Heating unit and manufacturing method thereof

Abstract

The heat generating unit of the present invention is characterized by comprising: a substrate formed from a thermoplastic resin composition containing about 100 parts by weight of a polyaryletherketone resin and about 1 to about 20 parts by weight of an additive for laser direct structuring; and a plating layer formed on at least a partial region of a surface of the substrate by a laser direct structuring process and a plating process, in which the plating layer is a layer in which a copper plating layer and a nickel plating layer are laminated, the cross-sectional thickness of the plating layer is about 100 [mu] m to about 1,000 [mu] m, and the ratio of the cross-sectional thickness of the copper plating layer to the cross-sectional thickness of the nickel plating layer is about 1: 1 to about 1: 80. The heat generating unit is excellent in heat generating performance, plating reliability and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to a heating unit and a manufacturing method thereof. More particularly, the present application relates to a heating unit and a manufacturing method thereof, which are excellent in heating performance, plating reliability, etc. BACKGROUND

[0002] In order to plate a metal layer on at least a portion of the surface of a molded article formed of a thermoplastic resin composition, a laser direct structuring process (LDS process) can be used. The laser direct structuring process is a process performed before a plating step, which refers to a process of modifying a region to be plated on the surface of a molded article to have a property suitable for plating by irradiating a laser on the region to be plated on the surface of the molded article. To this end, a thermoplastic resin composition used to manufacture the molded article must contain a laser direct structuring additive (LDS additive) capable of forming a metal nucleus by a laser. The additive is decomposed and generates a metal nucleus when irradiated with a laser. In addition, the region after laser irradiation has a rough surface. Due to such a metal nucleus and surface roughness, the region modified by a laser becomes suitable for plating.

[0003] An electronic cigarette is an atomizing device that forms a vapor by vaporizing a liquid by applying heat thereto, and includes a vaporization portion for vaporizing the liquid. The vaporization portion is a heating unit that heats to vaporize the liquid when a power source is applied, and the vaporization portion of the electronic cigarette is usually in a form in which a metal coil such as copper is wound inside or outside a plastic cylinder. In the case of a vaporization portion (heating coil unit) in which a metal coil is applied, the maximum temperature thereof is about 250°C, and has a running time of about four minutes, including a temperature rise time of about 30 seconds to reach the maximum temperature.

[0004] Recently, research on manufacturing a heating unit by applying a metal plating process of a laser direct structuring process, instead of using a metal coil, has been started. In order to use the heating unit manufactured by the plating process as a heating unit of an electronic cigarette or the like, it is required to reach a temperature of 150°C in 100 seconds or less, thereby being excellent in heating performance, plating reliability, etc.

[0005] Therefore, there is a need to develop a heating unit and a manufacturing method thereof, which are excellent in heating performance, plating reliability, etc.

[0006] Background technologies of the present application are disclosed in Korean Published Patent No. 10-2011-0018319, etc. SUMMARY

[0007] An object of the present application is to provide a heating unit which is excellent in heating performance, plating reliability, etc.

[0008] Another object of the present application is to provide a manufacturing method of the heating unit.

[0009] The above and other objects of the present application can be achieved by the present application described hereinafter.

[0010] 1. In one aspect, the present application relates to a heat generating unit. The heat generating unit includes: a substrate formed of a thermoplastic resin composition including about 100 parts by weight of a polyaryletherketone resin and about 1 to about 20 parts by weight of an additive for laser direct structuring; and a plated layer formed on at least a portion of a surface of the substrate by a laser direct structuring process and a plating process, wherein the plated layer is a layer in which a copper plated layer and a nickel plated layer are laminated, a cross-sectional thickness of the plated layer is about 100 μm to about 1,000 μm, and a cross-sectional thickness ratio of the copper plated layer to the nickel plated layer is about 1:1 to about 1:80.

[0011] 2. In the above-mentioned item 1, the polyaryletherketone resin can include a repeating unit represented by the following Chemical Formula 1.

