A semiconductor wire cutting and feeding linkage type wire cutting and forming apparatus

Abstract

The application discloses a semiconductor lead cutting and forming equipment with linkage of lead cutting and feeding, which comprises a machine body, an up-and-down openable lead cutting and forming die arranged on the machine body, and a feeding mechanism arranged on the machine body and used for feeding the lead cutting and forming die, wherein the feeding mechanism comprises a feeding plate used for placing a semiconductor lead frame conveyed from a previous process, a pushing assembly linked with an upper die plate of the lead cutting and forming die and used for moving a pushing end of the pushing assembly to a far end of the feeding plate away from the upper die plate when the upper die plate moves downward to close the die, and moving the pushing end to a near end of the feeding plate close to the upper die plate when the upper die plate moves upward to open the die, and an avoiding assembly used for lifting the pushing end to avoid the semiconductor lead frame on the feeding plate during movement of the pushing end to the far end of the feeding plate. The pushing assembly and the avoiding assembly of the application are completely mechanical structures and are linked with the upper die plate, so that a driving device and program control are not needed, and the volume and cost are relatively small.

Description

TECHNICAL FIELD

[0001] The present application relates to a lead cutting forming device, more particularly to a lead cutting forming device for semiconductor with lead cutting and feeding linkage. BACKGROUND

[0002] The semiconductor chip packaging product is in the form of a lead frame before lead cutting, and each semiconductor chip packaging product is arranged on a respective lead frame in an array. The structure of the semiconductor chip packaging product comprises a base island and leads arranged on both sides of the base island, and the adjacent leads are connected by connecting leads. The semiconductor lead cutting forming device is used for cutting the connecting leads on the product, so as to separate the semiconductor chip packaging product from the lead frame and simultaneously bend and form the leads.

[0003] The existing semiconductor lead cutting forming device mainly comprises a machine body, a feeding mechanism arranged on the machine body, and a lead cutting and bending mechanism. The lead cutting and bending mechanism mainly comprises a lead cutting and bending die and a driving assembly, and the opening and closing of the lead cutting and bending die is controlled by the driving assembly. The semiconductor lead frame is sequentially subjected to lead cutting and bending. The feeding mechanism is used for feeding the conveyed semiconductor lead frame into the lead cutting and bending die. The existing feeding mechanism is composed of an X-axis cylinder, a Z-axis cylinder and a clamping assembly. The clamping assembly is driven by the Z-axis cylinder to move to the semiconductor lead frame to clamp the semiconductor lead frame, and then the X-axis cylinder drives the clamping assembly to feed the semiconductor lead frame into the lead cutting and bending die. This mechanism needs to use two cylinders to complete the control of the entire clamping and feeding, and the program control is more troublesome, occupies a large space and has a high cost. SUMMARY

[0004] In view of the above-mentioned deficiencies of the prior art, the present application provides a semiconductor lead cutting forming device with lead cutting and feeding linkage, which does not need program control and has smaller volume and cost.

[0005] The above technical purpose of the present application is achieved by the following technical scheme:

[0006] A semiconductor lead cutting forming device with lead cutting and feeding linkage comprises a machine body, an up-and-down openable lead cutting forming die arranged on the machine body, and a feeding mechanism arranged on the machine body for feeding the lead cutting forming die, wherein the feeding mechanism comprises:

[0007] A feeding plate for placing the semiconductor lead frame conveyed from the previous process;

[0008] A pushing assembly arranged on the feeding plate and linked with the upper die plate of the lead cutting forming die, for moving the pushing end of the pushing assembly to the far end of the feeding plate away from the upper die plate when the upper die plate moves downward to close the die, and moving the pushing end of the pushing assembly to the near end of the feeding plate close to the upper die plate when the upper die plate moves upward to open the die;

[0009] An obstacle avoidance component, mounted on the feed plate, is used to lift the pushing end of the pusher component to avoid the semiconductor lead frame on the feed plate as the pushing end moves toward the far end of the feed plate, and to lower the pushing end back to the side of the semiconductor lead frame as the pushing end moves toward the far end and toward the near end of the feed plate.

