Wafer transmission device for electroplating equipment
By setting the buffer zone inside the wafer transfer device in the electroplating equipment, the robot directly connects to the cleaning module and the electroplating module, solving the problems of large footprint and low transfer efficiency, and achieving more efficient wafer transfer and electroplating operations.
Patent Information
- Application Number
- CN202511242946.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2025-10-17
AI Technical Summary
The separate design of EFEM, cache device and electroplating module in existing electroplating equipment leads to problems of large footprint and low wafer transfer efficiency.
The buffer zone is located inside the wafer transfer device, and the robot directly interfaces with the feeding module, cleaning module, and electroplating module, reducing the number of transfer links. The use of a retractable extension mechanism and drive mechanism improves the transfer flexibility.
It reduces the footprint of electroplating equipment, improves wafer transmission efficiency and accuracy, improves electroplating operation efficiency, and increases transfer efficiency by more than 30%.
Smart Images
Figure CN120797151A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor equipment, in particular to a wafer conveying device for electroplating equipment. BACKGROUND
[0002] The electroplating equipment usually comprises an EFEM (or a wafer conveying device) and an electroplating module. In the prior art, the EFEM is designed separately from the electroplating module, and before the wafer or the dummy wafer in the EFEM is delivered into the electroplating module, the wafer needs to be buffered between the EFEM and the electroplating module. Therefore, a buffering device is usually arranged between the EFEM and the electroplating module. That is, when the electroplating equipment is designed, the structural design of the EFEM, the buffering device and the electroplating module needs to be considered. In addition, the electroplating equipment is divided into the EFEM, the electroplating module and the buffering device between the two, which increases the floor area and occupies more equipment space. Moreover, due to the increase of the transmission link, the wafer conveying efficiency is reduced. SUMMARY
[0003] The present application aims to provide a wafer conveying device for electroplating equipment, which reduces the floor area and improves the conveying efficiency.
[0004] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:
[0005] A wafer conveying device for electroplating equipment, the electroplating equipment further comprises a feeding module connected to one side of the wafer conveying device, a cleaning module connected to the other side of the wafer conveying device and an electroplating module connected to the cleaning module, the wafer conveying device for electroplating equipment comprises a frame, a buffer area and a mechanical hand, the buffer area and the mechanical hand are both arranged in the frame, the buffer area can store a dummy wafer or / and a wafer; the mechanical hand can grab the dummy wafer or the wafer, the mechanical hand can extend out of the frame or retract into the frame, and respectively dock with the buffer area, the feeding module and the cleaning module to transfer the dummy wafer or the wafer.
[0006] In some possible implementation manners, the mechanical hand comprises an extendable extension mechanism, the extension mechanism can extend out of the frame or retract into the frame along the Y direction.
[0007] In some possible implementation manners, the extension mechanism comprises a base, a first arm part and a second arm part which are rotationally connected with each other, the first arm part and the second arm part can be arranged in a stacked manner from top to bottom along the Z direction and can be independently unfolded, and the second arm part is connected with a carrying part for carrying the dummy wafer or the wafer.
[0008] In some possible implementation manners, the mechanical arm further comprises a driving mechanism capable of driving the stretching mechanism to move in the X direction and / or the Z direction.
[0009] In some possible implementation manners, the driving mechanism comprises a horizontal driving mechanism and a vertical driving mechanism fixed on the horizontal driving mechanism, and the stretching mechanism is fixed on the vertical driving mechanism.
[0010] The horizontal driving mechanism is arranged in the X direction, and the horizontal driving mechanism is correspondingly connected to the mounting plates arranged on both sides of the frame in the X direction.
[0011] The horizontal driving mechanism drives the vertical driving mechanism to move in the X direction, so as to drive the stretching mechanism to move in the X direction through the vertical driving mechanism, and the vertical driving mechanism is capable of driving the stretching mechanism to move in the Z direction.
[0012] In some possible implementation manners, the wafer transfer device is internally provided with a wafer positioning area corresponding to and non-interfering with the mechanical arm, and arranged on one side of the mounting plates arranged on both sides of the frame in the X direction or between the two mounting plates.
[0013] In some possible implementation manners, the buffer area is arranged in the wafer positioning area, and the lowest position of the wafer or the dummy wafer loaded in the buffer area is not less than the lowest position to which the mechanical arm can move downward, so that the mechanical arm can take and place the wafer or the dummy wafer at the lowest position of the buffer area.
