Pin card for wafer test and adjusting method

Abstract

The invention provides a needle card for wafer testing and an adjusting method. The needle card for wafer testing comprises a substrate, a lens and a Z-axis adjusting device. The substrate comprises a first direction perpendicular to the surface of the substrate; the lens is movably mounted on the substrate; the Z-axis adjusting device is connected to the lens and the substrate and used for driving the lens to move in the first direction so as to adjust the relative position of the lens and the substrate. According to the wafer testing needle card and the adjusting method, the relative position between the Z-axis adjusting device lens and the substrate is arranged in the testing needle card, manual adjustment is not needed, and the adjusting accuracy and convenience are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor detection, in particular to a needle card for wafer testing and an adjusting method. BACKGROUND

[0002] In the process of new needle card debugging and subsequent mass production, the distance between the lens and the image sensor chip is usually adjusted to the best state according to the standard of the lens specification book. However, due to inevitable mechanical wear during use, the needle gradually shortens, the position of the lens moves relative to the image sensor chip, and the actual distance between the lens and the image sensor chip gradually decreases. This distance change causes the key parameters of image acquisition or testing (such as imaging clarity, optical performance, etc.) to deteriorate, and cannot be maintained in a state that meets high specification requirements.

[0003] Currently, in order to correct the distance offset between the lens and the image sensor chip, the current solution relies on manual operation: disassemble the entire lens assembly, manually adjust the position of the related support components (such as the lens barrel height). After repeated adjustment and testing, the distance between the lens and the image sensor chip is adjusted to the best distance range specified in the lens specification book. This process is inefficient, has the risk of introducing errors, and is difficult to ensure the stability of the work after repeated disassembly and assembly and the consistency before and after disassembly.

[0004] The statements herein merely provide background technology related to the present application, and do not necessarily constitute the prior art. SUMMARY

[0005] The purpose of the present application is to provide a needle card for wafer testing and an adjusting method, which has the advantage of high adjustment accuracy.

[0006] To achieve the above-mentioned purpose, the present application provides a needle card for wafer testing, which comprises: a substrate, including a first direction perpendicular to the surface of the substrate; a lens, movably mounted on the substrate; a Z-axis adjusting device connected to the lens and the substrate respectively, for driving the lens to move along the first direction to adjust the relative position of the lens and the substrate.

[0007] Optionally, the Z-axis adjusting device comprises a voice coil motor, and the output end of the voice coil motor is connected to the lens.

[0008] Optionally, the lens and the substrate are connected through a threaded pair, the axis direction of the threaded pair is parallel to the first direction, and the Z-axis adjusting device comprises a rotary driving mechanism connected to the lens.

[0009] Optionally, the rotating driving mechanism comprises a driving motor, and the Z-axis adjusting device further comprises a control chip electrically connected to the driving motor, and the lens is controlled to rotate by the driving motor.

[0010] Optionally, the control chip is further configured to monitor the position of the lens.

[0011] Optionally, the substrate has a second direction parallel to the surface of the substrate, and the second direction is perpendicular to the first direction; the wafer testing needle card further comprises an X-axis adjusting device comprising a first slide rail parallel to the second direction and a first electromagnet and a second electromagnet, the first electromagnet is connected to the substrate, the second electromagnet is connected to the lens, the lens can move along the first slide rail, and the lens is driven to move relative to the substrate along the second direction by changing the current of the first electromagnet and the second electromagnet.

[0012] Optionally, the substrate has a third direction parallel to the surface of the substrate, and the third direction is perpendicular to the first direction and the second direction; the wafer testing needle card further comprises a Y-axis adjusting device comprising a second slide rail parallel to the third direction and a third electromagnet and a fourth electromagnet, the third electromagnet is connected to the substrate, the fourth electromagnet is connected to the lens, the lens can move along the second slide rail, and the lens is driven to move relative to the substrate along the third direction by changing the current of the third electromagnet and the fourth electromagnet.

[0013] The application also provides a wafer testing needle card adjusting method, which is used for the wafer testing needle card as described above, and the adjusting method comprises: S10, detecting the position of the lens relative to the substrate; S20, driving the lens to move relative to the substrate along the first direction by the Z-axis adjusting device, so as to change the relative position between the lens and the substrate.

[0014] Optionally, the method further comprises S30, driving the lens to move relative to the substrate along the second direction by the X-axis adjusting device, so as to change the relative position between the lens and the substrate.

[0015] Optionally, the method further comprises S40, driving the lens to move relative to the substrate along the third direction by the Y-axis adjusting device, so as to change the relative position between the lens and the substrate.

