Pulse magnetron sputtering coating preparation device and preparation method

Abstract

The invention discloses a pulse magnetron sputtering coating preparation device and method, and belongs to the technical field of magnetron sputtering. A target sputtering mechanism and a substrate clamping mechanism are arranged in the sputtering tank; the target material sputtering mechanism is used for clamping and bombarding a target material to generate target material atoms; the substrate clamping mechanism comprises a fixing frame; clamping pieces which are symmetrically arranged by taking the axis of the sputtering tank as the center are arranged on the fixing frame; the substrate clamping mechanism is used for driving the two clamping pieces to clamp the substrate to form a clamping area and enabling the substrate to move back and forth between the two clamping pieces to enable the clamping area to be exposed alternately; the clamping roller clamps the clamping plate and is matched with the first driving part to reliably clamp the substrate, the second driving part drives the clamping roller to rotate, and the substrate moves back and forth between the clamping parts, so that the surface of the substrate is dynamically exposed in the deposition process, and the clamping blind area problem caused by a traditional clamping mode is effectively avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of magnetron sputtering, in particular to a pulse magnetron sputtering coating preparation device and a preparation method. BACKGROUND

[0002] Pulse magnetron sputtering is a technology for efficient coating by periodically modulating the power supply (such as intermediate frequency pulse or HiPIMS). Compared with traditional direct current sputtering, it has the advantages of arc suppression and improved film density.

[0003] Magnetron sputtering coating is a physical vapor deposition technology for thin film deposition in a vacuum environment. The basic process is as follows: the substrate and the target material are placed together in the coating chamber, the air in the chamber is pumped out by a vacuum pump, a certain pressure of high-purity argon gas is introduced, and a high voltage is applied in the low-pressure argon atmosphere to form a plasma in the target material area. The plasma contains argon atoms, positively charged argon ions and free electrons. Electron collision with argon atoms will continuously ionize new argon ions. When the target material is applied with a negative bias, the argon ions are accelerated towards the target material and bombard the target material surface, and the target atoms are sputtered due to kinetic energy impact. These atoms that have left the target fly in a straight line to the opposite substrate, depositing layer by layer to form a thin film. By adjusting the discharge current, gas pressure and other parameters, the deposition rate and film thickness can be precisely controlled, repeated coating can be achieved, and the thickness of each layer of film is uniform. Therefore, this process has good controllability, stability and repeatability, and is widely used in the preparation of functional thin films in the fields of optics, electronics, decoration, etc.

[0004] CN116065130B discloses a continuous coating electronic magnetron sputtering device, which adopts a horizontal vacuum magnetron sputtering method. The device controls multiple coating materials and target materials to pass through by an external driving device, and uses a movable coating material rack to support the coating materials. The device realizes double-sided magnetron sputtering coating of the target material at the same time, and avoids the sputtering blind area.

[0005] In the prior art, the coating material rack (6) clamps the coating material through the fixing piece (62), and the movement of the coating material rack (6) depends on the reciprocating rotation of the second screw rod (61), which limits the movement range of the fixing piece (62). The edge of the coating material or the shielding area of the fixing piece (62) may form a blind area due to insufficient sputtering, affecting the uniformity of the thin film.

[0006] Secondly, the target material racks (7) are arranged on the upper and lower sides of the coating material rack (6), but only one side of the target material facing the coating material is in use, and the other side is not fully utilized and is conveyed away, resulting in waste of the target material. SUMMARY

[0007] The present application aims to provide a pulse magnetron sputtering coating preparation device to solve the problem of blind area caused by insufficient sputtering of the edge of the coating material or the shielding area of the fixing piece in the prior art, which affects the uniformity of the thin film.

