A display screen spacer measurement method and device, and electronic equipment

Abstract

The application discloses a kind of display screen spacer measurement method and device, electronic equipment, the method comprises: after obtaining the three-dimensional topography of PS column, three-dimensional topography is corrected based on the inclination correction parameter by the inclination correction rule of preposition, and target three-dimensional topography is obtained;Determine the measurement range of each measuring head in target three-dimensional topography based on the mark point information of three mark points of the preposition of display screen;Height matrix of PS column in measurement range is acquired, and the PS column to be measured is identified;The measurement value of the PS column to be measured is obtained by measuring head;Target measurement result is obtained by multiple correction processing of measurement value based on the correction parameter of measuring head.The inclination correction of three-dimensional topography, the point to be measured by measuring head is quickly and accurately found, the PS column to be measured is quickly and accurately positioned in three-dimensional topography, and the four aspects that the difference exists in the measurement result of different measuring heads of the same PS column to be measured are solved, high-precision PS column measurement is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical micro-nano structure measurement, and in particular to a display screen spacer measurement method and device and electronic equipment. BACKGROUND

[0002] In the production process of an LCD (Liquid Crystal Display) liquid crystal screen, a CF (Color Filter) screen and an Array screen need to be combined (the CF screen mainly controls RGB colors, and the Array screen is mainly used to control color switching to facilitate the control of which pixels of the CF screen can be lit). Since there are a plurality of fine color film spacer heights (PSH: Photo Spacer Height, which can be understood as a fine column, hereinafter referred to as PSH) in both screens, the PSHs will slightly isolate the gap between the two screens when combined, and the outflow gap will be irrigated with liquid crystal. Fine PSHs will be distributed on the surface of the two screens. After the PSHs are manufactured, the height of each PSH must be measured. If the height is too high or too low, the amount of liquid crystal irrigated must be adjusted.

[0003] If the PSHs are too high or too low due to the manufacturing process, inaccurate measurement will affect the amount of liquid crystal irrigated. In the case of inaccurate measurement, if the PSHs are too low, the liquid crystal will be irrigated too much, causing the two bonded screens to be lifted up and form a bulge. Conversely, if the PSHs are too high, there will be a gap without liquid crystal after the fixed liquid crystal irrigation is completed, forming an internal bubble. Such a situation will cause the expensive liquid crystal screen to be scrapped, resulting in an increase in cost.

[0004] Therefore, how to improve the measurement accuracy of the PSH (Photo Spacer) column in the liquid crystal screen is a problem to be solved. SUMMARY

[0005] To solve the above problems, the embodiments of the present application provide a display screen spacer measurement method and device, electronic equipment, computer readable storage medium, and computer program product.

[0006] In a first aspect, to solve the above technical problems, the present application provides a display screen spacer measurement method, comprising:

[0007] After the three-dimensional topography of the PSH column of the display screen is constructed, the three-dimensional topography is obtained by a preset tilt correction rule to obtain a tilt correction parameter corresponding to the three-dimensional topography;

[0008] The three-dimensional topography is corrected based on the tilt correction parameter to obtain a target three-dimensional topography;

[0009] determine a measurement range of each measurement head in the target three-dimensional topography based on the landmark information of three landmarks of the preset position of the display screen;

[0010] obtain a height matrix of the PS columns in the measurement range, and identify a to-be-measured PS column based on the height matrix;

[0011] obtain a measurement value of the to-be-measured PS column measured by the measurement head;

[0012] obtain a correction parameter of the measurement head, and perform multiple correction processing on the measurement value based on the correction parameter to obtain a target measurement result.

[0013] Beneficial effects are:

[0014] In the technical scheme provided in the embodiments of the present application, after the three-dimensional topography of the PS columns of the display screen is constructed, the tilt correction parameter corresponding to the three-dimensional topography is obtained through the preset tilt correction rule; the three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography; the measurement range of each measurement head in the target three-dimensional topography is determined based on the landmark information of three landmarks of the preset position of the display screen; the height matrix of the PS columns in the measurement range is obtained, and a to-be-measured PS column is identified based on the height matrix; the measurement value of the to-be-measured PS column measured by the measurement head is obtained; the correction parameter of the measurement head is obtained, and multiple correction processing is performed on the measurement value based on the correction parameter to obtain a target measurement result. In this way, the present application finds the point to be measured by each measurement head quickly and accurately through tilt correction of the three-dimensional topography, quickly and accurately locates the to-be-measured PS column to be measured in the three-dimensional topography field, and solves the difference between the measurement results of different measurement heads for the same to-be-measured PS column in four aspects, thereby realizing high-precision PS column measurement.

[0015] Further, the tilt correction parameter corresponding to the three-dimensional topography is obtained through the preset tilt correction rule, including:

[0016] three reference points are selected on the three-dimensional topography through the preset tilt correction rule;

[0017] obtain a reference coordinate of the reference point, and obtain a slope value of the three-dimensional topography in a target axis direction based on the reference coordinate; the target axis direction includes an x-axis and a y-axis;

[0018] the slope value is taken as the tilt correction parameter corresponding to the three-dimensional topography.

[0019] Further, the three-dimensional topography is tilt-corrected based on the tilt correction parameter to obtain a target three-dimensional topography, including:

[0020] obtain a height matrix of the three-dimensional topography;

[0021] updating height values in the height matrix based on the slope value to obtain a target height matrix;

[0022] obtaining a corresponding target three-dimensional topography based on the target height matrix to complete the tilt correction of the three-dimensional topography.

