Spaced support movable position type semiconductor detection device

Abstract

The invention discloses an interval supporting movable position type semiconductor detection device, and relates to the technical field of semiconductor detection. The detection device comprises a chamber top cover; the top of the monitoring window is an integrated quartz window supported by the monitoring frame; the supporting frame body is supported on the top of the monitoring window at intervals through a supporting piece and is used for movably supporting more than one probe seat; the supporting piece comprises an end supporting piece, a first central supporting piece and a second central supporting piece; the first central lug is fixedly connected with the first central supporting piece, and the second central lug is fixedly connected with the second central supporting piece; the probe seat comprises a cylinder body connecting body and a connecting lug block. A detector head, a probe seat and the like of the monitoring equipment are prevented from being influenced by different deposition temperature fluctuations of the cavity; the probe seat can be installed and positioned at any position, the test position can be positioned at any position, and various sizes of substrates and tray changes are compatible.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor detection, and particularly relates to a spaced support movable position type semiconductor detection device. BACKGROUND

[0002] MOCVD (Metal-Organic Chemical Vapor Deposition) equipment is a key equipment for research and production of compound semiconductor epitaxial materials, is particularly suitable for large-scale industrial production of compound semiconductor functional structure materials, and is a core semiconductor equipment that cannot be replaced by other semiconductor equipment.

[0003] In the process of growing a compound semiconductor thin film material by using a MOCVD equipment, various source material gases and carrying gases are reacted to form a film, since the thin film growth is nanoscale growth, process parameters (for example, temperature, reflectivity, emissivity and bending rate) need to be accurately controlled. One of the core technologies is in-situ monitoring, real-time monitoring or monitoring of temperature, film thickness and warping.

[0004] In the process of growing an epitaxial film on a substrate by using a MOCVD equipment, the processing temperature required for epitaxial film growth is between 500 DEG C and 1300 DEG C, therefore, a monitoring equipment is usually arranged at the periphery of a reaction cavity to avoid high temperature, high pressure and corrosive chemicals in the reaction cavity. A probe head of the monitoring equipment is fixed by a probe seat, and corresponds to a hole type quartz window 1 of a monitoring part at the top of the reaction cavity to non-contact monitor process parameters such as temperature, reflectivity, emissivity and bending rate, so as to accurately control the epitaxial film growth process.

[0005] The hole type quartz window 1 in the prior art is a fixed multi-hole structure, as shown in Figure 1 , so that the size of the monitoring window is fixed, thereby matching the size of the light path channel of the monitoring equipment, ensuring the measurement accuracy, reducing the heat influence of the cavity on the outside; but the size of the substrate changes, the test position cannot be adjusted, and various sizes of substrates and trays cannot be compatible (for example, the ideal monitoring position is between adjacent holes of the fixed multi-hole structure, which affects the monitoring process). In the prior art, the position of the monitoring probe is adjusted by a movable monitoring probe system, but the movable monitoring probe system involves a motion structure, a control system and the like, the cost is significantly increased, the system is too complex, is not suitable for large-scale application, and the influence of the fixed multi-hole structure of the hole type quartz window 1 is not solved.

[0006] In addition, there are problems such as different influences of the probe head of the monitoring device by the heat of different deposition temperatures of the chamber (the processing temperature is between 500-1300℃), large fluctuations of the measurement accuracy of the probe, large deformation of the probe seat affected by the heat, influence on the installation position of the probe, and reduction of the measurement accuracy.

[0007] It should be noted that this part of the present application only provides background technology related to the present application, and does not necessarily constitute prior art or known technology. SUMMARY

[0008] The purpose of the present application is to overcome the problems of different substrate sizes, changes in the size of the substrate, inability to adjust the test position, inability to be compatible with various size substrates and tray changes, and the influence of the measurement accuracy of the probe head, probe seat, etc. of the monitoring device by the fluctuation of the deposition temperature of the chamber. The present application provides a spaced support movable position type semiconductor detection device, which avoids the influence of the probe head, probe seat, etc. of the monitoring device by the fluctuation of the deposition temperature of the chamber by spacing the support of the probe seat. The probe seat can be installed and positioned at any position, the test position can be positioned arbitrarily, and it is compatible with various size substrates and tray changes.

