Display panel, method for manufacturing display panel, and display device

Abstract

Embodiments of the present application provide a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a pixel definition layer, an isolation structure, a light-emitting functional layer and a first electrode layer. The pixel definition layer comprises a pixel limiting portion and a plurality of pixel openings. The pixel limiting portion comprises a first limiting layer and a second limiting layer. The isolation structure is arranged on a side of the second limiting layer away from the substrate. The isolation structure encloses to form a plurality of isolated openings. The isolated openings and the pixel openings are in communication. The light-emitting functional layer comprises a plurality of light-emitting units. The first electrode layer comprises a plurality of first electrodes. The first electrode comprises a first conductive layer and a second conductive layer. The second conductive layer comprises a second connecting portion and a second edge portion connected with each other. The second connecting portion is in contact with the first conductive layer and the light-emitting unit on opposite sides in a direction perpendicular to the substrate. The second edge portion is arranged in a spaced manner with the first conductive layer and is located between the first limiting layer and the second limiting layer. The display panel provided by the present application has high reliability.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, in related technologies, the edges of the first electrode used to drive the light-emitting unit are uneven, resulting in uneven distribution of the film layer on one side of the first electrode, which leads to low reliability of the display panel. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the uniformity of the film layer distribution on one side of the first electrode and improve the reliability of the display panel.

[0006] An embodiment of the first aspect of this application provides a display panel, including:

[0007] substrate;

[0008] A pixel definition layer is disposed on one side of a substrate. The pixel definition layer includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion. The pixel defining portion includes a first defining layer and a second defining layer. The second defining layer is located on the side of the first defining layer away from the substrate.

[0009] An isolation structure is disposed on the side of the second limiting layer away from the substrate. The isolation structure encloses and forms multiple isolation openings, and the isolation openings are connected to the corresponding pixel openings.

[0010] a light-emitting functional layer including a plurality of light-emitting units, at least part of the light-emitting units being arranged in the pixel opening and extending along the sidewall of the second defining layer towards the corresponding pixel opening;

[0011] a first electrode layer including a plurality of first electrodes, the first electrode including a first conductive layer and a second conductive layer, the first conductive layer being located on the side of the first defining layer close to the substrate, the second conductive layer including a second connecting portion and a second edge portion connected to each other, the second connecting portion being in contact with the first conductive layer and the light-emitting unit on opposite sides in a direction perpendicular to the substrate, and the second edge portion being arranged apart from the first conductive layer and located between the first defining layer and the second defining layer.

[0012] Embodiments of the second aspect of the present application further provide a display panel, comprising:

[0013] a substrate;

[0014] a pixel definition layer arranged on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion being enclosed, and the pixel defining portion including a first defining layer and a second defining layer, the second defining layer being located on the side of the first defining layer away from the substrate;

[0015] an isolation structure arranged on the side of the pixel defining portion away from the substrate, the isolation structure enclosing a plurality of isolation openings, and the isolation opening and the corresponding pixel opening being in communication;

[0016] a light-emitting functional layer including a plurality of light-emitting units, at least part of the light-emitting units being arranged in the pixel opening and extending along the sidewall of the second defining layer towards the corresponding pixel opening;

[0017] a protective layer having a first opening in communication with the pixel opening;

[0018] a first electrode layer including a plurality of first electrodes, the first electrode being arranged on the side of the light-emitting unit away from the substrate, the first electrode including a first conductive layer and a second conductive layer, the first conductive layer, the protective layer and the first defining layer being sequentially stacked, the protective layer having a first opening in communication with the pixel opening, part of the second conductive layer being located in the first opening and between the first conductive layer and the light-emitting unit, and part of the second conductive layer being located between the first defining layer and the second defining layer.

[0019] Embodiments of the third aspect of the present application further provide a preparation method of a display panel, comprising:

[0020] arranging at least one conductive material layer on one side of the substrate, and performing a patterning process on the at least one conductive material layer, the at least one conductive material layer including a first conductive material layer, and the first conductive material layer forming a plurality of spaced first conductive layers;

[0021] The first conductive layer is partially overlapped with a projection of the first limiting layer on the substrate, the first limiting layer has a second opening, the second opening exposes a part of the first conductive layer, the etching protection structure is located on a side of the first limiting layer away from the substrate, and a projection of a surface of the etching protection structure on the substrate is located in a projection of a surface of the etching protection structure on the substrate;

[0022] The second conductive material layer is arranged on the substrate, the second conductive material layer is disconnected at an edge of the etching protection structure, the second conductive material layer located in the second opening and in contact with the first conductive layer forms a second connecting part of the second conductive layer, the second conductive material layer in contact with the first limiting layer forms a second edge part of the second conductive layer, and the second edge part is arranged in a spaced manner from the first conductive layer;

[0023] The etching protection structure is removed;

[0024] The second limiting material layer and the isolation material layer are sequentially arranged on the substrate, the isolation material layer and the second limiting material layer are subjected to patterning processing, the second limiting material layer forms a second limiting layer, the second edge part is located between the first limiting layer and the second limiting layer, the first limiting layer and the second limiting layer enclose a plurality of pixel openings, the isolation material layer forms an isolation structure, the isolation structure encloses a plurality of isolation openings, and the isolation opening and the corresponding pixel opening are in communication;

[0025] A plurality of light emitting units and a plurality of second electrodes are prepared, at least part of the light emitting unit is arranged in the pixel opening and located on a side of the second connecting part away from the first conductive layer, the light emitting unit extends along the second limiting layer towards the sidewall of the corresponding pixel opening, and the second electrode is located on a side of the light emitting unit away from the substrate.

[0026] Embodiments of the fourth aspect of the application further provide a display device, including the display panel provided in any one of the first aspect, the second aspect, or the display panel prepared in any one of the third aspect.

[0027] In the display panel provided in the embodiments of the application, the relative two sides of the second connecting part are arranged in contact with the first conductive layer and the light emitting unit respectively, so that the first conductive layer, the second connecting part and the light emitting unit can be sequentially electrically connected, and the first electrode provides a voltage for the light emitting unit. By arranging the pixel limiting part to include the first limiting layer and the second limiting layer, and arranging the first conductive layer on a side of the first limiting layer close to the substrate, when a crack is generated in the first limiting layer extending along the first conductive layer, the second limiting layer on the side of the first limiting layer can cover the crack, thereby reducing or avoiding the crack in the pixel definition layer from exposing the film layer that does not need to be exposed. BRIEF DESCRIPTION OF DRAWINGS

[0028] Other features, objects, and advantages of the application will become more apparent from the following detailed description when read in conjunction with the accompanying drawings, in which like reference numerals indicate identical or functionally similar elements. In the drawings:

[0029] Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the application;

[0030] Figure 2 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0031] Figure 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0032] Figure 4 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0033] Figure 5 is a schematic diagram of a pixel driving circuit of a display panel provided by an embodiment of the application;

[0034] Figure 6 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0035] Figure 7 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0036] Figure 8 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0037] Figure 9 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0038] Figure 10 is a schematic diagram of a partial cross-sectional structure of a display panel provided by an embodiment of the application;

[0039] Figure 11 is a schematic diagram of a preparation method of a display panel provided by an embodiment of the application.

[0040] Legend of reference signs:

[0041] 1, substrate; 11, substrate; 12, transistor; T1, driving transistor; T2, switching transistor; 13, driving circuit layer; 14, planar layer;

[0042] 2, pixel definition layer; 21, first definition layer; 211, first definition part; 212, second definition part; 22, second definition layer; 221, third definition part; 222, fourth definition part; 23, pixel opening;

[0043] 30a, first light emitting device; 30b, second light emitting device; 30c, third light emitting device; 3, light emitting unit;

[0044] 4, first electrode; 41, first conductive layer; 411, first connection part; 412, first edge part; 42, second conductive layer; 421, second connection part; 422, second edge part; 43, third conductive layer; 44, protective layer; 441, first opening;

[0045] 5, second electrode; 511, main body part; 512, contact part;

[0046] 6, isolation structure; 61, first sub-layer; 62, second sub-layer; 63, third sub-layer; 64, isolation opening; 64a, first isolation opening; 64b, second isolation opening; 64c, third isolation opening;

[0047] 71, encapsulation part; 72, second encapsulation layer; 73, third encapsulation layer;

[0048] AA, display area; NA, non-display area; PX, sub-pixel; SPX1, first sub-pixel; SPX2, second sub-pixel; SPX3, third sub-pixel;

[0049] 200, etching protection structure; 410, first conductive material layer; 430, third conductive material layer; 440, first etching protection layer;

[0050] Z, first direction; X, second direction; Y, third direction. DETAILED DESCRIPTION

[0051] In order to make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the following will be used to clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0053] It should be noted that similar reference numerals and letters refer to like items in the accompanying drawings, and once an item is defined in one drawing, it is not necessary to further define and explain it in subsequent drawings. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0054] For easy understanding, the X-axis, Y-axis and Z-axis which are orthogonal to each other are shown in the drawings. The direction along the X-axis is referred to as the X direction, the direction along the Y-axis is referred to as the Y direction, and the direction along the Z-axis is referred to as the Z direction. The Z direction is the normal direction with respect to the plane containing the X direction and the Y direction. In addition, the case where various elements are observed in parallel with the plane containing the X direction and the Y direction is referred to as a plan view. Or the plane of the X direction and the Y direction is a plane parallel to the display surface of the display panel, and the Z direction is a direction parallel to the thickness direction of the display panel.

