Thermal conductivity coefficient measuring device and measuring method

Abstract

The invention discloses a heat conductivity coefficient measuring device and a measuring method, the heat conductivity coefficient measuring device comprises a sample heating copper disc a, a sample heating copper disc b, a height-adjustable clamp and a reading and measuring device, the sample heating copper disc a and the sample heating copper disc b are connected through the height-adjustable clamp and are arranged at two sides of the clamp, and the height can be adjusted through a knob; and the reading and measuring device can respectively or simultaneously measure the temperatures of the upper and lower experiment discs in the sample heating copper disc a and the sample heating copper disc b, and is provided with a timing device. The heat conductivity coefficients of two samples can be measured at the same time, the heat conductivity coefficient of the other sample can be measured through one given heat conductivity coefficient, the mass, the diameter, the specific heat capacity and the like of a copper disc do not need to be measured, asbestos gloves do not need to be worn in the operation process, and experiment loss is effectively reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of experimental equipment devices, and specifically relates to a thermal conductivity coefficient measuring device and a measuring method. BACKGROUND

[0002] Heat conduction is a mode of heat transfer, and the thermal conductivity coefficient is a key to understanding the thermal physical properties of different materials. The steady-state method for measuring the thermal conductivity coefficient of a poor conductor mainly uses the Fourier heat conduction equation to solve the thermal conductivity coefficient through the steady-state method. Currently, the commonly used thermal conductivity coefficient measuring instrument mainly uses a thermocouple to replace the temperature value by using the thermoelectric potential generated by the cold and hot ends of the thermocouple when working to calculate the thermal conductivity coefficient.

[0003] The current steady-state method for measuring the thermal conductivity coefficient usually uses two copper plates in the form of a disc to form a temperature gradient distribution, clamps the processed disc-shaped sample between the two copper plates, heats the upper copper plate, and measures the temperature reaching the steady state. In this process, the copper plate needs to be in close contact with the surface of the sample without air gap, and the mass, diameter and specific heat capacity of the copper plate need to be measured when calculating the data. However, the existing equipment has the following defects:

[0004] During the experiment, the cantilever type sample pressing mechanism is used, which is easy to produce air gap, the lifting process is complicated, the copper plate will be worn and oxidized after a period of use, the mass, diameter and specific heat capacity of the copper plate are usually measured by default, only the lower copper plate is measured, which will affect the specific values of the mass, diameter and specific heat capacity, resulting in errors. During the measurement experiment, the steady-state temperature data is recorded only once every 5 minutes, and the experimental content is not saturated.

[0005] In order to solve the above problems, we make improvements: a thermal conductivity coefficient measuring device and a measuring method. This device uses a double-copper-disc-screw heating structure to measure the thermal conductivity coefficients of two materials at the same time, and this measuring method can calculate the thermal conductivity coefficient of another sample by giving the thermal conductivity coefficient of a sample without measuring the mass, diameter and specific heat capacity of the copper plate. This measure will help to improve the accuracy, firmness and controllability of the experiment and enrich the experimental content. SUMMARY

[0006] In order to solve the above problems, the application provides the following technical scheme: a thermal conductivity coefficient measuring device and a measuring method, which comprises a sample heating copper disc a, a sample heating copper disc b, an adjustable height clamp and a reading and measuring device. The sample heating copper disc a and the sample heating copper disc b are connected through the adjustable height clamp and placed on both sides of the clamp, and the height can be adjusted through the knob on the adjustable height clamp. The reading and measuring device can measure the temperature of the upper and lower experimental discs in the sample heating copper disc a and the sample heating copper disc b respectively or simultaneously, and can be timed respectively.

[0007] As a preferred technical scheme of the present application, the sample heating copper disc a and the sample heating copper disc b are respectively arranged on the two sides of the clamp, so that the weight of the two sides is basically equal, the balance can be maintained for a long time, and problems such as tilting are not prone to occur, the height of the upper experimental disc can be adjusted through the knob, the opening and closing are convenient, and the sample and the experimental disc are in close contact without gaps.

