A BGA package structure

Abstract

The application relates to the technical field of BGA packaging, and discloses a BGA packaging structure, which comprises a chassis, the top of the chassis is fixedly connected with a shell, the inner wall of the shell is slidably connected with a shell two, the outer wall of the shell two is fixedly connected with an open grid plate, the outer wall of the open grid plate is fixedly connected with a connecting rod, the welding position on an integrated circuit connecting plate is recessed downward, when passing through the open grid plate, the open grid plate is overlapped with the grid on the integrated circuit connecting plate, so that transverse series connection of tin paste is prevented, meanwhile, when the integrated circuit connecting plate passes through the open grid plate, the tin paste is smeared on the integrated circuit connecting plate by a tin feeding opening, the tin paste is pressed in the reserved groove of the integrated circuit connecting plate by an elastic scraper, the reserved groove of the integrated circuit connecting plate is left with compacted tin paste, when the chip is installed and heated, the tin paste is melted to fix the pin of the circuit connecting plate, the small chip installation interval is avoided, the tin paste is melted and welded, the other chip module welding points are connected, and inaccurate welding is caused.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of BGA packaging devices, and particularly relates to a BGA packaging structure. BACKGROUND

[0002] With the continuous development of BGA packaging, BGA packaging is applied more and more widely. As an advanced packaging technology, BGA (Ball Grid Array) packaging has the advantages of high pin density, good electrical performance and thermal performance.

[0003] In the BGA packaging process, the chip needs to be fixed on the packaging substrate and electrically connected through welding and other processes. However, when the chip is too small to print the solder paste welding point, the solder paste is difficult to adhere to the welding point, resulting in inaccurate positioning and welding of the chip, which easily leads to welding deviation and affects the performance of the packaged chip. The application provides the following scheme, and specifically relates to a BGA packaging structure. SUMMARY

[0004] To solve the above technical problems, the application provides a BGA packaging structure, which comprises a chassis, and is characterized in that the BGA packaging structure further comprises:

[0005] A main body mechanism is fixedly connected to the top of the chassis and used for providing a mounting space of a basic device.

[0006] A following mechanism is fixedly connected to the inner wall of the main body mechanism and used for completing the main work of BGA packaging.

[0007] A soldering mechanism is fixedly connected to the inner wall of the main body mechanism and used for providing accurate coverage for packaging and welding.

[0008] The top of the chassis is fixedly connected with a shell, the inner wall of the shell is slidably connected with a shell two, the outer wall of the shell two is fixedly connected with an open grid plate, and the outer wall of the open grid plate is fixedly connected with a connecting rod.

[0009] Preferably, the main body mechanism comprises:

[0010] An external component is fixedly connected to the inner wall of the main body mechanism through an outer wall piece, and the external component provides a basic dustproof shell and a mounting space for the device.

[0011] The outer wall piece comprises a placing box fixedly connected to the outer wall of the shell.

[0012] A suction component is fixedly connected to the outer wall of the external component, and the suction component provides a basic structure for taking and installing the chip.

[0013] Preferably, the following mechanism comprises:

[0014] The upper feeding assembly is fixedly connected to the inner wall of the outer assembly, and the outer assembly provides basic feeding of the material;

[0015] The following assembly is fixedly connected to the inner wall of the outer assembly through a follower, and the following assembly cooperates with the upper feeding assembly to form a basic packaging process of the chip;

[0016] The follower includes a quick displacer I fixedly connected to the inner wall of the shell.

[0017] Preferably, the tin feeding mechanism includes:

[0018] The tin feeding assembly is fixedly connected to the inner wall of the outer assembly through a tin feeding member, and the tin feeding assembly accurately provides tin paste with appropriate thickness.

[0019] The tin feeding member includes a shell II slidingly connected to the inner wall of the shell.

[0020] The sliding assembly is fixedly connected to the outer wall of the tin feeding assembly through a sliding member, and the sliding assembly forms a passage through which the installed packaging workpiece can pass through sliding.

