An automobile headlamp chip welding tool based on a cooling channel structure

Abstract

The application relates to the chip welding technical field and discloses an automobile headlamp chip welding tool based on a cooling channel structure, which comprises a base, the top of the base is provided with a positioning part for assisting chip welding, and the top of the base is provided with a driving unit; wherein the positioning part comprises a bearing seat fixedly connected to the top of the base, a turnover frame is rotationally connected in the bearing seat, the bottom of the turnover frame is fixedly connected with a positioning frame matched with the outer side of the chip, when the turnover frame rotates to a position parallel to the circuit board, the turnover frame forms pressure bonding to the chip to prevent the chip from being deviated in the welding process. The automobile headlamp chip welding tool based on the cooling channel structure can effectively solve the problem that, in the prior art, when the hot air welding equipment heats the pins around the chip, the hot air flow generated by the hot air welding device easily causes the chip to be deviated in position, thereby causing welding errors.

Description

Technical Field

[0001] This invention relates to the field of chip welding technology, and more specifically to a welding fixture for automotive headlight chips based on a cooling channel structure. Background Technology

[0002] The core functional components of automotive headlights include LED light sources, driver chips, heat dissipation components, and optical components. These chips require soldering processes to achieve electrical connections and mechanical fixation to the circuit board, ensuring stable operation of the headlights. Given that most chips use multi-pin, densely packed side-mounted packages, reliable soldering and fixation of each pin is crucial during the soldering process. To ensure reliable chip soldering, the chip and circuit board are typically placed on suitable soldering fixtures, and hot air soldering equipment is used to solder the chip pins. This method achieves efficient and rapid soldering, significantly improving both soldering quality and efficiency.

[0003] The existing chip soldering process typically involves: positioning the circuit board in the soldering fixture, uniformly applying solder paste to the soldering area, aligning and attaching the chip to the target position, ensuring the lower ends of the chip leads are covered with solder paste, and finally using hot air soldering equipment to heat the surrounding leads of the chip. While this method can improve soldering efficiency to some extent, the hot airflow generated by the hot air soldering device during the heating process can easily cause the chip to shift position, leading to soldering errors and affecting the subsequent functional stability and reliability of automotive headlights. Summary of the Invention

[0004] To address the aforementioned shortcomings of existing technologies, this invention provides a welding fixture for automotive headlight chips based on a cooling channel structure. This fixture effectively solves the problem in existing technologies where the hot air flow generated by the hot air welding device can easily cause chip displacement when heating the peripheral pins of the chip, leading to welding errors.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This invention provides a welding fixture for automotive headlight chips based on a cooling channel structure, comprising:

[0007] The base has a limiting part for fixing the circuit board on its top, a positioning part for assisting chip soldering on its top, and a drive unit on its top.

[0008] The positioning part includes a bearing seat fixedly connected to the top of the base, and a flipping frame is rotatably connected inside the bearing seat. A positioning frame that fits against the outside of the chip is fixedly connected to the flipping frame on the side near the circuit board.

[0009] The driving unit is in transmission connection with the turnover frame, and is used for driving the turnover frame to rotate around the central axis of the bearing seat; when the turnover frame rotates to a position parallel to the circuit board, the turnover frame forms a press-fit to the chip to prevent the chip from being offset during welding.

[0010] Further, the positioning frame is in U-shaped design, and a side close to the circuit board is in inclined surface design; a side close to the chip is provided with a plurality of embedded rolling balls arranged in an array along the center of the positioning frame.

[0011] Further, the turnover frame is slidably connected with an abutting block abutting the outer side of the chip through a guide hole formed in the top of the turnover frame; the guide hole is provided with a plurality of holes arranged in an array along the center of the turnover frame; the abutting block is connected with the inner wall of the guide hole through a reset spring arranged on the outer side of the abutting block; a counterweight plate is fixedly connected to the side of the abutting block away from the positioning frame; and the side close to the chip of the positioning frame and the abutting block are both in rough surface design.