[0023] Further, the three landmark points based on the landmark point information of the preset position of the display screen determine the measurement range of each measurement head in the target three-dimensional topography, comprising:

[0024] Obtain the template information of the template display screen, the template information including template landmark point coordinates and template PS column coordinates corresponding to the measurement head;

[0025] Obtain the landmark point actual coordinates of the three landmark points included in the landmark point information; the preset position where the landmark point is located is the corner position of the display screen;

[0026] Obtain the coordinate mapping relationship between the landmark point actual coordinates and the template landmark point coordinates;

[0027] Based on the coordinate mapping relationship and the template PS column coordinates, obtain the actual PS column coordinates corresponding to each measurement head, and based on the actual PS column coordinates, determine the measurement range of each measurement head in the target three-dimensional topography.

[0028] Further, the height matrix of the PS column in the measurement range is obtained, and based on the height matrix, the to-be-measured PS column is identified, comprising:

[0029] Obtain the height matrix of the PS column in the measurement range, and obtain the average value between other height values in the height matrix except the minimum height value and the maximum height value;

[0030] Based on the average value, replace the height values in the height matrix that are less than the average value to obtain a processed height matrix;

[0031] Map to obtain the two-dimensional gray matrix corresponding to the processed height matrix;

[0032] Obtain the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range, and the PS column corresponding to the two-dimensional gray value with the minimum similarity is taken as the to-be-measured PS column.

[0033] Further, the to-be-measured PS column corresponds to at least one measurement head; the correction parameter of the measurement head is obtained, and based on the correction parameter, multiple correction processing is performed on the measurement value to obtain a target measurement result, comprising:

[0034] Obtain a one-time correction parameter of the measurement head for a preset standard step sample;

[0035] In a case that the to-be-tested PS column corresponds to multiple measurement heads, any one of the multiple measurement heads is taken as a reference measurement head;

[0036] A height difference relationship between the reference measurement head and other measurement heads except the reference measurement head is obtained, and secondary correction parameters of each of the other measurement heads are obtained based on the height difference relationship;

[0037] The measurement values are sequentially corrected based on the primary correction parameters and the secondary correction parameters, so as to obtain target measurement results.

[0038] Further, the obtaining of the primary correction parameters of the measurement head for the preset standard step sample comprises:

[0039] The original measurement values obtained by the measurement head for height measurement of the preset standard step sample are obtained;

[0040] The original measurement values of each of the measurement heads are linearly fitted, so as to obtain corresponding correction parameters, and the correction parameters are taken as the primary correction parameters.

[0041] Further, the obtaining of the height difference relationship between the reference measurement head and other measurement heads except the reference measurement head, and the obtaining of the secondary correction parameters of each of the other measurement heads based on the height difference relationship, comprise:

[0042] Multiple reference PS columns are selected in the three-dimensional topography;

[0043] A standard value obtained by the reference measurement head for height measurement of the reference PS column and measurement values obtained by other measurement heads except the reference measurement head for height measurement of the reference PS column are obtained;

[0044] The standard value and the measurement values are least square fitted, so as to obtain a height difference relationship between the reference measurement head and the other measurement heads;

[0045] The secondary correction parameters of each of the other measurement heads are obtained based on the height difference relationship.

[0046] In a second aspect, the present application provides a display screen spacer measurement device, comprising:

[0047] A correction parameter unit is configured to, after a three-dimensional topography of PS columns of a display screen is obtained, obtain a tilt correction parameter corresponding to the three-dimensional topography through a preset tilt correction rule;

[0048] A tilt correction unit is configured to correct the three-dimensional topography based on the tilt correction parameter, so as to obtain a target three-dimensional topography.

[0049] a range determining unit configured to determine a measurement range of each measurement head in the target three-dimensional topography based on the landmark information of the three landmark points of the preset position of the display screen;

[0050] a to-be-measured object unit configured to obtain a height matrix of a PS column in the measurement range, and identify a to-be-measured PS column based on the height matrix;

[0051] a measurement unit configured to obtain a measurement value of the to-be-measured PS column measured by the measurement head;

[0052] a multiple correction unit configured to obtain a correction parameter of the measurement head, and perform multiple correction processing on the measurement value based on the correction parameter to obtain a target measurement result.

[0053] In a third aspect, the present application also provides an electronic device, comprising: one or more processors; a storage device configured to store one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the display spacer measurement method as described above.

[0054] In a fourth aspect, the present application also provides a computer-readable storage medium having computer-readable instructions stored thereon, which, when executed by a processor of a computer, cause the computer to perform the display spacer measurement method as described above.

[0055] In a fifth aspect, the present application also provides a computer program product or a computer program, which comprises computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the display spacer measurement method provided in the various optional embodiments described above.

[0056] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not limiting to the present application. BRIEF DESCRIPTION OF DRAWINGS

[0057] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and serve to explain the principles of the present application. It is apparent that the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those of ordinary skill in the art without creative effort based on these drawings. In the drawings:

[0058] Figure 1 is a flowchart of a display spacer measurement method according to an exemplary embodiment of the present application;

[0059] Figure 2 FIG. 13 is a schematic diagram illustrating the effect of tilt correction of a three-dimensional topography according to an embodiment of the present application;

[0060] Figure 3 FIG. 14 is a block diagram of a measurement device for a display spacer according to an example embodiment of the present application;

[0061] Figure 4 FIG. 15 is a schematic diagram of a computer system of an electronic device suitable for implementing embodiments of the present application. DETAILED DESCRIPTION

[0062] The example embodiments will be described in detail herein with reference to the attached drawings. The following description is made with reference to the accompanying drawings in which like reference numerals refer to like elements, and the various embodiments are not limited thereto as described in the specification. Rather, the following description is made with reference to the accompanying drawings in which the same or similar elements are referred to with the same or similar reference numerals.

