A method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing power module

Abstract

The application discloses a flexible circuit board manufacturing method of a fine copper plating layer for a high-speed computing power module, an overflow tank is arranged at the top of an electroplating tank, an overflow circulation filtering system composed of a pump body and a filtering system is arranged at the electroplating tank to form an overflow electroplating tank, the liquid inlet and the liquid outlet of the overflow circulation filtering system are respectively connected with the bottom end of the overflow tank and the electroplating tank through pipelines, a metal mesh drag tank plate is manufactured and used to drag the overflow electroplating tank to form a drag tank overflow electroplating tank, a conductor clamping net frame with a hollow structure is manufactured to clamp a to-be-electroplated plate to form a to-be-electroplated combined plate, a supporting plate is arranged with the to-be-electroplated combined plate and placed in the drag tank overflow electroplating tank to be electroplated to form a flexible circuit board, and the overflow tank and the overflow circulation filtering system arranged at the top of the electroplating tank can effectively remove impurities in the electroplating tank body and solve the problem that the existing filtering system is difficult to remove surface floating matters.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board manufacturing, and in particular to a method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module. Background Technology

[0002] In high-speed computing system applications, the requirements for the lattice fineness and copper thickness uniformity of the circuit copper layer on the application circuit board are much higher than those for traditional circuit boards, in order to meet the needs of high-speed signal transmission and reduce signal loss and transmission instability.

[0003] However, there are many technical bottlenecks in the current copper plating process for this type of flexible circuit board that urgently need to be addressed:

[0004] Because flexible circuit boards are soft, and their flatness must be ensured during electroplating, existing technologies mostly use frame-type electroplating fixtures with two rows of clamps to hold the upper and lower ends of the board for fixation before electroplating.

[0005] However, for flexible circuit boards with high precision requirements for copper plating, this method of clamping only the top and bottom ends of the flexible circuit board, which causes the current to flow preferentially to the top and bottom ends of the board, results in the electric field lines acting preferentially on the top and bottom ends during electroplating. This can easily lead to the problem that the copper thickness at the top and bottom ends is greater than the copper thickness in the center area of ​​the board. If additional clamps are added to the left and right ends of the fixture to balance the current, the fixture will become bulky and the operation will be complicated, which will not only reduce the processing efficiency, but may also cause the board to be scrapped due to improper clamping.

[0006] During long-term use, the plating solution can easily become contaminated with impurities such as dry film debris and dust, which directly affects the smoothness of the electroplated copper surface and may even cause defects such as surface particles and protrusions.

[0007] For flexible circuit boards with increasingly high requirements for copper plating precision, existing filtration systems can filter the solution, but they are difficult to effectively remove impurities floating on the surface of the solution. Furthermore, long-term circulating filtration can cause tiny impurities to flow back into the tank, resulting in very limited filtration effect. It is difficult to achieve an effective filtration effect for such tiny impurities.

[0008] If the above filtration problems are solved by regularly maintaining the cylinder, it will not only consume a lot of manpower and time, but also require line shutdown for operation, which is costly and difficult to implement frequently.

[0009] In electroplating, to balance the electric field lines before and after the plate to be electroplated and to avoid excessive copper thickness at the edges of the plate, a plating plate is usually placed before and after the plate to be electroplated.

[0010] Currently, most of the copper plating boards used are bare copper boards (copper-clad laminates with bare copper surfaces). However, bare copper boards may generate impurities during the plating process and do not have adsorption and filtration functions, so they cannot help purify the electroplating solution. Furthermore, bare copper boards have a strong adsorption force on electric field lines and are prone to excessive adsorption of electric field lines, which makes it difficult for the edge copper thickness of the boards to be electroplated to meet the standard, thus affecting the plating precision.

[0011] When an electroplating line is shut down for an extended period (usually more than 12 hours), a plating tank removal process is required before restarting to activate the plating solution and adsorb impurities, thus preparing the production board (the board to be electroplated) for electroplating.

[0012] Existing plating processes often use blank circuit boards, copper-clad laminates, or scrapped copper-faced circuit boards. These materials are difficult to effectively remove minute impurities in the plating solution. For flexible circuit boards that require fine copper plating, the plating effect is limited, and it is difficult to guarantee the quality of subsequent electroplating.