[0010] Furthermore, the feed plate includes a base plate and two limiting strips. The two limiting strips are fixedly connected to the left and right sides of the top surface of the base plate, respectively. The opposite sides of the two limiting strips are spaced apart and parallel to each other.

[0011] Furthermore, the pushing assembly includes a first rack, a second rack, a reduction gear set, and a push rod. The first rack is slidably connected to one side of the feed plate, allowing it to move away from or near the upper template. The second rack is fixedly connected to the upper template. The reduction gear set is disposed on the feed plate and is used to connect the first rack and the second rack, so that the moving speed of the first rack is greater than that of the second rack. The push rod is hinged to the first rack, allowing it to rotate perpendicular to the moving direction of the first rack, and serves as the pushing end of the pushing assembly.

[0012] Furthermore, the pushing assembly also includes a push plate and a spring. The push plate is movable parallel to the moving direction of the first rack and passes through the end of the push rod, with the push plate facing the upper template. The two ends of the spring abut against the upper template and the push plate, respectively.

[0013] Furthermore, the avoidance assembly includes a fixed rod and an avoidance plate. One end of the fixed rod is fixedly connected to the other side of the feed plate opposite to the first rack, and the other end of the fixed rod extends to one side of the feed plate where the first rack is located and remains suspended. The avoidance plate is hinged to the suspended end of the fixed rod. During the movement of the push rod toward the far end of the feed plate, the avoidance plate causes the push rod to slide over the top surface of the avoidance plate and be lifted. After the push rod moves to the far end of the feed plate, it disengages from the avoidance plate and falls back. When the push rod moves toward the near end of the feed plate, it slides under the avoidance plate and simultaneously pushes the avoidance plate upward.

[0014] Furthermore, the feed plate has a recessed position near the upper template, and the near end of the clearance plate falls into the recessed position by its own weight, and the top surface of the near end of the clearance plate is lower than the top edge of the recessed position.

[0015] Furthermore, the clearance plate is composed of a near plate close to the upper template and a far plate away from the upper template. The connection between the fixing rod and the clearance plate is located between the near plate and the far plate. The top of the near plate and the far plate are provided with inclined surfaces that slope downward from the connection between the fixing rod and the clearance plate to their respective ends. When the pushing rod is not in contact with the clearance plate, the lower swing of the near plate remains against the feed plate while the far plate remains raised.

[0016] Furthermore, when the push rod slides to the end near the far plate, the push rod presses against the far plate, causing the far plate to swing down and the near plate to lift up.

[0017] Furthermore, as the push rod moves toward the near end of the feed plate, the bottom surface of the near plate presses against the top surface of the push rod.

[0018] In summary, the present invention offers the following advantages: By incorporating a pushing component that is linked to the upper template, the pushing end of the pushing component can move away from and towards the upper template to push the semiconductor lead frame on the feed plate into the bead forming mold. Simultaneously, a clearance component is provided to avoid the semiconductor lead frame on the feed plate as the pushing end of the pushing component moves towards the far end of the feed plate, preventing reverse pushing and scratching of the semiconductor lead frame. The pushing component and clearance component of the present invention are entirely mechanical structures linked to the upper template, eliminating the need for separate drive devices and program control, resulting in smaller size and lower cost. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 yes Figure 1 An enlarged view of point A;

[0021] Figure 3 This is a schematic diagram of the rib cutting forming mold and feeding mechanism of the present invention, and a partially enlarged structural diagram;

[0022] Figure 4 This is a front view structural diagram of the feeding mechanism of the present invention in one state;

[0023] Figure 5 This is a front view structural diagram of another state of the feeding mechanism of the present invention.

[0024] Figure label:

[0025] Machine body 1; Beam forming mold 2; Upper template 21; Feeding mechanism 3; Feeding plate 31; Base plate 311; Limiting strip 312; Pushing assembly 32; First rack 321; Second rack 322; Reduction gear set 323; Push rod 324; Push plate 325; Spring 326; Avoidance assembly 33; Fixing rod 331; Avoidance plate 332; Near plate 3321; Far plate 3322. Detailed Implementation

[0026] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to that other component.

