Server and power supply method

Abstract

This application provides a server and a power supply method, which can be applied to the field of server technology. The server includes: a signal board extending along a first direction, the signal board dividing the internal space of the server into a first region and a second region; a processing device and a computing device disposed in the first region and electrically connected to the signal board; a power supply device, at least partially disposed in the first region; and a power distribution device disposed in the second region and electrically connected to the power supply device and the signal board.

Description

Technical Field

[0001] This application relates to the field of server technology, and more specifically to a server and a power supply method. Background Technology

[0002] With the development of new internet technologies such as cloud computing, artificial intelligence, and big data, server performance is becoming increasingly powerful, and computing scale is expanding rapidly. However, this has led to challenges for artificial intelligence (AI) servers, including low power density, complex architecture, and difficult maintenance. Summary of the Invention

[0003] This application provides a server and a power supply method.

[0004] According to a first aspect of this application, a server is provided, comprising: a signal board extending along a first direction, the signal board dividing the internal space of the server into a first region and a second region; a processing device and a computing device disposed in the first region and electrically connected to the signal board; a power supply device at least partially disposed in the first region; and a power distribution device disposed in the second region and electrically connected to the power supply device and the signal board; wherein the power supply device is used to supply power to the power distribution device, such that the power distribution device supplies power to the processing device and the computing device via traces within the signal board.

[0005] A second aspect of this application provides a power supply method for a server as described above, comprising: a power supply device supplying power to a power distribution device such that the power distribution device supplies power to a processing device and a computing device via traces within a signal board.

[0006] According to embodiments of this application, the processing device and computing device are disposed in a first area of ​​the server's internal space, the power supply device is at least partially disposed in the first area, and the power distribution device is disposed in a second area. Thus, by partially disposing of the power supply device in the first area where the processing and computing devices are located, and placing the power distribution device in the other area, maintenance of the power supply device is facilitated, and relatively ample space is available for installing high-power power supply devices. Furthermore, power is supplied to the power distribution device through the power supply device, and then to other devices through the power distribution device via wiring within the signal board, increasing the power density of the power supply. Moreover, since the power distribution device, processing device, and computing device transmit signals via the signal board, the signal path is shortened, cable usage is reduced, and the complexity of the server architecture is reduced. Attached Figure Description

[0007] The above-mentioned contents, other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0008] Figure 1A A schematic diagram of a server according to an embodiment of this application is shown.

[0009] Figure 1B A schematic diagram of a server according to another embodiment of this application is shown.

[0010] Figure 2 A schematic diagram of a signal board according to an embodiment of this application is shown.

[0011] Figure 3 A schematic diagram of a server according to another embodiment of this application is shown.

[0012] Figure 4 A schematic diagram of a server according to another embodiment of this application is shown.

[0013] Figure 5 A schematic diagram of a server according to another embodiment of this application is shown.

[0014] Figure 6 A schematic diagram of a server according to another embodiment of this application is shown.

[0015] Figure 7 A top view of a power distribution board according to an embodiment of this application is shown.

[0016] Figure 8 A schematic diagram of a power distribution board according to another embodiment of this application is shown.

[0017] Figure 9 A schematic diagram of a power distribution board according to an embodiment of this application is shown.

[0018] Figure 10 A schematic diagram showing the connection of a power distribution board and a signal board according to an embodiment of this application is illustrated.

[0019] Figure 11 A schematic diagram of a heat dissipation device according to an embodiment of this application is shown.

[0020] Figure 12 A flowchart of a power supply method according to an embodiment of this application is shown. Detailed Implementation

[0021] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of this application for ease of explanation. However, it will be apparent that one or more embodiments may be implemented without these specific details. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0022] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0023] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0024] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0025] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] With the development of new internet technologies such as cloud computing, AI, and big data, server performance is becoming increasingly powerful, and server computing scale is expanding rapidly. This has led to a surge in the number and power of devices such as Central Processing Units (CPUs), Graphics Processing Units (GPUs), and switches. However, high power and high computing power have multifaceted impacts on server system design. For example, the high current transmission associated with high power increases the current transmission impedance loss of the copper foil on the printed circuit board (PCB). High power requires efficient heat dissipation and a high aperture ratio on the boards, which reduces the copper foil area and limits signal transmission. Simultaneously, efficient heat dissipation also necessitates reducing the number of interconnecting cables between boards, as high-speed and low-speed signals require board-to-board interconnects. Furthermore, complex board-to-board connections require interconnection with various types of connectors, posing challenges to board assembly and maintenance. The high power current carrying capacity and special structure of connectors between complex boards also increase the resources required for manufacturing.

[0027] In one approach, the central processing unit (CPU) (e.g., a server motherboard) and the graphics processing unit (GPU) are located in separate areas or chassis, and each uses its own power supply (e.g., a power supply unit, PSU). Furthermore, each CPU and GPU uses its own cooling system. This necessitates separate maintenance for the cooling systems of both the CPU and GPU. Moreover, since the CPU's cooling system is typically built into the CPU itself, it is difficult to perform maintenance while the server is powered on, thus impacting the server's online operations.

[0028] Furthermore, the CPU's cooling system, CPU, and power supply are arranged horizontally in sequence. This means the CPU's power supply must pass through the CPU to power the cooling system, resulting in a relatively long power path. Therefore, maintenance of the power supply path requires opening the top cover of the CPU's chassis.

[0029] Similarly, the Peripheral Component Interconnect Express Switch (PCIE Switch), the graphics processor (GPU), and the GPU's power supply are arranged horizontally in sequence. This results in a long power path from the GPU's power supply to the PCIE Switch, bypassing the GPU itself. Furthermore, the power supply is typically 54V, which is small and has limited power output, making it unsuitable for the high-power demands of GPUs.

[0030] Furthermore, the image processor and the central processing unit are usually stacked vertically. Therefore, when maintaining the image processor, it is necessary to first separate the central processing unit from the image processor before opening the chassis cover of the image processor located on the lower layer to maintain the image processor or the standard switch interconnecting the high-speed peripheral components.

[0031] In some solutions, the GPU and high-speed peripheral interconnect (HSP) standard switch can be designed as a drawer for easy removal and maintenance. However, the GPU and HSP standard switch are heavy, and the drawer has a long travel distance, reducing the ease of removal and thus complicating maintenance. Furthermore, the GPU and CCPU may interfere with each other, increasing maintenance difficulty. Additionally, since the GPU and CCPU are primarily connected via high-speed cables, these cables are expensive and have poor reliability; loose cables can affect system stability.

[0032] In view of this, this application provides a server.

[0033] Figure 1A A schematic diagram of a server according to an embodiment of this application is shown. Figure 1B A schematic diagram of a server according to another embodiment of this application is shown.

[0034] like Figure 1A As shown, the server includes a signal board (MBP), a processing unit (CPU BOX), a computing unit (GPU BOX), a power distribution unit (PD), and a power supply unit (PS). Additionally, as... Figure 1B As shown, in some embodiments, the server may also include a heat dissipation device such as a CBOX.

[0035] The signal board MBP can extend within the server along a first direction Z (e.g., vertically), but embodiments of this application are not limited to this. In some embodiments, the signal board MBP can also extend along a second direction X, orthogonal to the first direction Z. Thus, the signal board MBP can divide the internal space of the server into a first region and a second region. The signal board MBP can have a first surface and a second surface facing away from each other, and these first and second surfaces can also extend along the first direction Z. The first surface of the signal board MBP can face the first region. The second surface of the signal board MBP can face the second region. The first and second surfaces of the signal board MBP can each be provided with multiple interfaces to electrically connect to other devices inside the server via pins within the interfaces, such as a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS.

