Deposition apparatus

Abstract

The invention discloses a deposition apparatus. The deposition equipment comprises an equipment main body and an air inlet flow uniformizing piece. A process cavity is formed in the equipment body, and the equipment body is further provided with an air inlet end and an air outlet end. The air inlet flow uniformizing piece is arranged on the side, close to the air inlet end, of the process cavity, the air inlet flow uniformizing piece is cylindrical, and a plurality of air inlet flow uniformizing holes are formed in the circumferential direction of the air inlet flow uniformizing piece at intervals and used for being communicated with an air inlet pipeline. In this way, flowing of process gas can be optimized, and the coating quality is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film deposition, in particular to a deposition device. BACKGROUND

[0002] The deposition device can plate a substrate. In the related art, the substrate is placed in a carrier, and the carrier is transferred by a paddle rod. The plating of the substrate requires the introduction of process gas during the process. During the introduction of the process gas, the change in the flow field flow rate in the process chamber of the deposition device will interfere with the plating of the substrate, resulting in a decrease in the plating quality. SUMMARY

[0003] Embodiments of the present application provide a deposition device that can optimize the flow of process gas and improve the plating quality.

[0004] Embodiments of the present application provide a deposition device. The deposition device includes a device main body and a gas inlet uniform flow member. The device main body has a process cavity therein, and the device main body also has a gas inlet end and a gas outlet end. The gas inlet uniform flow member is arranged on one side of the process cavity close to the gas inlet end, and a plurality of gas inlet uniform flow holes are arranged at intervals in the circumferential direction of the gas inlet uniform flow member. The circumferential direction of the gas inlet uniform flow member is arranged at intervals with the inner wall of the device main body, and the gas inlet uniform flow holes are used to communicate with the gas inlet pipeline.

[0005] Optionally, the gas inlet uniform flow member and the gas inlet end surround the gas inlet space, the plurality of gas inlet uniform flow holes communicate the process cavity and the gas inlet space, and the gas inlet space communicates with the gas inlet pipeline.

[0006] Optionally, the deposition device further includes a gas outlet uniform flow member, the gas outlet uniform flow member is arranged on one side of the process cavity close to the gas outlet end, and a plurality of gas outlet uniform flow holes are arranged at intervals in the circumferential direction of the gas outlet uniform flow member. The circumferential direction of the gas outlet uniform flow member is arranged at intervals with the inner wall of the device main body, and the plurality of gas outlet uniform flow holes communicate with the process cavity. The gas outlet uniform flow holes are used to communicate with the gas outlet pipeline.

[0007] Optionally, the gas outlet uniform flow member has a gas outlet cavity therein, the gas outlet cavity communicates with the gas outlet uniform flow hole, and the gas outlet cavity communicates with the gas outlet pipeline.

[0008] Optionally, the side of the gas outlet uniform flow member close to the gas outlet end is arranged at intervals with the gas outlet end and forms a spacing space.

[0009] Optionally, the deposition device further includes a pipeline, one end of the pipeline communicates with the gas outlet pipeline, the other end of the pipeline communicates with and is connected to the gas outlet uniform flow member, the gas outlet uniform flow member is supported in the process cavity through the pipeline, and the pipeline communicates with the gas outlet cavity.

[0010] Optionally, the gas outlet uniform flow part includes a gas outlet uniform flow portion and a gas outlet blocking portion, the gas outlet uniform flow hole is arranged in the gas outlet uniform flow portion, the gas outlet cavity is arranged in the gas outlet uniform flow portion, the pipeline is connected to the side of the gas outlet uniform flow portion close to the gas outlet end, the gas outlet uniform flow portion is extended in a cylindrical shape from the circumference of the gas outlet blocking portion along the direction of the gas inlet end toward the gas outlet end, and a plurality of process windows are opened on the gas outlet blocking portion.

