Integrated reflow welding tool and method for multi-dimensional parts of microwave assembly

Abstract

The invention discloses an integrated reflow welding tool and method for multi-dimensional parts of a microwave assembly. The tool comprises a center positioning module and upper, lower, left and right dimension pressure applying modules; a positioning groove is formed in the middle of the center positioning module and used for containing a box body, a pushing and pressing elastic device is arranged on the inner side wall of the positioning groove and used for positioning the box body in the positioning groove, and positioning pins are arranged on the upper side, the lower side, the left side and the right side of the center positioning module; elastic locking mechanisms connected with the positioning pins are arranged at four corners of an upper cover plate and a lower cover plate of the upper dimension pressure applying module and the lower dimension pressure applying module, and a plurality of single-point elastic pressing tools are fixed on the upper cover plate and the lower cover plate and used for pressing the microwave substrate and the power panel respectively; a left cover plate and a right cover plate of the left dimension pressure applying module and the right dimension pressure applying module are provided with elastic locking mechanisms connected with the positioning pins, and a plurality of single-point elastic pressing tools are fixed to the left cover plate and the right cover plate and used for pressing a power connector and a radio frequency connector. According to the invention, multi-dimensional integrated assembling and welding of multi-dimensional high-integration microwave assembly parts can be realized.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of microwave assembly assembly, and particularly relates to a microwave assembly multi-dimensional component integrated reflow soldering tool and method. BACKGROUND

[0002] With the development of microwave assemblies in the direction of diversification and high integration, the number and integration of internal components of the assemblies are higher and higher, and the interconnection process is more complex. The assembly welding often involves front microwave substrate welding, back power board welding, side radio frequency connector and power connector welding, and front related component welding. Generally, a multi-temperature gradient welding method is adopted to solve the process problems of asynchronous welding.

[0003] The current multi-temperature gradient welding technology process is as follows: first, high melting point solder is selected for welding the front microwave substrate by reflow soldering or vapor phase soldering process, then the same melting point solder is used to weld the side wall connector by manual welding or induction welding technology, in this process, the early solder near the wall has the risk of re-melting, and finally the low-grade melting point solder is used to complete the welding of the back power board. The multi-temperature gradient welding is sequentially welded according to the principle of high temperature first and low temperature later. In this welding process, the selection of solder needs to consider the matching of the temperature resistance level of the material and the device. For high-integration multi-dimensional microwave assemblies, the current multi-temperature gradient welding technology mainly has the following shortcomings: ① There is a risk in the welding sequence, and there is a risk of solder re-melting, which affects the welding quality and structural stability; ② The welding process is complex, and multiple processes such as reflow soldering, vapor phase soldering, manual welding, and induction welding are involved in the welding process, which is difficult to operate and requires high technical requirements for personnel, and increases the difficulty of process management and quality control; ③ The selection and control of solder require higher requirements, different melting point solders need to be selected, and improper temperature control during welding can cause solder overflow, false welding and other problems, affecting the overall welding effect. SUMMARY

[0004] The purpose of the present application is to provide a microwave assembly multi-dimensional component integrated reflow soldering tool and method, which can realize multi-dimensional integration of multi-dimensional high-integration microwave assembly components.

