Method for automatically detecting defects of copper-clad aluminum alloy wire

Abstract

The invention is applicable to the technical field of copper-clad aluminum alloy wires, and particularly relates to a copper-clad aluminum alloy wire defect automatic detection method, which comprises the following steps: acquiring wire information; based on the wire rod information, analyzing to obtain detection information corresponding to the wire rod information; based on the detection information, the detection device is controlled to conduct bending and temperature rising operation on the wire, and first detection information and second detection information are obtained; analyzing according to the wire information, the first detection information and the second detection information to obtain a detection result; wherein the detection result is used for reflecting the defect condition between layers in the wire rod. According to the copper-clad aluminum alloy wire defect automatic detection method provided by the invention, the accuracy of a mechanical property judgment result can be improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of copper-clad aluminum alloy wires, and particularly relates to a copper-clad aluminum alloy wire defect automatic detection method. BACKGROUND The core structure of the copper-clad aluminum alloy wire is formed by metallurgical or mechanical combination of an outer copper layer (conductivity and protection) and an inner aluminum core (weight reduction and cost optimization), however, during the production process, problems such as copper plating process deviation, tensile deformation or surface treatment defects may occur, resulting in interface delamination, micro-cracks and other quality problems. These defects can significantly affect the electrical stability, mechanical reliability and corrosion resistance of the wire, especially in high temperature, high humidity or dynamic bending scenarios, which may cause circuit breakage, signal attenuation or even safety accidents. Therefore, through systematic detection means for defect detection of the copper-clad aluminum alloy wire, the potential defects of the wire can be accurately identified and quantitatively evaluated, and the reliability of the product can be improved.

[0002] In related technologies, especially in the mechanical performance detection process of the wire, the traditional bending test method has a significant technical blind spot. This method mainly determines whether the wire is qualified by observing whether the outer layer of the wire cracks during bending test, but for the copper-clad aluminum alloy wire, it is difficult to effectively evaluate the bonding force between the internal layers. For example, when the copper-clad aluminum alloy wire is bent, a gap may occur between the copper layer and the aluminum core without cracks on the surface of the copper layer. At this time, it may be misjudged as a qualified product by only detecting the integrity of the wire, or it may need to be detected again for electrical performance after mechanical performance detection. When the electrical performance is not detected again, the mechanical performance evaluation of the copper-clad aluminum alloy wire may be affected due to the copper layer peeling off during the bending detection process, which may directly damage the insulation performance, resulting in differences in the mechanical performance evaluation of the copper-clad aluminum alloy wire. When the electrical performance is detected again, the detection efficiency is reduced due to the increase in detection steps, and the difference in the mechanical performance evaluation of the copper-clad aluminum alloy wire may cause the defective wire to be used in a high-voltage or humid environment, which has a high risk of short circuit. The reduction in detection efficiency may not match the high-speed production line, which requires reducing the production speed or stopping the production line for detection in sections, resulting in a decrease in the overall production capacity of the product. SUMMARY

[0003] The copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application can improve the problem of inaccurate mechanical performance evaluation results of the wire.

[0004] In a first aspect, the embodiments of the present application provide a copper-clad aluminum alloy wire defect automatic detection method, comprising: obtaining wire information; wherein the wire information includes wire diameter information reflecting the size of the wire and environmental temperature information reflecting the temperature of the detection environment; Based on the wire information, analysis is performed to obtain detection information corresponding to the wire information; wherein the detection information includes a detection position at which the wire needs to be detected, a target angle at which the wire needs to be detected, and a bending rate at which the wire needs to be detected; Based on the detection information, a copper-clad aluminum alloy wire defect automatic detection device is controlled to perform a bending and heating operation on the wire, and first detection information and second detection information are obtained; wherein the bending and heating operation is used to reflect an operation of heating and bending the wire so that the bending angle of the wire reaches the target angle, the first detection information is used to reflect the surface features of the wire at the detection position, and the second detection information is used to reflect the surface temperature of the wire at the detection position; According to the wire information, the first detection information, and the second detection information, analysis is performed to obtain a detection result; wherein the detection result is used to reflect the defect condition between the internal layers of the wire.

[0005] The technical solution described above in the embodiments of the present application has at least the following technical effects: The copper-clad aluminum alloy wire defect automatic detection method provided in the embodiments of the present application first obtains wire information including wire diameter information used to reflect the size of the wire and environment temperature information used to reflect the size of the detection environment temperature, then based on the wire information, analysis is performed to obtain detection information corresponding to the wire information, including a detection position at which the wire needs to be detected, a target angle at which the wire needs to be detected, and a bending rate at which the wire needs to be detected, then based on the detection information, a copper-clad aluminum alloy wire defect automatic detection device is controlled to perform a first operation on the wire, and first detection information used to reflect the surface image of the wire and second detection information used to reflect the surface temperature of the wire are obtained, and then based on the wire information, the first detection information, and the second detection information, analysis is performed to obtain a detection result.

[0006] The method considers the size of the wire and the detection environment temperature to set the detection condition, can realize precise and controllable defect excitation and observation condition, and then performs a bending and heating operation on the copper-clad aluminum alloy wire according to the detection condition to obtain and analyze the temperature and image of the wire at the detection position in real time, can effectively identify hidden defects such as layer separation of the wire that cannot be detected by traditional single detection means through multi-dimensional data fusion analysis of the surface image and temperature field distribution under the synergistic action of bending and heating, can monitor the defects between the internal layers of the wire in real time, further improves the accuracy of the mechanical performance evaluation of the wire, and does not need to add other detection steps in the subsequent process, which can effectively improve the mechanical performance detection efficiency of the wire. Precise and controllable defect excitation and observation condition. At the same time, the non-destructive detection method ensures the structural integrity of the wire, and is suitable for online automatic rapid quality inspection of high-value wires.

[0007] In a possible implementation manner of the first aspect, the control of the copper-clad aluminum alloy wire defect automatic detection device to perform the bending and heating operation on the wire based on the detection information, and the acquisition of the first detection information and the second detection information, include: controlling the copper-clad aluminum alloy wire defect automatic detection device to perform the bending operation on the detection position as the outer side of the bending of the wire according to the bending rate of the detection information, and performing the heating at the detection position; wherein the outer side of the bending is used to reflect the side of the wire outwardly protruding when the wire is bent at the detection position, and the bending angle is used to reflect the included angle of two side line segments of the bent part of the wire after the bending operation is performed on the wire; acquiring the image information and the first temperature information in real time at the inner side of the bending, and confirming the image information as the first detection information; wherein the inner side of the bending is used to reflect the side of the wire inwardly sinking when the wire is bent at the detection position; acquiring the second temperature information at the outer side of the bending in real time; wherein the second temperature information is acquired at the same time as the first temperature information; confirming the first temperature information and the second temperature information as the second detection information.

[0008] In a possible implementation manner of the first aspect, the analysis according to the wire information, the first detection information and the second detection information to obtain the detection result, include: analyzing according to the image information in the first detection information to obtain the cutoff time; wherein the cutoff time is used to reflect the time point of the color value change of the feature point in the image information, and the feature point is the geometric center point in the image information; processing according to the wire information, the second detection information and the cutoff time to obtain the detection result.

[0009] In a possible implementation manner of the first aspect, the analysis according to the image information in the first detection information to obtain the cutoff time, include: acquiring the geometric center point of the image information, and acquiring the center color value corresponding to the geometric center point; wherein the center color value is used to reflect the color value size of the geometric center point in the image information; comparing the center color value at the i-th moment and the center color value at the i+1-th moment in the first detection information to obtain the first comparison result; wherein the first comparison result is used to reflect the difference value between the center color value at the i-th moment and the center color value at the i+1-th moment; confirm the i+1 moment as the deadline time when the first comparison result is not equal to 0.

