Method for directly arranging FOB (front-on-board) on medium-and-large-size wave crystal display module

Abstract

The invention discloses a method for directly arranging FOB for a medium and large-size wave crystal display module, and relates to the technical field of a manufacturing method of a liquid crystal display module. By optimizing an ear-shaped bearing structure at the bottom of a BL iron frame, the height of a PCB is controlled not to exceed the highest surface of the bottom of the module, the overall thickness of the module is remarkably reduced, and the manufacturing cost is reduced. The problem that a traditional medium-and-large-size liquid crystal module structure is large in thickness is solved. Meanwhile, black mylar glue is adopted to seal the periphery of the module, and adhesive force, waterproofness and corrosion resistance tests are carried out, so that steam invasion is effectively isolated, element corrosion is avoided, the stability of the module is improved, and the service life of the module is prolonged; finite element analysis and sealing performance detection are combined to ensure reliable structure and uniform sealing; and finally, the integrity and safety of the module in FOB transportation are guaranteed through the compression-resistant and shock-resistant packaging design.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of manufacturing methods of liquid crystal display modules, in particular to a method for directly arranging FOB of a medium-large size wave crystal display module. BACKGROUND

[0002] The method for directly arranging FOB of a medium-large size wave crystal display module is for the production or assembly process of a medium-large size wave crystal, i.e., a wave band transistor, display module, wherein "directly arranging" generally refers to arranging components or modules in a straight line for processing or packaging on a production line.

[0003] However, in the prior art, the following technical defects often exist:

[0004] On the one hand, the conventional medium-large size liquid crystal display module has a large thickness in the structural design, which is difficult to meet the customer's demand for optimization of the module thickness.

[0005] On the other hand, the existing module has deficiencies in the protection design, which easily leads to the entry of water vapor in the experimental environment to corrode the components, affecting the stability and service life of the product. SUMMARY

[0006] In view of the deficiencies of the prior art, the present application provides a method for directly arranging FOB of a medium-large size wave crystal display module, which solves the technical defects mentioned in the background art.

[0007] To achieve the above purpose, the present application is implemented by the following technical scheme: a method for directly arranging FOB of a medium-large size wave crystal display module, comprising the following steps:

[0008] S1, designing and manufacturing a BL iron frame bottom, extending two symmetrical "ear" shaped support structures through a bending structure, for supporting a PCB board, and adjusting the bending height of the support structure so that the height of the components of the PCB board does not exceed the highest surface of the bottom of the module; wherein the bending height parameter is optimized, and the module thickness is calculated;

[0009] S2, performing a sealing test on the designed module, and sealing the module by using black mela tape to seal the edges around the module to prevent water vapor from entering the inside of the module; through the sealing test and the water vapor permeability evaluation, it is verified whether the sealing effect meets the protection requirements;

[0010] S3, further optimizing the sealing process according to the results of the sealing test and the water vapor permeability evaluation in S2, including evaluating the adhesion and corrosion resistance of the sealing glue;

[0011] S4, according to the design optimization results in S1 and S2, the integration verification of the module is carried out to ensure that the module can stably run in the process of transportation, installation and use, and the thickness optimized module meets the customer's structural requirements while not affecting the display effect or causing other structural problems, and finally the straight FOB delivery of the large size wave crystal display module is completed;

[0012] S5, in the FOB delivery stage, further protection design in the transportation process is carried out in combination with the packaging mode, transportation requirements and the environmental conditions of final delivery, to ensure that the module is not affected by the external physical or water environment in the transportation process.

[0013] Preferably, the two "ear" structures extending from the bottom of the BL iron frame are further optimized, the support angle and height of the "ear" structure are calculated and adjusted to ensure the best balance between the minimum thickness and the maximum support force;

[0014] The adjustment of the support angle and height of the "ear" structure is based on the module thickness requirement and the PCB board stability requirement, and the strength simulation and test of the support structure are carried out by using finite element analysis to ensure that it will not be deformed or damaged in the transportation process.

