A turret bulk patcher

Abstract

The application discloses a turret type bulk material patching machine, which comprises a rack, a die bonding table assembly, a bonding head assembly, a pressing assembly, a visual assembly, a vibration disc feeding assembly, a sorting assembly and a micro-motion separation platform which are installed on the rack, the bonding head assembly comprises a rotating disc, a rotating disc driving element and a swing arm, the swing arm comprises a mounting seat, a connecting seat and an elastic plate, the mounting seat is fixedly connected with the rotating disc, one end of the elastic plate is fixedly connected with the connecting seat, the other end of the elastic plate is provided with a suction nozzle, and the connecting seat is fixedly connected on the elastic plate and close to one side of the suction nozzle; the pressing assembly comprises a pressing block and a lifting driving element, and a pressure bearing element is arranged on the connecting seat. The turret type bulk material patching machine adopts the elastic swing arm to replace the swing arm integrated with a sliding block structure, and the pressing structure and the swing arm structure are separated, so that the weight of the swing arm is reduced, the swing arm can rotate faster, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of patch machine, in particular to a turret type bulk patch machine. BACKGROUND

[0002] With the development of modern electronic components towards miniaturization, integration and high reliability, especially in the face of increasingly fierce market competition, the production and manufacturing equipment of electronic products is developing towards high speed, high precision, intelligence and multi-function. The bulk patch machine is a new type of patch machine, which can directly use bulk components for mounting without banding, effectively reducing the cost of component packaging and the cost of the entire electronic product.

[0003] At present, in the bulk patch industry, for the scene of synchronous mounting of multiple chips, the scheme of "multiple suction nozzles taking chips at the same time and synchronous die bonding" is mainly used. This scheme can realize the patching of multiple chips in a single batch through the linkage of multiple suction nozzles and positioning mechanisms, and theoretically can improve the production efficiency by 3-5 times. Therefore, it is widely used in high-density mounting scenes such as smart phone modules and wearable devices. However, this scheme has the problem of difficulty in changing product spacing. Since the spacing of multiple suction nozzles is fixed, when the spacing specification of mounted chips needs to be changed (such as switching from 0.5mm spacing to 0.8mm spacing), the entire suction nozzle set needs to be disassembled and replaced. This process not only takes a long time, but also needs to recalibrate the positioning accuracy of the suction nozzle, otherwise it is easy to cause chip deviation, false welding and other problems. On the other hand, for the mounting scene of medium and large size substrates, the turret type swing arm mounting method is often used. This method completes the actions of taking chips, moving and die bonding by rotating the swing arm to drive the suction nozzle. The existing swing arm structure integrates the suction nozzle, slider structure and downward driving structure. The swing arm is heavy and the rotation speed is slow, resulting in low patching efficiency. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the present application provides a turret type bulk patch machine, which uses an elastic swing arm to replace the swing arm integrated with a slider structure, and separates the downward pressure assembly from the swing arm, thereby reducing the weight of the swing arm to improve the rotation speed of the turntable. At the same time, through the design of a single suction nozzle swing arm, combined with the position adjustment of the micro-motion separation platform, the product spacing change can be adapted, and the production efficiency and adaptability can be further improved.

[0005] The technical scheme adopted by the present application to solve its technical problems is:

[0006] The application discloses a turret type bulk patching machine which comprises a rack and a die bonding table assembly, a bonding head assembly, a pressing assembly, a visual assembly, a vibration disc feeding assembly, a sorting assembly and a micro-motion separation platform which are mounted on the rack, wherein the bonding head assembly comprises a rotating disc, a rotating disc driving element for driving the rotating disc to rotate and a plurality of swing arms which are arranged in a ring shape on the rotating disc, each of the swing arms comprises a mounting seat, a connecting seat and an elastic plate, the mounting seat is fixedly connected with the rotating disc, one end of the elastic plate is fixedly connected with the connecting seat, the other end of the elastic plate is provided with a suction nozzle, and the connecting seat is fixedly connected with the elastic plate and located on the side close to the suction nozzle; one pressing assembly is arranged at a patch taking position and a patching position of the turret type bulk patching machine respectively, the pressing assembly comprises a pressing block and a lifting driving element for driving the pressing block to lift, and a pressure bearing part is arranged on the connecting seat, when the swing arm rotates to the position where the suction nozzle is located at the patch taking position or the patching position, the pressure bearing part is located directly below the pressing block, and the lifting driving element can push the pressure bearing part to move downward when the pressing block moves downward.

