Automatic packaging device and control method for wafer box

Abstract

The application provides an automatic packaging device and control method for wafer boxes, comprising: an automatic feeding module, an AOI appearance detection module, an automatic overturning module, a picking module, a labeling module, a supplementary material feeding module, an automatic packaging module, a packaging bag feeding module, an automatic discharging module, a discharging AOI appearance detection module and a discharging labeling module; the automatic feeding module is used for receiving wafer boxes; the supplementary material feeding module is used for pasting supplementary materials on the wafer boxes; the labeling module is used for pasting labels on the wafer boxes; the automatic packaging module is used for sleeving packaging bags on the wafer boxes; the automatic discharging module is used for moving the packaged wafer boxes to the discharging AOI appearance detection module; the discharging AOI appearance detection module is used for detecting whether the packaged wafer boxes are qualified; and the discharging labeling module is used for pasting labels on the packaged wafer boxes. Through the automatic packaging device, all packaging actions of the wafer boxes can be completed at one time, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer packaging technology, and more specifically to an automatic packaging device and control method for wafer boxes. Background Technology

[0002] In the semiconductor manufacturing industry, the transportation and storage of wafers are crucial. Wafer boxes are used to carry and protect wafers, ensuring their safety during production, transportation, and storage. To prevent wafers from being contaminated, damaged, or affected by the external environment during transportation, wafer boxes typically need to be packaged. However, most existing wafer box packaging equipment uses manual or semi-automatic packaging methods, which have many problems.

[0003] First, manual packaging is inefficient. Because wafer cassettes vary in size and shape and require precise placement and securing, manual operation cannot complete the packaging of large quantities of wafer cassettes in a short time. This not only increases production costs but can also lead to production delays. For example, on large-scale production lines, the speed of manual packaging is far from meeting production demands, thus becoming a bottleneck in the production process.

[0004] Secondly, the quality of manual packaging is inconsistent. Due to the subjectivity and inconsistency of manual operation, the tightness, sealing, and amount of packaging materials used are difficult to guarantee consistently. This may result in some wafer cases being damaged during transportation due to insecure packaging, or wafers being contaminated due to insufficient sealing. For example, uneven force when manually wrapping the packaging tape may cause the tape to loosen, leading to loose packaging during transportation.

[0005] Furthermore, while semi-automatic packaging equipment improves packaging efficiency to some extent, it still has many limitations. Semi-automatic equipment typically requires manual assistance for some operations, such as placing wafer boxes and adjusting packaging positions. This not only increases the frequency of human intervention but can also lead to operational errors. At the same time, semi-automatic equipment has a lower level of automation and cannot achieve fully automated control of the packaging process, making it difficult to match the automation level of modern production lines. For example, semi-automatic equipment may require frequent manual adjustments to packaging parameters during the packaging process, which not only increases operational complexity but may also lead to fluctuations in packaging quality.

[0006] With the rapid development of the semiconductor industry, higher demands are being placed on the efficiency, quality, and automation of wafer box packaging. Therefore, developing a fully automated wafer box packaging system to improve packaging efficiency, ensure packaging quality, and achieve full automation of the packaging process is a pressing technical challenge. Summary of the Invention

[0007] In view of this, embodiments of this specification provide an automatic packaging device and control method for wafer cassettes, so as to achieve fully automatic packaging of wafer cassettes, thereby changing the original manual or semi-automatic packaging to fully automatic packaging.

[0008] The embodiments in this specification provide the following technical solutions:

[0009] An automated packaging apparatus for a wafer cassette includes:

[0010] Automatic feeding module, AOI appearance inspection module, automatic flipping module, picking module, labeling module, auxiliary material feeding module, automatic packaging module, packaging bag feeding module, automatic unloading module, unloading AOI appearance inspection module and unloading labeling module;

[0011] The AOI appearance inspection module is set in the middle station of the automatic feeding module, and the automatic flipping module is set in the last station of the automatic feeding module and is used to receive the wafer cassette located on the AOI appearance inspection module.

[0012] The auxiliary material feeding module and the labeling module are set opposite to each other. The picking module is set between the auxiliary material feeding module and the labeling module. The feeding side of the picking module is set on the wafer box discharge side of the automatic flipping module. The auxiliary material feeding module is used to apply auxiliary materials on the wafer box, and the labeling module is used to apply labels on the wafer box.

[0013] The automatic packaging module is located on the wafer box discharge side of the pick-up module, and the packaging bag feeding module is located on the packaging bag feeding side of the automatic packaging module. The automatic packaging module is used to receive the packaging bags from the packaging bag feeding module and put the packaging bags over the outside of the wafer box.

[0014] The automatic unloading module is set on the wafer box discharge side of the automatic packaging module and is used to move the packaged wafer box to the unloading AOI appearance inspection module.

[0015] The AOI appearance inspection module is located above the automatic unloading module. The AOI appearance inspection module is used to inspect whether the packaged wafer box is qualified.

[0016] The feeding and labeling module is located on one side of the automatic feeding module. The feeding and labeling module is used to affix labels to the packaged wafer boxes.

[0017] Furthermore, the automated packaging module includes:

[0018] Packaging mobile platform, gripping strap assembly, lower suction bag assembly, upper suction bag assembly, left and right center pull edge assembly, sealing assembly, bag support assembly, bag pressing assembly, and adhesive application assembly;

[0019] The gripper assembly is mounted on the frame of the automated packaging module and is used to pick up and move the packaging bags;

[0020] The packing mobile platform is fixed to the frame base of the automated packaging module and is used to place and move the wafer cassette;

[0021] The lower suction bag assembly and the upper suction bag assembly are respectively set on the upper and lower sides of the packaging mobile platform. The lower suction bag assembly and the upper suction bag assembly are used to open the four corners of the packaging bag.

[0022] The left and right center pull-edge components are respectively set on the left and right sides of the packing mobile platform. Both the left and right center pull-edge components are used to pull the middle part of the packaging bag.

[0023] The sealing assembly is located on the feeding side of the packaging mobile platform, and the bag support assembly (780) is located on the upper and lower sides of the packaging mobile platform and is staggered from the wafer cassette entry direction of the lower suction bag assembly and the upper suction bag assembly. The sealing assembly is used to clamp the packaging bag and vacuum the packaging bag, and the bag support assembly is used to pre-press, press and heat the opening side of the packaging bag.

[0024] The bag-pressing assembly is located behind the bag-supporting assembly and is used to fold the open side of the packaging bag downwards;

[0025] The adhesive application assembly is located on one side of the opening of the packaging bag and is used to apply tape to the packaged wafer cassette.

[0026] Furthermore, the packaged mobile platform includes:

[0027] The system includes a mobile module, a rotating support unit, a packaging platform, and a pressing module. The rotating support unit is fixed to the mobile module, the packaging platform is fixed to the rotating support unit, and the pressing module is fixed to the packaging platform.

[0028] The gripping assembly includes:

[0029] The bag-grabbing lateral movement module, the bag-grabbing Z-axis module, and the bag-grabbing gripper assembly are connected to the bag-grabbing lateral movement module via the bag-grabbing Z-axis module. The bag-grabbing gripper assembly moves horizontally via the bag-grabbing lateral movement module and vertically via the bag-grabbing Z-axis module.

[0030] The lower suction bag assembly includes:

[0031] The lower suction bag Z-axis module, the lower suction bag head, the left lower pull bag element and the right lower pull bag element are respectively fixed at the upper end of the lower suction bag Z-axis module. The lower suction bag head moves vertically through the lower suction bag Z-axis module. The left lower pull bag element and the right lower pull bag element are respectively fixed at both ends of the lower suction bag head.

[0032] The upper suction bag assembly includes:

[0033] The upper suction bag Z-axis module, the upper suction bag head, the upper left pull bag element, and the upper right pull bag element are all included. The upper suction bag head is fixed at the lower end of the lower suction bag Z-axis module and moves vertically through the upper suction bag Z-axis module. The upper left pull bag element and the upper right pull bag element are fixed at both ends of the upper suction bag head, respectively.