[0010] In a possible implementation manner of the first aspect, the processing according to the wire information, the second detection information and the deadline time to obtain a detection result comprises: analyzing according to the wire information, the second detection information and the deadline time to obtain a feature set and a feature chain; wherein the feature set is used to reflect a set of temperature diffusion features in the second detection information before the deadline time, and the feature chain is used to reflect a feature chain in which the temperature diffusion features in the second detection information after the deadline time are arranged in a time sequence order; processing according to the feature set and the feature chain to obtain a detection result.

[0011] In a possible implementation manner of the first aspect, the analyzing according to the wire information, the second detection information and the deadline time to obtain a feature set and a feature chain comprises: segmenting the second detection information into first segmented information and second segmented information according to the deadline time; wherein the first segmented information is used to reflect the second detection information before the deadline time, and the second segmented information is used to reflect the second detection information after the deadline time; analyzing according to the deadline time to obtain a processing time period; wherein the processing time period is used to reflect an arbitrary time period before the deadline time; analyzing according to the wire information, the first segmented information and the processing time period to obtain a feature set; analyzing according to the wire information, the second segmented information and the processing time period to obtain a feature chain.

[0012] In a possible implementation manner of the first aspect, the analyzing according to the wire information, the first segmented information and the processing time period to obtain a feature set comprises: extracting a temperature value corresponding to an end time of the processing time period from first temperature information in the first segmented information, and confirming the temperature value as a first temperature value; wherein the end time is used to reflect a maximum time point in the processing time period; extracting a temperature value corresponding to the end time of the processing time period from second temperature information in the first segmented information, and confirming the temperature value as a second temperature value; comparing according to the first temperature value and the ambient temperature information to obtain a first temperature difference; wherein the first temperature difference is used to reflect a difference value between the first temperature value and the ambient temperature information; According to the first temperature value and the second temperature value, a second temperature difference is obtained, wherein the second temperature difference is used to reflect a difference between the first temperature value and the second temperature value; According to the wire diameter information, the processing time period, the first temperature difference and the second temperature difference, a reference coefficient is obtained, wherein the reference coefficient is used to reflect a temperature diffusion rate of the wire before the cutoff time; A set of multiple reference coefficients is confirmed as a feature set.

[0013] In a possible implementation manner of the first aspect, the analysis according to the wire information, the second segmentation information and the processing time period to obtain a feature chain comprises: According to the processing time period, a temperature value corresponding to the processing time period is obtained from the first temperature information in the second segmentation information, and the temperature value is confirmed as a third temperature value; According to the processing time period, a temperature value corresponding to the processing time period is obtained from the second temperature information in the second segmentation information, and the temperature value is confirmed as a fourth temperature value; According to the third temperature value and the ambient temperature information, a third temperature difference is obtained, wherein the third temperature difference is used to reflect a difference between the third temperature value and the ambient temperature information; According to the third temperature value and the fourth temperature value, a fourth temperature difference is obtained, wherein the fourth temperature difference is used to reflect a difference between the third temperature value and the fourth temperature value; According to the wire diameter information, the processing time period, the third temperature difference and the fourth temperature difference, a diffusion coefficient is obtained, wherein the diffusion coefficient is used to reflect a temperature diffusion rate of the wire after the cutoff time; The multiple diffusion coefficients are arranged in a time sequence order to obtain a feature chain.

[0014] In a possible implementation manner of the first aspect, the processing according to the feature set and the feature chain to obtain a detection result comprises: According to the multiple reference coefficients in the feature set, a processing coefficient is obtained, wherein the processing coefficient is used to reflect a normal distribution value of the multiple reference coefficients; According to a time sequence comparison between the processing coefficient and a diffusion coefficient corresponding to a last node in the feature chain, a second comparison result is obtained, wherein the second comparison result is used to reflect a difference between the processing coefficient and the diffusion coefficient corresponding to the last node; According to the second comparison result, a detection result is obtained.

[0015] In a possible implementation manner of the first aspect, the analyzing according to the second comparison result to obtain a detection result comprises: When the second comparison result is not equal to 0, the detection result is that there is an internal defect, otherwise, the detection result is that there is no internal defect.

[0016] In the second aspect, the embodiments of the present application provide a copper-clad aluminum alloy wire defect automatic detection system, comprising: An acquisition module is configured to acquire wire information, wherein the wire information comprises wire diameter information reflecting a specification size of the wire and environment temperature information reflecting a temperature of a detection environment; A first analysis module is configured to analyze, based on the wire information, to obtain detection information corresponding to the wire information, wherein the detection information comprises a detection position of the wire to be detected, a target angle of the wire to be detected, and a bending rate of the wire to be detected; A control module is configured to control a copper-clad aluminum alloy wire defect automatic detection device to perform a bending and heating operation on the wire based on the detection information, and to acquire first detection information and second detection information, wherein the bending and heating operation is configured to reflect an operation of heating and bending the wire to make a bending angle of the wire reach the target angle, the first detection information is configured to reflect a surface feature of the wire at the detection position, and the second detection information is configured to reflect a surface temperature of the wire at the detection position; A second analysis module is configured to analyze, based on the wire information, the first detection information, and the second detection information, to obtain a detection result, wherein the detection result is configured to reflect a defect condition between internal layers of the wire.

[0017] In the third aspect, the embodiments of the present application provide a copper-clad aluminum alloy wire defect automatic detection device, comprising a bending device, a heating device, a detection device, and a control device, wherein the bending device, the heating device, and the detection device are electrically connected to the control device, the control device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the computer program is executed by the processor to implement the method of any one of the first aspect.

[0018] In the fourth aspect, the embodiments of the present application provide a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the method of any one of the first aspect.

[0019] In a fifth aspect, the embodiments of the present application provide a computer program, which, when running on the copper-clad aluminum alloy wire defect automatic detection device, enables the copper-clad aluminum alloy wire defect automatic detection device to perform the copper-clad aluminum alloy wire defect automatic detection method according to any one of the first aspect.

[0020] It can be understood that the beneficial effects of the second aspect to the fifth aspect described above can be referred to the related description in the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is a flowchart of the copper-clad aluminum alloy wire defect automatic detection method provided by an embodiment of the present application; Figure 2 is a flowchart of the implementation process of the copper-clad aluminum alloy wire defect automatic detection method provided by an embodiment of the present application; Figure 3 is a structural diagram of the copper-clad aluminum alloy wire defect automatic detection system provided by an embodiment of the present application; Figure 4 is a structural diagram of the control device of the copper-clad aluminum alloy wire defect automatic detection device provided by an embodiment of the present application; Figure 5 is a structural diagram of the bending device of the copper-clad aluminum alloy wire defect automatic detection device provided by an embodiment of the present application; In the drawings, various reference signs represent: 100, bending device; 110, bending arm; 120, conveying mechanism; 130, driving device; 140, angle detection mechanism. DETAILED DESCRIPTION

[0023] In the following description, specific details are set forth in order to provide a thorough understanding of the embodiments of the present application. However, persons skilled in the art will understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary details.

[0024] It should be understood that the terms "comprises" and / or "comprising," when used in this specification, and / or the following claims, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0025] It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items, and that the term "at least one of' denotes one, or a plurality of, or any combination of the listed items.