[0007] As a further improvement of the above technical scheme, the elastic plate has two plates, and the two plates are arranged in parallel in the vertical direction, and the suction nozzle is arranged in the vertical direction and connected with the two elastic plates.

[0008] As a further improvement of the above technical scheme, the suction nozzle is rotatably connected with the elastic plate through a bearing, and the swing arm further comprises a correction structure for driving the suction nozzle to rotate, wherein the correction structure comprises a correction motor and a transmission element, the correction motor is mounted on the mounting seat, and the transmission element is used for transmitting the torque of the correction motor to the suction nozzle.

[0009] As a further improvement of the above technical scheme, the transmission element is located between the two elastic plates, and the transmission element comprises a driving belt pulley arranged on the main shaft of the correction motor, a driven belt pulley arranged on the suction nozzle and a synchronous belt connected between the driving belt pulley and the driven belt pulley, and the connecting seat is provided with an avoiding hole for avoiding the synchronous belt.

[0010] As a further improvement of the above technical scheme, the pressure bearing part comprises a connecting plate arranged on the connecting seat and a first bearing arranged on the connecting plate, the axis of the first bearing is arranged in the horizontal direction, the bottom of the pressing block is provided with an arc-shaped block, and the arc-shaped block abuts against the outer circumferential surface of the first bearing when the pressing block moves downward.

[0011] As a further improvement of the above technical solution, the lifting drive includes a fixed seat, a lifting rod, an elastic member and a lifting motor, the fixed seat is provided with a mounting cavity, the lifting motor is mounted on the fixed seat, the main shaft of the lifting motor is provided with a driving ring, the driving ring is located in the mounting cavity, the bottom of the driving ring is provided with a helical surface, the lifting rod is slidingly connected to the fixed seat and extends into the mounting cavity, the bottom end of the lifting rod is connected with the lower pressing block, the top end of the lifting rod is provided with a connecting block, the second bearing is arranged on the connecting block, the top of the second bearing abuts against the helical surface, when the lifting motor drives the driving ring to rotate, the second bearing slidingly contacts with the helical surface, the elastic member is connected between the connecting block and the fixed seat, and the elastic member provides a vertical upward elastic force on the connecting block when compressed.

[0012] As a further improvement of the above technical solution, the fixed seat is provided with a sleeve, the lifting rod is arranged in the sleeve, and a linear bearing is arranged between the lifting rod and the sleeve.

[0013] As a further improvement of the above technical solution, the fixed seat is provided with a limiting structure, the limiting structure includes a limiting portion arranged on the connecting block and two limiting blocks arranged on the fixed seat, a limiting groove is formed between the two limiting blocks, and the limiting portion is connected in the limiting groove.

[0014] As a further improvement of the above technical solution, the vibration disc feeding assembly is used to provide chips, the sorting assembly is used for detecting and transferring the chips to the micro-motion separation platform, the micro-motion separation platform includes an X-axis micro-motion module, a Y-axis micro-motion module, a vibration feeding block and an adsorption block, the vibration feeding block is provided with a feeding groove, the adsorption block is provided with a containing groove, the containing groove is in communication with the feeding groove, the bottom of the containing groove is provided with an adsorption hole, the adsorption hole is connected with a vacuum device, the adsorption block is arranged at the driving end of the X-axis micro-motion module, and the X-axis micro-motion module is arranged at the driving end of the Y-axis micro-motion module.

[0015] As a further improvement of the above technical solution, the adsorption block is provided with a pair of sensors, the adsorption block is provided with an avoiding groove, the avoiding groove is in communication with the containing groove, and the rays of the pair of sensors pass through the avoiding groove.

[0016] The beneficial effects of the present application are: the elastic plate is used as the main part of the swing arm, the suction nozzle is arranged at one end of the elastic plate, and the lower pressing assembly is arranged on the rack and is arranged separately from the swing arm. When the lifting driving element of the lower pressing assembly drives the lower pressing block to move downward, the lower pressing block contacts the pressure bearing element and pushes the pressure bearing element to move downward, so that the elastic plate is deformed, and at the same time, the suction nozzle moves downward synchronously to take or paste the sheet. After the sheet is taken or pasted, the lifting driving element drives the lower pressing block to move upward, the elastic plate is reset under the action of its own elastic force, and then drives the suction nozzle to move upward to reset. Compared with the swing arm of the prior art which integrates the slider structure level lower pressing assembly, the present application uses the elastic plate as the main part of the swing arm, and the lower pressing structure and the swing arm structure are separated, thereby reducing the weight of the swing arm, rotating faster, and improving the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present application will be further described below in combination with the drawings and examples.