[0005] In order to achieve the above-mentioned purpose, one aspect of the present application provides a microwave assembly multi-dimensional component integrated reflow soldering tool for welding and fixing the microwave substrate, box body, power connector, radio frequency connector and power board of the microwave assembly, the tool comprising a center positioning module and upper, lower, left and right dimensional pressure applying modules. The center positioning module is provided with a positioning groove in the middle for accommodating the box body, and the inner side wall of the positioning groove is provided with at least three push elastic devices in X and Y directions for realizing positioning of the box body in the X and Y planes of the positioning groove, and the upper, lower, left and right sides of the center positioning module are provided with positioning pins; The upper dimension pressure applying module comprises first and second upper cover plates, the first upper cover plate is provided with elastic locking mechanisms at the four corners for connecting with the upper positioning pins, the second upper cover plate is arranged above the area of the microwave substrate in the box body corresponding to the first upper cover plate, and a plurality of single-point elastic pressing tools are fixed on the first and second upper cover plates for pressing the microwave substrate; The lower dimension pressure applying module comprises first and second lower cover plates, the first lower cover plate is provided with elastic locking mechanisms at the four corners for connecting with the lower positioning pins, the second lower cover plate is arranged below the area of the power supply plate in the box body corresponding to the first lower cover plate, and a plurality of single-point elastic pressing tools are fixed on the first and second lower cover plates for pressing the power supply plate; The left dimension pressure applying module comprises first and second left cover plates, the first left cover plate is provided with elastic locking mechanisms at the left and right sides for connecting with the left positioning pins, the second left cover plate is arranged at the left area of the power supply connector and the radio frequency connector in the box body corresponding to the first left cover plate, and a plurality of single-point elastic pressing tools are fixed on the first and second left cover plates for pressing the power supply connector and the radio frequency connector; The right dimension pressure applying module comprises first and second right cover plates, the first right cover plate is provided with elastic locking mechanisms at the left and right sides for connecting with the right positioning pins, the second right cover plate is arranged at the right area of the radio frequency connector in the box body corresponding to the first right cover plate, and a plurality of single-point elastic pressing tools are fixed on the first and second right cover plates for pressing the radio frequency connector.

[0006] Another aspect of the present application provides a microwave assembly multi-dimensional component integrated reflow soldering method, which uses the above-mentioned tool to perform integrated reflow soldering on the microwave assembly multi-dimensional components, and the method comprises the following steps: Step S1: sequentially placing the solder sheet for the microwave substrate and the microwave substrate into the box body; Step S2: placing the box body prepared in step S1 into the positioning groove of the center positioning module, precisely positioning the box body by using the push elastic devices, locking the upper positioning pins of the center positioning module by the elastic locking mechanisms on the upper dimension pressure applying module, and completing pressure application on the microwave substrate; Step S3: pre-installing the left power supply connector and the corresponding solder frame, and the radio frequency connector and the corresponding solder ring into the corresponding connector mounting holes, aligning the single-point elastic pressing tools on the left dimension pressure applying module with the corresponding positions of the connectors, locking the left positioning pins of the center positioning module by the elastic locking mechanisms on the left dimension pressure applying module, and completing pressure application on the left connectors; Step S4: The right radio frequency connector and its corresponding solder ring are pre-installed into the corresponding connector mounting hole, the single-point elastic pressing tool on the right dimension pressing module is aligned with the corresponding position of the connector, the positioning pin on the right side of the center positioning module is locked by the elastic locking mechanism on the right dimension pressing module, and the pressure exertion on the right connector is completed. Step S5: The assembly assembled through steps S2, S3 and S4 is turned over, the power supply board assembly slot of the center positioning module is placed upward, the solder sheet and the power supply board used by the power supply board are sequentially placed into the box body, the lower positioning pin of the center positioning module is locked by the elastic locking mechanism on the lower dimension pressing module, and the pressure exertion on the power supply board is completed. Step S6: The assembled microwave assembly is placed into a reflow soldering furnace for soldering, and after soldering, the solder sheet, the solder frame and the solder ring are melted, and the welding of the microwave substrate, the power supply board and the connector is completed.

