Automatic cleaning and detecting integrated device for silicon wafer box

Abstract

The application provides a kind of automatic cleaning and detection integrated device of silicon wafer box, belongs to silicon wafer production equipment, including workbench and cleaning basket, multiple groups of silicon wafer box body are arranged in cleaning basket, workbench includes base and top table, transfer assembly is arranged on top table, transfer assembly includes track and two groups of mechanical arms sliding along track, and the end of mechanical arm is equipped with the grabbing mechanism of clamping cleaning basket;Workbench is divided into pre-washing area and cleaning area, pre-washing tank is arranged in pre-washing area, first cleaning tank, second cleaning tank and re-washing tank are sequentially arranged in cleaning area, and feed tank and discharge tank are respectively arranged on both sides of workbench;Mechanical arm and workbench are equipped with detection assembly for determining the cleanliness of silicon wafer box by color reaction and image analysis, detection assembly includes image acquisition module, multiple groups of color developing agent spray pipes and multiple groups of detection probes.The device sets detection assembly based on color reaction and image analysis, so that the user can determine the cleanliness of silicon wafer box.

Description

Technical Field

[0001] This invention belongs to the technical field of silicon wafer production equipment, and more specifically, it relates to an integrated automatic cleaning and testing device for silicon wafer boxes. Background Technology

[0002] In the semiconductor manufacturing industry, silicon wafer cassettes are often used to carry and transport silicon wafers. For example, in multiple stages of chip manufacturing, such as photolithography, etching, and coating, silicon wafers need to be placed in silicon wafer cassettes to ensure their safe transfer between different processing equipment.

[0003] However, during the use of silicon wafer cassettes, they inevitably become contaminated with various pollutants. If these pollutants are not cleaned and removed in a timely manner, they will contaminate the silicon wafers during subsequent use, affecting the precision and quality of chip manufacturing. Traditional silicon wafer cassette cleaning and inspection methods rely on manual visual inspection or simple contact inspection, which have limited accuracy. Contaminants or defects on the surface of the silicon wafer cassette may be overlooked. Given the extremely high cleanliness requirements of semiconductor manufacturing for silicon wafer cassettes, this can easily lead to unqualified silicon wafer cassettes entering subsequent production stages. This not only affects the production quality of silicon wafers, resulting in lower product yield, but also contaminates production equipment, increases equipment maintenance costs and downtime risks, and ultimately seriously hinders the efficient and stable development of the semiconductor manufacturing industry. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides an integrated automatic cleaning and inspection device for silicon wafer cassettes, which solves the technical problem that traditional silicon wafer cassette cleaning and inspection methods rely on manual visual inspection or simple contact inspection methods, resulting in limited inspection accuracy.

[0005] The purpose and effectiveness of the automatic cleaning and inspection integrated device for silicon wafer cassettes of the present invention are achieved by the following specific technical means:

[0006] An integrated automatic cleaning and inspection device for silicon wafer cassettes includes a workbench and a cleaning basket. Multiple silicon wafer cassette bodies are housed within the cleaning basket. The workbench includes a base and a top platform. A transfer assembly is mounted on the top platform. The transfer assembly includes a track and two sets of robotic arms that slide along the track. Each robotic arm has a gripping mechanism at its end to hold the cleaning basket. The workbench is divided into a pre-washing area and a cleaning area. The pre-washing area contains a pre-wash tank, and the cleaning area contains a first cleaning tank, a second cleaning tank, and a re-wash tank in sequence. A feed chute and a discharge chute are located on both sides of the workbench. The robotic arms and the workbench are equipped with a detection component for determining the cleanliness of the silicon wafer cassettes through colorimetric reactions and image analysis. The detection component includes an image acquisition module, multiple sets of colorimetric reagent spray nozzles, and multiple sets of detection probes. A control module is mounted on the workbench and is electrically connected to the image acquisition module and the detection probes.

[0007] According to a preferred embodiment, the cleaning basket has mounting plates on both sides, two sets of placement plates on the top of the cleaning basket, and hanging blocks for fixing the silicon wafer cassette body on the placement plates. The cleaning basket has multiple sets of adjusting tubes, each with a movable groove at the top. Springs and locking blocks are installed inside the multiple sets of adjusting tubes. The springs are sleeved on the locking blocks, and one end of the locking blocks extends out of the movable groove. The silicon wafer cassette body is locked onto the locking blocks and the hanging blocks. A cleaning channel is provided at the bottom of the cleaning basket.

[0008] According to a preferred embodiment, a roller conveyor belt is provided at the bottom of the feeding trough, and guide columns are provided above the roller conveyor belt and on both sides of the feeding trough; an air outlet pipe and a pre-wash liquid pipe are opened in the guide columns, and the pre-wash liquid pipe is spirally wound around the outside of the air outlet pipe; multiple sets of atomizing nozzles and hot air nozzles are provided on the guide columns, a hot air blower and a liquid storage tank are provided on one side of the discharge trough, the hot air blower and the multiple sets of air outlet pipes are connected by pipes, the pre-wash liquid pipe is connected to the liquid storage tank by a water pump, and a wastewater tray is provided below the roller conveyor belt.

[0009] According to a preferred embodiment, a water-proof cover is provided on the top of the pre-washing tank, and spray pipes are provided on both sides of the water-proof cover and the bottom of the pre-washing tank; a filter and a circulation pump are provided on one side of the pre-washing tank, and the spray pipes are connected to the inner cavity pipe of the pre-washing tank through the filter and the circulation pump to form a circulation pipe, and the circulation pump is electrically connected to the control module; a light-emitting device and an image acquisition module are provided on the water-proof cover, and a waterproof cover is provided on one side of the light-emitting device and the image acquisition module, and a heating ring for removing water mist is provided on the waterproof cover, and the control module is electrically connected to the light-emitting device and the heating ring respectively.

[0010] According to a preferred embodiment, an ultrasonic cleaner is provided below the first cleaning tank, the second cleaning tank, and the rewashing tank. The ultrasonic transducers of the three ultrasonic cleaners are respectively located at the bottom of the first cleaning tank, the second cleaning tank, and the rewashing tank. The ultrasonic cleaner is electrically connected to the control module. The bottom of the first cleaning tank, the second cleaning tank, and the rewashing tank is provided with a placement platform for placing the cleaning basket. Guide plates are provided at both ends of the placement platform.

[0011] According to a preferred embodiment, the first cleaning tank is filled with an alkaline cleaning agent, and the second cleaning tank is filled with deionized water. Both the first and second cleaning tanks are equipped with multiple sets of filter plates arranged in a rectangular shape within the tanks. Each filter plate contains an adsorption layer. Both the first and second cleaning tanks are equipped with stirring blades. A drive motor is located below each tank and connected to the stirring blades. The drive motor is electrically connected to the control module.

