Semiconductor refrigeration device

Abstract

The invention discloses a semiconductor refrigeration device, and relates to the technical field of semiconductor refrigeration. Comprising a semiconductor chilling plate, a water-cooling heat conduction assembly, a sample clamping assembly, a first partition plate, a second partition plate, a heat insulation plate and a signal transmission assembly. Vertical through channels are formed in the middles of the first partition plate, the second partition plate and the heat insulation plate, and a semi-closed area with an opening in the upper end is defined by the top end of the water-cooling heat conduction assembly and the channels in the middles of the first partition plate, the second partition plate and the heat insulation plate; the semiconductor chilling plate is located in the semi-closed area, the bottom end of the semiconductor chilling plate is a heat dissipation end and connected with the top end of the water-cooling heat conduction assembly for heat conduction, and the top end of the semiconductor chilling plate is a refrigeration end and used for containing a sample. The temperature measuring device abuts against the top end of the semiconductor chilling plate. A sample clamping assembly for clamping a sample is arranged on the heat insulation plate; the semiconductor chilling plate and the temperature measuring device are electrically connected with the signal transmission assembly. The refrigeration efficiency can be improved, and the compactness degree of the equipment structure can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device. BACKGROUND

[0002] The semiconductor refrigeration technology has outstanding advantages in equipment structure, system stability, performance reliability and adaptability, and has been widely used in the fields of national defense technology, aerospace and the like. The semiconductor refrigeration has the advantages of small space occupation, simple and light structure, no pollution and zero emission, so that the application field of the semiconductor refrigeration device is very wide, which is not only limited to the traditional refrigeration demand, but also can be applied to the electronic equipment heat dissipation, military equipment cooling and the like special fields. With the continuous progress of technology and the continuous expansion of application scenarios, the application field of the semiconductor refrigeration device will be further expanded.

[0003] The current semiconductor refrigeration equipment still needs to be improved in improving the refrigeration efficiency and the compactness of the equipment structure, so as to expand its application occasions, such as the occasions combined with the scanning electron microscope cavity.

[0004] In view of the problems existing in the prior art, the technical personnel in the field urgently need a semiconductor refrigeration device. SUMMARY

[0005] The purpose of the present application is to provide a semiconductor refrigeration device to solve the problems existing in the prior art, which can improve the refrigeration efficiency and the compactness of the equipment structure.

[0006] To achieve the above purpose, the present application provides the following scheme:

[0007] The present application provides a semiconductor refrigeration device, which comprises a semiconductor refrigeration sheet, a water-cooled heat conduction assembly, a sample clamping assembly, a first partition plate, a second partition plate, a heat insulation plate and a signal transmission assembly. The top end of the water-cooled heat conduction assembly is sequentially provided with the first partition plate, the second partition plate and the heat insulation plate in the vertical upward direction. The middle parts of the first partition plate, the second partition plate and the heat insulation plate are all provided with a through channel, and a semi-closed area with an open upper end is formed between the top end of the water-cooled heat conduction assembly and the through channel in the middle part of the first partition plate, the second partition plate and the heat insulation plate. The semiconductor refrigeration sheet is located in the semi-closed area. The bottom end of the semiconductor refrigeration sheet is a heat dissipation end and is connected to the top end of the water-cooled heat conduction assembly for heat conduction. The top end of the semiconductor refrigeration sheet is a refrigeration end and is used for placing a sample. A temperature measuring device is arranged on the second partition plate, and the temperature measuring device abuts against the top end of the semiconductor refrigeration sheet. The sample clamping assembly for clamping the sample is arranged on the heat insulation plate. The semiconductor refrigeration sheet and the temperature measuring device are electrically connected with the signal transmission assembly.

[0008] In some embodiments, the adapter plate is connected to the bottom end of the water-cooled assembly unit and is used to be positioned and connected to the object platform; and the cover plate is connected to the top end of the heat insulation plate and is provided with a through channel in the middle.

[0009] In some embodiments, the water-cooled heat-conducting assembly comprises a water-cooled bottom plate, a water-cooled upper plate and a water-cooled pipe; the water-cooled upper plate is located above the water-cooled bottom plate and is fixedly connected to the water-cooled bottom plate in a sealed manner; the inside of the water-cooled bottom plate is provided with a water flow inner groove, and the water-cooled pipe passes through the side wall of the water-cooled bottom plate and communicates with the water flow inner groove.