[0007] According to the microwave assembly multi-dimensional part integrated reflow soldering welding tool and method of the above aspect of the present application, multi-dimensional integrated welding of multi-dimensional high-integration microwave assembly parts can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor: Figure 1 is a three-dimensional schematic view of the microwave assembly multi-dimensional part integrated reflow soldering welding tool of an embodiment of the present application after assembly; Figure 2 is a three-dimensional view of the microwave assembly multi-dimensional part integrated reflow soldering welding tool of an embodiment of the present application; Figure 3 is a structural schematic view of the center positioning module of an embodiment of the present application; Figure 4 is a structural schematic view of the upper dimension pressing module of an embodiment of the present application; Figure 5 is a structural schematic view of the left dimension pressing module of an embodiment of the present application; Figure 6 is an exploded structural schematic view of the elastic locking mechanism of an embodiment of the present application; Figure 7 is a cutaway schematic view of the elastic locking mechanism of an embodiment of the present application; Figure 8 is a structural schematic view of the single-point elastic pressing tool of an embodiment of the present application; Figure 9 Schematic diagram of the structure of a microwave assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0009] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0010] One embodiment of the present invention provides a multi-dimensional component integrated welding tool for welding and fixing the front microwave substrate, box body, left connector (power connector), right connector (RF connector) and back power board. Figures 1-2 As shown, the microwave assembly multi-dimensional component integrated reflow soldering tooling according to the embodiment of the present invention includes a center positioning module 1 and multi-dimensional pressure modules distributed on its upper, lower, left, and right peripheral sides. The multi-dimensional pressure modules include an upper pressure module, a lower pressure module, a left pressure module, and a right pressure module.

[0011] A positioning groove is provided in the middle of the center positioning module 1 for accommodating the microwave component box body. Its size is 0.1 to 0.25 mm larger on one side than the outer shape of the microwave component, of which the straight side is 0.1 to 0.15 mm larger on one side and the curved side is 0.2 to 0.25 mm larger on one side. The inner side wall of the positioning groove is provided with at least three elastic pushing devices 6 in the X and Y directions, which are used to achieve precise positioning of the microwave component box body in the X / Y plane of the positioning groove. A through groove is provided in the middle of the positioning groove as a power board assembly groove, which is used for the lower dimensional pressure module to press and fix the power board on the back of the microwave component box body. In addition, positioning pins 7 are provided on each outer peripheral side of the center positioning module 1 for connecting the elastic locking mechanism 8 of the pressure modules in each dimension.

[0012] like Figure 3 As shown, the pushing elastic device 6 includes an inner groove body 22, a first pressure spring 23, a pushing block 24, a limit block 25 and a fastening screw 26, which are provided in the main body of the center positioning module 1. Among them, the inner groove body 22 and the pushing block 24 are both provided with a circular blind hole in which the first pressure spring 23 can be placed horizontally. The pushing block 24 can move under the action of the first pressure spring 23 to achieve the positioning of the microwave component box body in the positioning groove. The pushing block 24 can slide freely in the inner groove body 22, and the limit block 25 is fixedly connected to the inner groove body 22 by a screw 26, which is used to limit the maximum displacement of the pushing block 24 under the action of the first pressure spring 23. Among them, the upper half of the pushing block 24 that contacts the box body adopts an arc transition design to ensure that the box body can be smoothly lowered by virtue of the arc structure during the falling process to avoid jamming.

[0013] The structural diagram of the microwave component is shown in Figure 9, which mainly includes a front microwave substrate 37, a box body 38, a power connector 39, an RF connector 40 and a back power board 41. The multi-dimensional component integrated welding tool of the present invention is used to assemble them and then weld them through the solder sheet 42 used for the microwave substrate, the power connector welding frame 43, the RF connector welding ring 44, and the solder sheet 45 used for the power board.

[0014] like Figure 2 and Figure 4 As shown, the upper dimensional pressure module 2 includes a first upper cover plate 9 and a second upper cover plate 10. The four corners of the first upper cover plate 9 are provided with circular through holes corresponding to the positions of the positioning pins on the outer periphery of the center positioning module 1, and an elastic locking mechanism 8 is arranged above the circular through holes, which can be connected to the positioning pins on the outer periphery of the center positioning module 1 through the circular through holes. A second upper cover plate 10 is provided above the area of ​​the first upper cover plate 9 corresponding to the microwave substrate 37 in the box body 38. The two upper cover plates are fastened by screws, and multiple single-point elastic pressing tools 14 are fixed in the pre-opened through holes. These through holes are used to press the microwave substrate 37. In addition, the two upper cover plates should have ventilation holes with the same position. The ventilation holes are generally slot-shaped, which is conducive to the hot air in the reflow oven to transfer heat or the "steam" in vapor phase welding to transfer heat, thereby reducing heat capacity.