[0036] The CPU box (CPU) of the processing device can be located in the first area. The CPU box may include a server motherboard and a switch board, etc. The server motherboard may house components such as a central processing unit (CPU). For example, the CPU box may be box-shaped to house the server motherboard and switch board. The GPU box (GPU) of the computing device can also be located in the first area. The GPU box may include components such as a graphics processing unit (GPU). Similarly, the GPU box may be box-shaped to house computing components such as a graphics processing unit.

[0037] The CPU BOX and GPU BOX are disposed on the first side of the MBP (Multi-Board Components) and electrically connected to it. Thus, the CPU BOX and GPU BOX can be electrically connected via traces within the MBP. The CPU BOX may include an interface for connecting to the MBP. Pins in this interface of the CPU BOX are electrically connected to pins in the interface of the MBP. Similarly, the GPU BOX may also include an interface for connecting to the MBP. Pins in this interface of the GPU BOX can also be electrically connected to pins in the interface of the MBP. Based on this, the server motherboard, switch board, and GPU BOX can be interconnected via traces within the MBP. For example, high-speed and low-speed signals of the CPU on the server motherboard can be transmitted to the switch board and GPU BOX via the MBP. However, this embodiment is not limited to this; the CPU may also be connected to the switch board via cables, thereby transmitting signals to the GPU BOX via traces within the switch board and interconnect board. The GPU BOX generates heat during computation. In response, the CPU BOX can control the CBOX (heat dissipation unit) to cool the GPU BOX (computing unit).

[0038] The heat dissipation device can be located in a first area or a second area. In this embodiment, it is located in the second area. The heat dissipation device CBOX may include a fan or other heat dissipation components. The heat dissipation device CBOX can be located on the second side of the signal board MBP so as to be electrically connected to the signal board MBP. For example, the heat dissipation device CBOX may include an interface for connecting to the signal board MBP. The pins in the interface of the heat dissipation device CBOX can also be electrically connected to the pins in the interface of the signal board MBP. In this way, the processing device CPU BOX and the heat dissipation device CBOX can be electrically connected via traces in the signal board MBP so that the processing device CPU BOX can send control signals to the heat dissipation device CBOX. In this way, multiple heat dissipation devices (e.g., fans) in the heat dissipation device CBOX can be uniformly scheduled, reducing the complexity of heat dissipation control.

[0039] The power distribution device (PD) can be located in the second area. The power distribution device (PD) may include a power distribution board. The power distribution device (PD) may include an interface for connecting to the signal board (MBP). Pins within this interface of the power distribution device (PD) can also be electrically connected to pins within an interface on the second side of the signal board (MBP). The power distribution device (PD) can be located on the side of the power supply device (PS) closer to the signal board (MBP) in a third direction (Y) orthogonal to the first direction (Z), and is electrically connected to the power supply device (PS).

[0040] The power supply device (PS) may be at least partially disposed in the first region. For example, the power supply device may be disposed in the first region, or it may be partially disposed in the first region and partially disposed in the second region. The power supply device (PS) may include a power supply unit, etc. For example, the power supply device (PS) may be box-shaped to house the power supply unit. Wherein, with the first direction as the projection direction, the projection of the processing device and the projection of the computing device at least partially overlap, and the projection of the computing device and the projection of the power supply device at least partially overlap.

[0041] Specifically, the power supply device PS can be located next to the processing device CPU BOX and the computing device GPU BOX in the first direction Z, for example, the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX. For example, in one embodiment of this application, the pins in the interface of the power supply device PS can be electrically connected to the interface pins on the first side of the signal board MBP, thereby being electrically connected to the power distribution device PD via the signal board MBP. However, the embodiments of this application are not limited to this. In another embodiment of this application, the power supply device PS can also be electrically connected to the power distribution device PD below the signal board MBP. For example, a gap is formed between the bottom of the signal board MBP and the first inner side of the server (e.g., the inner bottom surface of the server), facilitating the electrical connection between the power supply device PS and the power distribution device PD at this gap. In this case, the projection of the power supply device PS in the third direction Y (e.g., it can also be a projection in the horizontal plane) and the projection of the signal board MBP in the third direction Y (e.g., it can also be a projection in the horizontal plane) may not overlap, or may at least partially overlap with the projection of the signal board MBP on the bottom surface of the server. For example, the power supply device (PS) can be electrically connected to the power distribution device (PD) via pins in its interface and pins in its interface. In addition to connecting to the PS, the PD can also connect to the CPU box, GPU box, and CBOX via traces within the signal board (MBP). Based on this, the MBP acts as a crucial bridge for high-speed signals, low-speed signals, and power flow, enabling high-density high-speed signal interconnection, low-speed signal interconnection, and power signal transmission. For example, the MBP can be electrically connected to the PD, providing, for example, 54V DC voltage to the GPU box. Thus, the PS can supply power to the PD, allowing the PD to supply power to the CPU box, GPU box, and CBOX via traces within the MBP.

[0042] Based on this, the CPU BOX and GPU BOX are located in the first area of ​​the server's internal space, the power supply unit (PS) is at least partially located in the first area, and the power distribution unit (PD) is located in the second area. By placing the power supply unit (PS) partially in the first area containing the CPU BOX and GPU BOX, and placing the power distribution unit (PD) in the other area, maintenance of the power supply unit (PS) is facilitated, and relatively ample space is available for installing high-power power supply units (PS). Furthermore, power is supplied to the power distribution unit (PD) via the power supply unit (PS), and then to other devices via the power distribution unit (PD) through the wiring within the signal board (MBP), increasing the power density of the power supply. Moreover, since the power distribution unit (PD), CPU BOX, and GPU BOX transmit signals via the signal board (MBP), the signal path is shortened, cabling is reduced, and the complexity of the server architecture is decreased.

[0043] In this embodiment, the power supply device (PS), the processing device (CPU BOX), and the computing device (GPU BOX) are arranged at intervals along the first direction Z. For example, the power supply device, processing device, and computing device can be arranged sequentially along the first direction Z. For example, the power supply device (PS), the processing device (CPU BOX), and the computing device (GPU BOX) can be arranged in the front part (i.e., the first area) of the server, which facilitates post-failure maintenance of the power supply device (PS), the processing device (CPU BOX), and the computing device (GPU BOX). Specifically, when the first direction Z is the projection direction, the projection of the processing device (CPU BOX) and the projection of the computing device (GPU BOX) at least partially overlap, and the projection of the computing device (GPU BOX) and the projection of the power supply device (PS) at least partially overlap, avoiding structural interference between the devices, reducing the complexity of the server architecture, and facilitating maintenance. The heat dissipation device (CBOX) and the power distribution device (PD) can also be arranged sequentially along the first direction Z. For example, the heat dissipation device (CBOX) and the power distribution device (PD) can be arranged in the rear part (i.e., the second area) of the server.

[0044] Based on this, at least one of the processing unit CPU BOX, computing unit GPU BOX, and power supply unit PS is slidably disposed within the internal space. For example, the processing unit CPU BOX can slide between a first position and a second position. When the processing unit CPU BOX is in the second position, it is electrically connected to the signal board MBP. Similarly, the computing unit GPU BOX can slide between a first position and a second position. When the computing unit GPU BOX is in the second position, it is electrically connected to the signal board MBP. And again, the power supply unit PS can slide between a first position and a second position. When the power supply unit PS is in the second position, it is electrically connected to the power distribution unit PD. The first position can correspond to a position where the entire device is located outside the server. The second position can correspond to a position where the entire device is located inside the server.