[0016] Compared with the prior art, the wafer testing needle card and the adjusting method provided by the application have the following beneficial effects: First, Z-axis high-precision adjustment: By setting the Z-axis adjustment device, the lens and the substrate are automatically and accurately aligned in the vertical direction, avoiding manual operation errors and improving adjustment accuracy and consistency.

[0017] Second, X / Y-axis coordinated compensation: Based on Z-axis adjustment, combined with X-axis adjustment device and Y-axis adjustment device, the lens can move in two directions parallel to the substrate, effectively eliminating lateral displacement deviation.

[0018] Third, three-dimensional all-around alignment: Through joint adjustment of X, Y, and Z directions, full- range high-precision alignment of the lens and the substrate can be achieved, ensuring the stability of the contact between the test needle and the wafer.

[0019] Fourth, improve automation and reliability: Without manual repeated adjustment, the system can quickly respond and automatically correct position deviation, significantly improving the automation level and reliability of the testing process, and is suitable for precise testing of high-density chips. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structural diagram of the lens and the substrate of the needle card of the present application.

[0021] Figure 2 It is a distribution diagram of the lens on the substrate.

[0022] Figure 3 It is a flowchart of the wafer testing needle card adjustment method of the present application.

[0023] BRIEF DESCRIPTION OF DRAWINGS wafer testing needle card 10 substrate 110 lens 120 Z-axis adjustment device 130 image sensor chip 140 DETAILED DESCRIPTION

[0024] The wafer testing needle card and the adjusting method are further described in detail below in combination with the drawings and specific embodiments. The advantages and features of the present application will be more apparent according to the following description. It should be noted that the drawings are very simplified and all use non-precise proportions, only for the purpose of facilitating and clarifying the description of the embodiments of the present application. In order to make the purpose, features and advantages of the present application more apparent and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size and the like shown in the drawings attached to the present specification are only used to cooperate with the content disclosed in the specification, so that those skilled in the art can understand and read, and are not used to limit the conditions for implementing the present application, so they do not have technical significance. Any modification of structure, change of proportion relationship or adjustment of size, which does not affect the effect and purpose that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.

[0025] As shown in Figure 1 and Figure 2 , the present application provides a wafer testing needle card 10. The wafer testing needle card 10 includes a substrate 110, a lens 120 and a Z-axis adjusting device 130. The substrate 110 includes a first direction perpendicular to the surface of the substrate 110, that is, the Z direction as indicated by the arrow in Figure 1 . The lens 120 is movably mounted on the substrate 110, as shown in Figure 2 , in this embodiment, 36 lenses 120 are mounted on the substrate 110, and in other embodiments, the number of lenses 120 can be set on the substrate 110 as needed, which is not limited here.

[0026] As shown in Figure 1 , the Z-axis adjusting device 130 is connected to the lens 120 and the substrate 110, respectively, for driving the lens 120 to move along the first direction to adjust the relative position of the lens 120 and the substrate 110. When the lens 120 is used for a long time, the lens 120 is gradually consumed, the needle length gradually becomes shorter, resulting in the distance between the lens of the lens 120 and the image sensor chip 140 gradually becoming shorter. By setting the Z-axis adjusting device 130 to adjust the position of the lens 120 along the first direction, the position of the lens 120 does not need to be adjusted manually, avoiding the disassembly of the lens 120 and the substrate 110 during the manual adjustment process, and improving the reliability of the adjustment.

[0027] In one embodiment, the Z-axis adjusting device 130 includes a voice coil motor, the output end of the voice coil motor is connected to the lens 120, the voice coil motor drives the lens 120 to move in the substrate 110 by electromagnetic force, and the moving range of the lens 120 is controlled by the push-pull of the spring sheet connected to the lens 120 and the substrate 110 at both ends, avoiding the lens 120 moving beyond the allowed range, and finally realizing the position adjustment of the lens 120.

[0028] In another embodiment, the lens 120 and the substrate 110 are connected through a threaded pair, the axis direction of the threaded pair is parallel to the first direction, and the Z-axis adjustment device 130 comprises a rotary driving mechanism connected to the lens 120. When the rotary driving mechanism drives the lens 120 to rotate, the lens 120 can move along the axis of the threaded pair, i.e. the first direction, due to the connection between the lens 120 and the substrate 110 through the threaded pair, so as to change the relative position between the lens 120 and the substrate 110, thereby achieving the adjustment of the position of the lens 120. In this embodiment, the position of the lens 120 does not need to be manually adjusted, and the lens 120 and the substrate 110 are not disassembled during the process of manually adjusting the relative position between the lens 120 and the substrate 110, thereby improving the reliability of the adjustment.