[0011] Optionally, the air outlet uniform flow part includes a cylindrical air outlet uniform flow portion, the air outlet cavity is arranged in the air outlet uniform flow portion, the pipe is connected to the side of the air outlet uniform flow portion close to the air outlet end, the air outlet uniform flow portion is extended in the direction from the air inlet end toward the air outlet end, and the air outlet uniform flow portion is through-arranged in the direction from the air inlet end toward the air outlet end.

[0012] Optionally, a furnace door is provided at the air inlet end of the equipment body, and the air inlet uniform flow component includes an air inlet blocking portion and an air inlet uniform flow portion, the air inlet uniform flow hole is provided in the air inlet uniform flow portion, and the air inlet uniform flow portion is extended in a cylindrical shape from the circumference of the air inlet blocking portion along the air outlet end toward the air inlet end, and the air inlet uniform flow portion is installed on the furnace door on the side close to the air inlet end.

[0013] Optionally, the deposition apparatus further comprises a carrier and a paddle, wherein the carrier is carried on the paddle, and the paddle is used to transfer the carrier from the process chamber.

[0014] The beneficial effects of the present application are: different from the prior art, by providing an air intake uniform flow member, and providing the air intake uniform flow holes in the circumference of the air intake uniform flow member. The process gas enters the process chamber from the air intake space through the air intake uniform flow holes located in the circumference of the air intake uniform flow member. On the one hand, the provision of multiple air intake uniform flow holes can have a uniform flow effect on the incoming process gas. On the other hand, since the air intake uniform flow holes are provided in the circumference of the air intake uniform flow member, the direct impact of the process gas on the carrier and the substrate on the carrier is reduced, thereby reducing the impact of the process gas on the bonding of the substrate and the carrier and the substrate coating, thereby solving the problems of a high proportion of dark substrates, plating leakage and excessively thick deposition on local substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of an embodiment of a deposition device of the present application;

[0016] Figure 2 yes Figure 1 A schematic diagram of part of the structure of the deposition equipment shown;

[0017] Figure 3 yes Figure 1 Schematic diagram of the coordination between the furnace door and the air inlet uniform flow member in the deposition equipment shown;

[0018] Figure 4 yes Figure 3 A schematic diagram of the split structure of the illustrated embodiment;

[0019] Figure 5 is Figure 1 Figure 2 is a structural schematic diagram of an embodiment of the out-gas uniform flow device in the deposition device shown in Figure 1 and the device body;

[0020] Figure 6 is Figure 1 Figure 3 is a structural schematic diagram of another embodiment of the out-gas uniform flow device in the deposition device shown in Figure 1 and the device body. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0022] The inventors of the present application found in the research process that in the film plating process of a substrate, the substrate has a high proportion of dark patches, plating omissions, and local over-thick deposition of the substrate in photoluminescence detection. Through the research of the inventors, it was found that the generation of the technical problem is because the flow field and flow rate of the process gas in the process cavity change to cause the local pressure change in the process cavity, and such change can cause the problems of the dark patches of the substrate, plating omissions, and local over-thick deposition of the substrate. The problems in the adhesion of the substrate and the carrier can cause the local potential change of the substrate, causing the abnormal deposition rate of the thin film, and further causing the problem of the high proportion of the dark patches of the substrate. The inventors further simulated and analyzed the flow field and flow rate of the process gas in the process cavity, found that the flow field disturbance in the furnace opening area is abnormally high, causing the decrease in the film plating uniformity of the substrate. The inventors further researched the deposition device structure of the related art and found that the gas in the deposition device is extracted along a straight line, and the gas flow directly impacts the substrate, causing the problems of the dark patches and uneven film plating. And the setting of the uniform flow device in the related art needs to open through holes on the uniform flow device to install the paddle rod, the observation window, the electrode feed rod, and the auxiliary heating rod and other components. These through holes can cause the invalidation of the uniform flow effect of the uniform flow device. In order to improve the above technical problems, the present application can provide the following embodiments.

