Equipment detection method and device, equipment, storage medium and program product

Abstract

The invention is suitable for the technical field of equipment detection, and provides an equipment detection method and device, equipment, a storage medium and a program product, and the method comprises the steps: obtaining a first reference resistor corresponding to a first heating body under a first heating condition; obtaining a first measurement resistance corresponding to a second heating body under the first heating condition, wherein the first measurement resistance is a measurement value obtained after resistance measurement is carried out on the second heating body under the first heating condition; based on the difference between the first measuring resistor and the first reference resistor, determining a resistance deviation value corresponding to the second heating body; and determining a quality detection result corresponding to the second heating body based on the resistance deviation value. Namely, the quality of the to-be-tested heating body is determined according to the difference between the resistance value corresponding to the reference heating body when the reference heating body is heated and the resistance value corresponding to the to-be-tested heating body when the to-be-tested heating body is heated by pre-determining the reference heating body which is uniformly heated, so that the defective heating bodies are screened, and the heating performance of the equipment is improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of device detection, and particularly relates to a device detection method and device, a device, a storage medium and a program product. BACKGROUND

[0002] With the development of technology, more and more devices have heating needs, and therefore, a better-performing heating device needs to be selected to realize the heating function of the device.

[0003] In the related art, a thick film heating body is printed on a substrate by a thick film screen printing process to print a conductor material, and then sintered at high temperature, so that the thick film heating body has a large density and good heat conduction function, and is often used as a heating device to realize the heating function of the device.

[0004] However, the line layout of the heating body is not uniform in the printing process, which causes the temperature of some areas of the heating body to be relatively high and the resistance to be relatively large during the heating process, thereby reducing the heating performance of the device. SUMMARY

[0005] The embodiments of the present application provide a device detection method, device, storage medium and program product, which pre-determine a reference heating body with uniform heating, determine the quality of a to-be-tested heating body according to the difference between the resistance corresponding to the reference heating body when heated and the resistance corresponding to the to-be-tested heating body when heated, and thereby screen out defective heating bodies and improve the heating performance of the device.

[0006] In a first aspect, the embodiments of the present application provide a device detection method, which comprises:

[0007] obtaining a first reference resistance corresponding to a first heating body under a first heating condition, the first heating body being a heating body with uniform material distribution;

[0008] obtaining a first measured resistance corresponding to a second heating body under the first heating condition, the first measured resistance being a measurement value obtained by measuring the resistance of the second heating body under the first heating condition;

[0009] determining a resistance deviation value corresponding to the second heating body based on the difference between the first measured resistance and the first reference resistance;

[0010] determining a quality detection result corresponding to the second heating body based on the resistance deviation value, the quality detection result being used to indicate the material uniformity of the second heating body.

[0011] Optionally, the determination of the quality detection result corresponding to the second heating body based on the resistance deviation value comprises:

[0012] determining that the quality detection result of the second heat generator meets a good product condition, in a case where the resistance deviation value does not reach a first resistance threshold; or

[0013] determining that the quality detection result of the second heat generator does not meet the good product condition, in a case where the resistance deviation value reaches the first resistance threshold.

[0014] Optionally, the resistance deviation value corresponding to the second heat generator is determined based on a difference between the first measured resistance and the first reference resistance, including:

[0015] subtracting the first reference resistance from the first measured resistance to obtain a resistance difference value as the resistance deviation value.

[0016] Optionally, the first reference resistance corresponding to the first heat generator under a first heating condition is obtained, including:

[0017] obtaining a first resistance temperature coefficient corresponding to the first heat generator;

[0018] obtaining a first reference temperature of the first heat generator under the first heating condition;

[0019] obtaining the first reference resistance based on the first reference temperature and the first resistance temperature coefficient.

