixes an information label. The specific process is as follows:

[0094] A. The wafer cassette is transported to the buffer position 213 by the transfer mechanism 14 in the loading station 1, and the labeling conveyor 23 transports the wafer cassette in the buffer position 213 to the labeling position 211;

[0095] B. The first detection component 243 collects information from the incoming material label on the top surface of the wafer cassette. Based on the obtained information, it controls the corresponding label printer 25 to print the information label. The labeling robot 241 controls the label tearing component 244 to tear off the incoming material label. Then, the first detection component 243 takes a picture of the information label on the label holder 29 for inspection. When the information label is defective, the labeling component 245 transfers the information label to the waste label rack 217 and controls the label printer 25 to reprint the information label. When the information label is qualified, the labeling robot 241 controls the labeling component 245 to transfer the qualified information label from the label holder 29 and affix it to the top surface of the wafer cassette.

[0096] C. The first detection component 243 takes pictures to detect the affixed information label. When the affixed information label is defective, the labeling conveyor 23 moves the wafer box to the transfer position 214 and then moves it to the defective temporary storage area 26 via the defective product handling device 27. When the affixed information label is qualified, the labeling conveyor 23 moves the wafer box to the transfer position 214 and then moves it to the inner bag heat sealing station 3 via the unloading and handling device 28.

[0097] Step two: The wafer cassette with the information label is fed into the pusher device 35. The bag-removing device 33 takes out the inner bag 8 from the inner bag storage rack 32 and moves it to the bagging position 311. The bag-spreading device 34 spreads the inner bag 8 on the bagging position 311 open. The pusher device 35 then pushes the wafer cassette into the spread inner bag 8. The heat-sealing device 36 first folds the opening of the inner bag 8, then performs vacuuming, and immediately performs heat sealing after vacuuming. The specific process is as follows:

[0098] A. The wafer cassette with the information label attached is fed into the feeding device 35. The bag taking device 33 takes out the inner bag from the inner bag storage rack 32 and moves it to the bagging position 311. The bag supporting device 34 opens the inner bag 8 on the bagging position 311. The feeding device 35 then pushes the wafer cassette into the opened inner bag 8.

[0099] B. The folding bag seat 361 moves closer to the bag filling position 311, causing the two folding bag knives 362 and the negative pressure tube 363 to move closer to the inner bag 8 so that the two folding bag knives 362 are respectively located on opposite sides of the bag opening of the inner bag 8, and the negative pressure tube 363 extends into the inner bag 8. Then the second moving mechanism 367 drives the two folding bag knives 362 to move towards each other, causing the side of the inner bag 8 in contact with them to move inward to the correct position, thus completing the folding bag treatment of the bag opening of the inner bag 8.

[0100] C. The upper heat-sealing assembly 364 moves downwards to contact the top surface of the inner bag 8 opening, while the lower heat-sealing assembly 365 moves upwards to contact the bottom surface of the inner bag 8 opening. The negative pressure tube 363 operates to vacuum the inside of the inner bag 8. The wafer cassette is limited by the upper positioning plate 368 and the lower positioning plate 369, preventing movement. After the negative pressure tube 363 completes the vacuuming process, the first moving mechanism 366 drives the folding bag seat 361 to move away from the bagging position 311, thereby pulling the negative pressure tube 363 out of the inner bag 8. At this time, the first heat-sealing cylinder 3653 drives the lower heat-sealing head 3652 to move upwards to cooperate with the upper heat-sealing head 3642 to clamp the opening of the inner bag 8 for heat sealing, thus completing the vacuuming and heat-sealing process of the inner bag 8 after folding.

[0101] Step 3: The wafer cassette with the inner bag installed enters desiccant attachment station 4 for desiccant attachment. The specific process is as follows:

[0102] A. The loading and conveying device 43 transports the wafer cassette with the inner bag attached to the adhesive application position 42. During the transport process, the loading and conveying device 43 moves the wafer cassette above the adhesive application position 42 and then slowly lowers the wafer cassette to the adhesive application position 42. During the descent, the inner bag folded edge section 84 is pushed upward and flattened by the flattening roller 443 and stored on the opposite side of the inner bag, while the remaining part rests on the folded edge plate 4441.

[0103] B. The first adhesive positioning component 441 fixes the wafer box between the first positioning plate 4412 and the relative flattening frame 442. Then the folding cylinder 4442 controls the folding plate 4441 to move closer to the first adhesive positioning component 441, so that the remaining part of the folding section 84 is folded down to the top surface of the inner bag 8 by the folding plate 4441.

[0104] C. The first adhesive-pulling cylinder 4455 controls the first adhesive-pulling pneumatic gripper 4453 to pull the tape outward to the outside of the first adsorption component 4456. The first adsorption component 4456 can adsorb and fix the tape so that the first cutting component 4454 can cut the pulled tape. The first transfer module 4458 and the second transfer module 4459 then work respectively so that the cut tape can be moved to the top surface of the wafer box to fix the end of the folded section 84 to the top surface of the inner bag 8.