[0023] In combination with Figure 1 and Figure 2Embodiments of the present application provide a deposition device 1. The deposition device 1 comprises a device body 10 and an inlet flow uniformizer 13. The device body 10 has a process cavity 101. The process cavity 101 can be used to accommodate process equipment such as a paddle 15 and a carrier 16. The process cavity 101 maintains a certain vacuum degree under the action of a negative pressure pump or the like to meet the process conditions of film plating. The process cavity 101 can also be connected to process gas to provide corresponding conditions for the film plating of the substrate. The device body 10 has an inlet end and an outlet end. The inlet flow uniformizer 13 is arranged on one side of the process cavity 101 close to the inlet end. The inlet flow uniformizer 13 is circumferentially spaced apart from the inner wall of the process cavity 101 and is provided with a plurality of inlet flow uniformizing holes 1321. The inlet flow uniformizing holes 1321 can be directly or indirectly connected to an inlet pipeline. The plurality of inlet flow uniformizing holes 1321 are connected to the process cavity 101. The axis direction of the inlet flow uniformizing holes 1321 is perpendicular to the direction of the inlet end towards the outlet end, for example, the axis direction of the inlet flow uniformizing holes 1321 can be towards the side wall of the process cavity 101. The area corresponding to the projection of the carrier 16 on the inlet flow uniformizer 13 is not provided with inlet flow uniformizing holes 1321.

[0024] Further, the inlet flow uniformizer 13 and the inlet end form an inlet space, and the plurality of inlet flow uniformizing holes 1321 connect the process cavity 101 and the inlet space. The inlet space is connected to the inlet pipeline, and the inlet pipeline can be connected to a gas source. The process gas is first introduced into the inlet space through the inlet pipeline, and then diffused in the inlet space and enters the process cavity 101 through the circumferentially arranged inlet flow uniformizing holes 1321. In this way, after the process gas enters the process cavity 101, most of the high-speed process gas is mainly distributed on the circumferential side of the inlet flow uniformizer 13, and the gas flow direction of the gas sprayed from the inlet flow uniformizing holes 1321 is towards the inner wall of the process cavity 101, thereby reducing the impact of the process gas on the carrier 16 and the substrate on the carrier 16.

[0025] By arranging the inlet flow uniformizer 13 and the inlet flow uniformizing holes 1321 on the circumferential side of the inlet flow uniformizer 13, the process gas needs to pass through the inlet flow uniformizing holes 1321 when entering the process cavity 101. On the one hand, the plurality of inlet flow uniformizing holes 1321 can have the effect of uniformizing the flow of the entering process gas; on the other hand, since the inlet flow uniformizing holes 1321 are arranged on the circumferential side, the impact of the process gas directly on the carrier 16 and the substrate on the carrier 16 is reduced, thereby reducing the influence of the process gas on the adhesion of the substrate and the carrier 16, and reducing the problems of high dark patch ratio and uneven film plating.

[0026] In some embodiments, the deposition apparatus 1 comprises a carrier 16 and a paddle 15, the carrier 16 is carried on the paddle 15, and the paddle 15 is used to turn the carrier 16 into or out of the process cavity 101. The paddle 15 can transfer the carrier 16 from inside the process cavity 101 to the outside, or transfer the carrier 16 from the outside into the process cavity 101, and the paddle 15 can support the carrier 16 in the process cavity 101. The periphery of the carrier 16 and the paddle 15 is spaced from the side wall of the process cavity 101. The process gas can diffuse everywhere in the process cavity 101 to meet the process conditions of the coating process. By arranging the gas inlet flow uniformizing member 13, the problems of direct impact of the process gas on the substrate and uneven distribution are reduced.