[0015] Preferably, by optimizing the design of the "ear" structure of the BL iron frame, the contact surface pressure distribution between the "ear" structure of the frame and the PCB board is further calculated to quantify the pressure concentration degree of the PCB board in the transportation and use process, and the contact surface pressure distribution is evaluated to prevent the circuit board damage or component shedding caused by excessive local stress.

[0016] Preferably, by adjusting the bending height of the "ear" structure of the BL iron frame, the influence of the thickness change of the module on the display effect is calculated and evaluated, and the display effect test is carried out on the simulation platform to ensure that the optimized thickness adjustment will not affect the optical performance of the display module or cause other display defects, finally meeting the dual requirements of the customer on the display effect and the thickness.

[0017] Preferably, when black mela glue is used for sealing around the module, further sealing layer adhesion test is carried out, the sealing glue layer meets the condition of not falling off in the module transportation process through stretching and peeling test, and the waterproof performance of the sealing glue is tested, including the stability and water vapor permeability in long-term use.

[0018] Preferably, according to the sealing test results, the sealing process around the module is optimized and adjusted, the corrosion resistance and environmental adaptability of the sealing glue are evaluated to ensure that the module can still maintain the sealing performance in extreme environment and prevent water vapor from entering and corroding the internal components.

[0019] Preferably, the thickness and coating uniformity of the sealing layer are precisely controlled through numerical simulation and test, so that the sealing effect of the sealing layer reaches uniform coating and no bubbles;

[0020] And use high-precision detection instrument for all-round detection of sealing effect, so that each batch of module meets the high standard protection requirements.

[0021] Preferably, by testing the sealing performance of the module in different environments, the durability of the module exposed to environmental factors such as high temperature and humidity during transportation is evaluated, and the sealing property of the module is ensured not to leak or be damaged due to external environment.

[0022] Preferably, according to the optimization result of the sealing performance, the module that has passed the sealing performance test is packaged by using compression-resistant and shock-resistant materials, and the waterproofness and impact resistance of the packaging are tested to ensure the integrity and stability of the product when delivered.

[0023] Preferably, in the module packaging scheme, a high-strength protective outer packaging layer is further designed, the packaging material meeting international transportation standards is used, and the compression strength and shock resistance of the packaging layer are calculated through simulation of the transportation process to ensure that the module can always maintain the best state during long-distance transportation worldwide and be delivered to the end customer.

[0024] The application provides a method for directly arranging FOB of a medium-large-size wave crystal display module.

[0025] (1) The method for directly arranging FOB of a medium-large-size wave crystal display module optimizes the thickness of the module by designing an "ear" shaped supporting structure at the bottom of the BL iron frame, realizes the best balance between the minimum thickness and the maximum supporting force, and effectively meets the demand of customers for the optimization of the thickness of the module; the supporting angle and height of the "ear" structure are calculated and adjusted, so that the height of the PCB board element does not exceed the highest surface of the bottom of the module, thereby avoiding the problem of large thickness in the structural design of the traditional medium-large-size liquid crystal display module, and through the strength simulation and test of the supporting structure by finite element analysis, it is ensured that the optimized design can provide stable support during transportation and use, and structural deformation or damage is avoided; in addition, the contact surface pressure distribution of each component of the module is calculated, the risk of circuit board damage or component falling caused by excessive local pressure is avoided, and the overall stability and reliability of the module are further improved.