[0026] As used in the description of the application and the following claims, the term "if' can be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [a described condition or event] is detected" can be interpreted to mean "upon determining" or "in response to determining" or "upon detecting [the described condition or event]" or "in response to detecting [the described condition or event]," depending on the context.

[0027] In addition, the description in the specification of the application and the appended claims, the terms "first," "second," "third," etc. are used merely as labels, and are not intended to impose numerical or sequential order unless it is expressly so indicated.

[0028] Reference in the specification to "one embodiment" or "an embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places in the specification are not necessarily all referring to the same embodiment, although it can. The terms "comprise," "comprising," "include," "including," and "has" or "having" or variants thereof are intended to be open-ended terms that do not exclude additional, unrecited elements or method steps. The terms "first," "second," and "third" and the like can be used to denote different units or elements it does not imply a particular importance of one over the other.

[0029] In the related art, especially in the mechanical property detection process of the wire, the traditional bending test method has a significant technical blind spot. This method mainly determines whether the wire is qualified by observing whether the outer layer of the wire cracks through bending test of the wire, but for copper-clad aluminum alloy wire, it cannot effectively evaluate the bonding force state between the internal layers. For example, when the copper-clad aluminum alloy wire is bent, a gap may occur between the copper layer and the aluminum core without cracks on the surface of the copper layer. At this time, it may be misjudged as a qualified product because only the integrity of the wire is detected, or it needs to be detected again for electrical performance after mechanical property detection. When the electrical performance is not detected again, the mechanical property evaluation of the copper-clad aluminum alloy wire may be affected because the copper layer peels off during the bending detection process, which directly leads to damage to the insulation performance, resulting in differences in the mechanical property evaluation of the copper-clad aluminum alloy wire. When the electrical performance is detected again, the detection efficiency is reduced due to the increase in detection steps, and the difference in the mechanical property evaluation of the copper-clad aluminum alloy wire may cause the defective wire to be in a high-voltage or humid environment during use, which has a high risk of short circuit. The reduction in detection efficiency may not match the high-speed production line, which requires reducing the production speed or stopping the production line for detection in segments, resulting in a decrease in the overall production capacity of the product.

[0030] To solve the above problems, the embodiments of the present application provide a copper-clad aluminum alloy wire defect automatic detection method. In this method, first, the wire diameter information reflecting the specification size of the wire and the environmental temperature information reflecting the size of the detection environment temperature are obtained, and then based on the wire information, the detection information including the detection position reflecting the wire that needs to be detected, the target angle reflecting the wire that needs to be detected, and the bending rate reflecting the wire that needs to be detected is analyzed and obtained. Then, based on the detection information, the copper-clad aluminum alloy wire defect automatic detection device is controlled to perform the first operation on the wire, and the first detection information reflecting the surface image of the wire and the second detection information reflecting the surface temperature of the wire are obtained. Finally, based on the wire information, the first detection information and the second detection information, the detection result is obtained.

[0031] The copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application can be applied to a copper-clad aluminum alloy wire defect automatic detection device. At this time, the copper-clad aluminum alloy wire defect automatic detection device is the execution subject of the copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application, and the specific type of the copper-clad aluminum alloy wire defect automatic detection device is not limited in the embodiments of the present application.

[0032] The copper-clad aluminum alloy wire defect automatic detection device includes a bending device 100, a heating device, a detection device, and a control device. The bending device 100, the heating device, and the detection device are electrically connected to the control device. The bending device 100 is used for bending detection of the copper-clad aluminum alloy wire. Please refer toFigure 5 The bending device includes a bending arm 110, a conveying mechanism 120, a driving device 130, and an angle detecting mechanism 140. The bending arm 110 is used to bend the copper-clad aluminum alloy wire. For example, the bending arm 110 can be a suspension type bending arm or a double support point type bending arm, etc. The conveying mechanism 120 is used to convey the copper-clad aluminum alloy wire to the bending device 100 for bending. For example, the conveying mechanism 120 can be a conveying wheel or a conveying belt, etc. The driving device 130 is used to provide power to the bending arm 110. For example, the driving device 130 can be an electric motor driving machine or a hydraulic driving machine, etc. The angle detecting mechanism 140 is used to detect the bending angle of the copper-clad aluminum alloy wire. For example, the angle detecting mechanism 140 can be a photoelectric editor or a laser angle measuring instrument, etc. The bending process is that when the detection position of the copper-clad aluminum alloy wire reaches the bending device, the detection position of the copper-clad aluminum alloy wire is bent in the direction away from the detection position along with the bending device 100. The heating device is used to heat the copper-clad aluminum alloy wire. For example, the heating device can be an induction heating device or an infrared radiator, etc. When the detection position of the copper-clad aluminum alloy wire starts to bend, the heating device irradiates the detection position to warm it up. The detection device includes a temperature detecting device and an image detecting device. The temperature detecting device is used to detect the surface temperature of the copper-clad aluminum alloy wire. For example, the temperature detecting device can be an infrared thermal imager or an infrared temperature sensor, etc. The image detecting device is used to acquire the surface image of the copper-clad aluminum alloy wire. For example, the image detecting device can be an industrial camera or a face array camera, etc. The temperature detecting device and the image detecting device are both arranged at the bending position of the bending arm 110. The control device is used to monitor and control the defect detection process of the copper-clad aluminum alloy wire.

[0033] For example, the control device can be a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a smart TV, a smart television, a handheld device with wireless communication function, a desktop computer, a handheld device with wireless communication function, a computer, a laptop computer, a handheld computing device, etc.

[0034] In order to better understand the copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application, the specific implementation process of the copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application will be exemplarily introduced below.

[0035] Figure 1 And Figure 2 The copper-clad aluminum alloy wire defect automatic detection method provided by the embodiments of the present application is shown in the schematic flow chart, please refer to Figure 1 And Figure 2 The copper-clad aluminum alloy wire defect automatic detection method includes: S100, acquire wire information; wherein the wire information includes wire diameter information reflecting the specification size of the wire and environment temperature information reflecting the size of the detection environment temperature.

[0036] Exemplarily, the wire diameter information can be acquired by manual input. The wire diameter information can also be acquired directly by reading a production diary. The production diary refers to a document or management tool recording various parameter information of the copper-clad aluminum alloy wire obtained in the process of producing the copper-clad aluminum alloy wire, wherein the various parameter information includes the wire diameter size of the copper-clad aluminum alloy wire. The environment temperature information can be acquired by manual input. The environment temperature information can also be acquired directly by a temperature detection device (such as a temperature sensor or an infrared sensor, etc.) in the copper-clad aluminum alloy wire automatic detection device.

[0037] S200, based on the wire information, analyze to obtain detection information corresponding to the wire information; wherein the detection information includes a detection position at which the wire needs to be detected, a target angle at which the wire needs to be detected, and a bending rate at which the wire needs to be detected.

[0038] It can be understood that copper-clad aluminum alloy wires of different specifications are used in different use scenarios, and the mechanical performance requirements thereof are different. For example, in the use scenarios of charging wires or earphone wires, the copper-clad aluminum alloy wire is required to have sufficient flexibility to resist bending and breaking, while in the use scenarios of overhead wires or cables, more attention is paid to the structural strength of the copper-clad aluminum alloy wire to resist vibration under the influence of wind for a long time.