[0018] Figure 1 is a structural schematic view of a turret type bulk component mounter in one direction according to an embodiment of the present application;

[0019] Figure 2 is a structural schematic view of a turret type bulk component mounter in another direction according to an embodiment of the present application;

[0020] Figure 3 is a structural schematic view of a swing arm in a turret type bulk component mounter according to an embodiment of the present application;

[0021] Figure 4 is a structural schematic view of a transmission element in a turret type bulk component mounter according to an embodiment of the present application;

[0022] Figure 5 is a schematic view of the state of a swing arm before and after pressing in a turret type bulk component mounter according to an embodiment of the present application;

[0023] Figure 6 is a structural schematic view of a lower pressing assembly in a turret type bulk component mounter according to an embodiment of the present application;

[0024] Figure 7 is an exploded view of a lower pressing assembly in a turret type bulk component mounter according to an embodiment of the present application;

[0025] Figure 8 is a sectional view of a lower pressing assembly in a turret type bulk component mounter according to an embodiment of the present application;

[0026] Figure 9 is a structural schematic view of a driving ring in a turret type bulk component mounter according to an embodiment of the present application;

[0027] Figure 10is a schematic view of the connection between the driving ring and the second bearing in a turret type bulk patch machine according to an embodiment of the present application;

[0028] Figure 11 is a side view of the connection between the driving ring and the second bearing in a turret type bulk patch machine according to an embodiment of the present application;

[0029] Figure 12 is a schematic view of the limiting structure in a turret type bulk patch machine according to an embodiment of the present application;

[0030] Figure 13 is a schematic view of the micro-motion separation platform in a turret type bulk patch machine according to an embodiment of the present application;

[0031] Figure 14 is a schematic view of the containing groove in a turret type bulk patch machine according to an embodiment of the present application;

[0032] Figure 15 is a top view of the micro-motion separation platform in a turret type bulk patch machine according to an embodiment of the present application.

[0033] The drawings show: 100, a rack; 200, a die bonding table assembly; 210, a jig; 220, an X-axis transverse movement module; 230, a Y-axis transverse movement module; 300, a bonding head assembly; 310, a rotary disc; 320, a rotary motor; 330, a swing arm; 331, a mounting seat; 332, a connecting seat; 333, an elastic plate; 334, a suction nozzle; 335, a correction motor; 336, a transmission member; 3361, a driving pulley; 3362, a driven pulley; 3363, a synchronous belt; 337, a connecting plate; 338, a first bearing; 400, a pressing assembly; 410, a pressing block; 420, an arc-shaped block; 430, a lifting driving member; 431, a lifting rod; 432, a sleeve; 433, a connecting block; 434, a second bearing; 435, a third bearing; 436, a spring; 437, a guide rod; 438, a driving ring; 4381, a helical surface; 439, a fixing seat; 4310, a lifting motor; 4311, a fixing bearing; 4312, a limiting block; 4313, a linear bearing; 500, a vibrating disc feeding assembly; 600, a sorting assembly; 700, a micro-motion separation platform; 710, a vibrating feeding block; 711, a feeding groove; 720, an adsorption block; 721, a containing groove; 722, an adsorption hole; 723, an avoiding groove; 730, a pair of photoelectric sensors; 740, a support frame; 751, an X-axis support plate; 752, an X-axis motor; 753, an X-axis eccentric block; 754, a fourth bearing; 761, a Y-axis support plate; 762, a Y-axis motor; 763, a Y-axis eccentric block; 764, a fifth bearing; 770, a bottom plate; 780, a solenoid valve; 800, a vision assembly; 810, a patch camera; 820, a pick-up camera; 830, a correction camera. DETAILED DESCRIPTION

[0034] The concept, specific structure and generated technical effects of the present application will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purpose, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments, and other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative labor are within the protection scope of the present application. In addition, all the coupling / connection relationships involved in the patent do not mean that the components are directly connected, but that a better coupling structure can be composed by adding or reducing coupling accessories according to the specific implementation situation, such as fixed connection / fixed installation which can be selected according to the needs screw connection, bolt connection, pin connection, key connection, adhesion, mortise and tenon connection, welding, riveting and the like, and detachable connection which can be selected according to the needs screw connection, bolt connection, threaded connection, buckle connection, mortise and tenon connection, magic tape connection and the like. The technical features in the present application can be combined interactively without conflict.