[0026] (2) The method for directly arranging the FOB of the large-size wave crystal display module, the module is sealed by black mela glue around the module, and the protection performance of the module is improved obviously through multiple tests of the adhesion, corrosion resistance and waterproof performance of the sealing layer, water vapor penetration is effectively prevented, water vapor in the experimental environment is prevented from entering the module to corrode the elements, the service life of the product is prolonged, each batch of modules meets the high-standard protection requirements through accurate optimization of the sealing process and omnidirectional sealing effect detection by using high-precision detection instruments, the demand of customers for high stability and durability products is further met, in addition, the safety and integrity of the module during transportation and installation are ensured through the optimization design of the sealing performance and compression and shock resistance packaging, and it is ensured that the finally delivered product can maintain excellent performance for a long time. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a step flowchart of the application;

[0028] Figure 2 It is a front view of the incoming design of the direct FOB, namely LCD+POL+FPC+PCB board;

[0029] Figure 3 It is a back view of the incoming design of the direct FOB, namely LCD+POL+FPC+PCB board;

[0030] Figure 4 It is a design schematic diagram of the two "ear" symmetrical structures extended from the bottom of the BL iron frame in the application;

[0031] Figure 5 It is a schematic diagram in which the PCB board is placed on the front side, the elements are placed on the back side, and the height does not exceed the highest surface of the module bottom in the application;

[0032] Figure 6 It is an enlarged schematic diagram in which the PCB and the iron frame extending "ear" structure are punched and fixed by screws in the application;

[0033] Figure 7 It is a specific schematic diagram in which the black mela glue is used for edge sealing around the module to prevent experimental water vapor from entering the elements to corrode the elements. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the application.

[0035] Embodiment 1

[0036] Referring to Figure 1 The present application provides a method for directly arranging FOB of a medium-large size wave crystal display module, comprising the following steps:

[0037] S1, designing and manufacturing a BL iron frame bottom, extending two symmetrical "ear" shaped supporting structures through bending structure for supporting the PCB board, and adjusting the bending height of the supporting structure so that the height of the PCB board element does not exceed the highest surface of the module bottom; wherein the bending height parameter is optimized, and the module thickness is calculated;

[0038] S2, performing sealing test on the designed module, and sealing by using black mela glue around the module to isolate water vapor from entering the module; through sealing test and water vapor permeability evaluation, it is verified whether the sealing effect meets the protection requirements;

[0039] S3, further optimizing the sealing process according to the results of sealing test and water vapor permeability evaluation in S2, including evaluating the adhesion and corrosion resistance of the sealing glue;

[0040] S4, according to the design optimization results in S1 and S2, performing integration verification of the module to ensure that the module can stably run in the process of transportation, installation and use, and the thickness optimized module meets the customer's structure requirements while not affecting the display effect or causing other structural problems, finally completing the direct FOB delivery of the medium-large size wave crystal display module;

[0041] S5, in the FOB delivery stage, further performing protection design in the transportation process in combination with the packaging method, transportation requirements and the final delivery environment conditions, to ensure that the module is not affected by the external physical or water vapor environment in the transportation process.

[0042] In this embodiment, by designing and manufacturing the "ear" shaped supporting structure of the BL iron frame bottom, the PCB board is effectively supported, and by adjusting the bending height of the supporting structure, the height of the PCB board element does not exceed the highest surface of the module bottom, the module thickness is optimized, and the problem of too large thickness of the traditional medium-large size liquid crystal module structure is solved;

[0043] By sealing around the module with black mela glue, water vapor is isolated from entering, the protection of the module is improved, and the sealing effect is verified through sealing test and water vapor permeability evaluation to ensure the stability of the module in harsh environment;

[0044] According to the sealing test results, the sealing process is further optimized to improve the adhesion and corrosion resistance of the sealing glue, and the durability of the module is enhanced;

[0045] In the integration verification process, ensure that the module runs stably in transportation, installation and use, and the optimized module thickness does not affect the display effect or cause structural problems, meeting customer needs;

[0046] In the FOB delivery stage, through the protective design for the transportation process, ensure that the module is not affected by the external physical or water environment during transportation, and ensure the integrity and stability of the product.

[0047] Example 2

[0048] Further optimize the two "ear" structures extending from the bottom of the BL iron frame, calculate and adjust the support angle and height of the "ear" structure to ensure the best balance between minimum thickness and maximum support force;

[0049] The adjustment of the support angle and height of the "ear" structure is based on the module thickness requirement and the stability requirement of the PCB board. Strength simulation and test of the support structure are carried out by using finite element analysis to ensure that it will not be deformed or damaged during transportation.