[0034] The left-center pull-edge component includes:

[0035] The left center pull belt has a horizontal axis and a left center pull belt claw. The left center pull belt claw is fixed on the left center pull belt horizontal axis and is used to pull the middle of the packaging bag.

[0036] The right center pull-out component includes:

[0037] The right center pull belt has a horizontal axis and a right center pull belt claw. The right center pull belt claw is fixed on the right center pull belt horizontal axis and is used to pull the middle of the packaging bag.

[0038] The tie-up components include:

[0039] The bag-tying Z-axis, bag-tying X-axis, bag-tying Y-axis, and vacuum assembly are all fixed on the base of the bag-tying assembly. The bag-tying Z-axis can move up and down relative to the base. The bag-tying X-axis and bag-tying Y-axis are equipped with grippers for clamping the packaging bag. The vacuum assembly is used to vacuum the packaging bag.

[0040] The bag support assembly includes:

[0041] The bag has a Z-axis support, an upper seal, and a lower seal. The upper and lower seals are fixed on the Z-axis support and can move closer to or further away from each other along the Z-axis.

[0042] Furthermore, the bag-pressing assembly includes:

[0043] The bag-pressing Z-axis and bag-pressing rollers are fixed on the bag-pressing Z-axis and can move up and down along the bag-pressing Z-axis;

[0044] The adhesive components include:

[0045] The device includes a tape removal assembly, a tape feeding module, and a tape suction assembly. The tape suction assembly is positioned above the tape feeding module. The tape removal assembly provides the tape, and the tape feeding module transports the tape to the adhesive application station of the tape suction assembly. The tape suction assembly then applies the tape to the packaging bag of the wafer cassette.

[0046] Furthermore, the packaging bag feeding module includes:

[0047] Packaging bag storage bin, storage bin lifting assembly, material handling robot assembly, and material unloading platform assembly;

[0048] The packaging bag storage bin is connected to the storage bin lifting assembly, and the packaging bag storage bin is driven to move up and down through the storage bin lifting assembly;

[0049] The packaging bags are placed in the packaging bag storage bin;

[0050] The material handling robot assembly is located on the discharge side of the packaging bag storage bin and is used to remove packaging bags from the packaging bag storage bin;

[0051] One end of the material feeding platform component is fixed to the material storage bin lifting component and is used to place the retrieved packaging bags.

[0052] Furthermore, the automatic feeding module includes:

[0053] The material feeding module and multiple material feeding buffer positions;

[0054] The feeding buffer positions are set sequentially along the feeding to discharging direction, and the feeding module is located below the feeding buffer position on the feeding side of the automatic feeding module;

[0055] The material feeding and labeling module includes:

[0056] The outer packaging label printing and peeling module, feeding assembly, and label affixing assembly;

[0057] The outer packaging label printing and peeling module is used to provide the outer packaging label. The outer packaging label is transported to the label affixing component via the feeding component, and the label affixing component affixes the outer packaging label to the sealed packaging bag.

[0058] A control method for an automated wafer cassette packaging apparatus, comprising the following steps:

[0059] The wafer box is conveyed to the inspection station of the AOI appearance inspection module through the automatic feeding module, and the appearance inspection of the wafer box is carried out by the automatic flipping module and the AOI appearance inspection module.

[0060] If the appearance inspection is qualified, the wafer box is moved to the auxiliary material feeding module through the picking module, and the auxiliary material is attached to the outside of the wafer box;

[0061] The wafer box is moved to the labeling module via the pick-up module, and the outer packaging label is affixed to the wafer box. Then, the wafer box is moved to the automatic packaging module via the pick-up module.

[0062] The packaging bag is fed into the automatic packaging module via the packaging bag feeding module. The automatic packaging module and the picking module then place the wafer box into the packaging bag and seal it. Finally, the sealed packaging bag is transported to the unloading port.

[0063] The automatic feeding module picks up the sealed packaging bag at the feeding port and transports the sealed packaging bag to the feeding AOI appearance inspection module. After the feeding AOI appearance inspection module performs appearance inspection on the sealed packaging bag, the feeding labeling module affixes the outer packaging label to the sealed packaging bag.

[0064] Furthermore, the wafer cell is subjected to appearance inspection using an automatic flipping module and an AOI appearance inspection module, including:

[0065] The AOI appearance inspection module performs automatic optical inspection on one side of the wafer box;

[0066] Determine whether the wafer box needs to be flipped based on external requirements. If it needs to be flipped, the wafer box is flipped by an automatic flipping module, and the other side of the wafer box is automatically optically inspected by an AOI appearance inspection module. If it does not need to be flipped, the automatic optical inspection ends.

[0067] If the automatic optical inspection is qualified, the wafer cassette is moved to the Mapping detection position of the AOI appearance inspection module through the pick-up module. The Mapping detection is used to detect the status of the wafer in the wafer cassette.

[0068] If the mapping inspection is qualified, the appearance inspection is qualified; if the automatic optical inspection is unqualified and / or the mapping inspection is unqualified, the appearance inspection is unqualified.

[0069] Furthermore, the packaging bag is conveyed to the automatic packaging module via the packaging bag feeding module, and the wafer cassette is placed into the packaging bag via the automatic packaging module and the pick-up module. The packaged wafer cassette is then transported to the unloading side of the automatic packaging module, including:

[0070] The storage bin lifting assembly is used to move the packaging bag storage bin to the discharge position. The picking robot assembly picks up a packaging bag at the discharge position and places the packaging bag on the upper surface of the feeding platform assembly.

[0071] The packaging bag is adsorbed on the surface of the feeding platform component, and the bag gripping and lateral movement module of the gripping belt component moves laterally to above the feeding platform component;

[0072] Adjust the platform of the rotating support unit to make it level with the platform of the packaging platform;

[0073] Control the Z-axis module of the bag gripper to descend, pick up the packaging bag through the bag gripper assembly, and place the packaging bag on the packaging platform of the packing mobile platform;

[0074] Move the packaging platform and rotating support unit to a position where the lower surface of the packaging bag can rest on the upper surface of the suction head of the lower suction bag;

[0075] The packaging bag is adsorbed by the suction head at the bottom of the bag.

[0076] The control bag gripping Z-axis module and the upper suction bag Z-axis module are simultaneously lowered to the upper surface of the packaging bag. The suction cups on the upper left and upper right bag pulling elements are used to hold the upper surface of the packaging bag and pull it to a certain height.

[0077] After clamping the four corners of the packaging bag with the upper left, upper right, lower left, and lower right pull-out bag elements, pull the upper left, upper right, lower left, and lower right pull-out bag elements to open the packaging bag until the bag opening is wide.

[0078] Rotate the rotating support unit in the opposite direction to a vertical position;

[0079] Extend the left and right center pull belt lateral axis and pull the middle of the packaging bag through the left and right center pull belt claws to open the packaging bag to its maximum size;

[0080] The wafer cassette is placed into the packaging bag using the pick-up module, and the wafer cassette is secured using the grippers of the packaging platform.

[0081] After the pickup module retracts, the left and right center pull-out components will also retract.

[0082] The bag-tying assembly descends vertically along the Z-axis, and with the grippers on the Y-axis open, it clamps the middle of the packaging bag using the X-axis.

[0083] The grippers on the X-axis of the bag-tying device push the packaging bag from the outside, the upper suction bag assembly clamps the packaging bag and moves it downward, and the lower suction bag assembly clamps the packaging bag and moves it upward.

[0084] When the upper suction bag assembly and the lower suction bag assembly approach each other, the upper and lower seals move towards each other simultaneously. After the upper and lower seals clamp the packaging bag, the packaging bag is pre-compressed, and the lower and upper suction bag assemblies are retracted to their original state.

[0085] The grippers on the Y-axis of the bag are retracted, and the upper and lower seals move towards each other simultaneously again. After the upper and lower seals clamp the bag, the bag is pressed tightly. The vacuum assembly continuously inflates and deflates the bag to create a vacuum.

[0086] When the packaging bag is tightened, the moving module moves forward following the state of the packaging bag;

[0087] Once the vacuum level of the packaging bag reaches the set value, the upper and lower seals are heated to open the packaging bag, while keeping the position of the moving module unchanged, so that the upper and lower seals are loosened and then retracted.