[0035] With reference to Figure 1 and Figure 2 , the embodiment of the present application provides a turret type bulk patch machine, which comprises a rack 100 and a die bonding table assembly 200, a bonding head assembly 300, a pressing assembly 400, a visual assembly 800, a vibrating disc feeding assembly 500, a sorting assembly 600 and a micro-motion separation platform 700 installed on the rack 100, wherein the bulk chip is fed through the vibrating disc feeding assembly 500, and then transferred to the micro-motion separation platform 700 by the sorting assembly 600. The micro-motion separation platform 700 combines the visual assembly 800 to position the chip in order to accurately pick the chip by the bonding head assembly 300. The bonding head assembly 300 picks the chip under the cooperation of the pressing assembly 400, and then transfers the chip to the patch position to mount the chip on the corresponding position of the circuit board loaded on the die bonding table assembly 200, thereby completing the patch work.

[0036] In the embodiment, with reference to Figure 1 , the bonding head assembly 300 comprises a rotating disc 310, a rotating disc 310 driving member and a plurality of swing arms 330 arranged in a ring on the rotating disc 310. The rotating disc 310 driving member comprises a rotating motor 320, which is installed on the rack 100 and the main shaft thereof is vertically downward. The rotating disc 310 is installed on the main shaft of the rotating motor 320. The rotating disc 310 is driven to rotate by the rotating motor 320, so as to drive the plurality of swing arms 330 to rotate, thereby facilitating the transfer of the chip.

[0037] Specifically, with reference to Figure 3 and Figure 4The swing arm 330 comprises a mounting base 331, a connecting base 332 and two elastic plates 333. The mounting base 331 is fixedly connected with the rotating disc 310. The two elastic plates 333 are arranged in parallel in the vertical direction. One end of the elastic plate 333 is fixedly connected with the connecting base 332. The other end of the elastic plate 333 is provided with a suction nozzle 334. The suction nozzle 334 is connected with an external vacuum equipment. The chip is sucked under negative pressure, and the chip is released under broken vacuum. The connecting base 332 is fixedly connected on the elastic plate 333 and close to one side of the suction nozzle 334.

[0038] It can be understood that, due to the elasticity of the elastic plate 333, when the connecting base 332 is not subjected to external force, the elastic plate 333 is in a state of elastic deformation, i.e. the side of the elastic plate 333 close to the suction nozzle 334 is in a state of elastic deformation, and the suction nozzle 334 is in a state of elastic deformation. Figure 5 When external force is applied on the connecting base 332, the elastic plate 333 will be elastically deformed, i.e. the side of the elastic plate 333 close to the suction nozzle 334 will move downward, so as to drive the suction nozzle 334 to move downward, so as to facilitate the picking or pasting of the chip.

[0039] In the embodiment, the two elastic plates 333 are arranged in a spaced manner and are fixed with the connecting base 332. The picking height and the pasting height of the chip mounter are arranged at the same height. During the debugging of the chip mounter, the levelness of the suction nozzle 334 is adjusted based on the picking height, so as to ensure that the suction nozzle 334 is horizontal relative to the chip during the picking and pasting of the chip, thereby ensuring the stable picking and pasting of the chip.

[0040] In addition, in the embodiment, only one suction nozzle 334 is arranged on each swing arm 330, and one chip is picked each time. When the interval of the customer product changes, the change can be quickly adapted.

[0041] Further, the elastic plate 333 is provided with a mounting hole, and the suction nozzle 334 is rotatably connected in the mounting hole. Preferably, a ball bearing is arranged between the suction nozzle 334 and the mounting hole, the inner ring of the ball bearing is connected with the suction nozzle 334 in an interference fit, and the outer ring of the ball bearing is connected with the mounting hole in an interference fit, so that the suction nozzle 334 can be fixed on the elastic plate 333 and can rotate relative to the elastic plate 333. The swing arm 330 further comprises a correction structure, which comprises a correction motor 335 and a transmission member 336. The correction motor 335 is mounted on the mounting seat 331, and the transmission member 336 is located between the two elastic plates 333. The transmission member 336 is used for transmitting the torque of the correction motor 335 to the suction nozzle 334. Specifically, the transmission member 336 comprises a driving belt pulley 3361 arranged on the main shaft of the correction motor 335, a driven belt pulley 3362 arranged on the suction nozzle 334, and a synchronous belt 3363 connected between the driving belt pulley 3361 and the driven belt pulley 3362. The connecting seat 332 is provided with a relief hole for avoiding the synchronous belt 3363. When the correction motor 335 operates, the suction nozzle 334 is rotated under the transmission of the synchronous belt 3363, and then the angle of the chip on the suction nozzle 334 is corrected.