[0050] By optimizing the design of the "ear" structure of the BL iron frame, the contact surface pressure distribution between the "ear" structure of the frame and the PCB board is further calculated to quantify the pressure concentration degree of the PCB board during transportation and use, and the contact surface pressure distribution is evaluated to prevent the circuit board from being damaged or components from falling off due to excessive local stress.

[0051] Further, on the "ear" structure extending from the bottom of the BL iron frame, through calculation and experimental test, the support angle α is selected as 25°, which ensures that the structure can provide the maximum support force without increasing the module thickness;

[0052] The bending height h is selected as 1.8mm, which ensures that the highest point of the PCB component does not exceed the maximum height 2.0mm of the module bottom, while maintaining the stability of the structure;

[0053] By comparing the strength and thickness of the module under different angles and heights through finite element analysis, the support angle α=25° and the bending height h=1.8mm are selected as the optimal parameters to ensure that the structure will not be deformed or damaged during transportation.

[0054] Strength simulation of the optimized "ear" structure is carried out by using finite element analysis (FEA) to verify its anti-deformation ability during transportation, specifically:

[0055] A three-dimensional finite element model of the module is established using ANSYS software, and a vertical load of 1.5N is applied in the model, which simulates the pressure during transportation; when the simulation result shows that the maximum deformation of the "ear" structure is 0.12mm, it meets the design requirements;

[0056] Through simulation analysis, it is verified that the "ear" structure at the selected supporting angle and height can maintain good stability during transportation and will not be irreversibly deformed or damaged.

[0057] The simulation is calculated by the following formula:

[0058]

[0059] Wherein, σ is the stress, FF is the applied load, A is the contact area, and the results show that the maximum stress of the "ear" structure does not exceed the yield limit of the material.

[0060] The contact surface pressure between the "ear" structure and the PCB is calculated and optimized to ensure that the contact pressure is evenly distributed during transportation and use, and the local stress is not too large, thereby preventing the circuit board from being damaged or the components from falling off, specifically:

[0061] The contact surface pressure when the contact area A is 12mm 2 is calculated by using the finite element analysis software, and the force applied on the "ear" structure is 1.5N. The contact pressure calculation formula is as follows:

[0062]

[0063] The pressure value is lower than the bearing limit of the PCB material, which ensures that there will be no local damage.

[0064] Further simulation of the contact surface pressure distribution ensures that the pressure distribution on the entire contact surface is uniform, avoiding damage to the circuit board caused by stress concentration;

[0065] The contact surface between the "ear" structure and the PCB is designed as a 5° inclined surface transition structure, and the length of the inclined surface in the contact area is 4.6mm and the height of the inclined surface is 0.4mm, which is used to effectively disperse the local stress and reduce the stress concentration of the PCB, specifically:

[0066] The shape of the contact surface is designed as a 5° inclined surface to increase the contact area, evenly distribute the contact stress, and reduce the local stress concentration; by designing the inclined surface of the contact surface, the contact pressure is dispersed, and the simulation results show that the pressure value in the local stress concentration area is reduced from 0.18MPa to 0.13MPa, effectively avoiding the risk of damage to the circuit board, reducing the contact stress peak value, and improving the overall compression resistance and stability of the module.

[0067] Example 3

[0068] By adjusting the bending height of the BL iron frame "ear" structure, the thickness change of the module is calculated and evaluated for its impact on display effect, and the display effect is tested on the simulation platform to ensure that the optimized thickness adjustment does not affect the optical performance of the display module or cause other display defects, ultimately meeting the customer's dual requirements for display effect and thickness.

[0069] When black mela seal is used to seal the four sides of the module, further sealing layer adhesion test is carried out, through stretching and peeling test, the sealing glue layer meets the condition of not falling off during module transportation, at the same time, the waterproof performance of the sealing glue is tested, including the stability in long-term use and water vapor permeability.