[0021] The tin feeding member includes a spring fixedly connected to the inner wall of the shell II, and the end of the spring away from the shell II is fixedly connected with a Y-shaped clamping block.

[0022] Preferably, the outer assembly includes a transparent acrylic plate fixedly connected to the outer wall of the shell, and the outer wall of the shell is provided with an open slot.

[0023] Preferably, the suction assembly includes a motion motor fixedly connected to the inner wall of the shell, the output shaft of the motion motor is fixedly connected with a mechanical arm, the end of the shell away from the shell is fixedly connected with a suction nozzle, and the outer wall of the suction nozzle is fixedly connected with an air pipe.

[0024] Preferably, the upper feeding assembly includes a platform I fixedly connected to the motion shaft of the quick displacer I, and the outer wall of the platform I is fixedly connected with a chip tray. When the tin feeding on the integrated circuit connecting plate is completed, a small amount of tin paste will overflow and be scraped off by the elastic scraper to the recycling port through the grid cooperation of the open grid plate and the elastic scraper, and the excess tin paste is recycled through the recycling port. At the same time, the output of the tin feeding port is adjusted by observing the amount of tin paste recycled through the recycling port, so as to avoid the use of appropriate amount of tin paste when different integrated circuit connecting plates require different amounts of tin paste, leading to excess tin paste and waste of resources, thereby reducing the production power consumption.

[0025] Preferably, the following component includes a toothed slide rail fixedly connected to the inner wall of the housing, a rapid displacement device two slidably connected to the outer wall of the toothed slide rail, a platform two fixedly connected to the motion axis of the rapid displacement device two, an integrated circuit connection board fixedly connected to the outer wall of the platform two, a lifting slide rod fixedly connected to the outer wall of the platform two, and a retraction port fixedly connected to the outer wall of the platform two. When the integrated circuit connection board passes through the open grid plate, the soldering port will apply solder paste to the grid of the integrated circuit connection board. Due to the special nature of the elastic scraper, when compacting the solder paste on the grid of the integrated circuit connection board, the elastic scraper will sink into the grid of the integrated circuit connection board to compact the solder paste. At the same time, when the elastic scraper exits the grid of the integrated circuit connection board, the friction between the elastic scraper and the edge of the grid of the integrated circuit connection board will interrupt the application of solder paste. When it enters the next grid of the integrated circuit connection board, the solder paste has low adhesion, and the elastic scraper scrapes it off, avoiding excess solder paste between the grids and preventing solder adhesion after the solder paste melts.

[0026] Preferably, the soldering assembly includes several elastic scrapers fixedly connected to the outer wall of the connecting rod. The outer wall of the elastic scraper is in contact with the inner wall of the open grid plate. A soldering port is fixedly connected to the outer wall of the open grid plate, and the outer wall of the soldering port is in contact with the inner wall of the open grid plate. When the rapid displacement device 2 moves the platform 2 into the equipment, the integrated circuit connection board fixed on the platform 2 will pass through the bottom of the open grid plate. The soldering area on the integrated circuit connection board is recessed downwards. When passing through the open grid plate, the open grid plate will overlap with the grid on the integrated circuit connection board to prevent the solder paste from spreading laterally. At the same time, when the integrated circuit connection board passes through the open grid plate, the soldering port will apply solder paste to the integrated circuit connection board. The elastic scraper will press the solder paste into the groove reserved in the integrated circuit connection board, so that the groove reserved in the integrated circuit connection board has compacted solder paste. When the chip is installed and heated, the solder paste will melt and fix the pins of the circuit connection board, avoiding the solder paste from connecting with the solder joints of other chip modules during the soldering process due to the small chip installation spacing and small chip size, which would lead to inaccurate soldering.