[0042] Further, with reference to Figure 3 , the connecting seat 332 is provided with a pressure receiving member, which comprises a connecting plate 337 arranged on the connecting seat 332 and a first bearing 338 arranged on the connecting plate 337. The axis of the first bearing 338 is arranged in a horizontal direction, and the central shaft of the first bearing 338 is fixedly connected to two protrusions on the connecting plate 337.

[0043] In this embodiment, the picking position and the placing position of the turret type bulk patch machine are respectively provided with one lower pressing assembly 400. With reference to Figure 6 , the lower pressing assembly 400 comprises a lower pressing block 410 and a lifting driving member 430 for driving the lower pressing block 410 to lift. The bottom of the lower pressing block 410 is provided with an arc-shaped block 420. When the swing arm 330 rotates to the position where the suction nozzle 334 is located at the picking position or the placing position, the pressure receiving member is located directly below the lower pressing block 410. At this time, when the lower pressing block 410 is driven to move downward by the lifting driving member 430, the arc-shaped block 420 abuts against the outer periphery of the first bearing 338, so that the elastic plate 333 is subjected to a downward force and deforms to drive the suction nozzle 334 to move downward.

[0044] It can be understood that the present application adopts the elastic plate 333 as the main part of the swing arm 330, the elastic plate 333 adopts the carbon fiber plate, has good elasticity, and is lighter in quality, and in addition, the lower pressing assembly 400 and the swing arm 330 are arranged separately, through the above arrangement, the weight of the swing arm 330 is reduced, the rotating speed of the rotating disc 310 can be faster, thereby improving the production efficiency.

[0045] In the embodiment, with reference to Figures 7-11 , the lifting driving piece 430 comprises a fixing seat 439, a lifting rod 431, an elastic piece and a lifting motor 4310, the fixing seat 439 is internally provided with a mounting cavity, the lifting motor 4310 is installed on the fixing seat 439, a fixed bearing 4311 is arranged between the main shaft of the lifting motor 4310 and the fixing seat 439, and the stability of the rotation of the main shaft of the lifting motor 4310 is ensured. The bottom of the main shaft of the lifting motor 4310 is fixedly connected with a driving ring 438, the driving ring 438 is located in the mounting cavity, and the bottom of the driving ring 438 is provided with a helical surface 4381. The fixing seat 439 is fixedly connected with a sleeve 432, the lifting rod 431 passes through the sleeve 432, and a linear bearing 4313 is arranged between the lifting rod 431 and the sleeve 432, so that the stability of the lifting rod 431 moving up and down in the vertical direction is ensured. The bottom end of the lifting rod 431 is connected with the lower pressing block 410, the top end of the lifting rod 431 extends into the mounting cavity, and the top end of the lifting rod 431 is provided with a connecting block 433, the connecting block 433 is provided with a second bearing 434, and the top of the outer circumferential surface of the second bearing 434 abuts against the helical surface 4381. The elastic piece comprises a guide rod 437 and a spring 436 sleeved on the guide rod 437, the guide rod 437 is vertically arranged, the top end of the guide rod 437 is fixedly connected with the connecting block 433, the bottom end of the guide rod 437 is fixedly connected with the fixing seat 439, and the spring 436 abuts against the connecting block 433 and the fixing seat 439.