[0070] According to the sealing test results, the sealing process of the four sides of the module is optimized and adjusted, and the corrosion resistance and environmental adaptability of the sealing glue are evaluated to ensure that the module can still maintain sealing performance in extreme environment and prevent water vapor from entering and corroding internal components.

[0071] Further, first, set the target total thickness value H T of the module, and measure the initial bending height h of the "ear" structure in the existing structure;

[0072] Through the calculation formula:

[0073] h=H T -H sub -H PCB ;

[0074] Where: H T is the overall thickness requirement of the module; H sub is the total thickness of the optical components including the diffuser and the light guide plate; H PCB is the thickness of the PCB board;

[0075] Set the calculated initial bending height h as the target value of the BL iron frame "ear" bending height, and adjust the structure by die bending, with an error control within ±0.05mm;

[0076] Load the adjusted module structure into the standard optical test platform;

[0077] Perform brightness uniformity test, collect 9-point brightness values Li, i=1~9 under full white picture;

[0078] And calculate the brightness uniformity U:

[0079]

[0080] U≥85%, otherwise it is considered that the "ear" bending structure adjustment is unreasonable and needs to be adjusted back;

[0081] Conduct chromatic consistency and halo control test at the same time to avoid Mura, bright spot or dark area phenomenon caused by structural deformation;

[0082] Select black Mylar with thickness of 0.15 mm and width of 5 mm, and perform full-enclosed type circumferential pasting according to the edge path of the module;

[0083] Ensure that the overlap length at each joint is greater than or equal to 3 mm, and hot pressing or rolling is used to assist the bending area to ensure close fitting;

[0084] After pasting, stand for 10 minutes to complete the initial bonding solidification;

[0085] Adhesion strength test is performed by using 90° peeling test method, and the test standard is that the peeling speed is 300 mm / min, and the peeling strength is greater than or equal to 0.9 N / 10 mm;

[0086] If it is lower than the standard, the Mylar brand or surface treatment method needs to be replaced, including using plasma cleaning, and retesting;

[0087] And constant temperature and humidity aging experiment is performed on the attached module, and after 48 hours of constant temperature and humidity aging experiment under the condition of 60°C and 90% RH, the adhesion force change rate AF is retested, which should meet:

[0088]

[0089] Immerse the module sample in a pure water container with a depth of 10 mm for 24 hours, and observe whether water seeps into the inside of the module; then perform water vapor transmission rate test, select the sealed area sample section to send to a third-party testing organization for detection, and the WVTR should be less than or equal to 3.5 g / m 2 ·day; if the detection is unqualified, the sealing material needs to be replaced or the heating and calendering method needs to be retested.

[0090] Put the module into a xenon lamp weathering test box to perform 100 hours of light aging test to simulate ultraviolet light and alternating temperature and humidity environment; observe whether there are phenomena such as color change, delamination and cracking of the adhesive at the sealing boundary;

[0091] Meanwhile, NaCl spray test is performed, and the NaCl spray test condition is 5% concentration, 35°C, for 8 hours continuously; observe the corrosion state of the boundary; evaluate whether the sealing adhesive reaches the corrosion resistance and UV resistance level, and the level is referred to IEC 60068 and ISO 4892 standards;

[0092] In this embodiment, the module thickness adjustment is combined with display optical performance evaluation as a closed loop control, and a calculation formula is used to guide the structure forming; the black Mylar sealing layer is introduced into quantitative peeling strength and environmental weatherability verification, and combined with WVTR transmission rate data to perform sealing process feedback;

[0093] Different from the prior art which simply uses hot melt adhesive or non-adhesive boundary packaging, the embodiment has stronger fatigue resistance, waterproofness and anti-aging ability.