[0045] Specifically, the power supply device PS, the processing device CPU BOX, and the computing device GPU BOX can slide along a third direction Y, and the heat dissipation device CBOX can slide along a third direction Y or along a second direction X. For example, the server may also include multiple slide rails arranged in a first direction Z, with the slide rails located between the plane of the first surface of the signal board MBP and the inner surface of the server opposite to the first surface of the signal board MBP. The computing device GPU BOX, the processing device CPU BOX, and the power supply device PS can each slide along the slide rails relative to the first surface of the signal board MBP. Specifically, the computing device GPU BOX and the processing device CPU BOX are electrically connected to the signal board MBP at the first end of the slide rail near the plane. This avoids structural interference between the devices. For example, the power supply device PS, the processing device CPU BOX, the computing device GPU BOX, and the heat dissipation device CBOX can be designed in a drawer form.

[0046] Simultaneously, the CPU BOX and GPU BOX are arranged adjacent to each other, which facilitates shortening the signal path between them. For example, the CPU BOX includes a switching board and a server motherboard arranged and electrically connected along the first direction Z, thus shortening the signal path from the server motherboard, switching board, and GPU BOX within the CPU BOX. Specifically, the server motherboard can be located above, and the switching board can be located below, facilitating high-speed signal connections. The power distribution device (PD) and the heat dissipation device (CBOX) are arranged sequentially along the first direction Z, allowing the power supply device (PS) and the power distribution device (PD) to be electrically connected below the signal board (MBP).

[0047] Furthermore, the switching board can be, for example, a high-speed peripheral component interconnect standard switch. High-speed signals from the switching board can be connected to the board edge via high-speed connectors and to the signal board MBP via vertical board connectors. During assembly, the switching board can be first placed in the housing of the processing device CPU BOX, and then the server motherboard can be installed, electrically connecting the server motherboard and the switching board via high-speed cables. The server motherboard and the switching board can be stacked vertically along the first direction Z or laid flat in the horizontal direction. In this application, the preferred embodiment is that the server motherboard and the switching board are stacked vertically along the first direction Z, which reduces the complexity of board development size and facilitates the plugging and unplugging maintenance of high-speed signal connection cables between the server motherboard and the switching board.

[0048] In this embodiment, the processing device CPU BOX may further include at least one of a communication card (e.g., a network card) and a storage device (e.g., a hard disk). Specifically, in one embodiment, with the first direction Z as the projection direction, the projection of the communication card coincides with the projection portion of the switching board. Furthermore, this embodiment is not limited to this; in this embodiment, the projection of the server motherboard may also coincide with the projection portion of the switching board. For example, the server motherboard and the communication card may be positioned above or below the switching board. Preferably, the server motherboard and the communication card may be positioned on the switching board for easy maintenance of both. Additionally, along the third direction Y, the communication card may be positioned on the side of the server motherboard away from the signal board, thus allowing the communication card to be closer to the outside of the server relative to the server motherboard, facilitating maintenance of the communication card. Similarly, the storage device may also be configured in the same way as the communication card described above, achieving a similar effect, and will not be elaborated further here.

[0049] Furthermore, in this embodiment, with the first direction Z as the projection direction, the projection of the communication card coincides with the projection of the power supply device PS. Specifically, the projection of the communication card coincides with the projection of the end of the power supply device PS near the outside of the server. Thus, both this end of the power supply device PS and the communication card are close to the outside of the server in the front window area, facilitating maintenance. Additionally, the high-power power supply device PS can extend between the connection point between the power supply device PS and the power distribution device PD and the aforementioned projection overlap point. Based on this, this application improves the convenience of maintaining the high-power power supply device PS installed inside the server.

[0050] For example, after assembling the server motherboard, devices such as network cards and hard drives can be placed in the CPU BOX of the processing unit. Specifically, at least one of the hard drive and network card can be located on the side of the server motherboard away from the signal board MBP. For example, the network card can be connected to the server motherboard via a slot. The hard drive can be electrically connected to the server motherboard or a switch board. After assembly, the drawer of the CPU BOX can be placed in the server chassis and connected to the signal board MBP. The GPU BOX works similarly. For example, the power supply unit PS, the CPU BOX, and the GPU BOX can each be located in an independent drawer. For example, the first side of the signal board MBP has multiple first plug-in interfaces. For example, the first plug-in interfaces can be vertical board-to-board connectors. For example, the plug-in interfaces of the signal board MBP can be designed using a blind-mating design, and a structurally guided design can be used to align the CPU BOX, GPU BOX, and CBOX of the cooling unit with the plug-in interfaces of the signal board MBP, avoiding the use of cables and ensuring reliable connections. This meets the design requirements of large data volumes and reliable operation of artificial intelligence servers, and also provides good error prevention and simple assembly. Furthermore, this application can also employ the guiding design of high-tolerance connectors (such as floating connectors) to ensure the reliability of the blind mating design. The power supply device (PS) can also adopt a similar blind mating design, such as using slide rails, to facilitate signal processing of the PS when it slides along the rails to a position where it can interconnect with the signal board (MBP) or power distribution board. This design offers better foolproofing and simplifies assembly. Similarly, the power distribution device (PD) and signal board (MBP) can also be removed from the server, which will not be elaborated upon here.

[0051] Multiple first connectors are located at the first ends of the first and second slide rails, respectively. The first end of the GPU BOX (computing device) is provided with a computing device connector, and the pins within this connector are used for electrical connection with the pins of the first connector on the first slide rail when the first end of the GPU BOX is located at the first end of the first slide rail. The first end of the CPU BOX (processing device) is provided with a processing device connector, and the pins within this connector are used for electrical connection with the pins of the first connector on the second slide rail when the first end of the CPU BOX is located at the first end of the second slide rail.

[0052] Specifically, there can be multiple first connectors on the second slide rail. The processing device connectors can include motherboard connectors and switchboard connectors. Pins in the motherboard connectors are used to electrically connect with pins in the corresponding first connectors in the second slide rail when the first end of the server motherboard is located at the first end of the second slide rail. Pins in the switchboard connectors are used to electrically connect with pins in the corresponding first connectors in the second slide rail when the first end of the switchboard is located at the first end of the second slide rail. Furthermore, in another embodiment of this application, the server motherboard can also be connected to a power distribution device (PD) via a cable so that the PD supplies power to the server motherboard via the cable. For example, the voltage output by the power distribution device (PD) can be a 12V DC voltage. In one embodiment of this application, with a third direction Y, orthogonal to both the first direction Z and the second direction X, as the projection direction, the projection of the computing device GPU BOX at least partially coincides with the projection of at least one heat dissipation device, and the projection of the processing device CPU BOX at least partially coincides with the projection of at least one heat dissipation device. This facilitates the heat dissipation devices to jointly cool the computing device GPU BOX and the processing device CPU BOX. For example, the CPU box, GPU box, and cooling box (CBOX) are positioned at the same horizontal level. For instance, relative to the horizontal inner surface of the server, the CPU box, GPU box, and cooling box (CBOX) can be at the same height. This facilitates heat dissipation from the cooling box (CBOX) for both the CPU and GPU boxes. For example, the cooling box (CBOX) can blow air horizontally onto the CPU and GPU boxes, thus cooling them together. Specifically, the GPU box is positioned relatively high to facilitate heat dissipation from the cooling box (CBOX).

[0053] Figure 2 A schematic diagram of a signal board MBP according to an embodiment of this application is shown.

[0054] like Figure 2 As shown, the surface of the signal board MBP in this embodiment can be provided with multiple plug-in interfaces. These multiple plug-in interfaces may include, for example, multiple first plug-in interfaces disposed on a first surface of the signal board MBP and multiple second plug-in interfaces disposed on a second surface of the signal board MBP.