[0088] The Z-axis of the bag pressing unit is lowered, and the bag opening of the sealed packaging bag is smoothed by the bag pressing roller. The bag opening of the sealed packaging bag is pressed onto the wafer cassette by the clamp of the pressing module. The moving module is then moved to the vicinity of the adhesive application assembly.

[0089] The tape is torn and cut using the tape removal assembly. The tape is then moved to the tape removal assembly by the tape feeding module and attached to the opening of the sealed packaging bag.

[0090] The packaged wafer cassettes are transported to the unloading side of the automated packaging module via a moving module.

[0091] Furthermore, it also includes:

[0092] The total length of the packaging bag is L, the length of the bottom of the packaging bag is L1, the length of the wafer box is L3, L2 is the length of the packaging bag after removing the bottom, L2=L-L1, L4 is the length of the hypotenuse of the packaging bag after heat sealing, L5 is the distance from the opening of the packaging bag to the seal, L6 is the overall height of the packaging bag after it is opened, L7 is the length of the packaging bag remaining after vacuuming, and L8 is the projection length of the hypotenuse of the packaging bag in the Y direction after heat sealing. Therefore, L2=L3+L4+L5, L7+L6 / 2=L2-L3;

[0093] During pre-compression, the initial stretching distance of the upper suction bag Z-axis module is L6, the movement distance of the upper suction bag Z-axis module, the bag gripping Z-axis module, the upper seal and the lower seal in the Z direction is L6 / 2, and the movement distance of the moving module in the Y direction is L4-L8, so that the time for the upper suction bag Z-axis module, the bag gripping Z-axis module, the upper seal and the lower seal to move L6 / 2 is equal to the time for the moving module to move L4-L8;

[0094] When vacuuming the packaging bag, the difference between the time it takes for the packaging bag to deform by the vacuuming distance L4-L6 / 2 and the time it takes for the moving module to move by the distance L8+L5-L7 is less than the set difference.

[0095] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0096] The automated wafer box packaging device according to the embodiments of the present invention can complete all packaging actions of the wafer box in one go, which can effectively reduce manual labor and improve production efficiency. Attached Figure Description

[0097] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0098] Figure 1 This is an overall schematic diagram of the automated packaging device for a wafer cassette according to an embodiment of the present invention;

[0099] Figure 2 This is a schematic diagram of the automatic feeding module, AOI appearance inspection module, and automatic flipping module according to an embodiment of the present invention;

[0100] Figure 3 This is a detailed schematic diagram of the automatic flipping module according to an embodiment of the present invention;

[0101] Figure 4 This is a schematic diagram of the picking module, labeling module, and auxiliary material feeding robot assembly according to an embodiment of the present invention;

[0102] Figure 5 This is a schematic diagram of the automatic packaging module and the packaging bag feeding module according to an embodiment of the present invention;

[0103] Figure 6 This is a first schematic diagram of the automatic packaging module according to an embodiment of the present invention;

[0104] Figure 7 This is a second schematic diagram of the automatic packaging module according to an embodiment of the present invention;

[0105] Figure 8 This is a detailed schematic diagram of the packaging bag feeding module according to an embodiment of the present invention;

[0106] Figure 9 This is a schematic diagram of a packaging and mobile platform according to an embodiment of the present invention;

[0107] Figure 10 This is a schematic diagram of the gripping assembly according to an embodiment of the present invention;

[0108] Figure 11 This is a schematic diagram of the lower suction bag assembly according to an embodiment of the present invention;

[0109] Figure 12 This is a schematic diagram of the upper suction bag assembly according to an embodiment of the present invention;

[0110] Figure 13 This is a schematic diagram of the left-middle pull-edge component according to an embodiment of the present invention;

[0111] Figure 14 This is a schematic diagram of the right-center pull-edge component according to an embodiment of the present invention;

[0112] Figure 15 This is a schematic diagram of the sealing assembly according to an embodiment of the present invention;

[0113] Figure 16 This is a schematic diagram of the bag support assembly according to an embodiment of the present invention;

[0114] Figure 17 This is a schematic diagram of the bag-pressing assembly according to an embodiment of the present invention;

[0115] Figure 18 This is a schematic diagram of the adhesive application assembly according to an embodiment of the present invention;

[0116] Figure 19 This is a schematic diagram of the automatic feeding module, the feeding AOI appearance inspection module, and the feeding labeling module according to an embodiment of the present invention;

[0117] Figure 20 This is a schematic diagram of the packaging process of the packaging bag according to an embodiment of the present invention;

[0118] Figure 21 This is a side view of the packaging bag in an unopened state according to an embodiment of the present invention;

[0119] Figure 22 This is a side view of the packaging bag in the open state according to an embodiment of the present invention;

[0120] Figure 23 This is a side view of the packaging bag in the pre-compressed but not vacuumed state according to an embodiment of the present invention;

[0121] Figure 24 This is a schematic diagram of the bag support assembly, the packing moving platform, the lower suction bag assembly, and the upper suction bag assembly according to an embodiment of the present invention;

[0122] Figure 25 This is a schematic diagram of the rotation state of the rotating support unit according to an embodiment of the present invention.

[0123] Figure reference numerals: 100, Automatic feeding module; 110, Buffer position; 120, Lateral robot arm; 130, NG port assembly; 200, AOI appearance inspection module; 210, Bottom AOI inspection assembly; 220, Top AOI inspection assembly; 230, Inspection completed station; 300, Automatic flipping module; 310, Feeding shaft; 320, Flipping assembly; 400, Pick-up module; 500, Labeling module; 510, Printer assembly; 520, Label picking assembly; 530, Barcode reader; 540, Robot arm labeling and scanning assembly; 600, Auxiliary material feeding. Modules; 610, Auxiliary material feeding robot assembly; 620, Humidity card; 630, Desiccant; 700, Automatic packaging module; 710, Packaging moving platform; 711, Moving module; 712, Rotary support unit; 713, Packaging platform; 714, Pressing module; 720, Gripping belt assembly; 721, Bag gripping lateral movement module; 722, Bag gripping Z-axis module; 723, Bag gripping claw assembly; 730, Lower suction bag assembly; 731, Lower suction bag Z-axis module; 732, Lower suction bag suction head; 733, Left lower pull bag element; 734, Right lower pull bag element; 740, Upper suction bag assembly; 741 742. Upper suction bag Z-axis module; 743. Upper left bag pull element; 744. Upper right bag pull element; 750. Left center pull side assembly; 751. Left center pull belt transverse axis; 752. Left center pull belt claw; 760. Right center pull side assembly; 761. Right center pull belt transverse axis; 762. Right center pull belt claw; 770. Closing assembly; 771. Closing bag Z-axis; 772. Closing bag X-axis; 773. Closing bag Y-axis; 774. Vacuum assembly; 780. Bag support assembly; 781. Bag support Z-axis; 782. Upper seal; 783. Lower seal; 790. Bag pressing assembly; 791. Bag pressing. Z-axis; 792, Bag pressing roller; 7100, Adhesive application assembly; 7101, Adhesive removal assembly; 7102, Adhesive feeding module; 7103, Adhesive suction assembly; 800, Packaging bag feeding module; 810, Packaging bag storage bin; 820, Storage bin lifting assembly; 830, Material handling robot assembly; 840, Material unloading platform assembly; 900, Automatic unloading module; 910, Unloading module; 920, Unloading buffer position; 1000, Unloading AOI appearance inspection module; 1100, Unloading labeling module; 1110, Feeding assembly; 1120, Outer packaging label printing and peeling module; 1130, Label affixing assembly. Detailed Implementation

[0124] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0125] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0126] like Figure 1 As shown, an automated packaging device for a wafer cassette includes:

[0127] Automatic feeding module 100, AOI appearance inspection module 200, automatic flipping module 300, picking module 400, labeling module 500, auxiliary material feeding module 600, automatic packaging module 700, packaging bag feeding module 800, automatic unloading module 900, unloading AOI appearance inspection module 1000, and unloading labeling module 1100.