[0094] Embodiment 4

[0095] Through numerical simulation and test, the thickness and coating uniformity of the sealing layer are precisely controlled, so that the sealing effect of the sealing layer reaches the uniform coating and no bubbles;

[0096] And high-precision detection instruments are used for omnibearing detection of the sealing effect, so that each batch of modules meets the high-standard protection requirements.

[0097] Through testing the sealing performance of the modules in different environments, the durability of the modules exposed to environmental factors such as high temperature and humidity during transportation is evaluated, and it is ensured that the sealing of the modules does not leak or damage due to external environment.

[0098] According to the optimization result of the sealing performance, the modules that pass the sealing performance test are packaged for transportation, the modules are wrapped with compression-resistant and shock-resistant materials, and the waterproofness and impact resistance of the packaging are tested to ensure the integrity and stability of the products when delivered.

[0099] In the module packaging scheme, a high-strength protective outer packaging layer is further designed, the packaging materials conforming to international transportation standards are used, and the compression strength and shock resistance of the packaging layer are calculated through simulation of the transportation process to ensure that the modules can always maintain the best state during long-distance transportation worldwide and be delivered to the end customers.

[0100] Further, a finite element numerical model is established by using ANSYS Fluent software to simulate the sealing layer coating process, and the coating thickness of the sealing glue is optimized to be controlled between 0.15mm and 0.25mm, and the optimal thickness is 0.20mm, combined with the actual parameters of the coating equipment, i.e. nozzle aperture 0.4mm, spraying pressure 0.25MPa, and spraying rate 50mm / s.

[0101] The surface of the module after coating is locally scanned and detected by using a SEM scanning electron microscope to ensure that the thickness difference is not more than ±0.02mm, the bubble size is not greater than 0.1mm, and the overall surface has no obvious depression, meeting the uniform and bubble-free standard. 2

[0102] In the sealing effect detection stage, Leica DVM6 digital microscope is used for batch sampling detection, the sampling ratio of each batch is 5%, the coating thickness and surface morphology are recorded point by point, IP67 level test standard is introduced, constant temperature and humidity test box is used for 48-hour aging test, and it is confirmed that the module packaging does not appear phenomena such as peeling and falling due to temperature and humidity fluctuations.​

[0103] Subsequently, the environmental exposure test was carried out in a simulated transport environment, the test conditions were 70℃, 95% RH, and the test lasted for 72 hours; the stability of the sealing layer of the verification module under extreme weather conditions was verified, and the thermocouple and high-precision humidity sensor with an error of ≤±1% RH were used to record the temperature and humidity fluctuation data, to ensure long-term weather resistance;

[0104] After the encapsulation detection was qualified, high-density closed-cell foam material and EVA shock pad with a thickness of 15 mm were selected for packaging, and the module was wrapped in all directions; the waterproof test used 1 m deep water immersion test for 30 minutes, and the module had no leakage; the impact resistance test was carried out according to the free falling test standard of ISO 2248, the module was freely dropped from a height of 1.5 m to the concrete floor, once on each side, and the requirements were that the package had no damage and the module functioned normally;

[0105] The outer packaging design used five-layer corrugated paperboard and was fixed with PP reinforcing tape, the compression strength test was carried out by using an electronic universal testing machine, and the compression strength was 105 kg under a loading rate of 10 mm / min; the shock resistance test used a transport simulation vibration platform, and the package structure had no loosening and the module position had no displacement or damage after 48 hours of continuous vibration;

[0106] Finally, through the above parameterized simulation, quantitative detection and multi-field coupling test method, the sealing, protection and stability of the module from encapsulation to transportation process were comprehensively evaluated and ensured, and a complete, implementable and industrialized application prospect technical scheme was formed.