[0027] Preferably, the sliding component includes a slot formed on the inner wall of the second housing. The inner wall of the second housing has a first groove and a second groove. Utilizing the movement characteristics of the second rapid displacement device, after the integrated circuit connection board fixed above the second rapid displacement device is installed and processed, the second rapid displacement device will drive the integrated circuit connection board to move towards the slot. When the lifting slide rod passes the second housing, the lifting slide rod will abut against the bottom of the Y-shaped block, causing the Y-shaped block to move upward. At the same time, it will shift in the direction of movement so that the Y-shape of the Y-shaped block is engaged in the slot. This causes the sliding component fixed on the outer wall of the second housing to slide upward along the outer wall of the second housing, thereby preventing the soldering component from colliding with the processed integrated circuit connection board when the second rapid displacement device moves outward, which would cause the chip on the integrated circuit connection board that is attached to the solder paste to shift.

[0028] The present application has the following advantages:

[0029] (1) The present application is aimed at the problem of inaccurate chip positioning welding. The welding position of the integrated circuit connecting plate is recessed downward. When the opening grid plate is passed, the opening grid plate will coincide with the grid on the integrated circuit connecting plate, preventing the horizontal connection of the solder paste. At the same time, when the integrated circuit connecting plate passes through the opening grid plate, the soldering opening will smear the solder paste onto the integrated circuit connecting plate. The solder paste is pressed into the reserved groove of the integrated circuit connecting plate by the elastic scraper, so that the reserved groove of the integrated circuit connecting plate has compacted solder paste. When the chip installation is completed and heated, the solder paste will melt and fix the pin of the circuit connecting plate, avoiding the connection of the solder paste with other chip welding points during the melting and welding of the solder paste due to the small chip installation spacing and small chip, resulting in inaccurate welding positioning.

[0030] (2) The present application utilizes the characteristics of the above-mentioned elastic scraper. When the integrated circuit connecting plate passes through the opening grid plate, the soldering opening will smear the solder paste in the grid of the integrated circuit connecting plate. The particularity of the elastic scraper is that when the grid of the integrated circuit connecting plate is compacted and smeared, the elastic scraper will sink into a part of the grid of the integrated circuit connecting plate, so that the solder paste is compacted. At the same time, when the elastic scraper exits the grid of the integrated circuit connecting plate, the friction between the elastic scraper and the edge of the grid of the integrated circuit connecting plate will interrupt the smearing of the solder paste, so that when it enters the next grid of the integrated circuit connecting plate, due to the low adhesion of the solder paste, the elastic scraper will scrape it off, avoiding the presence of excess solder paste between the grids, preventing the phenomenon of welding adhesion after the solder paste fusion.

[0031] (3) The present application utilizes the characteristics of the opening grid plate. When the soldering on the integrated circuit connecting plate is completed, a small amount of solder paste will overflow and be scraped off by the elastic scraper to the recovery port through the grid of the opening grid plate. The output of the soldering opening is adjusted by observing the amount of solder paste recovered through the recovery port, avoiding the use of an appropriate amount of solder paste when different integrated circuit connecting plates require different amounts of solder paste, resulting in excess solder paste and thus wasting resources, reducing production power consumption.

[0032] (4) The present application utilizes the characteristics of the second fast displacement device. After the integrated circuit connecting plate fixed above the second fast displacement device is installed and processed, the second fast displacement device will move the integrated circuit connecting plate towards the opening slot. When the lifting slide rod passes through the second shell, the lifting slide rod will abut against the bottom of the Y-shaped clamping block, causing the Y-shaped clamping block to move upwards and offset in the moving direction, so that the Y-shaped clamping block enters the clamping slot, driving the sliding assembly fixed on the outer wall of the second shell to slide upwards along the outer wall of the second shell. Thus, the soldering assembly is prevented from colliding with the processed integrated circuit connecting plate when the second fast displacement device moves outward, causing the chip on the integrated circuit connecting plate to shift. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed for the description of the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0034] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0035] Figure 2 It is a schematic diagram of the overall structure of the present application;

[0036] Figure 3 It is a schematic diagram of the overall structure of the present application;

[0037] Figure 4 It is a schematic diagram of the internal structure of the present application;