[0039] Exemplarily, the corresponding detection information can be obtained by matching the wire information with the data in the detection database. The detection information output by the learning model can also be obtained by inputting the wire information into the learning model, etc., but is not limited thereto. The detection database refers to a database containing all wire information and detection information corresponding to each wire information. These data can be obtained by laboratory experiments, field measurements and monitoring, and past experience, etc. After being obtained, the collected data is sorted, classified and archived, useful information and rules are extracted, and related data is saved into the database to form the detection database. The learning model is trained by multiple sets of training data, and each set of training data in the multiple sets of training data includes wire information and corresponding detection information.

[0040] S300, based on the detection information, control the copper-clad aluminum alloy wire defect automatic detection device to perform a bending and heating operation on the wire, and acquire first detection information and second detection information; wherein the bending and heating operation is used to reflect an operation of heating and bending the wire so that the bending angle of the wire reaches the target angle, the first detection information is used to reflect the surface features of the wire at the detection position, and the second detection information is used to reflect the surface temperature of the wire at the detection position.

[0041] It can be understood that the bending device in the copper-clad aluminum alloy wire defect automatic detection device can control the bending test at the detection position at the same time as the bending rate of the detection information, and the temperature rising operation is performed at the detection position until the included angle formed by the two side line segments of the bending part of the wire reaches the target angle in the detection information, and thus the bending temperature rising operation at the detection position is completed. During the bending temperature rising operation of the wire, the surface features of the side that is concave inward when the wire is bent at the detection position are acquired in real time, and the surface temperature of the side that is convex outward when the wire is bent at the detection position is acquired in real time, and finally the surface features of the side are confirmed as the first detection information, and the surface temperatures of the two sides are confirmed as the second detection information, so as to complete the acquisition of the first detection information and the second detection information.

[0042] In a possible implementation, in step S300, the copper-clad aluminum alloy wire defect automatic detection device is controlled to perform the bending temperature rising operation on the wire based on the detection information, and the first detection information and the second detection information are acquired, including: S310, according to the bending rate of the detection information, the copper-clad aluminum alloy wire defect automatic detection device controls the bending operation at the detection position as the bending outer side of the wire, and performs the temperature rising at the detection position; wherein the bending outer side is used to reflect the side that is convex outward when the wire is bent at the detection position, and the bending angle is used to reflect the included angle formed by the two side line segments of the bending part of the wire after the bending operation is performed on the wire.

[0043] It can be understood that when the copper-clad aluminum alloy wire defect automatic detection device receives the detection signal, the control device controls the bending device to bend the wire outward at the detection position, so that the detection position bending is the bending outer side, and at the same time, the temperature rising is performed at the detection position until the bending angle reaches the target angle when the wire is bent at the bending rate, and the bending detection of the copper-clad aluminum alloy wire is completed. The timing of stopping the temperature rising operation is explained to avoid that the temperature is too high to affect the performance of the wire itself S320, the image information and the first temperature information are acquired in real time at the bending inner side, and the image information is confirmed as the first detection information; wherein the bending inner side is used to reflect the side that is concave inward when the wire is bent at the detection position.

[0044] It can be understood that the copper-clad aluminum alloy wire defect automatic detection device can receive the detection signal at the same time, and release the trigger signal to the temperature detection device and the image detection device, so that the temperature detection device and the image detection device start the acquisition operation of the surface temperature and the surface features of the copper-clad aluminum alloy wire at the bending inner side at the same time, and obtain the first temperature information and the image information.

[0045] S330, acquiring second temperature information in real time at the bending outer side; wherein the second temperature information is acquired at the same time as the first temperature information.

[0046] It can be understood that the temperature detection device can be triggered to acquire the surface temperature of the copper-clad aluminum alloy wire at the bending outer side of the detection position and obtain the second temperature information at the same time when the detection signal is received by the copper-clad aluminum alloy wire defect automatic detection device.

[0047] S340, confirming the first temperature information and the second temperature information as second detection information.

[0048] It can be understood that the first temperature information and the second temperature information are combined in the time dimension, and the combined information is confirmed as the second detection information.

[0049] In this way, the bending operation of the copper-clad aluminum alloy wire is dynamically controlled by the bending rate parameter acquired in real time, the detection position is accurately positioned as the bending outer side and the temperature rising treatment is applied, and the targeted detection of the stress concentration area of the wire rod is realized.

[0050] S400, analyzing the wire rod information, the first detection information and the second detection information to obtain a detection result; wherein the detection result is used to reflect the defect condition between the internal layers of the wire rod.

[0051] It can be understood that the time when the color value changes corresponding to the geometric center point of the image information in the first detection information can be obtained by analyzing the first detection information, and then the time, the wire rod information and the second detection information are analyzed to obtain the detection result.

[0052] The time when the information entropy in the image information in the first detection information changes and the position in the image information where the information entropy changes at the time can be obtained by analyzing the first detection information. The diffusion distance can be obtained according to the position and the diameter information of the wire information. A temperature can be obtained from the first temperature information in the second detection information according to the time. A temperature difference between the two temperatures can be obtained by processing the temperature and the environmental temperature information in the wire information. A temperature can be obtained from the second temperature information in the second detection information according to the etching. The temperature obtained from the first temperature information in the second detection information according to the time is compared with the temperature, and a temperature difference between the two temperatures is obtained. The temperature diffusion coefficient can be obtained by processing the diffusion distance, the time when the information entropy in the image information changes, and the two temperature differences. The detection result can be finally obtained by comparing the preset threshold value with the temperature diffusion coefficient. The preset threshold value can be manually input by a person. The threshold value database can be directly obtained. The threshold value database refers to a database containing diffusion coefficients of different types of copper-clad aluminum alloy wires. The data can be obtained by laboratory experiments, on-site measurements and monitoring, and past experience. The collected data is sorted, classified, and archived, and useful information and rules are extracted. Related data is saved in the database to form the threshold value database.

[0053] In a possible implementation, in step S400, the detection result is obtained by analyzing the wire information, the first detection information, and the second detection information, including: S410, the cut-off time is obtained by analyzing the image information in the first detection information; wherein the cut-off time is used to reflect the time point when the color value of the feature point in the image information changes, and the feature point is the geometric center point in the image information.

[0054] It can be understood that for each obtained image information, the geometric center point coordinates of each image information are calculated and marked based on the geometric size of the pixel matrix thereof. The color value parameters (such as RGB, HSV components) of the geometric center point in the continuous frames are tracked in real time, and whether the color value changes is determined by a preset color difference algorithm (such as Euclidean distance or threshold comparison). When the color value of the geometric center point changes, the timestamp corresponding to the current frame is recorded as the cut-off time.

[0055] The image information obtained can also be analyzed. The time when the information entropy in the image information changes is analyzed as the cut-off time. The information entropy refers to the color richness of the image information.

[0056] In a possible implementation, in step S410, the cut-off time is obtained by analyzing the image information in the first detection information, including: S411, obtain a geometric center point of the image information, and obtain a center color value corresponding to the geometric center point; wherein the center color value is used to reflect a color value size of the geometric center point in the image information.

[0057] It can be understood that the image data containing two-dimensional information composed of a pixel matrix is collected, and then the geometric center point coordinate of the image is determined as (W / 2, H / 2) by the geometric center coordinate calculation module according to the size parameters (such as width W and height H) of the image pixel matrix. The color parameter of the corresponding position in the image color value matrix is extracted as the center color value based on the coordinate of the geometric center point, the color parameter includes at least one of RGB component, HSV component or gray value, and the center color value is converted into a standardized numerical value (such as an integer value or a normalized floating point value in the range of 0-255) for representing the color value feature of the geometric center point.