[0020] Optionally, before the first reference resistance corresponding to the first heat generator under the first heating condition is obtained, further including:

[0021] placing a plurality of candidate heat generators in an oil bath container, the oil bath container storing heat-conducting oil;

[0022] heating the oil bath container under a plurality of reference heating conditions to obtain a heating condition corresponding to each of the candidate heat generators under the plurality of reference heating conditions, the heating condition including a heating temperature and a heating resistance corresponding to the candidate heat generator;

[0023] obtaining a candidate resistance temperature coefficient corresponding to the candidate heat generator based on a plurality of heating conditions;

[0024] determining the first heat generator based on the candidate resistance temperature coefficient corresponding to each of the plurality of candidate heat generators.

[0025] Optionally, the heating of the oil bath container under a plurality of reference heating conditions to obtain a heating condition corresponding to each of the candidate heat generators under the plurality of reference heating conditions, includes:

[0026] In a process of heating the oil bath container under a plurality of reference heating conditions, infrared light emitted by the candidate heating body is received by an infrared temperature measuring device, and the infrared light is used to determine a heating temperature corresponding to the candidate heating body.

[0027] A resistance measurement device is used to measure the resistance of the candidate heating body, and a heating resistance corresponding to the candidate heating body is obtained.

[0028] In a second aspect, an equipment detection device is provided, and the equipment detection device comprises:

[0029] An obtaining module is configured to obtain a first reference resistance corresponding to a first heating body under a first heating condition, the first heating body being a heating body with uniform material distribution, and the first heating body;

[0030] The obtaining module is further configured to obtain a first measured resistance corresponding to a second heating body under the first heating condition, the first measured resistance being a measurement value obtained by measuring the resistance of the second heating body under the first heating condition;

[0031] A determining module is configured to determine a resistance deviation value corresponding to the second heating body based on a difference between the first measured resistance and the first reference resistance.

[0032] The determining module is further configured to determine a quality detection result corresponding to the second heating body based on the resistance deviation value, the quality detection result being used to indicate a material uniformity of the second heating body.

[0033] In a third aspect, a computer device is provided, and the computer device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the equipment detection method of any one of the first aspect when executing the computer program.

[0034] In a fourth aspect, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program, and the computer program is executable on a processor to implement the equipment detection method of any one of the first aspect.

[0035] In a fifth aspect, a computer program product is provided, and when the computer program product is executed on a computer device, the computer device executes the equipment detection method of any one of the first aspect.

[0036] It can be understood that the beneficial effects of the second aspect to the fifth aspect can be referred to the related description of the first aspect, and will not be repeated here.

[0037] The technical solutions provided in the embodiments of the present application have at least the following beneficial effects:

[0038] By pre-obtaining the first reference resistance of a first heating element when heated under a first heating condition, and obtaining the first measured resistance of a second heating element under the same first heating condition, the difference between the first measured resistance and the first reference resistance is used to obtain the resistance deviation value corresponding to the second heating element, and the quality test result of the second heating element is determined based on the resistance deviation value. In other words, the heating condition of the heating element to be tested is inferred based on the heating condition of the reference heating element, thereby judging the printing quality of the heating element to be tested and improving the heating performance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 This is a schematic diagram of a device detection method provided by an embodiment of the present application;

[0041] Figure 2 This is a flow chart of a device detection method provided in one embodiment of the present application;

[0042] Figure 3 This is a schematic diagram of the heating element structure provided by an embodiment of the present application;

[0043] Figure 4 This is a structural diagram of a device detection apparatus provided in one embodiment of the present application;

[0044] Figure 5 It is a structural diagram of the computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0046] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0047] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0048] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0049] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0050] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0051] In related technologies, regarding the heating performance of equipment, taking aerosol generating equipment as an example, since thick-film heating elements are made by printing conductive materials on a substrate through a thick-film screen printing process and then sintering them at high temperature, the thick-film heating elements have high density and good thermal conductivity. Therefore, thick-film heating elements are often used as heating devices to realize the heating function of the equipment.

[0052] However, the printing process may cause the circuit layout of the heating element to be uneven, resulting in some areas of the heating element having higher temperatures and greater resistance during the heating process, thereby reducing the heating performance of the device.