[0013] Therefore, in order to solve the systemic problems in the electroplating process of high-speed computing flexible circuit boards mentioned above, it is necessary to provide a method for manufacturing flexible circuit boards with fine copper plating for high-speed computing modules. Summary of the Invention

[0014] This invention aims to solve the comprehensive problems of poor electroplating quality in existing flexible board processing methods, and proposes a method for manufacturing a flexible circuit board with a fine copper plating layer for high-speed computing modules. The method involves taking a flexible copper-clad laminate, processing it according to design data to form a board to be electroplated, and then processing the board to be electroplated in an electroplating tank to form the flexible circuit board. The manufacturing method includes the following steps:

[0015] S10: An overflow trough is provided at the top of the electroplating tank, and an overflow circulation filtration system is provided to the electroplating tank to form an overflow electroplating tank; the inlet and outlet of the overflow circulation filtration system are connected to the bottom of the overflow trough and the electroplating tank respectively through pipes, and the overflow circulation filtration system consists of a pump body and a filtration system;

[0016] S20: Take a metal plate, make a metal mesh plate to form a dragging plate; then use the dragging plate to drag the overflow electroplating tank to form a dragging overflow electroplating tank.

[0017] S30: Take a conductor mesh frame, remove the middle area of ​​the corresponding plate to be electroplated to form a conductor clamping mesh frame with a hollow structure, and then use the conductor clamping mesh frame to clamp the plate to be electroplated to form a composite plate to be electroplated.

[0018] S40: Take the plating plate; arrange the plating plate and the plate to be electroplated, place them in the overflow electroplating tank of the drag tank for electroplating, and after subsequent processing, form the flexible circuit board.

[0019] Furthermore, the overflow trough is located on the outside of the electroplating tank, and the top of the overflow trough is higher than the top of the electroplating tank.

[0020] Furthermore, an overflow baffle is added to the top of the side wall inside the electroplating tank. The bottom of the overflow baffle is fixed to the side wall and forms an overflow groove with an open top with the side wall. The height of the overflow baffle is lower than the top of the electroplating tank.

[0021] Furthermore, the mesh size of the metal mesh plate is between 100 and 500 mesh.

[0022] Furthermore, the metal mesh plate is made of stainless steel, titanium, titanium alloy, or aluminum.

[0023] Furthermore, the coating plate is composed of two steel meshes sandwiching a filter cloth, and the size of the filter cloth is smaller on one side than that of the steel mesh.

[0024] Furthermore, the plate to be electroplated includes a forming line, the area outside the forming line is a tool edge, and the edge of the hollow structure falls within the range of the tool edge in the plate to be electroplated.

[0025] Furthermore, the electroplating line is a gantry line, and the number of the surrogate plates on both sides of the plate to be plated is greater than or equal to one; the electroplating line is a vertical continuous electroplating line, and the number of the surrogate plates on both sides of the plate to be plated is greater than or equal to two.

[0026] Furthermore, several of the plates to be plated are arranged adjacently to form a plate group to be plated, and several of the plates to be plated are arranged to form a plate group to be plated, with two plates to be plated arranged on both sides of the adjacent plates to be plated.

[0027] Furthermore, after the electroplating is completed, the conductor clamping frame, the plating plate, and the drag plate can be sequentially subjected to film removal, first cleaning, plating removal, and second cleaning.

[0028] The technical solution of this invention has the following main advantages:

[0029] By installing an overflow trough and an overflow circulation filtration system at the top of the electroplating tank, a dual purification mechanism is formed in conjunction with the main circulation filtration system. This effectively removes impurities floating on the surface of the electroplating tank, solving the problem that existing filtration systems are unable to remove surface floating matter and significantly improving the cleanliness of the electroplating solution.

[0030] By setting a metal mesh plate as a drag plate, the overflow electroplating tank is dragged through. The mesh structure filters out tiny impurities in the chemical solution, while increasing the contact area with the chemical solution, thus rapidly improving the activity of the chemical solution and solving the problems of poor purification effect and low activation efficiency of traditional drag plate materials.