[0028] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] Reference Figures 1 to 5 A semiconductor lead cutting and forming equipment with linked lead cutting and feeding includes a machine body 1, a lead cutting and forming mold 2 that can be opened and closed vertically on the machine body 1, and a feeding mechanism 3 on the machine body 1 for feeding material to the lead cutting and forming mold 2. The lead cutting and forming mold 2 is driven by a drive device of the machine body 1. During the mold opening and closing process, it cuts the connecting ribs of the semiconductor lead frame, separating the semiconductor chip package product from the lead frame. Simultaneously, it bends the leads of the cut semiconductor chip package product to form its shape.

[0031] like Figures 2 to 5 The feeding mechanism 3 includes:

[0032] The feed plate 31 is used to place the semiconductor lead frame conveyed from the previous process. In actual use, the feeding mechanism places the semiconductor lead frame one by one on the conveyor belt 4, and the conveyor belt 4 conveys the semiconductor lead frame to the feed plate 31.

[0033] The pusher assembly 32 is disposed on the feed plate 31 and linked with the upper template 21 of the rib forming mold 2. When the upper template 21 moves downward to close the mold, its pushing end moves to the far end of the feed plate 31 away from the upper template 21, and when the upper template 21 moves upward to open the mold, its pushing end moves to the near end of the feed plate 31 close to the upper template 21.

[0034] The avoidance component 33 is disposed on the feed plate 31 and is used to lift the push end of the push component 32 to avoid the semiconductor lead frame on the feed plate 31 during the process of the push end moving to the far end of the feed plate 31. During the process of the push end moving to the far end of the feed plate 31 and moving to the near end, the push end falls back and remains facing the side of the semiconductor lead frame.

[0035] In one embodiment, such as Figure 2 and Figure 3 As shown, the feed plate 31 includes a base plate 311 and two limiting strips 312. The two limiting strips 312 are fixedly connected to the left and right sides of the top surface of the base plate 311, respectively. The opposite sides of the two limiting strips 312 are spaced apart and parallel to each other. The spacing between the two limiting strips 312 is adapted to the width of the semiconductor lead frame, allowing the semiconductor lead frame to pass through and limiting its movement in the width direction.

[0036] In one embodiment, reference is made to Figures 2 to 5 The feeding assembly 32 includes a first rack 321, a second rack 322, a reduction gear set 323, a push rod 324, a push plate 325, and a spring 326. The first rack 321 is slidably connected to one side of the feed plate 31, allowing it to move away from or near the upper template 21. The second rack 322 is fixedly connected to the upper template 21. The push rod 324 is hinged to the first rack 321, allowing it to rotate perpendicular to the direction of movement of the first rack 321. This push rod 324 serves as the pushing end of the feeding assembly 32, used to push the semiconductor lead frame. The reduction gear set 323 is located on the feed plate 31 and connects the first rack 321 and the second rack 322. Since the moving distance of the upper template 21 is shorter than the distance the push rod 324 pushes the semiconductor lead frame into the bead-cutting mold 2, the reduction gear set 323 is provided so that the moving speed of the first rack 321 is greater than that of the second rack 322, thereby allowing the push rod 324 to achieve the required moving distance.

[0037] The existing lead-cutting mold 2 is equipped with a controllable and retractable positioning post. After the mold is opened, the cut semiconductor lead frame is carried away by the unloading mechanism. Subsequently, the positioning post extends from the lower template, and the semiconductor lead frame moves to abut against the positioning post, thus successfully positioning the semiconductor lead frame. To ensure that the semiconductor lead frame is fully pushed to the positioning position, the push plate 325 is inserted through the end of the push rod 324, allowing the push plate 325 to move parallel to the moving direction of the first rack 321, with the push plate 325 facing the upper template 21. The two ends of the spring 326 abut against the upper template 21 and the push plate 325, respectively. After the push plate 325 pushes the semiconductor lead frame against the positioning post, the push rod continues to move forward a short distance. At this time, the spring 326 is compressed and contracts, applying a certain pressure through the push plate 325 to the semiconductor lead frame, making it tightly adhere to the positioning post, thus completing the positioning.