[0055] For some elements, the terms "upper" or "above" are used when describing the position of an element in the Z direction, and the terms "lower" or "below" are used when describing the position of an element in the opposite direction. In addition, when the terms "upper", "above", "lower", "below", "relative" and the like are used to define the positional relationship between two elements, they not only include the case where the two elements are directly connected, but also include the case where the two elements are separated by a gap or other elements. In addition, the terms "first", "second", "third" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0056] In the related art, the edge of the first electrode for driving the light-emitting unit is not aligned, so that the film layer on the side of the first electrode is unevenly distributed, resulting in low reliability of the display panel.

[0057] For example, the undercut structure on the side of the first electrode close to the substrate causes the pixel definition layer, isolation structure and the like on the side of the first electrode to be broken, and the broken film layer exposes the film layer to be protected, resulting in corrosion of the film layer to be protected by the reagent used in the process of preparing the display panel. Not only does it affect the structure of the subsequent film layer, but it also may cause the encapsulation layer to fail to encapsulate the light-emitting structure, resulting in low reliability of the display panel.

[0058] Figure 1 is a structural schematic diagram of a display panel according to an embodiment of the present application. The display panel can be an organic light-emitting diode display panel (Organic Light Emitting Diode, abbreviated as OLED), a quantum dot electroluminescent display panel (Quantum Dot Light Emitting Diodes, abbreviated as QLED). The display panel includes a display area AA having a display function and a non-display area NA.

[0059] The display area AA of the display panel can have a rectangular shape, or a square, circular, or elliptical shape, or other shapes.

[0060] The display area AA includes a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, the pixel PX includes a sub-pixel SPX emitting white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3.

[0061] For reference, see Figure 2 The sub-pixel SPX includes a pixel driving circuit and a light emitting device driven by the pixel driving circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light emitting device 30a, the second sub-pixel SPX2 includes a second light emitting device 30b, and the third sub-pixel SPX3 includes a third light emitting device 30c. One pixel driving circuit drives at least one light emitting device to emit light. For example, the display area AA includes a normal display area AA and a light transmission display area AA. The light transmission display area AA is a display area AA provided for a sensor and having a light transmission property. The normal display area AA is a display area AA not provided for a sensor. In the normal display area AA, one pixel driving circuit drives one light emitting device to emit light. In the light transmission display area AA, one pixel driving circuit drives one or more light emitting devices to emit light.

[0062] For example, as shown in FIG. 1, the display panel 10 includes a display area AA and a non-display area NA. The display area AA includes a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, the pixel PX includes a sub-pixel SPX emitting white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3. Figures 2-3As shown, the display panel provided by the first aspect of the present application includes a substrate 1, a pixel definition layer 2, an isolation structure 6, a light-emitting functional layer, and a first electrode layer. The pixel definition layer 2 is arranged on one side of the substrate 1. The pixel definition layer 2 includes a pixel limiting portion and a plurality of pixel openings 23 formed by the pixel limiting portion. The pixel limiting portion includes a first limiting layer 21 and a second limiting layer 22. The second limiting layer 22 is located on the side of the first limiting layer 21 away from the substrate 1. The isolation structure 6 is arranged on the side of the second limiting layer 22 away from the substrate 1. The isolation structure 6 forms a plurality of isolation openings 64. The isolation opening 64 and the corresponding pixel opening 23 are in communication. The light-emitting functional layer includes a plurality of light-emitting units 3. At least part of the light-emitting unit 3 is arranged in the pixel opening 23 and extends along the side wall of the corresponding pixel opening 23 towards the second limiting layer 22. The first electrode layer includes a plurality of first electrodes 4. The first electrode 4 includes a first conductive layer 41 and a second conductive layer 42. The first conductive layer 41 is located on the side of the first limiting layer 21 close to the substrate 1. The second conductive layer 42 includes a second connecting portion 421 and a second edge portion 422 connected with each other. The second connecting portion 421 is in contact with the first conductive layer 41 and the light-emitting unit 3 on the opposite sides in the direction perpendicular to the substrate 1. The second edge portion 422 is arranged apart from the first conductive layer 41 and located between the first limiting layer 21 and the second limiting layer 22.

[0063] Please refer to Figure 4 The substrate 1 can be arranged in various ways. Optionally, the substrate 1 further includes a substrate 11 and a pixel driving circuit. For example, the substrate 1 includes a substrate 11, a driving circuit layer 13 arranged on the substrate 11, and a planar layer 14. The pixel driving circuit includes a transistor 12 and a capacitor. The capacitor includes a first plate and a second plate. The transistor 12 includes a source, a drain, a gate, and a semiconductor layer. The driving circuit layer 13 further includes a plurality of signal lines, such as a data signal line, a scan signal line, a driving power voltage signal line, and the like. The driving circuit layer 13 includes a plurality of conductive layers, such as a first metal layer, a second metal layer, and a third metal layer. The gate and the first plate can be located on the first metal layer. The second plate can be located on the second metal layer. The source and the drain can be located on the third metal layer.

[0064] Optionally, referring to Figure 5 The pixel driving circuit includes a driving transistor T1 and a switching transistor T2. The source of the switching transistor T2 is connected to a data line L1 providing a data signal Data. The gate of the switching transistor T2 is connected to a scan line L2 providing a scan signal Scan. The drain of the switching transistor T2 is connected to the gate of the driving transistor T1. The two ends of a storage capacitor C are respectively connected to the gate and the source of the driving transistor T1. The source of the driving transistor T1 is connected to a first power signal line L3. The drain of the driving transistor T1 is connected to a light-emitting unit 3. The light-emitting unit 3 is connected to a second power signal line L4. Figure 5is one embodiment of the pixel driving circuit, and the pixel driving circuit of the present application is not limited to Figure 5 The pixel driving circuit shown in FIG. 2T1C can also be other pixel driving circuits, such as 7T1C, 8T1C pixel driving circuits, etc.

[0065] Please refer to Figure 2 and Figure 3 Optionally, the substrate 1 is provided with a first electrode layer, the first electrode layer includes a plurality of first electrodes 4 arranged in an array, each first electrode 4 is arranged corresponding to each pixel opening 23, and the first electrode 4 is used to drive the light emitting unit 3 to emit light. Part of the first electrode 4 is exposed by the pixel opening 23, and another part of the first electrode 4 is located between the pixel defining part and the substrate 1.

[0066] The first electrode 4 can include a multi-layer structure, for example, the first electrode 4 includes a plurality of conductive layers, the plurality of conductive layers can be 2 layers, 3 layers, 4 layers, etc. Any two conductive layers can be prepared by using the same material or different materials. When the first electrode 4 includes 2 conductive layers, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42 which are in laminated contact. When the first electrode 4 includes 3 conductive layers, the first electrode 4 includes the first conductive layer 41 and the second conductive layer 42 which are in laminated contact, and 1 conductive layer arranged on the side of the first conductive layer 41 close to the substrate 1. When the first electrode 4 includes 4 conductive layers, the first electrode 4 includes the first conductive layer 41 and the second conductive layer 42 which are in laminated contact, and 2 conductive layers arranged on the side of the first conductive layer 41 close to the substrate 1, and so on.

[0067] There are many ways to set the material of the pixel definition layer 2, for example, the material of the pixel definition layer 2 is inorganic material, for example, the pixel definition layer 2 is formed by using at least one of inorganic insulating materials such as silicon nitride (SiN x ), silicon oxide (SiO x ), and silicon oxynitride (SiON).

[0068] In one embodiment, the pixel definition layer 2 includes a plurality of sub-layers, and the pixel definition layer 2 includes a first limiting layer 21 and a second limiting layer 22 which are arranged in sequence in the direction away from the substrate 1, that is, the pixel definition layer 2 can be designed as double layers. The pixel opening 23 can penetrate the first limiting layer 21 and the second limiting layer 22, at least part of the light emitting unit 3 is arranged in the pixel opening 23, and the light emitting unit 3 further extends along the second limiting layer 22 towards the sidewall of the corresponding pixel opening 23.