[0063] The block diagrams shown in the accompanying drawings are merely functional entities, and do not necessarily have to correspond to physically independent entities. That is, the functional entities can be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0064] The flowcharts shown in the accompanying drawings are merely illustrative, and do not necessarily include all contents and operations / steps, nor do they have to be executed in the order described. For example, some operations / steps can be further divided, and some operations / steps can be combined or partially combined, so that the actual execution order can be changed depending on the actual situation.

[0065] In the present application, "a plurality of" means two or more. The association relationship of "and / or" between associated objects means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. The character " / " generally means that the associated objects before and after it are in an "or" relationship.

[0066] In the related art, after the three-dimensional topography of the PS column is constructed, there is an inclination between the sampling device and the sample surface due to the installation precision and the position change of the sample on the stage, so that the constructed three-dimensional topography is inclined to different degrees, and the measured height of the PS column is greatly different when different reference surfaces are selected. In the actual measurement process, it is found that the height values measured by different probes when testing the column at the same point are different, and the height difference is large, which does not meet the requirement that the height difference of the same column measured by different probes is less than 18nm. In the actual industrial measurement equipment, since the radius of the measured column is mostly between 2µm and 10µm, and the position of the measured column in the field of view changes dynamically under the action of the fast movement of the measurement head, which brings problems to the fixed position measurement.

[0067] To solve the above problems, the embodiments of the present application provide a display spacer measurement method and device, electronic equipment, and computer readable storage medium, which are mainly related to the display spacer measurement technology in the optical micro-nano structure measurement technology. The embodiments will be described in detail below.

[0068] First, please refer to Figure 1 , Figure 1 is a flowchart of a display spacer measurement method according to an example embodiment of the present application. The method can be specifically executed by a server, which can be a standalone server or a cloud server providing cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms, etc. Basic cloud computing services, which are not limited herein.

[0069] As shown in Figure 1 , in an example embodiment, the display spacer measurement method can include steps S101 to S106, which are described in detail as follows:

[0070] In step S101, after the three-dimensional topography of the PS column of the display is constructed, the inclination correction parameters corresponding to the three-dimensional topography are obtained through the preset inclination correction rule.

[0071] In step S102, the three-dimensional topography is corrected based on the inclination correction parameters to obtain a target three-dimensional topography.

[0072] In step S103, based on the landmark point information of the three landmark points of the preset position of the display, the measurement range of each measurement head in the target three-dimensional topography is determined.

[0073] In step S104, a height matrix of the PS column in the measurement range is obtained, and the PS column to be measured is identified based on the height matrix.

[0074] In step S105, a measurement value of the PS column to be measured obtained by the measurement head is obtained.

[0075] In step S106, a correction parameter of the measurement head is obtained, and the measurement value is subjected to multiple correction processing based on the correction parameter to obtain a target measurement result.

[0076] As can be seen from the above, in the method provided in the embodiment, first, the tilt correction parameter corresponding to the three-dimensional morphology is obtained through the preset tilt correction rule, and the three-dimensional morphology is subjected to tilt correction based on the tilt correction parameter to obtain a target three-dimensional morphology. The problem that the measurement accuracy is affected due to the different degrees of tilt of the constructed three-dimensional morphology caused by the installation precision and the position change of the sample on the stage is solved. Secondly, the measurement range of each measurement head in the target three-dimensional morphology is determined through the 3 Mark point alignment method in the detection process of the PS column to be measured, and the PS column to be measured is accurately identified therefrom. Finally, the measurement value of the PS column to be measured is corrected through multiple correction, which further improves the accuracy of the measurement result and reduces the difference between the results of different measurement heads testing the same PS column.

[0077] Therefore, the tilt correction of the three-dimensional morphology, the fast and accurate finding of the point to be measured by each measurement head, the fast and accurate positioning of the PS column to be measured in the three-dimensional morphology field, and the solution to the difference between the measurement results of different measurement heads for the same PS column to be measured are realized, and high-precision PS column measurement is achieved.

[0078] In an example embodiment of the present application, the specific steps of obtaining the tilt correction parameter corresponding to the three-dimensional morphology through the preset tilt correction rule can include:

[0079] Three reference points of the three-dimensional morphology are selected through the preset tilt correction rule.

[0080] Reference coordinates of the reference points are obtained, and a slope value of the three-dimensional morphology in the target axis direction is obtained based on the reference coordinates; the target axis direction includes the x-axis and the y-axis.

[0081] The slope value is taken as the tilt correction parameter corresponding to the three-dimensional morphology.

[0082] In another example embodiment, after the tilt correction parameter is obtained, the specific steps of subjecting the three-dimensional morphology to tilt correction based on the tilt correction parameter to obtain a target three-dimensional morphology can include:

[0083] A height matrix of the three-dimensional morphology is obtained.

[0084] Update the height values in the height matrix based on the slope values to obtain a target height matrix;

[0085] Obtain a corresponding target three-dimensional topography based on the target height matrix to complete the tilt correction of the three-dimensional topography.

[0086] In this embodiment, in order to solve the tilt problem of the constructed three-dimensional topography, the slope k in the x-axis direction and the slope t in the y-axis direction of the three-dimensional topography need to be first calculated. The calculation formulae of k and t are as follows:

[0087]

[0088] The height values of the height matrix are updated based on the calculated k and t, and the updated height values are as follows:

[0089]

[0090] Wherein, pixel_size is the actual distance represented by one pixel in the image field of view.

[0091] Please refer to Figure 2 , Figure 2 is the effect diagram of the tilt correction of the three-dimensional topography in an embodiment of the present application. As shown in the figure, the left side is before the tilt correction, and the right side is after the tilt correction.

[0092] In this way, through the above-mentioned embodiments, the tilt correction parameter corresponding to the three-dimensional topography is obtained through the preset tilt correction rule, and the three-dimensional topography is corrected based on the tilt correction parameter to obtain a target three-dimensional topography. The problem that the measurement accuracy is affected due to the different degrees of tilt of the constructed three-dimensional topography caused by the installation precision and the position change of the sample on the stage is solved.