[0038] In one embodiment, reference is made to Figures 2 to 5 The avoidance assembly 33 includes a fixed rod 331 and an avoidance plate 332. One end of the fixed rod 331 is fixedly connected to the other side of the feed plate 31 opposite to the first rack 321, and the other end of the fixed rod 331 extends to one side of the feed plate 31 where the first rack 321 is located and this end remains suspended. The avoidance plate 332 is hinged to the suspended end of the fixed rod 331. During the movement of the push rod 324 toward the far end of the feed plate 31, the avoidance plate 332 causes the push rod 324 to slide over the top surface of the avoidance plate 332 and be lifted. After the push rod 324 moves to the far end of the feed plate 31, it disengages from the avoidance plate 332 and falls back. When the push rod 324 moves toward the near end of the feed plate 31, it slides under the avoidance plate 332 and pushes the avoidance plate 332 upward.

[0039] To ensure that the push rod 324 can avoid the top surface of the moving plate 332 when it moves towards the far end of the feed plate 31, a recess is provided on the feed plate 31 near the upper template 21, such as... Figure 2 and Figure 3 As shown, the clearance plate 332 falls into the recessed position by its own weight near the proximal end of the upper template 21, and the top surface of the proximal end of the clearance plate 332 is lower than the top edge of the recessed position. In this way, the push rod 324 moves towards the distal end of the feed plate 31 so that it contacts the top surface of the proximal end of the clearance plate 332, and then moves up to the top surface.

[0040] In one embodiment, reference is made to Figures 2 to 5 The clearance plate 332 is integrally formed by a near plate 3321 and a far plate 3322, wherein the near plate 3321 is close to the upper template 21, while the far plate 3322 is away from the upper template 21. The connection between the fixing rod 331 and the clearance plate 332 is located between the near plate 3321 and the far plate 3322. The tops of the near plate 3321 and the far plate 3322 are provided with inclined surfaces that slope downward from the connection between the fixing rod 331 and the clearance plate 332 towards their respective ends. The torque from the center of gravity of the near plate 3321 to the connection between the fixing rod 331 and the clearance plate 332 is greater than the torque from the center of gravity of the far plate 3322 to the connection between the fixing rod 331 and the clearance plate 332. When the push rod 324 is not in contact with the clearance plate 332, the near plate 3321 remains lowered against the feed plate 31, while the far plate 3322 remains raised.

[0041] like Figure 4As shown, when the push rod 324 slides to near the end of the far plate 3322, the push rod 324 presses against the far plate 3322, causing the far plate 3322 to swing down and the near plate 3321 to rise. That is, at this time, the force of the push rod 324 and the torque from the center of gravity of the far plate 3322 to the connection point of the fixed rod 331 and the clearance plate 332 is greater than the torque from the center of gravity of the near plate 3321 to the connection point of the fixed rod 331 and the clearance plate 332, causing the far plate 3322 to swing down and the near plate 3321 to rise. As the push rod 324 gradually slides towards the end of the far plate 3322, the far plate 3322 gradually swings down, causing the angle at which the push rod 324 is raised to gradually decrease, eventually detaching from the far plate 3322 relatively smoothly, preventing the push rod 324 from directly hitting the far plate 3322.

[0042] like Figure 5 As shown, since the near plate 3321 remains against the feed plate 31 under its own weight, the bottom surface of the near plate 3321 is set to be low in height. When the push rod 324 moves towards the near end of the feed plate 31, the bottom surface of the near plate 3321 presses against the top surface of the push rod 324, increasing the pressure of the push rod 324 and reducing the possibility that it may be lifted up due to vibration during the movement and disengage from the semiconductor lead frame, thus ensuring that the semiconductor lead frame is pushed into place smoothly.