[0031] By setting the plating plate as a sandwich structure with two layers of steel mesh and a filter cloth in between, the steel mesh can balance the electric field lines of the plate to be electroplated, and the filter cloth can adsorb tiny impurities in the plating solution, improving the smoothness of the plating layer. This solves the problem that traditional plating plates (bright copper plates) can only balance the electric field but cannot purify the plating solution.

[0032] The plate is designed with a tool edge and a hollow steel mesh frame. The tool edge that holds the plated plate makes contact with the steel mesh to achieve uniform current conduction, avoiding the problem of excessive copper thickness at the edge caused by traditional fixtures that only hold the two ends, thus ensuring the accuracy of electroplating.

[0033] By setting up plating plates on both sides of the plate to be electroplated, the number of plating plates is increased, which not only strengthens the balance of electric field lines and solves the deviation of copper thickness at the edge, but also enhances the ability to adsorb impurities and improves the overall uniformity of electroplating.

[0034] The overflow device provides the foundation for the drag-on cylinder treatment, the drag-on cylinder activation prepares the environment for electroplating, and the plating plate and conductor clamping frame work together to optimize the electric field, ultimately forming a systematic technical correlation. The technologies of each process promote each other and realize the systematic technology of "chemical purification - chemical activation - electric field optimization - impurity adsorption - recycling". This effectively solves the systemic problems of high-speed computing power flexible circuit boards in the electroplating process and realizes high-precision processing of flexible circuit boards. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the process flow of an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of a drag-type overflow electroplating cylinder with a first type of overflow groove according to an embodiment of the present invention.

[0038] Figure 3 This is a schematic diagram of another type of overflow electroplating cylinder with a second type of overflow groove according to an embodiment of the present invention.

[0039] Figure 4 This is a plan view of the plate to be electroplated according to an embodiment of the present invention;

[0040] Figure 5 This is a plan view of the electroplating assembly plate according to an embodiment of the present invention;

[0041] Figure 6 for Figure 5 Schematic diagram of the AA section structure;

[0042] Figure 7 This is a cross-sectional schematic diagram of the plating plate according to an embodiment of the present invention;

[0043] Figure 8 This is a schematic diagram of the arrangement structure of the plate group to be electroplated and the plate group to be electroplated according to an embodiment of the present invention.

[0044] Explanation of reference numerals: 10, Overflow electroplating tank; 1010, First type of overflow tank; 1020, Overflow circulation filtration system; 1030, Main circulation filtration system; 1040, Spray pipe assembly; 1050, Electroplating chuck; 1060, Anode; 10A, Another type of overflow electroplating tank; 1010A, Overflow baffle; 1010B, Second type of overflow tank; 100, Electroplating tank; 200, Plate to be electroplated; 210, Dry film pattern; 300, Forming line; 400, Tool edge; 20, Assembly plate to be electroplated; 2010, Conductor clamping mesh frame; 30, Accompanying plate; 3010, First steel mesh; 3020, Second steel mesh; 3030, Filter cloth; 40, Arrangement structure; 4010, Assembly of plates to be electroplated; 4020, Accompanying plate assembly.

[0045] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0047] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0048] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0049] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0050] Please see Figure 1 , Figure 1 This is a schematic diagram of the process flow according to an embodiment of the present invention.

[0051] The manufacturing method includes the following steps: A flexible copper-clad laminate is taken and processed according to design data to form a plate to be electroplated 200. The plate to be electroplated 200 is then processed in an electroplating tank 100 to form a flexible circuit board.

[0052] Please see Figure 2 , Figure 2 This is a schematic diagram of a drag-type overflow electroplating cylinder with a first type of overflow groove according to an embodiment of the present invention.

[0053] Step S10:

[0054] An overflow trough 1010 is provided at the top of the electroplating tank 100, and an overflow circulation filtration system 1020 is provided to the electroplating tank 100 to form an overflow electroplating tank; the inlet 1021 and outlet 1022 of the overflow circulation filtration system 1020 are respectively connected to the bottom end of the first overflow trough 1010 and the electroplating tank 100 through pipes, and the overflow circulation filtration system 1020 consists of a pump body and a filtration system.

[0055] Optionally, the first overflow trough 1010 is disposed on the outside of the electroplating tank 100, and the top of the first overflow trough 1010 is higher than the top of the electroplating tank 100.