[0058] S412, compare the center color value at the i-th moment with the center color value at the i+1-th moment in the first detection information to obtain a first comparison result; wherein the first comparison result is used to reflect the difference between the center color value at the i-th moment and the center color value at the i+1-th moment.

[0059] It can be understood that the frame images at the i-th moment and at the i+1-th moment in the first detection information are extracted, and the geometric center point coordinates and the corresponding center color values of the two frame images are obtained respectively, and then the center color values of the geometric center points of the two frame images are directly compared to obtain the first comparison result.

[0060] S413, when the first comparison result is not equal to 0, the i+1-th moment is confirmed as the cutoff time.

[0061] It can be understood that through the non-zero determination of the first comparison result, the initial moment of color value change is quickly locked, so as to accurately reflect the starting node of the event that the temperature spreads from the curved outside to the curved inside during the heating process.

[0062] In this way, by heating the curved outside, and then synchronously collecting the temperature information and the image information of the inside and the outside, the heat conduction abnormality caused by the defects in the material inside the wire during the bending process can be accurately positioned. The cooperative detection of the surface response and the internal defects is realized, and the missed detection rate is effectively reduced.

[0063] S420, processing according to the wire information, the second detection information and the cutoff time to obtain a detection result.

[0064] It can be understood that the set of temperature diffusion characteristics before the cutoff time in the second detection information and the characteristic chain of the temperature diffusion characteristics after the cutoff time in the second detection information can be obtained by analyzing the wire information, the second detection information and the cutoff time, and then the normal distribution value between the multiple data in the set can be obtained by analyzing the set, and finally the detection result can be obtained by sequentially comparing the normal distribution value with the characteristic chain.

[0065] The wire information, the second detection information and the cutoff time can also be analyzed by the analysis model to obtain the detection result, that is, the wire information, the second detection information and the cutoff time are input into the analysis model, and the analysis model outputs the corresponding detection result. The training process of the analysis model can be performed by taking the data obtained by data processing the wire information, the second detection information and the cutoff time and the detection result as the training data set of the analysis model, and then the analysis model is trained and learned by inputting the training data set of the analysis model into the analysis model, and finally the analysis model is obtained.

[0066] In this way, by analyzing the color value change time of the geometric center point in the image information, the starting time of the temperature diffusion from the outer side to the inner side of the material during the bending process can be located in real time, and by combining the cutoff time, the second detection information and the wire information, whether the internal gap defect occurs during the bending process can be analyzed, so that the mechanical performance of the wire can be accurately evaluated.

[0067] In a possible implementation, in step S420, the wire information, the second detection information and the cutoff time are processed to obtain a detection result, including: S421, the wire information, the second detection information and the cutoff time are analyzed to obtain a feature set and a characteristic chain; wherein the feature set is used to reflect the set of temperature diffusion characteristics before the cutoff time in the second detection information, and the characteristic chain is used to reflect the characteristic chain of the temperature diffusion characteristics after the cutoff time in the second detection information in time sequence order.

[0068] It can be understood that the two sections of the second detection information before and after the cutoff time can be obtained by processing the second detection information by the cutoff time, and then the feature set reflecting any time period before the cutoff time can be obtained by analyzing the cutoff time, and then the feature set can be obtained by analyzing the time period, the wire information and the second detection information before the cutoff time, and the characteristic chain can be obtained by analyzing the time period, the wire information and the second detection information after the cutoff time. The feature set and the characteristic chain output by the learning model can also be obtained by inputting the wire information, the second detection information and the cutoff time into the learning model, and the like, but are not limited thereto.

[0069] In a possible implementation, in step S421, the second detection information is analyzed according to the wire information, the second detection information and the cutoff time to obtain the feature set and the feature chain, including: S4211, the second detection information is divided into first segmentation information and second segmentation information according to the cutoff time; wherein the first segmentation information is used to reflect the second detection information before the cutoff time, and the second segmentation information is used to reflect the second detection information after the cutoff time.

[0070] It can be understood that the data segment with a timestamp less than or equal to the cutoff time in the second detection information is extracted and taken as the first segmentation information, and the data segment with a timestamp greater than or equal to the cutoff time in the second detection information is extracted and taken as the second segmentation information. The first temperature information and the second temperature information are included in the second detection information, and the second detection information is divided into the first segmentation information and the second segmentation information according to the cutoff time, the first segmentation information includes the first temperature information and the second temperature information before the cutoff time, and the second segmentation information includes the first temperature information and the second temperature information after the cutoff time.

[0071] S4212, the processing time period is obtained by analyzing the cutoff time; wherein the processing time period is used to reflect an arbitrary time period before the cutoff time.

[0072] It can be understood that a fixed interval time can be manually set, and the processing time period can be obtained by analyzing the cutoff time and the fixed interval time, for example, the processing time period is set to N seconds (N is the fixed interval time) before the cutoff time. The processing time period can also be directly obtained by analyzing the cutoff time, that is, the time from when the copper-clad aluminum alloy wire defect automatic detection device receives the detection signal to the cutoff time is taken as the processing time period.

[0073] S4213, the feature set is obtained by analyzing the wire information, the first segmentation information and the processing time period.

[0074] It can be understood that the temperature value corresponding to the maximum time point in the processing time period in the first temperature information can be obtained by analyzing the first temperature information in the first segmentation information and the processing time period, and then the temperature value is compared with the ambient temperature information in the wire information to obtain the first difference value between the temperature value and the ambient temperature information. At the same time, the temperature value corresponding to the maximum time point in the processing time period in the second temperature information is obtained by analyzing the second temperature information in the first segmentation information and the processing time period, and then the temperature value is compared with the temperature value corresponding to the maximum time point in the processing time period in the first temperature information in the first segmentation information to obtain the second difference value between the two temperature values. Finally, the rate of temperature diffusion of the wire before the cutoff time is obtained by processing the wire diameter information in the wire information, the processing time period, and the first difference value and the second difference value, and a plurality of the rate is confirmed as a feature set. The wire information, the first segmentation information, and the processing time period are also input into the learning model to obtain the feature set output by the learning model, and the like, but are not limited thereto.

[0075] In a possible implementation, in step S4213, the feature set is obtained by analyzing the wire information, the first segmentation information, and the processing time period, including: S42131, a temperature value corresponding to an end time of the processing time period is extracted from the first temperature information in the first segmentation information, and the temperature value is confirmed as a first temperature value; wherein the end time is used to reflect the maximum time point in the processing time period.

[0076] It can be understood that because the processing time period is a length of time, and the processing time period is obtained by analyzing the cutoff time, and the timestamps of the first segmentation information are all less than or equal to the cutoff time, the timestamp corresponding to the first temperature value is the end time of the processing time period. For example, if the cutoff time is 5s and the length of the processing time period is 3s, then the first temperature value is the temperature value in the first temperature information at the 3s, and so on.

[0077] S42132, a temperature value corresponding to an end time of the processing time period is extracted from the second temperature information in the first segmentation information, and the temperature value is confirmed as a second temperature value.

[0078] It can be understood that the second temperature value can be obtained by the extraction method of extracting the first temperature value in step S42131, which will not be described here.

[0079] S42133, the first temperature value is compared with the ambient temperature information to obtain the first temperature difference; wherein the first temperature difference is used to reflect the difference between the first temperature value and the ambient temperature information.

[0080] It can be understood that the first temperature difference = the first temperature value - the ambient temperature information.

[0081] S42134, according to the first temperature value and the second temperature value, a second temperature difference is obtained; wherein the second temperature difference is used to reflect the difference between the first temperature value and the second temperature value.