[0093] In an exemplary embodiment of the present application, based on the landmark point information of the three landmark points at the preset position of the display screen, the specific steps of determining the measurement range formed by each measurement head at the measurement point position in the target three-dimensional topography can include:

[0094] Obtain the template information of the template display screen, and the template information includes the template landmark point coordinates and the template PS column coordinates corresponding to the measurement head;

[0095] The landmark point information includes the landmark point actual coordinates of the three landmark points; and the preset position of the landmark point is the corner position of the display screen;

[0096] Obtain the coordinate mapping relationship between the landmark point actual coordinates and the template landmark point coordinates;

[0097] Based on the coordinate mapping relationship and the template PS column coordinates, actual PS column coordinates corresponding to each measuring head are obtained, and based on the actual PS column coordinates, a measurement range of each measuring head in the target three-dimensional topography is determined.

[0098] In this embodiment, the measurement range of each measuring head in the target three-dimensional topography is formed by the coordinates of the point to be measured by each measuring head.

[0099] In order to solve the problem of quickly finding the coordinates of the point to be measured by each measuring head for a large sample and achieving micron precision of the point coordinates, template information of the template display screen is first needed to be obtained, the template information including template landmark point coordinates and template PS column coordinates corresponding to the measuring head, and there being a coordinate conversion relationship between the template landmark point coordinates and the template PS column coordinates.

[0100] When constructing the template information of the template display screen, four cross Marks are present on the four corners of the template display screen as template landmark points, two measuring heads are used to walk to one end to shoot the Marks on the two sides of the display screen, and the machine coordinates of the center of the cross Mark are recorded, and then the measuring head continues to walk to shoot the machine coordinates of the center of the cross of one of the other two Marks; since there are glass coordinates of the center of the cross Mark on the display screen, according to the mapping relationship between the machine coordinates and the glass coordinates of the center of the cross Mark, a conversion matrix M1 from the glass coordinates to the machine coordinates can be obtained, and according to the conversion matrix M1, the glass coordinates of the center of the PS column to be measured on the display screen can be converted into the machine coordinates of the measuring head.

[0101] Preferably, the conversion matrix M1 from the glass coordinates to the machine coordinates utilizes affine transformation, which is a method of two-dimensional coordinate transformation, and can be represented by a linear transformation (matrix multiplication) plus a translation transformation (vector addition), and its form is as follows:

[0102]

[0103] In two-dimensional space, an affine transformation can be represented by the following formula:

[0104] x'= a * x + b * y + tx

[0105] y'= c * x + d* y + ty

[0106] Where (x, y) is the original coordinate, (x', y') is the transformed coordinate, a, b, c, d, tx, ty are transformation parameters.

[0107] According to the conversion matrix M1, the glass coordinates of the center of the PS column to be measured on the display screen can be converted into the machine coordinates of the measuring head.

[0108] In the actual measurement process, the template information can be the machine table coordinates P1, P2, P3 of the center of the Mark cross of a display screen in the same batch of display screen products and the machine table coordinates of the PS column to be measured, which are respectively taken as the template mark point coordinates and the template PS column coordinates, denoted as {P i} and i is the number of measurement points.

[0109] When the robot places a new display screen on the stage, the pre-alignment is first performed by the alignment cylinders around the stage to ensure that the cross Mark is still in the field of view of the 2.5 times lens (the field of view of 2.5 times is 2.0 mm long and 1.5 mm wide), and then the measurement head moves to the position of the template coordinates to take a picture. At this time, the center of the cross Mark is not in the center of the field of view. The algorithm finds the center of the cross Mark through the gray scale information of the cross Mark and records the coordinates P 11 , P 22 , P 33 of the center of the cross Mark at this time. The mapping relationship M2 from P1, P2, P3 to P 11 , P 22 , P 33 can be used to calculate the machine table coordinates of the PS column center of the display screen to be measured sent by the robot, so as to obtain the measurement range of each measurement head in the target three-dimensional topography, denoted as { i}, .

[0110] In this way, in the embodiments provided in the present application, the measurement range of each measurement head in the target three-dimensional topography is determined through the 3 Mark point alignment mode. The 3 Mark alignment effect is better than the 2 Mark alignment, and experimental verification is performed. The experimental results are shown in Table 1 below.

[0111] Table 1:

[0112]

[0113] From the three groups of data in Table 1 above, it can be concluded that the difference between the calculated machine table coordinates after 2 Mark alignment and the actual machine table coordinates is -0.274 mm (274 µm), -0.324 mm (324 µm), and -0.071 mm (71 µm) in the x direction, and -0.021 mm (21 µm), -0.021 mm (21 µm), and -0.011 mm (11 µm) in the y direction; and the difference between the calculated machine table coordinates after 3 Mark alignment and the actual machine table coordinates is 0, 0, and 0 in the x direction, and 0, 0.01 mm (10 µm), and 0.01 mm (10 µm) in the y direction.

[0114] Therefore, the above embodiment of the present application determines the measurement range of each measurement head in the target three-dimensional topography by the way of three Mark points, thereby improving the measurement accuracy of the subsequent PS column.

[0115] In an example embodiment of the present application, the specific steps of obtaining the height matrix of the PS column in the measurement range and identifying the to-be-measured PS column based on the height matrix can include:

[0116] Obtaining the height matrix of the PS column in the measurement range and obtaining the average value between other height values in the height matrix except the minimum height value and the maximum height value;

[0117] Replacing the height values less than the average value in the height matrix based on the average value to obtain a processed height matrix;

[0118] Mapping to obtain the two-dimensional gray matrix corresponding to the processed height matrix;

[0119] Obtaining the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range, and taking the PS column corresponding to the minimum similarity of the two-dimensional gray value as the to-be-measured PS column.