[0055] For example, the signal board MBP may include multiple first connectors such as a first connector GPUP for connecting a computing device, a first connector for connecting a processing device, and a first connector PSP for connecting a power supply device. For example, the first connector GPUP for connecting the computing device (e.g., the first connector of the first slide rail described above) may be located on the signal board MBP near the second inner side of the server (e.g., at the top). Specifically, the server has a second inner side in the first direction Z, adjacent to the computing device inside the server. For example, the second inner side may be the top surface of the server. A gap is formed between the top of the signal board and the second inner side of the server, thereby exposing at least a portion of the computing device to a heat dissipation device. This facilitates heat dissipation of the computing device by a heat dissipation device such as a fan. Simultaneously, the signal board can be structurally designed to partially expose the processing device, thereby enabling the computing device and the processing device to share heat dissipation.

[0056] The first connector for connecting the processing device may include a first connector MBPP for connecting to a server motherboard and a first connector SWP for connecting to a switch board. For example, the first connector MBPP for connecting to the server motherboard and the first connector SWP for connecting to the switch board may be located in the middle of the surface of the signal board MBP. For example, the first connector MBPP for connecting to the server motherboard may be positioned above the first connector SWP for connecting to the switch board, but this embodiment is not limited to this; the first connector MBPP for connecting to the server motherboard may also be positioned below the first connector SWP for connecting to the switch board.

[0057] Accordingly, computing devices may be provided with computing device interface. Processing devices may be provided with processing device interface. Processing device interface may include motherboard interface and switch interface. For example, a computing device may be electrically connected via pins in the computing device interface to pins in a first interface (GPUP) for connecting computing devices. A processing device may be electrically connected via pins in the processing device interface to pins in a first interface (SWP) for connecting processing devices. Specifically, a server motherboard may be electrically connected via pins in the motherboard interface to pins in a first interface (MBPP) for connecting server motherboards. A switch board may be electrically connected via pins in the switch board interface to pins in a first interface (SWP) for connecting switch boards.

[0058] The server motherboard can be electrically connected to the switching board via cables and other devices. The pins in the switching board's connectors can be electrically connected to the pins in the computing device connectors via traces inside the signal board (MBP). In this way, the server motherboard can interconnect with computing devices via the switching board, the pins in the switching board's connectors, the traces inside the signal board (MBP), and the pins in the computing device connectors with a relatively short signal path.

[0059] The first plug-in interface PSP for connecting power supply equipment can be located on one side near the bottom of the signal board MBP. The power supply equipment can be provided with an output interface, which can be used to electrically connect to the first plug-in interface PSP of the signal board MBP. There can be multiple first plug-in interface PSPs of the signal board MBP for connecting power supply equipment, thus allowing multiple power supply equipment to be connected.

[0060] On the other hand, the signal board MBP may include multiple second plug-in interfaces, such as a second plug-in interface FANP for connecting heat dissipation equipment and a second plug-in interface PDP for connecting power distribution equipment.

[0061] The second plug-in interface PDP for connecting the power distribution equipment and the first plug-in interface PSP for connecting the power supply equipment can be located on the side of the signal board MBP in the first direction Z, for example, at the bottom of the signal board MBP. Specifically, the first plug-in interface of the power supply equipment can also be located on the first surface of the signal board MBP on one side of the signal board MBP in the second direction X.

[0062] The pins in the output interface of the power supply device are electrically connected to pins in the first connector PSP used for connecting the power supply device, and the pins in the input interface of the power distribution device can be electrically connected to pins in the second connector PDP used for connecting the power distribution device. The pins in the output interface of the power distribution device can be electrically connected to pins in another second connector PDP used for connecting the power distribution device. Thus, the power supply device can be electrically connected to the power distribution device via pins in its output interface, pins in the first connector PSP used for connecting the power supply device, traces in the signal board MBP, pins in the second connector PDP used for connecting the power distribution device, and pins in the input interface of the power distribution device. It can also be electrically connected to the signal board MBP via pins in its output interface and pins in another second connector PDP used for connecting the power distribution device, thereby supplying power to the computing device, processing device, and cooling device.

[0063] Figure 3 A schematic diagram of a server according to another embodiment of this application is shown.

[0064] like Figure 3As shown, the server in this embodiment may include a signal board (MBP), a processing unit (CPU BOX), a computing unit (GPU BOX), a heat dissipation unit (CBOX), a power distribution unit (PD), and a power supply unit (PS). The processing unit (CPU BOX) may include a server motherboard (MB) and a switch board (SW). The processing unit (CPU BOX) may also include a network interface card (NIC) and a hard drive. At least one of the hard drive and NIC may be located on the side of the server motherboard away from the signal board (MBP). The heat dissipation unit may include a fan (FAN). The processing unit (CPU BOX) and the computing unit (GPU BOX) are disposed on a first side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The heat dissipation unit (CBOX) may be disposed on a second side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The power distribution unit (PD) may include a power distribution board. The power distribution board has a distribution board interface that may face the first region so that the distribution board interface is electrically connected to the power supply unit (PS). Furthermore, in some embodiments, the power distribution unit (PD) may not include a power distribution board.

[0065] The power distribution device PD can be located on the side of the power supply device PS near the signal board MBP on a third direction Y (e.g., a horizontal direction) intersecting the first direction Z, and is electrically connected to the power supply device PS. The power supply device PS can be located next to the processing device CPU BOX and the computing device GPU BOX on the first direction Z, for example, the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX.

[0066] Continue to refer to Figure 3As can be seen, in this embodiment, the length and depth of the power supply device PS do not exceed the bottom of the signal board MBP, meaning that the orthographic projection of the power supply device PS in the third direction Y does not overlap with the orthographic projection of the signal board MBP in the third direction Y. In this case, the output interface of the power supply device PS is adjacent to the bottom of the signal board MBP. The output interface of the power supply device PS can be a vertical board connector, specifically a vertical board-to-board connector. Thus, the output interface of the power supply device PS can be directly plugged into the first plug-in interface of the signal board MBP for connecting the power supply device PS, thereby electrically connecting the pins in the output interface of the power supply device PS to the pins in the first plug-in interface for connecting the power supply device PS, thus avoiding the need to use a power distribution board to electrically connect the power supply device PS and the signal board MBP. Furthermore, this embodiment is not limited to this. In other embodiments of this application, the Common Redundant Power Supply (CRPS) connector of the power supply device PS can be soldered to the signal board MBP. Thus, the power supply device PS can supply power to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX via the signal board MBP and the power distribution device PD. For example, the power supply device PS in this example may include a 12V power supply unit, and there can generally be multiple power supply units. In this case, the signal board MBP will occupy a space with a height of 1U in the lower area of ​​the server. Here, U is a unit of height. In one embodiment of this application, the 12V power supply device PS can be plugged into the plug-in interface of the power distribution board through the signal board MBP. Furthermore, the 12V power supply device PS can be replaced with a 54V power supply device PS, thereby reducing the number of power supply devices PS.