[0008] To solve the above technical problems, the application adopts the following technical solutions:

[0009] A pulse magnetron sputtering coating preparation device, comprising a horizontally arranged sputtering tank; a target material sputtering mechanism and a substrate clamping mechanism are arranged in the sputtering tank; the target material sputtering mechanism is used for clamping and bombarding the target material to generate target material atoms; the substrate clamping mechanism is located directly below the target material sputtering mechanism; the substrate clamping mechanism comprises a fixing frame; the fixing frame is provided with clamping pieces arranged symmetrically about the axis of the sputtering tank; each clamping piece comprises a clamping strip; a clamping groove is opened on one side of each clamping strip opposite to the other clamping strip; two clamping plates that move relatively or in opposite directions are slidably arranged in the clamping groove; a sliding groove is opened on one side of each clamping plate opposite to the other clamping plate; a plurality of clamping rollers are rotatably arranged in each sliding groove; a first driving piece is arranged on the clamping strip; a second driving piece is arranged on the clamping plate;

[0010] The first driving piece is used to drive the two clamping plates to move relatively, so that the clamping rollers on the two clamping pieces clamp the substrate to form a clamping area; the second driving piece is used to drive the clamping rollers to rotate, so that the substrate moves back and forth between the two clamping pieces, and the clamping area is alternately exposed.

[0011] Further, the first driving piece comprises a first motor and a double-headed screw rod; the double-headed screw rod is rotatably arranged in the clamping groove; the double-headed screw rod has two screw threads with opposite screw directions; the two clamping plates are threadedly connected to the corresponding screw threads; the first motor is arranged on the clamping strip, and the power end of the first motor is rotatably extended into the clamping strip and coaxially connected with one end of the double-headed screw rod.

[0012] Further, the second driving piece comprises a chain and a second motor; one of the two clamping plates is rotatably provided with a plurality of rotating shafts outside the clamping plate, and one end of the rotating shafts is coaxially connected with the corresponding clamping rollers; the other end of the rotating shafts is provided with a first sprocket outside the clamping plate; the second motor is arranged on the clamping plate, and the power end is provided with a second sprocket; the first sprocket and the second sprocket are linked by the chain.

[0013] Further, the target material sputtering mechanism comprises a power supply, a permanent magnet and two fixed discs arranged in parallel; one of the two fixed discs is rotatably arranged at the end of the sputtering tank by a third driving piece; two first abutting plates are symmetrically arranged about the axis of the fixed disc between the two fixed discs; a first abutting groove is opened on one side of the two first abutting plates opposite to each other; a first abutting strip is extended into the first abutting groove by a first spring damper; the two first abutting strips are used to clamp the target material; the power supply is arranged on the other fixed disc; the permanent magnet is arranged in the sputtering tank and located on the side of the target material away from the substrate; a through hole is opened in the sputtering tank; a gas filling valve is arranged in the through hole.

[0014] Further, the two fixed discs are provided with two arc-shaped grooves centered on the axis, two abutting columns are slidably and rotatably arranged in the two arc-shaped grooves, two second abutting plates parallel to the first abutting plate are arranged between the two abutting columns, a second abutting groove is formed on the opposite side of the two second abutting plates, a second abutting strip is arranged in the second abutting groove through a second spring damper, and the second abutting strip has a longer extension distance than the first abutting strip.

[0015] Further, the fourth driving member comprises a rotary motor, a linkage strip is arranged on the power end of the rotary motor, and two abutting motors are arranged on the side of the linkage strip close to the arc-shaped groove, and the power end of each abutting motor is coaxially connected with the corresponding abutting column by extending into the arc-shaped groove.

[0016] Further, the sputtering tank is provided with a rotating base, a gap is arranged in the fixed frame, and the target material sputtering mechanism is driven by the rotating base to pass through the gap and reach the other side of the substrate.

[0017] Further, the sputtering tank comprises a tank cover, the fixed frame is connected to the tank cover, a guide rail parallel to the axis is arranged in the sputtering tank, and the fixed frame is slidably arranged on the guide rail.

[0018] Another object of the present application is to provide a preparation method of the pulse magnetron sputtering coating preparation device, comprising the following steps:

[0019] Substrate loading and positioning

[0020] S1, open the tank cover, place the substrate between the two clamping members, start the first motor to drive the double-headed screw rod, and move the clamping plate synchronously to clamp the substrate, and test the reciprocating movement function of the substrate driven by the clamping roller through the chain wheel system driven by the second motor.