[0069] The second conductive layer 42 includes a second connecting portion 421 and a second edge portion 422 connected with each other, and the second connecting portion 421 and the second edge portion 422 can be formed together. The second edge portion 422 can be arranged around the second connecting portion 421. The second connecting portion 421 is in contact with the first conductive layer 41 and the light emitting unit 3 on opposite sides in a direction perpendicular to the substrate 1, so that the first conductive layer 41, the second connecting portion 421 and the light emitting unit 3 can be sequentially electrically connected, and the first electrode 4 can provide a voltage for the light emitting unit 3. The first conductive layer 41 is located on a side of the first limiting layer 21 close to the substrate 1, and part of the first limiting layer 21 extends along the first conductive layer 41. When a crack is generated in the first limiting layer 21 extending along the first conductive layer 41, the second limiting layer 22 located on a side of the first limiting layer 21 can cover the crack, so as to reduce or avoid the crack in the pixel definition layer 2 from exposing a film layer that does not need to be exposed.

[0070] In the embodiments provided in the present application, the second connecting portion 421 is in contact with the first conductive layer 41 and the light emitting unit 3 on opposite sides, so that the first conductive layer 41, the second connecting portion 421 and the light emitting unit 3 can be sequentially electrically connected, and the first electrode 4 can provide a voltage for the light emitting unit 3. By arranging that the pixel limiting portion includes the first limiting layer 21 and the second limiting layer 22, and the first conductive layer 41 is located on a side of the first limiting layer 21 close to the substrate 1, so that when a crack is generated in the first limiting layer 21 extending along the first conductive layer 41, the second limiting layer 22 located on a side of the first limiting layer 21 can cover the crack, thereby reducing or avoiding the crack in the pixel definition layer 2 from exposing a film layer that does not need to be exposed.

[0071] In some embodiments, the first limiting layer 21 and the second limiting layer 22 can be made of different materials. The film forming property of the first limiting layer 21 is better than that of the second limiting layer 22. That is, under the condition of the same thickness, the first limiting layer 21 can better cover the step structure formed by the first conductive portion and will not generate a crack. Conversely, to obtain the same step coverage effect, the thickness of the first limiting layer 21 is required to be thinner than that of the second limiting layer 22, that is, the thickness of the first limiting layer 21 is relatively low, which is beneficial to the thinness of the product, and the good film forming property means that the formed film has good coverage and is more compact, which is more conducive to isolating water vapor. That is, the material density of the first limiting layer 21 is greater than that of the second limiting layer 22.

[0072] For example, the etching resistance of the second limiting layer 22 is better than that of the first limiting layer 21. Since the side of the pixel definition layer 2 away from the substrate 1 will be etched during the preparation of the display panel, by selecting a material with better etching resistance as the second limiting layer 22, the etching resistance of the pixel definition layer 2 can be improved, and the reliability of the display panel can be further improved.

[0073] Exemplarily, the material of the first confinement layer 21 is different from the material of the second confinement layer 22. For example, the material of the first confinement layer 21 comprises silicon nitride, and the material of the second confinement layer 22 comprises silicon oxide.

[0074] Exemplarily, the thickness of the first confinement layer 21 is greater than or equal to 1000 microns and less than or equal to 5000 microns. For example, the thickness of the first confinement layer 21 is 1000 microns, 2000 microns, 3000 microns, 4000 microns, 5000 microns, etc.

[0075] Exemplarily, the thickness of the second confinement layer 22 is greater than or equal to 500 microns and less than or equal to 3000 microns. For example, the thickness of the second confinement layer 22 is 500 microns, 1000 microns, 2000 microns, 3000 microns, etc.

[0076] In some embodiments, the first electrode 4 further comprises a third conductive layer 43, the third conductive layer 43 is located on the side of the first conductive layer 41 close to the substrate 1, and the orthographic projection of the third conductive layer 43 on the substrate 1 is located within the orthographic projection of the first conductive layer 41 on the substrate 1, wherein:

[0077] The orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the first conductive layer 41 on the substrate 1, and the orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the third conductive layer 43 on the substrate 1.

[0078] The materials of the first conductive layer 41 and the third conductive layer 43 are different, so as to improve the conductivity and oxidation resistance of the first electrode 4. The materials being different can be that the components of the materials used are different, or the components used are the same but the proportions of the components are different. When the materials used to prepare the first conductive layer 41 and the third conductive layer 43 are in contact with the same etching liquid, the two have different etching rates, so as to form an undercut structure at the edge of the first conductive layer 41 and the side wall of the third conductive layer 43 close to the substrate 1, that is, the edge of the third conductive layer 43 is recessed compared with the edge of the first conductive layer 41, and the orthographic projection of the third conductive layer 43 on the substrate 1 is located within the orthographic projection of the first conductive layer 41 on the substrate 1.

[0079] The first conductive layer 41 and the edge of the third conductive layer 43 close to the surface of the substrate 1 form a cavity, the first confinement layer 21 can extend to the surface of the first conductive layer 41 along the substrate 1, and the first confinement layer 21 can seal the cavity so that the first confinement layer 21 continuously extends. When the first confinement layer 21 cracks along the extending part of the first conductive layer 41, the second edge part 422 has the function of preventing the water vapor from contacting the light emitting unit 3 through the crack of the first confinement layer 21, because the orthographic projection of the second edge part 422 on the substrate 1 covers the edge of the orthographic projection of the first conductive layer 41 on the substrate 1, and the orthographic projection of the second edge part 422 on the substrate 1 covers the edge of the orthographic projection of the third conductive layer 43 on the substrate 1.

[0080] Please refer to Figure 5 In some embodiments, the display panel further comprises an organic insulating layer, and a part of the organic insulating layer is located between the third conductive layer 43 and the substrate 1, and another part of the driving circuit layer 13 is located between the first confinement layer 21 and the substrate 1.

[0081] The organic insulating layer can be formed by using an organic insulating material on the substrate 1, or the flat layer 14 in the substrate 1 can be used as the organic insulating layer. The flat layer 14 is arranged on the side of the driving circuit layer 13 close to the light emitting functional layer, the first electrode 4 can be connected to the circuit in the driving circuit layer 13, the flat layer 14 can electrically isolate the first electrode 4 and part of the conductive structure in the driving circuit layer 13, and the flat layer 14 can also planarize the driving circuit layer 13. The third conductive layer 43 and the first conductive layer 41 can be formed on the flat layer 14, part of the flat layer 14 is exposed between the third conductive layers 43 of adjacent first electrodes 4, and part of the prepared first confinement layer 21 is located on the flat layer 14 and part of the first confinement layer 21 is located on the first conductive layer 41.

[0082] In some embodiments, the isolation structure 6 comprises a first sub-layer 61 and a second sub-layer 62, the first sub-layer 61 and the second sub-layer 62 are arranged in a stacked manner away from the substrate 1, the second sub-layer 62 protrudes towards the isolation opening 64 relative to the first sub-layer 61, the edge of the orthographic projection of the second edge part 422 on the substrate 1 is located within the orthographic projection of the first sub-layer 61 on the substrate 1, the edge of the orthographic projection of the first conductive layer 41 on the substrate 1 is located within the orthographic projection of the first sub-layer 61 on the substrate 1, and the edge of the orthographic projection of the third conductive layer 43 on the substrate 1 is located within the orthographic projection of the first sub-layer 61 on the substrate 1.

[0083] In these optional embodiments, the isolation structure 6 comprises a first sub-layer 61 and a second sub-layer 62, the second sub-layer 62 is arranged to protrude towards the isolation opening 64 relative to the first sub-layer 61, so that an inner recess can be formed under the second sub-layer 62. In the preparation process of the light emitting unit 3, the light emitting material can be broken into independent light emitting units 3 at the edge of the second sub-layer 62.

[0084] In the preparation of the isolation structure 6, the first isolation material and the second isolation material for forming the isolation structure 6 are arranged, and the first isolation material and the second isolation material are uniformly distributed on one side of the second limiting material in sequence. The first isolation material and the second isolation material are subjected to a patterning process, so that the first isolation material forms the first sub-layer 61, and the second isolation material forms the second sub-layer 62. The edge of the second edge portion 422 in the orthographic projection on the substrate 1 is located within the orthographic projection of the first sub-layer 61 on the substrate 1, and the edges of the first conductive layer 41 and the third conductive layer 43 in the orthographic projection on the substrate 1 are located within the orthographic projection of the first sub-layer 61 on the substrate 1, so that the prepared first sub-layer 61 can be elevated by the second edge portion 422, the first conductive layer 41 and the third conductive layer 43, and the edge of the prepared second sub-layer 62 away from the surface of the substrate 1 is flat, avoiding the edge of the second sub-layer 62 from warping.

[0085] In some embodiments, the material of the first conductive layer 41 includes at least one of silver and silver alloy.

[0086] In some embodiments, the material of the first conductive layer 41 includes at least one of silver, silver alloy and other metal materials with excellent light reflection. The first conductive layer 41 not only has good conductivity, but also has good light reflection capability. The light emitted by the light emitting unit 3 can pass through the second conductive layer 42 and be reflected in the first conductive layer 41, thereby improving the light emitting efficiency of the display panel. The third conductive layer 43 and the second conductive layer 42 located on both sides of the first conductive layer 41 can also protect the first conductive layer 41 in subsequent processes, reducing damage to the first conductive layer 41.