[0107] Although the embodiments of the present application have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A method for directly arranging FOBs for medium and large-sized wave crystal display modules, characterized by: The following steps are involved: S1. Design and manufacture the bottom of the BL iron frame, extending two symmetrical "ear"-shaped support structures through a bending structure to support the PCB. Adjust the bending height of the support structures so that the height of the PCB components does not exceed the highest surface of the module bottom. Calculate and determine the module thickness by optimizing the bending height parameters. S2. Conduct a sealing test on the designed module and seal it with black Mylar tape around the edges to prevent moisture from entering the module. Verify that the sealing effect meets the protection requirements through sealing tests and water vapor permeability assessments. S3. Based on the results of the sealing test and water vapor permeability evaluation in S2, further optimize the sealing process, including evaluating the adhesion and corrosion resistance of the sealant; S4. Based on the design optimization results in S1 and S2, conduct module integration verification to ensure that the module can operate stably during transportation, installation, and use. The thickness-optimized module meets the customer's structural requirements without affecting the display effect or causing other structural problems. Finally, complete the direct FOB delivery of the medium and large-sized wave crystal display module. S5. During the FOB delivery stage, further protective design during transportation is carried out in combination with the packaging method, transportation requirements and the final delivery environmental conditions to ensure that the module is not affected by the external physical or water environment during transportation.

2. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: The two "ears" extending from the bottom of the BL iron frame were further optimized. The support angle and height of the "ears" were calculated and adjusted to ensure the optimal balance between minimum thickness and maximum support force. The support angle and height of the "ear" structure are adjusted based on the module thickness requirements and PCB board stability requirements. Finite element analysis is used to simulate and test the strength of the support structure to ensure that it will not be deformed or damaged during transportation.

3. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: By optimizing the design of the BL iron frame's "ear" structure and further calculating the contact surface pressure distribution between the frame's "ear" structure and the PCB board, the degree of pressure concentration on the PCB board during transportation and use can be quantified. The contact surface pressure distribution is also evaluated to prevent circuit board damage or component loss caused by excessive local stress.

4. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: By adjusting the bending height of the BL iron frame's "ear" structure, the impact of module thickness changes on the display effect is calculated and evaluated, and the display effect is tested on a simulation platform to ensure that the optimized thickness adjustment will not affect the optical performance of the display module or cause other display defects, ultimately meeting the customer's dual requirements for display effect and thickness.

5. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: When using black Mylar glue to seal the module all around, the sealing layer adhesion test is further carried out. Through tensile and peeling tests, the sealant layer is ensured to meet the conditions of not falling off during module transportation. At the same time, the waterproof performance of the sealant is tested, including its stability and water vapor permeability in long-term use.

6. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: Based on the sealing test results, the sealing process around the module is optimized and adjusted, and the corrosion resistance and environmental adaptability of the sealant are evaluated to ensure that the module can still maintain its sealing performance in extreme environments and prevent water vapor from invading and corroding internal components.

7. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: Through numerical simulation and experimental testing, the thickness and coating uniformity of the sealing layer are precisely controlled to ensure that the sealing effect of the sealing layer is evenly coated and free of bubbles. High-precision testing instruments are used to conduct all-round testing of the sealing effect to ensure that each batch of modules meets high-standard protection requirements.

8. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: By testing the sealing performance of the module under different environments, the durability of the module when exposed to environmental factors such as high temperature and humidity during transportation is evaluated to ensure that the module's sealing is not leaked or damaged due to the external environment.

9. The method for in-line FOB of medium and large-sized wave crystal display modules according to claim 1, characterized in that: Based on the optimization results of the sealing performance, the modules that have finally passed the sealing performance test will be packaged for transportation. The modules will be wrapped with pressure-resistant and shock-resistant materials, and the packaging will be tested for its waterproofness and impact resistance to ensure the integrity and stability of the product upon final delivery.

10. The method for in-line FOB of medium and large size wave crystal display modules according to claim 1, characterized in that: In the module packaging solution, we further designed an external packaging layer with high-strength protective functions, using packaging materials that meet international transportation standards. Through tests simulating the transportation process, we calculated the compressive strength and seismic resistance of the packaging layer to ensure that the modules can always maintain optimal condition and be delivered to end customers during long-distance transportation around the world.

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