[0021] Target material loading and calibration

[0022] S2, place the target material between the two fixed discs, the first abutting strip automatically clamps the target material under the action of the first spring damper, test the target material rotation switching function through the fourth driving member, adjust the position of the second abutting plate through the abutting motor, and realize 180° target surface switching through the rotary motor.

[0023] Vacuum system preparation

[0024] S3, close all valves, start the vacuum pump to extract to the basic vacuum, fill in high-purity argon gas through the through-hole valve, and maintain the working gas.

[0025] Double-sided alternating film coating

[0026] S4, upper film coating stage: start the upper permanent magnet to form a magnetic control field, apply pulse power, and drive the clamping roller synchronously to make the substrate move back and forth.

[0027] S5, lower film coating switching: start the rotating motor to drive the target material mechanism to rotate 180°, and the lower permanent magnet automatically forms a new magnetic control field; repeat the film coating process.

[0028] Target material surface switching

[0029] S6, when the single-sided wear of the target material reaches a threshold value: the second pressing strip is extended to replace the first pressing strip, and the sputtering motor drives the fixed disc to rotate 180°

[0030] S7, full-circle utilization of the target material: adjust the position of the pressing column through the fourth driving member to realize 360° area sputtering of the target material.

[0031] Process termination

[0032] S8, turn off the pulse power and gas supply; after breaking the vacuum, take out the substrate; disassemble the tank cover for target replacement or maintenance.

[0033] Compared with the prior art, the beneficial effects of the present application are:

[0034] By clamping the clamping plate with the clamping roller and cooperating with the first driving member to realize reliable clamping of the substrate, the second driving member is used to drive the clamping roller to rotate, so that the substrate moves back and forth between the clamping members, thereby realizing dynamic exposure of the substrate surface during the deposition process, effectively avoiding the clamping blind area problem caused by the traditional clamping method. Through this dynamic exposure method, not only the uniformity of the coating on the substrate surface is significantly improved, but also the bonding quality of the film layer and the substrate is enhanced. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to make the purpose, technical scheme and beneficial effects of the present application clearer, the present application provides the following drawings for explanation:

[0036] Figure 1 It is a three-dimensional view of the present application.

[0037] Figure 2 It is a three-dimensional view of the sputtering tank of the present application.

[0038] Figure 3 It is a three-dimensional view of the target material sputtering mechanism in the sputtering tank of the present application, which is located below the substrate clamping mechanism.

[0039] Figure 4 It is a three-dimensional view of the substrate clamping mechanism of the present application.

[0040] Figure 5 It is a three-dimensional view of the target material sputtering mechanism of the present application.

[0041] Figure 6Three-dimensional diagram of the target material sputtering mechanism switching to the clamping surface of the target material.

[0042] Figure 7 Three-dimensional diagram of the clamping piece.

[0043] Figure 8 Three-dimensional diagram of the rotating base.

[0044] Figure 9 Three-dimensional diagram of the intermittent exposure of the substrate between the clamping pieces.

[0045] Icon: 1-sputtering pot, 2-pot cover, 3-target material sputtering mechanism, 4-substrate clamping mechanism, 5-fixing frame, 6-rail, 7-clamping strip, 8-clamping groove, 9-clamping plate, 10-clamping roller, 11-first driving piece, 12-second driving piece, 13-double screw, 14-chain, 15-first sprocket, 16-second sprocket, 17-power supply, 18-permanent magnet, 19-fixing disc, 20-first pressing plate, 21-first pressing strip, 22-arc-shaped groove, 23-second pressing plate, 24-second pressing strip, 25-linkage strip, 26-pressing motor, 27-rotating base, 28-gap, 29-bottom cover, 30-bottom motor, 31-C-shaped clamping plate, 32-inflation valve, 33-exhaust valve, 34-target material, 35-substrate. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0047] Example:

[0048] As Figures 1-9 shown, the present application provides a pulsed magnetron sputtering coating preparation device, which comprises a horizontally arranged sputtering pot 1 and four bottom feet; the sputtering pot 1 comprises a bolted pot cover 2; the sputtering pot 1 is provided with a target material sputtering mechanism 3 and a substrate clamping mechanism 4; the target material sputtering mechanism 3 is used for clamping and bombarding the target material 34 to generate target material 34 atoms; the substrate clamping mechanism 4 is located directly below the target material sputtering mechanism 3; the substrate clamping mechanism 4 comprises a fixing frame 5; one end of the fixing frame 5 is connected to the pot cover 2; the inner side wall of the sputtering pot 1 is provided with two rails 6 parallel to the axis; the fixing frame 5 is slidingly arranged on the two rails 6 to provide stable support; the fixing frame 5 is provided with substrate 35 clamping pieces arranged symmetrically with the axis of the sputtering pot 1 as the center; the substrate 35 clamping pieces are located below the target material sputtering mechanism 3;

[0049] Each substrate 35 holder comprises a clamping strip 7; each clamping strip 7 is provided with a clamping groove 8 on the side opposite to the other clamping strip 7 on the other side of the sputtering pot 1 axis; two clamping plates 9 are slidably arranged in the clamping groove 8 and move in opposite directions; the two clamping plates 9 extend out of the clamping groove 8; the two clamping plates 9 are provided with a sliding groove on the side opposite to each other in the same holder; a plurality of clamping rollers 10 are rotatably arranged in each sliding groove; the clamping strip 7 is provided with a first driving member 11; the clamping plate 9 is provided with a second driving member 12; the sputtering pot 1 is provided with a through hole and a gas extraction hole; the through hole is provided with a gas filling valve 32; the gas extraction hole is provided with a gas extraction valve 33.

[0050] The first driving member 11 is used to drive the two clamping plates 9 to move relative to each other, so that the clamping rollers 10 on the two clamping members clamp the substrate 35 to form a clamping area; the second driving member 12 is used to drive the clamping rollers 10 to rotate, so that the substrate 35 moves back and forth between the two clamping members, and the clamping area is alternately exposed.

[0051] The principle and beneficial effects of the above technical solution are as follows:

[0052] The substrate 35 is placed between the two clamping members, and the first driving member 11 is controlled to drive the two clamping plates 9 to move relative to each other, so that the clamping rollers 10 on the two clamping members clamp the substrate 35; then the fixed frame 5 is slidably placed on the two guide rails 6 to provide stable support, and the pot cover 2 is closed; after vacuumizing through the gas extraction valve 33, argon is filled into the sputtering pot 1 through the gas filling valve 32, and the target sputtering mechanism 3 is started to work; during the deposition process, the second driving member 12 is used to drive the clamping rollers 10 to rotate, so that the substrate 35 moves back and forth between the two clamping members, and the clamping area is alternately exposed, avoiding the blind area caused by clamping the substrate 35 in the prior art, and improving the uniformity of the deposited film layer.

[0053] In the embodiment, the first driving member 11 comprises a first motor and a double-headed screw rod 13; the double-headed screw rod 13 is rotatably arranged in the clamping groove 8; the double-headed screw rod 13 has two screw surfaces with opposite screw directions; the two clamping plates 9 are threadedly connected to the corresponding screw surfaces respectively; the first motor is arranged on the clamping strip 7, and the power end of the first motor is rotatably extended into the clamping strip 7 and coaxially connected with one end of the double-headed screw rod.

[0054] The principle and beneficial effects of the above technical solution are as follows:

[0055] The double-end screw 13 is arranged in the clamping groove 8 and has two thread surfaces with opposite thread directions on two sides. The two clamping plates 9 are respectively threadedly connected with the corresponding thread surfaces of the double-end screw 13. When the first motor works, the double-end screw 13 is driven to rotate. Since the two clamping plates 9 are respectively connected with the thread surfaces with opposite thread directions, the two clamping plates 9 simultaneously move in opposite directions (i.e., approach or move away from each other) in the clamping groove 8, so that the synchronous clamping or releasing operation is realized.