[0009] In order to achieve the above-mentioned purpose, the present application provides a spaced support movable position type semiconductor detection device, comprising:

[0010] A chamber top cover;

[0011] A monitoring window, the top of the monitoring window is an integrated quartz window supported by a monitoring frame;

[0012] A support frame, which is spaced and supported above the top of the monitoring window by a support member, for movably supporting more than one probe seat; the support frame comprises a frame, a first center strip and a second center strip are arranged in the frame; the first center strip and the second center strip are spaced apart, and the first center strip and the second center strip are spaced apart from the frame; the support frame further comprises a first center lug, a second center lug and an end lug protruding from the frame;

[0013] The support member comprises an end support member, a first center support member and a second center support member; the first center lug and the first center support member are fixedly connected, and the second center lug and the second center support member are fixedly connected;

[0014] The probe seat comprises a cylinder connector and a connecting lug; the connecting lug protrudes from the side wall of the cylinder connector and is provided with a through hole for fixing the probe seat at different positions.

[0015] Optionally, a movable heat adjusting cylinder is arranged between the first and second central strips, the movable heat adjusting cylinder comprising a movable connecting seat, a support, a first cylinder body and a second cylinder body; the opposite side walls of the first and second central strips are central strip side walls; the movable connecting seat is movably connected with the central strip side walls; the support is used to connect the movable connecting seat and support the first and second cylinder bodies; and the first and second cylinder bodies are movably positioned and enclose cylinder bodies of different sizes.

[0016] Optionally, a deformation adjusting assembly is further included, the deformation adjusting assembly comprising a movable block, an elastic member and a jacking member; the first or second central support comprises a polished rod part and a threaded part; the first or second central support is a circular rod; the movable block is sleeved on the polished rod part of the first or second central support and abuts against the first central lug; the elastic member is connected with the movable block and the jacking member; and the jacking member cooperates with the threaded part, and the jacking member is raised or lowered by rotating the jacking member.

[0017] Optionally, a deformation adjusting assembly is further included, the deformation adjusting assembly comprising a movable block, a fixed member, a second elastic member, a baffle, a second polished rod part, a second jacking member, a second threaded part and an inclined support rod; the fixed member is fixedly connected with the movable block and the second elastic member; the baffle is fixedly connected with the second elastic member; the baffle is sleeved on the second polished rod part of the inclined support rod and is used to movably support the second elastic member; the second jacking member cooperates with the second threaded part of the inclined support rod, the second jacking member abuts against the baffle, and the baffle is moved along the inclined support rod by rotating the second jacking member, thereby changing the compression of the second elastic member.

[0018] Optionally, through holes are arranged on the first central lug, the second central lug and the end lug, and the through holes are fixedly connected with the support by bolts.

[0019] Optionally, the first central lug and the second central lug are symmetrically and spacedly arranged relative to a horizontal axis of the deposition chamber center.

[0020] Optionally, a top surface of the cylinder body connector of the probe seat is an inclined top surface.

[0021] Optionally, an inclination angle of the inclined support rod relative to a vertical direction is 35°-75°.

[0022] Optionally, the elastic member and the second elastic member are springs.

[0023] Optionally, the working temperature of the deposition chamber is 500-1300℃.

[0024] Advantages:

[0025] The application provides a movable-position-type semiconductor detection device which is spaced apart and supported, provides a continuous and uninterrupted visual field for monitoring a substrate in a chamber through an integrated quartz window, and has a first central strip and a second central strip which are spaced apart and form a continuous and uninterrupted space therebetween, and the first central strip and the second central strip are spaced apart from a frame, and the first central strip and the frame and the second central strip and the frame form a continuous and uninterrupted space therebetween, so as to achieve movable fixing of a probe seat at any position; the frame, the first central strip and the second central strip of the support frame body form a plurality of continuous and uninterrupted spaces, so as to achieve movable fixing of the probe seat at any position and continuous visual field at any position, and overcome the problems of different substrate sizes, changes in substrate size, inability to adjust the test position, and incompatibility with various sizes of substrates and changes in trays in the prior art. The support frame body is spaced apart and supported on the top of the monitoring window by a support member, so that the support frame body is far away from the monitoring window, the possibility of deformation of the support frame body due to heat (less affected by different deposition temperature fluctuations of the chamber) is greatly reduced, the influence of deformation of the monitoring window is avoided, and convenient installation and fixing of the probe seat at any position are facilitated; based on the above structure, the problems of different substrate sizes, changes in substrate size, inability to adjust the test position, incompatibility with various sizes of substrates and changes in trays, and the influence of different deposition temperature fluctuations of the chamber on the measurement accuracy of the detector head and the probe seat of the monitoring equipment in the prior art are overcome, the measurement accuracy is greatly improved, and the measurement accuracy is not affected by different deposition chamber temperatures and is not limited by different substrate sizes. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0027] Figure 1 It is a schematic diagram of the existing hole-type quartz window;