[0053] Based on this, the present application embodiment provides a device detection method, schematically, please refer to Figure 1 , which shows a schematic diagram of a device detection method provided by an exemplary embodiment of the present application, such as Figure 1As shown, first, the first heating body 101 is heated under the first heating condition, and a corresponding resistance value of the first heating body 101 under the first heating condition is obtained as the first reference resistance 103. Second, the second heating body 102 is heated under the same first heating condition, and a corresponding resistance value of the second heating body 102 under the first condition is obtained as the first measurement resistance 104. According to the difference between the first reference resistance 103 and the first measurement resistance 104, a resistance deviation value is obtained, and thus a quality detection result corresponding to the second heating body 102 is determined according to the resistance deviation value.

[0054] Next, the device detection method provided by the embodiment of the present application will be described in detail. For illustration, reference is made to Figure 2 which shows a device detection method flowchart provided by an example embodiment of the present application. The method includes the following steps 210 to 240.

[0055] In step 210, a first reference resistance corresponding to the first heating body under a first heating condition is obtained.

[0056] The first heating body is a heating body with uniform material distribution.

[0057] For illustration, the heating body (including the first heating body or the second heating body) is a device for providing heat energy in the device.

[0058] For example, in the case of an aerosol generating device, after the power supply is started, the battery assembly provides electric energy to the heating body to heat it. After the heating body is heated, it transmits heat to the aerosol generating substrate, so that the aerosol generating substrate reaches the boiling point and is atomized to generate aerosol in a suspended state for the user to smoke.

[0059] For illustration, the heating body is packaged with a heat-conducting material on the surface by a printing process, so as to convert electric energy into heat energy and realize the heating function.

[0060] Optionally, the heat-conducting material includes at least one of a stainless steel material, a copper wire material, a titanium alloy material, a nickel alloy material, etc.

[0061] Therefore, in the printing process, the material of the heating body may be unevenly distributed, which leads to a higher heating temperature and a higher corresponding resistance value in some areas of the heating body during the heating process, thereby reducing the heating effect of the device.

[0062] For illustration, reference is made to Figure 3 which shows a structure diagram of a heating body provided by an example embodiment of the present application, as shown in Figure 3As shown, the current display is the heating body 300, wherein a plurality of lines are laid out (or printed) in the heating body 300, taking the first line 310 as an example, the first line 310 is a line corresponding to a copper wire material, in the process of heating the heating body 300, the heat conduction function of the first line 310 will cause the temperature of the area where the first line 310 is located to rise, so that the resistance value of the area will also increase accordingly.

[0063] Illustratively, the relationship between the resistance value of the heating body and the heating temperature is related to the temperature coefficient of resistance (TCR), wherein the temperature coefficient of resistance describes the change of the resistance value of the heating body with the change of the temperature.

[0064] Illustratively, if the material of the heating body is uniformly printed and distributed, the actual resistance value of the heating body in the heating process is the same as the calculated resistance value calculated by the TCR, wherein the way of calculating the resistance value by the TCR can refer to the following formula one.

[0065]

[0066] Wherein, TCR represents the temperature coefficient of resistance, R1 represents the resistance value of the heating body at T1 temperature, and R2 represents the resistance value at T2 temperature.

[0067] Therefore, taking the room temperature as the T1 temperature as an example, the resistance value R1 of the heating body at the room temperature is obtained, and the TCR of the heating body is known, so that after the heating body is heated to the T2 temperature, the resistance value R2 of the heating body at the T2 temperature can be calculated according to the formula one.

[0068] Illustratively, the actual resistance value of the heating body in the heating process can be detected by a resistance measuring device, if the material of the heating body is not uniformly printed and distributed, there will be a deviation between the actual resistance value of the heating body and the calculated resistance value calculated by the TCR, wherein the calculation formula of the deviation value can refer to formula two.

[0069] Formula two: R all = R TCR + R 负载

[0070] Wherein, R all represents the actual resistance value of the heating body in the heating process, R TCR represents the calculated resistance value calculated according to the formula one under the condition that the corresponding TCR of the heating body is known, and R 负载 is the deviation value between the actual resistance value and the calculated resistance value at the same temperature.