[0012] According to a preferred embodiment, the first cleaning tank is filled with an alkaline cleaning agent, and the second cleaning tank is filled with deionized water. Both the first and second cleaning tanks are equipped with multiple sets of filter plates arranged in a rectangular shape. Each filter plate has an adsorption layer and a reflector plate near the cleaning basket. Both the first and second cleaning tanks are equipped with stirring blades. A drive motor is located below each of the first and second cleaning tanks, connected to the stirring blades and electrically connected to the control module. A heating plate is located at the bottom of both the first and second cleaning tanks, and the heating plate is electrically connected to the control module.

[0013] According to a preferred embodiment, the rewashing tank is filled with pure water, and multiple sets of electromagnetic vibrators are installed at the bottom of the rewashing tank. An air tank and an electromagnetic control valve are provided below the rewashing tank. An aeration pipe is provided inside the rewashing tank, and the aeration pipe is connected to the air tank pipe through a pipeline. The electromagnetic control valve is installed on the pipeline. The control module is electrically connected to the electromagnetic vibrators and the electromagnetic control valve respectively.

[0014] According to a preferred embodiment, a roller conveyor belt is provided at the bottom of the discharge trough, and multiple sets of heating tubes are provided on the inner wall of the discharge trough. A blower is provided on one side of each heating tube. The control module is electrically connected to the roller conveyor belt, the heating tubes, and the blower. An infrared probe for detecting the entry and exit of the cleaning basket is provided at one end of the feed trough and the discharge trough. The control module is electrically connected to the infrared probe. A water collection tray is provided below the roller conveyor belt.

[0015] According to a preferred embodiment, the detection component further includes a display agent reservoir, which is connected to the colorimetric agent spray pipe via a pump. The colorimetric agent spray pipe and the display agent reservoir are located within the cleaning area. An ultraviolet lamp is provided on the worktable. The control module is electrically connected to the pump and the ultraviolet lamp respectively. The robotic arm is equipped with multiple sets of detection probes for the fluorescence reaction of the colorimetric agent. All detection probes face the silicon wafer box body and are electrically connected to the control module.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. This invention, by incorporating a detection component based on colorimetric reaction and image analysis, enables users to determine the cleanliness of silicon wafer cassettes, thus improving the detection accuracy of the device. Users can activate the detection component via the control module, causing the colorimetric reagent sprayed from the nozzle to react with any contaminants present on the surface of the silicon wafer cassette. An image acquisition module captures the resulting image, and the detection probe collects the data, allowing users to obtain information about contaminants on the surface of the silicon wafer cassette, thereby enhancing the device's ability to detect the cleanliness of silicon wafer cassettes. Compared to traditional methods relying on visual inspection or simple contact testing, this invention reduces misjudgments caused by human factors or limitations in detection methods, ensuring that only silicon wafer cassettes meeting cleanliness standards enter subsequent production stages, thus guaranteeing the production quality of silicon wafers.

[0018] 2. When using this device, the user can place the silicon wafer cassette in the cleaning basket and use the hanging blocks and clamps on the basket to fix the cassette, ensuring its stability during the cleaning process and improving the device's ability to hold the wafer cassette in place. Then, through the coordinated work of each cleaning tank and related equipment—such as the pre-washing with spray in the pre-wash tank, the alkaline cleaning agent in the first cleaning tank, the deionized water in the second cleaning tank, and the pure water in the re-wash tank—the device can perform a comprehensive and deep cleaning of the silicon wafer cassette, removing various contaminants that have accumulated during use. This provides the user with a high-cleanliness silicon wafer cassette and enhances the device's cleaning capabilities. Simultaneously, the ultrasonic cleaners, stirring blades, and heating plates equipped in each cleaning tank enhance the cleaning effect from different angles, further ensuring the cleaning quality.

[0019] 3. This invention, by incorporating a transfer assembly including a track and a sliding robotic arm and gripping mechanism, enables users to automatically transfer silicon wafer cassettes between different areas, thus enhancing the automation level of the device. Users can control the robotic arm to slide along the track via the control module, using the gripping mechanism to hold the cleaning basket and transfer it between different areas such as the inlet trough, pre-washing area, cleaning area, and outlet trough. This eliminates the need for manual handling, reducing manpower and increasing transfer efficiency, thereby improving the automation of silicon wafer cassette transfer. Furthermore, infrared sensors installed in the inlet and outlet troughs can detect the entry and exit of the cleaning basket, facilitating the control module's scheduling of the transfer assembly and further optimizing the automation level of the entire cleaning and inspection process, ensuring smooth operation of the device. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the assembled structure of the present invention;

[0021] Figure 2 This is a front view of the present invention;

[0022] Figure 3 This is a schematic diagram of the cleaning basket of the present invention;

[0023] Figure 4 This is a schematic diagram of the robotic arm of the present invention;

[0024] Figure 5 This is a schematic diagram of the cleaning area of ​​the present invention;

[0025] Figure 6 This is a schematic diagram of the water-repellent cover of the present invention;

[0026] Figure 7 This is a schematic diagram of the feed trough of the present invention;

[0027] Figure 8 This is a schematic diagram of the pre-wash tank of the present invention;

[0028] Figure 9 This is a schematic diagram of the cleaning tank of the present invention;

[0029] Figure 10 This is a schematic diagram of the reflector of the present invention;

[0030] Figure 11 This is a schematic diagram of the rewashing tank of the present invention;

[0031] Figure 12 This is a schematic diagram of the discharge trough of the present invention;

[0032] Figure 13 This is a schematic diagram of the principle framework of the present invention.