[0029] In one embodiment, the rotary driving mechanism comprises a driving motor, and the Z-axis adjustment device 130 further comprises a control chip electrically connected to the driving motor. The lens 120 is driven to rotate by the driving motor, and the output of the driving motor is connected to the lens 120, and the axis direction of the output shaft of the driving motor is parallel to the first direction, so as to drive the lens 120 to rotate. In this embodiment, the lens 120 is driven to rotate by the driving motor, and the driving motor can control the rotation of the lens 120 in a step-by-step manner with the control chip, thereby improving the control accuracy of the rotation of the lens 120 and ultimately improving the accuracy of the position adjustment between the lens 120 and the substrate 110. The position of the lens 120 does not need to be manually adjusted, thereby improving the reliability of the adjustment.

[0030] The control chip is further configured to monitor the relative position between the lens 120 and the substrate 110. The position of the lens 120 is monitored while the lens 120 is driven to move, so as to achieve the closed-loop control of the movement of the lens 120 relative to the substrate 110 and accurately adjust the position of the lens 120.

[0031] In one embodiment, as shown in FIG. 1, Figure 2 the substrate 110 has a second direction parallel to the surface of the substrate 110, and the second direction is perpendicular to the first direction, i.e. the X direction shown in FIG. 1. Figure 2 Figure 2 Each block in FIG. 1 represents a lens 120 mounted in the interior of the substrate 110 and a Z-axis adjustment device 130 component connected to the lens 120.

[0032] ​The wafer testing needle card 10 further comprises an X-axis adjusting device, which comprises a first slide rail parallel to the second direction and a first electromagnet and a second electromagnet. The first electromagnet is connected to the substrate 110, and the second electromagnet is connected to the lens 120. The lens 120 can move along the first slide rail, and by changing the current of the first electromagnet and the second electromagnet, the lens 120 is driven to move along the second direction relative to the substrate 110. In this embodiment, by controlling the current of the first electromagnet and the second electromagnet, the relative position between the first electromagnet and the second electromagnet is adjusted, and the first electromagnet and the second electromagnet are respectively connected to the substrate 110 and the lens 120, so that the lens 120 can move relative to the substrate 110 in the second direction, adjust the offset of the lens optical center of the lens 120 relative to the center of the light-sensitive area of the image sensor chip 140 in the X-axis direction, and the relative position adjustment of the substrate 110 and the lens 120 can be realized without disassembling them, thereby improving the convenience of adjustment and avoiding errors introduced in the disassembly process.

[0033] Further, in an embodiment, the substrate 110 has a third direction parallel to the surface of the substrate 110, the third direction is perpendicular to the first direction and the second direction, and the second direction is the Y direction identified in the figure. Figure 2 The Y direction identified in the figure.

[0034] The wafer testing needle card 10 further comprises a Y-axis adjusting device, which comprises a second slide rail parallel to the third direction and a third electromagnet and a fourth electromagnet. The third electromagnet is connected to the substrate 110, and the fourth electromagnet is connected to the lens 120. The lens 120 can move along the second slide rail. In this embodiment, by controlling the current of the third electromagnet and the fourth electromagnet, the relative position between the third electromagnet and the fourth electromagnet is adjusted, and the third electromagnet and the fourth electromagnet are respectively connected to the substrate 110 and the lens 120, so that the lens 120 can move relative to the substrate 110 in the third direction, adjust the offset of the lens optical center of the lens 120 relative to the center of the light-sensitive area of the image sensor chip 140 in the Y-axis direction, and the relative position adjustment of the substrate 110 and the lens 120 can be realized without disassembling them, thereby improving the convenience of adjustment and avoiding errors introduced in the disassembly process.

[0035] In this embodiment, if the optical center of the lens 120 is offset relative to the center of the light-sensitive area of the image sensor chip 140 when adjusting the relative position between the lens 120 and the substrate 110, the X-axis adjusting device and the Y-axis adjusting device can be used to adjust the three-axis adjustment of the lens 120 along the X, Y, and Z directions of the substrate 110, thereby improving the convenience of adjustment.

[0036] As shown in Figure 3 The application further provides a wafer testing needle card 10 adjusting method, which is used for the wafer testing needle card 10 described above, and the adjusting method comprises the following steps: S10, detecting the position of the lens 120 relative to the substrate 110, first detecting the relative position of the lens 120 and the substrate 110, if the relative position of the lens 120 and the substrate 110 is detected within the error allowed range, the Z-axis adjusting device 130 is not required to control the relative position between the lens 120 and the substrate 110, and the method is directly ended; if the relative position of the lens 120 and the substrate 110 is detected to deviate from the allowed range, S20 is entered.

[0037] S20, driving the lens 120 to move relative to the substrate 110 along the first direction by the Z-axis adjusting device 130, changing the relative position between the lens 120 and the substrate 110, when the lens 120 is used for a long time, the lens 120 is gradually consumed, the needle gradually becomes shorter, resulting in the distance between the lens 120 and the image sensor chip 140 gradually becoming shorter, by setting the Z-axis adjusting device 130 to adjust the position of the lens 120 along the first direction, without manually adjusting the position of the lens 120, avoiding disassembling the lens 120 and the substrate 110 in the manual adjustment process, improving the reliability of the adjustment.