[0015] The lower dimensional pressure module 3 includes a first lower cover plate 12 and a second lower cover plate (not shown in the figure). Round holes corresponding to the positions of the positioning pins on the outer periphery of the center positioning module 1 are provided at the four corners of the first lower cover plate 12, and an elastic locking mechanism 8 is disposed below the round holes, which can be connected to the positioning pins on the outer periphery of the center positioning module 1 through the round holes. A second lower cover plate is disposed below the area of ​​the first lower cover plate 12 corresponding to the power board 41 in the box body 38. The two lower cover plates are fastened by screws, and multiple single-point elastic pressing fixtures 14 are fixed to the pre-opened through holes. These through holes are used to press the power board 41. In addition, the two lower cover plates should have ventilation holes at the same position. The ventilation holes are generally slot-shaped, which is conducive to the transfer of heat by hot air in the reflow oven or "steam" in vapor phase welding to reduce heat capacity.

[0016] The upper dimensional pressure module 2 presses the microwave substrate 37 and avoids the upper surface components through the single-point elastic pressing tool 14 fixed by the first and second upper cover plates, and the lower dimensional pressure module 3 presses the power board 41 and avoids the lower surface components through the single-point elastic pressing tool 14 fixed by the first and second lower cover plates, wherein the ends of the single-point elastic pressing tool are both equipped with a non-opening high-temperature resistant polytetrafluoroethylene soft protective sleeve pad 36.

[0017] like Figure 2 and Figure 5As shown, the left dimension pressing module 4 includes a first left cover plate 15 and a second left cover plate 18, the first left cover plate 15 is provided with circular through holes on the left and right sides corresponding to the positions of the outer peripheral side positioning pins of the center positioning module 1, and is equipped with an elastic locking mechanism 8 on the left side of the circular through hole, which is connected with the outer peripheral side positioning pin 7 of the center positioning module 1 through the through hole. In the left side area of the first left cover plate 15 corresponding to the power connector and the radio frequency connector in the box body 38, a second left cover plate 18 is arranged, and the two left cover plates are fastened by screws, and a plurality of single-point elastic pressing tools 14 are fixed in the through holes opened in advance, which are used to press the power connector 39 and the radio frequency connector 40.

[0018] The right dimension pressing module 5 includes a first right cover plate 19 and a second right cover plate 21, the first right cover plate 19 is provided with circular through holes on the left and right sides corresponding to the positions of the outer peripheral side positioning pins of the center positioning module 1, and is equipped with an elastic locking mechanism 8 on the right side of the circular through hole, which is connected with the outer peripheral side positioning pin 7 of the center positioning module through the through hole. In the right side area of the first right cover plate 19 corresponding to the radio frequency connector 40 in the box body, a second right cover plate 21 is arranged, and the two right cover plates are fastened by screws, and a plurality of single-point elastic pressing tools 14 are fixed in the through holes opened in advance, which are used to press the radio frequency connector 40.

[0019] The left dimension pressing module 4 presses the power connector 39 and the radio frequency connector 40 through the single-point elastic pressing tools 14 fixed by the first and second left cover plates, and the right dimension pressing module 5 presses the radio frequency connector 40 through the single-point elastic pressing tools 14 fixed by the first and second right cover plates. Among them, the power connector is fixed by two single-point pressing elastic tools 14, the end of which is equipped with a high-temperature-resistant polytetrafluoroethylene soft protective sleeve pad 36 without opening; the radio frequency connector is fixed by a single pressing elastic tool, and the end is equipped with a high-temperature-resistant polytetrafluoroethylene soft protective sleeve pad 36 with a circular blind hole. The size of the protective sleeve pad is designed to meet the following conditions: the outer diameter is greater than the outer end face of the radio frequency connector and smaller than the connector mounting hole of the box body 38, so as to ensure the pressing stability of the connector and its welding ring and prevent it from falling off. In addition, the diameter and depth of the circular blind hole should be greater than the diameter and length of the inner conductor of the radio frequency connector, so as to protect the inner conductor from being damaged during assembly.