[0027] In combination Figure 3 and Figure 4 In some embodiments, the gas inlet end of the apparatus body 10 is provided with a furnace door 19. The gas inlet flow uniformizing member 13 comprises a gas inlet blocking part 131 and a gas inlet flow uniformizing part 132. The gas inlet flow uniformizing holes 1321 are arranged on the gas inlet flow uniformizing part 132, and the gas inlet flow uniformizing part 132 is arranged in a cylindrical shape extending from the periphery of the gas inlet blocking part 131 along the direction from the gas outlet end to the gas inlet end. The side of the gas inlet flow uniformizing part 132 close to the gas inlet end is mounted on the furnace door 19. The gas inlet flow uniformizing part 132, the gas inlet blocking part 131 and the furnace door 19 form a gas inlet space. The furnace door 19 can be provided with a gas inlet assembly, and the process gas enters the gas inlet space through the gas inlet assembly. The gas inlet blocking part 131 can prevent the process gas from directly blowing on the carrier 16 and the substrate on the carrier 16. The process gas in the gas inlet space can enter the process cavity 101 from the gas inlet flow uniformizing holes 1321 on the gas inlet flow uniformizing part 132, and the gas inlet can be avoided on the carrier 16. In this case, the axis direction of the gas inlet flow uniformizing holes 1321 can be towards the side wall of the process cavity 101. The axis direction of the gas inlet flow uniformizing holes 1321 can be perpendicular to the direction from the gas inlet end to the gas outlet end.

[0028] Further, the gas inlet flow uniformizing holes 1321 are arranged in at least one circle along the periphery of the gas inlet flow uniformizing part 132, and on this basis, a plurality of circles can be arranged along the direction from the gas inlet end to the gas outlet end. The plurality of gas inlet flow uniformizing holes 1321 can be arranged in correspondence with each other and in a flush manner, or can be arranged in a staggered manner, which is not specifically limited here.

[0029] Optionally, in other embodiments, the air inlet flow uniformizer 13 can be disc-shaped, and the air inlet flow uniformizing portion 132 is annularly arranged around the outer periphery of the disc-shaped air inlet blocking portion 131. In this case, the axis direction of the air inlet flow uniformizing hole 1321 is perpendicular to the direction of the air inlet end towards the air outlet end (i.e. the axis direction of the device body 10). Alternatively, the axis direction of the air inlet flow uniformizing hole 1321 can be arranged at an angle with the direction of the air inlet end towards the air outlet end, and the angle is less than 45°. The air inlet flow uniformizing hole 1321 can be arranged in a circle on a preset diameter along the circumferential direction of the air inlet flow uniformizing portion 132. The air inlet flow uniformizing hole 1321 can be arranged in multiple circles on the air inlet flow uniformizing portion 132 with different preset diameters. The multiple circles of air inlet flow uniformizing holes 1321 can be arranged in correspondence with each other in a flush manner, or arranged in a staggered manner, which is not specifically limited herein.

[0030] In combination Figure 1 and Figure 2 In some embodiments, the deposition device 1 further comprises an air outlet flow uniformizer 14 arranged on the side of the process chamber 101 close to the air outlet end. The circumferential direction of the air outlet flow uniformizer 14 is spaced apart from the inner wall of the device body 10. The circumferential direction of the air outlet flow uniformizer 14 is spaced apart and arranged with a plurality of air outlet flow uniformizing holes 1421. Among them, the axis direction of the air outlet flow uniformizing hole 1421 is perpendicular to the direction of the air inlet end towards the air outlet end, for example, the axis direction of the air outlet flow uniformizing hole 1421 can also be towards the side wall of the process chamber 101. The area corresponding to the projection of the carrier 16 on the air outlet flow uniformizer 14 is not provided with air outlet flow uniformizing holes 1421. The air outlet flow uniformizing hole 1421 can be directly or indirectly communicated with the air outlet pipeline, and the air outlet pipeline can be connected with a negative pressure pump or the like.

[0031] In some embodiments, the air outlet flow uniformizer 14 and the air outlet end of the device body 10 form an air outlet cavity. The air outlet flow uniformizer 14 is mounted on the air outlet end of the device body.