[0012] Further, the turnover frame is provided with two airflow channels arranged in a symmetrical manner along the center of the turnover frame; the bottom of the turnover frame is fixedly connected with air pipes in communication with the airflow channels; and a cooling unit is fixedly connected to the outer side of the turnover frame and is in communication with the airflow channels through a connecting pipe arranged on the outer side of the cooling unit.

[0013] Further, the top of the turnover frame is provided with a plurality of air holes arranged in an array along the center of the turnover frame; and the top end of the turnover frame is provided with two slot holes arranged in a symmetrical manner along the center of the turnover frame.

[0014] Further, the slot holes are slidably connected with a movable rod and a blocking rod through a slide rail arranged in the slot hole; and the movable rod and the blocking rod are sequentially arranged from the outside to the inside along the slot hole.

[0015] Further, the movable rod and the blocking rod are connected through a connecting rod; the top of the blocking rod is in inclined surface design; the bottom of the movable rod is in arc surface design; and the movable rod is connected with the outer side of the slide rail through an elastic member arranged in the movable rod.

[0016] Compared with the prior art, the technical scheme provided by the application has the following beneficial effects:

[0017] The application is provided with a positioning part, when the driving unit drives the turnover frame to be parallel to the circuit board, the positioning frame and the abutting block jointly compress the chip to form rigid constraint, the compression structure directly offsets the airflow impact force, ensures the accurate alignment of the chip and the circuit board pad, avoids the welding error caused by position deviation, and when the turnover frame rotates, the counterweight plate generates a downward sliding component force with the change of the inclination angle, drives the abutting block and the positioning frame to clamp the chip, when the inclination angle of the turnover frame reaches a critical value, the abutting block is attached to the sidewall of the chip, pushes the chip to the closed end of the positioning frame to form bidirectional limiting, avoids the chip from separating from the positioning frame due to centrifugal force in the turnover process, meanwhile, the positioning frame adopts a U-shaped structure design, the side close to the circuit board is provided with a guide slope to guide the chip to enter the positioning frame stably, and the inner wall of the positioning frame is embedded with a plurality of arrayed balls to convert the sliding friction between the chip and the positioning frame into rolling friction, effectively prevents the chip from being damaged due to jamming in the chip feeding process, when the turnover frame rotates to the feeding station, cooperates with the external chip conveying device to complete the feeding action, and the chip position does not need to be adjusted deliberately in the feeding process, only needs to follow the chip welding sequence. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, below the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the embodiment of the present application;

[0020] Figure 2 It is a three-dimensional structure schematic diagram of the embodiment of the present application;

[0021] Figure 3 It is a three-dimensional structure schematic diagram of the positioning part of the embodiment of the present application;

[0022] Figure 4 It is a three-dimensional structure schematic diagram of the positioning part of the embodiment of the present application; Figure 3

[0023] Figure 5 It is a three-dimensional structure schematic diagram of the positioning frame of the embodiment of the present application;

[0024] Figure 6 It is a three-dimensional structure schematic diagram of the positioning frame of the embodiment of the present application; Figure 5

[0025] Figure 7 ​​This is a cross-sectional view of the flipping frame according to an embodiment of the present invention;

[0026] Figure 8 This is an embodiment of the present invention. Figure 7 A magnified structural diagram of section C in the middle;

[0027] Figure 9 This is a schematic diagram of the three-dimensional state transformation of the flipping frame according to an embodiment of the present invention;

[0028] Figure 10 This is a schematic diagram showing the three-dimensional transformation of the abutment block and the counterweight plate in an embodiment of the present invention.