[0012] [Chemical Formula 1]

[0013]

[0014] 3. In the above-mentioned item 1 or 2, for the polyaryletherketone resin, a melt viscosity measured by a capillary viscometer at a temperature of 400°C and a shear rate of 1000 sec -1 may be about 50 Pa·s to about 500 Pa·s according to ASTM D3835.

[0015] 4. In the above-mentioned item 1 to 3, the additive for laser direct structuring can include one or more of a heavy metal complex oxide spinel and a copper salt.

[0016] 5. In the above-mentioned item 1 to 4, the plating process can include a chemical copper plating step, an electrolytic copper plating step, and an electrolytic nickel plating step.

[0017] 6. In the above-mentioned item 1 to 5, the plating process can include a chemical nickel plating step, an electrolytic nickel plating step, and an electrolytic copper plating step.

[0018] 7. In the above-mentioned item 1 to 6, for the plated layer, a maximum temperature measured by a thermal imaging camera when a current of 20 A and a voltage of 10 V are applied can be about 200°C to about 300°C.

[0019] 8. In the above-mentioned item 1 to 7, for the plated layer, a time to reach 150°C measured by a thermal imaging camera after a current of 20 A and a voltage of 10 V are applied can be about 1 second to about 100 seconds.

[0020] 9. In the above embodiments 1 to 8, for the thermoplastic resin composition, after an injection-molded test piece of 50 mm x 90 mm x 3.2 mm in size is aged at 25°C for 6 hours, the surface of the test piece is activated in a stripe pattern by a laser direct molding process, and a plating layer is formed on the activated surface by a plating process, then the test piece on which plating is completed is placed in a chamber at 85°C, 85% RH for 72 hours, and after 100 grids of 1 mm x 1 mm in size are engraved on the plating layer, the number of grids that are not peeled off when peeled off with a tape is about 90 to about 100.

[0021] 10. In the above embodiments 1 to 9, for the thermoplastic resin composition, after an injection-molded test piece of 50 mm x 90 mm x 3.2 mm in size is aged at 25°C for 6 hours, the surface of the test piece is activated in a stripe pattern by a laser direct molding process, and a plating layer is formed on the activated surface by a plating process, then the test piece on which plating is completed is placed in a chamber at 250°C for 200 hours, and after 100 grids of 1 mm x 1 mm in size are engraved on the plating layer (copper layer), the number of grids that are not peeled off when peeled off with a tape is about 90 to about 100.

[0022] 11. Another aspect of the present application relates to a manufacturing method of a heat generating unit. The manufacturing method includes the steps of: manufacturing a substrate from a thermoplastic resin composition containing about 100 parts by weight of a polyaryletherketone resin and about 1 to about 20 parts by weight of an additive for laser direct molding; irradiating laser light to at least a part of the surface of the substrate; electroless plating copper or nickel on the region after laser irradiation; electrolytic plating copper or nickel on the plating layer after electroless plating copper or nickel; and electrolytic plating nickel or copper on the plating layer after electrolytic plating copper or nickel to form a plating layer, wherein the plating layer is a layer in which a copper plating layer and a nickel plating layer are laminated, the cross-sectional thickness of the plating layer is about 100 μm to about 1,000 μm, and the cross-sectional thickness ratio of the copper plating layer to the nickel plating layer is about 1:1 to about 1:80.

[0023] 12. In the above embodiment 11, the substrate can be manufactured by injection molding the thermoplastic resin composition using an injection molding machine at a molding temperature of about 380°C to about 480°C and a mold temperature of about 50°C to about 200°C.

[0024] 13. In the above embodiments 11 or 12, the wavelength of the laser light can be 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm, or 10,600 nm.

[0025] 14. In Embodiments 11 to 13, the electroless plating of copper can be performed for about 10 minutes to about 40 minutes in an electroless copper plating solution at about 55°C, and the electroless plating of nickel can be performed for about 10 minutes to about 40 minutes in an electroless nickel plating solution at about 50°C.

[0026] 15. In Embodiments 11 to 14, the electrolytic plating of copper can be performed for about 1 minute to about 3,000 minutes at a current density of about 10 A / dm 2 , and the electrolytic plating of nickel can be performed for about 1 minute to about 3,000 minutes at a current density of about 5 A / dm 2 .