[0033] In the diagram, the correspondence between component names and their corresponding reference numerals is as follows:

[0034] 101. Cleaning basket; 102. Silicon wafer box body; 103. Base; 104. Top platform; 105. Track; 106. Robotic arm; 107. Gripping mechanism; 108. Pre-wash tank; 109. First cleaning tank; 111. Second cleaning tank; 112. Re-wash tank; 113. Feed chute; 114. Discharge chute; 115. Image acquisition module; 116. Color developer spray nozzle; 117. Detection probe; 118. Control module; 201. Clamping platform; 202. Placement plate; 203. Hanging block; 204. Adjusting pipe; 205. Clamping block; 206. Cleaning channel; 301. Roller conveyor belt; 302. Guide column; 303. Air outlet duct; 304. Pre-wash liquid duct; 305. Atomizing nozzle; 306. Hot air nozzle; 307. Hot air blower; 30 8. Storage tank; 309. Water pump; 310. Wastewater tray; 401. Waterproof cover; 402. Spray pipe; 403. Filter; 405. Circulation pump; 406. Illumination device; 407. Waterproof cover; 408. Heating ring; 501. Ultrasonic cleaner; 502. Ultrasonic transducer; 503. Placement platform; 504. Guide plate; 505. Filter plate; 506. Adsorption layer; 507. Stirring blade; 508. Drive motor; 509. Reflector; 511. Heating plate; 601. Electromagnetic vibrator; 602. Gas tank; 603. Electromagnetic control valve; 604. Aeration pipe; 607. Water collection tray; 608. Infrared probe; 609. Heating tube; 611. Exhaust fan; 701. Indicator storage box; 702. Extraction pump; 713. Ultraviolet lamp. Detailed Implementation

[0035] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0036] Example 1:

[0037] like Figures 1 to 13As shown, the present invention provides an integrated automatic cleaning and testing device for silicon wafer cassettes, including a workbench and a cleaning basket 101. The cleaning basket 101 contains multiple silicon wafer cassette bodies 102. By setting the workbench to support each functional area and the cleaning basket 101 to place the silicon wafer cassette bodies 102, the device can build a complete cleaning and testing system, thereby improving the systemicity and integration of the device. The workbench includes a base 103 and a top platform 104. A transfer assembly is mounted on the top platform 104. The transfer assembly includes a track 105 and two sets of robotic arms 106 that slide along the track 105. Each robotic arm 106 has a gripping mechanism 107 at its end to hold a cleaning basket 101. The robotic arms 106 grip the two side clamps 201 of the cleaning basket 101 via the gripping mechanism 107 and move along the track 105, moving and placing the cleaning basket 101 at various workstations. This automates the material transfer process in the cleaning and inspection of the silicon wafer cassette body 102, improving the overall efficiency, stability, and processing capacity of the device. The robotic arm 106 can be a KR10R11002 model robotic arm. Specifically, the automated transfer process eliminates the need for frequent manual intervention, avoiding many drawbacks of manual transfer. This not only reduces labor costs but also minimizes errors that may occur due to manual operation, such as untimely transfer or placement deviations, thereby improving work efficiency.

[0038] like Figure 5 As shown, the workbench is divided into a pre-washing area and a cleaning area. The pre-washing area is equipped with a pre-washing tank 108, and the cleaning area is equipped with a first cleaning tank 109, a second cleaning tank 111, and a re-washing tank 112 in sequence. A feed chute 113 and a discharge chute 114 are respectively located on both sides of the workbench. This layout enables the device to achieve a comprehensive cleaning process for the silicon wafer cassette body 102, improving the overall cleaning efficiency of the device.

[0039] Specifically, the feed tank 113 serves as the starting point, facilitating the centralized loading of the silicon wafer cassette body 102 in preparation for subsequent cleaning. The pre-wash tank 108 performs a preliminary rinse on the silicon wafer cassette body 102, removing large particles of impurities from the surface and reducing the burden on subsequent cleaning. The second cleaning tank 111 uses deionized water to wash away residual alkaline cleaning agents and some water-soluble impurities; the re-wash tank 112 re-washes defective products, ensuring the cleanliness of the silicon wafer cassette body 102. The different cleaning tanks have clearly defined functions and work together to complete the cleaning process. The discharge tank 114 is used to discharge the silicon wafer cassette body 102 after cleaning and testing, forming a closed loop in the entire process.

[0040] The robotic arm 106 and the worktable are equipped with a detection component for determining the cleanliness of the silicon wafer cassette body 102 through colorimetric reaction and image analysis. The detection component includes an image acquisition module 115, multiple sets of colorimetric reagent spray nozzles 116, and multiple sets of detection probes 117. A control module 118 is provided on the worktable, and the control module 118 is electrically connected to both the image acquisition module 115 and the detection probes 117. By setting up the detection component on the robotic arm 106 and the worktable and connecting it to the control module 118, the device can determine the cleanliness of the silicon wafer cassette body 102, improving the detection accuracy of the device. The detection probes 117 can be OPT-2000 fluorescent detection probes; the control module 118 can be an IPC-610L industrial computer.

[0041] like Figure 3 , 5 As shown, the cleaning basket 101 has mounting platforms 201 on both sides, and two sets of placement plates 202 on the top. Each placement plate 202 has a hanging block 203 for fixing the silicon wafer cassette body 102. The cleaning basket 101 has multiple sets of adjusting tubes 204, each with a movable groove at the top. Springs and locking blocks 205 are installed inside each adjusting tube 204. The springs are fitted onto the locking blocks 205, and one end of each locking block 205 extends into the movable groove. The silicon wafer cassette body 102 is secured to the locking blocks 205 and the hanging blocks 203. A cleaning channel 206 is provided at the bottom of the cleaning basket 101. By setting mounting platforms 201 on both sides of the cleaning basket 101, hanging blocks 203 on the top, and using springs and locking blocks 205 within the adjusting tubes 204 to fix the silicon wafer cassette body 102, the device can secure the silicon wafer cassette body 102, improving the stability and reliability of the device. Specifically, the clamping platform 201 facilitates the gripping of the transfer components by the robotic arm 106, ensuring that the cleaning basket 101 will not fall off during the transfer process; the hanging block 203 and the clamping block 205 cooperate with each other to limit the silicon wafer box body 102 from both the top and bottom, so that it will not shake inside the cleaning basket 101, avoiding damage caused by collisions between the silicon wafer box bodies 102 and with the cleaning basket 101, and ensuring that the cleaning process proceeds smoothly.

[0042] Secondly, by setting up a cleaning channel 206 at the bottom of the cleaning basket 101, the device can achieve thorough rinsing of the silicon wafer cassette body 102 with the cleaning fluid, thus improving the cleaning effect of the device. The cleaning fluid can not only come into contact with contaminants from the top and sides of the silicon wafer cassette body 102, but also flow through the cleaning channel 206 from the bottom, carrying away impurities from the bottom and crevices of the silicon wafer cassette body 102.

[0043] Furthermore, the elasticity of the spring inside the adjusting tube 204 allows the locking block 205 to adapt to silicon wafer cassette bodies 102 of different sizes. When silicon wafer cassette bodies 102 of different specifications are placed, the locking block 205 can automatically adjust its position under the action of the spring, always maintaining a fixed position on the silicon wafer cassette body 102. This feature enhances the compatibility of the cleaning basket 101 with silicon wafer cassette bodies 102 of various specifications.