[0087] In some embodiments, the material of the third conductive layer 43 is a transparent conductive oxide, which includes but is not limited to at least one of Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO) or Indium Gallium Zinc Oxide (IGZO).

[0088] In some other embodiments, the material of the second conductive layer 42 is a transparent conductive oxide, which includes but is not limited to at least one of Indium Tin Oxide, Indium Zinc Oxide or Indium Gallium Zinc Oxide.

[0089] In some other embodiments, the materials of the second conductive layer 42 and the third conductive layer 43 are the same. The same material means that the components of the materials used by the two are the same, and the proportions of the components are the same, which simplifies the storage of materials in the preparation process.

[0090] In some embodiments, the orthographic projection of the first conductive layer 41 on the substrate 1 is located within the orthographic projection of the second conductive layer 42 on the substrate 1, i.e. the first conductive layer 41 has a larger projected area than the second conductive layer 42. When the first confinement layer 21 cracks along the portion of the first conductive layer 41, the first conductive layer 41 can block water vapor from contacting the light emitting unit 3 through the crack of the first confinement layer 21.

[0091] In some embodiments, the display panel further comprises a second electrode layer, the second electrode layer comprises a second electrode 5 located on the side of the corresponding light emitting unit 3 away from the substrate 1. Optionally, the light emitting device is composed of the first electrode 4, the light emitting unit 3 and the second electrode 5. Optionally, the second electrode 5 is located in each isolation opening 64. Optionally, the second electrode 5 and the isolation structure 6 are electrically connected.

[0092] Optionally, at least one light emitting unit 3 comprises a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL and an electron injection layer EIL stacked in the direction away from the substrate 1 (the thickness direction Z). The light emitting unit 3 can comprise one light emitting material layer EML, or a stacked light emitting unit 3 comprising multiple light emitting material layers EML.

[0093] In the light emitting process of the light emitting unit 3, the first electrode 4 is used to generate holes, and the second electrode 5 is used to generate electrons, and the holes and the electrons combine in the light emitting unit 3 to make the light emitting unit 3 emit light. The first electrode 4 is in contact with the light emitting unit 3, and part of the light emitting unit 3 can be overlapped with the isolation structure 6, which can cause the holes to crosstalk between adjacent light emitting units 3 through the light emitting unit 3 and the isolation structure 6.

[0094] In order for the light emitting unit 3 to emit light, a pixel voltage is provided to the first electrode 4 and a common voltage is provided to the second electrode 5, a potential difference is formed between the first electrode 4 and the second electrode 5, so that the light emitting unit 3 arranged between the first electrode 4 and the second electrode 5 emits light. In one embodiment, if a potential difference is formed between the first electrode 4 and the second electrode 5 of the light emitting unit 3, the light emitting material layer EML of the light emitting unit 3 emits light.

[0095] In one embodiment, the pixel voltage of the first electrode 4 is provided by a pixel driving circuit, and the common voltage of the second electrode 5 is provided by the isolation structure 6. Specifically, the second electrode 5 is electrically connected to the isolation structure 6, and the common voltage is supplied to the second electrode 5 by providing the common voltage to the isolation structure 6. That is, the isolation structure 6 has the function of supplying the common voltage to the second electrode 5.

[0096] In some embodiments, the second electrode 5 is electrically connected to the isolation structure 6, and part of the second confinement layer 22 is located between the second edge portion 422 and the second electrode 5.

[0097] The second connecting portion 421, the light emitting unit 3, and the second electrode 5 can be sequentially stacked. The portion of the second defining layer 22 is located between the second edge portion 422 and the second electrode 5, thereby reducing or avoiding the second edge portion 422 and the second electrode 5 from being in contact and short-circuiting.

[0098] In some embodiments, the portion of the second defining layer 22 is located between the second edge portion 422 and the light emitting unit 3.

[0099] The second conductive layer 42, the second defining layer, the light emitting unit 3, and the second electrode 5 can be sequentially prepared. The second defining layer 22 can not only separate the second edge portion 422 and the second electrode 5, but also separate the second edge portion 422 and the light emitting unit 3, thereby reducing or avoiding the second electrode 5 prepared later and the second conductive layer 42 from being electrically connected.

[0100] In some embodiments, the second edge portion 422 extends along the first defining layer 21 to the side of the first defining layer 21 away from the substrate 1 and towards the surface of the pixel opening 23.

[0101] When preparing the display panel, the first conductive layer 41 and the first defining layer 21 can be prepared first, and then the second conductive layer 42 and the second defining layer 22 can be prepared. The shape and area of the second conductive layer 42 prepared later can be controlled so that the second conductive layer 42 can not only cover the first conductive layer 41 exposed from the first defining layer 21, but also cover the surface of the first defining layer 21 towards the pixel opening 23 and the side of the first defining layer 21 away from the substrate 1, to ensure that the first conductive layer 41 and the second conductive layer 42 are effectively electrically connected.

[0102] In some embodiments, the light emitting unit 3 extends along the second defining layer 22 to the side of the second defining layer 22 away from the substrate 1 and towards the surface of the pixel opening 23, and the light emitting unit 3 is spaced apart from the isolation structure 6.

[0103] The shape and area of the light emitting unit 3 prepared can be controlled so that the light emitting unit 3 can not only cover the second conductive layer 42 exposed from the second defining layer 22, but also cover the surface of the second defining layer 22 towards the pixel opening 23 and the side of the second defining layer 22 away from the substrate 1, to ensure that the second conductive layer 42 and the light emitting unit 3 are effectively electrically connected.

[0104] Please refer to Figure 6 In other embodiments, the second edge portion 422 extends along the first defining layer 21 towards the surface of the pixel opening 23, and the end of the second edge portion 422 away from the second connecting portion 421 is located on the surface of the first defining layer 21 towards the pixel opening 23.

[0105] When the display panel is prepared, the first conductive layer 41 and the first confinement layer 21 can be prepared first, and then the second conductive layer 42 and the second confinement layer 22 can be prepared. The shape and area of the second conductive layer 42 prepared later can be controlled so that the second conductive layer 42 can not only cover the first conductive layer 41 exposed from the first confinement layer 21, but also cover the surface of the first confinement layer 21 facing the pixel opening 23, to ensure that the first conductive layer 41 and the second conductive layer 42 are effectively electrically connected.

[0106] In some embodiments, the light emitting unit 3 extends along the surface of the second confinement layer 22 facing the pixel opening 23, and the edge of the light emitting unit 3 is located on the surface of the second confinement layer 22 facing the pixel opening 23.

[0107] The shape and area of the prepared light emitting unit 3 can be controlled so that the light emitting unit 3 can not only cover the second conductive layer 42 exposed from the second confinement layer 22, but also cover the surface of the second confinement layer 22 facing the pixel opening 23, to ensure that the second conductive layer 42 and the light emitting unit 3 are effectively electrically connected.

[0108] Please refer to Figure 7 , the second confinement layer 22 can be obtained by patterning the second confinement material layer. In some embodiments, the edge of the second confinement layer 22 contacts the surface of the second edge portion 422 away from the substrate 1, the edge of the second confinement layer 22 is all or part of the surface of the second confinement layer 22 facing the pixel opening 23, and the orthographic projection of the second confinement layer 22 on the substrate 1 partially overlaps the orthographic projection of the second edge portion 422 on the substrate 1.

[0109] Please refer to Figure 6 , in other embodiments, the second confinement layer 22 extends along the second edge portion 422 away from the surface of the substrate 1 to the surface of the second edge portion 422 facing the pixel opening 23, and the edge of the second confinement layer 22 contacts the surface of the second edge portion 422 facing the pixel opening 23.

[0110] The second confinement layer 22 not only contacts the surface of the second edge portion 422 away from the substrate 1, but also contacts the surface of the second edge portion 422 facing the pixel opening 23.

[0111] In other embodiments, the second confinement layer 22 extends along the second edge portion 422 to the part of the surface of the second connecting portion 421 away from the substrate 1.

[0112] The second confinement layer 22 not only contacts the surface of the second edge portion 422 away from the substrate 1, but also contacts the surface of the second edge portion 422 facing the pixel opening 23 and the surface of the second connecting portion 421 away from the substrate 1. At least part of the surface of the second connecting portion 421 away from the substrate 1 contacts the light emitting unit 3.

[0113] In some embodiments, the display panel further comprises a protective layer 44, the first conductive layer 41 comprises a first connecting portion 411 and a first edge portion 412 connected to each other, the protective layer 44 is located between the first edge portion 412 and the first limiting layer 21, the protective layer 44 has a first opening 441 communicating with the pixel opening 23, at least part of the second connecting portion 421 is arranged in the first opening 441 and in contact with the first connecting portion 411.