[0027] The present application has the effect of providing a heating unit having excellent heating performance, plating reliability, and the like, and a manufacturing method thereof. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A heating unit of one embodiment of the present application is schematically shown. DETAILED DESCRIPTION

[0029] Hereinafter, the present application is described in detail as follows.

[0030] The heating unit of the present application includes: (A) a substrate formed of a thermoplastic resin composition; and (B) a plated layer.

[0031] In the present specification, "a to b" indicating a numerical range is defined as "≥ a and ≤ b".

[0032] (A) Substrate

[0033] The substrate of one embodiment of the present application is formed of a thermoplastic resin composition for a laser direct structuring process (LDS process) containing (a) a polyaryletherketone resin and (b) an additive for laser direct structuring.

[0034] (a) Polyaryletherketone Resin

[0035] The polyaryletherketone resin of one embodiment of the present application is a resin that can improve plating reliability, heat resistance, and the like of a heating unit, and a polyaryletherketone resin conventionally used for a thermoplastic resin composition can be used.

[0036] In the embodiment, a polyaryletherketone resin (polyether ether ketone resin, etc.) containing a repeating unit represented by the following Chemical Formula 1 can be used.

[0037] [Chemical Formula 1]

[0038]

[0039] In a specific example, for the polyaryletherketone resin, the melt viscosity measured by a capillary viscometer under a shear rate condition of 1000 sec"1at a temperature of 400°C according to ASTM D3835 is about 50 Pa-s to about 500 Pa-s, for example, about 100 Pa-s to about 400 Pa-s. Within the above range, plating reliability, heat resistance, and the like of the heating unit can be excellent. -1 The melt viscosity measured by a capillary viscometer under a shear rate condition can be about 50 Pa-s to about 500 Pa-s, for example, about 100 Pa-s to about 400 Pa-s. Within the above range, plating reliability, heat resistance, and the like of the heating unit can be excellent.

[0040] (b) laser direct structuring additive

[0041] The laser direct structuring (LDS) additive of one specific example of the present application is a substance capable of forming a metal nucleus by laser, and a laser direct structuring additive conventionally used for a resin composition for laser direct structuring can be used. Here, the laser refers to light amplified by stimulated emission (stimulated emission light), and the laser can be ultraviolet light having a wavelength of about 100 nm to about 400 nm, visible light having a wavelength of about 400 nm to about 800 nm, or infrared light having a wavelength of about 800 nm to about 25,000 nm, for example, infrared light having a wavelength of about 1,000 nm to about 2,000 nm.

[0042] In a specific example, the laser direct structuring additive can include a heavy metal mixture oxide spinel and / or a copper salt.

[0043] In a specific example, the heavy metal mixture oxide spinel can be exemplified by magnesium aluminum oxide (MgAl2O4), zinc aluminum oxide (ZnAl2O4), iron aluminum oxide (FeAl2O4), copper iron oxide (CuFe2O4), copper chromium oxide (CuCr2O4), manganese iron oxide (MnFe2O4), nickel iron oxide (NiFe2O4), titanium iron oxide (TiFe2O4), iron chromium oxide (FeCr2O4), magnesium chromium oxide (MgCr2O4), combinations thereof, and the like. For example, copper chromium oxide (CuCr2O4) can be used. The copper chromium oxide (CuCr2O4) can be applied when the desired color of the final molded product is a dark color such as black, gray, and the like, since it has a dark color.

[0044] In embodiments, the copper salt can be exemplified by copper hydroxide phosphate, copper phosphate, copper sulfate, cuprous thiocyanate, combinations thereof, and the like, but is not limited thereto. For example, copper hydroxide phosphate can be used. The copper hydroxide phosphate is a compound in which copper phosphate is combined with copper hydroxide, and can be specifically Cu3(PO4)2·2Cu(OH)2, Cu3(PO4)2·Cu(OH)2, and the like. The copper hydroxide phosphate does not reduce the color reproducibility of an additional colorant, and thus a molded product of a desired color can be easily obtained.