[0071] Therefore, the first heating body is a material printing distribution uniform heating body, that is, the first heating body has an R all equal to R 负载 That is, the first heating body is taken as the reference heating body in the embodiment of the application.

[0072] Illustratively, the first reference resistance refers to a resistance value corresponding to the first heating body when the first heating body is heated under the first heating condition, for example, the resistance value obtained by applying a 3.7-volt voltage to the first heating body for 2 seconds is the first resistance value.

[0073] Alternatively, the first reference resistance is a resistance value measured by using a voltage measurement device in the process of heating the first heating body under the first heating condition, or the first reference resistance is a resistance value calculated according to the corresponding TCR and the corresponding related heating parameters, which are not limited in the embodiment of the application.

[0074] The related heating parameters include the resistance value of the first heating body at room temperature, the room temperature, and the temperature corresponding to the first heating body under the first heating condition.

[0075] In some embodiments, a first resistance temperature coefficient corresponding to the first heating body is obtained, a first reference temperature of the first heating body under the first heating condition is obtained, and the first reference resistance is obtained based on the first reference temperature and the first resistance temperature coefficient.

[0076] Illustratively, first, a material printing distribution uniform heating body needs to be determined as the first heating body from a plurality of candidate heating bodies.

[0077] In some embodiments, the plurality of candidate heating bodies are placed in an oil bath container, the oil bath container stores heat-conducting oil, the oil bath container is heated under a plurality of reference heating conditions to obtain a heating condition corresponding to each of the candidate heating bodies under the plurality of reference heating conditions, the heating condition includes a heating temperature and a heating resistance corresponding to the candidate heating body, a candidate resistance temperature coefficient corresponding to each of the candidate heating bodies is obtained based on the plurality of heating conditions, and the first heating body is determined based on the candidate resistance temperature coefficients corresponding to the plurality of candidate heating bodies.

[0078] In some embodiments, during the heating of the oil bath container under the plurality of reference heating conditions, infrared light emitted by the candidate heating body is received by an infrared temperature measurement device, and the infrared light is used to determine the heating temperature corresponding to the candidate heating body; and a resistance measurement device is used to measure the resistance of the candidate heating body to obtain the heating resistance corresponding to the candidate heating body.

[0079] Illustratively, the plurality of candidate heating bodies are screened by using the oil bath heating method and the infrared detection method to determine the first heating body.

[0080] The oil bath heating method uses high-temperature thermal oil as the heat transfer medium, and changes the temperature of the heating element by varying the oil bath temperature. By placing the candidate heating element in an oil bath and precisely controlling the oil bath temperature, the heating element can operate stably at different temperatures. Thermal oil offers advantages such as high heating efficiency, easy temperature regulation, minimal temperature fluctuation, and precise control. It provides a stable and adjustable temperature environment for the heating element, making it easy to measure the resistance value of the heating element at different temperature points.

[0081] Infrared detection involves using an infrared thermometer to measure the temperature of a heating element based on the incident red light it sends. When a heating element generates heat, it emits infrared light, which the infrared thermometer receives and analyzes to measure its surface temperature.

[0082] In this embodiment, a series of different oil bath temperatures are set so that the heating element reaches thermal equilibrium at different temperatures. At each temperature point, an infrared temperature measuring mechanism is used to measure the temperature of different areas of the heating element. At the same time, a resistance measuring device is used to measure the resistance values ​​corresponding to different areas. The temperature and resistance values ​​corresponding to different areas of the heating element at each temperature point are recorded to calculate the TCR values ​​corresponding to different areas of the heating element, and the TCR differences in different areas of the heating element are obtained. The heating element with the smallest TCR difference is selected from multiple candidate heating elements as the first heating element.

[0083] Step 220: Obtain a first measured resistance corresponding to the second heating element under the first heating condition.