[0120] Due to the influence of the "bat wing effect" of the white light interference device in the actual production environment, the maximum value and the minimum value in the height matrix of the PS column three-dimensional topography constructed are relatively large, which leads to a relatively large gray scale change of the gray two-dimensional matrix mapped from the three-dimensional height matrix. Thus, the wrong PS column to be measured may be found in the actual measurement.

[0121] In the embodiment, in order to improve the accuracy of positioning the to-be-measured PS column in the three-dimensional topography field, the average value is calculated by sorting the height values in the height matrix and taking the middle part of the data. By replacing the data lower than the average value in the original height matrix with the average value, the maximum value and the minimum value in the height matrix are used to map the height value to 0 to 255 gray scale value. Thus, the gray scale change of the two-dimensional gray matrix obtained is smaller, and the gray scale mapping formula is where f is the gray value after height mapping, max_z is the maximum value in the height matrix, z is the value of the height matrix, and min_z is the minimum value in the height matrix.

[0122] Finally, the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range is obtained, and the PS column corresponding to the minimum similarity of the two-dimensional gray value is taken as the to-be-measured PS column.

[0123] Preferably, the similarity between the two-dimensional gray matrix and the template gray value corresponding to the measurement range is obtained by gray comparison, and the gray comparison is an image matching method commonly used in computer vision by template matching. The basic principle is to compare a small image template with a larger target image to find the position of the template in the target image.

[0124] The core idea of template matching is to calculate the similarity of gray values between the template and the target image region. Common similarity measurement methods include normalized correlation coefficient (NCC), sum of squared differences (SSD), sum of absolute differences (SAD), etc. The normalized correlation coefficient is used in this application, and the value is closer to 1, the matching degree is higher. The formula is:

[0125]

[0126] Wherein , , T(x,y) is the template gray value of the template PS column at coordinates (x,y), and I(x,y) is the gray value at coordinates (x,y) corresponding to the two-dimensional gray matrix.

[0127] In an example embodiment of the present application, the specific steps of obtaining the correction parameters of the measurement head, performing multiple correction processing on the measurement value based on the correction parameters, and obtaining the target measurement result can include:

[0128] Obtain the first correction parameter of the measurement head for the preset standard step sample;

[0129] When the to-be-measured PS column corresponds to multiple measurement heads, any measurement head in the multiple measurement heads is taken as a reference measurement head;

[0130] Obtain the height difference relationship between the reference measurement head and other measurement heads except the reference measurement head, and obtain the second correction parameter of each other measurement head based on the height difference relationship;

[0131] Based on the first correction parameter and the second correction parameter, the measurement value is sequentially corrected to obtain the target measurement result.

[0132] In the embodiment, the to-be-tested PS column corresponds to at least one measurement head. When the to-be-tested PS column corresponds to one measurement head, the measurement value is corrected by the first correction parameter only, because there is no difference between the measurement results of different measurement heads. When the to-be-tested PS column corresponds to multiple measurement heads, the measurement value is corrected by the first correction parameter and the second correction parameter in sequence to obtain the target measurement result, and the second correction parameter is used to eliminate the systematic deviation between different measurement heads.

[0133] In another example embodiment, the specific steps of obtaining the first correction parameter of the measurement head for the preset standard step sample can include:

[0134] obtaining the original measurement value obtained by the measurement head in height measurement of the preset standard step sample;

[0135] linearly fitting the original measurement value of each measurement head to obtain the corresponding correction parameter, and taking the correction parameter as the first correction parameter.

[0136] In the embodiment, two standard step samples that have completed calibration are selected as compensation references, and then the different measurement heads are used to measure the height of the standard step samples to obtain the corresponding original measurement values. Then, the measurement results of each measurement head are linearly fitted to calculate the corresponding first polynomial correction parameter (i.e., a and b). The correction coefficient obtained by the fitting is taken as the first correction parameter for linear compensation of the measurement result. wherein, is the corrected result, is the original measurement result.

[0137] In another example embodiment, the specific steps of obtaining the height difference relationship between the reference measurement head and other measurement heads except the reference measurement head, and obtaining the second correction parameter of each other measurement head based on the height difference relationship can include:

[0138] selecting multiple reference PS columns in the three-dimensional topography;

[0139] obtaining the standard value obtained by the reference measurement head in height measurement of the reference PS column, and the measurement value obtained by the other measurement heads except the reference measurement head in height measurement of the reference PS column;

[0140] performing least square fitting on the standard value and the measurement value to obtain the height difference relationship between the reference measurement head and the other measurement heads;

[0141] obtaining the second correction parameter of each other measurement head based on the height difference relationship.

[0142] In this embodiment, under the premise that the measurement values of the PS column to be measured are corrected by the first correction parameter, the following compensation strategy is adopted to eliminate the systematic deviation of the multiple measurement heads in the product measurement process and ensure that the measurement results remain consistent between different measurement heads:

[0143] At least two PS columns are selected in the three-dimensional morphology of the display screen as the height reference for compensation calculation, and a measurement head is set as the reference head (Reference Head), and the measurement result thereof is set as the standard value. The measurement data of other heads will be fitted and corrected relative to the reference. All measurement heads measure the height of the selected PS column points to form a height corresponding data pair between the reference head, and a least square method is used to fit the height difference relationship between the measurement heads, and a one-time or multiple polynomial model is constructed to solve the correction coefficient (such as a and b) of each non-reference head.

[0144] The calculation process of the preferred second correction parameter can be that n PS columns are measured, and n data points (x_i, y_i) are obtained, i=1, 2,..., n. A linear model (for example, a straight line) is used to fit these data: .