[0114] In the preparation of the display panel, the third conductive material layer, the first conductive material layer and the first etching protection layer are prepared in sequence, the first etching protection layer has a third opening exposing the first conductive material layer, the first conductive material layer exposed by the third opening and the third conductive material layer are subjected to wet etching, the first conductive material layer forms a plurality of spaced first conductive layers 41, and the third conductive material layer forms a plurality of spaced third conductive layers 43. Then, the film layers such as the first limiting layer 21 are prepared. Before the preparation of the second conductive layer 42, the first etching protection layer is subjected to etching treatment, and the first etching protection layer forms the protective layer 44 having the first opening 441, and at least part of the second conductive layer 42 prepared later is arranged in the first opening 441 and in contact with the first connecting portion 411. The first etching protection layer without the first opening 441 can protect the second conductive layer 42 during the preparation of the film layers such as the first limiting layer 21.

[0115] Please refer to Figure 8 In some embodiments, the first limiting layer 21 comprises a first limiting portion 211 and a second limiting portion 212, the first limiting portion 211 is located between adjacent first conductive layers 41, the second limiting portion 212 extends from the first limiting portion 211 along the second conductive layer 42 to the side of the protective layer 44 away from the substrate 1, and the surface of the first limiting portion 211 away from the substrate 1 is recessed toward the substrate 1 relative to the surface of the second limiting portion 212 away from the substrate 1.

[0116] The first limiting portion 211 and the second limiting portion 212 can be prepared together. The first limiting portion 211 prepared later is arranged between the spaced third conductive layers 43, between the spaced first conductive layers 41, and between the spaced first etching protection layers 440. The second limiting portion 212 prepared later extends along the side surface of the first conductive layer 41, the side surface of the first etching protection layer 440 to the side of the first etching protection layer 440 away from the substrate 1. The first limiting layer 21 can protect the side surface of the first conductive layer 41 and block the aforementioned cavity.

[0117] The second limiting portion 212 is elevated by the third conductive layer 43, the first conductive layer 41 and the protective layer 44 stacked thereon, such that the surface of the first limiting portion 211 away from the substrate 1 is recessed toward the substrate 1 relative to the surface of the second limiting portion 212 away from the substrate 1, and the distance from the surface of the first limiting portion 211 away from the substrate 1 to the substrate 1 is less than the distance from the surface of the second limiting portion 212 away from the substrate 1 to the substrate 1.

[0118] In some embodiments, the second limiting layer 22 includes a third limiting portion 221 and a fourth limiting portion 222 connected to each other, the third limiting portion 221 is located on the side of the first limiting portion 211 away from the substrate 1, the fourth limiting portion 222 is located on the side of the second limiting portion 212 away from the substrate 1, the second edge portion 422 is located between the second limiting portion 212 and the fourth limiting portion 222, the surface of the third limiting portion 221 away from the substrate 1 is recessed toward the substrate 1 relative to the surface of the fourth limiting portion 222 away from the substrate 1, and the isolation structure 6 is disposed on the side of the second limiting layer 22 away from the substrate 1.

[0119] In the second limiting layer 22 prepared later, the third limiting portion 221 is located on the side of the first limiting portion 211 away from the substrate 1, and the fourth limiting portion 222 is located on the side of the second limiting portion 212 away from the substrate 1, such that the fourth limiting portion 222 is elevated by the third conductive layer 43, the first conductive layer 41 and the protective layer 44 stacked thereon, and the surface of the fourth limiting portion 222 away from the substrate 1 is recessed toward the substrate 1 relative to the surface of the third limiting portion 221 away from the substrate 1, and the distance from the surface of the fourth limiting portion 222 away from the substrate 1 to the substrate 1 is less than the distance from the surface of the third limiting portion 221 away from the substrate 1 to the substrate 1.

[0120] In some embodiments, the second edge portion 422 extends from the first limiting portion 211 to the surface of the first limiting portion 211 away from the substrate 1, and the fourth limiting portion 222 is elevated not only by the third conductive layer 43, the first conductive layer 41 and the protective layer 44 stacked thereon, but also by the second edge portion 422.

[0121] In some embodiments, part of the isolation structure 6 is supported on the side of the third limiting portion 221 away from the substrate 1, and part of the isolation structure 6 is supported on the side of the fourth limiting portion 222 away from the substrate 1.

[0122] The isolation structure 6 prepared later can be partially located on the third limiting portion 221 and also partially located on the fourth limiting portion 222, because the surface of the third limiting portion 221 away from the substrate 1 and the surface of the fourth limiting portion 222 away from the substrate 1 have a step difference, such that part of the isolation structure 6 is elevated by the fourth limiting portion 222, the surface of the isolation structure 6 away from the substrate 1 is a non-planar surface, and the edge of the orthographic projection of the second limiting portion 212 on the substrate 1 overlaps with the edge of the orthographic projection of the isolation structure 6 on the substrate 1.

[0123] Referring to Figure 9 In some embodiments, the isolation structure 6 further comprises a third sub-layer 63, the third sub-layer 63 is located on the side of the first sub-layer 61 facing the substrate 1, and the third sub-layer 63 is arranged protruding towards the isolation opening 64 relative to the first sub-layer 61, the orthographic projection of the third sub-layer 63 on the substrate 1 and the orthographic projection of the first electrode 4 on the substrate 1 are staggered.

[0124] In the preparation process of the isolation structure 6, when the first sub-layer 61 is side-etched, the third sub-layer 63 can provide protection to the film layer on the side of the substrate 1.

[0125] Optionally, the materials of the first sub-layer 61 and the second sub-layer 62 are different, and the etching rate of the first sub-layer 61 is less than that of the second sub-layer 62. The material of the first sub-layer 61 includes a conductive material, which specifically can include at least one of copper (CU), copper alloy, aluminum (Al), and aluminum alloy, and the aluminum alloy can include at least one of aluminum neodymium alloy (AlNd), aluminum yttrium alloy (AlY), or aluminum silicon alloy (AlSi). The second sub-layer 62 can be a single-layer structure or a multi-layer structure. When the second sub-layer 62 is a single-layer structure, the material of the second sub-layer 62 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. As shown in Figure 7 When the second sub-layer 62 is a multi-layer structure, one layer of the second sub-layer 302 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and another layer of the second sub-layer 62 can include a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0126] Optionally, the material of the third sub-layer 63 includes a conductive material, for example, the material of the third sub-layer 63 can include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0127] In some embodiments, the second electrode 5 overlaps with the third sub-layer 63.

[0128] The second electrode 5 is formed of a metal material such as an alloy of magnesium and silver (MgAg). The second electrode 5 also extends to the surface of the third sub-layer 63 away from the substrate 1 and overlaps with the third sub-layer 63.

[0129] Optionally, the second electrode 5 includes a main body part 511 and a contact part 512 surrounding the main body part 511 in a closed ring shape, the contact part 512 and the third sub-layer 63 are in contact with each other. Specifically, the contact part 512 can be in contact with the side wall of the third sub-layer 63; the contact part 512 can also extend to the surface of the third sub-layer 63 away from the substrate 11, and the contact part 512 and the surface of the third sub-layer 63 away from the substrate 11 are in contact.

[0130] For example, the material of the first sub-layer 61 includes a conductive material, and the second electrode 5 and the first sub-layer 61 are electrically connected. Alternatively, as shown in FIG. 1C, the materials of the first sub-layer 61 and the third sub-layer 63 both include a conductive material, and the second electrode 5 and the third sub-layer 63, the first sub-layer 61 are electrically connected. Figure 9

[0131] Please refer to FIG. 1A, Figure 10 In some embodiments, the plurality of first electrodes 4 includes a first sub-electrode and a second sub-electrode, and the plurality of light emitting units 3 includes a first light emitting unit 3a for emitting a first color light and a second light emitting unit 3b for emitting the first color light; in the direction from the substrate 1 to the first conductive layer 41, the thickness of the second conductive layer 42 in the first sub-electrode is H1, and the thickness of the second conductive layer 42 in the second sub-electrode is H2, H1 and H2 are not the same.

[0132] The second conductive layer 42 in different first electrodes 4 for contacting different light emitting units 3 has different thicknesses, so that the distances from the corresponding second electrode 5 of the different light emitting units 3 to the first conductive layer 41 are different, thereby adjusting the distances from the light emitted by the light emitting units 3 to the first conductive layer 41, so that by adjusting the values of H1 and H2, the light emitting units 3 for emitting different wavelengths of color light can have a microcavity effect, and the light emitting efficiency of the different light emitting units 3 can be improved.

[0133] In other embodiments, the plurality of first electrodes 4 includes a third sub-electrode, and the plurality of light emitting units 3 includes a third light emitting unit 3c for emitting a third color light; in the direction from the substrate 1 to the first conductive layer 41, the thickness of the second conductive layer 42 in the third sub-electrode is H3, and H1, H2, H3 are not the same.

[0134] The wavelengths of the first color light, the second color light and the third color light are different. Optionally, the first color light, the second color light and the third color light are red light, blue light and green light.