[0038] In some embodiments, the adjustment method further comprises the following steps: S30, driving the lens 120 to move relative to the substrate 110 along the second direction by the X-axis adjusting device, to change the relative position between the lens 120 and the substrate 110. S40, driving the lens 120 to move relative to the substrate 110 along the third direction by the Y-axis adjusting device, to change the relative position between the lens 120 and the substrate 110.

[0039] In this embodiment, when the lens 120 is used for a long time or the relative position of the Z-axis between the lens 120 and the substrate 110 causes the lens optical center of the lens 120 to deviate from the center of the image sensor chip 140, the X-axis adjusting device and the Y-axis adjusting device are used to adjust the deviation of the lens optical center of the lens 120 relative to the center of the image sensor chip 140 along the X-axis and Y-axis directions, without disassembling the substrate 110 and the lens 120, the relative position between the two can be adjusted, improving the convenience of adjustment, and avoiding errors introduced in the disassembly process.

[0040] It is to be understood that the terminology used herein such as first and second, and the like, is only intended to distinguish one entity or action from another entity or action, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0041] In the description of the application, it is to be understood that the orientation or positional relationship indicated by the terms "center", "height", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise specified and limited.

[0042] In the description of the application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0043] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of the first feature to the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "above" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. "Below", "below" and "below" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0044] While the application has been described in detail by reference to preferred embodiments thereof, it should be recognized that the description set forth herein is by way of example and that modifications of the procedures described can be employed without departing from the scope of the application. Accordingly, the scope of the application should be determined by the appended claims and equivalents thereof.

Claims

1. A wafer testing needle card, characterized in that: The wafer testing needle card includes: a substrate, including a first direction perpendicular to the surface of the substrate; a lens, movably mounted on the substrate; and a Z-axis adjustment device, respectively connected to the lens and the substrate, for driving the lens to move along the first direction to adjust the relative position of the lens and the substrate.

2. The wafer testing needle card according to claim 1, wherein: The Z-axis adjustment device includes a voice coil motor, and an output end of the voice coil motor is connected to the lens.

3. The wafer testing needle card according to claim 1, wherein: The lens and the substrate are connected via a threaded pair, the axis direction of the threaded pair is parallel to the first direction, and the Z-axis adjustment device includes a rotation drive mechanism, which is connected to the lens.

4. The wafer testing needle card according to claim 3, wherein: The rotation drive mechanism includes a drive motor, and the Z-axis adjustment device also includes a control chip. The control chip is electrically connected to the drive motor and controls the rotation of the lens through the drive motor.

5. The wafer testing needle card according to claim 4, wherein: The control chip is also used to monitor the position of the lens.

6. The wafer testing needle card according to claim 1, wherein: The substrate has a second direction parallel to the surface of the substrate, and the second direction is perpendicular to the first direction; the wafer testing needle card also includes an X-axis adjustment device, including a first slide rail parallel to the second direction and a first electromagnet and a second electromagnet, the first electromagnet is connected to the substrate, and the second electromagnet is connected to the lens, and the lens can move along the first slide rail. By changing the current of the first electromagnet and the second electromagnet, the lens is driven to move along the second direction relative to the substrate.

7. The wafer testing needle card according to claim 6, wherein: The substrate has a third direction parallel to the surface of the substrate, and the third direction is perpendicular to the first direction and the second direction; the wafer testing needle card also includes a Y-axis adjustment device, including a second slide rail parallel to the third direction and a third electromagnet and a fourth electromagnet, the third electromagnet is connected to the substrate, and the fourth electromagnet is connected to the lens, and the lens can move along the second slide rail. By changing the current of the third electromagnet and the fourth electromagnet, the lens is driven to move along the third direction relative to the substrate.

8. A wafer test needle card adjustment method, characterized in that: For a wafer testing needle card as described in any one of claims 1 to 7, the adjustment method includes: S10, detecting the position of the lens relative to the substrate; S20, driving the lens to move along a first direction relative to the substrate through a Z-axis adjustment device to change the relative position between the lens and the substrate.

9. The wafer testing probe card adjustment method according to claim 8, wherein: The method further includes S30 , driving the lens to move relative to the substrate along a second direction by an X-axis adjustment device to change the relative position between the lens and the substrate.

10. The wafer testing probe card adjustment method according to claim 9, wherein: The method further includes S40 , driving the lens to move relative to the substrate along a third direction by a Y-axis adjustment device to change a relative position between the lens and the substrate.

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