[0008] As a preferred technical scheme of the present application, the double copper disc device can simultaneously measure the thermal conductivities of two samples, and the thermal conductivity of one sample is determined through the given thermal conductivity of the other sample, without measuring the mass, diameter and specific heat capacity of the copper disc, reducing experimental loss, so that the lower experimental disc does not need to be removed, and the stable placement of the experimental disc can be ensured.

[0009] The present application has the following beneficial effects:

[0010] I. The thermal conductivity measuring device can be used to measure the thermal conductivities of two solid materials, and is simple to operate, and the sample to be measured is uniformly heated.

[0011] II. In the present application, the upper experimental disc in the upper sample heating copper disc can be simply opened and closed through the height-adjustable clamp, without considering the position sliding of the upper experimental disc during the experiment, and the stability is high, the hand does not directly contact the heating experimental disc during the operation process, and there is no need to wear asbestos gloves, and the operation is simple.

[0012] III. In the present application, the thermal conductivity of one sample is given, and the thermal conductivity of the other sample is determined, and the accuracy of the measured thermal conductivity is higher. DETAILED DESCRIPTION

[0013] Figure 1 is a three-dimensional structural schematic view of the thermal conductivity measuring device and the measuring method of the present application;

[0014] Figure 2 is a three-dimensional schematic view of the reading and measuring device of the thermal conductivity measuring device and the measuring method of the present application;

[0015] Figure 3 is a three-dimensional schematic view of the sample heating copper disc of the thermal conductivity measuring device and the measuring method of the present application;

[0016] Figure 4 is a three-dimensional exploded schematic view of the height-adjustable clamp of the thermal conductivity measuring device of the present application;

[0017] In the figure: 1, reading and measuring device; 2, sample heating copper disc a; 3, height-adjustable clamp; 4, sample heating copper disc b. DETAILED DESCRIPTION

[0018] Preferred embodiments of the present invention are described in further detail below with reference to the accompanying drawings, which form a part of the detailed description and illustrate illustrative specific embodiments in which the invention may be practiced. In this regard, directional terms, such as "upper," "lower," "left," "right," "top," and "bottom," used with reference to the orientation of the figures being described are for illustrative purposes only and do not limit the structure of this patent. The preferred embodiments described herein are intended only to illustrate and explain the present invention and are not intended to limit the present invention.

[0019] Example: Figure 1 As shown, a thermal conductivity coefficient measuring device includes: the sample heating copper pan a2 and the sample heating copper pan b4 have the same appearance, structure and material, can be connected to the slider 303 by screws, fixed on both sides of the adjustable height clamp 3, and the height of the upper test pan 204 and the upper test pan 404 can be adjusted by the knob 306 above the adjustable clamp 3, and the lower test pans of the sample heating copper pan a2 and the sample heating copper pan b4 are both installed on the reading and measuring device 1.

[0020] like Figure 2 As shown, the reading and measuring device 1 includes a sample heating copper pan a2 temperature adjustment knob 101, a sample heating copper pan b4 temperature adjustment knob 102, a signal output interface 103, an upper and lower experimental pan temperature display conversion switch 104, a timing switch start 105, a timing switch reset 106, a radiator switch 107, an automatic / manual control selection switch 108, a manual control gear 109, a set temperature display light 110 and a corresponding liquid crystal display panel 111, a real-time temperature display light 112 and a corresponding liquid crystal display panel 113, a timer display light 114 and a corresponding liquid crystal display panel 115. The upper part of the liquid crystal display panel in the reading and measuring device 1 displays the relevant parameters of the sample heating copper pan a2, and the lower part displays the relevant parameters of the sample heating copper pan b4.

[0021] like Figure 3 As shown, the sample heating copper pan a2 includes a radiator 201, and the lower experimental pan 203 is a copper disc with a small hole for temperature measurement. It is placed on the copper pan seat 202, and the copper pan seat 201 is fixed above the radiator 201. The upper experimental pan 204 is fixed to the adjustable height fixture 3 through a dovetail type fixed seat. The opening and closing of the upper experimental pan 204 and the lower experimental pan 203 can be adjusted by the knob 306. During the experiment, the sample to be tested can be placed on the lower experimental pan 203, and the sample to be tested can be evenly heated by the upper experimental pan 204. A heater 206 and a heat preservation cover 207 are fixed above the upper experimental pan to realize heating control of the upper experimental pan 204. The structure of the sample heating copper pan b4 is exactly the same as that of the sample heating copper pan a2, including a radiator 401, a copper pan seat 402, a lower experimental pan 403, an upper experimental pan 404, a heater 406 and a heat preservation cover 407.