[0029] The labels in the diagram represent: 1. Base; 2. Limiting part; 3. Positioning part; 31. Bearing seat; 32. Tilting frame; 321. Airflow channel; 322. Air pipe; 323. Vent hole; 324. Slot; 325. Movable rod; 326. Stop bar; 327. Connecting rod; 33. Positioning frame; 331. Ball bearing; 34. Guide hole; 35. Abutment block; 36. Return spring; 37. Counterweight plate; 38. Cooling unit; 381. Connecting pipe; 4. Drive unit. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0031] The present invention will be further described below with reference to embodiments.

[0032] Example:

[0033] Please see Figures 1-10 This invention provides a technical solution: a welding fixture for automotive headlight chips based on a cooling channel structure, comprising:

[0034] The base 1 has a limiting part 2 for fixing the circuit board on its top, a positioning part 3 for assisting chip soldering on its top, and a drive unit 4 on its top.

[0035] The positioning part 3 includes a bearing seat 31 fixedly connected to the top of the base 1, and a flipping frame 32 is rotatably connected inside the bearing seat 31. A positioning frame 33 that fits against the outside of the chip is fixedly connected to the side of the flipping frame 32 near the circuit board.

[0036] The drive unit 4 is connected to the flipping frame 32 for driving the flipping frame 32 to rotate around the central axis of the bearing seat 31. When the flipping frame 32 rotates to a position parallel to the circuit board, the flipping frame 32 presses the chip to prevent the chip from shifting during the soldering process.

[0037] The positioning frame 33 has a U-shaped design, and the side of the positioning frame 33 near the circuit board has an inclined design. A ball bearing 331 is fitted into the inner wall of the positioning frame 33 near the chip, and multiple balls bearing 331 are arranged in an array along the center of the positioning frame 33.

[0038] The flip frame 32 is slidably connected to an abutment block 35 that fits against the outside of the chip through a guide hole 34 on its top. Multiple guide holes 34 are provided and arranged in an array along the center of the flip frame 32. The abutment block 35 is connected to the inner wall of the guide hole 34 through a reset spring 36 provided on its outside. A counterweight plate 37 is fixedly connected to the side of the abutment block 35 away from the positioning frame 33. The positioning frame 33 and the abutment block 35 are both designed with rough surfaces on the side near the chip.

[0039] An airflow channel 321 is provided inside the tilting frame 32, and there are two airflow channels 321 that are symmetrically distributed along the center of the tilting frame 32. An air pipe 322 that communicates with the airflow channel 321 is fixedly connected to the bottom of the tilting frame 32. A cooling unit 38 is fixedly connected to the outside of the tilting frame 32, and the cooling unit 38 is connected to the airflow channel 321 through a connecting pipe 381 provided on its outside.

[0040] The top of the flipping frame 32 is provided with ventilation holes 323, and there are multiple ventilation holes 323 arranged in an array along the center of the flipping frame 32. The top of the flipping frame 32 is provided with slots 324, and there are two slots 324 arranged symmetrically along the center of the flipping frame 32.

[0041] The slot 324 is slidably connected to a movable rod 325 and a stop rod 326 via a slide rail disposed inside it. The movable rod 325 and the stop rod 326 are distributed sequentially from the outside to the inside along the slot 324.

[0042] The movable rod 325 and the stop rod 326 are connected by a connecting rod 327. The top of the stop rod 326 is designed with a sloping surface, and the bottom of the movable rod 325 is designed with an arc surface. The movable rod 325 is connected to the outside of the slide rail through an elastic element set inside it.

[0043] The principle and advantages of this automotive headlight chip welding fixture based on a cooling channel structure:

[0044] During the soldering operation, the operator places the circuit board to be soldered above the base 1. By adjusting the limiting part 2 on the base 1, the limiting part 2 forms a rigid constraint on the circuit board, thereby eliminating soldering quality deviations caused by circuit board displacement in subsequent chip soldering processes. After the circuit board is positioned, the operator evenly applies solder paste to its pad areas.