[0145] The least square method aims to find the coefficients a and b, so that the sum of the squares of the residuals (the difference between the predicted value and the true value) of all data points is minimized. The sum of the squares of the residuals (loss function) is: S = Σ (y i - (a + b*x i ))^2 (i from 1 to n). In order to minimize S, the partial derivatives of a0 and a1 are taken, and the partial derivatives are set to 0:

[0146] .

[0147] Thus, a and b can be solved as the second correction parameter, and the calculation of the first correction parameter is the same.

[0148] In this way, in the embodiments provided in the present application, the problem of different measurement results of different measurement heads for the same PS column can be solved by the first correction parameter corresponding to the standard step and the second correction parameter between the measurement heads. For example, the original measurement results of the two standard pieces tested by the measurement head H1 are shown in Table 2.

[0149] Table 2:

[0150]

[0151] The known calibration values are 1.864 pm and 3.63 pm respectively, and the fitting correction coefficients are a=0.045265 and b=0.981588; for example, taking Head1 as the reference probe, Head2 is fitted to obtain the height pairs shown in Table 3.

[0152] Table 3:

[0153]

[0154] The fitting coefficients are a: 0.046941, b: 1.668013

[0155] If Head2 measures a certain PS column as 1.7355 pm, the corrected height is a+b*1.7355=1.7495 pm, which reduces the difference between the results of different measurement heads testing the same PS column.

[0156] In this way, the application corrects the measurement value of the to-be-measured PS column through the above-mentioned embodiment in a multiple correction manner, further improves the accuracy of the measurement result, and reduces the difference between the results of different measurement heads testing the same PS column.

[0157] Figure 3 is a block diagram of a display screen spacer measurement device 300 according to an example embodiment of the application. As shown in Figure 3 , the device comprises:

[0158] The correction parameter unit 301 is configured to, after constructing the three-dimensional topography of the PS column of the display screen, obtain the tilt correction parameter corresponding to the three-dimensional topography through a preset tilt correction rule.

[0159] The tilt correction unit 302 is configured to perform tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain a target three-dimensional topography.

[0160] The range determination unit 303 is configured to determine the measurement range of each measurement head in the target three-dimensional topography based on the landmark information of the three landmark points of the preset position of the display screen.

[0161] The to-be-measured object unit 304 is configured to obtain the height matrix of the PS column in the measurement range, and identify the to-be-measured PS column based on the height matrix.

[0162] The measurement unit 305 is configured to obtain the measurement value of the to-be-measured PS column measured by the measurement head.

[0163] The multiple correction unit 306 is configured to obtain the correction parameter of the measurement head, and perform multiple correction processing on the measurement value based on the correction parameter to obtain a target measurement result.

[0164] The device applies the display screen spacer measurement method provided in the application, constructs the three-dimensional topography of the PS column of the display screen, and then the correction parameter unit 301 obtains the tilt correction parameter corresponding to the three-dimensional topography by the preset tilt correction rule; the tilt correction unit 302 performs tilt correction on the three-dimensional topography based on the tilt correction parameter to obtain a target three-dimensional topography; the range determination unit 303 determines the measurement range of each measurement head in the target three-dimensional topography based on the landmark point information of the three landmark points of the preset position of the display screen; the height matrix of the PS column in the measurement range is obtained by the to-be-measured object unit 304, and the to-be-measured PS column is identified based on the height matrix; the measurement unit 305 obtains the measurement value of the to-be-measured PS column measured by the measurement head; and the correction parameter of the measurement head is obtained by the multiple correction unit 306, and the measurement value is processed by multiple correction based on the correction parameter to obtain a target measurement result. In this way, the tilt correction of the three-dimensional topography, the quick and accurate finding of the point to be measured by each measurement head, the quick and accurate positioning of the to-be-measured PS column to be measured in the three-dimensional topography field, and the solving of the difference between the measurement results of different measurement heads for the same to-be-measured PS column are realized, and high-precision PS column measurement is realized.

[0165] In another exemplary embodiment, the correction parameter unit 301 is further configured to select three reference points that are not collinear from the three-dimensional topography by the preset tilt correction rule; obtain reference coordinates of the reference points, and obtain a slope value of the three-dimensional topography in a target axis direction based on the reference coordinates; the target axis direction includes an x-axis and a y-axis; and the slope value is taken as the tilt correction parameter corresponding to the three-dimensional topography.

[0166] In another exemplary embodiment, the tilt correction unit 302 is further configured to obtain a height matrix of the three-dimensional topography; update the height values in the height matrix based on the slope value to obtain a target height matrix; and obtain a corresponding target three-dimensional topography based on the target height matrix to complete the tilt correction of the three-dimensional topography.

[0167] In another exemplary embodiment, the range determination unit 303 is further configured to obtain template information of the template display screen, the template information including template landmark point coordinates and template PS column coordinates corresponding to the measurement head; obtain landmark point actual coordinates of the three landmark points included in the landmark point information; the preset position where the landmark points are located is an edge corner position of the display screen; obtain a coordinate mapping relationship between the landmark point actual coordinates and the template landmark point coordinates; obtain actual PS column coordinates corresponding to each measurement head based on the coordinate mapping relationship and the template PS column coordinates, and determine the measurement range of each measurement head in the target three-dimensional topography based on the actual PS column coordinates.

[0168] In another example embodiment, the to-be-measured object unit 304 is further configured to obtain a height matrix of the PS columns in the measurement range, and obtain a mean value between height values in the height matrix other than the minimum height value and the maximum height value; replace height values less than the mean value in the height matrix based on the mean value to obtain a processed height matrix; map a two-dimensional grayscale matrix corresponding to the processed height matrix; and obtain a similarity between the two-dimensional grayscale matrix and a template grayscale value corresponding to the measurement range, and take the PS column corresponding to the minimum similarity as the to-be-measured PS column.