[0067] Further, continue to refer to Figure 3It is known that the second side of the signal board MBP is opposite to the second inner side of the server. The second inner side is provided with an AC voltage interface AC. The pins of this AC voltage interface AC can be electrically connected via cables to the signal board MBP interface for connecting the AC voltage interface AC. For example, the connection between the AC voltage interface AC and the signal board MBP can be pre-assembled. Specifically, it can be electrically connected via cables to the pins within the signal board MBP interface. Simultaneously, the pins of the power supply device PS's input interface can be electrically connected to the pins of the first plug-in interface of the signal board MBP for connecting the power supply device PS's input interface. Thus, the power supply device PS can be electrically connected to the pins of the AC voltage interface AC via the pins of its input interface, the pins of the first plug-in interface for connecting the power supply device PS's input interface, the internal wiring of the signal board MBP, and the pins of the signal board MBP interface for connecting the AC voltage interface AC, and receive AC voltage from the AC voltage interface AC. The power supply unit (PS) can chop and step down the received AC voltage to obtain a DC voltage. This DC voltage is then supplied to the power distribution board (PD) via traces within the signal board (MBP). The PD further steps down the DC voltage to provide power to the GPU, CPU, and CBOX (processor unit and heat sink). The MBP then supplies this stepped-down DC voltage to these components via traces within the MBP. Furthermore, the MBP acts as a crucial bridge between high-speed signals, low-speed signals, and power supply, enabling high-density interconnection of high-speed and low-speed signals, as well as power signal transmission. For example, the MBP can be electrically connected to the power distribution unit (PD), providing, for instance, a 54V DC voltage to the GPU. In this way, the PS can supply power to the PD, which in turn supplies power to the CPU, GPU, and CBOX via traces within the MBP.

[0068] In another embodiment of this application, the power supply device PS and the power distribution board can be directly electrically connected at a gap below the signal board MBP. (The following is in conjunction with...) Figure 4 Please provide an explanation.

[0069] Figure 4 A schematic diagram of a server according to another embodiment of this application is shown.

[0070] like Figure 4As shown, the server in this embodiment may include a signal board (MBP), a processing unit (CPU BOX), a computing unit (GPU BOX), a heat dissipation unit (CBOX), a power distribution unit (PD), and a power supply unit (PS). The processing unit (CPU BOX) may include a server motherboard (MB) and a switch board (SW). The processing unit (CPU BOX) may also include a network interface card (NIC) and a hard drive. At least one of the hard drive and NIC may be located on the side of the server motherboard away from the signal board (MBP). The heat dissipation unit may include a fan (FAN). The processing unit (CPU BOX) and the computing unit (GPU BOX) are disposed on a first side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The heat dissipation unit (CBOX) may be disposed on a second side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The power distribution unit (PD) may include a power distribution board. The power distribution unit (PD) may be located on a third direction (Y, for example, a horizontal direction) intersecting the first direction (Z) near the power supply unit (PS) and electrically connected to the power supply unit (PS). The power supply unit (PS) may be located next to the processing unit (CPU BOX) and the computing unit (GPU BOX) in the first direction (Z), for example, the power supply unit (PS) may be located below the processing unit (CPU BOX) and the computing unit (GPU BOX).

[0071] Further, refer to Figure 4 As can be seen, in this embodiment, the length and depth of the power supply device PS do not exceed the bottom of the signal board MBP, that is, the orthographic projection of the power supply device PS in the third direction Y does not overlap with the orthographic projection of the signal board MBP in the third direction Y.

[0072] For example, the server has a first inner side surface in a first direction Z. This first inner side surface is adjacent to a power supply device PS inside the server. For example, the first inner side surface can be the bottom surface inside the server, and the power supply device PS can be located below the processing unit CPU BOX and the computing unit GPU BOX. A gap is formed between the first inner side surface and the signal board MBP, such that the power supply device PS and the power distribution device PD are electrically connected at the gap between the first inner side surface and the signal board MBP. Specifically, the power supply device PS can be electrically connected to the power distribution board. For example, the power supply device PS can be electrically connected to the power distribution board via a horizontal board-to-board connector. For example, the power supply device PS can include a 54V power supply node.

[0073] In this configuration, the orthographic projection of the power distribution board in the third direction Y partially overlaps with the orthographic projection of the signal board MBP in the third direction Y. The power supply device PS can provide DC voltage to the power distribution board via the power distribution board, enabling the power distribution board to supply power to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX via traces within the signal board MBP.

[0074] Further, continue to refer to Figure 4 It is known that the second side of the signal board MBP is opposite to the second inner side of the server. The second inner side is provided with an AC voltage interface (AC). This AC voltage interface (AC) can be electrically connected to the power distribution board. For example, the connection between the AC voltage interface (AC) and the power distribution board can be pre-assembled. The power distribution board can be provided with an interface for connecting the input interface of the power supply unit, i.e., the distribution board interface. When the pins in the input interface of the power supply unit are electrically connected to the pins in the distribution board interface of the power distribution board, the power supply unit can receive AC voltage from the AC voltage interface (AC) via the pins inside the distribution board interface of the power distribution board and the wiring of the power distribution board. Then, the power supply device (PS) can chop, step down, or otherwise process the received AC voltage to obtain DC voltage.

[0075] In this embodiment, when the pins in the output interface of the power supply device PS are electrically connected to the pins in another interface of the power distribution board, the power supply device PS can provide DC voltage to the power distribution board electrically connected to the power distribution board via the pins in the other interface of the power distribution board. The power distribution board may be equipped with electrolytic capacitors. The electrolytic capacitors can be used to meet the peak power requirements of the graphics processor of the artificial intelligence server. The number of electrolytic capacitors can be set based on the power supply unit to meet dynamic load requirements. The power distribution board can be used to step down the DC voltage received from the power distribution board and provide it to the GPU BOX, CPU BOX, and CBOX of the computing device, processing device, and cooling device, respectively, based on the power requirements of the GPU BOX, CPU BOX, and CBOX of the cooling device, via different traces in the signal board MBP.

[0076] In one embodiment of this application, to avoid electromagnetic interference between AC and DC voltages on the power distribution board and to meet safety regulations, the 54V power supply device PS can be connected to the 54V power distribution board using separate DC and AC connectors. The AC connector crosses the 54V power distribution board via an AC cable and is fixed to the 54V AC voltage interface AC, then connects to the external computer room's AC power cable via the AC voltage interface AC. This design separates the DC and AC components, thus at least partially preventing mutual interference between AC and DC signals. After the separate AC and DC connectors are fixed as a whole on the 54V power distribution board, they are then blind-mold assembled with the 54V power supply device PS. Based on this, the signal board MBP can act as a crucial bridge between high-speed signals, low-speed signals, and power supply, enabling high-density high-speed signal interconnection, low-speed signal interconnection, and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD, providing, for example, 54V DC voltage to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, so that the power distribution device PD can supply power to the processing device CPU BOX, computing device GPU BOX and heat dissipation device CBOX through the traces in the signal board MBP.

[0077] In another embodiment of this application, the output interface and input interface of the power supply device (PS) can be electrically connected to the same interface of the power distribution board, and electrically connected to the power distribution board via different pins within the same interface. For example, the output interface of the power supply device (PS) can be provided with output pins, and the input interface of the power supply device (PS) can be provided with input pins. In yet another embodiment of this application, the power supply device (PS) can be provided with an interface that includes both output pins and input pins. For example, the output pins of the power supply device are located in a first region. Alternatively, if the power supply device is located in a first region and a second region, the output pins of the power supply device can be located in the second region for electrical connection with the power distribution device.

[0078] Figure 5 A schematic diagram of a server according to another embodiment of this application is shown.

[0079] like Figure 5As shown, the server in this embodiment may include a signal board (MBP), a processing unit (CPU BOX), a computing unit (GPU BOX), a heat dissipation unit (CBOX), a power distribution unit (PD), and a power supply unit (PS). The processing unit (CPU BOX) may include a server motherboard (MB) and a switch board (SW). The processing unit (CPU BOX) may also include a network interface card (NIC) and a hard drive. At least one of the hard drive and NIC may be located on the side of the server motherboard away from the signal board (MBP). The heat dissipation unit may include a fan (FAN). The processing unit (CPU BOX) and the computing unit (GPU BOX) are disposed on a first side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The heat dissipation unit (CBOX) may be disposed on a second side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The power distribution unit (PD) may include a power distribution board. The power distribution unit (PD) may be located on a third direction (Y, for example, a horizontal direction) intersecting the first direction (Z) near the power supply unit (PS) and electrically connected to the power supply unit (PS). The power supply unit (PS) may be located next to the processing unit (CPU BOX) and the computing unit (GPU BOX) in the first direction (Z), for example, the power supply unit (PS) may be located below the processing unit (CPU BOX) and the computing unit (GPU BOX).