[0135] Please refer to FIG. 1A, Figure 2 In some embodiments, the display panel further includes a first encapsulation layer, the first encapsulation layer includes a plurality of encapsulation portions 71, the encapsulation portion 71 is located on the side of the light emitting unit 3 away from the substrate 1, the encapsulation portion 71 also covers the side wall of the isolation structure 6 facing the isolation opening 64, and extends to the side of the isolation structure 6 away from the substrate 1.

[0136] The encapsulation portion 71 is located on the side of the second electrode 5 away from the substrate 1, and extends to the side of the isolation structure 6 away from the substrate 1 through the side wall of the isolation structure 6.

[0137] For example, as shown in FIG. 1A, Figure 8 ​As shown, the encapsulation part 71 includes a first segment 711 and a second segment 712 connected to each other, the first segment 711 is located in the isolation opening 64 and is arranged on the side of the light emitting unit 3 away from the substrate 1, the second segment 712 is located on the side of the isolation structure 6 facing the isolation opening 64, and the side surface of the first segment 711 away from the substrate 1 and the side surface of the second segment 712 away from the isolation structure 6 are at least partially connected to each other to enclose the gap space.

[0138] For example, the side surface of the first segment 711 away from the substrate 1 and the side surface of the second segment 712 away from the isolation structure 6 can also not be connected.

[0139] In some embodiments, the display panel further includes a second encapsulation layer 72 and a third encapsulation layer 73, the second encapsulation layer 72 covers the isolation structure 6 and the encapsulation part 71, and the third encapsulation layer 73 covers the second encapsulation layer 72. The first encapsulation layer and the third encapsulation layer 73 are both inorganic materials, and the materials of the first encapsulation layer and the third encapsulation layer 73 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 72 is an organic insulating material, such as an epoxy resin, an acrylic resin, or the like. The second encapsulation layer 72 and the third encapsulation layer 73 are continuously arranged at least on the display area AA as a whole, and a part thereof is also arranged in the non-display area NA.

[0140] The second encapsulation layer 72 can be filled in the fracture to block the fracture and improve the encapsulation effect of the first encapsulation layer and the second encapsulation layer 72 as a whole on the light emitting unit 3. The second encapsulation layer 72 can be filled in the fracture and filled in the gap between the isolation structure 6 and the second sub-layer 62, so as to reduce or avoid the peeling of the encapsulation part 71 and the isolation structure 6.

[0141] In some embodiments, the display panel can further include at least one film layer such as a touch layer, a polarizer, a color film substrate 1, and a protective cover plate. The film layer can also be bonded in the display panel through an adhesive layer such as an optical clear adhesive (OCA).

[0142] For example, the side surface of the first segment 711 away from the substrate 1 and the side surface of the second segment 712 away from the isolation structure 6 can also not be connected. Figures 1-10In a second aspect, a display panel is provided, comprising: a substrate 1, a pixel definition layer 2, an isolation structure 6, a light-emitting functional layer, a protective layer 44, and a first electrode layer, the pixel definition layer 2 is disposed on one side of the substrate 1, the pixel definition layer 2 comprises a pixel limiting portion and a pixel opening 23 enclosed by the pixel limiting portion, the pixel limiting portion comprises a first limiting layer 21 and a second limiting layer 22, the second limiting layer 22 is located on a side of the first limiting layer 21 away from the substrate 1; the isolation structure 6 is disposed on a side of the pixel limiting portion away from the substrate 1, the isolation structure 6 encloses a plurality of isolation openings 64, the isolation openings 64 and the pixel openings 23 are in communication; the light-emitting functional layer comprises a plurality of light-emitting units 3, at least part of the light-emitting units 3 is disposed in the pixel opening 23 and extends along the second limiting layer 22 towards the sidewall of the corresponding pixel opening 23; the protective layer 44 has a first opening 441 in communication with the pixel opening 23; the first electrode layer comprises a plurality of first electrodes 4, the first electrodes 4 are disposed on a side of the light-emitting units 3 away from the substrate 1, the first electrodes 4 comprise a first conductive layer 41 and a second conductive layer 42, the first conductive layer 41, the protective layer 44 and the first limiting layer 21 are sequentially stacked, part of the second conductive layer 42 is located between the first conductive layer 41 and the light-emitting units 3 in the first opening 441, and part of the second conductive layer 42 is located between the first limiting layer 21 and the second limiting layer 22.

[0143] The isolation structure 6 in the second aspect can be disposed as the isolation structure 6 in the first aspect, and the first electrode 4 in the second aspect can be disposed as the first electrode 4 in the first aspect.

[0144] In the display panel of the present embodiment, by disposing part of the second conductive layer 42 in contact with the first conductive layer 41 and the light-emitting unit 3 respectively, the first conductive layer 41, the second conductive layer 42 and the light-emitting unit 3 can be sequentially electrically connected, so that the first electrode 4 provides voltage for the light-emitting unit 3. By disposing the pixel limiting portion to comprise the first limiting layer 21 and the second limiting layer 22, and disposing the first conductive layer 41 on a side of the first limiting layer 21 close to the substrate 1, when a crack occurs in the first limiting layer 21 extending along the first conductive layer 41, the second limiting layer 22 on the side of the first limiting layer 21 can cover the crack, thereby reducing or avoiding the crack in the pixel definition layer 2 from exposing the film layer that is not required to be exposed.

[0145] The manufacturing method of the display panel 10 of the present embodiment will be described below.

[0146] Please refer to Figure 11 The manufacturing method of the display panel 10 comprises:

[0147] S100, disposing at least one layer of conductive material on one side of the substrate 1, and patterning the at least one layer of conductive material, the at least one layer of conductive material comprising a first conductive layer 41 formed by a first conductive material layer 410;

[0148] S200, disposing a first limiting layer 21 and an etching protection structure 200 on the substrate 1, the first conductive layer 41 partially overlaps the first limiting layer 21 in the orthographic projection of the substrate 1, the first limiting layer 21 has a second opening D1 exposing a portion of the first conductive layer 41, the etching protection structure 200 is disposed on the side of the first limiting layer 21 away from the substrate 1, and the orthographic projection of the surface of the etching protection structure 200 on the substrate 1 is within the orthographic projection of the surface of the etching protection structure 200 on the substrate 1;

[0149] S300, disposing a second conductive material layer on the substrate 1, the second conductive material layer is discontinuous at the edge of the etching protection structure 200, the second conductive material layer within the second opening D1 and in contact with the first conductive layer 41 forms a second connecting portion 421 of a second conductive layer 42, the second conductive material layer in contact with the first limiting layer 21 forms a second edge portion 422 of the second conductive layer 42, and the second edge portion 422 is spaced apart from the first conductive layer 41;

[0150] S400, removing the etching protection structure 200;

[0151] S500, sequentially disposing a second limiting material layer and an isolation material layer on the substrate 1, and patterning the isolation material layer and the second limiting material layer, the second limiting material layer forms a second limiting layer 22, the second edge portion 422 is located between the first limiting layer 21 and the second limiting layer 22, the first limiting layer 21 and the second limiting layer 22 enclose a plurality of pixel openings 23, the isolation material layer forms an isolation structure 6, the isolation structure 6 encloses a plurality of isolation openings 64, and the isolation openings 64 and the corresponding pixel openings 23 are in communication;

[0152] S600, preparing a plurality of light emitting units 3 and a plurality of second electrodes 5, at least part of the light emitting units 3 is disposed in the pixel openings 23 and located on the side of the second connecting portion 421 away from the first conductive layer 41, the light emitting units 3 extend along the second limiting layer 22 towards the sidewall of the corresponding pixel openings 23, and the second electrodes 5 are located on the side of the light emitting units 3 away from the substrate 1.

[0153] In S200, by setting the etching protection structure 200, the orthographic projection of the surface of the etching protection structure 200 on the substrate 1 away from the substrate 1 is located in the orthographic projection of the surface of the etching protection structure 200 on the substrate 1 close to the substrate 1, so that the second conductive material layer is disconnected at the edge of the etching protection structure 200, thereby forming a plurality of spaced second conductive layers 42. Since the first limiting layer 21 is prepared first, and then the second limiting layer 22 is prepared, when the first limiting layer 21 has a crack, the second limiting layer 22 can cover the crack on the first limiting layer 21. Since the second limiting layer 22 is prepared before the preparation of the isolation structure 6, the second limiting layer 22 can avoid or reduce the contact between the isolation structure 6 and the second conductive layer 42.

[0154] In some embodiments, S100 includes:

[0155] S110, sequentially setting a third conductive material layer 430 and a first conductive material layer 410 on one side of the substrate 1;

[0156] S120, forming a patterned first etching protection layer 440 on the first conductive material layer 410, the first etching protection layer 440 having a third opening exposing the first conductive material layer 410;

[0157] S130, wet etching the first conductive material layer 410 and the third conductive material layer 430 exposed to the third opening, the first conductive material layer 410 forming a plurality of spaced first conductive layers 41, and the third conductive material layer 430 forming a plurality of spaced third conductive layers 43, the orthographic projection of the third conductive layer 43 on the substrate 1 being located in the orthographic projection of the first conductive layer 41 on the substrate 1.