[0045] After the solder paste application process is completed, the drive unit 4 drives the flipping frame 32 to rotate around the axis of the bearing seat 31 to a horizontal position (i.e., the preset loading station). At this time, the external chip conveying device conveys the chip to be soldered into the space formed by the positioning frame 33 and the flipping frame 32 according to the welding sequence. After the chip is positioned in the positioning frame 33, the drive unit 4 drives the flipping frame 32 to rotate towards the circuit board until a 180-degree reverse rotation is completed, so that the chip can align with the soldering target of the circuit board and achieve bonding.

[0046] During the rotation of the flip frame 32 from the preset loading station to the welding station, the chip is placed in the placement space formed by the positioning frame 33 and the flip frame 32. As the flip frame 32 rotates, the chip is subjected to centrifugal inertial force. This centrifugal inertial force causes the chip to overcome the constraint force of the positioning frame 33, resulting in relative displacement. This can cause the chip to fail to accurately align with the welding target on the circuit board, or even fall off the positioning frame 33, thus causing the welding process to be interrupted or the welding to fail.

[0047] The flip frame 32 is in the loading position, and the counterweight plate 37 and the abutment block 35 are in the initial working position, without contact with the chip. As the flip frame 32 rotates, its tilt angle gradually increases. When the tilt angle reaches a critical value, the downward component of the counterweight plate 37 overcomes the static friction between the abutment block 35 and the flip frame 32, driving the abutment block 35 to move along the guide hole 34 and compress the return spring 36. Since the positioning frame 33 has a U-shaped structure, the abutment block 35 contacts the chip sidewall as it moves, pushing the chip from the open end of the positioning frame 33 to the closed end until the chip is in contact with the closed end of the positioning frame 33, thus achieving chip limit locking. At the same time, the positioning frame 33 and the abutment block 35 are both rough surfaces near the chip. By increasing the static friction coefficient of the contact surface, a dual fixing effect of mechanical constraint and friction constraint is formed, further resisting the chip's displacement tendency. This can prevent the chip from shifting during the rotation of the flip frame 32, ensuring the docking accuracy between the chip and the pad.

[0048] It is worth noting that the positioning frame 33 has a sloping design on the side near the circuit board. When the external feeding device transports the chip to the positioning frame 33, this sloping surface forms a guide sloping surface, which can guide the chip to smoothly transition into the positioning cavity. The side wall of the positioning frame 33 has a built-in ball bearing 331, which can convert the sliding friction between the chip and the side wall of the positioning frame 33 into rolling friction, reduce the frictional resistance during the chip displacement process, and improve the stability of the chip's movement in the positioning frame 33.

[0049] During the process of the flipping frame 32 rotating from the loading position to the critical tilt angle of the counterweight plate 37, the counterweight plate 37 drives the abutment block 35 to limit the chip, so that it is in a position that is precisely aligned with the pad. As the flipping frame 32 continues to rotate to the vertical position, the downward force of the counterweight plate 37 reaches its maximum value, which can ensure that the chip is clamped and fixed by the positioning frame 33 and the abutment block 35 during the process, and prevent it from falling off the positioning frame 33. During this process, when the counterweight plate 37 moves from its initial displacement to the slot 324, it contacts the inclined surface of the stop bar 326. As the distance between them continues to decrease, the compressive strength increases. The compressive force drives the stop bar 326 to move away from the chip until the stop bar 326 is completely retracted into the slot 324. The counterweight plate 37 continues to move towards the chip. When it moves past the slot 324 (i.e., it disengages from the stop bar 326), the elastic element built into the movable rod 325, together with the connecting rod 327, drives the stop bar 326 to reset. At this time, the flat end of the stop bar 326 is in contact with the side wall of the counterweight plate 37, thereby mechanically limiting the counterweight plate 37. This prevents the chip from being reliably limited within the positioning frame 33 during the rotation of the flipping frame 32 from the vertical position to the horizontal position (in the direction of the circuit board). This is because the downward force of the counterweight plate 37 decreases, which reduces the limiting degree of the abutment block 35 on the chip. This ensures that the chip remains reliably limited within the positioning frame 33 during the rotation of the flipping frame 32.