[0010] In some embodiments, the signal transmission assembly comprises a wire passing box and a plug; one end of the wire passing box is open and the other end is provided with a bottom plate; one end of the plug passes through the bottom plate of the wire passing box and is fixedly connected to the bottom plate through a fastener; the semiconductor refrigeration piece and the temperature measuring device are electrically connected to the plug; the bottom plate of the wire passing box is provided with a through hole for the water-cooled pipe to pass through; and the wire passing box is fixedly connected to the side end of the cover plate and the adapter plate through a fastener.

[0011] In some embodiments, the first side plate and the second side plate are symmetrically arranged; the first side plate is fixedly connected to one side end of the first partition plate and the water-cooled bottom plate through a fastener; and the second side plate is fixedly connected to the other side end of the first partition plate and the water-cooled bottom plate through a fastener.

[0012] In some embodiments, the sample clamping assembly comprises a plurality of spring pressing plates; one end of each of the plurality of spring pressing plates is fixedly connected to the heat insulation plate, and the other end is a pressing end and is used to press the sample on the semiconductor refrigeration piece.

[0013] In some embodiments, the heat insulation plate and the cover plate are made of PE material; the temperature measuring device is a platinum resistance block; and the platinum resistance block is pressed on the top end of the semiconductor refrigeration piece and is used to measure the temperature of the refrigeration end of the semiconductor refrigeration piece.

[0014] In some embodiments, the adapter plate is connected to the bottom end of the water-cooled assembly unit and is used to be positioned and connected to the object platform; and the cover plate is connected to the top end of the heat insulation plate and is provided with a through channel in the middle.

[0015] In some embodiments, the bottom end of the semiconductor refrigeration piece is connected to the top end of the water-cooled heat-conducting assembly through a heat-conducting silicone grease.

[0016] In some embodiments, the first partition plate is provided with a slot near one side of the water-cooled upper plate for the electric connecting wire of the semiconductor refrigeration piece to pass through; the inner wall of the channel of the second partition plate is provided with a mounting portion protruding, and the temperature measuring device is connected and fixed with the mounting portion through a fastener; the channels in the middle of the first partition plate, the second partition plate, the heat insulation plate and the cover plate are all rectangular channels.

[0017] The present application has the following technical effects relative to the prior art:

[0018] The semiconductor refrigeration device of the present application has the following advantages: the water-cooled heat conduction assembly, the first partition plate, the second partition plate and the heat insulation plate jointly form a semi-closed space region with one end open, and the semiconductor refrigeration piece is placed in the region, the bottom end of the semiconductor refrigeration piece is connected with the top end of the water-cooled heat conduction assembly, the heat of the heat dissipation end of the semiconductor refrigeration piece is absorbed through the water-cooled heat conduction assembly, and the heat preservation effect is improved through the semi-closed space region, so that the overall structure can improve the refrigeration efficiency of the semiconductor refrigeration piece; the temperature measuring device is used to measure the temperature of the semiconductor refrigeration piece and fix the semiconductor refrigeration piece, the sample clamping assembly is used to clamp and fix the sample on the semiconductor refrigeration piece, and the electric connecting wire of the semiconductor refrigeration piece and the temperature measuring device is integrated and connected to the signal transmission assembly; the semiconductor refrigeration device of the present application has the advantages of compact overall equipment structure, small equipment size and light weight, high refrigeration efficiency, variable sample shape and size within a specified size range, and can be used in combination with an electron microscope cavity. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows: obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0020] Figure 1 It is an exploded view of the semiconductor refrigeration device in some embodiments of the present application.

[0021] Figure 2 It is a perspective structural schematic view of the semiconductor refrigeration device in some embodiments of the present application.

[0022] Figure 3 It is a top view of the semiconductor refrigeration device in some embodiments of the present application.

[0023] Figure 4 It is a connection structure schematic view of the water-cooled heat conduction assembly and the semiconductor refrigeration piece in some embodiments of the present application.