[0045] In embodiments, the additive for laser direct structuring can have an average particle diameter of about 0.01 μm to about 50 μm, for example, about 0.1 μm to about 30 μm, specifically about 0.5 μm to about 10 μm. Within the above range, a plated surface can be uniformly formed when plating is performed by laser direct structuring. In the present application, unless otherwise specified, the average particle diameter refers to a number average diameter, and refers to a value measured for D50 (particle diameter at a distribution rate of 50%).

[0046] In embodiments, about 1 parts by weight to about 20 parts by weight, for example, about 5 parts by weight to about 15 parts by weight, of the additive for laser direct structuring can be included with respect to about 100 parts by weight of the polyaryletherketone resin. When the content of the additive for laser direct structuring is less than about 1 parts by weight with respect to about 100 parts by weight of the polyaryletherketone resin, a sufficient amount of a metal nucleus for plating can not be formed when laser is irradiated to the thermoplastic resin composition (substrate), resulting in plating failure or a decrease in plating reliability, and when it exceeds about 20 parts by weight, plating reliability, mechanical properties, and the like of the thermoplastic resin composition (substrate) can decrease.

[0047] The thermoplastic resin composition of one embodiment of the present application can further include an additive conventionally included in a thermoplastic resin composition. The additive can be exemplified by an inorganic filler, a flame retardant, an anti-dripping agent, a lubricant, a nucleating agent, a stabilizer, a release agent, a pigment, a dye, a mixture thereof, and the like, but is not limited thereto. When the additive is used, the content of the additive can be about 0.001 parts by weight to about 40 parts by weight, for example, about 0.1 parts by weight to about 10 parts by weight, with respect to about 100 parts by weight of the polyaryletherketone resin.

[0048] The thermoplastic resin composition of one embodiment of the present application can be in the form of a pellet obtained by mixing the components and melt-extruding using a general-purpose twin-screw extruder at a temperature of about 360°C to about 420°C, for example, about 380°C to about 410°C.

[0049] In one embodiment, for the thermoplastic resin composition, after a 50 mm x 90 mm x 3.2 mm injection-molded test piece is aged at 25°C for 6 hours, the surface of the test piece is activated in a stripe pattern by a laser direct structuring process, and a plating layer is formed on the activated surface by a plating process, the test piece on which plating is completed is placed in a chamber at 85°C, 85% RH for 72 hours, and after 100 grids of 1 mm x 1 mm are engraved on the plating layer (copper layer), the number of grids that are not peeled when peeled with a tape can be about 90 to about 100.

[0050] In one embodiment, for the thermoplastic resin composition, after a 50 mm x 90 mm x 3.2 mm injection-molded test piece is aged at 25°C for 6 hours, the surface of the test piece is activated in a stripe pattern by a laser direct structuring process, and a plating layer is formed on the activated surface by a plating process, the test piece on which plating is completed is placed in a chamber at 250°C for 200 hours, and after 100 grids of 1 mm x 1 mm are engraved on the plating layer (copper layer), the number of grids that are not peeled when peeled with a tape can be about 90 to about 100.

[0051] A substrate of one embodiment of the present application is formed of the thermoplastic resin composition. For example, a molded article can be produced by a molding method such as injection molding, compression molding, blow molding, or extrusion molding using the thermoplastic resin composition. The substrate can be easily formed by a person with ordinary knowledge in the field to which the present application pertains.

[0052] (B) Plating layer

[0053] A plating layer of one embodiment of the present application is a layer formed on at least a part of the surface of the substrate by a laser direct structuring process and a plating process, and is formed of a copper plating layer and a nickel plating layer laminated. The cross-sectional thickness of the plating layer can be about 100 to about 1,000 μm, and the cross-sectional thickness ratio of the copper plating layer to the nickel plating layer can be about 1: 1 to about 1:80.

[0054] In one embodiment, the plating process can include a chemical copper plating step, an electrolytic copper plating step, and an electrolytic nickel plating step. In this case, a plating layer in which a copper plating layer and a nickel plating layer are sequentially laminated on a part of the surface of the substrate can be obtained.