[0050] It is worth noting that the closed end of the positioning frame 33 is always aligned with a certain soldering position of the pad. When the external chip delivery device sends the chip into the positioning frame 33, regardless of the initial position of the chip, during the rotation of the flipping frame 32, the counterweight plate 37 and the abutment block 35 work together to make the chip fit with the closed end of the positioning frame 33, without the need to deliberately adjust the position of the chip.

[0051] As the tilting frame 32 continues to rotate, the angle between it and the circuit board gradually decreases. During this process, the end of the movable rod 325 inside the slot 324 gradually contacts the top of the circuit board. After the contact deepens, the movable rod 325 is squeezed by the circuit board and slides along the slide rail inside the slot 324. The connecting rod 327 is supported by a bracket connected to the base 1. The connecting rod 327 can rotate around the center of the bracket. Therefore, the movable rod 325, the stop rod 326, and the connecting rod 327 constitute a lever mechanism. When the movable rod 325 moves upward, the stop rod 326 moves inward toward the inside of the slot 324 under the linkage of the connecting rod 327. As the movable rod 325 moves, the stop rod 326 gradually moves into the slot 324. When the flipping frame 32 rotates to the welding station (i.e., parallel to the circuit board), the movable rod 325 reaches its maximum stroke, and the stop rod 326 moves into the slot 324 simultaneously. At this time, the counterweight plate 37 disengages from the mechanical limit of the stop rod 326, and the reset spring 36 drives the abutment block 35 and the counterweight plate 37 to reset to the initial position, so as to realize the cyclic feeding of the chip.

[0052] It is worth noting that the contact end between the movable rod 325 and the circuit board adopts an arc-shaped structure design. This design avoids the stress concentration caused by sharp angles or planar contacts, achieving a uniform distribution of contact load, thereby reducing the risk of extrusion damage to the circuit board surface and avoiding problems such as indentations, cracks, and component detachment. Simultaneously, in this lever mechanism, the support fulcrum is positioned close to the stop rod 326, making the movable rod 325, stop rod 326, and connecting rod 327 form a force-saving lever (the effort arm is greater than the resistance arm). Since the contact force between the movable rod 325 and the circuit board is constrained by the rotation angle of the flipping frame 32, the initial contact force is small. Utilizing the force amplification effect of the force-saving lever, the small driving force can be amplified, ensuring that the stop rod 326 reliably moves downward and fully retracts into the slot 324.

[0053] After the chip is placed, the hot air flow generated by the external hot air welding device is introduced from directly above the chip to melt the solder paste and weld the chip leads. During the welding process, the flipping frame 32 remains in a static position, and a continuous preload is applied to the chip to form a positioning constraint, effectively suppressing chip displacement caused by the hot air flow generated by the hot air welding device, thereby reducing welding deviation.

[0054] It is worth noting that the flip frame 32 has pre-set guide holes 34 and vent holes 323 on its surface. When the hot air flow of the hot air soldering device acts on the chip, the air flow can enter the space formed by the flip frame 32 and the circuit board through the guide holes 34 and vent holes 323, ensuring that the solder paste is fully melted to meet the chip soldering requirements.

[0055] Both chips and circuit boards have clear thermal damage thresholds. During hot air soldering, the solder paste needs to be melted with instantaneous high temperature input, but continuous high temperature can easily cause oxidation and deterioration of the lead bonding layer inside the chip, and at the same time cause excessive thermal expansion of the circuit board, resulting in pad peeling or substrate warping and deformation. In addition, excessive volatilization of flux in the solder paste can cause metallurgical defects such as pores and voids to form at the solder joint.