[0024] Figure 5Connection diagram of water-cooled heat-conducting assembly, semiconductor refrigeration sheet and first partition plate in some embodiments of the present application;

[0025] Figure 6 Connection diagram of water-cooled heat-conducting assembly, semiconductor refrigeration sheet, first partition plate and second partition plate in some embodiments of the present application;

[0026] Figure 7 Structure diagram of signal transmission assembly in some embodiments of the present application;

[0027] Figure 8 Structure diagram of signal transmission assembly in some embodiments of the present application;

[0028] Figure 9 Structure diagram of cover plate in some embodiments of the present application;

[0029] Figure 10 Structure diagram of heat insulation plate in some embodiments of the present application;

[0030] Figure 11 Structure diagram of second partition plate in some embodiments of the present application;

[0031] Figure 12 Structure diagram of semiconductor refrigeration sheet in some embodiments of the present application;

[0032] Figure 13 Structure diagram of first partition plate in some embodiments of the present application;

[0033] Figure 14 Structure diagram of water-cooled bottom plate in some embodiments of the present application;

[0034] Figure 15 Structure diagram of water-cooled heat-conducting assembly in some embodiments of the present application;

[0035] Figure 16 Structure diagram of adapter plate in some embodiments of the present application.

[0036] In the figure: 1-semiconductor refrigeration sheet; 2-water-cooled heat-conducting assembly; 3-sample clamping assembly; 4-first partition plate; 5-second partition plate; 6-heat insulation plate; 7-signal transmission assembly; 8-adapter plate; 9-cover plate; 10-first side plate; 11-second side plate; 12-positioning column; 13-temperature measuring device; 14-fastener; 15-electric connection wire; 21-water-cooled bottom plate; 22-water-cooled upper plate; 23-water-cooled pipe; 31-spring pressing sheet; 41-avoidance groove; 51-mounting part; 71-wire passing box; 72-plug; 211-water flow inner groove; 711-through hole. DETAILED DESCRIPTION

[0037] With reference to the accompanying drawings, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those ordinarily skilled in the art without creative work fall within the scope of the present application.

[0038] The present application aims to provide a semiconductor refrigeration device to solve the problems in the prior art, improve refrigeration efficiency and equipment structure compactness, and be applicable to occasions combined with electron microscope cavities.

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] The present application provides a semiconductor refrigeration device, as shown in the figure, comprising a semiconductor refrigeration sheet 1, a water-cooled heat-conducting assembly 2, a sample clamping assembly 3, a first partition plate 4, a second partition plate 5, an insulating plate 6 and a signal transmission assembly 7. Figures 1 to 16 The middle part of the first partition plate 4, the second partition plate 5 and the insulating plate 6 is provided with a channel penetrating up and down, the top end of the water-cooled heat-conducting assembly 2 is sequentially provided with the first partition plate 4, the second partition plate 5 and the insulating plate 6 in the vertical upward direction, and a semi-closed area with an open upper end is formed between the top end of the water-cooled heat-conducting assembly 2 and the channels in the middle part of the first partition plate 4, the second partition plate 5 and the insulating plate 6, and the semiconductor refrigeration sheet 1 is arranged in the semi-closed area.

[0041] The bottom end of the semiconductor refrigeration sheet 1 is a heat dissipation end and is connected and heat-conducted with the top end of the water-cooled heat-conducting assembly 2, the top end of the semiconductor refrigeration sheet 1 is a refrigeration end and is used for placing a sample, and a temperature measuring device 13 is arranged on the second partition plate 5 and abuts against the top end of the semiconductor refrigeration sheet 1.

[0042] The semiconductor refrigeration sheet 1 and the temperature measuring device 13 are electrically connected with the signal transmission assembly 7.

[0043] It should be noted that the semiconductor refrigeration is a technology of refrigeration by using the special properties of semiconductor materials; in the semiconductor material, when the current is applied through the material, due to the energy band structure of the material, the electrons in the conduction band will jump from the high energy level to the low energy level, and in this process, heat will be absorbed; at the same time, the holes in the conduction band will release heat to the outside; therefore, by controlling the current size and direction, the semiconductor material can absorb heat on one side and release heat on the other side to achieve the refrigeration effect. The electric connection line 15 of the semiconductor refrigeration sheet 1 is connected with the signal transmission assembly 7, so as to supply power to the semiconductor refrigeration sheet 1, the bottom end of the semiconductor refrigeration sheet 1 radiates heat and is absorbed by the water-cooled heat conduction assembly 2, and the top end of the semiconductor refrigeration sheet 1 absorbs heat to refrigerate the sample.

[0044] In some embodiments, the adapter plate 8 and the cover plate 9 are further included; the adapter plate 8 is connected to the bottom end of the water-cooled heat conduction assembly 2, and the adapter plate 8 is used for positioning and connecting on the electron microscope sample platform, that is, the adapter plate 8 can be positioned and connected with the electron microscope sample platform.