[0158] By setting the first etching protection layer 440, the first etching protection layer 440 can protect the prepared third conductive layer 43 and the first conductive layer 41.

[0159] In some embodiments, S200 includes:

[0160] S210, sequentially setting a first limiting material layer and a second etching protection layer on the substrate 1;

[0161] S220, patterning the second etching protection layer, the second etching protection layer forming an etching protection structure 200 having a fourth opening, the fourth opening exposing part of the first limiting material layer;

[0162] S230, dry etching the first limiting material layer and the first etching protection layer 440 exposed to the fourth opening, the first etching protection layer 440 forming a protection layer 44 having a first opening 441, the first opening 441 exposing part of the first conductive layer 41, and the first limiting material layer forming a first limiting layer 21 having a second opening.

[0163] The first etching protection layer 440 can reduce or avoid damage to the prepared third conductive layer 43 and the first conductive layer 41 caused by the step of forming the second etching protection layer 44.

[0164] In some embodiments, S300 comprises:

[0165] S310, evaporating a second conductive material layer on the substrate 1, the second conductive material layer being broken at edges of the etching protection structure 200, a part of the second conductive material layer being located in the second opening and contacting the first conductive layer 41, and a part of the second conductive material layer being located on a side of the etching protection structure 200 away from the substrate 1;

[0166] S400 comprises:

[0167] The etching protection structure 200 and the second conductive material layer on the side of the etching protection structure 200 away from the substrate 1 are removed.

[0168] In some embodiments, the plurality of first electrodes 4 comprises a first sub-electrode and a second sub-electrode, the plurality of second openings comprises a first sub-opening and a second sub-opening, and the plurality of light emitting units 3 comprises a first light emitting unit for emitting light of a first color and a second light emitting unit for emitting light of the first color; S300 comprises:

[0169] S310, disposing a second conductive material layer on the substrate 1, and the thickness of the second conductive material layer in the direction from the substrate 1 to the first conductive layer 41 is H1;

[0170] S320, removing the second conductive material layer located in the second sub-opening, and the second conductive material layer located in the first sub-opening forms the first sub-electrode;

[0171] S330, disposing a second conductive material layer on the substrate 1, and the thickness of the second conductive material layer in the direction from the substrate 1 to the first conductive layer 41 is H2, H1 and H2 are not the same;

[0172] S340, removing the second conductive material layer located on a side of the first sub-electrode, and the second conductive material layer located in the second sub-opening forms the second sub-electrode;

[0173] S600 comprises:

[0174] S610, disposing the first light emitting unit on a side of the first sub-electrode and the second electrode 5 contacting the first light emitting unit;

[0175] S620, disposing the second light emitting unit on a side of the second sub-electrode and the second electrode 5 contacting the second light emitting unit.

[0176] In S310, the second conductive layer 42 of the first light emitting device 30a is made. Since the second conductive layer 42 of the first light emitting device 30a is made as a whole layer, the second conductive material layer is in the first opening 441 communicated with the plurality of first isolation openings 64a, the plurality of second isolation openings 64b and the plurality of third isolation openings 64c. The second conductive material layer in the first opening 441 communicated with the plurality of first isolation openings 64a and the plurality of third isolation openings 64c is removed by etching, so that the second conductive layer 42 is reserved only in the first opening 441 communicated with the plurality of second isolation openings 64b.

[0177] In S330, the second conductive layer 42 of the second light emitting device 30b is made. Since the second conductive layer 42 of the second light emitting device 30b is made as a whole layer, the second conductive material layer is in the first opening 441 communicated with the plurality of first isolation openings 64a, the plurality of second isolation openings 64b and the plurality of third isolation openings 64c. The second conductive material layer in the first opening 441 communicated with the plurality of first isolation openings 64a and the plurality of third isolation openings 64c is removed by etching, so that the second conductive layer 42 is reserved only in the first opening 441 communicated with the plurality of second isolation openings 64b.

[0178] In S600, the first encapsulation layer corresponding to the first light emitting device 30a is made. Since the film layer of the first light emitting device 30a and the first encapsulation layer are made as whole layers, the film layer of the first light emitting device 30a and the first encapsulation layer are in the positions of the plurality of first isolation openings 64a, the plurality of second isolation openings 64b and the plurality of third isolation openings 64c.

[0179] The film layer of the first light emitting device 30a and the first encapsulation layer in the positions of the plurality of second isolation openings 64b and the plurality of third isolation openings 64c are removed by etching, so that the light emitting unit 3 and the second electrode 5 of the first light emitting device 30a and the encapsulation part 71 of the first light emitting device 30a are formed only in the positions of the plurality of first isolation openings 64a.

[0180] Based on the above steps, the light emitting unit 3 and the second electrode 5 of the second light emitting device 30b and the encapsulation part 71 of the second light emitting device 30b are arranged in the positions of the plurality of second isolation openings 64b, and the light emitting unit 3 and the second electrode 5 of the third light emitting device 30c and the encapsulation part 71 of the third light emitting device 30c are arranged in the positions of the plurality of third isolation openings 64c.

[0181] In some possible implementation, the present application further provides a display device, which comprises the display panel in the present application. The display device can comprise a device with image processing capability, for example, a mobile phone, a desktop computer, a notebook computer, a tablet computer, a vehicle-mounted display, a wearable device, etc. Since the display device comprises the display panel in the present application, the reliability of the display device is higher.

[0182] The technical features of the above embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not contradict each other, they should be considered to be within the scope of the present disclosure.

[0183] The above embodiments merely express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

[0184] Although the present application has been described with reference to the preferred embodiments, various modifications can be made to it and components thereof can be replaced with equivalents without departing from the scope of the present application. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: substrate; A pixel definition layer is disposed on one side of the substrate. The pixel definition layer includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion. The pixel defining portion includes a first defining layer and a second defining layer. The second defining layer is located on the side of the first defining layer away from the substrate. An isolation structure is disposed on the side of the second limiting layer opposite to the substrate, and the isolation structure encloses and forms a plurality of isolation openings, the isolation openings being connected to the corresponding pixel openings; The light-emitting functional layer includes a plurality of light-emitting units, at least a portion of which is disposed within the pixel opening and extends along the second limiting layer toward the sidewall of the corresponding pixel opening; The first electrode layer includes a plurality of first electrodes. Each first electrode includes a first conductive layer and a second conductive layer. The first conductive layer is located on the side of the first limiting layer close to the substrate. The second conductive layer includes a second connecting portion and a second edge portion connected together. The second connecting portion contacts the first conductive layer and the light-emitting unit on opposite sides in a direction perpendicular to the substrate, respectively. The second edge portion is located between the first limiting layer and the second limiting layer.

2. The display panel according to claim 1, characterized in that, The first electrode further includes a third conductive layer, which is located on the side of the first conductive layer closer to the substrate. The orthographic projection of the third conductive layer on the substrate lies within the orthographic projection of the first conductive layer on the substrate, wherein: The orthographic projection of the second edge portion on the substrate covers the edge of the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the second edge portion on the substrate covers the edge of the orthographic projection of the third conductive layer on the substrate.

3. The display panel according to claim 2, characterized in that, The display panel also includes: An organic insulating layer, a portion of which is located between the third conductive layer and the substrate, and another portion of which is located between the first defining layer and the substrate.

4. The display panel according to claim 2, characterized in that, The isolation structure includes a first sub-layer and a second sub-layer, which are stacked sequentially along a direction away from the substrate. The second sub-layer protrudes relative to the first sub-layer toward the isolation opening, wherein: The edge of the second edge portion's orthographic projection on the substrate is located within the orthographic projection of the first sublayer on the substrate, the edge of the first conductive layer's orthographic projection on the substrate is located within the orthographic projection of the first sublayer on the substrate, and the edge of the third conductive layer's orthographic projection on the substrate is located within the orthographic projection of the first sublayer on the substrate.

5. The display panel according to claim 2, characterized in that, The material of the first conductive layer includes at least one of silver and silver alloys; And / or, the material of the third conductive layer includes at least one of indium tin oxide, indium zinc oxide, or indium gallium zinc oxide.

6. The display panel according to claim 1 or 2, characterized in that, The orthographic projection of the first conductive layer on the substrate lies within the orthographic projection of the second conductive layer on the substrate.

7. The display panel according to claim 1, characterized in that, The display panel further includes a second electrode layer comprising a plurality of second electrodes. The second electrodes are located on the side of the corresponding light-emitting unit facing away from the substrate. The second electrodes are electrically connected to the isolation structure. A portion of the second defining layer is located between the second edge and the second electrodes; and / or, A portion of the second defining layer is located between the second edge portion and the light-emitting unit.