[0056] When the hot air welding equipment completes the preset heat input and the solder has fully wetted the chip pins and circuit board pads, forming a preliminary metallurgical bond, the cooling unit 38 on the outside of the flip frame 32 starts operating. The airflow generated by the cooling unit 38 is introduced into the airflow channel 321 through the connecting pipe 381. Since the air pipe 322 and the airflow channel 321 form a connected loop, the airflow can be directionally sprayed to the chip welding area. When the airflow flows through the high-temperature area, the excess heat generated during the welding process is quickly dissipated through forced convection, thereby achieving solder joint temperature control, accelerating solder solidification, and reducing thermal stress accumulation.

[0057] After the chip soldering process is completed, the reset spring 36 drives the counterweight plate 37 and the abutment block 35 to reset to the initial position along the guide hole 34. Then, the drive unit 4 outputs driving force to drive the flipping frame 32 to rotate around the central axis of the bearing seat 31 to the loading position. During this process, the operator can remove the circuit board constrained by the limit part 2 from the base 1 to proceed to the next process.

[0058] The present invention employs positioning part 3, which has the following advantages:

[0059] Firstly, the drive unit 4 drives the flipping frame 32 to rotate around the bearing seat 31. When the flipping frame 32 rotates to be parallel with the circuit board, the positioning frame 33 and the abutment block 35 together press the chip, forming a rigid constraint. During welding, the hot air flow generated by the hot air welding device can easily cause the chip to shift. This pressing structure directly counteracts the impact force of the airflow, ensuring precise alignment between the chip and the circuit board pads, avoiding welding errors caused by positional deviations. Furthermore, when the flipping frame 32 rotates, the counterweight plate 37 generates a downward component force as the tilt angle changes, driving the abutment block 35 and the positioning frame 33 to clamp the chip. When the tilt angle of the flipping frame 32 reaches the critical value, the abutment block 35 adheres to the side wall of the chip, pushing the chip to the closed end of the positioning frame 33, forming a bidirectional limit. The clamping force is adaptively adjusted using the component force of gravity, preventing the chip from detaching from the positioning frame 33 due to centrifugal force during the flipping process.

[0060] Secondly, the positioning frame 33 adopts a U-shaped structure design, with a guide slope on the side closest to the circuit board. When the external feeding device transports the chip, this slope forms a natural guide trajectory, guiding the chip smoothly into the positioning frame 33. Furthermore, multiple sets of arrayed ball bearings 331 are embedded in the inner wall of the positioning frame 33, converting the sliding friction between the chip and the positioning frame 33 into rolling friction, effectively preventing chip damage caused by jamming during feeding. When the flipping frame 32 rotates to the feeding station, it works in conjunction with the external chip conveying device to complete the feeding action. During feeding, there is no need to deliberately adjust the chip position; only the chip soldering sequence needs to be followed. Regardless of the initial position of the chip within the positioning frame 33, during the rotation of the flipping frame 32, the counterweight plate 37 and the abutment plate work together to achieve the final positioning of the chip.

[0061] Thirdly, the movable rod 325 and the stop rod 326 form a lever mechanism through the connecting rod 327. When the flipping frame 32 rotates from the loading station to the vertical position, the counterweight plate 37 and the abutment block 35 work together to limit the chip. During the process of the flipping frame 32 rotating from the vertical position to the soldering station, the flat end of the stop rod 326 mechanically limits the counterweight plate 37 to prevent the counterweight plate 37 from being displaced under the action of the return spring 36, which would weaken the limiting effect of the abutment block 35 on the chip. When the flipping frame 32 rotates to the soldering station, the movable rod 325 is squeezed upward by the circuit board and the stroke reaches its maximum value. Through the lever mechanism, the stop rod 326 is driven to retract into the slot 324, releasing the lock on the counterweight plate 37. The counterweight plate 37, together with the return spring 36, then drives the abutment block 35 to return to the initial position along the guide hole 34, realizing the cyclic loading of the chip.