[0014] In some possible implementation manners, the wafer positioning area is further provided with an edge finder above the buffer area, and the mechanical arm can perform edge finding operation through the edge finder after taking the wafer or the dummy wafer from the buffer area.
[0015] In some possible implementation manners, the cleaning module is arranged on one side of the wafer transfer device for the electroplating equipment in the Y direction, and a door body is detachably connected to the side of the frame close to the cleaning module in the Y direction.
[0016] In some possible implementation manners, the cleaning module is arranged on one side of the wafer transfer device for the electroplating equipment in the Y direction, and a corresponding window is arranged on the side of the frame close to the cleaning module in the Y direction, and the window allows the mechanical arm to pass through the window to deliver the wafer to the cleaning module.
[0017] In some possible implementation manners, the cleaning module is provided with a plurality of openings corresponding to the windows and a plurality of station groups corresponding to the openings, the station group includes two stations arranged side by side along the Y direction, and the opening allows the mechanical hand passing through the window to further pass through the opening to transfer the wafer between the corresponding station group.
[0018] In some possible implementation manners, a center calibration module is arranged at the window, the mechanical hand can be docked with the center calibration module, and the center calibration module is used for center calibration of the wafer or the wafer.
[0019] Advantages of the present application:
[0020] 1. In the electroplating equipment, the cleaning module and the electroplating module are generally integrated structures, and the wafer transfer device is directly connected with the cleaning module, which is equivalent to directly connecting the wafer transfer device with the electroplating module through the cleaning module, so that a buffer device is not needed between the wafer transfer device and the electroplating module, the floor area of the electroplating equipment is reduced, and the cost and space are saved.
[0021] 2. The buffer area is arranged in the wafer transfer device, so that the wafer transfer device is directly connected with the electroplating equipment through the cleaning module, the wafer transfer link is reduced, and the efficiency and accuracy of wafer transfer are improved.
[0022] 3. The frame of the wafer transfer device is arranged to be directly connected with the electroplating module through the cleaning module to transfer the wafer, so that the structure of the wafer transfer device is more reasonable, which is helpful to develop more advanced electroplating equipment, especially to improve the wafer transfer efficiency. Compared with the prior art, after optimizing the structure of the wafer transfer device, the wafer transfer efficiency can be improved by more than 30% when the wafer is directly transferred through the cleaning module and the electroplating module, and the electroplating operation efficiency of the wafer is further improved. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is a schematic view of the electroplating equipment provided by the embodiment of the present application;
[0024] Figure 2 is a top view of the electroplating equipment provided by the embodiment of the present application;
[0025] Figure 3 is a schematic view of the wafer transfer device for the electroplating equipment from one perspective provided by the embodiment of the present application;
[0026] Figure 4 is a schematic view of the wafer transfer device for the electroplating equipment from another perspective provided by the embodiment of the present application;
[0027] Figure 5is another perspective under the specific embodiment provided by the present application for the schematic diagram of wafer conveying device for electroplating equipment without door body and protection plate;
[0028] Figure 6 is the first arm part of the stretching mechanism provided by the specific embodiment of the present application.
[0029] Figure 7 is the second arm part of the stretching mechanism provided by the specific embodiment of the present application.
[0030] Figure 8 is the schematic diagram of edge finder and buffer provided by the specific embodiment of the present application.
[0031] Figure 9 is the front view of edge finder and buffer provided by the specific embodiment of the present application.
[0032] In the figure:
[0033] 100, loading module; 200, cleaning module; 210, first station; 220, second station; 240, station group; 300, wafer conveying device; 400, fastener; 500, wafer; 600, dummy sheet; 700, wafer positioning area; 710, first area; 720, second area; 730, third area;
[0034] 1, frame; 11, door body; 12, window; 13, protection plate; 2, buffer area; 21, frame; 22, placement layer; 3, mechanical hand; 31, horizontal driving mechanism; 32, vertical driving mechanism; 33, stretching mechanism; 331, base; 332, first arm part; 333, second arm part; 34, driving mechanism; 4, edge finder. DETAILED DESCRIPTION
[0035] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0036] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0037] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0038] As shown in Figures 1-9 The present embodiment provides a wafer transfer device for a plating equipment, the plating equipment further comprises a feeding module 100 connected with one side of the wafer transfer device 300, a cleaning module 200 connected with the other side of the wafer transfer device 300, and a plating module connected with the cleaning module 200. The plating process is carried out using the above-mentioned plating equipment, which comprises the following steps: the wafer 500 is first transferred to the cleaning module 200 for cleaning before the plating process, then transferred to the plating module for plating, and then transferred to the cleaning module 200 for cleaning after the plating process.