[0045] The cover plate 9 is connected to the top end of the heat insulation plate 6, and the middle part of the cover plate 9 is provided with a through channel, so that the top end of the water-cooled heat conduction assembly 2, the first partition plate 4, the second partition plate 5, the heat insulation plate 6 and the through channel in the middle part of the cover plate 9 together form a semi-closed area with an open upper end.

[0046] In some embodiments, as shown in Figure 14 and Figure 15 The water-cooled heat conduction assembly 2 includes a water-cooled bottom plate 21, a water-cooled upper plate 22 and a water-cooled pipe 23; the water-cooled upper plate 22 is located above the water-cooled bottom plate 21 and is sealingly connected and fixed with the water-cooled bottom plate 21; the inside of the water-cooled bottom plate 21 is provided with a water flow inner groove 211, and the water-cooled pipe 23 penetrates through the side wall of the water-cooled bottom plate 21 and communicates with the water flow inner groove 211.

[0047] It should be noted that the water-cooled bottom plate 21 of the present application can be fixed by welding in the water-cooled upper plate 22 to be closed, and the water-cooled pipe 23 is welded in the corresponding hole position of the water-cooled bottom plate 21, and the three are welded to be air-tight and water-tight, and the leakage rate is ≤1×10 -11 Pa·L / S. The water flow inner groove 211 is built in the water-cooled bottom plate 21, so that the water flow circulates along the specified inner groove for refrigeration; and the water-cooled pipe 23 of the present application includes a water inlet pipe and a water outlet pipe, which respectively penetrate through the side wall of the water-cooled bottom plate 21 and communicate with the water flow inner groove 211. Those skilled in the art can also use other ways to realize the sealing and fixed connection of the water-cooled bottom plate 21 and the water-cooled upper plate 22, which is not limited in the present application.

[0048] In some embodiments, as shown in Figure 7 and Figure 8As shown, the signal transmission assembly 7 comprises a wire passing box 71 and a plug 72; one end of the wire passing box 71 is open and the other end is provided with a bottom plate, one end of the plug 72 passes through the bottom plate of the wire passing box 71 and is connected and fixed between the bottom plate through a fastener 14, the other end of the plug 72 is located in the wire passing box 71, and the semiconductor refrigeration piece 1 and the temperature measuring device 13 are electrically connected with the plug 72; a through hole 711 for the water-cooled pipe 23 to pass through is formed in the bottom plate of the wire passing box 71; and the wire passing box 71 and the side end of the cover plate 9 and the side end of the adapter plate 8 are connected and fixed through the fastener 14.

[0049] The plug 72 of the present application is a 9-core military connector, which plays a role of line sequence integration, integrates the positive and negative electrode lines of the semiconductor refrigeration piece 1 and the double lines of the temperature measuring device 13, and makes the device cable unified outlet, thereby reducing the line sequence.

[0050] In some embodiments, as shown in Figures 1 to 3 The first side plate 10 and the second side plate 11 are symmetrically arranged, the first side plate 10 is connected and fixed with one side end of the first partition plate 4 and one side end of the water-cooled bottom plate 21 through the fastener 14, and the second side plate 11 is connected and fixed with the other side end of the first partition plate 4 and the other side end of the water-cooled bottom plate 21 through the fastener 14. The present application makes the whole device closely combined through the first side plate 10 and the second side plate 11.

[0051] In some embodiments, as shown in Figures 1 to 3 The sample clamping assembly 3 comprises a plurality of spring pressing pieces 31; one end of each of the plurality of spring pressing pieces 31 is connected and fixed with the heat insulation plate 6, and the other end is a pressing end and is used for pressing the sample on the upper surface of the semiconductor refrigeration piece 1.

[0052] It should be noted that the present application directly contacts the sample on the upper surface of the semiconductor refrigeration piece 1 with the customized spring pressing piece 31 to fix the sample, and the size of the sample can be flexibly changed within a space of 25mm×25mm; and the sample clamping assembly 3 of the present application further comprises an upper adapter plate, which can be used for adapter installation when the sample exceeds 25mm×25mm.

[0053] In some embodiments, the heat insulation plate 6 and the cover plate 9 are made of PE material and play a role of heat preservation and insulation; obviously, the heat insulation plate 6 and the cover plate 9 can also be made of other materials with heat preservation and insulation functions, and the present application does not make specific limitation in this regard.