[0044] like Figure 5 , 7 As shown, a roller conveyor belt 301 is provided at the bottom of the feed trough 113, and guide columns 302 are provided above the roller conveyor belt 301 and on both sides of the feed trough 113. An air outlet pipe 303 and a pre-wash liquid pipe 304 are provided inside the guide column 302. The pre-wash liquid pipe 304 is spirally wrapped around the outside of the air outlet pipe 303. Multiple sets of atomizing nozzles 305 and hot air nozzles 306 are provided on the guide column 302. A hot air blower 307 and a liquid storage tank 308 are provided on one side of the discharge trough 114. The hot air blower 307 is connected to multiple sets of air outlet pipes through pipes. The pre-wash liquid pipe 304 is connected to the liquid storage tank 308 through a water pump 309. A wastewater pan 310 is provided below the roller conveyor belt 301. By installing a roller conveyor belt 301 at the bottom of the feed trough 113 and guide columns 302 above and on both sides thereon, along with an air outlet duct 303, a pre-wash liquid duct 304, an atomizing nozzle 305, and a hot air nozzle 306, the device can pre-clean and pre-heat the silicon wafer cassette body 102 during the feeding stage, thus improving the device's pre-processing capacity and cleaning efficiency. The roller conveyor belt 301 can automatically transport the cleaning basket 101 containing the silicon wafer cassette body 102, improving the automation and efficiency of the feeding process. The pre-wash liquid pipe 304 and air outlet pipe 303 are set in the guide column 302, and together with the atomizing nozzle 305 and hot air nozzle 306, the silicon wafer box body 102 can be pre-washed with liquid and dried with hot air at the same time, removing some impurities and moisture, reducing the burden on subsequent formal cleaning and saving overall cleaning time. At the same time, the top of the feed tank 113 is equipped with an electric cover, so that the atomized liquid can fall fully onto the silicon wafer box body 102. Then, the liquid storage tank 308 is equipped with a liquid level sensor and a liquid filling port extending to the outer wall of the workbench. The liquid level sensor can be an E110 model rod liquid level sensor. This setting can realize the function of liquid filling reminder.

[0045] Secondly, by installing a hot air blower 307 and a storage tank 308 on one side of the discharge trough 114, connecting the hot air blower 307 to the air outlet pipe, connecting the pre-wash liquid pipe 304 to the storage tank 308 via a water pump 309, and installing a wastewater tray 310 below the roller conveyor belt 301, the device can collect wastewater. The hot air generated by the hot air blower 307 can further preheat the silicon wafer cassette body 102 before cleaning, improving the cleaning effect. The storage tank 308 can store the pre-wash liquid, which can be circulated by the water pump 309, reducing the waste of the pre-wash liquid. The wastewater tray 310 can collect the wastewater generated during the cleaning process for centralized treatment.

[0046] Furthermore, the spiral arrangement of the pre-wash liquid pipe 304 around the outside of the air outlet pipe 303 enables heat exchange. During the delivery of hot air through the air outlet pipe 303, heat is transferred to the pre-wash liquid within the pre-wash liquid pipe 304, raising its temperature, enhancing its activity, and improving the pre-washing effect. Simultaneously, this compact structure saves space. The arrangement of multiple atomizing nozzles 305 and hot air nozzles 306 allows for spraying and drying of the silicon wafer cassette body 102 from different angles, ensuring comprehensive pre-treatment.

[0047] like Figure 5 , 6 As shown in Figure 8, a water-repellent cover 401 is provided on the top of the pre-wash tank 108, and spray pipes 402 are provided on both sides of the water-repellent cover 401 and the bottom of the pre-wash tank 108. A filter 403 and a circulation pump 405 are provided on one side of the pre-wash tank 108. The spray pipes 402 are connected to the inner cavity pipe of the pre-wash tank 108 through the filter 403 and the circulation pump 405 to form a circulation pipe. The circulation pump 405 is electrically connected to the control module 118. A light-emitting device 406 and an image acquisition module 115 are provided on the water-repellent cover 401. A waterproof cover 407 is provided on one side of the light-emitting device 406 and the image acquisition module 115. A heating ring 408 for removing water mist is provided on the waterproof cover 407. The control module 118 is electrically connected to the light-emitting device 406 and the heating ring 408 respectively. The water-repellent cover 401 provided on the top of the pre-wash tank 108 can prevent the cleaning liquid from splashing out of the pre-wash tank 108 during the cleaning process; it can also reduce the evaporation of the cleaning liquid to a certain extent.

[0048] The spray pipes 402 installed on both sides of the water-proof cover 401 and at the bottom of the pre-wash tank 108 constitute an all-round spray system. When the silicon wafer cassette body 102 is placed in the pre-wash tank 108, these spray pipes 402 can spray cleaning fluid onto the silicon wafer cassette body 102 from different angles to ensure that all parts of the silicon wafer cassette body 102 are fully covered and rinsed by the cleaning fluid.

[0049] The filter 403 and circulation pump 405, along with the resulting circulation pipeline, are located on one side of the pre-wash tank 108, enabling the recycling of the cleaning solution. The circulation pump 405 extracts the cleaning solution from the pre-wash tank 108, removes impurities through the filter 403, and then returns it to the spray pipe 402 for continued use. This setup not only saves on the amount of cleaning solution used but also reduces production costs. The control module 118 is electrically connected to the circulation pump 405 and can control its operation according to a preset program or actual cleaning requirements.

[0050] The illumination device 406 and image acquisition module 115 installed on the water-proof cover 401 are used for preliminary monitoring of the contamination level of the silicon wafer cassette body 102. The light provided by the illumination device 406 ensures that the surface of the silicon wafer cassette body 102 is visible within the field of view of the image acquisition module 115. The image acquisition module 115 can capture images of the surface of the silicon wafer cassette body 102 and transmit them to the control module 118 for analysis. By analyzing the images, the control module 118 can determine the contamination level of the silicon wafer cassette body 102 so as to adjust the subsequent cleaning process in a timely manner. The image acquisition module 115 can be an MV-CA050-10GC industrial camera; the illumination device 406 can be a CCSLAX-150 rectangular light source.

[0051] A waterproof cover 407 is installed on one side of the illumination device 406 and the image acquisition module 115 to protect these two components from the corrosion of the cleaning fluid and ensure their stable operation in a humid environment. A heating ring 408 installed on the waterproof cover 407 is specifically used to remove water mist that may form on the surface of the waterproof cover 407. During the pre-washing process, water mist can easily form on the surface of the waterproof cover 407 due to the spraying of the cleaning fluid and temperature changes, which can affect the imaging effect of the image acquisition module 115. The heating ring 408 operates under the control of the control module 118, removing the water mist by heating, ensuring that the light from the illumination device 406 can pass normally through the waterproof cover 407, allowing the image acquisition module 115 to capture images of the surface of the silicon wafer cassette body 102, thereby ensuring the accuracy of monitoring. The heating ring 408 can be an OMEGAHBR-150 model heating ring.