[0039] When the plating module performs the plating process, the wafer 500 must be used in pairs, otherwise it will disturb the flow of the plating solution and affect the plating effect of the wafer 500. When the number of wafers 500 to be plated is two, the two wafers 500 are plated in the plating module at the same time. When the number of wafers 500 to be plated is one, another wafer needs to be replaced by a dummy wafer 600.
[0040] The wafer transfer device 300 for the plating equipment comprises a frame 1, a buffer area 2 and a manipulator 3, the buffer area 2 and the manipulator 3 are arranged in the frame 1, the buffer area 2 can store the dummy wafer 600 or / and the wafer 500; the manipulator 3 can grab the dummy wafer 600 or the wafer 500, the manipulator 3 can extend out of the frame 1 or retract into the frame 1, and respectively abut with the buffer area 2, the feeding module 100 and the cleaning module 200 to transfer the dummy wafer 600 or the wafer 500.
[0041] The loading module 100, the buffer area 2 and the cleaning module 200 can place the wafer 500 or / and the dummy wafer 600. In one case, the loading module 100, the buffer area 2 and the cleaning module 200 place the wafer 500. In another case, the loading module 100, the buffer area 2 and the cleaning module 200 place the wafer 500 and the dummy wafer 600. The loading module 100 and the cleaning module 200 place according to the requirement, and the robot 3 transfers according to the requirement, which provides the dummy wafer 600 for the subsequent electroplating process.
[0042] The cleaning module 200 and the electroplating module are generally an integral structure. In the industry, the cleaning module 200 and the electroplating module are also called electroplating main equipment as a whole. Therefore, the buffer area 2 is arranged in the wafer transfer device 300 in the embodiment, so that the wafer transfer device 300 is directly connected with the cleaning module 200 and the electroplating module, and a buffer device does not need to be arranged between the wafer transfer device 300 and the electroplating module, which reduces the transmission nodes, facilitates the transmission of the wafer 500 or the dummy wafer 600, reduces the floor area, saves the cost and space.
[0043] Since the robot 3 is respectively connected with the workstations of the buffer area 2, the loading module 100 and the cleaning module 200 to transfer the dummy wafer 600 or the wafer 500, in one embodiment, the robot 3 can take the dummy wafer 600 from the loading module 100 and place it in the buffer area 2. When the dummy wafer 600 needs to be cleaned, the robot 3 takes the dummy wafer 600 from the buffer area 2 and places it in the cleaning module 200. When the wafer 500 needs to be cleaned, the robot 3 takes the wafer 500 from the loading module 100 and directly places it in the cleaning module 200. In one embodiment, the robot 3 can take the dummy wafer 600 and the wafer 500 from the loading module 100 and place them in the buffer area 2. When the dummy wafer 600 needs to be cleaned, the robot 3 takes the dummy wafer 600 from the buffer area 2 and places it in the cleaning module 200. When the wafer 500 needs to be cleaned, the robot 3 takes the wafer 500 from the buffer area 2 and places it in the cleaning module 200.
[0044] In the process of transferring the wafer 500 and the dummy wafer 600, the mechanical hand 3 in the wafer transferring device 300 for the electroplating equipment can directly take the wafer 500 or the dummy wafer 600 out of the cleaning module 200, and after the cleaning is completed, the main mechanical hand in the electroplating module directly takes the wafer 500 out of the cleaning module 200 and puts it into the electroplating module for electroplating process. The prior art sets a buffer device between the wafer transferring device 300 and the electroplating module, and then the mechanical hand 3 in the wafer transferring device 300 puts the wafer 500 or the dummy wafer 600 into the buffer device, and the main mechanical hand in the electroplating module takes the wafer 500 or the dummy wafer 600 out of the buffer device and puts it into the electroplating module for electroplating process. Compared with the prior art, the buffer zone 2 in the embodiment is arranged inside the wafer transferring device 300, so that the wafer transferring device 300 is directly connected with the cleaning module 200 and the electroplating equipment, the links of wafer 500 transmission are reduced, the structure of the electroplating equipment and the wafer 500 transmission process are simplified, and the efficiency and accuracy of wafer 500 transmission are improved.