[0169] In another example embodiment, the to-be-measured PS column corresponds to at least one measurement head; the multiple correction unit 306 is further configured to obtain a first correction parameter of the measurement head for a preset standard step sample; when the to-be-measured PS column corresponds to multiple measurement heads, take any one of the multiple measurement heads as a reference measurement head; obtain a height difference relationship between the reference measurement head and other measurement heads other than the reference measurement head, and obtain a second correction parameter of each other measurement head based on the height difference relationship; and sequentially correct the measurement values based on the first correction parameter and the second correction parameter to obtain a target measurement result.

[0170] In another example embodiment, the multiple correction unit 306 is further configured to obtain an original measurement value of the measurement head for height measurement of the preset standard step sample; perform linear fitting on the original measurement value of each measurement head to obtain a correction parameter, and take the correction parameter as the first correction parameter.

[0171] In another example embodiment, the multiple correction unit 306 is further configured to select multiple reference PS columns in the three-dimensional topography; obtain a standard value of the reference measurement head for height measurement of the reference PS column, and a measurement value of other measurement heads other than the reference measurement head for height measurement of the reference PS column; perform least squares fitting on the standard value and the measurement value to obtain a height difference relationship between the reference measurement head and the other measurement heads; and obtain a second correction parameter of each other measurement head based on the height difference relationship.

[0172] It should be noted that the display screen spacer measurement device provided in the above embodiments and the display screen spacer measurement method provided in the above embodiments belong to the same concept, wherein the specific manner in which each module and unit performs operations has been described in detail in the method embodiments, and will not be described here. The display screen spacer measurement device provided in the above embodiments can allocate the above functions to different functional modules as needed in actual application, i.e., divide the internal structure of the device into different functional modules to complete all or part of the functions described above, and this is not limited herein.

[0173] Embodiments of the present application also provide an electronic device, comprising: one or more processors; a storage device for storing one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the method for measuring the display screen spacer provided in each of the above embodiments.

[0174] Figure 4 A structural diagram of a computer system of an electronic device suitable for implementing embodiments of the present application is shown. It should be noted that, Figure 4 The computer system 400 of the electronic device shown is only an example and should not impose any limitation on the functions and use range of embodiments of the present application.

[0175] As Figure 4 shown, the computer system 400 includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to programs stored in a read-only memory (ROM) 402 or programs loaded from a storage portion 408 into a random access memory (RAM) 403, such as performing the methods in the above embodiments. In the RAM 403, various programs and data required for system operation are also stored. The CPU 401, the ROM 402, and the RAM 403 are connected to each other through a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0176] The following components are connected to the I / O interface 405: an input portion 406 including a keyboard, a mouse, and the like; an output portion 407 including a display such as a cathode ray tube (CRT), a liquid crystal display (LCD), and the like, and a speaker, and the like; a storage portion 408 including a hard disk, and the like; and a communication portion 409 including a network interface card such as a LAN (Local Area Network) card, a modem, and the like. The communication portion 409 performs communication processing via a network such as the Internet. A drive 410 is also connected to the I / O interface 405 as necessary. A removable recording medium 411 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, and the like is attached to the drive 410 as necessary, so that a computer program read therefrom is installed into the storage portion 408 as necessary.

[0177] In particular, in accordance with embodiments of the present application, the processes described above with reference to the flowcharts can be implemented as a computer software program. For example, embodiments of the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program comprising computer programs for performing the methods illustrated by the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via the communication section 409, and / or installed from the removable medium 411. When the computer program is executed by the central processing unit (CPU) 401, various functions defined in the system of the present application are performed.

[0178] It should be noted that the computer readable medium shown in the embodiments of the present application can be a computer readable signal medium or a computer readable storage medium or any combination of the two. The computer readable storage medium may, for example, be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (Compact Disc Read-Only Memory, CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer readable signal medium can include a data signal propagating in a baseband or as part of a carrier wave, in which the computer readable computer program is carried. Such a propagated data signal can take on many forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. The computer readable signal medium can also be any computer readable medium other than the computer readable storage medium that can send, propagate, or transmit the program for use by or in connection with an instruction execution system, apparatus, or device. The computer program contained on the computer readable medium can be transmitted in any suitable medium, including but not limited to wireless, wired, or the like, or any suitable combination of the above.

[0179] The flowcharts and block diagrams in the drawings illustrate the architecture, functionality, and operation of possible implementations of apparatuses, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowcharts or block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or in the reverse order, depending on the functionality involved. It will also be noted that each block of the block diagrams or flowcharts, and combinations thereof, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or combinations of hardware and software.

[0180] The units described in the embodiments of the present application can be implemented by software, or by hardware, or by a combination of software and hardware. The units described can also be located in a single processor. In some cases, the names of the units do not limit the units themselves.

[0181] Another aspect of the present application provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the method for measuring the display spacer as described above. The computer readable storage medium can be included in the electronic device as described in the embodiments above, or can exist separately from the electronic device.

[0182] Another aspect of the present application provides a computer program product or a computer program. The computer program product or the computer program includes computer instructions. The computer instructions are stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium. The processor executes the computer instructions, so that the computer device performs the method for measuring the display spacer as described in the embodiments above.

[0183] The preferred embodiments of the present application have been described above with the aid of drawings. The application is not limited to the above embodiments but can be modified in various ways within the scope of the application.