[0043] The above embodiments are merely explanations of the present invention and are not intended to limit the present invention. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A semiconductor lead cutting and forming equipment with linked lead cutting and feeding, comprising a machine body, a lead cutting and forming mold that can be opened and closed vertically on the machine body, and a feeding mechanism on the machine body for feeding material to the lead cutting and forming mold, characterized in that, The feeding mechanism includes: The feed plate is used to hold the semiconductor lead frame that has been transported from the previous process. The pusher assembly is set on the feed plate and linked with the upper template of the rib forming mold. When the upper template moves downward to close the mold, its pushing end moves to the far end of the feed plate away from the upper template, and when the upper template moves upward to open the mold, its pushing end moves to the near end of the feed plate close to the upper template. An obstacle avoidance component, mounted on the feed plate, is used to lift the pushing end of the pusher component to avoid the semiconductor lead frame on the feed plate as the pushing end moves toward the far end of the feed plate, and to lower the pushing end and keep it facing the side of the semiconductor lead frame as the pushing end moves to the far end of the feed plate and toward the near end. The feeding assembly includes a first rack, a second rack, a reduction gear set, and a push rod. The first rack is slidably connected to one side of the feed plate and can move away from or near the upper template. The second rack is fixedly connected to the upper template. The reduction gear set is disposed on the feed plate and is used to connect the first rack and the second rack, so that the moving speed of the first rack is greater than that of the second rack. The push rod is hinged to the first rack and can rotate perpendicular to the moving direction of the first rack, serving as the pushing end of the feeding assembly. The avoidance assembly includes a fixed rod and an avoidance plate. One end of the fixed rod is fixedly connected to the other side of the feed plate opposite to the first rack, and the other end of the fixed rod extends to one side of the feed plate where the first rack is located and remains suspended. The avoidance plate is hinged to the suspended end of the fixed rod. During the movement of the push rod toward the far end of the feed plate, the avoidance plate causes the push rod to slide over the top surface of the avoidance plate and be lifted. After the push rod moves to the far end of the feed plate, it disengages from the avoidance plate and falls back. When the push rod moves toward the near end of the feed plate, it slides under the avoidance plate and simultaneously pushes the avoidance plate upward. The clearance plate is composed of a near plate close to the upper template and a far plate away from the upper template. The connection between the fixing rod and the clearance plate is located between the near plate and the far plate. The top of the near plate and the far plate are provided with inclined surfaces that slope downward from the connection between the fixing rod and the clearance plate to their respective ends. When the push rod is not in contact with the clearance plate, the lower edge of the near plate remains against the feed plate while the far plate remains raised. As the push rod gradually slides towards the end of the far plate, it presses against the far plate, causing the far plate to gradually swing down while the angle at which the push rod is lifted gradually decreases, eventually causing the push rod to smoothly detach from the far plate.

2. The semiconductor lead cutting and forming equipment with lead cutting and feeding linkage according to claim 1, characterized in that: The feed plate includes a base plate and two limiting strips. The two limiting strips are fixedly connected to the left and right sides of the top surface of the base plate, respectively. The opposite sides of the two limiting strips are spaced apart and parallel to each other.

3. The semiconductor lead cutting and forming equipment with lead cutting and feeding linkage according to claim 1, characterized in that: The pushing assembly also includes a push plate and a spring. The push plate is movable parallel to the moving direction of the first rack and passes through the end of the push rod, with the push plate facing the upper template. The two ends of the spring abut against the push rod and the push plate, respectively.

4. The semiconductor lead cutting and forming equipment with lead cutting and feeding linkage according to claim 1, characterized in that: The feed plate has a recessed position near the upper template. The near end of the clearance plate falls into the recessed position by its own weight, and the top surface of the near end of the clearance plate is lower than the top edge of the recessed position.

5. The semiconductor lead cutting and forming equipment with lead cutting and feeding linkage according to claim 1, characterized in that: As the push rod moves toward the near end of the feed plate, the bottom surface of the near plate presses against the top surface of the push rod.

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