[0038] Figure 5 It is an enlarged schematic diagram of A in the present application; Figure 4

[0039] Figure 6 It is a schematic diagram of the rapid displacement device of the present application;

[0040] Figure 7 It is a schematic diagram of the tin plating assembly of the present application;

[0041] Figure 8 It is an enlarged schematic diagram of B in the present application; Figure 7

[0042] Figure 9 It is a schematic diagram of the tin plating assembly component of the present application;

[0043] Figure 10 It is a schematic diagram of the sliding assembly of the present application;

[0044] Figure 11 It is an enlarged schematic diagram of C in the present application. Figure 10

[0045] In the drawings, the component list represented by each reference sign is as follows:

[0046] ​​​In the figure: 1, the main body mechanism; 11, external components; 12, suction components; 111, the chassis; 112, the shell; 113, the placement box; 114, the transparent acrylic plate; 121, the moving motor; 122, the mechanical arm; 123, the suction nozzle; 124, the air pipe; 2, the following mechanism; 21, the feeding assembly; 22, the following assembly; 211, the fast displacementer one; 212, the platform one; 213, the chip tray; 221, the toothed slide rail; 222, the fast displacementer two; 223, the platform two; 224, the integrated circuit connecting plate; 225, the lifting slide rod; 226, the recycling port; 3, the tin plating mechanism; 31, the tin plating assembly; 32, the sliding assembly; 311, the shell two; 312, the open grid plate; 313, the connecting rod; 314, the elastic scraper; 315, the tin plating port; 321, the spring; 322, the Y-shaped clamping block; 323, the clamping groove; 324, the groove one; 325, the groove two; 115, the opening slot. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0048] Embodiment one, please refer to Figures 1-10 The present application is a BGA packaging structure, comprising a chassis, characterized in that it further comprises:

[0049] The main body mechanism 1 is fixedly connected to the top of the chassis 111, and is used to provide a mounting space for the basic equipment;

[0050] The following mechanism 2 is fixedly connected to the inner wall of the main body mechanism 1, and is used to complete the main work of BGA packaging;

[0051] The tin plating mechanism 3 is fixedly connected to the inner wall of the main body mechanism 1, and is used to provide accurate coverage for packaging welding;

[0052] The shell 112 is fixedly connected to the top of the chassis 111, the shell two 311 is slidingly connected to the inner wall of the shell 112, the connecting rod 313 is fixedly connected to the outer wall of the open grid plate 312, and the open grid plate 312 is fixedly connected to the outer wall of the shell two 311.

[0053] The main body mechanism 1 comprises:

[0054] The external components 11 are fixedly connected to the inner wall of the main body mechanism 1 through the outer wall part, and the external components 11 provide a basic dustproof shell and a mounting space for the equipment;

[0055] The outer wall piece includes a placing box 113 fixedly connected to the outer wall of the shell 112.

[0056] The suction assembly 12 is fixedly connected to the outer wall of the external assembly 11, and the suction assembly 12 provides a basic structure for chip taking and installation of the device.

[0057] The following mechanism 2 includes:

[0058] The feeding assembly 21 is fixedly connected to the inner wall of the external assembly 11, and the external assembly 11 provides a basic supply of materials;

[0059] The following assembly 22 is fixedly connected to the inner wall of the external assembly 11 through a following piece, and the following assembly 22 cooperates with the feeding assembly 21 to form a basic packaging process of the chip;

[0060] The following piece includes a quick displacer one 211 fixedly connected to the inner wall of the shell 112.

[0061] The tin feeding mechanism 3 includes:

[0062] The tin feeding assembly 31 is fixedly connected to the inner wall of the external assembly 11 through a tin feeding piece, and the tin feeding assembly 31 accurately provides tin paste with a suitable thickness;

[0063] The tin feeding piece includes a shell two 311 slidingly connected to the inner wall of the shell 112;

[0064] The sliding assembly 32 is fixedly connected to the outer wall of the tin feeding assembly 31 through a sliding piece, and the sliding assembly 32 forms a passage through which the installed packaging workpiece can pass through sliding;

[0065] The tin feeding piece includes a spring 321 fixedly connected to the inner wall of the shell two 311, and the spring 321 has a Y-shaped clamping block 322 fixedly connected to the end away from the shell two 311.

