Cooling plate topological optimization method, cooling method and device

Abstract

The invention relates to the technical field of heat dissipation, and provides a cooling plate topological optimization method, a cooling method and a cooling device.The method comprises the steps that the temperature value of a target temperature point of a cooling plate is minimized as an optimization target, and the pressure drop of a cooling medium in the cooling plate does not exceed the lift of a cooling water pump as a constraint condition; constructing an optimization function related to topological parameters of a cooling medium flow channel in the cooling plate; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate; and based on the optimization function, topological optimization is carried out on the cooling medium flow channel in the cooling plate. The cooling medium flow channel after topological optimization is more reasonable and can better adapt to the heat source distribution characteristics of equipment, efficient flowing of the cooling medium and uniform transfer of heat are achieved, and therefore generation of local overheat points is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a cooling plate topology optimization method, a cooling method and device. BACKGROUND

[0002] The heat generated by equipment during operation is increasing. In order to ensure the stable operation of the equipment and prolong its service life, efficient heat dissipation technology becomes crucial. Cooling plate, as a kind of efficient cooling device, has been widely used in many fields due to its high cooling efficiency, compact structure and other advantages. It absorbs the heat generated by the equipment and carries it away by circulating the cooling medium (usually water or other liquids) in the flow channel inside the cooling plate, thereby achieving effective cooling of the equipment.

[0003] The cooling effect of the cooling plate depends largely on the design of the cooling medium flow channel inside it. When the topology structure of the cooling medium flow channel in the cooling plate is designed with defects, local hot spots will be generated. SUMMARY

[0004] The present application provides a cooling plate topology optimization method, a cooling method and device to solve the technical problem of the generation of local hot spots due to the design defects of the topology structure of the cooling medium flow channel in the cooling plate in the prior art.

[0005] The present application provides a cooling plate topology optimization method, comprising the following steps: Minimizing the temperature value of the target temperature point of the cooling plate as the optimization goal, and the pressure drop of the cooling medium in the cooling plate does not exceed the head of the cooling water pump as the constraint condition, to construct the optimization function related to the topology parameters of the cooling medium flow channel in the cooling plate; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate; Based on the optimization function, the topology of the cooling medium flow channel in the cooling plate is optimized.

[0006] According to the cooling plate topology optimization method provided by the present application, based on the optimization function, the topology of the cooling medium flow channel in the cooling plate is optimized, which comprises: Obtain the temperature distribution and pressure drop of the cooling plate under the current topology parameters; Based on the temperature distribution and pressure drop of the cooling plate under the current topology parameters, determine the sensitivity coefficient under the current topology parameters; Based on the sensitivity coefficient, update the topology parameters, and perform density filtering on the updated topology parameters; Project the density filtered topology parameters through the hyperbolic tangent function to obtain the topology optimized cooling medium flow channel.

[0007] The cooling plate topology optimization method provided by the application further comprises: In a case where a temperature difference between a first temperature value of the target temperature point of the cooling plate after current topology optimization and a second temperature value of the target temperature point of the cooling plate after last topology optimization converges, it is determined that the topology optimization is ended.

[0008] The cooling plate topology optimization method provided by the application further comprises: A three-dimensional simulation cooling plate corresponding to the cooling medium flow channel after current topology optimization is constructed. The three-dimensional simulation cooling plate is verified by three-dimensional simulation. In a case where a pressure drop of the simulation cooling medium in the three-dimensional simulation cooling plate is within a preset range and a temperature peak value of the three-dimensional simulation cooling plate does not exceed a preset temperature threshold in a three-dimensional simulation verification result, it is determined that the topology optimization is successful.

[0009] The cooling plate topology optimization method provided by the application further comprises: In a case where a temperature difference between a first temperature value of the target temperature point of the cooling plate after current topology optimization and a second temperature value of the target temperature point of the cooling plate after last topology optimization does not converge, the step of obtaining the temperature distribution and the pressure drop of the cooling plate under the current topology parameter is returned to continue to execute.

[0010] The application further provides a cooling method, comprising the following steps: The flow path of the cooling medium is adjusted through the cooling medium flow channel in the cooling plate at the device to be cooled, and the pressure drop of the cooling plate is controlled within a preset range, so that the temperature peak value of the device to be cooled does not exceed a preset temperature threshold. The topology structure of the cooling medium flow channel of the cooling plate is obtained based on any one of the cooling plate topology optimization methods.

[0011] The application further provides a cooling plate topology optimization device, comprising: A first cooling plate topology optimization module is configured to minimize the temperature value of the target temperature point of the cooling plate as an optimization target, and the pressure drop of the cooling medium in the cooling plate does not exceed the lift of the cooling water pump as a constraint condition, and an optimization function related to the topology parameter of the cooling medium flow channel in the cooling plate is constructed; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate. A second cooling plate topology optimization module is configured to perform topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function.

[0012] The application further provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor implements the cooling plate topology optimization method or the cooling method according to any one of the above when executing the program.

[0013] The application further provides a non-transitory computer-readable storage medium having a computer program stored thereon, wherein the computer program is executed by a processor to implement the cooling plate topology optimization method or the cooling method according to any one of the above.