[0105] D. The attaching conveyor 46 moves the wafer cassette at the attaching position 42 to the second attaching positioning component 453. The wafer cassette is positioned by the cooperation of the second positioning plate 4533 and the second fixing frame 4531. The attaching robot 451 controls the desiccant adsorption component 458 to adsorb and transfer the desiccant in the desiccant storage bin 454 to the top surface of the inner bag 8. Then, it continues to control the tape adsorption component 457 to obtain tape from the tape supply mechanism 455. The desiccant is fixed on the surface of the inner bag 8 by the cooperation of the fixed adsorption head 4571 and the floating adsorption head 4572 to complete the attachment of the desiccant. The attaching conveyor 46 continues to work to transport the wafer cassette with the attached desiccant to the outer bag packaging and heat sealing station 5.

[0106] Step 4: The outer bagging and heat sealing station 5 covers the wafer box with the desiccant and heat seals it. The wafer box with the outer bag is then placed into the outer bag labeling and inspection station 6, where the outer bag label and RoHS label are affixed. The wafer box packaging is now complete, and it is then placed into the unloading station 7 for unloading.

[0107] This application defines the structural composition of the packaging machine. By setting up a wafer box labeling and inspection station 2, an inner bag filling and heat sealing station 3, and a desiccant application station 4, it can stably and automatically complete the labeling, bagging, and desiccant application of wafer boxes, greatly reducing manpower input, improving production efficiency, and achieving high cleanliness. The overall equipment has a high degree of automation, operates fully automatically, avoids the risk of wafer contamination inside the wafer box caused by manual operation, and is also compatible with wafer box packaging of various sizes.

[0108] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the specification of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. An automatic wafer box packaging machine, characterized in that: This includes a wafer box labeling and inspection station for labeling wafer boxes, an inner bag packaging and heat sealing station for packaging labeled wafer boxes, and a desiccant application station for affixing desiccant to the inner bag. The inner bag filling and heat sealing station includes a sealing table, a bag filling position set on the sealing table, an inner bag storage rack set on the sealing table, a bag picking device for picking up inner bags from the inner bag storage rack and placing them at the bag filling position, a bag opening device for opening the inner bags at the bag filling position, a pushing device for pushing wafer cassettes into the opened inner bags, and a heat sealing device for heat sealing the opening of the inner bags. A desiccant attachment station includes an attachment worktable, an adhesive application position on the attachment worktable, a loading and conveying device for transporting wafer cassettes to the adhesive application position, a first attachment device on the attachment worktable for attaching the opening of an inner bag to one side of the inner bag, and a second attachment device for attaching the desiccant to the inner bag. The first attachment device includes a first adhesive positioning component on the attachment worktable located on one side of the adhesive application position, a flattening frame on the attachment worktable opposite to the first adhesive positioning component, a flattening roller rotatably mounted on the flattening frame, and a folding mechanism mounted on the flattening frame. The inner bag includes an inner bag body for housing a wafer cassette and an edge segment located outside the heat-sealed area. When the loading and conveying device moves the wafer cassette housing the inner bag downwards to the adhesive application position, the flattening roller pushes the edge segment upwards, partially tucking it into the opposite side of the inner bag, while the remaining portion rests on the edge folding assembly. The edge folding assembly folds the remaining portion of the edge segment downwards to the top surface of the inner bag, and the first adhesive tape application assembly applies adhesive tape between the top surface of the inner bag and the end of the edge segment.

2. The automatic wafer box packaging machine according to claim 1, characterized in that: The folding assembly includes a folding plate mounted on a flattening frame that can move along the direction close to the first adhesive applicator positioning component, and a folding cylinder mounted on the flattening frame that connects to and drives the folding plate to move. The folding plate is provided with multiple adhesive applicator clearance areas at intervals for the first adhesive applicator to apply adhesive tape. After the folded section is pushed flat and stored on the opposite side of the inner bag by the flattening roller, the remaining part rests on the folding plate. The folding cylinder controls the folding plate to move closer to the first adhesive applicator positioning component, so that the remaining part of the folded section is driven by the folding plate to fold downward to the top surface of the inner bag.

3. The automatic wafer box packaging machine according to claim 1, characterized in that: The heat-sealing device includes a folding bag seat movable along the direction of approaching the bag filling position, two folding bag knives movably mounted on the sealing platform, a negative pressure tube disposed inside one of the folding bag knives, an upper heat-sealing assembly and a lower heat-sealing assembly disposed vertically opposite each other, a first moving mechanism disposed on the sealing platform to drive the folding bag seat to move, a second moving mechanism disposed on the folding bag seat to drive the two folding bag knives to move towards each other, an upper positioning plate disposed on the upper heat-sealing assembly extending downward, and a lower positioning plate disposed on the lower heat-sealing assembly extending upward and opposite to the upper positioning plate. The two folding bag knives are respectively opposite to the two sides of the inner bag, and the upper positioning plate and the lower positioning plate are respectively opposite to the top surface and bottom surface of the inner bag. The first moving mechanism drives the folding bag seat to move closer to the bag filling position so that the negative pressure tube extends into the inner bag, and the folding bag knives on the same side are located on the outside of the inner bag. The second moving mechanism drives the two folding bag knives to move towards each other so that the folding bag knives drive the inner bag side that is in contact with them to move inward to complete the folding of the inner bag opening.