[0084] The first measured resistance refers to a measured value obtained by measuring the resistance of the second heating element under the first heating condition.

[0085] Schematically, the second heating element is the heating element to be detected.

[0086] Illustratively, the first measured resistance is a result obtained by measuring the resistance value of the second heating element by a resistance measuring device during the process of heating the second heating element under the first heating condition.

[0087] Step 230: Determine a resistance deviation value corresponding to the second heating element based on a difference between the first measured resistance and the first reference resistance.

[0088] In some embodiments, the first reference resistance is subtracted from the first measured resistance to obtain a resistance difference value as the resistance deviation value.

[0089] Illustratively, the resistance deviation value is the resistance difference between the first measurement resistor and the first reference resistor.

[0090] Step 240: Determine the quality detection result corresponding to the second heating element based on the resistance deviation value.

[0091] The quality detection result is used to indicate the material uniformity of the second heating body.

[0092] The quality detection result is used to indicate the material uniformity of the second heating body, that is, the greater the resistance deviation value, the more uneven the conductor material of the second heating body in the printing process, and vice versa, the smaller the resistance deviation value, the more uniform the conductor material of the second heating body in the printing process.

[0093] In the embodiment, the second heating body with the resistance deviation value meeting the specified condition is used as a good product heating body, and the second heating body with the resistance deviation value not meeting the specified condition is used as a non-good product heating body. In actual production process, only the good product heating body is used as the heat conduction material to improve the heating performance of the equipment.

[0094] In some embodiments, in the case where the resistance deviation value does not reach the first resistance threshold, it is determined that the quality detection result of the second heating body meets the good product condition; or in the case where the resistance deviation value reaches the first resistance threshold, it is determined that the quality detection result of the second heating body does not meet the good product condition.

[0095] The good product condition is used to indicate that the second heating body can be put into production and use.

[0096] In the embodiment, different resistance threshold ranges are set to determine the quality detection result of the second heating body, for example,

R1, R2

R2, R3

[0097] The device detection method provided in the embodiment of the application obtains the first reference resistance of the first heating body as a reference under the first heating condition, and obtains the first measured resistance of the second heating body under the same first heating condition. The resistance deviation value of the second heating body is obtained according to the difference between the first measured resistance and the first reference resistance, and the quality detection result of the second heating body is determined according to the resistance deviation value. That is, the heating condition of the to-be-tested heating body is inferred according to the heating condition of the reference heating body, so as to judge the printing quality of the to-be-tested heating body, and further improve the heating performance of the equipment.

[0098] For illustration, refer to Figure 4 which shows a schematic diagram of a device detection apparatus provided by an example embodiment of the present application, wherein the device detection apparatus can specifically include the following modules:

[0099] The acquisition module 410 is configured to acquire a first reference resistance corresponding to a first heating body under a first heating condition, wherein the first heating body is a heating body with uniform material distribution.

[0100] The acquisition module 410 is further configured to acquire a first measured resistance corresponding to a second heating body under the first heating condition, wherein the first measured resistance is a measurement value obtained by performing resistance measurement on the second heating body under the first heating condition.

[0101] The determination module 420 is configured to determine a resistance deviation value corresponding to the second heating body based on a difference between the first measured resistance and the first reference resistance.

[0102] The determination module 420 is further configured to determine a quality detection result corresponding to the second heating body based on the resistance deviation value, wherein the quality detection result is used to indicate a material uniformity condition of the second heating body.

[0103] Optionally, the determination module 420 is further configured to determine that the quality detection result of the second heating body meets a good product condition in a case where the resistance deviation value does not reach a first resistance threshold; or determine that the quality detection result of the second heating body does not meet the good product condition in a case where the resistance deviation value reaches the first resistance threshold.

[0104] Optionally, the determination module 420 is further configured to subtract the first measured resistance from the first reference resistance to obtain a resistance difference value as the resistance deviation value.