[0054] The temperature measuring device 13 is a platinum resistance press block, which is connected with the second partition plate 5 through the fastener 14 and is pressed on the top end of the semiconductor refrigeration piece 1 and is used for measuring the temperature of the refrigeration end of the semiconductor refrigeration piece 1; as shown in Figure 6 The platinum resistance press block is in a T-shaped structure.

[0055] In some embodiments, as shown inFigure 16 As shown in the drawings, the adapter plate 8 further comprises positioning posts 12; the adapter plate 8 is provided with at least two positioning holes, and the at least two positioning posts 12 pass through the corresponding positioning holes and are used for positioning connection with the object platform.

[0056] In some embodiments, the bottom end of the semiconductor refrigeration sheet 1 is connected with the top end of the water-cooled heat conduction assembly 2 through heat-conductive silicone grease.

[0057] In some embodiments, as shown in the drawings, Figure 12 and Figure 13 As shown in the drawings, the first partition plate 4 is provided with a recessed groove 41 for the electric connection wire 15 of the semiconductor refrigeration sheet 1 to pass through on the side close to the water-cooled upper plate 22. The electric connection wire 15 of the semiconductor refrigeration sheet 1 of the present application passes through the recessed groove 41 and is electrically connected with the plug 72.

[0058] In some embodiments, as shown in the drawings, Figure 11 The inner wall of the channel of the second partition plate 5 is protruded to form a mounting portion 51, and the temperature measuring device 13 is connected and fixed with the mounting portion 51 through the fastener 14; the channels in the middle of the first partition plate 4, the second partition plate 5, the heat insulation plate 6 and the cover plate 9 are all rectangular channels.

[0059] In some embodiments, as shown in the drawings, Figure 12 As shown in the drawings, the semiconductor refrigeration sheet 1 of the present application comprises a multi-layer structure from bottom to top.

[0060] The first partition plate 4, the second partition plate 5 and the heat insulation plate 6 of the semiconductor refrigeration device of the present application are stacked on the upper part of the water-cooled heat conduction assembly 2, and are locked on the water-cooled heat conduction assembly 2 through screws, which mainly functions to make the semiconductor refrigeration sheet 1 and the water-cooled heat conduction assembly 2 tightly contact to realize efficient temperature transmission. The heat insulation plate 6 and the cover plate 9 are made of PE material to play the roles of heat preservation and insulation; the first side plate 10 and the second side plate 11 are symmetrically arranged on the left and right sides to make the whole device tightly combined. The whole heat preservation and insulation is realized through the water-cooled heat conduction assembly 2, the first partition plate 4, the semiconductor refrigeration sheet 1, the second partition plate 5, the heat insulation plate 7, the upper cover plate 9, the first side plate 10 and the second side plate 11.

[0061] Before refrigeration, the sample needs to be fixed through the customized spring pressing sheet 31 or the upper adapter plate, then the water-cooled circulation is started, and finally the sample refrigeration is performed through the powered semiconductor refrigeration sheet 1.

[0062] The semiconductor refrigeration device has an outer size of 69mm*61mm*22.1mm, can be combined with electron microscope cavities of various brands, and can be fixed on scanning electron microscope support platforms of various types through positioning holes of an electron microscope adapter plate 8. That is, the semiconductor refrigeration device can be combined with mainstream scanning electron microscopes and vacuum glove boxes of various brands, and can be used under these optical microscopic imaging systems to observe the corresponding relationship between the microstructure evolution of the composition, morphology, structure and refrigeration performance of a sample in the refrigeration process of the sample. The device has a compact structure, a small volume, light weight, high refrigeration efficiency, and variable sample shape and size within a specified size range.

[0063] The semiconductor refrigeration device has the following effects:

[0064] Small space occupation, simple and light structure, no pollution and zero emission;

[0065] Can be combined with electron microscope cavities of various brands;

[0066] All-solid-state design, no mechanical moving parts, therefore zero noise, zero wear, service life of more than 100,000 hours, and very low maintenance cost;

[0067] Precise temperature control capability can realize ±1℃ temperature control by adjusting the current size and direction.