[0128] The AOI appearance inspection module 200 is set at the middle station of the automatic feeding module 100, and the automatic flipping module 300 is set at the last station of the automatic feeding module 100 and is used to receive the wafer cassette located on the AOI appearance inspection module 200.

[0129] The auxiliary material feeding module 600 and the labeling module 500 are arranged opposite to each other. The picking module 400 is arranged between the auxiliary material feeding module 600 and the labeling module 500. The feeding side of the picking module 400 is arranged on the wafer box discharge side of the AOI appearance inspection module 200. The auxiliary material feeding module 600 is used to apply auxiliary materials on the wafer box, and the labeling module 500 is used to apply labels on the wafer box.

[0130] The automatic packaging module 700 is located on the wafer box discharge side of the pickup module 400, and the packaging bag feeding module 800 is located on the packaging bag feeding side of the automatic packaging module 700. The automatic packaging module 700 is used to receive the packaging bags in the packaging bag feeding module 800 and put the packaging bags on the outside of the wafer box.

[0131] The automatic unloading module 900 is located on the wafer box discharge side of the automatic packaging module 700 and is used to move the packaged wafer box to the unloading AOI appearance inspection module 1000 or to other equipment.

[0132] The AOI appearance inspection module 1000 is located above the automatic unloading module 900. The AOI appearance inspection module 1000 is used to inspect whether the packaged wafer box is qualified.

[0133] The feeding and labeling module 1100 is located on one side of the automatic feeding module 900. The feeding and labeling module 1100 is used to affix labels to the packaged wafer boxes.

[0134] The automatic loading module 100 is used to receive wafer cassettes. The loading positions of the automatic loading module 100 are compatible with manual loading, AGV (Automated Guided Vehicle) loading, and OHT (Overhead Hoist Transport) loading. The loading interface standard meets the SEMI (Semiconductor Equipment and Materials International) standard. The module has multiple buffer positions to buffer multiple wafer cassettes, with each station complementing the others. A robotic arm is installed on the buffer, which grasps the wafer cassette and moves it to the position of the bottom AOI inspection component 210 for AOI bottom surface inspection.

[0135] The qualified wafer cells will then be placed on the automatic flipping module 300 for further AOI top inspection. After the inspection is completed, the wafer cells will be flipped or not flipped as needed (depending on the actual material unloading requirements).

[0136] Subsequently, the picking robot of the picking module 400 will grab the wafer box and place it at the Mapping detection position of the AOI. The Mapping detection position is used to detect the status of the wafer in the wafer box. After the detection is qualified, the picking robot will grab the wafer box and move the wafer box to the station of the auxiliary material loading module 600 (first move the wafer box to the detection completed station 230, and then move the wafer box to the auxiliary material loading module 600 through the picking module 400).

[0137] The robotic arm of the auxiliary material feeding module 600 will prepare in advance and take out the auxiliary materials (usually desiccants and humidity cards) from the auxiliary material feeding box. After the picking robotic arm picks up the wafer cassette and arrives at the designated workstation, the robotic arm of the auxiliary material feeding module 600 will attach the auxiliary materials to the outside of the wafer cassette.

[0138] After the auxiliary materials are loaded, the picking robot will grab the wafer box and place it on the labeling module 500 station. The labeling module 500 station will automatically complete the printing, peeling, affixing and inspection of the outer packaging label according to the requirements.

[0139] After labeling is completed, the robotic arm of the pick-up module 400 places the wafer cassette into the packaging station of the automated packaging module 700. Prior to this, the packaging mobile platform 710 will pre-open the packaging bag. The packaging bag opening action of the packaging mobile platform 710 is as follows:

[0140] The packaging bag feeding module 800 determines the type of packaging bag to be fed according to the requirements (packaging bags are divided into aluminum foil bags and PE bags, and there are two specifications of packaging bags: stand-up pouches and flat bags. The difference between these two types of packaging bags results in two different packaging methods. The difference is that stand-up pouches are pre-made into the shape to be packaged, while flat bags are not, and are just simple two-layer packaging bags. When using stand-up pouches, they have an open end and a closed end). The packaging bag is picked up from the packaging bag feeding box by the closed end by a robotic arm and placed on a platform. Then, a robotic arm on the top of the automatic packaging module picks up the packaging bag and places it on the packaging platform. On the packaging mobile platform 710 of the automatic packaging module 700, several mechanical axes perform actions such as opening the packaging bag, opening the bag mouth, picking up the robotic arm to put the wafer box into the packaging bag, folding the bag mouth, sealing the bag mouth, extracting gas or protective gas from the bag for cleaning and vacuuming, heat sealing the bag mouth, folding the bag mouth again to flatten it, sealing the folded edges with tape, and sending it to the unloading port. Then the packaging platform transports the automatically packaged wafer box to the unloading port, waiting for the unloading module to pick it up.

[0141] The automatic unloading module 900 transfers the packaged wafer box to the workstation of the unloading AOI appearance inspection module 1000. The camera will capture the status of the packaged wafer box and transmit and store the data.

[0142] Subsequently, at the same workstation, the unloading and labeling module 1100 will print, peel off, and deliver the pre-printed label to the label waiting position. The unloading robot of the unloading and labeling module 1100 will pick up the label from the outer packaging and affix it to the outside of the packaging bag. After completing all the above actions, the unloading robot will store the fully packaged wafer box in the unloading buffer position 920, waiting for manual or AGV retrieval.

[0143] like Figure 2 As shown, the automatic loading module 100 includes buffer positions 110, a traversing robot 120, and an NG port assembly 130. The buffer positions include multiple buffer positions 110, configured for OHT loading, manual loading, or AGV loading according to actual needs. The traversing robot 120 grasps the wafer cassettes and places them at various workstations, where bottom AOI inspection is performed at the bottom AOI inspection assembly 210, and top AOI inspection is performed at the top AOI inspection assembly 220. The wafers are then handed over to the automatic flipping module 300 or placed on the line of the NG port assembly 130. Separate AOI inspection arrangements effectively utilize existing space. The NG port assembly 130 stores wafer cassettes that are inspected for NG (Not Detected) defects and serves as a buffer workstation for NG wafer cassettes.

[0144] like Figure 3As shown, the automatic flipping module 300 includes a feeding shaft 310 and a flipping component 320. After the flipping component 320 and the traversing robot 120 are connected, if the wafer cassette needs to be top-up, no rotation is required. The feeding shaft 310 simply receives the wafer cassette from the flipping component 320 and moves it to the next position. If the wafer cassette needs to be top-side down, it needs to be flipped 90 degrees before the feeding shaft 310 receives the wafer cassette from the flipping component 320 and moves it to the next position. Whether or not to perform the flipping is determined by the actual requirements.

[0145] like Figure 4 As shown, the picking module 400 is a robotic arm module. The robotic arm of the picking module 400 picks up the wafer box and places it into the labeling module 500, the auxiliary material feeding module 600, and the inspection completion station 230. It performs auxiliary material placement (including but not limited to humidity cards and desiccants), labeling and scanning, and AOI mapping inspection. Finally, the robotic arm of the picking module 400 puts the wafer box into the packaging station of the automatic packaging module 700.

[0146] The labeling module 500 includes multiple printer components 510 (multiple printer components 510 meet the needs of printing labels of various sizes), a label picking component 520 (places multiple printed labels in the pre-application position), a barcode reader 530 (the barcode reader 530 is used to compare the information of the printed barcode with the information in the system), and a robotic arm affixing and scanning component 540 (the robotic arm affixing and scanning component 540 is used to determine the accuracy of the affixing position and whether there are any errors in the label affixing).

[0147] The auxiliary material feeding module 600 has multiple auxiliary material feeding stations, including feeding of humidity gauges 620 and desiccants 630. The module also includes an auxiliary material feeding robot assembly 610. The humidity gauge 620 detects the humidity of objects inside the wafer cassette; exceeding a certain humidity level indicates non-compliance. The desiccant 630 absorbs excess moisture from the wafer cassette, maintaining its dryness.

[0148] like Figure 5 As shown, the automatic packaging module 700 and the packaging bag feeding module 800 are arranged adjacent to each other.