[0046] It can be understood that when the lifting motor 4310 drives the driving ring 438 to rotate, the second bearing 434 is in sliding contact with the helical surface 4381, with reference to Figure 9, the helical surface 4381 at the bottom of the driving ring 438 is a continuous gradient structure, the height of which gradually decreases from the starting end (close to the side of the lifting motor 4310) to the end (far from the side of the lifting motor 4310), for driving the second bearing 434 to move up and down by rotating, that is, when the second bearing 434 moves from the starting end of the helical surface 4381 to the end of the helical surface 4381, the second bearing 434 moves downward under the action of the helical surface 4381, thereby pushing the connecting block 433, the lifting rod 431, the pressing block 410 and the arc-shaped block 420 to move downward, realizing the pressing action of the suction nozzle 334, so as to take or paste the sheet, and at the same time, the spring 436 is compressed. When the taking or pasting action is completed, the lifting motor 4310 drives the driving ring 438 to rotate reversely, that is, when the second bearing 434 moves from the end of the helical surface 4381 to the starting end of the helical surface 4381, the restoring force of the spring 436 drives the connecting block 433 to move upward, thereby driving the lifting rod 431, the pressing block 410 and the arc-shaped block 420 to move upward, and driving the suction nozzle 334 to move upward and reset under the action of the restoring force of the elastic plate 333.

[0047] Preferably, referring to Figure 8 and Figure 12 , the fixing seat 439 is provided with a limiting structure, the limiting structure comprises a limiting part arranged on the connecting block 433 and two limiting blocks 4312 arranged on the fixing seat 439, the limiting blocks 4312 can be integrally formed with the fixing seat 439 or be fixed on the fixing seat 439 by screws, a limiting groove is formed between the two limiting blocks 4312, and the limiting part is connected in the limiting groove, so that the upward and downward movement of the connecting block 433 is limited, and the circumferential deflection of the connecting block 433 when moving is prevented. Further, the limiting part comprises a third bearing 435 arranged on the connecting block 433, the circumferential surface of the third bearing 435 is in contact with the two limiting blocks 4312 respectively, the width of the limiting groove matches the outer diameter of the third bearing 435 when the connecting block 433 moves upward and downward, only allowing the third bearing 435 to slide upward and downward, limiting the circumferential rotation of the connecting block 433, and ensuring the vertical lifting of the lifting rod 431. When the third bearing 435 moves upward and downward in the limiting groove, the third bearing 435 rolls relative to the limiting blocks 4312, has a small friction force, and ensures the smooth upward and downward movement of the connecting block 433.

[0048] In the embodiment, the die bonding table assembly 200, the visual assembly 800, the vibration tray feeding assembly 500 and the sorting assembly 600 are all the assemblies of the prior art. For example, the die bonding table assembly 200 comprises a jig 210, an X-axis transverse movement module 220 and a Y-axis transverse movement module 230. The Y-axis transverse movement module 230 is installed on the rack 100, the X-axis transverse movement module 220 is installed on the driving end of the Y-axis transverse movement module 230, and the jig 210 is installed on the driving end of the X-axis transverse movement module 220. The jig 210 is used to load the circuit board, and the X-axis transverse movement module 220 and the Y-axis transverse movement module 230 are respectively used to drive the jig 210 to move in the X-axis and Y-axis directions, so as to adjust the position of the patch. Specifically, the X-axis transverse movement module 220 and the Y-axis transverse movement module 230 can adopt linear motors. For example, the vibration tray feeding assembly 500 comprises a feeding hopper, a vibration tray and a discharge slot. The chip enters the vibration tray from the feeding hopper, and is sorted and oriented by the vibration tray and then conveyed to the discharge slot. For example, the sorting assembly 600 comprises a turret robot and a detection assembly. The turret robot takes the chip from the discharge port of the vibration tray feeding assembly 500, and then the chip is corrected and inspected for electrical performance and polarity by the detection assembly. The defective chip is put into a waste container, and the good chip is put into the micro-motion separation platform 700. The visual assembly 800 comprises a patch camera 810, a chip taking camera 820 and a correction camera 830. The patch camera 810 is located at the patch position, takes a photo of the patch position of the circuit board, and cooperates with the die bonding table assembly 200 to ensure the accuracy of the patch. The chip taking camera 820 is located at the chip taking position, takes a photo of the chip taking position of the micro-motion separation platform 700, and cooperates with the micro-motion separation platform 700 to ensure the accuracy of the chip taking. The correction camera 830 is located at the correction position between the chip taking position and the patch position. When the suction nozzle 334 sucks the chip and moves to the correction position, the correction camera 830 takes a photo of the chip, detects the deviation of the chip taking position, drives the suction nozzle 334 to rotate by the correction motor 335, so as to compensate for the patch position and improve the patch accuracy.