[0066] The external assembly 11 includes a transparent acrylic plate 114 fixedly connected to the outer wall of the shell 112, and the outer wall of the shell 112 is provided with an open groove 115.

[0067] The suction assembly 12 includes a motion motor 121 fixedly connected to the inner wall of the shell 112, the output shaft of the motion motor 121 is fixedly connected with a mechanical arm 122, the end away from the shell 112 of the shell 112 is fixedly connected with a suction nozzle 123, and the outer wall of the suction nozzle 123 is fixedly connected with an air pipe 124.

[0068] The loading assembly 21 comprises a platform 212 fixedly connected to a moving shaft of a fast displacement device 211, and the outer wall of the platform 212 is fixedly connected with a chip tray 213. When the tin on the integrated circuit connecting plate 224 is completed, a small amount of tin paste is overflowed and scraped off by the elastic scraper 314 to the recovery port 226 through the cooperation of the grid of the open grid plate 312 and the elastic scraper 314 for compaction of the tin paste. The excess tin paste is recovered through the recovery port 226, and the output of the tin inlet 315 is adjusted by observing the amount of tin paste recovered through the recovery port 226, so that when different integrated circuit connecting plates 224 require different amounts of tin paste, the appropriate amount of tin paste can be accurately used, the tin paste is not excessive, resources are not wasted, and the production power consumption is reduced.

[0069] In example two, please refer to Figures 4-11 On the basis of example one, the follow-up assembly 22 comprises a toothed slide rail 221 fixedly connected to the inner wall of the shell 112, the outer wall of the toothed slide rail 221 is slidingly connected with a fast displacement device 222, the moving shaft of the fast displacement device 222 is fixedly connected with a platform 223, the outer wall of the platform 223 is fixedly connected with an integrated circuit connecting plate 224, the outer wall of the platform 223 is fixedly connected with a lifting slide rod 225, and the outer wall of the platform 223 is fixedly connected with a recovery port 226. When the integrated circuit connecting plate 224 passes through the open grid plate 312, the tin paste is applied to the grid of the integrated circuit connecting plate 224 through the tin inlet 315. The special property of the elastic scraper 314 is that when the elastic scraper 314 is pressed into a part of the grid of the integrated circuit connecting plate 224 for compaction and application, the tin paste is compacted. When the elastic scraper 314 exits the grid of the integrated circuit connecting plate 224, the friction between the elastic scraper 314 and the edge of the grid of the integrated circuit connecting plate 224 can block the application of the tin paste, so that when the elastic scraper 314 enters the next grid of the integrated circuit connecting plate 224, the tin paste is scraped off due to the low adhesion of the tin paste, so that excess tin paste is prevented from appearing between the grids, and the phenomenon of welding adhesion after the tin paste is fused is prevented.

[0070] The upper tin assembly 31 comprises a plurality of elastic scrapers 314 fixedly connected to the outer wall of the connecting rod 313, the outer wall of the elastic scraper 314 is connected to the inner wall of the open grid plate 312, the outer wall of the open grid plate 312 is fixedly connected with the upper tin opening 315, the outer wall of the upper tin opening 315 is connected to the inner wall of the open grid plate 312, when the rapid displacement device two 222 drives the platform two 223 to move towards the inside of the equipment, the integrated circuit connecting plate 224 fixedly connected to the platform two 223 will pass through the bottom of the open grid plate 312, the place to be welded on the integrated circuit connecting plate 224 is recessed downward, when passing through the open grid plate 312, the open grid plate 312 will coincide with the grid on the integrated circuit connecting plate 224, preventing the tin paste from being horizontally connected, at the same time, when the integrated circuit connecting plate 224 passes through the open grid plate 312, the upper tin opening 315 will smear the tin paste on the integrated circuit connecting plate 224, the elastic scraper 314 will press the tin paste in the reserved groove of the integrated circuit connecting plate 224, so that the reserved groove of the integrated circuit connecting plate 224 has compacted tin paste, when the chip is installed and heated, the tin paste will melt and fix the pin of the circuit connecting plate 224, avoiding the small installation distance of the chip, the small chip leading to the connection between the tin paste melting welding and other chip module welding points, resulting in inaccurate welding.