[0082] It can be understood that the second temperature difference = the first temperature value - the second temperature value.

[0083] S42135, according to the wire diameter information, the processing time period, the first temperature difference and the second temperature difference, a reference coefficient is obtained; wherein the reference coefficient is used to reflect the temperature diffusion rate of the wire before the cutoff time.

[0084] It can be understood that the calculation formula of the reference coefficient can be , wherein B is the reference coefficient, d is the wire diameter information, t is the processing time period, ∆T1 is the first temperature difference, and ∆T2 is the second temperature difference.

[0085] S42136, a set of multiple reference coefficients is confirmed as a feature set.

[0086] It can be understood that because the length of the processing time period is less than the cutoff time, the first temperature value obtained by the processing time period can be multiple temperature values corresponding to multiple time points between the processing time period and the cutoff time in the first temperature information, and the second temperature value can be multiple temperature values corresponding to multiple time points between the processing time period and the cutoff time in the second temperature information, that is, there are multiple reference coefficients.

[0087] In this way, by extracting the internal and external temperature values at the end of the processing time period, the final state of the thermal response of the material after the bending operation is captured, the temperature diffusion rate is quantified in combination with the wire diameter size, the processing time period and the temperature difference information, and the mapping relationship between the internal condition and the thermal response is established, so that the existence of the internal defects of the wire during the bending detection of the wire can be judged through the mapping relationship.

[0088] S4214, according to the wire information, the second segmentation information and the processing time period, a feature chain is obtained.

[0089] It can be understood that the temperature value corresponding to the processing time period in the first temperature information can be obtained by analyzing the first temperature information in the second segmentation information and the processing time period, and then the third difference value between the temperature value and the ambient temperature information in the wire information is obtained by comparing the temperature value with the ambient temperature information in the wire information. Meanwhile, the temperature value corresponding to the processing time period in the second temperature information is obtained by analyzing the second temperature information in the second segmentation information and the processing time period, and then the fourth difference value between the two temperature values is obtained by comparing the temperature value with the temperature value corresponding to the processing time period in the first temperature information in the second segmentation information. Finally, the rate of temperature diffusion of the wire after the cutoff time is obtained by processing the wire diameter information in the wire information, the processing time period, and the third difference value and the fourth difference value, and then the rates are processed in time sequence to obtain the feature chain. The feature chain output by the learning model is obtained by inputting the wire information, the second segmentation information, and the processing time period into the learning model, and the like, but is not limited thereto.

[0090] In this way, by dividing the second detection information (temperature data) into before the cutoff time and after the cutoff time according to the cutoff time, the thermal response characteristics of defects in the stress concentration stage (before the cutoff time) and the stable diffusion stage (after the cutoff time) can be captured respectively, avoiding the limitation of a single time point.

[0091] In a possible implementation, in step S4214, the feature chain is obtained by analyzing the wire information, the second segmentation information, and the processing time period, including: S42141, the temperature value corresponding to the processing time period is obtained from the first temperature information in the second segmentation information according to the processing time period, and the temperature value is confirmed as the third temperature value.

[0092] It can be understood that because the timestamps of the second segmentation information are all greater than or equal to the cutoff time, the timestamp of the third temperature value is the sum of the timestamp corresponding to the first temperature information in the second segmentation information and the processing time period. For example, if the cutoff time is 5 s and the processing time period is 3 s, the third temperature value is the temperature value corresponding to the first temperature information in the second segmentation information at the 8th (5+3) s, and so on.

[0093] S42142, the temperature value corresponding to the processing time period is obtained from the second temperature information in the second segmentation information according to the processing time period, and the temperature value is confirmed as the fourth temperature value.

[0094] It can be understood that the fourth temperature value can be obtained by the method of obtaining the third temperature value in step S42141, which will not be described here.

[0095] S42143, according to the third temperature value and the ambient temperature information, a third temperature difference is obtained; wherein the third temperature difference is used to reflect the difference between the third temperature value and the ambient temperature information.

[0096] It can be understood that the third temperature difference = the third temperature value - the ambient temperature information.

[0097] S42144, according to the third temperature value and the fourth temperature value, a fourth temperature difference is obtained; wherein the fourth temperature difference is used to reflect the difference between the third temperature value and the fourth temperature value.

[0098] It can be understood that the fourth temperature difference = the third temperature value - the fourth temperature value.

[0099] S42145, according to the wire diameter information, the processing time period, the third temperature difference and the fourth temperature difference, a diffusion coefficient is obtained; wherein the diffusion coefficient is used to reflect the rate of temperature diffusion of the wire after the cutoff time.

[0100] It can be understood that the processing process of obtaining the diffusion coefficient can be obtained by the processing method of obtaining the reference coefficient in step S42135, which will not be repeated here.

[0101] S42146, arrange a plurality of diffusion coefficients in time sequence order to obtain a feature chain.

[0102] It can be understood that the plurality of diffusion coefficients can be arranged by analyzing the time of the processing time period of obtaining the diffusion coefficient as the sorting order, and the diffusion coefficient can also be sorted by the order of obtaining the diffusion coefficient to obtain the feature chain. Because the time of obtaining each section gradually increases as the bending detection of the wire progresses, the diffusion coefficient increases with the increase of the time of obtaining each section.

[0103] In this way, the temperature diffusion rate is calculated by combining the wire diameter information, the processing time period and the temperature difference data, which can quantify the thermal response stability of the material after the cutoff time. And the internal defect condition of the wire during the bending process is revealed by the temperature diffusion rate, that is, when the temperature diffusion rate changes, it indicates the crack propagation inside the wire.

[0104] S422, according to the feature set and the feature chain, a detection result is obtained.

[0105] It can be understood that the normal distribution value between the plurality of reference coefficients in the feature set can be obtained by processing, and then the normal distribution value is compared with the last node of the feature chain in real time to obtain the difference value between the processing coefficient and the diffusion coefficient corresponding to the last node, and finally the detection result is obtained by analyzing the difference value. The last coefficient in the feature set can also be compared with the last node of the feature chain in real time to obtain the difference value between the processing time sequence and the diffusion coefficient corresponding to the last node, and finally the detection result is obtained by analyzing the difference value.

[0106] In this way, the space-time consistency model for defect judgment is established by combining the wire information, the second detection information and the cutoff time, avoiding the limitation of a single index (such as a fixed temperature threshold), and being especially suitable for cross verification of complex defects.

[0107] In a possible implementation, in step S422, the detection result is obtained by processing the feature set and the feature chain, including: S4221, processing according to the plurality of reference coefficients in the feature set to obtain a processing coefficient; wherein the processing coefficient is used to reflect the normal distribution value of the plurality of reference coefficients.

[0108] It can be understood that the mean and standard deviation between the plurality of reference coefficients in the feature set are calculated as processing data, and then the mean and standard deviation are processed to obtain the standard normal distribution value.

[0109] S4222, time sequence comparison according to the processing coefficient and the diffusion coefficient corresponding to the last node in the feature chain to obtain a second comparison result; wherein the second comparison result is used to reflect the difference value between the processing coefficient and the diffusion coefficient corresponding to the last node.

[0110] It can be understood that the diffusion coefficient corresponding to each chain node of the feature chain refers to the diffusion coefficient corresponding to different bending angles at the bending position of the wire. Because of the bending detection, the number of chain nodes of the diffusion coefficient in the feature chain increases, that is, the diffusion coefficient of the last node of the feature chain increases continuously. By comparing the processing coefficient with the diffusion coefficient corresponding to the last node of the concentration in the feature chain in real time, the mechanical property detection efficiency of the wire is effectively improved.