[0028] Figure 2 It is a structural schematic diagram of the movable-position-type semiconductor detection device provided by the embodiments of the application;

[0029] Figure 3 It is a structural schematic diagram of the top of the monitoring window provided by the embodiments of the application;

[0030] Figure 4 Structure diagram of a movable heat adjusting cylinder provided for an embodiment of the present application;

[0031] Figure 5 Structure diagram of another probe seat provided for an embodiment of the present application;

[0032] Figure 6 Structure diagram of a deformation adjusting assembly provided for an embodiment of the present application.

[0033] Explanation of reference signs:

[0034] 1 - hole type quartz window; 2 - chamber top cover; 3 - monitoring window; 31 - integrated quartz window; 32 - monitoring frame; 4 - support frame body; 41 - frame; 42 - first center strip; 43 - second center strip; 44 - first center lug; 45 - second center lug; 46 - end support; 47 - first center support; 471 - light pole part; 472 - threaded part; 48 - second center support; 49 - end lug; 50 - center strip side wall; 5 - probe seat; 51 - cylinder body connector; 52 - connecting lug block; 6 - movable heat adjusting cylinder; 61 - moving connection seat; 62 - support; 63 - first cylinder body; 64 - second cylinder body; 7 - deformation adjusting assembly; 71 - movable block; 72 - elastic member; 73 - jacking member; 74 - fixing member; 75 - second elastic member; 76 - baffle; 77 - second light pole part; 78 - second jacking member; 79 - second threaded part; 80 - inclined support rod. DETAILED DESCRIPTION

[0035] In the present application, the orientation words such as "upper", "lower", "left", "right" used without contrary description generally refer to the orientation shown in the drawings and the actual application.

[0036] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0037] In the present disclosure, unless specifically stated and limited otherwise, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact with an intervening medium. Also, the first feature "over", "above" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. The first feature "under", "below" and "underneath" the second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0038] The endpoints of the ranges and any values described herein are not limited to the precise values recited as essentially any range of values can be combined with any other range of values to produce a new range of values. With respect to a numerical value range, the end points of each range, the end points of each range and individual point values, and individual point values can be combined with each other to produce one or more new numerical value ranges, which should be considered as specifically disclosed herein. Wherein, the terms "optional" and "optional" mean that it can be included, or not included (or can be, or can not be).

[0039] In order to overcome the problems of different substrate sizes, changes in substrate size position, inability to adjust test position, inability to be compatible with various size substrates and tray changes, and the influence of chamber deposition temperature fluctuations on the measurement accuracy of the detector head and probe seat of the monitoring device, the present application is further researched and proposed.

[0040] Please refer to Figures 2 to 6 The embodiment of the present application provides a movable position type semiconductor detection device supported by a spacer, which comprises:

[0041] A chamber top cover 2.

[0042] A monitoring window 3 supported by the chamber top cover 2 and in communication with the deposition chamber, for providing the growth condition of the epitaxial film on the substrate in the deposition chamber, by monitoring the temperature, reflectivity, emissivity and bending rate, etc., to accurately control the epitaxial film growth process. The top of the monitoring window 3 is an integrated quartz window 31 supported by a monitoring frame 32, which provides a non-spaced monitoring window and can provide a continuous and uninterrupted field of view for monitoring the substrate in the chamber.