[0045] The wafer transferring device 300 is arranged to directly pass through the cleaning module 200 and be connected with the electroplating module to transfer the wafer, so that the structure of the wafer transferring device 300 is more reasonable, which is helpful to develop more advanced electroplating equipment, especially to improve the wafer transfer efficiency. Compared with the prior art, after the structure of the wafer transferring device 300 is optimized, the wafer transfer efficiency can be improved by more than 30% when the wafer is directly transferred through the cleaning module 200 and the electroplating module, and then the electroplating operation efficiency of the wafer is improved.
[0046] In an embodiment, the cleaning module 200 and the feeding module 100 are respectively arranged on the two sides of the wafer transferring device 300 along the Y direction. The Y direction of the embodiment refers to the extension direction from the wafer transferring device 300 to the cleaning module 200 and finally to the electroplating module. The mechanical hand 3 includes an extendable extension mechanism 33, which can extend out of the frame 1 along the Y direction or retract into the frame 1. When the extension mechanism 33 retracts into the frame 1, it can be connected with the buffer zone 2 in the frame 1, and when the extension mechanism 33 extends out of the frame 1, it can be connected with the cleaning module 200. The cleaning module 200 has two parallel workstations, i.e. the first workstation 210 and the second workstation 220, for placing the wafer 500 or the dummy wafer 600 in the same layer along the Y direction, and the extension mechanism 33 can be connected with the two workstations respectively.
[0047] The stretching mechanism 33 comprises a base 331, a first arm 332 and a second arm 333 connected with each other in rotation, the first arm 332 and the second arm 333 can be stacked from top to bottom along the Z direction and can be independently unfolded, and the second arm 333 is connected with a carrying part for carrying the wafer 500 or the artificial lens 600. By arranging two arms, the two arms can be in a fully stretched state, a fully contracted state and an intermediate state between the fully stretched state and the fully contracted state, so that the stretching mechanism 33 has multiple forms, can expand the extension length range of the stretching mechanism 33, and improve the flexibility. Exemplarily, the first arm 332 and the second arm 333 comprise multiple unfolding modes, such as: both the first arm 332 and the second arm 333 are in a fully contracted state, or one of them is in a fully contracted state and the other is in a fully unfolded state or an intermediate state, etc. The two arms of the stretching mechanism 33 respectively have corresponding unfolding modes and unfolding lengths to be connected with the feeding module 100, the buffer area 2, the first work station 210 and the second work station 220. The two arms are stacked, which compresses the thickness of the stretching mechanism 33 after stretching, effectively prevents interference with the surrounding structure, and provides convenience for wafer 500 transmission. Specifically, the carrying part can be designed according to the prior art, which will not be described here.
[0048] Optionally, the length of the stretching mechanism 33 in the fully contracted state is greater than 500 mm, and the length of the stretching mechanism 33 in the fully stretched state is greater than 800 mm, which can be applied to movement in a larger space. Exemplarily, the length of the stretching mechanism 33 in the fully contracted state is 600 mm or 700 mm, etc., and the length of the stretching mechanism 33 in the fully unfolded state is 900 mm or 1000 mm or more, etc.
[0049] In this embodiment, different electroplating equipment can be designed according to actual needs, and all are within the protection scope of this embodiment.
[0050] The robot 3 further comprises a driving mechanism 34, which can drive the stretching mechanism 33 to move along the X direction and / or the Z direction, thereby improving the movement range of the robot 3 along the X direction and / or the Z direction, and further improving the flexibility. Optionally, a plurality of placement layers 22 are arranged along the Z direction on the buffer area 2, and the placement layers 22 are used to place the wafer 500 or the artificial lens 600. By moving the stretching mechanism 33 along the Z direction, the stretching mechanism 33 can be connected with the plurality of placement layers 22. Optionally, a plurality of work station groups 240 are arranged on the cleaning module 200, and the cleaning module 200 is provided with cleaning structures on both sides along the Y direction, and each cleaning structure has two layers, and each cleaning structure on the same layer comprises two work stations arranged side by side along the Y direction, i.e., the first work station 210 and the second work station 220. Figure 1As shown, the above structure makes the cleaning module 200 have 8 cleaning structures, 4 on each side, one side can be set as a cleaning structure before electroplating, only used to perform the cleaning process before electroplating, and the other side is set as a cleaning structure after electroplating, only used to perform the cleaning process after electroplating. By moving along the X direction through the stretching mechanism 33, the same height station group 240 can be docked. Alternatively, by moving along the Z direction through the stretching mechanism 33, the station group 240 at different heights can be docked.