[0071] The sliding assembly 32 comprises a clamping groove 323 opened in the inner wall of the second shell 311, the inner wall of the second shell 311 is provided with a groove one 324, the inner wall of the second shell 311 is provided with a groove two 325, by the characteristics of the rapid displacement device two 222, when the integrated circuit connecting plate 224 fixedly connected to the top of the rapid displacement device two 222 is installed and processed, the rapid displacement device two 222 will drive the integrated circuit connecting plate 224 to move towards the open slot 115, when the lifting slide rod 225 passes through the second shell 311, the lifting slide rod 225 will abut against the bottom of the Y-shaped clamping block 322, so that the Y-shaped clamping block 322 moves upward, at the same time, it will be offset to the moving direction, so that the Y-shaped clamping block 322 is clamped into the clamping groove 323, driving the sliding assembly 32 fixedly connected to the outer wall of the second shell 311 to slide upward along the outer wall of the second shell 311, so as to avoid the collision between the upper tin assembly 31 and the integrated circuit connecting plate 224 after processing, which causes the chip on the integrated circuit connecting plate 224 to deviate from the tin paste.

[0072] One specific application of the embodiment is: before use, connect the trachea 124 to the corresponding interface of the upper tin mouth 315, ensure that the working state is normal, turn on the power to make the moving motor 121 in working state, the moving motor 121 drives the mechanical arm 122 to work, the mechanical arm 122 swings back and forth to make the fixed suction nozzle 123 cooperate with the pickup chip to install, at the same time, since the mechanical arm 122 is in a mechanical swing state and cannot adjust the pickup position of the suction nozzle 123, the fast displacer one 211 and the fast displacer two 222 control the platform one 212 and the platform two 223 to adjust the position, cooperate with the pickup installation of the above components, the fast displacer two 222 will realize displacement along the toothed rail 221, when the fast displacer two 222 is displaced to the open slot 115, the platform two 223 will coincide with the open slot 115 to form a complete platform surface, which is convenient for personnel operation, when the fast displacer two 222 drives the platform two 223 to move towards the inside of the equipment, the integrated circuit connection plate 224 fixed on the platform two 223 will pass through the bottom of the open grid plate 312, the place to be welded on the integrated circuit connection plate 224 is recessed downward, when passing through the open grid plate 312, the open grid plate 312 will coincide with the grid on the integrated circuit connection plate 224, preventing the tin paste from being horizontally connected, at the same time, when the integrated circuit connection plate 224 passes through the open grid plate 312, the upper tin mouth 315 will smear the tin paste on the integrated circuit connection plate 224, the tin paste will be pressed in the reserved groove of the integrated circuit connection plate 224 by the elastic scraper 314, so that the reserved groove of the integrated circuit connection plate 224 has compacted tin paste, when the chip installation is completed and heated, the tin paste will melt and fix the pin of the circuit connection plate 224, avoiding the situation that due to small chip installation distance and small chip, the tin paste is connected with other chip module welding points during tin paste melting and welding, resulting in inaccurate welding.