[0056] In the embodiment, the second driving member 12 includes a chain 14 and a second motor. One of the two clamping plates 9 is rotatably provided with a plurality of rotating shafts extending into the sliding groove, and one end of each rotating shaft is coaxially connected with a corresponding clamping roller 10. The other end of each rotating shaft is provided with a first sprocket 15 located outside the clamping plate 9. The second motor is arranged on the clamping plate 9 and has a second sprocket 16 at a power end. The first sprocket 15 and the second sprocket 16 are linked through the chain 14.

[0057] Principles and beneficial effects of the above technical solutions:

[0058] The second driving member 12 adopts a chain transmission mechanism. The second motor synchronously drives a plurality of first sprockets 15 to rotate through the chain 14, thereby driving the rotating shafts and the clamping rollers 10 to link. The clamping rollers 10 actively roll in the sliding groove, thereby driving the substrate 35 to move back and forth between the two clamping members, allowing the clamping area to be alternately exposed, avoiding the occurrence of a blind area, and improving the uniformity of the deposited film layer.

[0059] In the embodiment, the target sputtering mechanism 3 includes a power supply 17, a permanent magnet 18, and two parallel arranged fixed discs 19. One of the two fixed discs 19 is rotatably arranged at the end of the sputtering tank 1 through a third driving member. Two first abutting plates 20 are symmetrically arranged with the axis of the fixed disc 19 as the center between the two fixed discs 19. First abutting grooves are opened on the opposite sides of the two first abutting plates 20. First abutting strips 21 are arranged to extend into the first abutting grooves through first spring dampers (not shown in the figure). The two first abutting strips 21 are used to clamp the target material 34. The power supply 17 is arranged on the other fixed disc 19. The permanent magnet 18 is arranged in the sputtering tank 1 through two C-shaped clamping plates 31 and located on the side of the target material 34 away from the substrate 35.

[0060] Principles and beneficial effects of the above technical solutions:

[0061] The target 34 is clamped by two abutting strips, and the power supply 17 is controlled by an external controller to apply an electric field to cooperate with the externally supplied argon to form a plasma in the region of the target 34. The plasma contains argon atoms, positively charged argon ions and free electrons, and the collision between the electrons and the argon atoms will continuously ionize new argon ions. When the target 34 is applied with a negative bias, the argon ions are accelerated towards the target 34 and bombard the surface of the target 34, and the atoms of the target 34 are sputtered due to kinetic energy impact. These atoms separated from the target 34 fly along a straight path to the opposite substrate 35, and form a film layer by layer.

[0062] The third driving member rotates the fixed disc 19 to realize the double-sided utilization of the target 34. When one side of the target 34 reaches the preset sputtering loss threshold, the driving motor drives the fixed disc 19 to rotate by 180°, so that the other unused side of the target 34 is switched to the working position to continue participating in the sputtering process.

[0063] In the embodiment, two arc-shaped grooves 22 are arranged on the two fixed discs 19 with the axis as the center; the two arc-shaped grooves 22 are slidably and rotatably provided with abutting columns; the two abutting columns are provided with second abutting plates 23 parallel to the first abutting plate 20; the opposite side of each second abutting plate 23 is provided with a second abutting groove; the second abutting groove is provided with an extended second abutting strip 24 through a second spring damper (not shown in the figure); the extension distance of the second abutting strip 24 is longer than that of the first abutting strip 21; the fixed disc 19 close to the power supply 17 is provided with a fourth driving member; and the fourth driving member is used to control the abutting column to slide along the arc-shaped groove 22.