Claims

1. A method of measuring a display screen spacer, characterized by, The method comprises: After the three-dimensional topography of the PS column of the display screen is constructed, a tilt correction parameter corresponding to the three-dimensional topography is obtained through a preset tilt correction rule; The three-dimensional topography is corrected based on the tilt correction parameter to obtain a target three-dimensional topography; Based on the landmark point information of the three landmark points of the preset position of the display screen, the measurement range of each measurement head in the target three-dimensional topography is determined; The height matrix of the PS column in the measurement range is obtained, and the to-be-measured PS column is identified based on the height matrix; The measurement value of the to-be-measured PS column measured by the measurement head is obtained; The correction parameter of the measurement head is obtained, and the measurement value is processed through multiple correction based on the correction parameter to obtain a target measurement result; Wherein, the to-be-measured PS column corresponds to at least one measurement head; the correction parameter of the measurement head is obtained, and the measurement value is processed through multiple correction based on the correction parameter to obtain a target measurement result, which comprises: The original measurement value obtained by the measurement head in height measurement of a preset standard step sample is obtained; The original measurement value of each measurement head is linearly fitted to obtain a corresponding correction parameter, and the correction parameter is taken as a first correction parameter; When the to-be-measured PS column corresponds to multiple measurement heads, any measurement head in the multiple measurement heads is taken as a reference measurement head; A plurality of reference PS columns are selected in the three-dimensional topography; The standard value obtained by the reference measurement head in height measurement of the reference PS column and the measurement value obtained by the other measurement heads except the reference measurement head in height measurement of the reference PS column are obtained; The standard value and the measurement value are fitted by the least square method to obtain the height difference relationship between the reference measurement head and the other measurement heads; The secondary correction parameter of each of the other measurement heads is obtained based on the height difference relationship; The measurement value is sequentially corrected based on the first correction parameter and the secondary correction parameter to obtain a target measurement result.

2. The method of claim 1, wherein, The tilt correction parameter corresponding to the three-dimensional topography is obtained through a preset tilt correction rule, which comprises: Three reference points not in a straight line are selected in the three-dimensional topography through a preset tilt correction rule; The reference coordinates of the reference points are obtained, and the slope value of the three-dimensional topography in the target axis direction is obtained based on the reference coordinates; the target axis direction comprises x-axis and y-axis; The slope value is taken as the tilt correction parameter corresponding to the three-dimensional topography.

3. The method of claim 2, wherein, The three-dimensional topography is corrected based on the tilt correction parameter to obtain a target three-dimensional topography, which comprises: The height matrix of the three-dimensional topography is obtained; The height value in the height matrix is updated based on the slope value to obtain a target height matrix; The corresponding target three-dimensional topography is obtained based on the target height matrix to complete the tilt correction of the three-dimensional topography.

4. The method of claim 1, wherein, The template information of the template display screen is obtained, and the template information comprises template landmark point coordinates and template PS column coordinates corresponding to the measurement head; ​ The landmark point information comprises actual landmark point coordinates of three landmark points; and the preset position where the landmark points are located is a corner position of the display screen. A coordinate mapping relationship between the actual landmark point coordinates and the template landmark point coordinates is obtained. Actual PS column coordinates corresponding to each measurement head are obtained based on the coordinate mapping relationship and the template PS column coordinates, and a measurement range of each measurement head in the target three-dimensional morphology is determined based on the actual PS column coordinates.

5. The method of claim 1, wherein, The height matrix of the PS column in the measurement range is obtained, and a to-be-measured PS column is identified based on the height matrix, including: The height matrix of the PS column in the measurement range is obtained, and a mean value between other height values in the height matrix except for the minimum height value and the maximum height value is obtained. The height values in the height matrix that are less than the mean value are replaced based on the mean value to obtain a processed height matrix. A two-dimensional grayscale matrix corresponding to the processed height matrix is obtained through mapping. A similarity between the two-dimensional grayscale matrix and a template grayscale value corresponding to the measurement range is obtained, and a PS column corresponding to a two-dimensional grayscale value with a minimum similarity is taken as the to-be-measured PS column.

6. A display panel spacer measuring apparatus characterized by comprising: It includes: A correction parameter unit is configured to, after a three-dimensional morphology of a PS column of a display screen is constructed, obtain an inclination correction parameter corresponding to the three-dimensional morphology through a preset inclination correction rule. An inclination correction unit is configured to correct the three-dimensional morphology based on the inclination correction parameter to obtain a target three-dimensional morphology. A range determination unit is configured to determine a measurement range of each measurement head in the target three-dimensional morphology based on landmark point information of three landmark points of a preset position of the display screen. A to-be-measured object unit is configured to obtain a height matrix of a PS column in the measurement range and identify a to-be-measured PS column based on the height matrix. A measurement unit is configured to obtain a measurement value of the to-be-measured PS column measured by the measurement head. A multiple correction unit is configured to obtain a correction parameter of the measurement head, perform multiple correction processing on the measurement value based on the correction parameter, and obtain a target measurement result. The to-be-measured PS column corresponds to at least one measurement head. The multiple correction unit is further configured to obtain an original measurement value of a preset standard step sample measured by the measurement head. Linear fitting is performed on the original measurement value of each measurement head to obtain a correction parameter, and the correction parameter is taken as a first correction parameter. When the to-be-measured PS column corresponds to multiple measurement heads, any measurement head in the multiple measurement heads is taken as a reference measurement head. Multiple reference PS columns are selected in the three-dimensional morphology. A standard value of the reference PS column measured by the reference measurement head and a measurement value of the reference PS column measured by other measurement heads except for the reference measurement head are obtained. A least square fitting is performed on the standard value and the measurement value to obtain a height difference relationship between the reference measurement head and the other measurement heads. Secondary correction parameters of each of the other measurement heads are obtained based on the height difference relationship. The measured values are sequentially corrected based on the first correction parameter and the second correction parameter to obtain target measurement results.

7. An electronic device, comprising: Comprise: One or more processors; A storage device for storing one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the display spacer measurement method according to any one of claims 1 to 5.

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