[0149] like Figure 6 , 7 As shown, the automatic packaging module 700 includes a packing mobile platform 710, a gripping strap assembly 720, a lower suction bag assembly 730, an upper suction bag assembly 740, a left and middle pull-side assembly 750, a right and middle pull-side assembly 760, a tying assembly 770, a bag support assembly 780, a bag pressing assembly 790, and an adhesive applicator 7100.

[0150] A gripping assembly 720 is mounted on the frame of the automated packaging module 700 and is used to pick up and move packaging bags. A packing moving platform 710 is fixed to the frame of the automated packaging module 700 and is used to place and move wafer cassettes. A lower suction bag assembly 730 and an upper suction bag assembly 740 are respectively mounted on the upper and lower sides of the packing moving platform 710, and are used to open the four corners of the packaging bag. A left-center pull-side assembly 750 and a right-center pull-side assembly 760 are respectively mounted on the left and right sides of the packing moving platform 710, and are used to pull the middle part of the packaging bag.

[0151] The sealing assembly 770 is installed on the loading side of the packing mobile platform 710, such as... Figure 24 As shown, the bag-supporting assembly 780 is positioned on the upper and lower sides of the packaging mobile platform 710, and is offset from the wafer cassette entry direction of the lower suction bag assembly 730 and the upper suction bag assembly 740. The sealing assembly 770 is used to clamp the packaging bag and vacuum it. The bag-supporting assembly 780 is used to pre-press, press, and heat the open side of the packaging bag. The bag-pressing assembly 790 is positioned behind the bag-supporting assembly 780 and is used to fold the open side of the packaging bag downwards. The adhesive-applying assembly 7100 is positioned below the open side of the packaging bag and is used to apply adhesive tape to the packaged wafer cassette.

[0152] like Figure 8 As shown, the packaging mobile platform 710 includes a mobile module 711, a rotating support unit 712, a packaging platform 713, and a pressing module 714.

[0153] like Figure 9 As shown, the packaging bag feeding module 800 includes: a packaging bag storage bin 810, a storage bin lifting assembly 820, a picking robot assembly 830, and a discharging platform assembly 840. The packaging bag storage bin 810 is connected to the storage bin lifting assembly 820, and the storage bin lifting assembly 820 drives the packaging bag storage bin 810 to move up and down. Packaging bags are placed in the packaging bag storage bin 810. The picking robot assembly 830 is located on the discharge side of the packaging bag storage bin 810 and is used to remove packaging bags from the packaging bag storage bin 810. One end of the discharging platform assembly 840 is fixed to the storage bin lifting assembly 820 and is used to place the removed packaging bags.

[0154] like Figure 10 As shown, the gripping assembly 720 includes a bag-gripping lateral movement module 721, a bag-gripping Z-axis module 722, and a bag-gripping claw assembly 723. The bag-gripping lateral movement module 721 is connected to the bag-gripping Z-axis module 722. The bag-gripping claw assembly 723 moves horizontally via the bag-gripping lateral movement module 721 and vertically via the bag-gripping Z-axis module 722.

[0155] like Figure 11As shown, the lower suction bag assembly 730 includes a lower suction bag Z-axis module 731, a lower suction bag head 732, a left lower pull-down bag element 733, and a right lower pull-down bag element 734. The lower suction bag head 732 is fixed to the upper end of the lower suction bag Z-axis module 731 and moves vertically through the lower suction bag Z-axis module 731. The left lower pull-down bag element 733 and the right lower pull-down bag element 734 are respectively fixed to both ends of the lower suction bag head 732.

[0156] like Figure 12 As shown, the upper suction bag assembly 740 includes an upper suction bag Z-axis module 741, an upper suction bag head 742, a left upper pull bag element 743, and a right upper pull bag element 744. The upper suction bag head 742 is fixed to the lower end of the lower suction bag Z-axis module 731, and the upper suction bag head 742 moves vertically through the upper suction bag Z-axis module 741. The left upper pull bag element 743 and the right upper pull bag element 744 are respectively fixed to both ends of the upper suction bag head 742.

[0157] like Figure 13 and Figure 14 As shown, the left center pull assembly 750 includes a left center pull belt transverse axis 751 and a left center pull belt claw 752. The right center pull assembly 760 includes a right center pull belt transverse axis 761 and a right center pull belt claw 762. The left center pull belt claw 752 is fixed to the left center pull belt transverse axis 751 and is used to pull the middle of the packaging bag. The right center pull belt claw 762 is fixed to the right center pull belt transverse axis 761 and is used to pull the middle of the packaging bag.

[0158] like Figure 15 As shown, the sealing assembly 770 includes a Z-axis 771, an X-axis 772, a Y-axis 773 (a pair of Y-axis 773, one on each side), and a vacuum assembly 774. The Z-axis 771, X-axis 772, Y-axis 773, and vacuum assembly 774 are all fixed on the base of the sealing assembly 770. The Z-axis 771 can move up and down relative to the base. The X-axis 772 and Y-axis 773 are both equipped with grippers for clamping the packaging bag. The vacuum assembly 774 is used to vacuum the packaging bag.

[0159] like Figure 16 As shown, the bag support assembly 780 includes a bag support Z-axis 781, an upper seal 782, and a lower seal 783. Both the upper seal 782 and the lower seal 783 are fixed on the bag support Z-axis 781, and the upper seal 782 and the lower seal 783 can move closer to or further away from the bag support Z-axis 781.

[0160] like Figure 17 As shown, the bag-pressing assembly 790 includes a bag-pressing Z-axis 791 and a bag-pressing roller 792. The bag-pressing roller 792 is fixed on the bag-pressing Z-axis 791 and can move up and down along the bag-pressing Z-axis 791.

[0161] like Figure 18 As shown, the adhesive application assembly 7100 includes an adhesive removal assembly 7101, an adhesive delivery module 7102, and an adhesive suction assembly 7103. The adhesive suction assembly 7103 is positioned above the adhesive delivery module 7102. The adhesive removal assembly 7101 provides the adhesive tape, the adhesive delivery module 7102 transports the adhesive tape to the adhesive suction assembly 7103's application station, and the adhesive suction assembly 7103 applies the adhesive tape to the wafer cassette's packaging bag.

[0162] The steps for packaging wafer boxes using the automatic packaging module 700 and the packaging bag feeding module 800 are as follows:

[0163] The storage bin lifting assembly 820 moves the packaging bag storage bin 810 to one of its corresponding positions. The picking robot assembly 830 picks up a packaging bag, swings it up and down, and places it on the upper surface of the unloading platform assembly 840. Simultaneously, a vacuum is created on the surface of the unloading platform assembly 840 to hold the packaging bag in place. Then, the bag-grabbing lateral movement module 721 of the gripping belt assembly 720 moves laterally above the unloading platform assembly 840. After the bag-grabbing Z-axis module 722 descends, the bag-grabbing gripper assembly 723 picks up the packaging bag and places it onto the packaging platform 713 of the packaging moving platform 710 (the rotating support unit 712 can rotate 90 degrees). Figure 25 As shown), at this time, the platform of the rotating support unit 712 is formed by... Figure 8 After rotating 90 degrees, the packaging platform 713 and the rotating support unit 712 move the packaging bag to a suitable position. At this time, due to the tension of the packaging bag itself and the fact that the upper surface of the lower suction head 732 is much lower than the surface of the packaging platform 713, the lower surface of the packaging bag can rest on the upper surface of the lower suction head 732. Then, the lower suction head 732 generates a vacuum and sucks up the packaging bag.