[0064] The principle and beneficial effects of the above technical solution are as follows:

[0065] The double fixed disc 19 linkage mechanism is adopted to realize the 360° full utilization of the target 34. When both sides of the target 34 are completed sputtering, the fourth driving member is used to adjust the position of the second abutting plate 23 to the upper and lower sides of the target 34, so that the second abutting strip 24 is extended under the action of the second spring damper, and the upper and lower sides of the target 34 are clamped through the longer extension distance; at the same time, the first abutting strip 21 is retracted to release the clamping. At this time, the fourth driving member drives the fixed disc 19 to rotate, so that the region of the target 34 originally blocked by the first abutting strip 21 is completely exposed, and the utilization rate of the target 34 is improved.

[0066] In the embodiment, the fourth driving member includes a rotary motor; the power end of the rotary motor is provided with a linkage strip 25; the side of the linkage strip 25 close to the arc-shaped groove 22 is provided with two abutting motors 26; and the power end of each abutting motor 26 extends into the arc-shaped groove 22 and is coaxially connected with the corresponding abutting column.

[0067] The principle and beneficial effects of the above technical solution are as follows:

[0068] The rotating motor drives the linkage strip 25 to rotate, thereby driving the abutting column to slide along the arc-shaped slot 22 through the abutting motor 26, and further adjusting the position of the second abutting plate 23; meanwhile, before the second abutting strip works, the abutting motor 26 drives the abutting column to rotate, so that the second abutting plate 23 rotates to the outside together with the second abutting strip 24, avoiding shielding the target material 34.

[0069] In the embodiment, the rotating base 27 is arranged in the sputtering tank 1; the gap 28 is arranged in the fixed frame 5; the target material sputtering mechanism 3 is driven by the rotating base 27 to pass through the gap 28 and reach the other side of the substrate 35.

[0070] Specifically, the sputtering tank 1 further comprises a bolted bottom cover 29; an annular slot coaxial with the sputtering tank 1 is formed at one end of the sputtering tank 1 away from the tank cover 2; the rotating base 27 is coaxially arranged in the annular slot; the bottom motor 30 is arranged in the bottom cover 29; the power end of the bottom motor 30 is coaxially connected to one side of the rotating base 27 away from the tank cover 2; the third driving member is a sputtering motor arranged at one side of the rotating base 27 close to the bottom cover 29; the power end of the sputtering motor is rotatably penetrated through the rotating base 27 and coaxially connected to the adjacent fixed disc 19; the number of permanent magnets 18 is two, one of which is arranged in the sputtering tank 1 through two C-shaped clamping plates 31 and located at one side of the target material 34 away from the substrate 35, and the other permanent magnet 18 is arranged in the sputtering tank 1 through two C-shaped clamping plates 31 and located on the inner wall of the sputtering tank 1 below the substrate 35, and the two permanent magnets 18 are arranged with the axis of the sputtering tank 1 as the center.

[0071] Specifically, the first motor, the second motor, the driving motor, the rotating motor, the bottom motor 30 and the sputtering motor are all selected as servo motors.

[0072] The principle and beneficial effects of the above technical solution are as follows:

[0073] The rotating base in the sputtering tank 1 is driven by the bottom motor 30 to drive the target material 34 mechanism to realize 180° position switching in the gap 28 of the fixed frame 5, so that the target material 34 can alternately act on the upper and lower surfaces of the substrate 35; the two symmetrically arranged permanent magnets 18 are fixed by the C-shaped clamping plates 31 to ensure that the target material 34 can form a stable magnetron sputtering environment in the upper and lower stations, and the detachable bottom cover 29 realizes the full-automatic double-sided coating process in the vacuum cavity.

[0074] A preparation method of a pulse magnetron sputtering coating device, comprising the following steps:

[0075] Substrate 35 loading and positioning

[0076] S1, open the tank cover 2, place the substrate 35 between the two clamping members; start the first motor to drive the double-headed screw 13, so that the clamping plate 9 moves synchronously to clamp the substrate 35; test the reciprocating movement function of the substrate 35 driven by the clamping roller 10 through the second motor driving the chain wheel system.