[0032] In some embodiments, the air outlet flow uniformizer 14 has an air outlet cavity inside, the air outlet cavity is communicated with the air outlet flow uniformizing hole 1421, and the air outlet cavity is communicated with the air outlet pipeline. The gas in the process chamber 101 can be sucked into the air outlet cavity through the air outlet flow uniformizing hole 1421. The gas in the air outlet cavity can be directly or indirectly discharged from the air outlet pipeline. By separately arranging the air outlet cavity to discharge the gas, the interference of the components close to the air outlet end on the air outlet process can be reduced, so that a stable and uniform negative pressure can be generated at the air outlet flow uniformizing hole 1421, thereby uniformly discharging the gas in the process chamber 101. If the air outlet flow uniformizing hole 1421 of the air outlet flow uniformizer 14 is throughly arranged, the air outlet flow uniformizer 14 and the air outlet end form an air outlet space, and the air outlet process will be interfered by various components of the air outlet end. Moreover, the flow field near the air outlet flow uniformizer 14 is sensitive to the fluctuation of the pumping speed of the vacuum pump and the air suction pipeline, which is not conducive to the improvement of the air outlet uniformity.

[0033] In some embodiments, the deposition apparatus further comprises a pipe 143, one end of the pipe 143 is in communication with the gas outlet pipe of the apparatus body 10, and the other end of the pipe 143 is in communication with the gas outlet cavity in the gas outlet flow uniformizer 14. The gas outlet flow uniformizer 14 is supported in the process cavity 101 by the pipe 143, and the circumference of the gas outlet flow uniformizer 14 is spaced apart from the inner wall of the apparatus body 10. The process gas can enter the gas outlet flow uniform hole 1421 through the space between the gas outlet flow uniformizer 14 and the inner wall of the apparatus body 10. The pipe 143 is located in the space 18, which can support the gas outlet flow uniformizer 14 in the process cavity 101 on the one hand, and can communicate the gas outlet cavity with the gas outlet pipe on the other hand, so that the gas in the process cavity can enter the gas outlet cavity through the gas outlet flow uniform hole 1421, then pass through the pipe 143, and finally be discharged through the gas outlet pipe. Through the above-mentioned manner, the exhaust process can be relatively independent, and the interference of the exhaust process can be reduced.

[0034] In combination Figure 1 In some embodiments, the gas outlet flow uniformizer 14 is spaced apart from the gas outlet end to form a space 18. Spacing the gas outlet flow uniformizer 14 from the gas outlet end reduces the direct dissipation of heat in the process cavity 101 from the gas outlet end. The process gas first enters the gas outlet flow uniformizer 14 through the gas outlet flow uniform hole 1421, and then enters the pipe 143 to be discharged by the negative pressure pump and the pipe. The pipe 143 communicates the gas outlet flow uniformizer 14 and the vacuum pump. The gas outlet flow uniformizer 14 can be installed on the side wall of the process cavity 101 or the gas outlet end by other components, which is not specifically limited here.

[0035] The gas outlet flow uniformizer 14 is connected with the external negative pressure pump equipment, etc. In the process of air exhaust, the process gas can enter the gas outlet cavity of the gas outlet flow uniformizer 14 from the gas outlet flow uniform hole 1421, and then be discharged by the negative pressure pump and the pipe. The gas outlet flow uniform hole 1421 is located on the side wall of the gas outlet flow uniformizer 14, so that the process gas can be deviated to the area close to the side wall in the process cavity 101 in the process of discharge, thereby reducing the interference of the process gas with the adhesion of the substrate and the carrier in the process of discharge.

[0036] In combination with the foregoing embodiments, the inlet flow uniformizing member 13 and the outlet flow uniformizing member 14 are provided, and the inlet flow uniformizing holes 1321 and the outlet flow uniformizing holes 1421 are respectively arranged on the side walls of the inlet flow uniformizing member 13 and the outlet flow uniformizing member 14. The flow direction of the process gas in the process chamber 101 is guided by the inlet flow uniformizing member 13, so that the process gas directly impacting the carrier 16 and the substrate on the carrier 16 is reduced. The outlet flow uniformizing member 14 is provided to reduce the changes in the flow field and the flow rate of the process gas near the vacuum pump caused by the fluctuation of the pumping speed of the vacuum pump. The process gas can enter the carrier 16 by diffusion. In the above manner, the flow field distribution of the process gas in the process chamber 101 can be improved, the impact of the flow of the process gas on the substrate is reduced, and thus the problems such as a high proportion of dark patches, plating leakage, and uneven plating film caused thereby are reduced.