[0052] like Figure 5 , 9As shown, an ultrasonic cleaner 501 is installed below the first cleaning tank 109, the second cleaning tank 111, and the rewash tank 112. The ultrasonic transducers 502 of the three ultrasonic cleaners 501 are located on the bottom of the first cleaning tank 109, the second cleaning tank 111, and the rewash tank 112, respectively. The ultrasonic cleaners 501 are electrically connected to the control module 118. The bottom of the first cleaning tank 109, the second cleaning tank 111, and the rewash tank 112 is provided with a placement platform 503 for placing the cleaning basket 101. Guide plates 504 are provided at both ends of the placement platform 503. The ultrasonic cleaner 501 can be a VGT-2060FCH model ultrasonic cleaner.

[0053] When the ultrasonic cleaner 501 is working, the ultrasonic transducer 502 converts electrical energy into high-frequency mechanical vibration, which is transmitted to the cleaning basket 101 and the silicon wafer cassette body 102 through the liquid medium. This high-frequency vibration generates countless tiny bubbles in the liquid. These bubbles burst on the surface of the silicon wafer cassette body 102, generating impact force that penetrates deep into the gaps and pores of the silicon wafer cassette body 102, peeling off stubborn stains and impurities, thus enhancing the cleaning effect. Since all three cleaning tanks are equipped with ultrasonic cleaners 501, the cleaning tasks can be completed with the help of ultrasonic waves at different cleaning stages, such as the first cleaning tank 109 using alkaline cleaning agents to remove oil and specific impurities, the second cleaning tank 111 using deionized water for further cleaning, and the rewash tank 112 using pure water for cleaning. This ensures that the silicon wafer cassette body 102 achieves optimal cleanliness in each cleaning step.

[0054] The control module 118 is electrically connected to the ultrasonic cleaner 501, enabling control of the ultrasonic cleaning process. Operators can use the control module 118 to adjust the power, frequency, and cleaning time of the ultrasonic cleaner 501 based on factors such as the degree of contamination and material characteristics of the silicon wafer cassette body 102. For heavily contaminated silicon wafer cassette bodies 102, the power can be increased and the cleaning time extended; for more sensitive materials, the power can be appropriately reduced to avoid damage to the silicon wafer cassette body 102.

[0055] The placement platforms 503 located at the bottom of the three cleaning tanks provide a stable position for the cleaning baskets 101. The guide plates 504 at both ends of the placement platforms 503 serve to guide and position the baskets. When the transfer assembly transports the cleaning baskets 101 above the cleaning tanks, the guide plates 504 assist in placing the baskets 101 on the placement platforms 503, preventing placement deviations and ensuring stability during the cleaning process. This allows the ultrasonic energy to be applied evenly to the silicon wafer cassette body 102, guaranteeing consistent cleaning results. Simultaneously, the guide plates 504 facilitate the removal of the cleaning baskets 101, improving the operational convenience and efficiency of the entire cleaning process.

[0056] The first cleaning tank 109 is filled with an alkaline cleaning agent, and the second cleaning tank 111 is filled with deionized water. Both the first cleaning tank 109 and the second cleaning tank 111 are equipped with multiple sets of filter plates 505, which are arranged in a rectangular shape within the first cleaning tank 109 and the second cleaning tank 111. Each filter plate 505 has an adsorption layer 506. Both the first cleaning tank 109 and the second cleaning tank 111 are equipped with stirring blades 507. A drive motor 508 is located below the first cleaning tank 109 and the second cleaning tank 111, and the drive motor 508 is connected to the stirring blades 507. The drive motor 508 is electrically connected to the control module 118.

[0057] The alkaline cleaning agent filled in the first cleaning tank 109 has excellent dissolving and emulsifying abilities for common contaminants such as grease and organic matter on the surface of the silicon wafer cassette body 102. When the silicon wafer cassette body 102 is placed in the first cleaning tank 109, the alkaline cleaning agent, with the assistance of the ultrasonic cleaner 501, can quickly penetrate between the contaminants and the surface of the silicon wafer cassette body 102, peeling the contaminants off the silicon wafer cassette body 102, achieving the purpose of preliminary deep cleaning. The deionized water in the second cleaning tank 111 is mainly used to remove the alkaline cleaning agent residue and some water-soluble impurities remaining on the silicon wafer cassette body 102 after cleaning in the first cleaning tank 109. After cleaning with the alkaline cleaning agent, some chemical substances will remain on the surface of the silicon wafer cassette body 102. The deionized water can dissolve and remove these residues, further purifying the silicon wafer cassette body 102.

[0058] Multiple sets of rectangularly arranged filter plates 505 are installed in the two cleaning tanks. The adsorption layer 506 within the filter plates 505 is typically composed of ion exchange resin material. During the cleaning process, the cleaning solution continuously circulates, and the adsorption layer 506 adsorbs particulate impurities, residual chemicals, and contaminants detached from the surface of the silicon wafer cassette 102 due to ultrasonic vibration in the cleaning solution, continuously purifying the cleaning solution, ensuring its cleanliness, maintaining a stable cleaning effect, extending the service life of the cleaning solution, and reducing production costs.

[0059] A stirring blade 507 installed in the cleaning tank is connected to a drive motor 508 below, and the drive motor 508 is controlled by the control module 118. The drive motor 508 drives the stirring blade 507 to rotate, enabling the cleaning solution to circulate within the tank, enhancing the contact and friction between the cleaning solution and the surface of the silicon wafer cassette body 102. In the first cleaning tank 109, stirring allows the alkaline cleaning agent to fully react with contaminants, accelerating the dissolution rate of oil stains, etc.; in the second cleaning tank 111, stirring helps deionized water to rinse the silicon wafer cassette body 102 more evenly, improving the comprehensiveness and efficiency of the cleaning. The control module 118 can adjust the speed of the drive motor 508 according to cleaning requirements to adapt to the cleaning of silicon wafer cassette body 102 with different levels of contamination.

[0060] like Figure 5 , 11 As shown, the rewash tank 112 is filled with pure water. Multiple sets of electromagnetic vibrators 601 are installed at the bottom of the rewash tank 112. An air tank 602 and an electromagnetic control valve 603 are located below the rewash tank 112. An aeration pipe 604 is installed inside the rewash tank 112 and is connected to the air tank 602 via a pipeline. The electromagnetic valve 603 is mounted on the pipeline. The control module 118 is electrically connected to both the electromagnetic vibrators 601 and the electromagnetic control valve 603. The electromagnetic vibrator 601 can be a ZFB-150 type electromagnetic vibrator; the electromagnetic control valve 603 can be an ASCO8262 series electromagnetic control valve.