[0111] S4223, analyzing the second comparison result to obtain a detection result.

[0112] It can be understood that when the second comparison result reflects that the difference between the processing coefficient and the diffusion coefficient corresponding to the last node in the feature chain is not equal to 0, it means that the diffusion coefficient changes relative to the processing coefficient, that is, it can be reflected that at the moment when the diffusion coefficient is obtained, the internal gap defect has been generated in the copper-clad aluminum alloy wire under the influence of the bending detection. Conversely, when the second comparison result reflects that the difference between the processing coefficient and the diffusion coefficient corresponding to the last node in the feature chain is equal to 0, it means that the diffusion coefficient has not changed relative to the processing coefficient, that is, it can be reflected that before the moment when the diffusion coefficient is obtained, the internal gap defect has not been generated in the copper-clad aluminum alloy wire under the influence of the bending detection.

[0113] In this way, by calculating the normal distribution value of the plurality of reference coefficients in the feature set, the individual differences or noise interference can be effectively smoothed, and the overall statistical characteristics of the temperature diffusion of the material before the cutoff time can be extracted. Then, by comparing the processing coefficient with the diffusion coefficient of the last node of the feature chain (the dynamic diffusion rate at the latest moment), the mutation of the internal wire of the material in the bending detection process can be quantified, and thus the detection result can be obtained.

[0114] In a possible implementation, in step S4223, the detection result is obtained by analyzing the second comparison result, including: S42231, when the second comparison result is not equal to 0, the detection result is that there is an internal defect, otherwise, the detection result is that there is no internal defect.

[0115] It can be understood that the diffusion rate of temperature is an inherent property of the material. When the second comparison result changes, that is, the second comparison result is not equal to 0, it means that the diffusion rate of temperature from the outside of the bending to the inside of the bending changes, that is, during the bending detection, because the bending detection causes the gap defect between the copper layer and the aluminum core of the copper-clad aluminum alloy wire, when the gap defect between the copper layer and the aluminum core occurs, the diffusion path of temperature changes from the original “copper layer→aluminum core→copper layer” to “copper layer→gap defect→aluminum core→copper layer”, “copper layer→aluminum core→gap defect→copper layer” or “copper layer→gap defect→aluminum core→gap defect→copper layer”, thereby changing the diffusion rate, that is, the second comparison result changes. Inherent property refers to the inherent and innate characteristics of an object or substance, which are determined by the internal structure of the object (such as atomic composition, molecular arrangement, chemical bond type, etc.), and do not change with changes in external environment (such as temperature, pressure, shape, size), nor disappear due to human intervention or different application scenarios.

[0116] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0117] Corresponding to the copper clad aluminum alloy wire defect automatic detection method described in the above embodiments, the embodiments of the present application also provide a copper clad aluminum alloy wire defect automatic detection system. Each module of the copper clad aluminum alloy wire defect automatic detection system can realize each step of the copper clad aluminum alloy wire defect automatic detection method. Figure 3 The structural block diagram of the copper clad aluminum alloy wire defect automatic detection system provided by the embodiments of the present application is shown, and only the parts related to the embodiments of the present application are shown for ease of illustration.

[0118] Referring to Figure 3 , the copper clad aluminum alloy wire defect automatic detection system comprises: An acquisition module is configured to acquire wire information. The wire information comprises wire diameter information reflecting the specification size of the wire and environmental temperature information reflecting the size of the detection environment temperature.

[0119] A first analysis module is configured to analyze the detection information corresponding to the wire information based on the wire information. The detection information comprises a detection position of the wire to be detected, a target angle of the wire to be detected, and a bending rate of the wire to be detected.

[0120] A control module is configured to control the copper clad aluminum alloy wire defect automatic detection device to perform a bending and heating operation on the wire based on the detection information, and to acquire first detection information and second detection information. The bending and heating operation is configured to reflect the operation of heating and bending the wire to make the bending angle of the wire reach the target angle. The first detection information is configured to reflect the surface features of the wire at the detection position. The second detection information is configured to reflect the surface temperature of the wire at the detection position.

[0121] A second analysis module is configured to analyze the detection result based on the wire information, the first detection information and the second detection information. The detection result is configured to reflect the defect condition between the internal layers of the wire.

[0122] It should be noted that the information interaction, execution process and the like between the above-mentioned system / units, since the same concept, its specific functions and the technology effects brought about, specific can refer to the method embodiment part, here will not be repeated.

[0123] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0124] An embodiment of the present application also provides an automatic detection device for defects in copper-clad aluminum alloy wires. The automatic detection device for defects in copper-clad aluminum alloy wires includes a bending device, a heating device, a detection device, and a control device. The bending device, heating device, detection device, and control device are electrically connected. Figure 4 This is a schematic diagram of the structure of the control device 4 provided in one embodiment of the present application. Figure 4 As shown, the control device 4 of this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown), at least one memory 41 ( Figure 4 Only one is shown in the figure) and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, the control device 4 implements the steps of any of the above-mentioned embodiments of the method for automatically detecting defects in copper-clad aluminum alloy wires, or implements the functions of each module / unit in each embodiment of the above-mentioned system.

[0125] For example, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to implement the present application. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, and the instruction segments are used to describe the execution process of the computer program 42 in the control device 4.

[0126] The control device 4 can be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The control device 4 can include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that Figure 4This is merely an example of the control device 4 and does not constitute a limitation on the control device 4. The control device 4 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0127] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0128] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as a hard drive or memory of the control device 4. In other embodiments, the memory 41 may also be an external storage device of the control device 4, such as a plug-in hard drive, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash memory card, etc. equipped on the control device 4. Furthermore, the memory 41 may include both the internal storage unit of the control device 4 and an external storage device. The memory 41 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or is about to be output.

[0129] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0130] An embodiment of the present application provides a computer program product. When the computer program product is run on a copper-clad aluminum alloy wire defect automatic detection device, the copper-clad aluminum alloy wire defect automatic detection device implements the steps of any of the above-mentioned method embodiments.

[0131] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a computer readable storage medium. According to such understanding, the present application can implement all or part of the processes in the above-mentioned embodiment methods through a computer program to instruct related hardware to complete, and the computer program can be stored in a computer readable storage medium. The computer program can implement the steps of each method embodiment when executed by a processor. The computer program includes computer program code, which can be in the form of source code, object code, executable files or some intermediate forms. The computer readable medium at least includes any entity or device capable of carrying the computer program code to the copper-clad aluminum alloy wire defect automatic detection equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal and software distribution medium. For example, U disk, mobile hard disk, magnetic disk or optical disk and the like.

[0132] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in detail in a certain embodiment can be referred to the related description of other embodiments.

[0133] Those skilled in the art can appreciate that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0134] In the embodiments provided in the present application, it should be understood that the disclosed copper-clad aluminum alloy wire defect automatic detection system and copper-clad aluminum alloy wire defect automatic detection equipment can be implemented in other ways. For example, the above-described copper-clad aluminum alloy wire defect automatic detection system embodiments are merely illustrative. For example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed each other can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0135] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may also be distributed to multiple network units. Part or all of the units can be selected to achieve the purpose of the embodiment scheme according to actual needs.