[0020] As shown in FIG. 1, the center positioning module 1 is provided with a plurality of outer peripheral side positioning pins 7, and the left and right dimension pressing modules 4 and 5 are respectively provided with a plurality of circular through holes corresponding to the positions of the outer peripheral side positioning pins 7, and are equipped with an elastic locking mechanism 8 on the left and right sides of the circular through hole, which is connected with the outer peripheral side positioning pin 7 of the center positioning module 1 through the through hole. Figure 6 and Figure 7As shown, the elastic locking mechanism 8 includes a main body compartment 27, a slider 28, a limiting cylinder 29, and a second pressure spring 30. The main body compartment 27 is provided with a non-through hole inner cavity for the free movement of the slider 28, and the slider 28 can enter and exit through the right opening. Two circular blind holes are provided on the inner wall of the main body compartment 27, which are arranged opposite to the spring mounting surface of the slider 28. The two holes are used to fix the second pressure spring 30 and clamp the second pressure spring 30 in the middle position. Circular through holes are provided on the upper and lower surfaces of the main body compartment 27 to allow the positioning pin to pass freely; limiting windows are provided on the left and right side surfaces to limit the range of movement of the limiting cylinder 29 after being connected to the slider 28. In addition, positioning through holes are provided around the main body compartment 27, which can be fastened to the cover plate by screws.

[0021] The tail of the slider 28 serves as a spring mounting surface, and is provided with two circular blind holes for fixing the pressure spring. The left and right surfaces are mounting surfaces for the limiting cylinder 29, and are provided with circular blind holes with internal threads for connection with the limiting cylinder 29 with external threads. The thickness of the U-shaped card at the front end of the slider 28 is one-third of the thickness of the main body, and adopts a U-shaped opening design. The U-shaped notch can be used to clamp the positioning pin. Under the action of the spring, the U-shaped notch automatically tightens to lock the peripheral positioning pin of the center positioning module. When unlocking, press the limiting columns symmetrically distributed on the left and right sides of the main compartment to push the U-shaped card back, so that the positioning pin is disengaged from the U-shaped notch, thereby realizing the rapid separation of the locking mechanism of the pressure module in each dimension and the peripheral positioning pin of the center positioning module.

[0022] The front end of the limiting cylinder 29 has an external thread, which can be screwed and fastened with the circular blind hole with an internal thread on the limiting cylindrical mounting surface of the slider 28; the maximum diameter of the limiting cylinder 29 is smaller than the height difference of the limiting window of the main bin 27, ensuring that it can move normally in the window.

[0023] like Figure 8 As shown, the single-point elastic pressing tool 14 includes an outer sleeve 31, an inner sleeve rod 32, a third pressure spring 30, an anti-spring overflow gasket 34, a screw 35 and a soft protective sleeve 36. The outer sleeve 31 is provided with an outer step and is assembled in the through hole opened in the first upper / lower / left / right cover plate. The depth of the blind hole is adapted to the thickness of the outer step. The single-point elastic pressing tool 14 is fixed by pressing through the holes in the second upper / lower / left / right cover plate. The inner sleeve rod 32 is provided with an inner step. The third pressure spring 30 is placed between the inner sleeve rod 32 and the anti-spring overflow gasket 34. The two are fastened together by screws 35. The outer surface of the soft protective sleeve 36 is provided with a thread, which is screwed into the inner thread at the bottom of the inner sleeve rod 32. The sleeve is made of high-temperature resistant polytetrafluoroethylene. Except for the soft protective sleeve used in the RF connector, which has a circular blind hole at the end, the rest are soft protective sleeves without openings.