[0105] Optionally, the acquisition module 410 is further configured to acquire a first resistance temperature coefficient corresponding to the first heating body; acquire a first reference temperature of the first heating body under the first heating condition; and obtain the first reference resistance based on the first reference temperature and the first resistance temperature coefficient.

[0106] Optionally, the acquisition module 410 is further configured to place a plurality of candidate heating bodies in an oil bath container, wherein the oil bath container stores heat-conducting oil; heat the oil bath container under a plurality of reference heating conditions to obtain a plurality of heating conditions corresponding to the candidate heating bodies under the plurality of reference heating conditions, wherein the heating conditions include heating temperatures and heating resistances corresponding to the candidate heating bodies; and acquire candidate resistance temperature coefficients corresponding to the candidate heating bodies based on the plurality of heating conditions.

[0107] The first heating body is determined based on a plurality of candidate resistance temperature coefficients corresponding to a plurality of candidate heating bodies.

[0108] Optionally, the acquisition module 410 is further configured to receive infrared light emitted by the candidate heating body through an infrared temperature measuring device during heating of the oil bath container under a plurality of reference heating conditions, the infrared light being used to determine a heating temperature corresponding to the candidate heating body; and measure the resistance of the candidate heating body through a resistance measuring device to obtain a heating resistance corresponding to the candidate heating body.

[0109] The device detection apparatus provided by the embodiments of the present application obtains the first reference resistance corresponding to the first heating body under the first heating condition by pre-acquiring the first heating body as a reference, and obtains the first measured resistance corresponding to the second heating body under the same first heating condition, obtains the resistance deviation value corresponding to the second heating body according to the difference between the first measured resistance and the first reference resistance, and determines the quality detection result of the second heating body according to the resistance deviation value. That is, the heating condition of the to-be-detected heating body is inferred according to the heating condition of the reference heating body, so as to judge the printing quality of the to-be-detected heating body, and further improve the heating performance of the device.

[0110] Referring to Figure 5 , a structural schematic diagram of a computer device provided by an embodiment of the present application is shown. As Figure 5 shown, the computer device 1000 of the embodiment includes at least one processor 1010 (only one processor is shown in the figure), a memory 1020, and a computer program 1021 stored in the memory 1020 and executable on the at least one processor 1010, and the processor 1010 implements the steps in the above-mentioned device detection method embodiments when executing the computer program 1021. Figure 5

[0111] The computer device 1000 can be a desktop computer, a notebook computer, a palm computer, a cloud server, and the like. The terminal device can include, but is not limited to, the processor 1010 and the memory 1020. Those skilled in the art can understand that Figure 5 The computer device 1000 is only an example, and does not constitute a limitation on the computer device 1000, and can include more or fewer components than those shown in the figure, or combine certain components, or different components, for example, can also include an input / output device, a network access device, and the like.

[0112] ​The processor 1010 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0113] In some embodiments, the memory 1020 may be an internal storage unit of the computer device 1000, such as a hard disk or memory of the computer device 1000. In other embodiments, the memory 1020 may also be an external storage device of the computer device 1000, such as a plug-in hard disk equipped on the computer device 1000, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. Furthermore, the memory 1020 may include both an internal storage unit of the computer device 1000 and an external storage device. The memory 1020 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of a computer program. The memory 1020 may also be used to temporarily store data that has been output or is about to be output.

[0114] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0115] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0116] Those skilled in the art can understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. A person skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0117] In the embodiments provided in the present application, it should be understood that the disclosed apparatus / computer device and method can be implemented in other ways. For example, the apparatus / computer device embodiments described above are merely schematic, for example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed each other can be through some interface, indirect coupling or communication connection between the devices or units, which can be electrical, mechanical or other forms.

[0118] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or they can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the present embodiment.

[0119] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0120] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and when the computer program is executed by the processor, it can implement the steps of the above-mentioned various method embodiments. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying computer program code, recording medium, USB flash drive, shaking hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0121] The present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed through a computer program product. When the computer program product runs on a computer device, the computer device can implement the steps in the above-mentioned method embodiments when executing.