[0164] Then, the bag-gripping Z-axis module 722 and the upper suction Z-axis module 741 simultaneously descend to the upper surface of the packaging bag. The suction cups on the upper left and upper right bag-pulling elements 743 and 744 adhere to the upper surface of the packaging bag and pull it to a certain height. Then, the upper left, upper right, lower left, and lower right bag-pulling elements 733 and 734 clamp the edges of the packaging bag, pulling it to its highest point. At the same time, the upper left, upper right, lower left, and lower right bag-pulling elements 733 and 734 again open the four corners of the packaging bag, maximizing the opening of the bag. Simultaneously, the rotating support unit 712 rotates in the opposite direction to a vertical position. Figure 8As shown. After the left and right center pull belt transverse axes 751 and 761 extend, the left and right center pull belt claws 752 and 762 pull the middle part of the packaging bag, further opening the packaging bag to its maximum. The robotic arm of the pickup module 400 places the wafer cassette into the packaging bag, and the grippers of the packaging platform 713 fix the wafer cassette. After the robotic arm of the pickup module 400 retracts, the left and right center pull belt components 750 and 760 retract. The bag-tying component 770's Z-axis 771 descends vertically, and with the grippers of the bag-tying Y-axis 773 open, the bag-tying X-axis 772 clamps the middle part of the packaging bag (the opposite side of the packaging bag that was just pulled by the left and right center pull belt claws 752 and 762). The grippers on the X-axis of the bag-tying assembly 772 push the packaging bag from the outside. The upper suction bag assembly 740 clamps the packaging bag and moves downward, while the lower suction bag assembly 730 clamps the packaging bag and moves upward. When the upper suction bag assembly 740 and the lower suction bag assembly 730 are very close, the upper sealing 782 and the lower sealing 783 move towards each other simultaneously. After lightly clamping the packaging bag, the lower suction bag assembly 730 and the upper suction bag assembly 740 retract to their original state. The grippers on the Y-axis of the bag-tying assembly 773 retract, and the upper sealing 782 and the lower sealing 783 move towards each other simultaneously again. After heavily clamping the packaging bag, the vacuum assembly 774 performs a gas bath action (i.e., by continuously inflating and deflating the gas to change the gas composition inside the wafer cell). Simultaneously, in coordination with the tightening process of the packaging bag, the moving module 711 moves forward following the state of the packaging bag. Once the vacuum level reaches a certain value, the upper sealing port 782 and lower sealing port 783 begin heating to seal the packaging bag. After the packaging bag is sealed, the moving module 711 remains in the same position, and the upper sealing port 782 and lower sealing port 783 loosen and retract. Then, the bag pressing Z-axis 791 descends, and the bag pressing roller 792 smooths the sealed packaging bag opening. The pressing module 714 extends its clamp to press the sealed bag opening onto the wafer cassette. The moving module 711 then retracts to the adhesive application position. The adhesive removal component 7101 pre-processes the actions of tearing, pulling, and cutting the adhesive tape. The adhesive delivery module 7102, along with the adhesive suction component 7103, obtains the adhesive tape from the adhesive removal component 7101 and attaches it to the outer packaging of the wafer cassette. Subsequently, the moving module 711 moves to the unloading position.

[0165] like Figure 19 As shown, the automatic unloading module 900 includes an unloading module 910 and several unloading buffer positions 920. During operation, the moving module 711 places the wafer cassette on the first unloading buffer position 920 and then leaves. The unloading module 910 lifts the wafer cassette from below the first unloading buffer position 920 to the unloading AOI appearance inspection module 1000 and the unloading labeling module 1100 station.

[0166] The AOI appearance inspection module is used to take pictures of the shape of the sealed packaging bag (with the wafer box inside the packaging bag) using a camera;

[0167] The unloading and labeling module 1100 includes an outer packaging label printing and peeling module 1120, a feeding component 1110, and a label affixing component 1130. During operation, the unloading module 910 places the wafer cassette on the workstation of the unloading AOI appearance inspection module 1000 / unloading and labeling module 1100. First, the camera of the unloading AOI appearance inspection module 1000 captures the state of the packaged wafer cassette. The camera image system compares this image with images of qualified packaged products to determine if it is qualified. Simultaneously, the outer packaging label printing and peeling module 1120 prints the corresponding label. The feeding component 1110, based on the required affixing position, picks up the label from the outer packaging label printing and peeling module 1120 via the label affixing component 1130, moves it to the corresponding position, and affixes the label. After labeling is completed, the unloading AOI appearance inspection module 1000 again takes photos and reads the barcode to confirm the affixing position and the correctness of the barcode, and then uploads the data to the control system.

[0168] The shape changes of packaging bags during the packaging process, such as Figure 20 As shown.

[0169] Ensuring the fit and consistency of the packaging bags during the packaging process is a challenge. This invention addresses this issue by employing a multi-axis coordination method during packaging. The moving module 711 carries the packaging bag or the bag containing the wafer cassette; the bag-gripping Z-axis module 722 / upper bag-suction Z-axis module 741 opens the bag opening; the lower bag-suction Z-axis module 731 opens the bag opening; and the upper sealing 782 / lower sealing 783 pre-pressing, pressing, and vacuuming components 774 are coordinated as follows:

[0170] like Figure 21 and Figure 22 As shown, the total length of the packaging bag is L, and the bottom of the packaging bag (the direction of the bottom is the rearward direction of the Y direction) is (reference) Figure 1 The length occupied by the wafer cassette inside the packaging bag is L1. After the wafer cassette is placed inside the packaging bag, it occupies L3. L2 is the length of the packaging bag after removing the bottom. L2 = L - L1. L3 is the length occupied by the wafer cassette inside the packaging bag. L4 is the length of the diagonal side of the packaging bag after heat sealing. L5 is the distance from the opening of the packaging bag to the seal. L6 is the maximum height of the packaging bag (i.e., the overall height of the packaging bag after it is opened), which is actually greater than the height of the wafer cassette. L7 is the remaining length of the packaging bag after vacuuming. Figure 23As shown, L8 is the projected length of the hypotenuse of the packaging bag in the Y direction after heat sealing. Theoretically, L2 = L3 + L4 + L5, L7 + L6 / 2 = L2 - L3, where L6 is the initial stretching distance of the upper suction bag Z-axis module 741, L6 / 2 is the travel distance in the Z direction of the upper suction bag Z-axis module 741, the bag gripping Z-axis module 722, the upper sealing 782, and the lower sealing 783 during pre-compression, and L4 - L8 is the travel distance of the moving module 711 in the Y direction. After vacuuming, the moving module 711 traveled a distance of L8 + L5 - L7. Simultaneously, according to the Pythagorean theorem, L8... 2 +(L6 / 2) 2 =L4 2 During the packaging process, each motion axis (upper suction bag Z-axis module 741, bag gripping Z-axis module 722, upper sealing 782, and lower sealing 783) ensures that the time for the change of pre-compression L6 / 2 and the travel distance L4-L8 of the moving module 711 are equal. The time for the change of the deformation distance L4-L6 / 2 of the packaging bag caused by vacuuming is kept at a small difference from the time for the change of L8+L5-L7. The actual difference needs to be slightly adjusted according to the different properties of each type of packaging bag, that is, to ensure that the packaging bag is always in a taut state.

[0171] The embodiments of the present invention achieve the following technical effects:

[0172] The automated wafer cassette packaging device of this invention can complete all packaging actions of the wafer cassette in one go, effectively reducing manual labor, improving production efficiency, and ensuring packaging consistency. The automated wafer cassette packaging device of this invention is compatible with multiple brands of FOSB (Front Opening Shipping Box) and FOUP (Front Opening Unified Pod) conforming to SEMI standards. The entire automated packaging device adopts an assembly line design, requiring no manual operation and effectively ensuring the cleanliness level of the packaging.

[0173] The above description is merely a specific embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any substitution of equivalent components or equivalent changes and modifications made within the scope of protection of this patent should still fall within the scope of this patent. Furthermore, the technical features, technical features and technical solutions, and technical solutions in this invention can be freely combined and used.