[0024] In summary, each pressure applying module on the periphery side of the center positioning module 1 can be quickly connected and fixed with the protruding positioning pins 7 of different dimensions on the center positioning module 1 through the elastic locking mechanism 8 thereof, the tooling innovation realizes one-time welding assembly of the microwave assembly multi-dimensional parts, has the characteristics of high assembly integration and high positioning precision, significantly simplifies the assembly process and improves the operation efficiency, and is suitable for the automatic mechanical arm and realizes fully automatic high-efficiency assembly.

[0025] The embodiment of the present application also provides a microwave assembly multi-dimensional part integrated reflow soldering method, which adopts the tooling of the above-mentioned embodiment of the present application to perform integrated reflow soldering of the microwave assembly multi-dimensional parts, and the method comprises the following steps: Step S1: sequentially place the solder sheet 42 for the microwave substrate and the microwave substrate 37 on which the surface-mounted components are fixed by the solder paste into the box body 38; Step S2: place the box body 38 assembled in step S1 into the positioning groove of the center positioning module 1, and accurately position the box body 38 by using the three push elastic devices 6. The pressure applying on the microwave substrate 37 is completed by locking the positioning pins 7 on the upper side of the center positioning module through the elastic locking mechanism 8 on the upper dimension pressure applying module; Step S3: preinstall the left power connector 39, the radio frequency connector 40 and the corresponding solder frame 43 and solder ring 44 into the corresponding connector mounting holes. Then, align the single-point elastic pressing tool 14 on the left dimension pressure applying module with the corresponding position of the connector, lock the positioning pins 7 on the left side of the center positioning module through the elastic locking mechanism 8 of the left dimension pressure applying module, and thus complete the pressure applying on the left connector; Step S4: preinstall the right radio frequency connector 40 and the corresponding solder ring 44 into the corresponding connector mounting holes. Then, align the single-point elastic pressing tool 14 on the right dimension pressure applying module with the corresponding position of the connector, lock the positioning pins 7 on the right side of the center positioning module through the elastic locking mechanism 8 of the right dimension pressure applying module, and thus complete the pressure applying on the right connector; Step S5: turn over the assembly assembled in steps S2, S3 and S4, place the power board assembly groove of the center positioning module upward, sequentially place the solder sheet 45 for the power board and the power board into the box body 38, lock the positioning pins on the lower side of the center positioning module through the elastic locking mechanism 8 on the lower dimension pressure applying module, and thus complete the pressure applying on the power board 41 by the lower dimension pressure applying module; Step S6: place the integrated tooling of the assembled microwave assembly into a reflow soldering furnace for soldering, melt the solder sheet and the solder ring after soldering, and thus complete the soldering of the microwave substrate, the power board and the connector; After the soldering is completed, remove the dimension pressure applying modules and take out the microwave assembly.

[0026] The microwave assembly multi-dimensional part integration reflow soldering tool and method has the following beneficial effects: (1) The present application can realize multi-dimensional integration of high-integration microwave assembly parts, with high efficiency, stability and reliability, simple and fast process flow, high consistency and reliability. (2) The present application can realize accurate positioning of the microwave assembly in the X / Y plane of the positioning groove by setting at least three pushing devices in the center positioning module. (3) The single-point pressure elastic tool of the present application can be flexibly replaced according to the welding effect, and the dynamic adjustment of the welding pressure can be realized by replacing the wire diameter specification of the pressure spring, improving the process adaptability. (4) The positioning pin and locking mechanism of the present application are universal and can be reused, greatly shortening the design cycle of new product tooling.

[0027] The above only describes some exemplary embodiments of the present application by way of illustration, without doubt, for ordinary skilled in the art, without departing from the spirit and scope of the present application, the described embodiments can be modified in various ways. Therefore, the above figures and description are illustrative in nature and should not be construed as limiting the scope of the claims of the present application.