[0043] The support frame body 4 is supported on the top of the monitoring window 3 by the support, and is used to movably support one or more probe holders 5; the large window design of the integrated quartz window 31 is beneficial to continuous monitoring, and the heat in the deposition chamber has greater influence on the upper part, and the support frame body 4 is more obviously affected by thermal expansion and contraction, the deformation of the support frame body 4 is increased, which is not conducive to improving the measurement accuracy. By supporting the top of the monitoring window 3 by the support, the support frame body 4 is away from the monitoring window 3, which greatly reduces the heat influence of heat conduction, which is the main heat influence source, and can greatly reduce the possibility of deformation of the support frame body 4, which is beneficial to improving the measurement accuracy. At the same time, by supporting the top of the monitoring window 3 by the support, a space is formed between the monitoring window 3 and the support frame, which is beneficial to the movable fixing and disassembly of the probe holder 5, and greatly reduces the installation and maintenance difficulty. The monitoring window 3 is provided with a window, which is inevitably deformed in a large area, and has a large possibility of thermal deformation, which affects the measurement accuracy. The support is supported on the chamber top cover 2, and the structure of the chamber top cover 2 is stable, so that the support frame body 4 is not affected by the deformation of the monitoring window 3, which is more beneficial to improving the measurement accuracy.

[0044] The support frame body 4 includes a frame 41, which is a rectangular structure matched with the main structure of the monitoring window 3; a first center strip 42 and a second center strip 43 are arranged in the frame 41; the first center strip 42 and the second center strip 43 are arranged at intervals, and a continuous interval without interruption is formed between the first center strip 42 and the second center strip 43, so as to realize the continuous monitoring of the epitaxial film growth on the substrate in the deposition chamber without obstruction of the detector head. The first center strip 42 and the second center strip 43 are arranged at intervals with the frame 41, and a continuous interval without interruption is formed between the first center strip 42 and the frame 41 and between the second center strip 43 and the frame 41, so as to realize the movable fixing of the probe holder 5 at any position. The support frame body 4 further includes a first center lug 44, a second center lug 45 and an end lug 49 arranged on the frame 41; the first center lug 44, the second center lug 45 and the end lug 49 are provided with through holes, and are fixedly connected with the support by bolts.

[0045] The support members include end support members 46, a first central support member 47, and a second central support member 48. The support members can be rod-shaped, plate-shaped, or other shapes, and can have circular, oval, or other cross-sectional shapes, which are not limited herein. Preferably, the support members are circular support rods, and the support members are provided with holes or other structures for fixed connection. In the illustration, the end support members 46 are provided in four numbers, located near the four ends of the frame 41, and are fixedly connected to the four end lugs 49 of the support frame 4, so as to support the support frame 4 as a whole above the top of the monitoring window 3. The support frame 4 spans the entire top of the monitoring window 3, and has a large span in the length direction. The support frame 4 is easily deformed in the length direction, which affects the measurement accuracy. The first central lug 44 and the first central support member 47 are fixedly connected, and the second central lug 45 and the second central support member 48 are fixedly connected, so as to support the support frame 4 from the central part in the length direction, effectively reducing the deformation of the support frame 4, and improving the structural stability of the support frame 4. Preferably, the first central lug 44 and the second central lug 45 are symmetrically and spaced apart relative to a horizontal axis passing through the center of the deposition chamber, so as to stably support the easily deformed area near the center of the deposition chamber, further reduce the risk of deformation of the support frame 4, and improve the measurement accuracy.

[0046] The above spacing refers to the non-direct contact between adjacent components. The spacing distance can be determined according to actual needs such as heat insulation, detection path size, and size of the fixed connection member.

[0047] The probe seat 5 is provided in one or more numbers, and is movably supported on the support frame 4. The probe seat 5 includes a cylinder connecting body 51 and a connecting lug 52. The cylinder connecting body 51 is provided with a screw hole for fixed connection with a detector head (not shown) for stable support of the detector head. The connecting lug 52 protrudes from the side wall of the cylinder connecting body 51, and is provided with a through hole for a bolt or other connecting member to pass through the through hole, and the first central strip 42 and the frame 41, and the second central strip 43 and the frame 41 form a continuous and uninterrupted spacing, so as to fix the probe seat 5 at different positions.