[0080] refer to Figure 5 As can be seen, in this embodiment, the length and depth of the power supply device PS do not exceed the bottom of the signal board MBP, meaning that the orthographic projection of the power supply device PS in the third-party Y direction does not overlap with the orthographic projection of the signal board MBP in the third-party Y direction. However, since there is a gap between the bottom of the signal board MBP and the bottom of the server interior, the output interface of the power supply device PS and the input interface of the power distribution device PD can be electrically connected below the signal board MBP. In this case, the orthographic projection of the power distribution board in the third-party Y direction overlaps with the orthographic projection of the signal board MBP in the third-party Y direction at least partially. The power supply device PS can provide DC voltage to the power distribution board, enabling the power distribution board to supply power to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX via traces within the signal board MBP.

[0081] Furthermore, the power distribution board may include a distribution board interface facing the power supply device PS, with a first pin within the distribution board interface for connecting to the output pin of the power supply device PS to receive DC voltage via the pin within the output interface of the power supply device PS. The power distribution board can then supply power to the processing device CPUBOX, computing device GPU BOX, and cooling device CBOX via traces within the signal board MBP based on the received DC voltage. For example, the power supply device can use pre-stored electrical energy for power supply. However, this application is not limited to this; in another embodiment of this application, the power supply device can also receive AC voltage from a data center outside the server for power supply.

[0082] Continue to refer to Figure 5 As can be seen, the second side of the signal board MBP faces the inner side of the server where the AC voltage interface is located, and the distribution board interface also includes a second pin. This second pin can be used to connect the input pin of the power supply device PS and the pin in the AC voltage interface AC to provide the AC voltage from the AC voltage interface AC to the power supply device PS. For example, the power distribution device may also include a cable. One end of the cable is electrically connected to the second pin, and the other end of the cable is electrically connected to the AC voltage pin in the AC voltage interface. The second pin in the distribution board interface can be connected to the pin in the AC voltage interface AC via the cable. In this way, the output pin of the power supply device PS can be electrically connected to the first pin of the distribution board interface, and the input pin of the power supply device PS can be electrically connected to the second pin of the distribution board interface. Based on this, the power supply device PS can receive AC voltage from the AC voltage interface AC via the second pin. Then, the power supply device PS can perform chopping, step-down, and other processing on the received AC voltage to obtain DC voltage. Next, the power supply device (PS) can provide DC voltage to the power distribution board via the first pin of the power distribution board interface. The power distribution board then steps down the DC voltage to a level suitable for supplying the GPU BOX, CPU BOX, and CBOX, and provides this stepped-down DC voltage to these components via traces within the signal board (MBP). Based on this, the MBP acts as a crucial bridge between high-speed signals, low-speed signals, and power supply, enabling high-density high-speed signal interconnection, low-speed signal interconnection, and power signal transmission. For example, the MBP can be electrically connected to the power distribution device (PD), providing, for example, 54V DC voltage to the GPU BOX. Thus, the power supply device (PS) can supply power to the power distribution device (PD), allowing the PD to supply power to the CPU BOX, GPU BOX, and CBOX via traces within the MBP.

[0083] Figure 6 A schematic diagram of a server according to another embodiment of this application is shown.

[0084] like Figure 6As shown, the server in this embodiment may include a signal board (MBP), a processing unit (CPU BOX), a computing unit (GPU BOX), a heat dissipation unit (CBOX), a power distribution unit (PD), and a power supply unit (PS). The processing unit (CPU BOX) may include a server motherboard (MB) and a switch board (SW). The processing unit (CPU BOX) may also include a network interface card (NIC) and a hard drive. At least one of the hard drive and NIC may be located on the side of the server motherboard away from the signal board (MBP). The heat dissipation unit may include a fan (FAN). The processing unit (CPU BOX) and the computing unit (GPU BOX) are disposed on a first side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The heat dissipation unit (CBOX) may be disposed on a second side of the signal board (MBP) and thus electrically connected to the signal board (MBP). The power distribution unit (PD) may include a power distribution board. The power distribution unit (PD) may be located on a third direction (Y, for example, a horizontal direction) intersecting the first direction (Z) near the power supply unit (PS) and electrically connected to the power supply unit (PS). The power supply unit (PS) may be located next to the processing unit (CPU BOX) and the computing unit (GPU BOX) in the first direction (Z), for example, the power supply unit (PS) may be located below the processing unit (CPU BOX) and the computing unit (GPU BOX).

[0085] refer to Figure 6 As can be seen, in this embodiment, the length and depth of the power supply device PS exceed the bottom of the signal board MBP, meaning that the orthographic projection of the power supply device PS in the third direction Y (i.e., its orthographic projection in the horizontal plane) at least partially overlaps with the orthographic projection of the signal board MBP in the third direction Y. However, since there is a gap between the bottom of the signal board MBP and the bottom of the server interior, the output interface of the power supply device PS and the input interface of the power distribution device PD can be electrically connected below the signal board MBP. In this case, the orthographic projection of the power distribution board in the third direction Y does not overlap with the orthographic projection of the signal board MBP in the third direction Y. The power supply device PS can provide DC voltage to the power distribution board, enabling the power distribution board to supply power to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX via the traces within the signal board MBP. Based on this, the signal board MBP can act as an important bridge for high-speed signals, low-speed signals, and power current transmission, realizing high-density high-speed signal interconnection, low-speed signal interconnection, and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD, providing, for example, a 54V DC voltage to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, enabling the power distribution device PD to supply power to the processing device CPU BOX, the computing device GPU BOX, and the cooling device CBOX via traces within the signal board MBP.

[0086] Further reference Figure 6It is known that the first end of the power supply device PS is located on the inner side of the server opposite to the first side of the signal board MBP, and the second end of the power supply device PS passes through the gap between the plane where the first side of the signal board MBP is located and the bottom of the signal board MBP, thereby electrically connecting to the power distribution device PD. In this way, there is sufficient space to install a high-power power supply device PS on the same side as the processing device CPU BOX, computing device GPU BOX, and signal board MBP (e.g., below the processing device CPU BOX, computing device GPU BOX, and signal board MBP), or even on the same side as the processing device CPU BOX, computing device GPU BOX, signal board MBP, and heat dissipation device CBOX (e.g., below the processing device CPU BOX, computing device GPU BOX, signal board MBP, and heat dissipation device CBOX), thereby increasing the power density of the power supply to the devices.

[0087] This application embodiment may include at least two power supply devices (PS). The power distribution device (PD) includes at least two distribution board interfaces, each of which is electrically connected to one power supply device (PS). Specifically, at least one input pin of any power supply device (PS) is connected to an AC voltage pin in at least one AC voltage interface (AC) via a second pin in at least one distribution board interface. The following is combined with... Figure 7 Please provide an explanation.

[0088] Figure 7 A top view of a power distribution board according to an embodiment of this application is shown.