Claims

1. A multi-dimensional integrated reflow soldering tool for microwave components, used for soldering and fixing microwave substrates, boxes, power connectors, radio frequency connectors, and power boards of microwave components, characterized in that: The tooling includes a center positioning module and upper, lower, left, and right dimensional pressure modules; A positioning slot is provided in the middle of the center positioning module for accommodating the box body. The inner sidewall of the positioning slot is provided with at least three elastic pushing devices in the X and Y directions for positioning the box body in the X and Y planes of the positioning slot. Positioning pins are provided on the top, bottom, left and right sides of the center positioning module. The upper dimensional pressure module includes a first and a second upper cover plate. The four corners of the first upper cover plate are provided with elastic locking mechanisms connected to the upper side positioning pins. The second upper cover plate is arranged above the area of ​​the first upper cover plate corresponding to the microwave substrate in the box body. Multiple single-point elastic pressing tooling is fixed on the first and second upper cover plates for pressing the microwave substrate. The lower dimensional pressure module includes a first and a second lower cover plate. The four corners of the first lower cover plate are provided with elastic locking mechanisms connected to the lower side positioning pins. The second lower cover plate is arranged below the area of ​​the first lower cover plate corresponding to the power board in the box body. Multiple single-point elastic pressing tooling is fixed on the first and second lower covers for pressing the power board. The left-dimension pressure module includes a first and a second left cover plate. The first left cover plate is provided with elastic locking mechanisms connected to the left positioning pin on the left and right sides. The second left cover plate is provided in the left area of ​​the first left cover plate corresponding to the power connector and the RF connector in the box body. The first and second left cover plates are fixed with multiple single-point elastic pressing tooling for pressing the power connector and the RF connector. The right-dimensional pressure module includes a first and a second right cover plate. The first right cover plate is provided with elastic locking mechanisms connected to the right positioning pin on the left and right sides. The second right cover plate is arranged in the right area of ​​the RF connector in the box body corresponding to the first right cover plate. Multiple single-point elastic pressing tooling is fixed on the first and second right covers for pressing the RF connector.

2. The microwave assembly multi-dimensional component integrated reflow soldering tool as claimed in claim 1, characterized in that: The pushing elastic device includes an inner groove body, a first pressure spring, a pushing block, a limit block and a fastening screw opened on the central positioning module, wherein the inner groove body and the pushing block are both provided with a blind hole capable of horizontally placing the first pressure spring; the pushing block can move under the action of the first pressure spring to realize the positioning of the microwave component box body in the positioning groove; the pushing block can slide freely in the inner groove body; the limit block is fixedly connected to the inner groove body by a fastening screw, and is used to limit the maximum displacement of the pushing block under the action of the first pressure spring.

3. The multi-dimensional component integrated reflow soldering tool for microwave assemblies according to claim 1 or 2, characterized in that: The elastic locking mechanism includes a main body, a slider, a limiting cylinder and a second pressure spring. The tail of the slider serves as the spring mounting surface, with two circular blind holes for fixing the second pressure spring. The left and right sides of the slider serve as the limiting cylinder mounting surfaces, with circular blind holes with internal threads for connecting with the limiting cylinder. A U-shaped clip is provided at the front end of the slider for clamping the positioning pin. The main body compartment is provided with a non-through hole inner cavity for the free movement of the slider. The slider can enter and exit through the right opening. Two circular blind holes are provided on the left inner wall of the main body compartment, which are arranged opposite to the spring mounting surface of the slider. The second pressure spring is fixed between the two holes and clamped in the middle position. There are circular through holes on the upper and lower sides of the main body to allow the positioning pin to pass freely, and limit windows on the left and right sides to limit the range of motion after the limit cylinder is connected to the slider; The front end of the limiting cylinder is provided with an external thread, which can be screwed and fastened with a circular blind hole with an internal thread on the mounting surface of the limiting cylinder of the slider.