[0051] In an embodiment, the driving mechanism 34 includes a horizontal driving mechanism 31 and a vertical driving mechanism 32 fixed on the horizontal driving mechanism 31, and the stretching mechanism 33 is fixed on the vertical driving mechanism 32. The horizontal driving mechanism 31 is arranged along the X direction, and the horizontal driving mechanism 31 is correspondingly connected to the mounting plates arranged on both sides of the frame 1 along the X direction. The horizontal driving mechanism 31 drives the vertical driving mechanism 32 to move along the X direction, so as to drive the stretching mechanism 33 to move along the X direction through the vertical driving mechanism 32; and the vertical driving mechanism 32 can drive the stretching mechanism 33 to move along the Z direction. Through the horizontal driving mechanism 31 and the vertical driving mechanism 32, the stretching mechanism 33 can move along the X direction and the Z direction. The horizontal driving mechanism 31 and the vertical driving mechanism 32 are both linear driving modules.
[0052] In an embodiment, the wafer transfer device 300 is internally provided with a wafer positioning area 700, which is correspondingly arranged and non-interfering with the robot 3, and is arranged on one side of the mounting plate arranged on both sides of the frame 1 along the X direction or between the two mounting plates. Alternatively, the wafer positioning area 700 includes a first area 710, a second area 720 and a third area 730 arranged in sequence along the X direction, the first area 710 is arranged on the mounting plate, the second area 720 is the area between the mounting plate and the robot 3, and the third area 730 is one side of the robot 3 along the Y direction, specifically, the third area 730 is located on one side of the vertical driving mechanism 32 along the Y direction. The above three areas do not interfere with the robot 3.
[0053] When the wafer positioning area 700 is arranged in the first area 710, the upper feeding module 100 and the cleaning module 200 are arranged on both sides of the wafer conveying device 300 along the Y direction, and the mechanical arm 3 can avoid crossing the wafer positioning area 700 when it is docked with the upper feeding module 100 and the cleaning module 200, thereby preventing structural interference, facilitating structural layout, and making the overall structure of the wafer conveying device 300 more compact. In an embodiment, the buffer area 2 includes a frame 21 and a plurality of placement layers 22 arranged along the Z direction on the frame 21, and the placement layers 22 are used to place the wafers 500. The frame 21 can be directly connected with the mounting plate. When the wafer positioning area 700 is arranged in the third area 730, the mechanical arm 3, the wafer positioning area 700, the upper feeding module 100 and the cleaning module 200 are arranged along the Y direction, thereby further reducing the X direction footprint. When the wafer positioning area 700 is arranged in the second area 720, the above advantages can be simultaneously considered, and details are not repeated here.
[0054] The buffer area 2 is arranged in the wafer positioning area 700, and the lowest position of the wafers 500 or the dummy wafers 600 loaded in the buffer area 2 is not less than the lowest position to which the mechanical arm 3 can move downward, so that the mechanical arm 3 can take and place the wafers 500 or the dummy wafers 600 at the lowest position of the buffer area 2.
[0055] The wafer positioning area 700 is also provided with an edge finder 4, which is used to detect the physical characteristics of the wafer 500, such as the edge, the center and the orientation structure, etc., to provide accurate position and direction reference for subsequent processes. For example, the edge finder 4 determines the angular direction of the wafer 500 by detecting the position of the orientation structure, such as the notch on the wafer 500, to ensure that the process pattern matches the direction of the wafer 500. The edge finder 4 can synchronously identify the damage, cracks or contaminants (such as fragments) of the edge of the wafer 500. If the edge damage is found, the equipment will trigger an alarm to avoid the damaged wafer 500 entering the subsequent process (which may cause fragment contamination of the equipment, scratch the chuck or affect the vacuum tightness). The edge finder 4 collects the coordinates of multiple points of the edge of the wafer 500 through optical scanning (such as laser) or mechanical contact detection, calculates the actual geometric center, and ensures that the center of the wafer 500 is aligned with the equipment reference axis when the mechanical arm 3 grasps or the process chuck is loaded, thereby avoiding processing deviation (such as misalignment of the photolithography pattern) caused by center deviation.