[0073] By using the characteristics of the elastic scraper 314, when the integrated circuit connection plate 224 passes through the open grid plate 312, the upper tin mouth 315 will smear the tin paste in the grid of the integrated circuit connection plate 224, and the particularity of the elastic scraper 314 is that when it compacts and smears the grid on the integrated circuit connection plate 224, the elastic scraper 314 will sink into part of the grid on the integrated circuit connection plate 224, so that the tin paste is compacted, at the same time, when the elastic scraper 314 exits the grid on the integrated circuit connection plate 224, due to the friction between the elastic scraper 314 and the edge of the grid on the integrated circuit connection plate 224, the tin paste is blocked from smearing, so that when it enters the next grid on the integrated circuit connection plate 224, due to the low adhesion of the tin paste, the elastic scraper 314 scrapes it, avoiding excess tin paste between the grids, preventing the phenomenon of welding adhesion after tin paste fusion.

[0074] The characteristic of the fast displace device two 222 is used, when the integrated circuit connecting plate 224 fixed above the fast displace device two 222 is installed and processed, the fast displace device two 222 will drive the integrated circuit connecting plate 224 to move to the opening slot 115, when the lifting slide bar 225 passes the shell two 311, the lifting slide bar 225 will stop at the bottom of the Y-shaped clamping block 322, the Y-shaped clamping block 322 will move upward, and will be offset to the moving direction, so that the Y-shaped clamping block 322 is clamped into the clamping slot 323, the slide assembly 32 fixed on the outer wall of the shell two 311 is driven to slide upward along the outer wall of the shell two 311, so that the upper tin assembly 31 does not collide with the integrated circuit connecting plate 224 when the fast displace device two 222 moves outward, and the chip on the integrated circuit connecting plate 224 is not offset.

[0075] The characteristic of the opening grid plate 312 is used, when the tin on the integrated circuit connecting plate 224 is completed, the grid of the opening grid plate 312 is matched with the elastic scraper 314 to compact the tin paste, and a small amount of tin paste will overflow and be scraped off by the elastic scraper 314 to the recovery port 226, the excess tin paste is recovered through the recovery port 226, and the output of the tin port 315 is adjusted by observing the amount of tin paste recovered through the recovery port 226, so that the appropriate amount of tin paste can be accurately used when different integrated circuit connecting plates 224 need different amounts of tin paste, the tin paste is not wasted, and the production power consumption is reduced.

[0076] The preferred embodiments of the application disclosed above are only used to help explain the application. The preferred embodiments do not describe all the details, and the application is not limited to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The embodiments are selected and described in the specification, in order to better explain the principles and practical applications of the application, so that the persons skilled in the art can well understand and use the application. The application is limited by the claims and the entire scope and equivalents thereof.

Claims

1. A BGA package structure, comprising a chassis, characterized in that, Also includes: The main structure (1) is fixedly connected to the top of the base frame (111) to provide installation space for the basic equipment; Follower mechanism (2), which is fixedly connected to the inner wall of the main body mechanism (1) and is used to complete the main work of BGA packaging; Tinning mechanism (3), which is fixedly connected to the inner wall of the main body mechanism (1) to provide precise coverage for encapsulation soldering; The base frame (111) is fixedly connected to the top of the outer shell (112), the inner wall of the outer shell (112) is slidably connected to the second outer shell (311), the outer wall of the second outer shell (311) is fixedly connected to the outer wall of the second outer shell (311), and the outer wall of the open grid plate (312) is fixedly connected to the outer wall of the open grid plate (312). The following mechanism (2) includes a following component (22), which includes a toothed slide rail (221) fixedly connected to the inner wall of the outer shell (112). A rapid displacement device (222) is slidably connected to the outer wall of the toothed slide rail (221). The motion axis of the rapid displacement device (222) is fixedly connected to a platform (223). An integrated circuit connection board (224) is fixedly connected to the outer wall of the platform (223). The tinning mechanism (3) includes: Soldering component (31), which is fixedly connected to the inner wall of the outer component (11) by a soldering part, and the soldering component (31) precisely provides solder paste of appropriate thickness; The tinning assembly (31) includes a plurality of elastic scrapers (314) fixedly connected to the outer wall of the connecting rod (313). The outer wall of the elastic scraper (314) is fitted and connected to the inner wall of the open grid plate (312). The outer wall of the open grid plate (312) is fixedly connected to a tinning port (315). The outer wall of the tinning port (315) is fitted and connected to the inner wall of the open grid plate (312). When the integrated circuit interconnect board (224) passes through the open grid board (312), the solder port (315) will apply solder paste to the grid of the integrated circuit interconnect board (224). Due to the special nature of the elastic scraper (314), when the solder paste is compacted on the grid of the integrated circuit interconnect board (224), the elastic scraper (314) will sink into part of the grid of the integrated circuit interconnect board (224), thus compacting the solder paste. The solder joints on the integrated circuit connection board (224) are recessed downwards. When the board passes through the open grid plate (312), the open grid plate (312) will overlap with the grid on the integrated circuit connection board (224) to prevent the solder paste from being connected horizontally. At the same time, when the integrated circuit connection board (224) passes through the open grid plate (312), the solder port (315) will apply the solder paste to the integrated circuit connection board (224). The elastic scraper (314) will press the solder paste into the groove reserved on the integrated circuit connection board (224) so ​​that the groove reserved on the integrated circuit connection board (224) has compacted solder paste.