[0068] The principle and implementation mode of the present application are described by applying specific examples in the present application, and the above examples are only used to help understand the method and core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed. In conclusion, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A semiconductor refrigeration device, characterized in that: It includes a semiconductor refrigeration sheet, a water-cooled heat-conducting component, a sample clamping component, a first partition plate, a second partition plate, a heat insulation plate and a signal transmission component; The top of the water-cooled heat-conducting component is provided with the first baffle, the second baffle, and the heat insulation plate in sequence in a vertically upward direction. The middle of the first baffle, the second baffle, and the heat insulation plate are all provided with a channel running through from top to bottom, and a semi-enclosed area with an upper end opening is formed between the top of the water-cooled heat-conducting component and the first baffle, the second baffle, and the channel in the middle of the heat insulation plate; The semiconductor refrigeration chip is located in the semi-enclosed area, the bottom end of the semiconductor refrigeration chip is a heat dissipation end and is connected to the top end of the water-cooled heat conduction component for heat conduction, and the top end of the semiconductor refrigeration chip is a cooling end and is used to place the sample; A temperature measuring device is provided on the second partition plate, and the temperature measuring device abuts against the top of the semiconductor refrigeration plate; the sample clamping assembly for clamping the sample is provided on the heat insulation plate; The semiconductor refrigeration plate and the temperature measuring device are both electrically connected to the signal transmission component.

2. The semiconductor refrigeration device according to claim 1, characterized in that: Also includes adapter plates and cover plates; The adapter plate is connected to the bottom end of the water-cooled heat-conducting component, and the adapter plate is used to be positioned and connected to the loading platform; the cover plate is connected to the top end of the heat insulation plate, and a channel running through the cover plate is provided in the middle.

3. The semiconductor refrigeration device according to claim 2, characterized in that: The water-cooled heat-conducting assembly includes a water-cooled bottom plate, a water-cooled upper plate and a water-cooled pipe; The water-cooled upper plate is located above the water-cooled bottom plate and is sealed and fixed to the water-cooled bottom plate; The water cooling bottom plate is provided with a water flow inner groove inside, and the water cooling pipe passes through the side wall of the water cooling bottom plate and is communicated with the water flow inner groove.

4. The semiconductor refrigeration device according to claim 3, characterized in that: The signal transmission component includes a wire box and a plug; One end of the wire box is open and the other end is provided with a bottom plate. One end of the plug passes through the bottom plate of the wire box and is connected and fixed to the bottom plate by a fastener. The semiconductor refrigeration plate and the temperature measuring device are both electrically connected to the plug. A through hole for the water cooling pipe to pass through is opened on the bottom plate of the wire box. The wire box is connected and fixed to the side ends of the cover plate and the adapter plate through fasteners.

5. The semiconductor refrigeration device according to claim 3, characterized in that: Also included are a first side panel and a second side panel; The first side plate and the second side plate are symmetrically arranged. The first side plate is connected and fixed to one end of the first partition plate and the water-cooled bottom plate by fasteners, and the second side plate is connected and fixed to the other end of the first partition plate and the water-cooled bottom plate by fasteners.

6. The semiconductor refrigeration device according to claim 1, characterized in that: The sample clamping assembly includes a plurality of spring pressing pieces; One end of each of the spring pressing sheets is fixedly connected to the heat insulation plate, and the other end is a pressing end and is used to press the sample located on the semiconductor refrigeration sheet.

7. The semiconductor refrigeration device according to claim 2, characterized in that: The heat insulation board and the cover board are both made of PE material; The temperature measuring device is a platinum resistance block, which is pressed on the top of the semiconductor refrigeration plate and is used to measure the temperature of the cooling end of the semiconductor refrigeration plate.

8. The semiconductor refrigeration device according to claim 2, characterized in that: Also included are positioning columns; At least two positioning holes are formed on the adapter plate, and at least two positioning posts pass through the corresponding positioning holes and are used for positioning connection with the loading platform.

9. The semiconductor refrigeration device according to claim 1, characterized in that: The bottom end of the semiconductor refrigeration plate is connected to the top end of the water-cooled heat-conducting component through thermal grease.

10. The semiconductor refrigeration device according to claim 3, characterized in that: A side of the first partition close to the water-cooled upper plate is provided with an avoidance groove for the electrical connection wire of the semiconductor refrigeration plate to pass through; The inner wall of the channel of the second partition is protruding to form a mounting portion, and the temperature measuring device is connected and fixed to the mounting portion by fasteners; the channels in the middle of the first partition, the second partition, the insulation plate and the cover plate are all rectangular channels.

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