[0136] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A method for automatically detecting defects in copper-clad aluminum alloy wires, characterized in that: include: Acquire wire information; wherein the wire information includes wire diameter information for reflecting the specification size of the wire and ambient temperature information for reflecting the size of the detection environment temperature; Based on the wire information, analyzing and obtaining detection information corresponding to the wire information; wherein the detection information includes a detection position of the wire to be detected, a target angle of the wire to be detected, and a bending rate of the wire to be detected; Based on the detection information, the automatic detection device for defects in a copper-clad aluminum alloy wire is controlled to perform a bending and heating operation on the wire, and obtain first detection information and second detection information; wherein the bending and heating operation is used to reflect the operation of heating and bending the wire so that the bending angle of the wire reaches the target angle, the first detection information is used to reflect the surface characteristics of the wire at the detection position, and the second detection information is used to reflect the surface temperature of the wire at the detection position; An analysis is performed based on the wire material information, the first detection information, and the second detection information to obtain a detection result; wherein the detection result is used to reflect the defect status between layers inside the wire material.

2. The method for automatically detecting defects in copper-clad aluminum alloy wires according to claim 1, wherein: The method of controlling the automatic copper-clad aluminum alloy wire defect detection device to perform a bending and heating operation on the wire based on the detection information, and obtaining the first detection information and the second detection information, includes: According to the bending rate of the detection information, the automatic copper-clad aluminum alloy wire defect detection device is controlled to perform a bending operation on the detection position as the bending outer side of the wire, and to increase the temperature at the detection position; wherein the bending outer side is used to reflect the side of the wire that bulges outward when the wire is bent at the detection position, and the bending angle is used to reflect the angle formed by the line segments on both sides of the bent portion of the wire after the bending operation; Acquire image information and first temperature information in real time at the inner side of the bend, and confirm the image information as first detection information; wherein the inner side of the bend is used to reflect the side of the wire material that is concave inward when it is bent at the detection position; Acquiring second temperature information in real time at the outer side of the bend; wherein the second temperature information is acquired at the same time as the first temperature information; The first temperature information and the second temperature information are confirmed as second detection information.

3. The automatic detection method for copper-clad aluminum alloy wire defects according to claim 2, characterized in that: The analyzing the wire material information, the first detection information, and the second detection information to obtain a detection result includes: Analyzing the image information in the first detection information to obtain a cutoff time; wherein the cutoff time is used to reflect the time point at which a color value of a feature point in the image information changes, and the feature point is a geometric center point in the image information; Processing is performed according to the wire material information, the second detection information and the cut-off time to obtain a detection result.

4. The automatic detection method for copper-clad aluminum alloy wire defects according to claim 3, characterized in that: The analyzing the image information in the first detection information to obtain the cutoff time includes: Obtaining a geometric center point of the image information and obtaining a central color value corresponding to the geometric center point; wherein the central color value is used to reflect the size of the color value at the geometric center point in the image information; Comparing the central color value at the i-th moment in the first detection information with the central color value at the i+1-th moment to obtain a first comparison result; wherein the first comparison result is used to reflect the difference between the central color value at the i-th moment and the central color value at the i+1-th moment; When the first comparison result is not equal to 0, the (i+1)th moment is confirmed as the deadline.

5. The automatic detection method for copper-clad aluminum alloy wire defects according to claim 3, characterized in that: The processing according to the wire material information, the second detection information and the cut-off time to obtain a detection result includes: Analyzing the wire material information, the second detection information, and the cutoff time to obtain a feature set and a feature chain; wherein the feature set is used to reflect a set of temperature diffusion features in the second detection information before the cutoff time, and the feature chain is used to reflect a feature chain of temperature diffusion features in the second detection information after the cutoff time arranged in a chronological order; The feature set and the feature chain are processed to obtain a detection result.

6. The method for automatically detecting defects in copper-clad aluminum alloy wires according to claim 5, wherein: The analyzing the wire material information, the second detection information, and the cutoff time to obtain a feature set and a feature chain includes: Splitting the second detection information into first segmented information and second segmented information according to the deadline; wherein the first segmented information is used to reflect the second detection information before the deadline, and the second segmented information is used to reflect the second detection information after the deadline; Analyze according to the deadline to obtain a processing time period; wherein the processing time period is used to reflect any time period before the deadline; Analyze the wire material information, the first segmentation information, and the processing time period to obtain a feature set; A feature chain is obtained by analyzing the wire material information, the second segmentation information, and the processing time period.

7. The automatic detection method for copper-clad aluminum alloy wire defects according to claim 6, characterized in that: The analyzing according to the wire material information, the first segmentation information and the processing time period to obtain a feature set includes: extracting a temperature value corresponding to the end time of the processing time period from the first temperature information in the first segmentation information, and confirming the temperature value as the first temperature value; wherein the end time is used to reflect the maximum time point in the processing time period; extracting a temperature value corresponding to the end time of the processing time period from the second temperature information in the first segmentation information, and confirming the temperature value as the second temperature value; Obtaining a first temperature difference according to a comparison between the first temperature value and the ambient temperature information; wherein the first temperature difference is used to reflect the difference between the first temperature value and the ambient temperature information; Obtaining a second temperature difference according to a comparison between the first temperature value and the second temperature value; wherein the second temperature difference is used to reflect the difference between the first temperature value and the second temperature value; Processing is performed based on the wire diameter information, the processing time period, the first temperature difference, and the second temperature difference to obtain a reference coefficient; wherein the reference coefficient is used to reflect the temperature diffusion rate of the wire before the cut-off time; A set of multiple reference coefficients is identified as a feature set.

8. The method for automatically detecting defects in copper-clad aluminum alloy wires according to claim 7, wherein: The analyzing the wire material information, the second segmentation information, and the processing time period to obtain a feature chain includes: Acquire, segment by segment according to the processing time period, a temperature value corresponding to the processing time period from the first temperature information in the second segmentation information, and confirm the temperature value as a third temperature value; acquiring, segment by segment according to the processing time period, a temperature value corresponding to the processing time period from the second temperature information in the second segmentation information, and confirming the temperature value as a fourth temperature value; Obtaining a third temperature difference by comparing the third temperature value with the ambient temperature information; wherein the third temperature difference is used to reflect the difference between the third temperature value and the ambient temperature information; Obtaining a fourth temperature difference by comparing the third temperature value with the fourth temperature value; wherein the fourth temperature difference is used to reflect the difference between the third temperature value and the fourth temperature value; Processing is performed according to the wire diameter information, the processing time period, the third temperature difference, and the fourth temperature difference to obtain a diffusion coefficient; wherein the diffusion coefficient is used to reflect the temperature diffusion rate of the wire after the cut-off time; The plurality of diffusion coefficients are arranged in a time sequence to obtain a characteristic chain.

9. The method for automatically detecting defects in copper-clad aluminum alloy wires according to claim 5, wherein: The processing according to the feature set and the feature chain to obtain a detection result includes: Processing is performed according to the plurality of reference coefficients in the feature set to obtain a processing coefficient; wherein the processing coefficient is used to reflect the normal distribution value of the plurality of reference coefficients; Performing a time series comparison between the processing coefficient and the diffusion coefficient corresponding to the last node in the feature chain to obtain a second comparison result; wherein the second comparison result is used to reflect the difference between the processing coefficient and the diffusion coefficient corresponding to the last node; An analysis is performed based on the second comparison result to obtain a detection result.

10. The automatic detection method for copper-clad aluminum alloy wire defects according to claim 9, characterized in that: The analyzing according to the second comparison result to obtain a detection result includes: When the second comparison result is not equal to 0, the detection result is that an internal defect exists; otherwise, the detection result is that no internal defect exists.

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