[0048] The continuous and uninterrupted field of view for monitoring the substrate in the chamber is provided by the integrated quartz window 31; the first central strip 42 and the second central strip 43 are spaced apart, forming an uninterrupted and continuous interval between the first central strip 42 and the second central strip 43, and the first central strip 42 and the second central strip 43 are spaced apart from the frame 41, forming an uninterrupted and continuous interval between the first central strip 42 and the frame 41 and the second central strip 43 and the frame 41, so as to achieve the movable fixation of the probe seat 5 at any position; a plurality of uninterrupted and continuous intervals are formed by the cooperation of the frame 41, the first central strip 42 and the second central strip 43 of the support frame body 4, so as to achieve the movable fixation of the probe seat 5 at any position, and the continuous field of view at any position, overcoming the problems of different substrate sizes, changes in substrate size position, inability to adjust the test position, and inability to be compatible with various size substrates and tray changes in the prior art. The support frame body 4 is spaced apart and supported on the top of the monitoring window 3 by the support member, so that the support frame body 4 is far away from the monitoring window 3, greatly reducing the possibility of deformation of the support frame body 4 due to heat (less affected by the fluctuation of the deposition temperature of the chamber), and avoiding the influence of the deformation of the monitoring window 3, while facilitating the convenient installation and fixation of the probe seat 5 at any position; based on the above structure, the problems of different substrate sizes, changes in substrate size position, inability to adjust the test position, inability to be compatible with various size substrates and tray changes, and the influence of the fluctuation of the deposition temperature of the chamber on the measurement accuracy of the detector head and the probe seat of the monitoring equipment in the prior art are overcome, so that the measurement accuracy can be greatly improved without being affected by the different deposition chamber temperatures and the different substrate sizes.

[0049] The deposition chamber temperature is different, the upward radiation heat is different, and the amount of upward radiation in the field of view range of the monitoring equipment (the size of the light path path channel is matched) is required, but beyond that, the upward radiation heat is different due to the different deposition chamber temperatures, the radiation heat on the upper part of the monitoring window 3 is different, which affects the temperature of the upper part, and the optimal working temperature on the entire measurement path of the monitoring equipment is certain, and the different temperature of the upper part affects the further provision of the measurement accuracy.

[0050] Optionally, the space between the first center strip 42 and the second center strip 43 is provided with a movable heat adjusting cylinder 6; the movable heat adjusting cylinder 6 comprises a movable connecting seat 61, a support 62, a first cylinder body 63 and a second cylinder body 64. The opposite side walls of the first center strip 42 and the second center strip 43 are center strip side walls 50; the movable connecting seat 61 is movably connected with the center strip side walls 50, so that the position of the movable heat adjusting cylinder 6 corresponds to the mounting seat and is movably arranged at any position; the connection mode can be that the center strip side walls 50 are provided with magnetic blocks and the movable connecting seat 61 is provided with magnetic blocks, and the two are fixed and shifted by magnetic attraction; or the movable connecting seat 61 and the center strip side walls 50 can be movably connected and fixed by a groove and a sliding block; which is not limited here. The support 62 is used to connect the movable connecting seat 61 and support the first cylinder body 63 and the second cylinder body 64. The first cylinder body 63 and the second cylinder body 64 are movably positioned and surround different sizes of cylinder bodies, and the cylinder bodies are arranged below the probe seat 5 to provide a path matched with the path of the monitoring equipment; the first cylinder body 63 and the second cylinder body 64 are made of heat-resistant materials (the specific material can be selected from commercially available high-temperature-resistant materials, which is not limited here), which are used to block external heat by surrounding the cylinder bodies; the different sizes of the cylinder bodies receive different heat radiation from the lower deposition chamber, and the different temperatures of the entered radiation are changed by the size of the cylinder body, so that the temperature in the cylinder body is changed; the temperature of the lower deposition chamber is changed by changing the size of the cylinder body, and the temperature of the space in the cylinder body is changed, so that the temperature of the space in the cylinder body is not affected by the excessive fluctuation of the temperature of the lower deposition chamber, the measurement accuracy is affected, and the optimal working temperature of the entire measurement path of the monitoring equipment is achieved. Understandably, the material of the first cylinder body 63 and the second cylinder body 64 can be a cylinder body containing a phase change material inside, so as to improve its temperature adjusting capacity.