Claims

1. An automated packaging device for a wafer cassette, characterized in that, include: Automatic feeding module (100), AOI appearance inspection module (200), automatic flipping module (300), picking module (400), labeling module (500), auxiliary material feeding module (600), automatic packaging module (700), packaging bag feeding module (800), automatic unloading module (900), unloading AOI appearance inspection module (1000) and unloading labeling module (1100); The AOI appearance inspection module (200) is located at the middle station of the automatic feeding module (100), and the automatic flipping module (300) is located at the last station of the automatic feeding module (100) and is used to receive the wafer cassette located on the AOI appearance inspection module (200). The auxiliary material feeding module (600) and the labeling module (500) are arranged opposite to each other. The picking module (400) is arranged between the auxiliary material feeding module (600) and the labeling module (500). The feeding side of the picking module (400) is arranged on the wafer cassette discharge side of the automatic flipping module (300). The auxiliary material feeding module (600) is used to apply auxiliary materials on the wafer cassette, and the labeling module (500) is used to apply labels on the wafer cassette. The automatic packaging module (700) is located on the wafer box discharge side of the pickup module (400), and the packaging bag feeding module (800) is located on the packaging bag feeding side of the automatic packaging module (700). The automatic packaging module (700) is used to receive the packaging bag in the packaging bag feeding module (800) and put the packaging bag on the outside of the wafer box. The automatic unloading module (900) is located on the wafer box discharge side of the automatic packaging module (700) and is used to move the packaged wafer box to the unloading AOI appearance inspection module (1000). The AOI appearance inspection module (1000) is located above the automatic unloading module (900), and the AOI appearance inspection module (1000) is used to detect whether the packaged wafer box is qualified. The feeding and labeling module (1100) is located on one side of the automatic feeding module (900), and the feeding and labeling module (1100) is used to affix labels to the packaged wafer cassette.

2. The automated packaging apparatus for a wafer cassette according to claim 1, characterized in that, The automatic packaging module (700) includes: Packaging mobile platform (710), gripping strap assembly (720), lower suction bag assembly (730), upper suction bag assembly (740), left center pull edge assembly (750), right center pull edge assembly (760), sealing assembly (770), bag support assembly (780), bag pressing assembly (790), and adhesive application assembly (7100). The gripping assembly (720) is disposed on the frame of the automatic packaging module (700) and is used to pick up and move the packaging bag; The packing mobile platform (710) is fixed to the frame of the automatic packaging module (700) and is used to place and move the wafer cassette; The lower suction bag assembly (730) and the upper suction bag assembly (740) are respectively disposed on the upper and lower sides of the packaging mobile platform (710), and the lower suction bag assembly (730) and the upper suction bag assembly (740) are used to open the four corners of the packaging bag; The left center pull-edge assembly (750) and the right center pull-edge assembly (760) are respectively disposed on the left and right sides of the packaging moving platform (710), and both the left center pull-edge assembly (750) and the right center pull-edge assembly (760) are used to pull the middle part of the packaging bag. The sealing assembly (770) is disposed on the loading side of the packaging mobile platform (710), and the bag support assembly (780) is disposed on the upper and lower sides of the packaging mobile platform (710), and is offset from the wafer cassette entry direction of the lower suction bag assembly (730) and the upper suction bag assembly (740). The sealing assembly (770) is used to clamp the packaging bag and vacuum the packaging bag, and the bag support assembly (780) is used to pre-press, press and heat the opening side of the packaging bag. The bag-pressing assembly (790) is disposed on the rear side of the bag-supporting assembly (780) and is used to fold the open side of the packaging bag downward; The adhesive application assembly (7100) is disposed on one side of the opening side of the packaging bag and is used to apply tape to the packaged wafer cassette.

3. The automated packaging apparatus for a wafer cassette according to claim 2, characterized in that, The packaged mobile platform (710) includes: The mobile module (711), the rotating support unit (712), the packaging platform (713), and the pressing module (714) are fixed on the mobile module (711), the packaging platform (713), and the pressing module (714). The gripping assembly (720) includes: The bag-grabbing transverse module (721), the bag-grabbing Z-axis module (722), and the bag-grabbing gripper assembly (723) are connected to the bag-grabbing transverse module (721) via the bag-grabbing Z-axis module (722). The bag-grabbing gripper assembly (723) moves horizontally via the bag-grabbing transverse module (721) and vertically via the bag-grabbing Z-axis module (722). The lower suction bag assembly (730) includes: The lower suction bag Z-axis module (731), the lower suction bag head (732), the left lower pull bag element (733), and the right lower pull bag element (734) are provided. The lower suction bag head (732) is fixed at the upper end of the lower suction bag Z-axis module (731). The lower suction bag head (732) moves vertically through the lower suction bag Z-axis module (731). The left lower pull bag element (733) and the right lower pull bag element (734) are respectively fixed at both ends of the lower suction bag head (732). The upper suction bag assembly (740) includes: The upper suction bag Z-axis module (741), the upper suction bag head (742), the upper left pull bag element (743), and the upper right pull bag element (744) are provided. The upper suction bag head (742) is fixed at the lower end of the lower suction bag Z-axis module (731). The upper suction bag head (742) moves vertically through the upper suction bag Z-axis module (741). The upper left pull bag element (743) and the upper right pull bag element (744) are respectively fixed at both ends of the upper suction bag head (742). The left center pull-edge assembly (750) includes: The left center pull belt has a horizontal sliding shaft (751) and a left center pull belt claw (752). The left center pull belt claw (752) is fixed on the left center pull belt horizontal sliding shaft (751) and is used to pull the middle of the packaging bag. The right center pull-edge assembly (760) includes: The right center pull belt has a transverse axis (761) and a right center pull belt claw (762). The right center pull belt claw (762) is fixed on the right center pull belt transverse axis (761) and is used to pull the middle of the packaging bag. The closure assembly (770) includes: The bag-tying Z-axis (771), bag-tying X-axis (772), bag-tying Y-axis (773), and vacuum assembly (774) are all fixed on the base of the bag-tying assembly (770). The bag-tying Z-axis (771) can move up and down relative to the base. The bag-tying X-axis (772) and bag-tying Y-axis (773) are both equipped with grippers for clamping the packaging bag. The vacuum assembly (774) is used to vacuum the packaging bag. The bag support assembly (780) includes: The bag has a Z-axis (781), an upper seal (782), and a lower seal (783). The upper seal (782) and the lower seal (783) are both fixed on the Z-axis (781). The upper seal (782) and the lower seal (783) can move closer to or further away from the Z-axis (781).

4. The automated packaging apparatus for a wafer cassette according to claim 2, characterized in that, The bag-pressing assembly (790) includes: The bag pressing Z-axis (791) and the bag pressing roller (792) are fixed on the bag pressing Z-axis (791) and can move up and down along the bag pressing Z-axis (791); The adhesive assembly (7100) includes: The assembly includes a tape removal component (7101), a tape delivery module (7102), and a tape suction component (7103). The tape suction component (7103) is positioned above the tape delivery module (7102). The tape removal component (7101) is used to provide tape. The tape delivery module (7102) is used to transport the tape to the adhesive application station of the tape suction component (7103) and apply the tape to the packaging bag of the wafer cassette through the tape suction component (7103).

5. The automated packaging apparatus for a wafer cassette according to claim 1, characterized in that, The packaging bag feeding module (800) includes: Packaging bag storage bin (810), storage bin lifting assembly (820), material handling robot assembly (830) and material unloading platform assembly (840); The packaging bag storage bin (810) is connected to the storage bin lifting assembly (820), and the packaging bag storage bin (810) is driven to move up and down through the storage bin lifting assembly (820); The packaging bag is placed in the packaging bag storage bin (810); The material handling robot assembly (830) is located on the discharge side of the packaging bag storage bin (810) and is used to remove the packaging bags from the packaging bag storage bin (810); One end of the material dispensing platform assembly (840) is fixed to the storage bin lifting assembly (820) and is used to place the removed packaging bag.

6. The automated packaging apparatus for a wafer cassette according to claim 1, characterized in that, The automatic feeding module (900) includes: The unloading module (910) and multiple unloading buffer positions (920); The feeding buffer positions (920) are arranged sequentially along the feeding to discharging direction, and the feeding module (910) is located below the feeding buffer positions (920) on the feeding side of the automatic feeding module (900); The material feeding and labeling module (1100) includes: The outer packaging label printing and peeling module (1120), the feeding assembly (1110), and the label affixing assembly (1130) are all included. The outer packaging label printing and peeling module (1120) is used to provide the outer packaging label, which is transported to the label affixing component (1130) via the feeding component (1110) and affixed to the sealed packaging bag by the label affixing component (1130).