[0055] In an embodiment, the plating process can include a chemical nickel plating step, an electrolytic nickel plating step, and an electrolytic copper plating step. In this case, a plated layer in which a nickel plated layer and a copper plated layer are sequentially stacked on a part of the surface of the substrate can be obtained.

[0056] In an embodiment, for the plated layer, the cross-sectional thickness measured by SEM / EDS (scanning electron microscope / energy dispersive spectroscopy) can be about 100 μm to about 1,000 μm, for example, about 100 μm to about 700 μm. When the cross-sectional thickness of the plated layer is less than about 100 μm, plating reliability and the like can be decreased, and when it exceeds about 1,000 μm, heat generation performance and the like can be decreased.

[0057] In an embodiment, for the plated layer, the cross-sectional thickness ratio (copper plated layer:nickel plated layer) of the copper plated layer and the nickel plated layer measured by SEM / EDS (scanning electron microscope / energy dispersive spectroscopy) can be about 1:1 to about 1:80, for example, about 1:1.1 to about 1:50. When the cross-sectional thickness ratio of the plated layer is less than about 1:1, heat generation performance, plating reliability, and the like can be decreased, and when it exceeds about 1:80, heat generation performance and the like can be decreased.

[0058] In an embodiment, for the plated layer, the maximum temperature measured by a thermal imaging camera when a current of 20 A and a voltage of 10 V are applied can be about 200°C to about 300°C, for example, about 230°C to about 280°C.

[0059] In an embodiment, for the plated layer, the time to reach 150°C measured by a thermal imaging camera after a current of 20 A and a voltage of 10 V are applied can be about 1 second to about 100 seconds, for example, about 5 seconds to about 60 seconds.

[0060] An embodiment of the heating unit of the present application includes the substrate and the plated layer, and has excellent heat generation performance, plating reliability, and the like, and thus can be used as a vaporization portion (heating unit) of an electronic cigarette, an internal circuit of an induction heating device, and the like. In particular, when the heating unit is used as a vaporization portion of an electronic cigarette, the shape of the substrate can be cylindrical, and the plated layer can be formed in a pattern similar to a coil on the inside or outside of the cylindrical substrate.

[0061] Figure 1 A heating unit of an embodiment of the present application is schematically shown. In the drawing, the dimensions of the structural elements constituting the invention are shown enlarged for the sake of clarity of the description, but are not limited thereto. As shown in Figure 1 A heating unit 10 of an embodiment of the present application can include a substrate 20, and a plated layer 30 formed on at least a part of the surface of the substrate 20 by a laser direct structuring process and a plating process.

[0062] The heat generating unit 10 of one embodiment of the present application can be manufactured by a manufacturing method including the following steps: manufacturing a substrate 20 from the thermoplastic resin composition; irradiating laser light on at least a part of the surface of the substrate 20 (plating layer 30 region); electroless plating of copper or nickel on the region after laser light irradiation; electrolytic plating of copper or nickel on the plating layer after electroless plating of copper or nickel; and electrolytic plating of nickel or copper on the plating layer after electrolytic plating of copper or nickel to form the plating layer 30.

[0063] In one embodiment, the substrate 20 can be manufactured by injection molding the thermoplastic resin composition using an injection molding machine under conditions of a molding temperature of about 380 °C to about 480 °C and a mold temperature of about 50 °C to about 200 °C.

[0064] In one embodiment, the laser light irradiation causes the additive for laser direct structuring included in the substrate 20 to decompose and form a metal nucleus. In addition, the region after laser light irradiation (plating layer 30 region) has a surface roughness suitable for plating. The wavelength of the laser light can be 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm, or 10,600 nm.

[0065] In one embodiment, the electroless plating (metallization) process of copper or nickel can be performed by a conventional electroless plating process. For example, the electroless plating layer of copper or nickel can be formed on the region after laser light irradiation on the surface of the substrate 20 by immersing the substrate 20 after laser light irradiation in one or more electroless plating tanks.