[0056] A first overflow trough 1010 is provided on the top of the electroplating tank 100 and installed on the outer side of the top of both sides of the tank body. The top of the first overflow trough 1010 is higher than the top of the electroplating tank 100. At the same time, the liquid level of the chemical solution in the first overflow trough 1010 is controlled to be lower than the top of the electroplating tank 100. The bottom of the first overflow trough 1010 is connected to the overflow circulation filtration system 1020 through a pipe. The system is then connected back to the electroplating tank 100 through another pipe to form a complete circulation loop.

[0057] The overflow circulation filtration system 1020 consists of a pump body and a filtration system. The entire overflow electroplating tank operation process is as follows: (Anodes 1060 are set on both sides of the electroplating tank 100, and spray pipe groups 1040 are set in the middle. Electroplating clamps 1050 hold the plates to be electroplated 200 and arrange them between the spray pipe groups 1040 on both sides.) During the electroplating process, the chemical solution in the tank will overflow naturally into the first overflow tank 1010 due to the height difference of the water flow. Then, it is transported to the overflow circulation filtration system 1020 through the pipeline. Driven by the pump body, the chemical solution is purified by the filtration system and then transported back into the tank to achieve continuous circulation and purification of the chemical solution.

[0058] It is worth noting that the electroplating tank 100 is equipped with a main circulation filtration system 1030 based on existing technology. The chemical solution in the tank is transported to the main circulation filtration system 1030 through pipelines. After being filtered by the main circulation filtration system 1030, it is transported to the spray pipe assembly 1040 through pipelines, which can further improve the removal effect of impurities in the chemical solution. The overflow circulation filtration system 1020 is further set up, especially for impurities floating on the surface of the chemical solution, forming a more comprehensive purification mechanism.

[0059] Please see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of another type of overflow electroplating cylinder with a second type of overflow groove according to an embodiment of the present invention. Figure 4 This is a planar schematic diagram of the plate to be electroplated according to an embodiment of the present invention.

[0060] Optionally, an overflow baffle 1010A is added to the top of the side wall inside the electroplating tank 100. The bottom of the overflow baffle 1010A is fixed to the side wall and forms a second overflow groove 1010B with an upper opening with the side wall. The height of the overflow baffle 1010A is lower than the top of the electroplating tank 100. The electroplating tank 100 forms another type of drag-over overflow electroplating tank 10A.

[0061] The operating logic of this implementation is basically the same as the overflow tank scheme set outside the electroplating tank 100. The chemical solution in the tank passes over the overflow baffle 1010A and enters the tank. After being purified by the overflow circulation filtration system 1020 through the pipeline, it flows back to the electroplating tank 100 to remove impurities. This scheme does not require replacing the tank body and can enable old equipment to have overflow filtration function while controlling costs.

[0062] Optionally, the overflow baffle 1010A can be fixed inside the electroplating tank 100 by welding, bonding or other methods.

[0063] Optionally, the overflow baffle 1010A can be a segmented structure, forming several overflow baffles 1010A, which are evenly distributed on the side wall of the cylinder. This can make full use of the empty space inside the cylinder and disperse the processing risks, reducing systemic problems caused by a single overflow baffle 1010A.

[0064] Step S20:

[0065] Take a metal plate and make a metal mesh plate to form a drag plate (not shown in the attached figure); then use the drag plate to drag the overflow electroplating tank to form a drag overflow electroplating tank 10.

[0066] Optionally, the mesh size of the metal mesh can be from 100 to 500 mesh.

[0067] Metal plates are selected and processed into metal mesh plates, which are then used as drag plates. The drag plates are then placed in an overflow electroplating tank for drag treatment. After the treatment is completed, a drag overflow electroplating tank 10 is formed.

[0068] The mesh size of the metal mesh is between 100 and 500 mesh, with 300 or 400 mesh being preferred.

[0069] On the one hand, the mesh structure can filter impurities in the electroplating solution; on the other hand, the mesh design increases the contact area with the solution, which can improve the activity of the plating tank in a shorter time, effectively improve the efficiency of plating tank operation, and lay a good foundation for subsequent electroplating processes.