7. A control method for an automated wafer cassette packaging apparatus, comprising using the automated wafer cassette packaging apparatus according to any one of claims 1 to 6 to automatically package the wafer cassette, characterized in that, Includes the following steps: The wafer cassette is conveyed to the inspection station of the AOI appearance inspection module (200) through the automatic feeding module (100), and the appearance inspection of the wafer cassette is performed by the automatic flipping module (300) and the AOI appearance inspection module (200). If the appearance inspection is qualified, the wafer box is moved to the auxiliary material feeding module (600) through the picking module (400), and the auxiliary material is attached to the outside of the wafer box; The wafer box is moved to the labeling module (500) by the picking module (400), and the outer packaging label is pasted onto the wafer box. Then, the wafer box is moved to the automatic packaging module (700) by the picking module (400). The packaging bag is conveyed to the automatic packaging module (700) through the packaging bag feeding module (800), and the wafer box is placed into the packaging bag and sealed through the automatic packaging module (700) and the picking module (400). The sealed packaging bag is then transported to the unloading port. The automatic feeding module (900) picks up the sealed packaging bag at the feeding port and transports the sealed packaging bag to the feeding AOI appearance inspection module (1000). After the feeding AOI appearance inspection module (1000) performs appearance inspection on the sealed packaging bag, the feeding labeling module (1100) affixes the outer packaging label to the sealed packaging bag.

8. The control method for the automated wafer cassette packaging apparatus according to claim 7, characterized in that, The wafer cassette is subjected to appearance inspection using the automatic flipping module (300) and the AOI appearance inspection module (200), including: The AOI appearance inspection module (200) performs automatic optical inspection on one side of the wafer cell; Determine whether the wafer cassette needs to be flipped based on external requirements. If it needs to be flipped, the wafer cassette is flipped by the automatic flipping module (300), and the other side of the wafer cassette is automatically optically inspected by the AOI appearance inspection module (200). If it does not need to be flipped, the automatic optical inspection ends. If the automatic optical inspection is qualified, the wafer cassette is moved to the Mapping detection position of the AOI appearance inspection module (200) by the pickup module (400), wherein the Mapping detection is used to detect the state of the wafer in the wafer cassette; If the mapping inspection is qualified, the appearance inspection is qualified; if the automatic optical inspection is unqualified and / or the mapping inspection is unqualified, the appearance inspection is unqualified.

9. The control method for the automated wafer cassette packaging apparatus according to claim 7, characterized in that, The packaging bag is conveyed to the automatic packaging module (700) via the packaging bag feeding module (800), and the wafer cassette is placed into the packaging bag via the automatic packaging module (700) and the picking module (400). The packaged wafer cassette is then transported to the unloading side of the automatic packaging module (700), including: The packaging bag storage bin (810) is moved to the discharge position using the storage bin lifting assembly (820), and the picking robot assembly (830) picks up one of the packaging bags at the discharge position and places the packaging bag on the upper surface of the dispensing platform assembly (840); The packaging bag is adsorbed by the surface of the feeding platform assembly (840), and the bag gripping lateral movement module (721) of the gripping belt assembly (720) moves laterally to above the feeding platform assembly (840); Adjust the platform of the rotating support unit (712) to keep the platform of the rotating support unit (712) level with the platform of the packaging platform (713); The Z-axis module (722) of the bag gripper is controlled to descend, and the bag gripper assembly (723) picks up the packaging bag and places the packaging bag on the packaging platform (713) of the packing mobile platform (710); Move the packaging platform (713) and the rotating support unit (712) to a position where the lower surface of the packaging bag can rest on the upper surface of the lower suction head (732); The packaging bag is adsorbed by the suction head (732); The control bag gripping Z-axis module (722) and the upper suction bag Z-axis module (741) are simultaneously lowered to the upper surface of the packaging bag. The suction cups on the upper left bag pulling element (743) and the upper right bag pulling element (744) are used to hold the upper surface of the packaging bag and pull it to a certain height. After clamping the four corners of the packaging bag by the upper left pull bag element (743), the upper right pull bag element (744), the lower left pull bag element (733), and the lower right pull bag element (734), pull the upper left pull bag element (743), the upper right pull bag element (744), the lower left pull bag element (733), and the lower right pull bag element (734) to open the packaging bag until the opening of the packaging bag is opened to the maximum. Rotate the rotating support unit (712) in the opposite direction to a vertical position; Extend the left and right center pull belt transverse axis (751) and the right center pull belt transverse axis (761), and pull the middle of the packaging bag through the left and right center pull belt claws (752) and the right center pull belt claws (762) to open the packaging bag to its maximum size; The wafer cassette is placed into the packaging bag by the picking module (400), and the wafer cassette is fixed by the grippers of the packaging platform (713). After the pickup module (400) is retracted, the left center pull-edge assembly (750) and the right center pull-edge assembly (760) are retracted; The bag-tying assembly (770) descends vertically along the Z-axis (771) and, with the grippers of the Y-axis (773) open, clamps the middle of the packaging bag using the X-axis (772). The grippers of the bag-tying X-axis (772) push the packaging bag from the outside, the upper suction bag assembly (740) clamps the packaging bag and moves downward, and the lower suction bag assembly (730) clamps the packaging bag and moves upward; When the upper suction bag assembly (740) approaches the lower suction bag assembly (730), the upper seal (782) and the lower seal (783) move towards each other simultaneously. After the upper seal (782) and the lower seal (783) clamp the packaging bag, the packaging bag is pre-compressed, and the lower suction bag assembly (730) and the upper suction bag assembly (740) are withdrawn to their original state. The grippers of the Y-axis (773) of the bag are retracted, and the upper seal (782) and the lower seal (783) move towards each other simultaneously again. After the upper seal (782) and the lower seal (783) clamp the packaging bag, the packaging bag is pressed tightly. The packaging bag is continuously inflated and deflated by the vacuum assembly (774) to create a vacuum in the packaging bag. When the packaging bag is tightened, the moving module (711) moves forward following the state of the packaging bag; When the vacuum degree of the packaging bag reaches the set value, the sealing of the packaging bag is heated by the upper sealing (782) and the lower sealing (783), keeping the position of the moving module (711) unchanged, so that the upper sealing (782) and the lower sealing (783) are loosened and then retracted; The Z-axis (791) of the bag press is lowered, the bag opening of the sealed packaging bag is smoothed by the bag press roller (792), the bag opening of the sealed packaging bag is pressed onto the wafer cassette by the clamp of the pressing module (714), and the moving module (711) is moved to the vicinity of the adhesive application assembly (7100). The tape is torn and cut by the adhesive removal assembly (7101), and the adhesive suction assembly (7103) is moved to the adhesive removal assembly (7101) by the adhesive feeding module (7102) to obtain the tape. The tape is then pasted onto the opening of the sealed packaging bag. The packaged wafer cassette is transported to the unloading side of the automatic packaging module (700) via the moving module (711).

10. The control method for the automated wafer cassette packaging apparatus according to claim 9, characterized in that, Also includes: The total length of the packaging bag is L, the length of the bottom of the packaging bag is L1, the length of the wafer box is L3, L2 is the length of the packaging bag after removing the bottom, L2=L-L1, L4 is the length of the hypotenuse of the packaging bag after heat sealing, L5 is the distance from the opening of the packaging bag to the seal, L6 is the overall height of the packaging bag after it is opened, L7 is the length of the packaging bag remaining after vacuuming, and L8 is the projection length of the hypotenuse of the packaging bag in the Y direction after heat sealing. Therefore, L2=L3+L4+L5, L7+L6 / 2=L2-L3; During pre-compression, the initial stretching distance of the upper suction bag Z-axis module (741) is L6, the moving distance of the upper suction bag Z-axis module (741), the bag gripping Z-axis module (722), the upper seal (782) and the lower seal (783) in the Z direction is L6 / 2, and the moving module (711) in the Y direction is L4-L8, so that the time for the upper suction bag Z-axis module (741), the bag gripping Z-axis module (722), the upper seal (782) and the lower seal (783) to move L6 / 2 is equal to the time for the moving module (711) to move L4-L8; When the packaging bag is vacuumed, the difference between the time it takes for the packaging bag to deform by the vacuuming distance L4-L6 / 2 and the time it takes for the moving module (711) to move by L8+L5-L7 is less than the set difference.

Images