4. The automatic wafer box packaging machine according to claim 3, characterized in that: The bag-retrieving device includes a first bag-retrieving frame extending along the direction near the bag-filling position on the sealing platform, a second bag-retrieving frame extending along the direction near the inner bag storage rack on the first bag-retrieving frame, a support plate movably mounted on the first bag-retrieving frame for placing the inner bag, a correction mechanism located below the second bag-retrieving frame for correcting the position of the inner bag, a bag-retrieving assembly movably mounted on the second bag-retrieving frame for clamping the inner bag, a first drive assembly mounted on the first bag-retrieving frame for driving the support plate to move, and a second drive assembly mounted on the second bag-retrieving frame for driving the bag-retrieving assembly to move. The bag-retrieving assembly picks up the inner bag from the inner bag storage rack and places it on the support plate, and the first drive assembly drives the support plate containing the inner bag to move to the bag-filling position.

5. The automatic wafer box packaging machine according to claim 4, characterized in that: The calibration mechanism includes a calibration frame that can be moved up and down below the second bag-retrieving frame, two first calibration components that are arranged opposite each other on both sides of the calibration frame, two second calibration components that are arranged opposite each other on both sides of the calibration frame, and a calibration lifting cylinder that is connected to and drives the calibration frame to move up and down. The two first calibration components and the two second calibration components are alternately arranged on the four sides of the calibration frame. The first calibration component includes a calibration plate that can move along the opposite side and a first calibration cylinder that is arranged on the calibration frame to drive the calibration plate to move. The second calibration component includes a calibration column that can move along the opposite side and a second calibration cylinder that is arranged on the calibration frame to drive the calibration column to move. The support plate is provided with a strip-shaped moving hole for the opposite calibration column to pass through.

6. The automatic wafer box packaging machine according to claim 4, characterized in that: The bag-retrieving assembly includes a movable seat movably mounted on a second bag-retrieving frame, a bag-retrieving plate that can extend into an inner bag storage rack and is located at the lower end of the movable seat, and a plurality of bag-retrieving suction nozzles spaced apart at the lower end of the bag-retrieving plate.

7. The automatic wafer box packaging machine according to claim 1, characterized in that: The second attaching device includes an attaching robot arm mounted on an attaching worktable, a rotating frame mounted at the front end of the attaching robot arm, a tape supply mechanism for supplying tape, a desiccant storage rack mounted on the attaching worktable for storing desiccant, a second detection component spaced apart on the outer periphery of the rotating frame, a desiccant adsorption and transfer component, and a tape adsorption and transfer component.

8. The automatic wafer box packaging machine according to claim 1, characterized in that: The wafer cassette labeling and inspection station includes a labeling table, a labeling conveyor set on the labeling table for conveying wafer cassettes, a labeling device set on the labeling table, and a label printer set on the labeling table. The labeling device includes a labeling robot set on the labeling table, a mounting plate set at the front end of the labeling robot, and a first detection component, a label tearing component, and a labeling component spaced apart on the mounting plate.

9. The automatic wafer box packaging machine according to claim 1, characterized in that: It also includes an outer bag filling and heat sealing station and an outer bag labeling and inspection station. The outer bag filling and heat sealing station covers the wafer cassette with the adsorbent and heat seals it. The outer bag labeling and inspection station labels the outer bag.

10. An automated wafer cassette packaging method, characterized in that: The packaging process, based on any one of claims 1 to 9, specifically includes the following steps: Step 1: The wafer cassette with the incoming material label on the top surface enters the wafer cassette labeling and inspection station. The wafer cassette labeling station peels off the incoming material label and then affixes an information label. Step 2: The wafer cassette with the information label is fed into the feeding device. The bag taking device takes out the inner bag from the inner bag storage rack and moves it to the bagging position. The bag supporting device opens the inner bag at the bagging position. The feeding device then pushes the wafer cassette into the opened inner bag. The heat sealing device first folds the opening of the inner bag and then performs vacuuming. After vacuuming, the heat sealing process is performed immediately. Step 3: The wafer cassette with the inner bag installed is transported to the adhesive application position by the loading and conveying device. When the loading and conveying device moves the wafer cassette with the inner bag down to the adhesive application position, the flattening roller pushes the folded edge section upward and flattens it so that part of it is stored on the opposite side of the inner bag, and the rest is placed on the folding edge assembly. The folding edge assembly works to fold the remaining part of the folded edge section downward to the top surface of the inner bag. The first adhesive tape application assembly then applies adhesive tape between the top surface of the inner bag and the end of the folded edge section to fix the folded edge section. The wafer cassette with the inner bag folded edge section fixed is moved to the second application device, and the desiccant is fixed to the top surface of the inner bag by the second application device, completing the application of the desiccant.

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