[0051] The support comprises an end support 46, a first center support 47 and a second center support 48; the end support 46, the first center support 47 and the second center support 48 are all round rods. The support frame body 4 spans the top of the entire monitoring window 3, and has a large span in the length direction, so the support frame body 4 is prone to deformation in the length direction, which affects the measurement accuracy. After the two ends of the support frame body 4 are supported by the end support 46, although the first center support 47 and the second center support 48 support near the center, since the monitoring equipment usually detects within the end portion, the support frame body 4 is inevitably subjected to greater downward pressure in the middle, especially after a long time of work, which leads to a high risk of deformation of the support frame body 4; in addition, when the monitoring equipment is installed, the probe seat 5 on the support frame body 4 is connected by adjusting the position, and due to position adjustment errors and the like, the support frame body 4 is subjected to force impact, and the vibration of the motor, shifting components and the like on the monitoring equipment also affects the stability of the support frame body. Since the types of monitoring equipment are different, the top surface of the cylinder connecting body 51 of the probe seat 5 can be an inclined top surface, as shown in Figure 5The inclined top surface causes the monitoring device to have different downward pressure on the support frame 4, in addition to the vertical downward pressure, there is also a force parallel to the support frame 4, thereby changing the stress on both sides of the probe seat, due to the complexity of the monitoring device, the corresponding influence (deformation influence) of the downward pressure on the support frame 4 cannot be ignored, which affects the improvement of measurement accuracy.

[0052] Optionally, a deformation adjustment assembly 7 is further included, which is used to provide the first center lug 44 and the second center lug 45 with additional adjustable upward support force and adjustable inclined upward support force, so as to improve the downward deformation of the support frame 4 and improve the measurement accuracy.

[0053] The deformation adjustment assembly 7 includes a movable block 71, an elastic member 72 and a jacking member 73; the first center support member 47 includes a light rod part 471 and a threaded part 472; the movable block 71 is sleeved on the light rod part 471 of the first center support member 47 and abuts against the first center lug 44, and provides the first center lug 44 with additional variable upward support force when supporting the lower part; the elastic member 72 is connected with the movable block 71 and the jacking member 73, wherein the elastic member 72 (such as a spring, etc.) is rotatably connected with the jacking member 73, and the rotatable connection manner is not limited, for example, the elastic member 72 can be fixedly connected with a rotatable piece arranged in the jacking member 73; the jacking member 73 cooperates with the threaded part 472, and the lifting of the jacking member 73 is realized by rotating the jacking member 73, the elastic member 72 is compressed to different degrees, and then the adjustable upward support force is provided to the first center lug 44 to resist the downward pressure of different monitoring devices; in the use process, for example, a certain upward support force can be applied in the initial stage; when the support frame 4 is deformed to a certain degree (in the installation or use process), the adjustable upward support force is provided by adjusting the different degrees of compression of the elastic member 72 by the jacking member 73, so as to resist the downward pressure of different monitoring devices and adjust the deformation trend of the support frame 4.

[0054] Understandably, the corresponding second center support member 48 includes a light rod part 471 and a threaded part 472 (not shown in the figure), which has the same structure as the first center support member 47, and provides the same adjustable upward support force.

[0055] The deformation adjustment assembly 7 further comprises a fixing piece 74, a second elastic piece 75, a baffle 76, a second light pole part 77, a second jacking piece 78, a second threaded part 79 and an inclined support pole 80; the fixing piece 74 is fixedly connected with the movable block 71 and the second elastic piece 75, the baffle 76 is fixedly connected with the second elastic piece 75, the baffle 76 is sleeved on the second light pole part 77 of the inclined support pole 80 and is used for movably supporting the second elastic piece 75; the second jacking piece 78 is matched with the second threaded part 79 of the inclined support pole 80, the second jacking piece 78 is in abutment with the baffle 76, the baffle 76 is moved along the inclined support pole 80 through the rotation of the second jacking piece 78, and then the compression of the second elastic piece 75 is changed, thereby providing the upwardly inclined support force on the first center lug 44, so that the adjustment of the support force parallel to the support frame body 4 and the support force perpendicular to the chamber top cover 2 is realized; in use, the direction of the support force can be adjusted according to the deformation conditions of different ends in the length direction of the support frame body 4; if the top surface of the cylinder connecting body 51 of the probe seat 5 is an inclined top surface, by adjusting the direction of the inclined top surface, the component parallel to the support frame body 4 when the monitoring equipment is pressed down can be opposite to the component parallel to the support frame body 4 of the upwardly inclined support force on the first center lug 44, so that the component parallel to the support frame body 4 when the monitoring equipment is pressed down is offset, and then the possibility of deformation of the support frame body 4 is improved, which is beneficial to improving the measurement accuracy. Through the arrangement of the elastic piece 72 and the second elastic piece 75, the support frame body 4 can have a certain elastic buffering capacity when being pressed down, so that the resistance to deformation is improved.