2. The BGA packaging structure according to claim 1, characterized in that: The main body (1) includes: External component (11) is fixedly connected to the inner wall of the main body (1) by an outer wall component. The external component (11) provides the equipment with a basic dustproof shell and installation space. The outer wall component includes a placement box (113) fixedly connected to the outer wall of the outer shell (112); The suction component (12) is fixedly connected to the outer wall of the outer component (11) and provides the basic structure for chip picking and installation of the device.

3. The BGA packaging structure according to claim 2, characterized in that: The following mechanism (2) also includes: Feeding assembly (21) is fixedly connected to the inner wall of the outer assembly (11), which provides the basic supply of materials; The following component (22) is fixedly connected to the inner wall of the outer component (11) through a follower. The following component (22) works with the feeding component (21) to form the basic chip packaging process. The follower includes a rapid displacement device (211) fixedly connected to the inner wall of the housing (112).

4. The BGA packaging structure according to claim 3, characterized in that: The tinning mechanism (3) also includes: The sliding component (32) is fixedly connected to the outer wall of the tin-on component (31) by a sliding member. The sliding component (32) forms a channel through which the installed packaged workpiece can pass. The tin-on component includes a spring (321) fixedly connected to the inner wall of the outer casing (311), and a Y-shaped locking block (322) is fixedly connected to one end of the spring (321) away from the outer casing (311); The tin-on component includes a second outer shell (311) that is slidably connected to the inner wall of the outer shell (112).

5. A BGA packaging structure according to claim 4, characterized in that: The external component (11) includes a transparent acrylic plate (114) fixedly connected to the outer wall of the housing (112), and the outer wall of the housing (112) has an opening groove (115).

6. A BGA packaging structure according to claim 5, characterized in that: The suction assembly (12) includes a motion motor (121) fixedly connected to the inner wall of the housing (112), the output shaft of the motion motor (121) is fixedly connected to a robotic arm (122), a suction nozzle (123) is fixedly connected to one end of the housing (112) away from the housing (112), and an air tube (124) is fixedly connected to the outer wall of the suction nozzle (123).

7. A BGA packaging structure according to claim 6, characterized in that: The feeding assembly (21) includes a platform (212) fixedly connected to the motion axis of the rapid displacement device (211), and a chip tray (213) is fixedly connected to the outer wall of the platform (212).

8. A BGA packaging structure according to claim 7, characterized in that: The outer wall of the second platform (223) is fixedly connected to a lifting slide bar (225), and the outer wall of the second platform (223) is fixedly connected to a retraction port (226).

9. A BGA packaging structure according to claim 8, characterized in that: The sliding component (32) includes a slot (323) formed on the inner wall of the outer shell (311), and the inner wall of the outer shell (311) is provided with a groove (324) and a groove (325).

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