[0061] Specifically, the rewash tank 112 serves as a step for re-cleaning the defective silicon wafer cassette body 102. The pure water inside provides a pure cleaning medium. The pure water can avoid introducing new impurities, ensuring a deep cleaning of the silicon wafer cassette body 102 and removing any contaminants that may remain from the previous cleaning steps, thereby meeting the cleanliness requirements of the silicon wafer cassette body 102 in semiconductor manufacturing.

[0062] Multiple sets of electromagnetic vibrators 601 installed at the bottom of the rewash tank 112 play a crucial role. When the silicon wafer cassette body 102 is detected to be defective and requires rewashing, the control module 118 activates the electromagnetic vibrators 601. The electromagnetic vibrators 601 cause the pure water in the rewash tank 112 to fluctuate and oscillate through high-frequency vibration. This vibration allows the pure water to more fully contact all parts of the silicon wafer cassette body 102, further enhancing the cleaning effect and dislodging residual contaminants in hidden locations. At the same time, a buffer is provided at the bottom of the rewash tank to prevent the vibration from affecting other processes.

[0063] The air tank 602, electromagnetic control valve 603, and aeration pipe 604 connected to it, located below the rewash tank 112, together constitute the aeration system. The electromagnetic control valve 603 is controlled by the control module 118. When gas from the air tank 602 is released into the pure water of the rewash tank 112 through the aeration pipe 604, a large number of tiny bubbles are generated. These bubbles contact and burst on the surface of the silicon wafer cassette body 102 as they rise, and the resulting minute impact force helps remove contaminants from the surface of the silicon wafer cassette body 102.

[0064] By coordinating the control of the electromagnetic vibrator 601 and the electromagnetic control valve 603 through the control module 118, the intensity and method of rewashing can be adjusted according to the degree and characteristics of contamination of the defective silicon wafer cassette body 102. For silicon wafer cassette bodies 102 with lighter contamination, the vibration frequency of the electromagnetic vibrator 601 and the aeration rate of the air tank 602 can be appropriately reduced; while for silicon wafer cassette bodies 102 with heavier contamination, the vibration and aeration effects are enhanced to achieve rewashing, ensuring that the rewashed silicon wafer cassette body 102 can meet the cleanliness standards required for semiconductor manufacturing, thereby reducing the number of defective products entering subsequent production stages and improving the yield rate of the entire production process.

[0065] like Figure 5 , 12 As shown, a roller conveyor belt 301 is provided at the bottom of the discharge trough 114, and multiple sets of heating tubes 609 are provided on the inner wall of the discharge trough 114. A blower 611 is provided on one side of the heating tubes 609. The control module 118 is electrically connected to the roller conveyor belt 301, the heating tubes 609, and the blower 611 respectively. An infrared probe 608 for detecting the entry and exit of the cleaning basket 101 is provided at one end of the feed trough 113 and the discharge trough 114. The control module 118 is electrically connected to the infrared probe 608, and a water collection tray 607 is provided below the roller conveyor belt 301. The infrared probe 608 can be an E3F-DS30C4 model infrared probe.

[0066] The discharge chute 114 plays a crucial role in the final stage of the automated cleaning and inspection system for silicon wafer cassettes. The roller conveyor 301 at its bottom primarily transports the silicon wafer cassette body 102 after cleaning and inspection. The control module 118, connected to the roller conveyor 301, adjusts the conveyor speed according to the overall system's operation, ensuring an orderly discharge process that prevents accumulation of silicon wafer cassette bodies 102 and avoids operational errors due to excessive speed.

[0067] The multiple sets of heating tubes 609 installed on the inner wall of the discharge trough 114 and the exhaust fan 611 on one side of the heating tubes 609 together constitute the drying system. When the silicon wafer cassette body 102 moves with the roller conveyor belt 301, the heating tubes 609 start working, releasing heat to heat the silicon wafer cassette body 102, causing the moisture on the surface of the silicon wafer cassette body 102 to evaporate. The exhaust fan 611 blows hot air onto the silicon wafer cassette body 102, accelerating the evaporation of moisture and removing water vapor, further improving drying efficiency. The control module 118 can adjust the power of the heating tubes 609 and the air speed of the exhaust fan 611 according to actual needs to ensure that the silicon wafer cassette body 102 reaches the ideal dry state before discharge, avoiding the impact of residual moisture on subsequent use.

[0068] Infrared sensors 608, installed at one end of the feed trough 113 and the discharge trough 114, are used to detect the entry and exit of the cleaning basket 101, monitoring its position. When the cleaning basket 101 approaches the detection area of ​​the feed trough 113 or the discharge trough 114, the infrared sensors 608 detect it and transmit a signal to the control module 118. Based on the received signal, the control module 118 adjusts the operating status of relevant equipment in a timely manner, such as controlling the transfer assembly to place the cleaning basket 101 in a designated position, or controlling the roller conveyor 301 to start or stop, thereby automating the entire cleaning and detection process and improving the operating efficiency of the device.

[0069] The water collection tray 607 located below the roller conveyor belt 301 is responsible for collecting the water dripping from the silicon wafer box body 102 after cleaning, as well as the condensate generated during the drying process. This prevents water from flowing freely in the work area, maintains a clean working environment, and also facilitates centralized wastewater treatment, improving the overall practicality and standardization of the device.

[0070] like Figure 5 , 8 As shown, the detection assembly also includes a display agent reservoir 701, which is connected to the colorimetric agent spray nozzle 116 via a pump 702. The colorimetric agent spray nozzle 116 and the display agent reservoir 701 are located in the cleaning area. A UV lamp 713 is provided on the worktable. The control module 118 is electrically connected to the pump 702 and the UV lamp 713 respectively. The robotic arm 106 is equipped with multiple sets of detection probes 117 for the colorimetric agent fluorescence reaction. All detection probes 117 face the silicon wafer box body 102. The detection probes 117 are electrically connected to the control module 118.

[0071] Specifically, the indicator reservoir 701 in the detection component stores an indicator for detecting the cleanliness of the silicon wafer cassette body 102. This indicator can specifically react with any contaminants that may remain on the surface of the silicon wafer cassette body 102, thereby providing a basis for determining whether the silicon wafer cassette body 102 meets cleanliness standards. The indicator may be a metal chelated fluorescent indicator.