[0122] The above embodiments are intended only to illustrate the technical solutions of the present application and are not intended to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents; and such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present application and should be included within the scope of protection of the present application.

Claims

1. A device detection method, characterized in that: The method comprises: Obtaining a first reference resistance of a first heating element corresponding to a first heating condition, wherein the first heating element is a heating element with a uniformly distributed material; Obtaining a first measured resistance corresponding to the second heating element under the first heating condition, where the first measured resistance refers to a measured value obtained by measuring the resistance of the second heating element under the first heating condition; determining a resistance deviation value corresponding to the second heating element based on a difference between the first measured resistance and the first reference resistance; A quality detection result corresponding to the second heating element is determined based on the resistance deviation value, and the quality detection result is used to indicate the material uniformity of the second heating element.

2. The method according to claim 1, characterized in that The determining a quality detection result corresponding to the second heating element based on the resistance deviation value includes: When the resistance deviation value does not reach the first resistance threshold, determining that the quality inspection result of the second heating element meets the good product condition; or When the resistance deviation value reaches the first resistance threshold, it is determined that the quality inspection result of the second heating element does not meet the good product condition.

3. The method according to claim 1 or 2, characterized in that The determining, based on a difference between the first measured resistance and the first reference resistance, a resistance deviation value corresponding to the second heating element includes: The first reference resistance is subtracted from the first measured resistance to obtain a resistance difference, which is used as the resistance deviation value.

4. The method according to claim 1 or 2, characterized in that The obtaining of a first reference resistance corresponding to the first heating element under the first heating condition includes: Obtaining a first resistance temperature coefficient corresponding to the first heating element; obtaining a first reference temperature of the first heating element under the first heating condition; The first reference resistance is obtained based on the first reference temperature and the first resistance temperature coefficient.

5. The method according to claim 1 or 2, characterized in that Before obtaining the first reference resistance of the first heating element corresponding to the first heating condition, the method further includes: Placing a plurality of candidate heating elements in an oil bath container, wherein the oil bath container stores heat transfer oil; Heating the oil bath container under a plurality of reference heating conditions to obtain heating conditions corresponding to the candidate heating element under the plurality of reference heating conditions, the heating conditions including the heating temperature and heating resistance corresponding to the candidate heating element; Obtaining a candidate resistance temperature coefficient corresponding to the candidate heating element based on multiple heating conditions; The first heating element is determined based on candidate resistance temperature coefficients corresponding to a plurality of candidate heating elements.

6. The method according to claim 5, characterized in that The step of heating the oil bath container under a plurality of reference heating conditions to obtain heating conditions corresponding to the candidate heating element under the plurality of reference heating conditions includes: During the process of heating the oil bath container under multiple reference heating conditions, infrared light emitted by the candidate heating element is received by an infrared temperature measuring device, and the infrared light is used to determine the heating temperature corresponding to the candidate heating element; The resistance of the candidate heating element is measured by a resistance measuring device to obtain a heating resistance corresponding to the candidate heating element.

7. A device detection device, characterized in that: The device comprises: An acquisition module, configured to acquire a first reference resistance corresponding to a first heating element under a first heating condition, wherein the first heating element is a heating element with a uniformly distributed material; The acquisition module is further configured to acquire a first measured resistance corresponding to the second heating element under the first heating condition, where the first measured resistance refers to a measured value obtained by measuring the resistance of the second heating element under the first heating condition; a determination module, configured to determine a resistance deviation value corresponding to the second heating element based on a difference between the first measured resistance and the first reference resistance; The determination module is further used to determine a quality detection result corresponding to the second heating element based on the resistance deviation value, and the quality detection result is used to indicate the material uniformity of the second heating element.

8. A computer device, characterized in that: The computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the device detection method according to any one of claims 1 to 6 is implemented.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the device detection method according to any one of claims 1 to 6 is implemented.

10. A computer program product, characterized in that The device comprises a computer program, which enables the device detection method according to any one of claims 1 to 6 to be executed when the computer program is executed.

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