[0056] The edge finder 4 is located above the buffer area 2; the mechanical arm 3 can take out the wafer 500 or the dummy wafer 600 from the buffer area 2 and perform edge finding operation through the edge finder 4, thereby shortening the distance between the buffer area 2 and the edge finder 4, improving the efficiency of transferring the wafer 500 between the two, and arranging the edge finder 4 and the buffer area 2 in sequence from top to bottom along the Z direction, thereby reducing the footprint and making the structure more compact.
[0057] The cleaning module 200 is arranged on one side of the wafer conveying device 300 along the Y direction, and the frame 1 is detachably connected with the door body 11 on the side close to the cleaning module 200 along the Y direction, so as to facilitate the maintenance personnel to enter from the inside of the wafer conveying device 300, and after the door body 11 is detached, the cleaning module 200 and the like are maintained. Alternatively, the door body 11 is connected to the frame 1 by insertion or through screws and the like fasteners 400.
[0058] The frame 1 is provided with a corresponding window 12 on the side close to the cleaning module 200 along the Y direction, and the window 12 allows the robot 3 to pass through the window 12 to transfer the wafer 500 with the cleaning module 200. Specifically, the frame 1 is provided with a protective plate 13 on the side along the Y direction, the protective plate 13 is located on both sides of the door body 11 along the X direction, and the window 12 is arranged on the protective plate 13. The window 12 and the door body 11 are independently arranged and do not affect each other.
[0059] The window 12 is provided with a center calibration module, the robot 3 can be docked with the center calibration module, and the center calibration module is used for center calibration of the wafer 500 or the dummy wafer 600, which can help the robot 3 to accurately transfer the wafer 500 into the cleaning module 200. The center calibration module is a prior art and will not be described again.
[0060] In an embodiment, the cleaning module 200 is provided with a plurality of openings corresponding to the window 12 and a plurality of station groups 240 corresponding to the openings, respectively. The station group 240 includes two stations arranged side by side along the Y direction, and the opening allows the robot 3 passing through the window 12 to further pass through the opening to transfer the wafer 500 between the corresponding station group 240. The cleaning module 200 is provided with a plurality of station groups 240, which can realize simultaneous cleaning of a plurality of groups of wafers 500 or a combination of wafers 500 and dummy wafers 600, thereby improving the work efficiency. A plurality of center calibration modules are arranged at the plurality of windows 12, and after the horizontal driving mechanism 31 and the vertical driving mechanism 32 of the robot 3 drive the stretching mechanism 33 to the preset position along the X direction and the Z direction, respectively, the stretching mechanism 33 is unfolded, the wafer 500 is directly transferred into the corresponding station group 240 of the cleaning module 200 after passing through the window 12 and being calibrated by the center calibration module. The robot 3 moves along the X direction or the Z direction after the wafer 500 is calibrated by the center calibration module, which shortens the distance after positioning and improves the transmission efficiency, and reduces the secondary deviation of the wafer 500 caused by the vibration of the robot 3 or the air flow disturbance during the transmission process. The wafer 500 is directly placed into the cleaning module 200 after passing through the corresponding center calibration module, thereby improving the wafer placement accuracy.
[0061] Obviously, the above embodiments of the present application are merely example for clearly explaining the present application, and are not intended to limit the embodiments of the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and also impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.
Claims
1. A wafer transfer device for electroplating equipment, the electroplating equipment further comprising a loading module (100) connected to one side of the wafer transfer device, a cleaning module (200) connected to the other side of the wafer transfer device, and an electroplating module connected to the cleaning module (200), characterized in that: The wafer transfer device for electroplating equipment comprises a frame (1), a buffer zone (2) and a robot (3), wherein the buffer zone (2) and the robot (3) are both arranged in the frame (1), and the buffer zone (2) can store dummy wafers (600) and / or wafers (500); the robot (3) can grab the dummy wafers (600) or the wafers (500), and the robot (3) can extend out of the frame (1) or retract into the frame (1), and respectively dock with the buffer zone (2), the loading module (100) and the cleaning module (200) to transfer the dummy wafers (600) or the wafers (500).