[0070] Optionally, the metal mesh can be made of stainless steel, titanium, titanium alloy or aluminum. Using a metal material with properties different from electroplated copper as the metal mesh can achieve the effect of removing only the copper adhering to the surface when using stripping solution to remove the plating and clean it in the future, thereby reducing (or avoiding) damage to the metal mesh itself.

[0071] Please see Figure 5 and Figure 6 , Figure 5 This is a plan view of the electroplating assembly plate according to an embodiment of the present invention; Figure 6 for Figure 5 A schematic diagram of the AA section structure.

[0072] Step S30:

[0073] Take a conductor mesh frame, remove the middle area corresponding to the plate to be electroplated 200, and form a conductor clamping mesh frame 2010 with a hollow structure. Then use the conductor clamping mesh frame 2010 to clamp the plate to be electroplated 200, and the whole assembly is formed into the plate to be electroplated 20.

[0074] Optionally, the plate to be electroplated 200 includes a forming line 300, and the area outside the forming line 300 is a tool edge 400. The edge of the hollow structure falls within the range of the tool edge 400 in the plate to be electroplated assembly 20.

[0075] In the structural design of the plate to be electroplated 200, the area outside the forming line 300 is the tool edge 400, and the hollow structure edge of the conductor clamping mesh frame 2010 must fall within the range of the tool edge 400. At the same time, the edge of the plate to be electroplated 200 is set as the exposed copper area (i.e. the edge area not covered by the dry film pattern 210). The setting of the exposed copper area provides a conductive basis for the steel mesh clamping, so that the copper layer of the edge of the plate to be electroplated 200 can fully contact the stainless steel mesh frame. The conductivity of the mesh frame is used to achieve uniform current conduction, which effectively avoids the problem of uneven current distribution caused by traditional clamps only clamping the two ends. Combined with the positioning function of the hollow structure, it not only ensures the clamping stability, but also optimizes the coating uniformity through the electric field balance effect of the steel mesh.

[0076] The conductor clamping frame 2010 provides stable structural support for subsequent electroplating processes and optimizes the electric field distribution. It also works in conjunction with the preceding overflow circulation filtration system 1020 and tank dragging treatment. The preceding processes have purified the electroplating solution and improved the tank activity. As a conductive medium, the conductor clamping frame 2010 can conduct uniform current to all parts of the plate to be electroplated 200. During electroplating, it can form a synergistic electric field environment with the plate to be electroplated 200, so that the plate to be electroplated 200 can form a uniform copper plating layer in a stable electric field and clean solution environment throughout the electroplating process, ultimately improving the precision and quality stability of the flexible circuit board.

[0077] Furthermore, the size of the removed intermediate region is smaller on one side than the size of the flexible circuit board, but larger than the size of the effective area of ​​the flexible circuit board.

[0078] The hollow structure formed must be precisely matched with the plate to be electroplated 200, and its edge must fall within the tool edge 400 of the plate to be electroplated 200. This ensures that the plate can be firmly clamped without covering the effective area to be electroplated, thus ensuring the electroplating accuracy.

[0079] Optionally, the conductor clamping frame 2010 is made of stainless steel.

[0080] On the one hand, stainless steel can form a stable electric field balance with the plate to be plated 200 during electroplating. Unlike titanium mesh, which cannot deposit copper layers, stainless steel mesh frames are plated with copper layers simultaneously with the plate to be plated 200. By expanding its own conductive area, it is equivalent to indirectly increasing the edge conductive area of ​​the plate to be plated 200. This can effectively absorb the uneven electric field lines that were originally concentrated at the edge of the plate, making the current distribution more uniform. This directly improves the problem of excessively thick copper at the edge caused by traditional fixtures that only clamp the two ends, and further improves the fineness of the plating layer.

[0081] On the other hand, stainless steel mesh frames have the advantage of recyclability. After electroplating, the copper layer deposited on the surface can be completely removed by conventional processes such as micro-etching and stripping without damaging the conductor holding mesh frame 2010 body, so that it can be reused for multiple batches of production, which is compatible with the long-term stable operation requirements of the overflow circulation filtration system 1020.

[0082] Optionally, the conductor clamping frame 2010 has a mesh count of 10 to 400.