[0062] Fourthly, the flipping frame 32 completes position conversion under the drive of the drive unit 4. When it rotates to the loading position, it works with the external chip conveying device to realize automated chip loading. When it flips to the vertical position, the counterweight plate 37 drives the abutment block 35 to slide along the guide hole 34 with the help of gravity, and works with the positioning frame 33 to form dynamic limit locking of the chip. When it rotates to the soldering position, the chip and the circuit board solder pad area are accurately aligned through the reference coordination of the positioning part 3 and the limiting part 2. Through the position conversion of the flipping frame 32, the automated chip loading and dynamic positioning process are integrated into the same tooling system. The traditionally separate loading and positioning processes are integrated through the mechanical action of the flipping frame 32 to form a continuous soldering step.

[0063] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A welding fixture for automotive headlight chips based on a cooling channel structure, characterized in that, include: The base (1) has a limiting part (2) for fixing the circuit board on the top, a positioning part (3) for assisting chip welding on the top, and a drive unit (4) on the top. The positioning part (3) includes a bearing seat (31) fixedly connected to the top of the base (1), and a flip frame (32) is rotatably connected inside the bearing seat (31). The flip frame (32) is fixedly connected to a positioning frame (33) that fits against the outside of the chip on the side near the circuit board. The drive unit (4) is connected to the flipping frame (32) for driving the flipping frame (32) to rotate around the central axis of the bearing seat (31). When the flipping frame (32) rotates to a position parallel to the circuit board, the flipping frame (32) presses the chip to prevent the chip from shifting during the soldering process. The positioning frame (33) is U-shaped and has a sloping design on the side near the circuit board. A ball bearing (331) is fitted into the inner wall of the positioning frame (33) near the chip. Multiple balls bearing (331) are arranged in an array along the center of the positioning frame (33). The flipping frame (32) is slidably connected to an abutment block (35) that fits against the outside of the chip through a guide hole (34) on its top. Multiple guide holes (34) are arranged in an array along the center of the flipping frame (32). The abutment block (35) is connected to the inner wall of the guide hole (34) through a reset spring (36) on its outside. A counterweight plate (37) is fixedly connected to the side of the abutment block (35) away from the positioning frame (33). Both the positioning frame (33) and the abutment block (35) have a rough surface design on the side near the chip.

2. The automotive headlight chip welding fixture based on a cooling channel structure according to claim 1, characterized in that: The flipping frame (32) has an airflow channel (321) inside, and there are two airflow channels (321) that are symmetrically distributed along the center of the flipping frame (32). The bottom of the flipping frame (32) is fixedly connected to an air pipe (322) that communicates with the airflow channel (321). The outside of the flipping frame (32) is fixedly connected to a cooling unit (38), and the cooling unit (38) is connected to the airflow channel (321) through a connecting pipe (381) on its outside.

3. The automotive headlight chip welding fixture based on a cooling channel structure according to claim 1, characterized in that: The top of the flipping frame (32) is provided with ventilation holes (323), and there are multiple ventilation holes (323) arranged in an array along the center of the flipping frame (32). The top of the flipping frame (32) is provided with slots (324), and there are two slots (324) arranged symmetrically along the center of the flipping frame (32).

4. The automotive headlight chip welding fixture based on a cooling channel structure according to claim 3, characterized in that: The slot (324) is slidably connected to a movable rod (325) and a stop rod (326) via a slide rail disposed inside it. The movable rod (325) and the stop rod (326) are distributed sequentially from the outside to the inside along the slot (324).

5. The automotive headlight chip welding fixture based on a cooling channel structure according to claim 4, characterized in that: The movable rod (325) and the stop rod (326) are connected by a connecting rod (327). The top of the stop rod (326) is designed with a sloping surface, and the bottom of the movable rod (325) is designed with an arc surface. The movable rod (325) is connected to the outside of the slide rail through an elastic element set inside it.

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