[0037] In combination with Figure 5 In some embodiments, the outlet flow uniformizing member 14 includes an outlet flow uniformizing portion 142 and an outlet flow blocking portion 141, and the outlet flow uniformizing holes 1421 are arranged on the outlet flow uniformizing portion 142. An outlet flow cavity is arranged in the outlet flow uniformizing portion 142, and a pipe 143 is connected to the outlet flow uniformizing portion 142 near the side of the outlet end. The outlet flow uniformizing portion 142 extends in a cylindrical shape from the circumferential direction of the outlet flow blocking portion 141 to the direction from the inlet end to the outlet end. The process gas in the process chamber 101 can enter the outlet flow cavity in the outlet flow uniformizing portion 142 from the outlet flow uniformizing holes 1421 on the outlet flow uniformizing portion 142, and then be discharged through the pipe 143, thereby reducing the local pressure difference fluctuation at the outlet end. In this case, the axis direction of the outlet flow uniformizing holes 1421 can be toward the side wall of the process chamber 101. The axis direction of the outlet flow uniformizing holes 1421 can be perpendicular to the direction from the inlet end to the outlet end. Further, the outlet flow uniformizing holes 1421 can be arranged in a circle along the circumferential direction of the outlet flow uniformizing portion 142, and on this basis, multiple circles can be arranged in the direction from the inlet end to the outlet end. The multiple circles of outlet flow uniformizing holes 1421 can be arranged in correspondence with each other and in a flat manner, or can be arranged in a staggered manner, which is not specifically limited herein.

[0038] Alternatively, the outlet flow uniformizing member 14 is arranged in a disc shape, and the outlet flow uniformizing portion 142 is arranged in a ring shape and is sleeved on the outer periphery of the disc-shaped outlet flow blocking portion 141. In this case, the axis direction of the outlet flow uniformizing holes 1421 can be along the direction from the inlet end to the outlet end (i.e., the axis direction of the equipment body 10). Alternatively, the axis direction of the outlet flow uniformizing holes 1421 can be arranged at an angle to the direction from the inlet end to the outlet end, and the angle is less than 45°. The outlet flow uniformizing holes 1421 can be arranged in a circle along the circumferential direction of the inlet flow uniformizing portion 132 at a predetermined diameter. The outlet flow uniformizing holes 1421 can be arranged in multiple circles at different predetermined diameters on the outlet flow uniformizing portion 142. The multiple circles of outlet flow uniformizing holes 1421 can be arranged in correspondence with each other and in a flat manner, or can be arranged in a staggered manner, which is not specifically limited herein.

[0039] In some embodiments, a plurality of process windows 1411 are formed in the gas outlet blocking portion 141. The process windows 1411 of the gas outlet blocking portion 141 can be used for the paddle rod 15, the electrode feed rod, and the auxiliary heating rod to pass through. The process windows 1411 can also be used to set the observation window. The components passing through the process windows 1411 or the sealing members can be sealed. The process gas does not pass through the gas outlet blocking portion 141.

[0040] In combination Figure 6 In some embodiments, the gas outlet uniform flow member 14 includes a cylindrical gas outlet uniform flow portion 142. A gas outlet cavity is arranged in the gas outlet uniform flow portion 142, and a pipe 143 is connected to the side of the gas outlet uniform flow portion 142 close to the gas outlet end. The gas outlet uniform flow portion 142 extends in the direction from the gas inlet end to the gas outlet end, and the gas outlet uniform flow portion 142 is arranged through in the direction from the gas inlet end to the gas outlet end. In other words, the gas outlet uniform flow member 14 is only provided with the gas outlet uniform flow portion 142, and is not provided with the aforementioned gas outlet blocking portion 141. The through-arranged gas outlet uniform flow member 14 leaves more process assembly movable space. In the case of increasing the auxiliary components inserted from the furnace tail during the process, the gas outlet uniform flow member 14 can not need to be further structurally changed.