[0049] In the embodiment, with reference to Figures 13-15 , the micro-motion separation platform 700 comprises an X-axis micro-motion module, a Y-axis micro-motion module, a vibration feeding block 710 and a suction block 720. The vibration feeding block 710 is provided with a linear feeding slot 711, and the suction block 720 is provided with a containing groove 721 in communication with the feeding slot 711. After the sorting assembly 600 transfers the chip provided by the vibration tray feeding assembly 500 into the feeding slot 711, the vibration feeding block 710 is fixedly connected with a vibration motor (not shown) at the bottom. The vibration motor drives the vibration feeding block 710 to generate high-frequency micro-amplitude vibration after being powered on, so that the chip in the feeding slot 711 moves along the groove body direction to the containing groove 721.

[0050] The bottom of the accommodating groove 721 is provided with an adsorption hole 722, the adsorption hole 722 is connected with a vacuum device through a vacuum pipeline, an electromagnetic valve 780 is arranged on the vacuum pipeline, the air pressure state of the adsorption hole 722 is controlled through the electromagnetic valve 780, when the chip moves into the accommodating groove 721, the adsorption hole 722 generates negative pressure to adsorb and fix the chip, so that the chip flying is avoided, when the suction nozzle 334 takes the chip, the chip is not adsorbed because the adsorption hole 722 is broken vacuum, and the chip is convenient for the suction nozzle 334 to take away.

[0051] Preferably, the adsorption block 720 is provided with a pair of sensors 730, the adsorption block 720 is provided with an avoidance groove 723, the avoidance groove 723 is communicated with the accommodating groove 721, the rays of the pair of sensors 730 are arranged in the avoidance groove 723, when the chip moves into the accommodating groove 721, the rays are blocked, so that whether the chip is in the accommodating groove 721 can be detected through the pair of sensors 730.

[0052] In the embodiment, the adsorption block 720 is arranged at the driving end of the X-axis micro-motion module, the X-axis micro-motion module is arranged at the driving end of the Y-axis micro-motion module, the position of the chip in the X-axis and Y-axis directions is adjusted through the X-axis micro-motion module and the Y-axis micro-motion module, the different chip taking positions of each suction nozzle 334 can be corresponded, and the chip taking precision and stability are improved.

[0053] Specifically, referring to Figure 13 and Figure 15The Y-axis micro-motion module comprises a bottom plate 770, a Y-axis cross guide rail, a Y-axis support plate 761 and a Y-axis motor 762, the bottom plate 770 is fixedly connected to the rack 100, the Y-axis support plate 761 is slidably connected to the bottom plate 770 through the Y-axis cross guide rail along the Y-axis direction, the main shaft of the Y-axis motor 762 is connected with a first eccentric shaft through a Y-axis eccentric block 763, a fifth bearing 764 is arranged on the first eccentric shaft, a first groove in sliding contact with the fifth bearing 764 is arranged on the Y-axis support plate 761, when the Y-axis motor 762 drives the first eccentric shaft to rotate, the fifth bearing 764 abuts against the side wall of the first groove, so that the Y-axis support plate 761 is driven to move along the Y-axis direction. The X-axis micro-motion module comprises an X-axis cross guide rail, an X-axis support plate 751 and an X-axis motor 752, the X-axis support plate 751 is slidably connected to the Y-axis support plate 761 through the X-axis cross guide rail along the X-axis direction, the main shaft of the X-axis motor 752 is connected with a second eccentric shaft through an X-axis eccentric block 753, a fourth bearing 754 is arranged on the second eccentric shaft, a second groove in sliding contact with the fourth bearing 754 is arranged on the X-axis support plate 751, when the X-axis motor 752 drives the second eccentric shaft to rotate, the fourth bearing 754 abuts against the side wall of the second groove, so that the X-axis support plate 751 is driven to move along the X-axis direction. The adsorption block 720 is connected to the X-axis support plate 751 through a support frame 740, so that the position of the adsorption block 720 is adjusted by the operation of the X-axis motor 752 and the Y-axis motor 762.

[0054] In the embodiment, the first bearing 338, the second bearing 434, the third bearing 435, the fourth bearing 754 and the fifth bearing 764 can be replaced by structures such as rollers, so as to reduce friction and make the movement of each component more stable.