[0056] The inclined support pole 80 is fixedly installed on the chamber top cover 2 through a fixing block and is stably supported by the chamber top cover 2, so that stable support is provided for the adjustment of the upward support force. The inclination angle of the inclined support pole 80 relative to the vertical direction is 35°-75°, so that the upward and horizontal components of appropriate sizes are provided.

[0057] Alternatively, the movable block 71 can also be fixedly connected with the first center lug 44 through a fixing part, and after the fixed connection, the downward pulling force on the lug and the adjustable force parallel to the support frame body 4 in different directions can be realized, so that more possibilities of adjustable stress are realized, and the stress conditions of the support frame body 4 are improved.

[0058] The above describes the preferred embodiments of the application, but the application is not limited thereto. Within the technical concept of the application, various simple modifications can be made to the technical solutions of the application, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be considered as the disclosed content of the application and belong to the protection scope of the application.

Claims

1. A semiconductor testing device with movable position supported by a spacer, characterized in that: include: Chamber cover; Monitoring window: the top of the monitoring window is an integrated quartz window supported by the monitoring frame; A support frame is supported on the top of the monitoring window by support members at intervals, and is used to movably support more than one probe seat; the support frame includes a frame, and a first center bar and a second center bar are provided in the frame; the first center bar and the second center bar are spaced apart, and the first center bar and the second center bar are respectively spaced apart from the frame; the support frame also includes a first center lug, a second center lug, and an end lug protruding from the frame; The support member includes an end support member, a first center support member and a second center support member; the first center lug is fixedly connected to the first center support member, and the second center lug is fixedly connected to the second center support member; The probe base includes a cylindrical connector and a connecting ear block; the connecting ear block protrudes from the side wall of the cylindrical connector and is provided with a through hole for fixing the probe base at different positions.

2. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: A movable heat regulating cylinder is provided in the interval between the first center bar and the second center bar, and the movable heat regulating cylinder includes a movable connecting seat, a bracket, a first cylinder body and a second cylinder body; the side walls opposite to the first center bar and the second center bar are the center bar side walls; the movable connecting seat is movably connected to the center bar side walls; the bracket is used to connect the movable connecting seat and support the first cylinder body and the second cylinder body; the first cylinder body and the second cylinder body can be movably positioned and enclosed into cylinders of different sizes.

3. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: It also includes a deformation adjustment component, which includes a movable block, an elastic member and a lifting member; the first center support member or the second center support member includes a smooth rod portion and a threaded portion; the first center support member or the second center support member is a circular rod member; the movable block is sleeved on the smooth rod portion of the first center support member or the second center support member and abuts against the first center lug; the elastic member is connected to the movable block and the lifting member; the lifting member cooperates with the threaded portion, and the lifting member is lifted and lowered by rotating the lifting member.

4. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: The cam is secured to the rear of the second support rod and is adapted to engage the second support rod when the cam is engaged with the second support rod.

5. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: The first central lug, the second central lug and the end lug are provided with through holes and are fixedly connected to the support member by bolts.

6. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: The first central lug and the second central lug are symmetrically spaced relative to a horizontal axis passing through the center of the deposition chamber.

7. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: The top surface of the cylindrical connector of at least one of the probe seats is an inclined top surface.

8. The spacer support movable position type semiconductor testing device according to claim 4, characterized in that: The tilt angle of the tilt support rod relative to the vertical direction is 35°-75°.

9. The spacer support movable position type semiconductor testing device according to claim 3 or 4, characterized in that: The elastic member and the second elastic member are springs.

10. The spacer support movable position type semiconductor testing device according to claim 1, characterized in that: The operating temperature of the deposition chamber is 500-1300°C.

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