[0077] Target 34 loading and calibration

[0078] S2, place the target 34 between the two fixed disks 19; the first clamping strip 21 automatically clamps the target 34 under the action of the first spring damper; test the rotation switching function of the target 34 through the fourth driving member: the clamping motor 26 adjusts the position of the second clamping plate 23; the rotation motor realizes 180° target surface switching.

[0079] Vacuum system preparation

[0080] S3, close all valves, start the vacuum pump to extract the base vacuum, fill high-purity argon through the through-hole valve, and maintain the working gas.

[0081] Double-sided alternating film deposition

[0082] S4, upper film deposition stage: start the upper permanent magnet 18 to form a magnetron field, apply a pulse power source 17 to synchronously drive the clamping roller 10 to make the substrate 35 reciprocate.

[0083] S5, lower film deposition switching: start the rotation motor to drive the target 34 mechanism to rotate 180°, the lower permanent magnet 18 automatically forms a new magnetron field; repeat the film deposition process.

[0084] Target 34 surface switching

[0085] S6, when the single-sided wear of the target 34 reaches the threshold value: the second clamping strip 24 extends to replace the first clamping strip 21, the sputtering motor drives the fixed disk 19 to rotate 180°

[0086] S7, full use of the target 34: adjust the clamping column position through the fourth driving member to realize 360° area sputtering of the target 34.

[0087] Process termination

[0088] S8, turn off the pulse power source 17 and the gas supply; after breaking the vacuum, take out the substrate 35; disassemble the tank cover 2 to replace or maintain the target 34.

[0089] Although the present application has been described with reference to a number of explanatory embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the scope of the principles disclosed herein. More particularly, many modifications and variations of the present subject matter can be made in the light of the above teachings. The present embodiments are meant to be illustrative and not restrictive. All such modifications and variations are meant to be within the scope of the application, as set forth in the appended claims. Other uses will be apparent to those skilled in the art.

Claims

1. A pulsed magnetron sputtering coating preparation device, characterized in that: It includes a horizontally arranged sputtering tank; a target sputtering mechanism and a substrate clamping mechanism are provided in the sputtering tank; the target sputtering mechanism is used to clamp and bombard the target material to generate target atoms; the substrate clamping mechanism is located directly below the target sputtering mechanism; the substrate clamping mechanism includes a fixed frame; the fixed frame is provided with clamping members symmetrically arranged with the axis of the sputtering tank as the center; each clamping member includes a clamping bar; a clamping groove is provided on the side opposite to the other clamping bar; two clamping plates that move relative to or back to each other are slidingly provided in the clamping groove; a slide groove is provided on the opposite side of the two clamping plates; a plurality of clamping rollers are rotatably provided in each slide groove; a first driving member is provided on the clamping bar; a second driving member is provided on the clamping plate; wherein the first driving member is used to drive the two clamping plates to move relative to each other, so that the clamping rollers on the two clamping members clamp the substrate to form a clamping area; the second driving member is used to drive the clamping rollers to rotate, so that the substrate moves back and forth between the two clamping members, so that the clamping areas are exposed alternately.

2. The pulsed magnetron sputtering coating preparation device according to claim 1, characterized in that: The first driving member includes a first motor and a double-headed screw; the double-headed screw is rotatably arranged in a clamping groove; the double-headed screw has two threaded surfaces with opposite thread directions; the two clamping plates are respectively threadedly connected to the corresponding threaded surfaces; the first motor is arranged on the clamping bar, and the power end of the first motor rotates and extends into the clamping bar and is coaxially connected to one end of the double-headed threaded screw.

3. The pulsed magnetron sputtering coating preparation device according to claim 1, characterized in that: The second driving member includes a chain and a second motor; one of the two clamping plates is provided with multiple rotating shafts extending into the slide groove on the outer side, and one end of the rotating shaft is coaxially connected to the corresponding clamping roller; the other end of the multiple rotating shafts is provided with a first sprocket located outside the clamping plate; the second motor is provided on the clamping plate, and the power end is provided with a second sprocket; the first sprocket and the second sprocket are linked by a chain.