[0041] In some embodiments, the shapes of the gas inlet uniform flow member 13 and the gas outlet uniform flow member 14 can be hollow cylindrical, hollow circular truncated cone, or hollow circular ring structure, etc.

[0042] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A deposition device, characterized in that: include: An equipment body, wherein the equipment body has a process cavity, and the equipment body also has an air inlet end and an air outlet end; An air intake flow equalizer is provided on one side of the process chamber close to the air intake end, and a plurality of air intake flow equalizer holes are provided at circumferential intervals on the air intake flow equalizer. The air intake flow equalizer is circumferentially spaced from the inner wall of the equipment body, and the plurality of air intake flow equalizer holes are connected to the process chamber, and the air intake flow equalizer holes are used to connect to the air intake pipe.

2. The deposition apparatus according to claim 1, wherein: The air intake uniform flow member and the air intake end are surrounded to form an air intake space, the multiple air intake uniform flow holes communicate with the process chamber and the air intake space, and the air intake space is communicated with the air intake pipeline.

3. The deposition apparatus according to claim 1, wherein: The deposition equipment also includes a gas outlet uniform flow component, which is arranged on one side of the process chamber close to the gas outlet end. The gas outlet uniform flow component is circumferentially spaced apart with a plurality of gas outlet uniform flow holes. The gas outlet uniform flow component is circumferentially spaced apart from the inner wall of the equipment body. The plurality of gas outlet uniform flow holes are connected to the process chamber, and the gas outlet uniform flow holes are used to be connected to the gas outlet pipe.

4. The deposition apparatus according to claim 3, wherein: The air outlet uniform flow member has an air outlet cavity inside, the air outlet cavity is communicated with the air outlet uniform flow hole, and the air outlet cavity is communicated with the air outlet pipe.

5. The deposition apparatus according to claim 4, wherein: The side of the air outlet uniform flow member close to the air outlet end is spaced apart from the air outlet end and forms a spacing space.

6. The deposition apparatus according to claim 5, wherein: The deposition device also includes a pipeline, one end of which is connected to the gas outlet pipeline, and the other end of the pipeline is connected to the gas outlet flow equalizer. The gas outlet flow equalizer is supported in the process chamber through the pipeline, and the pipeline is connected to the gas outlet cavity.

7. The deposition apparatus according to claim 6, wherein: The gas outlet uniform flow component includes a gas outlet uniform flow portion and a gas outlet blocking portion, the gas outlet uniform flow hole is arranged in the gas outlet uniform flow portion, the gas outlet cavity is arranged in the gas outlet uniform flow portion, the pipeline is connected to the side of the gas outlet uniform flow portion close to the gas outlet end, the gas outlet uniform flow portion is extended in a cylindrical shape from the circumference of the gas outlet blocking portion along the gas inlet end toward the gas outlet end, and a plurality of process windows are opened on the gas outlet blocking portion.

8. The deposition apparatus according to claim 6, wherein: The air outlet uniform flow component includes an air outlet uniform flow portion arranged in a cylindrical shape, the air outlet cavity is arranged in the air outlet uniform flow portion, the pipe is connected to the side of the air outlet uniform flow portion close to the air outlet end, the air outlet uniform flow portion is extended in the direction from the air inlet end toward the air outlet end, and the air outlet uniform flow portion is through-arranged in the direction from the air inlet end toward the air outlet end.

9. The deposition apparatus according to claim 2, wherein: The air inlet end of the equipment body is provided with a furnace door, and the air inlet flow equalizing part includes an air inlet blocking part and an air inlet flow equalizing part. The air inlet flow equalizing hole is provided in the air inlet flow equalizing part, and the air inlet flow equalizing part extends in a cylindrical shape from the circumference of the air inlet blocking part along the air outlet end toward the air inlet end, and the air inlet flow equalizing part is installed on the furnace door on the side close to the air inlet end.

10. The deposition device according to any one of claims 1 to 9, characterized in that: The deposition apparatus further includes a carrier and a paddle rod, wherein the carrier is carried on the paddle rod, and the paddle rod is used to transfer the carrier from the process chamber.

Images