4. The integrated reflow soldering tool for multi-dimensional components of microwave assemblies according to claim 3, characterized in that: The thickness of the U-shaped card set at the front end of the slider is one-third of the thickness of the slider body, and the opening is U-shaped. Under the action of the second pressure spring, the U-shaped opening is automatically tightened to lock the positioning pin.

5. The multi-dimensional component integrated reflow soldering tool for microwave assemblies according to claim 1 or 2, characterized in that: The single-point elastic pressing tool comprises an outer sleeve, an inner sleeve rod, a third pressure spring, an anti-spring overflow gasket, screws and a soft protective sleeve pad. The outer sleeve is provided with an outer step and is assembled in the blind hole opened in the first upper, lower, left and right cover plates, and the depth of the blind hole is adapted to the thickness of the outer step; the fixation of the single-point elastic pressing tooling is achieved by perforating and pressing the second upper, lower, left and right cover plates; the inner sleeve rod is provided with an inner step, and the third pressure spring is placed between the inner sleeve rod and the anti-spring overflow gasket, and the inner sleeve rod and the anti-spring overflow gasket are fastened with screws; the outer surface of the soft protective sleeve pad is provided with a thread, which is screwed together with the internal thread at the bottom of the inner sleeve rod.

6. The integrated reflow soldering tool for multi-dimensional components of microwave assemblies according to claim 5, characterized in that: The power connector is fixed with two single-point press elastic tooling, and its end is equipped with a high-temperature resistant polytetrafluoroethylene soft protective sleeve pad without openings; the RF connector is fixed with a single press elastic tooling, and its end is equipped with a high-temperature resistant polytetrafluoroethylene soft protective sleeve pad with a circular blind hole.

7. The microwave assembly multi-dimensional component integrated reflow soldering tool as claimed in claim 1 or 2, characterized in that: A through groove is provided in the middle of the positioning groove as a power board assembly groove, which is used for the lower dimensional pressure module to press and fix the power board on the back of the box body.

8. A method for integrated reflow soldering of multi-dimensional components of microwave assemblies, characterized in that: The tooling according to any one of claims 1 to 7 is used to perform integrated reflow soldering of multi-dimensional components of a microwave assembly, the method comprising: Step S1: placing the solder sheet used for the microwave substrate and the microwave substrate into the box body in sequence; Step S2: Place the box body assembled in step S1 into the positioning groove of the center positioning module, use the push elastic device to accurately position it, and lock the upper positioning pin of the center positioning module through the elastic locking mechanism on the upper dimensional pressure module to complete the pressure application on the microwave substrate; Step S3: Pre-install the left power connector and its corresponding welding frame, the RF connector and its corresponding welding ring into the corresponding connector mounting holes, align the single-point elastic pressing tool on the left dimensional pressure module with the corresponding position of the connector, and lock the positioning pin on the left side of the center positioning module through the elastic locking mechanism on the left dimensional pressure module to complete the pressure application on the left connector; Step S4: Pre-install the right RF connector and its corresponding solder ring into the corresponding connector mounting hole, align the single-point elastic pressing tool on the right dimensional pressure module with the corresponding position of the connector, and lock the positioning pin on the right side of the center positioning module through the elastic locking mechanism on the right dimensional pressure module to complete the pressure application on the right connector; Step S5: Flip the assembly assembled in steps S2, S3, and S4, place the centering module with the power board assembly slot facing upward, place the solder sheet used for the power board and the power board into the box body in sequence, and lock the lower positioning pin of the centering module through the elastic locking mechanism on the lower dimensional pressure module to complete the pressure application on the power board; Step S6: The assembled microwave assembly is placed in a reflow soldering furnace for soldering. After soldering, the solder sheet, solder frame and solder ring are melted, and the soldering of the microwave substrate, power board and connector is completed.

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