[0089] refer to Figure 7 It can be seen that multiple distribution board interfaces (SPs) can be set on the power distribution board (PDB), and a raised PDU can be set. Each distribution board interface (SP) can include a first interface area A and a second interface area B. The first interface area A can be provided with a first pin, and the second interface area B can be provided with a second pin. For example, the first interface area and the second interface area can be connected through a slot, which ensures that the first interface area and the second interface area are flush on the side closest to the power supply unit, which facilitates the connection of the power supply unit interface. For example, the first pin set in the first interface area A can be a DC voltage pin, such as a positive pin and a negative pin, which can be arranged in the first direction Z or the second direction X. For example, the first pin set in the second interface area B can be an AC voltage pin, such as a neutral pin, a live pin, and a ground pin, used to connect the live wire, neutral wire, and ground wire, respectively. The pins in the interface of the power supply equipment should correspond to the pin settings of the power distribution board, which will not be elaborated here.

[0090] Meanwhile, the second pins of the second interface area B can be in multiple sets, each electrically connected to the first AC voltage interface C and the second AC voltage interface D. There can be multiple first AC voltage interfaces C and multiple second AC voltage interfaces D. Furthermore, the first AC voltage interface C can include a neutral pin, a live pin, and a ground pin, and the second AC voltage interface D can include a neutral pin, a live pin, and a ground pin. Thus, even if one of the first AC voltage interfaces C or the second AC voltage interface D fails, AC voltage can still be provided through the other, unaffected AC voltage interface.

[0091] Through the aforementioned redundancy design, even in the event of power supply unit failure, AC voltage interface failure, cable failure, or distribution board interface failure, this application can still ensure power supply reliability using the non-faulty components. Furthermore, based on this design, AC voltage can be provided to the 54V power supply device via dual AC voltage interfaces, or via a single AC voltage interface, based on the 54V system power of the 54V power supply device. On this basis, the dual AC input power supply nodes are preferably configured with N+1 redundancy (e.g., N+1 dual AC input power supply nodes, where N is a positive integer), suitable for configurations with higher computing device power; the single AC input power supply nodes are preferably configured with N+N redundancy (e.g., 2N dual AC input power supply nodes, where N is a positive integer), suitable for configurations with lower computing device power.

[0092] Figure 8 A schematic diagram of a power distribution board according to another embodiment of this application is shown.

[0093] like Figure 8 As shown, in this embodiment, the distribution board interface of the power distribution board is lower than the output interface of the power distribution board in the vertical direction. Specifically, the height H between the output interface and the distribution board interface can be 1U. This allows the power distribution board to be electrically connected to the output interface of the power supply equipment below the signal board, and also allows the output interface of the protrusion on the power distribution board to be electrically connected to the signal board.

[0094] Figure 9 A schematic diagram of a power distribution board according to an embodiment of this application is shown. Figure 10 A schematic diagram showing the connection of a power distribution board and a signal board according to an embodiment of this application is illustrated.

[0095] like Figure 9 and Figure 10As shown, the protrusion of the power distribution device can protrude from the power distribution board. The protrusion is provided with the aforementioned output interface of the power distribution device, which faces the signal board and is electrically connected to the signal board. This allows the power distribution board to be electrically connected to the output interface of the power supply device below the signal board, and also allows the output interface of the power distribution board to be electrically connected to the signal board. For example, the power distribution board can be provided with traces for connecting the protrusion and the power supply device. Multiple step-down circuits for stepping down DC voltage can be provided within the protrusion. These multiple step-down circuits can each step down the received DC voltage to obtain a step-down voltage suitable for each device, so that the voltages of the multiple step-down voltages can be used to supply power to the aforementioned devices via various traces within the signal board. For example, an electrolytic capacitor can be provided within the protrusion of the power distribution board in the first direction Z.

[0096] The output interface of the power distribution equipment includes copper busbars soldered to the power distribution equipment. Specifically, the output interface of the power distribution equipment may include a positive copper busbar and a negative copper busbar. The second connector of the signal board includes a floating clip-on connector, i.e., a clip connector, soldered to the signal board. The power distribution equipment is electrically connected to the signal board when the copper busbar is held in place by the floating clip-on connector; that is, the power distribution equipment is electrically connected to the signal board when the copper busbar is inserted into the floating clip-on connector. Thus, the clip connectors on the lower left and right sides of the signal board connect to the two copper busbars of the power distribution board respectively, thereby enabling the 54V power supply unit to interface with the signal board through two sets of connectors. This configuration can partially save power traces on the signal board and reduce interference between power traces and high-speed links.

[0097] The power distribution board supports blind-mating design. For example, the power distribution board can slide along a third direction Y or a second direction X (e.g., via a slide rail). Because the power distribution board and signal board experience significant impact forces and large lateral offset errors during blind mating, a design using the aforementioned copper busbars and floating clamp-type interfaces can be employed to meet the required mating tolerances and ensure electrical connection reliability. Furthermore, the copper busbars are integrated into a single positive and negative structure (i.e., the positive and negative copper busbars are integrated into the same raised structure), while the floating clamp-type interface is a separate design. This improves the mating accuracy between the power distribution board and signal board and enhances the flexibility of the floating clamp-type interface's placement.

[0098] In this embodiment, the plurality of second connectors, in addition to being used to connect to the output interfaces of the power distribution device, can also be used to connect to the heat dissipation device connectors of the heat dissipation device. In this embodiment, the heat dissipation device may include at least two heat dissipation devices, which are spaced apart along a first direction and / or a second direction. The second direction is orthogonal to the first direction.

[0099] Figure 11A schematic diagram of a heat dissipation device according to an embodiment of this application is shown.

[0100] refer to Figure 11 The heat dissipation device also includes a first connecting plate and a second connecting plate. The first connecting plate can extend along a second direction and is electrically connected to at least one heat dissipation device. It should be understood that the embodiments of this application are not limited to this; in other embodiments, the first connecting plate can also extend along a third direction. The second connecting plate can extend along a first direction, is electrically connected to at least one first connecting plate, and is electrically connected to a signal board. For example, the first connecting plate can be a vertical connecting plate. The second connecting plate can be a horizontal connecting plate. Thus, the heat dissipation device can include a vertical connecting plate, a horizontal connecting plate, and a heat dissipation device. Figure 11 (Not shown in the image).

[0101] The vertical connecting board may extend along a first direction and include interfaces for multiple first connecting boards. For example, the interfaces for the multiple first connecting boards may be multiple vertical board plug-in interfaces (e.g., vertical board-to-board connectors) and heat dissipation device plug-in interfaces (e.g., vertical board-to-board connectors). The multiple vertical board plug-in interfaces are arranged in the first direction and electrically connected to the heat dissipation device plug-in interfaces. For example, pins within the multiple vertical board plug-in interfaces may be electrically connected to pins within the heat dissipation device plug-in interfaces via traces within the vertical connecting board.