[0083] For flexible circuit boards with different wiring densities, the electric field distribution is further optimized by dynamically matching the mesh count (10 to 400 meshes), which creates an effect similar to the wiring density of the board to be electroplated 200, thus helping to improve the uniformity of electroplating.

[0084] Please see Figure 7 , Figure 7 This is a cross-sectional schematic diagram of the plating plate according to an embodiment of the present invention.

[0085] Step S40:

[0086] Take a plating plate 30; arrange the plating plate 30 and the electroplating assembly plate 20, place them in the overflow electroplating tank 10 for electroplating, and after subsequent processing, form a flexible circuit board.

[0087] Optionally, the coating plate 30 is composed of two steel meshes (including the first steel mesh 3010 and the second steel mesh 3020) sandwiching the filter cloth 3030. The size of the filter cloth 3030 is smaller on each side than the first steel mesh 3010 and the second steel mesh 3020.

[0088] From the perspective of collaboration with the preceding process, the first steel mesh 3010 and the second steel mesh 3020 are preferably made of stainless steel, which continues the conductivity of the conductor clamping mesh frame 2010 in step S30, effectively balancing the electric field lines around the electroplating plate 200, and can also be reused (refer to the description of step S30, which will not be repeated here), in collaboration with the recycling mechanism of the drag plate.

[0089] The filter cloth 3030 has a smaller single-sided dimension than the first steel mesh 3010 and the second steel mesh 3020. This allows the electroplating solution to first pass through the filter cloth 3030 to adsorb tiny impurities (such as dry film debris and copper powder particles) when flowing through the plating plate 30. Then, it passes through the first steel mesh 3010 or the second steel mesh 3020 into the area to be electroplated. This effectively adsorbs impurities in the electroplating solution and improves the smoothness of the electroplated copper layer. Especially for vertical continuous electroplating processes, the pre-plating plate 30 can "pre-filter" the solution, preventing impurities from directly adhering to the surface of the plate to be electroplated 200. Together with the overflow circulation filtration system 1020, it forms a multi-layer purification barrier to ensure the processing of a high-precision plating layer.

[0090] Optionally, the mesh count of the first steel mesh 3010 and the second steel mesh 3020 are both 10 to 500 mesh. By approximately matching the mesh count and line density of the frame of the composite plate 20 to be electroplated, the uniformity of the electric field distribution is further optimized and the coating accuracy is improved.

[0091] Optionally, the filter cloth 3030 may be made of polyester, polypropylene, nylon, vinylon, or other composite filter materials that can withstand the erosion of electroplating chemicals without dissolving, and work synergistically with the overflow circulation filtration system 1020 in step S10. On this basis, the filter cloth 3030 can ensure long-term stable impurity adsorption capacity due to its corrosion resistance.

[0092] Optionally, the electroplating line is a gantry line, and the number of plating plates 30 on both sides of the adjacent plate to be electroplated 200 is greater than or equal to 1; the electroplating line is a vertical continuous electroplating line, and the number of plating plates 30 on both sides of the adjacent plate to be electroplated 200 is greater than or equal to 2. In actual production, it is preferred to have 4, 6 or 8.

[0093] By increasing the number of steel meshes to enhance the uniform distribution of electric field lines, and by using more 3030 filter cloths to stack up, the adsorption effect on chemical impurities is improved, which matches the high-precision production of the vertical continuous electroplating line.

[0094] Optionally, if the plate to be electroplated 200 includes a large plate to be electroplated and a small plate to be electroplated, the number of the auxiliary plates 30 between the large plate to be electroplated and the small plate to be electroplated is greater than or equal to 2, wherein the size of the auxiliary plates 30 gradually decreases from the side closer to the large plate to the side closer to the small plate to be electroplated, forming a stepped transition.

[0095] Please see Figure 8 , Figure 8 This is a schematic diagram of the arrangement structure of the plate group to be electroplated and the plate group to be electroplated according to an embodiment of the present invention.

[0096] Optionally, several plates to be electroplated 200 are arranged adjacently to form a plate group 4010, and several plates to be electroplated 30 are arranged to form a plate group 4020. The two plate groups 4020 are arranged on both sides of the adjacent plate group 4010 to be electroplated, forming an arrangement structure 40; this further improves the filtration and adsorption effect of the electroplating solution and improves the fineness and uniformity of electroplating.