[0055] The above is a specific description of the preferred embodiment of the application, but the application is not limited to the above-mentioned embodiment, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A turret-type chip mounter, comprising a frame and a die bonder assembly, a die bonder assembly, a die press assembly, a vision assembly, a vibratory feeder assembly, a sorting assembly, and a micro-motion separation platform mounted on the frame, characterized in that: The head assembly includes a turntable, a turntable drive for driving the turntable to rotate, and a plurality of swing arms arranged in a ring on the turntable. Each swing arm includes a mounting base, a connecting base, and an elastic plate. The mounting base is fixedly connected to the turntable. One end of the elastic plate is fixedly connected to the connecting base. The other end of the elastic plate is provided with a suction nozzle. The connecting base is fixedly connected to the elastic plate and to the side close to the suction nozzle. The turret-type bulk material placement machine is provided with a pressing assembly at both the pick-up and placement positions. The pressing assembly includes a pressing block and a lifting drive for driving the pressing block to move up and down. A pressure-bearing component is provided on the connecting seat. When the swing arm rotates to the position where the suction nozzle is located at the pick-up or placement position, the pressure-bearing component is located directly below the pressing block. When the lifting drive drives the pressing block to move downward, it can push the pressure-bearing component to move downward. The vibratory feeder assembly is used to provide chips, and the sorting assembly is used to detect and transfer the chips to the micro-motion separation platform. The micro-motion separation platform includes an X-axis micro-motion module, a Y-axis micro-motion module, a vibratory feeder block, and an adsorption block. The vibratory feeder block is provided with a feed groove, and the adsorption block is provided with a receiving groove. The receiving groove is connected to the feed groove, and the bottom of the receiving groove is provided with an adsorption hole. The adsorption hole is connected to a vacuum device. The adsorption block is located at the drive end of the X-axis micro-motion module, and the X-axis micro-motion module is located at the drive end of the Y-axis micro-motion module.

2. The turret-type bulk material placement machine according to claim 1, characterized in that: The elastic plate has two pieces, which are arranged parallel to each other in the vertical direction. The suction nozzle is arranged in the vertical direction and connected to both elastic plates.

3. A turret-type bulk material patching machine according to claim 2, characterized in that: The suction nozzle and the elastic plate are rotatably connected by a bearing. The swing arm also includes a correction structure for driving the suction nozzle to rotate. The correction structure includes a correction motor and a transmission component. The correction motor is mounted on the mounting base, and the transmission component is used to transmit the torque of the correction motor to the suction nozzle.

4. A turret-type bulk material placement machine according to claim 3, characterized in that: The transmission component is located between the two elastic plates. The transmission component includes a drive pulley on the main shaft of the correction motor, a driven pulley on the suction nozzle, and a synchronous belt connecting the drive pulley and the driven pulley. The connecting seat is provided with a clearance hole to avoid the synchronous belt.

5. A turret-type bulk material patching machine according to claim 1, characterized in that: The pressure-bearing component includes a connecting plate disposed on the connecting seat and a first bearing disposed on the connecting plate. The axis of the first bearing is arranged in a horizontal direction. An arc-shaped block is disposed at the bottom of the lower pressure block. When the lower pressure block moves downward, the arc-shaped block abuts against the outer peripheral surface of the first bearing.

6. A turret-type bulk material patching machine according to claim 5, characterized in that: The lifting drive component includes a fixed base, a lifting rod, an elastic element, and a lifting motor. The fixed base has an installation cavity, and the lifting motor is mounted on the fixed base. The main shaft of the lifting motor has a drive ring located within the installation cavity. The bottom of the drive ring has a helical surface. The lifting rod is slidably connected to the fixed base and extends into the installation cavity. The bottom end of the lifting rod is connected to the lower pressure block, and the top end of the lifting rod has a connecting block. A second bearing is mounted on the connecting block, and the top of the second bearing abuts against the helical surface. When the lifting motor drives the drive ring to rotate, the second bearing slides in contact with the helical surface. The elastic element connects the connecting block and the fixed base, and when compressed, it provides an upward elastic force acting on the connecting block.

7. A turret-type bulk material patching machine according to claim 6, characterized in that: The fixed base is provided with a sleeve, the lifting rod passes through the sleeve, and a linear bearing is provided between the lifting rod and the sleeve.

8. A turret-type bulk material patching machine according to claim 6, characterized in that: The fixed base is provided with a limiting structure, which includes a limiting part disposed on the connecting block and two limiting blocks disposed on the fixed base. A limiting groove is formed between the two limiting blocks, and the limiting part is connected to the limiting groove.

9. A turret-type bulk material patching machine according to claim 1, characterized in that: The adsorption block is equipped with a through-beam sensor and a clearance groove, which is connected to the receiving groove. The rays of the through-beam sensor pass through the clearance groove.

Images