[0066] In one embodiment, the electrolytic plating process of copper or nickel and the electrolytic plating process of nickel or copper can be performed by a conventional electrolytic plating process. For example, the plating layer 30 can be finally formed on the region after laser light irradiation on the surface of the substrate 20 by immersing the substrate 20 after electroless plating of copper or nickel in one or more electrolytic plating tanks to electrolytic plate copper or nickel on the plating layer after electroless plating of copper or nickel, and then electrolytic plate nickel or copper on the plating layer after electrolytic plating of copper or nickel.

[0067] In one embodiment, the electroless plating of copper can be performed for about 10 minutes to about 40 minutes in a copper electroless plating solution (Circuposit 4500 or the like) at about 55 °C, and the electroless plating of nickel can be performed for about 10 minutes to about 40 minutes in a nickel electroless plating solution (Ronamax SMT-115 or the like) at about 50 °C.

[0068] In one embodiment, the electrolytic plating of copper can be performed for about 1 minute to about 3,000 minutes at a current density of about 10 A / dm 2 2 ​at a current density of 0.1 A / dm2to 100 A / dm2for about 1 minute to about 3,000 minutes. Within the above range, a plating layer having a desired total cross-sectional thickness of the plating layer and a ratio of the cross-sectional thickness of the copper plating layer to the cross-sectional thickness of the nickel plating layer can be formed.

[0069] Thus, the heating unit 10 in which the plating layer 30 is formed on at least a part of the surface of the substrate 20 by the laser direct structuring process can be easily formed by a person having ordinary knowledge in the field of the present application.

[0070] Hereinafter, the present application will be described more specifically by way of examples, but the examples are for illustrative purposes only and should not be construed as limiting the present application.

[0071] Examples

[0072] Hereinafter, the specifications of each component used in the examples and comparative examples are as follows.

[0073] (A) Polyaryletherketone Resin

[0074] (A1) A polyether ether ketone resin (manufacturer: Victrex, product name: 150G, melt viscosity: about 130 Pa-s) was used.

[0075] (A2) A polyether ether ketone resin (manufacturer: Victrex, product name: 450G, melt viscosity: about 350 Pa-s) was used.

[0076] (B) Additive for Laser Direct Structuring

[0077] (B1) Basic copper phosphate (manufacturer: Merck performance materials, product name: Iriotec 8840) was used. ®

[0078] (B2) Copper chromium oxide (CuCr2O4, manufacturer: SHEPHERD, product name: Black 1G) was used.

[0079] Examples 1 to 3 and Comparative Examples 1 to 5

[0080] ​After adding each of the above-mentioned components in the amounts described in Tables 1 and 2 below, pellets of the thermoplastic resin composition were prepared by extrusion at about 380°C. The pellets were prepared using a twin-screw extruder having an L / D of 36 and a diameter of 36 mm, and were dried at about 100°C for more than about 4 hours. The pellets were then injection-molded into a substrate sample using a 10 Oz injection molding machine (molding temperature: about 400°C, mold temperature: about 150°C). Next, a copper and / or nickel plating layer was formed on the substrate sample as described in Tables 1 and 2 below, and a heating element sample was prepared. Here, the electroless plating of copper (Examples 1 to 3, Comparative Examples 1 to 4) was performed in an electroless copper plating solution (Circuposit 4500) at about 55°C for about 10 minutes to about 40 minutes, and the electroless plating of nickel (Comparative Example 5) was performed in an electroless nickel plating solution (Ronamax SMT-115) at about 50°C for about 10 minutes to about 40 minutes. In addition, the electrolytic plating of copper (Examples 1 to 3, Comparative Examples 1 to 4) was performed at a current density of about 10 A / dm 2 to about 3,000 minutes, and the electrolytic plating of nickel (Examples 1 to 3, Comparative Examples 2 to 5) was performed at a current density of about 5 A / dm 2 to about 3,000 minutes. The physical properties of the prepared heating element sample were evaluated by the following methods, and the results are shown in Tables 1 and 2 below.

[0081] Physical property measurement method

[0082] (1) Maximum plating layer temperature: After applying a current of 20 A and a voltage of 10 V to the plating layer of the heating element sample prepared in the examples and comparative examples, the maximum temperature (unit: °C) of the plating layer was measured using a thermal imaging camera (manufacturer: FLIR, device name: T335).