[0022] As shown in Figure 4 The adjustable height clamp is a screw structure. The screw base 301 is fixed on the reading and measuring device 1 by a hexagonal screw. The screw 305 is connected to the screw base 301 by a bearing 302 and is fixed at the top by a screw pressing plate 306. Three holes are provided in the middle of the sliding block 303. The middle hole passes through the screw 305, and the two side holes pass through the support rod 304 to fix and balance. The heating device pressing plate 308 can be connected to the dovetail type fixing seat 205 and 405 by a screw and is fixed on the sliding block 303. The screw 305 passes through the screw pressing plate 307 at the top and is connected to the knob 306. The support rod 304 is fixed at the top by a screw. During the experiment, by adjusting the knob 306, the opening and closing of the upper and lower experimental discs can be realized, so that the sample and the experimental disc are in close contact without gaps.

[0023] The working and measuring method steps are as follows:

[0024] (1) At the beginning of the experiment, the sample to be tested a and the sample to be tested b are placed on the lower experimental disc 203 and 403, respectively. The upper experimental disc 204 and 404 is covered on the sample to be tested by using the knob 306, and is tightened to make the upper and lower experimental discs in good contact and without air gap. Set the two sample heating copper discs to the same temperature value, and read the temperature value of the upper and lower experimental discs every 5 minutes after heating. After a period of time, when the temperature values of the two samples on the upper and lower experimental discs are unchanged, it is considered that the stable state has been reached, and the respective numerical values at this time are recorded.

[0025] (2) After reaching the stable state, hold the knob 306 to open the upper experimental disc 203 and 403, remove the sample to be tested, and cover the upper experimental disc 204 and 404 on the lower experimental disc 203 and 403, and continue to heat. When the lower experimental disc is about 10℃ higher than the stable state temperature, use the knob 306 to lift the upper experimental disc 204 and 404, stop heating, and let the lower experimental disc 203 and 403 cool naturally, and read its temperature value every 30 seconds. When the thermal conductivity of the known sample b is known, the thermal conductivity of the other sample can be measured by the formula.

[0026] (3) This method can also be used to calculate the thermal conductivity of each sample by giving the mass, thickness and specific heat capacity of the copper disc.

[0027] In summary, the thermal conductivity measuring device is easy to operate, safe and efficient, and has high firmness. The sample is uniformly heated during the experiment, and the mass and diameter of the copper disc do not need to be measured, which saves the operation steps and calculation steps. Various experimental methods are suitable for different needs.

[0028] In the description of the application, it also needs to be explained that, unless otherwise explicitly specified and limited, the terms "fixed", "mounted", "connected", "linked" should be understood broadly, for example, can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing embodiments of the present application are described in detail, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A thermal conductivity determination device and measurement method, comprising a sample heating copper pan a, a sample heating copper pan b, an adjustable height fixture, and a reading and measuring device. The sample heating copper pan a and the sample heating copper pan b are connected by the adjustable height fixture and placed on both sides of the fixture. The heights can be adjusted by a knob on the adjustable height fixture. The reading and measuring device can measure the temperatures of the upper and lower test pans of the sample heating copper pan a and the sample heating copper pan b separately or simultaneously, and can time them separately.

2. The height-adjustable clamp according to claim 1, characterized in that Using a screw structure, the sample heating copper pan a and the sample heating copper pan b are fixed on both sides of the adjustable height fixture, and the height of the upper experimental pan can be adjusted by the knob on the top.

3. The reading and measuring device according to claim 1, characterized in that The set temperature, heating gear, heat dissipation time and other related parameters of the sample heating copper pan a and the sample heating copper pan b can be adjusted separately. The sample heating copper pan a and the sample heating copper pan b according to claim 1 are characterized in that: The two copper plates are identical in size and material and are fixed on both sides of an adjustable height fixture, enabling simultaneous thermal conductivity measurements of two samples.

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