8. The display panel according to claim 1, characterized in that, The second edge portion extends along the surface of the first defining layer toward the pixel opening to the side of the first defining layer opposite to the substrate; and / or, The light-emitting unit extends along the surface of the second limiting layer toward the pixel opening to the side of the second limiting layer away from the substrate, and the light-emitting unit is spaced apart from the isolation structure.

9. The display panel according to claim 1, characterized in that, The second edge extends along the surface of the first defining layer toward the pixel opening, and the end of the second edge away from the second connecting portion is located on the surface of the first defining layer toward the pixel opening; And / or, The light-emitting unit extends along the surface of the second defining layer toward the pixel opening, and the edge of the light-emitting unit is located on the surface of the second defining layer toward the pixel opening.

10. The display panel according to claim 1, characterized in that, The edge of the second defining layer contacts the surface of the second edge portion that is away from the substrate; Alternatively, the second defining layer extends along the second edge portion away from the substrate to the surface of the second edge portion facing the pixel opening, and the edge of the second defining layer contacts the surface of the second edge portion facing the pixel opening; Alternatively, the second defining layer extends along the second edge portion to the portion of the second connecting portion facing away from the substrate.

11. The display panel according to claim 1, characterized in that, The display panel further includes a protective layer. The first conductive layer includes a first connecting portion and a first edge portion connected together. The protective layer is located between the first edge portion and the first defining layer. The protective layer has a first opening communicating with the pixel opening. At least a portion of the second connecting portion is disposed in the first opening and contacts the first connecting portion.

12. The display panel according to claim 11, characterized in that, The first limiting layer includes a first limiting portion and a second limiting portion. The first limiting portion is located between adjacent first conductive layers. The second limiting portion extends from the first limiting portion along the first conductive layer to the side of the protective layer away from the substrate. The surface of the first limiting portion away from the substrate is recessed toward the substrate relative to the surface of the second limiting portion away from the substrate.

13. The display panel according to claim 12, characterized in that, The second limiting layer includes a third limiting portion and a fourth limiting portion connected to each other. The third limiting portion is located on the side of the first limiting portion away from the substrate, and the fourth limiting portion is located on the side of the second limiting portion away from the substrate. The second edge portion is located between the second limiting portion and the fourth limiting portion. The surface of the third limiting portion away from the substrate is recessed toward the substrate relative to the surface of the fourth limiting portion away from the substrate. The isolation structure is disposed on the side of the second limiting layer away from the substrate.

14. The display panel according to claim 13, characterized in that, A portion of the isolation structure is supported on the side of the third limiting portion away from the substrate, and a portion of the isolation structure is supported on the side of the fourth limiting portion away from the substrate.

15. The display panel according to claim 1, characterized in that, The plurality of first electrodes includes a first sub-electrode and a second sub-electrode, and the plurality of light-emitting units includes a first light-emitting unit for emitting a first color light and a second light-emitting unit for emitting a first color light; along the direction from the substrate to the first conductive layer, the thickness of the second conductive layer in the first sub-electrode is H1, and the thickness of the second conductive layer in the second sub-electrode is H2, wherein H1 and H2 are not the same.

16. A display panel, characterized in that, include: substrate; A pixel definition layer is disposed on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel defining portion includes a first defining layer and a second defining layer. The second defining layer is located on the side of the first defining layer away from the substrate. An isolation structure is disposed on the side of the pixel defining portion away from the substrate, and the isolation structure encloses and forms a plurality of isolation openings, the isolation openings being connected to the corresponding pixel openings; The light-emitting functional layer includes a plurality of light-emitting units, at least a portion of which is disposed within the pixel opening and extends along the second limiting layer toward the sidewall of the corresponding pixel opening; A protective layer having a first opening communicating with the pixel opening; The first electrode layer includes a plurality of first electrodes. The first electrodes are disposed on the side of the light-emitting unit facing the substrate. The first electrode includes a first conductive layer and a second conductive layer. The first conductive layer, the protective layer and the first limiting layer are stacked in sequence. A portion of the second conductive layer is located in the first opening and between the first conductive layer and the light-emitting unit. A portion of the second conductive layer is located between the first limiting layer and the second limiting layer.

17. A method for manufacturing a display panel, characterized in that, include: At least one conductive material layer is disposed on one side of the substrate, and the at least one conductive material layer is patterned. The at least one conductive material layer includes a first conductive material layer, and the first conductive material layer forms a plurality of spaced first conductive layers. A first defining layer and an etching protection structure are disposed on the substrate. The orthographic projection of the first conductive layer on the substrate overlaps with the orthographic projection of the first defining layer on the substrate. The first defining layer has a second opening that exposes a portion of the first conductive layer. The etching protection structure is located on the side of the first defining layer away from the substrate. The orthographic projection of the surface of the etching protection structure near the substrate on the substrate is located within the orthographic projection of the surface of the etching protection structure away from the substrate on the substrate. A second conductive material layer is disposed on the substrate. The second conductive material layer is broken at the edge of the etched protective structure. The second conductive material layer located in the second opening and in contact with the first conductive layer forms a second connection portion of the second conductive layer. The second conductive material layer in contact with the first limiting layer forms a second edge portion of the second conductive layer. The second edge portion is spaced apart from the first conductive layer. Remove the etched protective structure; A second defining material layer and an isolation material layer are sequentially disposed on the substrate. The isolation material layer and the second defining material layer are patterned. The second defining material layer forms a second defining layer. The second edge portion is located between the first defining layer and the second defining layer. The first defining layer and the second defining layer enclose a plurality of pixel openings. The isolation material layer forms an isolation structure. The isolation structure encloses a plurality of isolation openings. The isolation openings are connected to the corresponding pixel openings. Multiple light-emitting units and multiple second electrodes are fabricated. At least a portion of the light-emitting units is disposed within the pixel opening and located on the side of the second connection portion away from the first conductive layer. The light-emitting units extend along the second limiting layer toward the sidewall of the corresponding pixel opening. The second electrodes are located on the side of the light-emitting units away from the substrate.

18. The method for manufacturing a display panel according to claim 17, characterized in that, The step of forming at least one conductive material layer on one side of the substrate and patterning the at least one conductive material layer includes: A third conductive material layer and a first conductive material layer are sequentially disposed on one side of the substrate; A patterned first etch protection layer is formed on the first conductive material layer, the first etch protection layer having a third opening that exposes the first conductive material layer; Wet etching is performed on the first conductive material layer and the third conductive material layer exposed to the third opening. The first conductive material layer forms a plurality of spaced first conductive layers, and the third conductive material layer forms a plurality of spaced third conductive layers. The orthographic projection of the third conductive layer on the substrate is located within the orthographic projection of the first conductive layer on the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that, The first defining layer and etching protection structure are disposed on the substrate, including: A first defining material layer and a second etching protection layer are sequentially disposed on the substrate; The second etch protection layer is patterned to form an etch protection structure with a fourth opening, the fourth opening exposing a portion of the first defining material layer; The first defining material layer and the first etch protection layer exposed to the fourth opening are subjected to dry etching, the first etch protection layer is formed into a protective layer with a first opening, the first opening exposes a portion of the first conductive layer, and the first defining material layer is formed into a first defining layer with a second opening.

20. The method for manufacturing a display panel according to claim 17, characterized in that, The step of forming a second conductive material layer on the substrate includes: A second conductive material layer is deposited on the substrate. The second conductive material layer is broken at the edge of the etch protection structure. A portion of the second conductive material layer is located in the second opening and in contact with the first conductive layer. A portion of the second conductive material layer is located on the side of the etch protection structure away from the substrate. The removal of the etched protective structure includes: Remove the etching protection structure and the second conductive material layer located on the side of the etching protection structure opposite to the substrate.

21. The method for manufacturing a display panel according to claim 17, characterized in that, The plurality of first electrodes include a first sub-electrode and a second sub-electrode, the plurality of second openings include a first sub-opening and a second opening, and the plurality of light-emitting units include a first light-emitting unit for emitting a first color light and a second light-emitting unit for emitting a first color light; The step of forming a second conductive material layer on the substrate includes: A second conductive material layer is disposed on the substrate, and the thickness of the second conductive material layer is H1 along the direction from the substrate to the first conductive layer. Remove the second conductive material layer located in the second sub-opening; the second conductive material layer located in the first sub-opening forms the second conductive layer of the first sub-electrode. A second conductive material layer is disposed on the substrate, and the thickness of the second conductive material layer is H2 along the direction from the substrate to the first conductive layer, wherein H1 and H2 are not the same. Remove the second conductive material layer located on one side of the first sub-electrode, and the second conductive material layer located in the second sub-opening forms the second conductive layer of the second sub-electrode; The preparation of multiple light-emitting units includes: The first light-emitting unit and the second electrode in contact with the first light-emitting unit are disposed on one side of the first sub-electrode; The second light-emitting unit and the second electrode in contact with the second light-emitting unit are disposed on one side of the second sub-electrode.

22. A display device, characterized in that, The display panel includes any one of claims 1 to 16, or a display panel prepared by a method comprising any one of claims 17 to 21.

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