[0083] (2) Time for the plating layer temperature to reach 150°C: After applying a current of 20 A and a voltage of 10 V to the plating layer of the heating element sample prepared in the examples and comparative examples, the time (unit: seconds) for the plating layer temperature to reach 150°C was measured using a thermal imaging camera (manufacturer: FLIR, device name: T335).

[0084] (3) High humidity plating reliability evaluation: After aging an injection-molded sample (substrate sample) having dimensions of 50 mm x 90 mm x 3.2 mm at 25°C for 6 hours, the surface of the sample was activated in a stripe pattern by a laser direct structuring process, and a copper and / or nickel plating layer was formed as described in Tables 1 and 2 below. After the plating was completed, the sample was placed in a chamber at 85°C and 85% RH for 72 hours, and after 100 1 mm x 1 mm grids were engraved on the plating layer (copper layer), the number of grids that were not peeled off when peeled off with tape was measured.

[0085] (4) High temperature plating reliability evaluation: After aging 50 mm x 90 mm x 3.2 mm size injection molded test pieces at 25°C for 6 hours, the surface of the test pieces was activated in stripe form by a laser direct forming process, and a copper and / or nickel plating layer was formed as described in Table 1 and Table 2 below, after which the plated test pieces were placed in a chamber at 250°C for 200 hours, and after 100 1 mm x 1 mm sized grids were engraved on the plating layer (copper layer), the number of grids that were not peeled off when peeled off with a tape was measured.

[0086] [Table 1]

[0087]

[0088] [Table 2]

[0089]

[0090] From the above results, it can be seen that the heat generating unit of the present application is excellent in heat generating performance (maximum temperature, time to reach 150°C), high humidity and high temperature plating reliability, etc.

[0091] On the other hand, in the case of Comparative Example 1 in which a nickel plating layer was not applied and the plating layer cross-sectional thickness exceeded the range of the present application, it was found that the heat generating performance, etc. decreased; in the case of Comparative Example 2 in which the plating layer cross-sectional thickness exceeded the range of the present application and the cross-sectional thickness ratio of the copper plating layer to the nickel plating layer exceeded the range of the present application, it was found that the heat generating performance, etc. decreased. Further, in the case of Comparative Example 3 in which the cross-sectional thickness ratio of the copper plating layer to the nickel plating layer was less than the range of the present application, it was found that the heat generating performance, high humidity and high temperature plating reliability, etc. decreased; in the case of Comparative Example 4 in which the plating layer cross-sectional thickness was less than the range of the present application, it was found that the high humidity and high temperature plating reliability, etc. decreased; and in the case of Comparative Example 5 in which a copper plating layer was not applied, it was found that the high humidity and high temperature plating reliability, etc. decreased.

[0092] The present application has been described above centering on the examples. It should be understood by those having ordinary knowledge in the field to which the present application pertains that the present application can be realized in modified forms without departing from the essential characteristics of the present application. Therefore, the disclosed examples should not be considered in a limiting sense, but should be considered in an illustrative sense. The scope of the present application is not limited by the above description, but is embodied in the claims, and should be interpreted to include all differences within the equivalent range of the present application.

Claims

1. A heating unit, characterized in that, include: The substrate is formed of a thermoplastic resin composition comprising about 100 parts by weight of polyaryletherketone resin and about 1 to about 20 parts by weight of laser direct forming additive; and The coating is formed on at least a portion of the surface of the substrate using a laser direct forming process and a plating process. The plating layer is composed of layers of copper and nickel plating. The cross-sectional thickness of the coating is from approximately 100 μm to approximately 1,000 μm. The ratio of the cross-sectional thickness of the copper plating layer to that of the nickel plating layer is approximately 1:1 to approximately 1:

80.

2. The heating unit according to claim 1, characterized in that, The polyaryletherketone resin comprises repeating units represented by the following chemical formula 1. [Chemical Formula 1] 。 3. The heating unit according to claim 1 or 2, characterized in that, For the polyaryletherketone resin, according to ASTM D3835, at a temperature of 400°C and 1000 seconds... -1 Under shear rate conditions, the melt viscosity measured by a capillary viscometer is approximately 50 Pa·s to approximately 500 Pa·s.