4. The pulsed magnetron sputtering coating preparation device according to claim 1, characterized in that: The target material sputtering mechanism includes a power supply, a permanent magnet and two fixed disks arranged in parallel; one of the fixed disks is rotatably set at the end of the sputtering tank through a third driving member; two first clamping plates are symmetrically arranged between the two fixed disks with the axis of the fixed disk as the center; first clamping grooves are opened on the opposite sides of the two first clamping plates; a first clamping bar extending through the first spring damper is provided in each of the first clamping grooves; the two first clamping bars are used to clamp the target material; the power supply is arranged on the other fixed disk; the permanent magnet is arranged in the sputtering tank and is located on the side of the target material facing away from the substrate; a through hole is opened on the sputtering tank; and an inflation valve is provided in the through hole.

5. The pulsed magnetron sputtering coating preparation device according to claim 4, characterized in that: Two arc-shaped grooves are provided on the two fixed disks with the axis as the center; a clamping column is provided in each of the two arc-shaped grooves for sliding and rotating; a second clamping plate parallel to the first clamping plate is provided between the two clamping columns; a second clamping groove is provided on the opposite side of the two second clamping plates; a second clamping strip is provided in the second clamping groove through a second spring damper; the extension distance of the second clamping strip is longer than that of the first clamping strip; a fourth driving member is provided on the fixed disk close to the power supply; the fourth driving member is used to control the clamping column to slide along the arc-shaped groove.

6. The pulsed magnetron sputtering coating preparation device according to claim 5, characterized in that: The fourth driving member includes a rotating motor; a linkage bar is provided at the power end of the rotating motor; two abutting motors are provided on the side of the linkage bar close to the arc groove; the power end of each abutting motor extends into the arc groove and is coaxially connected to the corresponding abutting column.

7. The pulsed magnetron sputtering coating preparation device according to claim 1, characterized in that: A rotating base is rotatably provided in the sputtering tank; a gap is provided in the fixing frame; and the target material sputtering mechanism is driven by the rotating base to pass through the gap and reach the other side of the substrate.

8. The pulsed magnetron sputtering coating preparation device according to claim 1, characterized in that: The sputtering tank comprises a tank cover; a fixing frame is connected to the tank cover; a guide rail parallel to the axis is arranged in the sputtering tank; and the fixing frame is slidably arranged on the guide rail.

9. A method for preparing a pulsed magnetron sputtering coating preparation device according to any one of claims 1 to 8, characterized in that: The following steps are involved: Substrate loading and positioning: S1. Open the tank lid and place the substrate between the two clamping members. Start the first motor to drive the double-headed screw, so that the clamping plate moves synchronously to clamp the substrate. Use the second motor to drive the sprocket system to test the reciprocating movement of the substrate by the clamping roller. Target loading and calibration: S2. Place the target between the two fixed plates; the first clamping bar automatically clamps the target under the action of the first spring damper; test the target rotation switching function through the fourth driving member: the clamping motor adjusts the position of the second clamping plate; the rotating motor realizes 180° target surface switching; Vacuum system preparation: S3. Close all valves, start the vacuum pump to pump to basic vacuum, and fill high-purity argon through the through-hole valve to maintain the working gas; Double-sided alternating coating: S4, upper coating stage: start the upper permanent magnet to form a magnetic control field and apply a pulse power supply to synchronously drive the clamping roller to make the substrate move back and forth; S5, lower coating switch: start the rotating motor to drive the target mechanism to rotate 180 degrees, and the lower permanent magnet automatically forms a new magnetic control field; repeat the coating process; Target surface switching: S6. When the target material single-side loss reaches a threshold value: the second abutting bar extends to replace the first abutting bar, and the sputtering motor drives the fixed plate to rotate 180 degrees; S7, full-circle utilization of target material: the position of the clamping column is adjusted by the fourth driving member to achieve 360° area sputtering of the target material; Process Termination: S8, turn off the pulse power supply and gas supply; remove the substrate after breaking the vacuum; Remove the tank cover for target replacement or maintenance.

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