2. The wafer transfer device for electroplating equipment according to claim 1, characterized in that: The manipulator (3) includes a retractable extension mechanism (33), and the extension mechanism (33) can extend out of the frame (1) or retract into the frame (1) along the Y direction.
3. The wafer transfer device for electroplating equipment according to claim 2, characterized in that: The extending mechanism (33) comprises a base (331), a first arm (332) and a second arm (333) which are rotatably connected to each other in pairs. The first arm (332) and the second arm (333) can be stacked from top to bottom along the Z direction and can be independently unfolded from each other. The second arm (333) is connected to a supporting part for supporting the dummy film (600) or the wafer (500).
4. The wafer transfer device for electroplating equipment according to claim 2, characterized in that: The manipulator (3) further comprises a driving mechanism (34), and the driving mechanism (34) is capable of driving the stretching mechanism (33) to move along the X direction and / or the Z direction.
5. The wafer transfer device for electroplating equipment according to claim 4, characterized in that: The driving mechanism (34) includes a horizontal driving mechanism (31) and a vertical driving mechanism (32) fixed on the horizontal driving mechanism, and the stretching mechanism (33) is fixed on the vertical driving mechanism (32); The horizontal driving mechanism (31) is arranged along the X direction, and both sides of the horizontal driving mechanism (31) are correspondingly connected to the mounting plates arranged on both sides of the frame (1) in the X direction; The horizontal driving mechanism (31) drives the vertical driving mechanism (32) to move in the X direction, thereby driving the stretching mechanism (33) to move in the X direction through the vertical driving mechanism (32); the vertical driving mechanism (32) can drive the stretching mechanism (33) to move in the Z direction.
6. The wafer transfer device for electroplating equipment according to claim 1, characterized in that: A wafer positioning area (700) is provided inside the wafer transfer device. The wafer positioning area (700) corresponds to the robot (3) and is arranged non-interferingly, and is arranged on one side of a mounting plate provided on both sides of the frame (1) in the X direction or between two mounting plates.
7. The wafer transfer device for electroplating equipment according to claim 6, characterized in that: The buffer zone (2) is arranged in the wafer positioning area (700), and the lowest position of the wafer (500) or the dummy wafer (600) loaded in the buffer zone (2) is not less than the lowest position to which the robot (3) can move downward, so that the robot (3) can take and place the wafer (500) or the dummy wafer (600) at the lowest position of the buffer zone (2).
8. The wafer transfer device for electroplating equipment according to claim 7, characterized in that: An edge finder (4) is also provided in the wafer positioning area (700), and the edge finder (4) is located above the buffer zone (2); the robot (3) can take out the wafer (500) or the dummy wafer (600) from the buffer zone (2) and then perform an edge finding operation through the edge finder (4).
9. The wafer transfer device for electroplating equipment according to claim 1, characterized in that: The cleaning module (200) is arranged on one side of the wafer transfer device for electroplating equipment along the Y direction, and the frame (1) is detachably connected to a door body (11) on one side close to the cleaning module (200) along the Y direction.
10. The wafer transfer device for electroplating equipment according to claim 1, characterized in that: The cleaning module (200) is arranged on one side of the wafer transfer device for electroplating equipment along the Y direction, and a corresponding window (12) is provided on the side of the frame (1) close to the cleaning module (200) along the Y direction, and the window (12) allows the robot (3) to pass through the window (12) to transfer wafers to and from the cleaning module (200).
11. The wafer transfer device for electroplating equipment according to claim 10, characterized in that: The cleaning module (200) is provided with a plurality of openings corresponding to the windows (12) and workstation groups (240) corresponding to the openings. The workstation group (240) includes two workstations arranged in parallel along the Y direction. The openings allow the robot (3) passing through the window (12) to further pass through the openings to transfer wafers between the corresponding workstation groups (240).
12. The wafer transfer device for electroplating equipment according to claim 10, characterized in that: A center calibration module is provided at the window (12), and the robot (3) can dock with the center calibration module. The center calibration module is used to perform center calibration on the dummy film (600) or the wafer (500).