4. The heating unit according to any one of claims 1 to 3, characterized in that, The additive for laser direct forming includes one or more of the following: heavy metal composite oxide spinel and copper salt.

5. The heating unit according to any one of claims 1 to 4, characterized in that, The plating process includes a chemical copper plating step, an electrolytic copper plating step, and an electrolytic nickel plating step.

6. The heating unit according to any one of claims 1 to 5, characterized in that, The plating process includes a chemical nickel plating step, an electrolytic nickel plating step, and an electrolytic copper plating step.

7. The heating unit according to any one of claims 1 to 6, characterized in that, For the coating, when a current of 20A and a voltage of 10V are applied, the highest temperature measured by a thermal imaging camera is about 200°C to about 300°C.

8. The heating unit according to any one of claims 1 to 7, characterized in that, For the coating, after applying a current of 20A and a voltage of 10V, the time to reach 150°C, as measured by a thermal imaging camera, is approximately 1 second to approximately 100 seconds.

9. The heating unit according to any one of claims 1 to 8, characterized in that, For the thermoplastic resin composition, after aging a 50mm×90mm×3.2mm injection-molded sample at 25°C for 6 hours, the sample surface is activated in a stripe pattern using a laser direct molding process, and the coating is formed on the activated surface using a plating process. The coated sample is then placed in a chamber at 85°C and 85%RH for 72 hours. After 100 1mm×1mm grids are engraved on the coating, the number of grids that are not peeled off with tape is approximately 90 to approximately 100.

10. The heating unit according to any one of claims 1 to 9, characterized in that, For the thermoplastic resin composition, after aging a 50mm×90mm×3.2mm injection-molded sample at 25°C for 6 hours, the sample surface is activated in a stripe pattern using a laser direct molding process, and the plating layer is formed on the activated surface using a plating process. The plated sample is then placed in a chamber at 250°C for 200 hours, and 100 1mm×1mm grids are etched on the plating layer (copper layer). When peeled off with tape, the number of grids that are not peeled off is approximately 90 to approximately 100.

11. A method for manufacturing a heating unit, characterized in that, Includes the following steps: A substrate is manufactured from a thermoplastic resin composition comprising about 100 parts by weight of polyaryletherketone resin and about 1 to about 20 parts by weight of an additive for laser direct molding. At least a portion of the surface of the substrate is irradiated with a laser; Chemically plate copper or nickel in the area after laser irradiation; Electroplating copper or nickel onto the coating after chemical copper or nickel plating; as well as Electrolytic plating of nickel or copper is performed on top of the electrolytically plated copper or nickel layer to form a coating. The plating layer is composed of layers of copper and nickel plating. The cross-sectional thickness of the coating is from approximately 100 μm to approximately 1,000 μm. The ratio of the cross-sectional thickness of the copper plating layer to that of the nickel plating layer is approximately 1:1 to approximately 1:

80.

12. The method for manufacturing the heating unit according to claim 11, characterized in that, The substrate is manufactured by injection molding the thermoplastic resin composition using an injection molding machine at a molding temperature of about 380°C to about 480°C and a mold temperature of about 50°C to about 200°C.

13. The method for manufacturing the heating unit according to claim 11 or 12, characterized in that, The wavelength of the laser is 248nm, 308nm, 355nm, 532nm, 1,064nm or 10,600nm.

14. The method for manufacturing the heating unit according to any one of claims 11 to 13, characterized in that, The copper electroless plating is performed in a copper electroless plating solution at about 55°C for about 10 minutes to about 40 minutes, and the nickel electroless plating is performed in a nickel electroless plating solution at about 50°C for about 10 minutes to about 40 minutes.

15. The method for manufacturing the heating unit according to any one of claims 11 to 14, characterized in that, The copper electroplating is performed at approximately 10 A / dm². 2 The electrolytic plating of nickel is performed at a current density of approximately 5 A / dm³ for approximately 1 minute to approximately 3,000 minutes. 2 It can be performed at a current density of approximately 1 minute to approximately 3,000 minutes.

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