[0072] The extraction pump 702 operates under the command of the control module 118. When a cleanliness test is required on the silicon wafer cassette body 102, the control module 118 activates the extraction pump 702. The extraction pump 702 extracts an appropriate amount of indicator from the indicator reservoir 701 and delivers it through a pipeline to the indicator spray nozzle 116. This setup ensures that the indicator is quantitatively sprayed onto the surface of the silicon wafer cassette body 102, guaranteeing the accuracy and repeatability of the test results.

[0073] The developer spray nozzle 116 is located within the cleaning area, and its function is to uniformly spray the developer onto the surface of the silicon wafer cassette body 102. To enhance the detection effect, the ultraviolet lamp 713 provides light of a specific wavelength. Under this light, the fluorescence phenomenon produced by the reaction of many developers with contaminants becomes more pronounced. The control module 118 can control the extraction volume of the extraction pump 702 and the on / off state of the ultraviolet lamp 713 according to the detection requirements, thereby regulating the detection process.

[0074] Multiple sets of detection probes 117 mounted on the robotic arm 106 are used to detect the fluorescence reaction produced after the colorimetric reagent reacts with the contaminants. When the colorimetric reagent on the surface of the silicon wafer housing 102 undergoes a fluorescence reaction under the illumination of the ultraviolet lamp 713, the detection probes 117 can sensitively capture information such as the intensity and color of the fluorescence and transmit this data to the control module 118.

[0075] By analyzing this data, the control module 118 can determine the cleanliness level of the silicon wafer cassette body 102 and whether it meets the requirements for semiconductor manufacturing. If the test results show that the cleanliness of the silicon wafer cassette body 102 does not meet the standards, the control module 118 can further issue instructions, such as transferring the silicon wafer cassette body 102 to the rewash tank 112 for re-cleaning, thereby realizing the full automation of the cleaning and testing process of the silicon wafer cassette body 102.

[0076] Example 2:

[0077] Based on the integrated automatic cleaning and inspection device for silicon wafer cassettes provided in Embodiment 1 of this application, Embodiment 2 of this application proposes an integrated automatic cleaning and inspection device for silicon wafer cassettes. Embodiment 2 is merely a preferred embodiment of Embodiment 1, and its implementation will not affect the individual implementation of Embodiment 1. Embodiment 2 of the present invention will be further described below.

[0078] like Figure 5 , 10As shown, the first cleaning tank 109 is filled with an alkaline cleaning agent, and the second cleaning tank 111 is filled with deionized water. Both the first and second cleaning tanks 109 and 111 are equipped with multiple sets of filter plates 505, arranged in a rectangular shape within the tanks. Each filter plate 505 contains an adsorption layer 506, and a reflector plate 509 is located on the side of the filter plate 505 closest to the cleaning basket 101. Both the first and second cleaning tanks 109 and 111 are equipped with stirring blades 507. A drive motor 508 is located below both the first and second cleaning tanks 109 and 111, connected to the stirring blades 507 and electrically connected to the control module 118. A heating plate 511 is located at the bottom of both the first and second cleaning tanks 109 and 111, and is electrically connected to the control module 118.

[0079] By installing filter plates 505 with adsorption layers 506 in the first cleaning tank 109 and the second cleaning tank 111, impurities in the cleaning solution can be adsorbed, maintaining the cleanliness of the cleaning solution, extending its service life, and thus ensuring the stability of the cleaning effect. Secondly, by installing a reflector plate 509 on the side of the filter plate 505 near the cleaning basket 101, the reflector plate 509 can reflect the ultrasonic waves generated by the ultrasonic cleaner 501 towards the cleaning basket 101, enhancing the energy density of the ultrasonic waves near the cleaning basket 101, causing the silicon wafer cassette body 102 to be subjected to stronger ultrasonic waves, further improving cleaning efficiency and effect. Then, a heating plate 511 is installed at the bottom of the first cleaning tank 109 and the second cleaning tank 111, and is electrically connected to the control module 118. The control module 118 can adjust the temperature of the heating plate 511 according to cleaning requirements. Appropriately increasing the temperature of the cleaning solution can enhance the dissolution and cleaning ability of alkaline cleaning agents and deionized water on contaminants.

[0080] The difference between this embodiment 2 and embodiment 1 is that a reflector plate 509 is added to the filter plate 505 and a heating plate 511 is added to the bottom of the first cleaning tank 109 and the second cleaning tank 111. A drive motor 508 is connected to the control module 118.

[0081] Specifically, the addition of reflector 509 alters the propagation path of the ultrasonic waves, enhancing the cleaning effect on the silicon wafer cassette body 102. Reflector 509 can be made of aluminum foil. The addition of heating plate 511 makes the cleaning fluid temperature controllable, broadening the cleaning application range and enabling it to handle more types of contaminants. Heating plate 511 can be an HMS-901AH model heating plate. The drive motor 508 is connected to the control module 118 to control the rotation of the stirring blade 507 or other cleaning-related coordinated actions. Compared to Embodiment 1, Embodiment 2 further optimizes the cleaning process through these improvements, enhancing the cleaning quality and efficiency of the device on the silicon wafer cassette body 102. The remaining conditions are the same as in Embodiment 1, so they will not be repeated in this embodiment.

[0082] The foregoing has shown and described the basic principles and main features of the present invention and its advantages. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments.

Claims

1. An integrated automatic cleaning and inspection device for silicon wafer cassettes, comprising a workbench and a cleaning basket (101), wherein the cleaning basket (101) contains multiple silicon wafer cassette bodies (102), characterized in that: The workbench includes a base (103) and a top platform (104). A transfer assembly is provided on the top platform (104). The transfer assembly includes a track (105) and two sets of robotic arms (106) that slide along the track (105). Each robotic arm (106) has a gripping mechanism (107) at its end to hold the cleaning basket (101). The workbench is divided into a pre-washing area and a cleaning area. A pre-washing tank (108) is provided in the pre-washing area. A first cleaning tank (109), a second cleaning tank (111), and a re-washing tank (112) are provided in sequence in the cleaning area. The workbench is provided with a feed chute (113) and a discharge chute (114) on both sides; the robotic arm (106) and the workbench are provided with a detection component for determining the cleanliness of the silicon wafer box by color reaction and image analysis. The detection component includes an image acquisition module (115), multiple sets of color developer spray nozzles (116), and multiple sets of detection probes (117); the workbench is provided with a control module (118), which is electrically connected to the image acquisition module (115) and the detection probes (117).