[0097] Optionally, after electroplating, the conductor clamping frame 2010, the plating plate 30, and the drag plate can be subjected to film removal, first cleaning, plating removal, and second cleaning in sequence.

[0098] The film removal process is used to thoroughly remove the dry film impurities adsorbed by the conductor clamping frame 2010, the plating plate 30, and the drag plate during the electroplating process using a film removal solution. This prevents impurities from remaining and affecting the next use, ensuring that the tool surface is clean.

[0099] The first cleaning is to remove any remaining plating solution to ensure the plating removal effect.

[0100] The stripping process uses stripping solution to remove the copper layer formed by electroplating on the surface of the tool without damaging the tool body (stainless steel conductor clamping mesh frame 2010 and plating plate 30), and can restore its conductivity and filtration performance. This is compatible with the reusability requirement of conductor clamping mesh frame 2010 in step S30 and the recycling design of plating plate 30 in step S40.

[0101] The second cleaning removes any remaining plating solution, ensuring that the tool will not contaminate the plating solution the next time it is used.

[0102] Through this series of post-processing steps, the conductor clamping frame 2010, the plating plate 30, and the drag plate can be reused multiple times, which not only reduces production costs but also works in conjunction with the systematic design of the entire technical solution of "purification-electroplating-recycling" to ensure the stability of electroplating quality in continuous production.

[0103] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module, comprising taking a flexible copper-clad laminate, processing it into a plate to be electroplated according to design data, and processing the plate to be electroplated in an electroplating tank to form the flexible circuit board, characterized in that, The manufacturing method includes the following steps: S10: An overflow trough is provided at the top of the electroplating tank, and an overflow circulation filtration system is provided to the electroplating tank to form an overflow electroplating tank; The inlet and outlet of the overflow circulation filtration system are connected to the bottom of the overflow tank and the electroplating tank respectively through pipes. The overflow circulation filtration system consists of a pump body and a filtration system. S20: Take a metal plate, make a metal mesh plate to form a dragging plate; then use the dragging plate to drag the overflow electroplating tank to form a dragging overflow electroplating tank. S30: Take a conductor mesh frame, remove the middle area of ​​the corresponding plate to be electroplated to form a conductor clamping mesh frame with a hollow structure, and then use the conductor clamping mesh frame to clamp the plate to be electroplated to form a composite plate to be electroplated. The plate to be electroplated includes a forming line, the area outside the forming line is a tool edge, and the edge of the hollow structure falls within the range of the tool edge; S40: Take the plating plate; arrange the plating plate and the electroplating assembly plate, place them in the overflow electroplating tank of the drag tank for electroplating, and after subsequent processing, form the flexible circuit board; The coating plate consists of two steel meshes sandwiching a filter cloth, and the size of the filter cloth is smaller on one side than that of the steel mesh.

2. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, The overflow trough is located on the outside of the electroplating tank, and the top of the overflow trough is higher than the top of the electroplating tank.

3. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, An overflow baffle is added to the top of the side wall inside the electroplating tank. The bottom of the overflow baffle is fixed to the side wall and forms an overflow groove with an opening at the top with the side wall. The height of the overflow baffle is lower than the top of the electroplating tank.

4. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, The mesh size of the metal mesh plate is between 100 and 500 mesh.

5. A method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1 or 4, characterized in that, The metal mesh is made of stainless steel, titanium, titanium alloy or aluminum.

6. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, The electroplating line is a gantry line, and the number of the dummy plates on both sides of the plate to be plated is greater than or equal to 1; the electroplating line is a vertical continuous electroplating line, and the number of the dummy plates on both sides of the plate to be plated is greater than or equal to 2.

7. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, Several plates to be plated are arranged adjacently to form a plate group to be plated, and several plates to be plated are arranged to form a plate group to be plated. Two plates to be plated are arranged on both sides of an adjacent plate group to be plated.

8. The method for manufacturing a flexible circuit board with a fine copper plating layer for a high-speed computing module as described in claim 1, characterized in that, After the electroplating is completed, the conductor clamping frame, the plating plate and the drag plate are sequentially subjected to film removal, first cleaning, plating removal and second cleaning.

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