[0102] There can be multiple horizontal connecting plates. These multiple horizontal connecting plates are arranged in a first direction. Each of the multiple horizontal connecting plates includes an interface for a second connecting plate. For example, the interface of the second connecting plate can be a horizontal plate plug-in interface (e.g., a vertical plate-to-plate connector). The horizontal plate plug-in interface of any horizontal connecting plate is used to connect to the vertical plate plug-in interface. Specifically, pins within the horizontal plate plug-in interface can be used for electrical connection to pins within the vertical plate plug-in interface. Each horizontal connecting plate can be provided with a heat dissipation device. For example, the heat dissipation device can be a fan. Four to five heat dissipation devices can be provided on any horizontal connecting plate. The number of horizontal connecting plates can be three to four rows. Each row of heat dissipation devices is plugged into a corresponding horizontal connecting plate, for example, through a heat dissipation device connector (e.g., a vertical connector). For example, the heat dissipation device is configured to be detachably connected to the first connecting plate. Specifically, there are multiple heat dissipation devices on any horizontal connecting plate. The multiple heat dissipation devices on any horizontal connecting plate are arranged at intervals in a second direction and can be detached from any horizontal connecting plate. However, the embodiments of this application are not limited to this. In other embodiments of this application, multiple heat dissipation devices can also be arranged at intervals in the third direction upward, at intervals in the second direction and the third direction upward, etc. Based on this, by setting horizontal connecting plates, the heat dissipation resistance of the system can be reduced. Each row of horizontal connecting plates is connected to the vertical connecting plate through a vertical plate plug-in interface, thereby receiving voltage from the signal board to power the fan. The horizontal and vertical connecting plates can be reinforced by structural components or other devices. Furthermore, the connecting plates support blind insertion and have a guide design, making the connection between boards simpler and more reliable than cable connections. For example, the first connecting plate can move between a third position and a fourth position. And when the first connecting plate is in the fourth position, it is electrically connected to the second connecting plate. The third position can correspond to the position where the first connecting plate is entirely outside the server. The fourth position can correspond to the position where the first connecting plate is entirely inside the server. For example, the server also includes a third inner side (e.g., the vertical inner side of the server) extending along the first direction and perpendicular to the first and second surfaces of the signal board. A connecting plate slide rail is formed between the third inner side and the vertical connecting plate. Any horizontal connecting plate can slide relative to the vertical connecting plate along a connecting plate slide rail. For example, the horizontal plate plug-in interface of any horizontal connecting plate is located at the first end of any horizontal connecting plate. This horizontal plate plug-in interface is used to electrically connect the horizontal connecting plate to the vertical connecting plate via the vertical plate plug-in interface when the first end of the horizontal connecting plate is located at the vertical plate plug-in interface. Thus, since the vertical and horizontal connecting plates are connected via plug-in interfaces, this provides advantages such as cable-free connection, simple assembly, good error prevention, high connection reliability, and easy maintenance. Furthermore, the heat dissipation device can be maintained at any location while the machine is powered on.

[0103] Figure 12A flowchart of a power supply method according to an embodiment of this application is shown.

[0104] like Figure 12 As shown, the power supply method of this embodiment may include operation S1210.

[0105] In operation S1210, the power supply equipment supplies power to the power distribution equipment so that the power distribution equipment supplies power to the processing equipment and computing equipment via the traces in the signal board.

[0106] It should be understood that the power supply method in the embodiments of this application is not limited to this; refer to the foregoing description, which will not be repeated here.

[0107] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0108] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

[0109] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Without departing from the scope of this application, those skilled in the art can make various substitutions and modifications, all of which should fall within the scope of this application.

Claims

1. A server, characterized in that, The server includes: A signal board extends along a first direction, and the signal board divides the internal space of the server into a first region and a second region; Processing and computing devices are located in the first area and are electrically connected to the signal board; A power supply device is disposed in the first region and extends from the first region to the second region; wherein, in the first direction, there is a gap between the signal board and the inner surface of the server for the power supply device to extend from the first region to the second region; A power distribution device is disposed in the second area and electrically connected to the power supply device and the signal board; the power distribution device includes a power distribution board, which is provided with a distribution board interface for connecting to the interface of the power supply device. The distribution board interface is provided with a first pin and a second pin. The first pin is used to receive DC voltage from the power supply device, and the second pin is used to provide AC voltage to the power supply device. The power supply device is used to convert the AC voltage into the DC voltage and supply power to the power distribution device based on the DC voltage, so that the power distribution device supplies power to the processing device and the computing device through the traces in the signal board.

2. The server according to claim 1, characterized in that, The distribution board interface faces the first area.

3. The server according to claim 2, characterized in that, The power distribution device also includes: A protrusion is disposed on the power distribution board and protrudes from the power distribution board. The protrusion is provided with an output interface, which faces the signal board and is electrically connected to the signal board.

4. The server according to claim 3, characterized in that, The output interface includes a copper busbar; The signal board is provided with a floating clamp-type interface; when the copper busbar is clamped by the floating clamp-type interface, the power distribution device is electrically connected to the signal board.

5. The server according to any one of claims 2 to 4, characterized in that, The first pin is configured to be electrically connected to the output pin of the power supply device; The second pin is configured to be electrically connected to the AC voltage pin and the input pin of the power supply device.

6. The server according to claim 5, characterized in that, The output pins of the power supply device are located in the second region.

7. The server according to claim 5, characterized in that, The power distribution device also includes: A cable, one end of which is electrically connected to the second pin, and the other end of which is electrically connected to the AC voltage pin.

8. The server according to any one of claims 2 to 4, characterized in that, Includes at least two of the aforementioned power supply devices; The power distribution device includes at least two distribution board interfaces, each of which is electrically connected to one of the power supply devices.

9. The server according to any one of claims 1 to 4, characterized in that, At least one of the processing device, the computing device, and the power supply device is slidably disposed in the internal space.

10. The server according to claim 9, characterized in that, The processing device is configured to slide between a first position and a second position, wherein the processing device is electrically connected to the signal board when it is in the second position. And / or, the computing device is configured to slide between a first position and a second position, wherein the computing device is electrically connected to the signal board when it is in the second position.

11. The server according to claim 10, characterized in that, The power supply device is configured to slide between a first position and a second position, wherein the power supply device is electrically connected to the power distribution device when it is in the second position.

12. The server according to any one of claims 1 to 4, characterized in that, Also includes: A heat dissipation device is installed in the second area.

13. The server according to claim 12, characterized in that, The heat dissipation device includes: At least two heat dissipation devices are arranged at intervals along a first direction and / or a second direction; The second direction is orthogonal to the first direction.

14. The server according to claim 13, characterized in that, The heat dissipation device also includes: A first connecting plate extends along the second direction and is electrically connected to at least one of the heat dissipation devices; The second connecting plate extends along the first direction, is electrically connected to at least one of the first connecting plates, and is also electrically connected to the signal board.

15. The server according to claim 14, characterized in that, The first connecting plate is configured to move between a third position and a fourth position, and is electrically connected to the second connecting plate when the first connecting plate is in the fourth position.

16. The server according to claim 14, characterized in that, The heat dissipation device is configured to be detachably connected to the first connecting plate.

17. The server according to claim 13, characterized in that, With a third direction orthogonal to both the first and second directions as the projection direction, the projection of the computing device at least partially overlaps with the projection of at least one of the heat dissipation devices; Furthermore, the projection of the processing device at least partially overlaps with the projection of at least one of the heat dissipation devices.

18. The server according to any one of claims 1 to 4, characterized in that, The power supply equipment, the processing equipment, and the computing equipment are arranged at intervals along the first direction.

19. The server according to claim 18, characterized in that, Along the first direction, the power supply equipment, the processing equipment, and the computing equipment are arranged sequentially.

20. The server according to any one of claims 1 to 4, characterized in that, The processing device includes an electrically connected switching board, server motherboard, storage device, and communication card.

21. The server according to claim 20, characterized in that, Along a third direction orthogonal to both the first and second directions, the communication card is disposed on the side of the server motherboard away from the signal board; With the first direction as the projection direction, the projection of the communication card coincides with the projection portion of the switching board, and / or the projection of the server motherboard coincides with the projection portion of the switching board.

22. The server according to claim 21, characterized in that, With the first direction as the projection direction, the projection of the communication card coincides with the projection portion of the power supply device.

23. A power supply method for a server as described in any one of claims 1 to 22, characterized in that, The power supply method includes: The power supply equipment supplies power to the power distribution equipment so that the power distribution equipment supplies power to the processing and computing equipment via traces in the signal board.

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