2. The integrated automatic cleaning and inspection device for silicon wafer cassettes according to claim 1, characterized in that: The cleaning basket (101) has a mounting plate (201) on both sides. The top of the cleaning basket (101) has two sets of placement plates (202). The placement plates (202) have a hanging block (203) for fixing the silicon wafer box body (102). The cleaning basket (101) has multiple sets of adjusting tubes (204). The top of the adjusting tubes (204) has a movable groove. The multiple sets of adjusting tubes (204) have springs and locking blocks (205) inside. The springs are sleeved on the locking blocks (205). One end of the locking blocks (205) extends out of the movable groove. The silicon wafer box body (102) is locked on the locking blocks (205) and the hanging blocks (203). The bottom of the cleaning basket (101) has a cleaning channel (206).

3. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 2, characterized in that: The bottom of the feed trough (113) is provided with a roller conveyor belt (301), and guide columns (302) are provided above the roller conveyor belt (301) and on both sides of the feed trough (113). An air outlet pipe (303) and a pre-wash liquid pipe (304) are provided inside the guide column (302). The pre-wash liquid pipe (304) is spirally wrapped around the outside of the air outlet pipe (303). Multiple sets of atomizing nozzles (305) and hot air nozzles (306) are provided on the guide column (302). A hot air blower (307) and a storage tank (308) are provided on one side of the discharge trough (114). The hot air blower (307) is connected to the multiple sets of air outlet pipes through pipes. The pre-wash liquid pipe is connected to the storage tank (308) through a water pump (309). A wastewater pan (310) is provided below the roller conveyor belt (301).

4. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 3, characterized in that: The pre-washing tank (108) is equipped with a water-proof cover (401) at the top, and spray pipes (402) are provided on both sides of the water-proof cover (401) and at the bottom of the pre-washing tank (108); a filter (403) and a circulation pump (405) are provided on one side of the pre-washing tank (108), and the spray pipes (402) are connected to the inner cavity pipe of the pre-washing tank (108) through the filter (403) and the circulation pump (405) to form a circulation pipe, and the circulation pump (405) The control module (118) is electrically connected to the control module (118); the water-proof cover (401) is provided with a light-emitting device (406) and the image acquisition module (115), and a waterproof cover (407) is provided on one side of the light-emitting device (406) and the image acquisition module (115). The waterproof cover (407) is provided with a heating ring (408) for removing water mist. The control module (118) is electrically connected to the light-emitting device (406) and the heating ring (408) respectively.

5. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 1, characterized in that: Ultrasonic cleaners (501) are provided below the first cleaning tank (109), the second cleaning tank (111), and the rewashing tank (112). The ultrasonic transducers (502) of the three ultrasonic cleaners (501) are located at the bottom of the first cleaning tank (109), the second cleaning tank (111), and the rewashing tank (112), respectively. The ultrasonic cleaners (501) are electrically connected to the control module (118). The bottom of the first cleaning tank (109), the second cleaning tank (111), and the rewashing tank (112) is provided with a placement platform (503) for placing the cleaning basket (101). The placement platform (503) has guide plates (504) at both ends.

6. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 5, characterized in that: The first cleaning tank (109) is filled with an alkaline cleaning agent, and the second cleaning tank (111) is filled with deionized water. Both the first cleaning tank (109) and the second cleaning tank (111) are provided with multiple sets of filter plates (505). The multiple sets of filter plates (505) are arranged in a rectangular shape in the first cleaning tank (109) and the second cleaning tank (111). The filter plates (505) are provided with an adsorption layer (506). Both the first cleaning tank (109) and the second cleaning tank (111) are provided with stirring blades (507). The first cleaning tank (109) and the second cleaning tank (111) are provided with a drive motor (508) below them. The drive motor (508) is connected to the stirring blades (507). The drive motor (508) is electrically connected to the control module (118).

7. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 5, characterized in that: The first cleaning tank (109) is filled with an alkaline cleaning agent, and the second cleaning tank (111) is filled with deionized water. Both the first cleaning tank (109) and the second cleaning tank (111) are equipped with multiple sets of filter plates (505). These filter plates (505) are arranged in a rectangular shape within the first cleaning tank (109) and the second cleaning tank (111). Each filter plate (505) contains an adsorption layer (506), and a reflector plate (509) is provided on the side of the filter plate (505) closest to the cleaning basket (101). A stirring blade (507) is provided in both the first cleaning tank (109) and the second cleaning tank (111). A drive motor (508) is provided below the first cleaning tank (109) and the second cleaning tank (111). The drive motor (508) is connected to the stirring blade (507) and the drive motor (508) is electrically connected to the control module (118). A heating plate (511) is provided at the bottom of the first cleaning tank (109) and the second cleaning tank (111). The heating plate (511) is electrically connected to the control module (118).

8. The integrated automatic cleaning and inspection device for silicon wafer cassettes according to claim 6 or 7, characterized in that: The rewashing tank (112) is filled with pure water. Multiple sets of electromagnetic vibrators (601) are installed at the bottom of the rewashing tank (112). An air tank (602) and an electromagnetic control valve (603) are provided below the rewashing tank (112). An aeration pipe (604) is provided in the rewashing tank (112). The aeration pipe (604) is connected to the air tank (602) via a pipe. The electromagnetic control valve (603) is installed on the pipe. The control module (118) is electrically connected to the electromagnetic vibrator (601) and the electromagnetic control valve (603) respectively.

9. The integrated automatic cleaning and testing device for silicon wafer cassettes according to claim 1, characterized in that: The bottom of the discharge trough (114) is provided with a roller conveyor belt (301), and the inner wall of the discharge trough (114) is provided with multiple sets of heating tubes (609). A blower (611) is provided on one side of the heating tube (609). The control module (118) is electrically connected to the roller conveyor belt (301), the heating tube (609), and the blower (611), respectively. An infrared probe (608) for detecting the entry and exit of the cleaning basket (101) is provided at one end of the feed trough (113) and the discharge trough (114). The control module (118) is electrically connected to the infrared probe (608). A water collection tray (607) is provided below the roller conveyor belt (301).

10. The integrated automatic cleaning and inspection device for silicon wafer cassettes according to claim 1, characterized in that: The detection assembly also includes a display agent reservoir (701), which is connected to the colorimetric agent spray nozzle (116) via a pump (702). The colorimetric agent spray nozzle (116) and the display agent reservoir (701) are located in the cleaning area. A UV lamp (713) is provided on the workbench. The control module (118) is electrically connected to the pump (702) and the UV lamp (713) respectively. The robotic arm (106) is provided with multiple sets of detection probes (117) for the colorimetric agent fluorescence reaction. All detection probes (117) face the silicon wafer box body (102). The detection probes (117) are electrically connected to the control module (118).

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