[0014] The application further provides a computer program product comprising a computer program, wherein the computer program is executed by a processor to implement the cooling plate topology optimization method or the cooling method according to any one of the above.

[0015] The cooling plate topology optimization method, the cooling method, and the device provided by the application minimize the temperature value of the target temperature point of the cooling plate as an optimization target, and the pressure drop of the cooling medium in the cooling plate does not exceed the head of the cooling water pump as a constraint condition, so as to construct an optimization function related to the topology parameters of the cooling medium flow channel in the cooling plate, and then perform topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function. The topology-optimized cooling medium flow channel is more reasonable, can better adapt to the heat source distribution characteristics of the equipment, realizes efficient flow of the cooling medium and uniform heat transfer, and reduces the generation of local overheating points. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0017] Figure 1 is a flowchart of the cooling plate topology optimization method provided by the application.

[0018] Figure 2 is a scene diagram of the cooling plate topology optimization method provided by the application.

[0019] Figure 3 is a structural diagram of the cooling plate topology optimization device provided by the application.

[0020] Figure 4 is a structural diagram of the electronic device provided by the application. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0022] It should be noted that, in the description of the present invention, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. The orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the system or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0023] The terms "first," "second," and so forth, used herein are used to distinguish similar objects, not to describe a specific order or precedence. It should be understood that such terms are interchangeable where appropriate, allowing embodiments of the present invention to be implemented in an order other than that illustrated or described herein. Furthermore, the terms "first," "second," and so forth generally distinguish objects of a single type, and do not limit the number of objects. For example, the first object may be one or more. Furthermore, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the connected objects.

[0024] The following combination Figures 1-4 The present invention describes a cooling plate topology optimization method and device.

[0025] The cooling plate topology optimization method according to the embodiment of the present invention is as follows: Figure 1 As shown, it includes step 110 and step 120.

[0026] Step 110 , with minimizing the temperature value of the target temperature point of the cooling plate as the optimization goal and the pressure drop of the cooling medium in the cooling plate not exceeding the head of the cooling water pump as the constraint condition, construct an optimization function related to the topological parameters of the cooling medium flow channel in the cooling plate.

[0027] Here, the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate.

[0028] It should be understood that, due to the heat generation of the heat source and the cooling effect of the cooling medium, there will be temperature differences in different regions on the surface or inside the cooling plate. Therefore, in this embodiment, the point or region with the highest temperature value in the temperature distribution of the cooling plate is taken as the optimization object, and the temperature value of the point or region with the highest temperature value in the temperature distribution of the cooling plate is minimized as the optimization target, to perform the topology optimization of the cooling plate.

[0029] Here, the pressure drop of the cooling medium in the cooling plate refers to the pressure difference between the inlet and outlet of the cooling medium in the cooling plate. The cooling water pump head refers to the maximum pressure head that the water pump can provide, that is, the maximum height that the water pump can lift the cooling medium, or the maximum resistance that the water pump can overcome.

[0030] It should be understood that the cooling water pump head is an important parameter of the water pump performance, which determines whether the water pump can provide sufficient pressure for the cooling system to ensure that the cooling medium can be effectively circulated in the system. Therefore, in this embodiment, when performing the topology optimization of the cooling plate, the influence of the cooling medium flow channel design on the pressure drop is also considered to ensure that the optimized cooling medium flow channel can achieve effective cooling without exceeding the cooling water pump head.

[0031] It should be noted that the topology parameters of the cooling medium flow channel refer to the design variables that affect the distribution of the cooling medium flow channel. These variables define the existence and distribution of the cooling medium flow channel in the design space, and are key parameters in topology optimization.

[0032] Specifically, after determining the optimization target and the constraint condition, an optimization function related to the topology parameters of the cooling medium flow channel in the cooling plate is constructed, which takes the minimization of the temperature value of the target temperature point as the optimization target, and adds the constraint condition that the pressure drop of the cooling medium does not exceed the cooling water pump head to the optimization function.

[0033] Step 120, topology optimization of the cooling medium flow channel in the cooling plate based on the optimization function.

[0034] After the optimization function is constructed, the topology optimization is performed using the constructed optimization function.

[0035] In actual application, before performing the topology optimization, the initial values of the topology parameters of the cooling medium flow channel are set, which are usually the assumption of uniform distribution of the cooling medium flow channel in the design space. Then the optimization function is solved until the optimal solution that meets all requirements is found, and the three-dimensional topology structure of the cooling medium flow channel in the topology-optimized cooling plate is obtained.

[0036] Referring to Figure 2 ,Figure 2 A three-dimensional topological structure of the cooling medium flow channel in the topologically optimized cooling plate is shown, and in the specific design, the preliminary distribution structure of the main flow channel and the core flow channel is determined.

[0037] In addition, an extension section can also be arranged at the inlet and outlet areas of the cooling plate, which can be designed as an integer multiple of the fin size in terms of structural size to ensure continuous transition with the pin rib structure of the main flow channel and facilitate the use of a modular manufacturing process.

[0038] Further, the extension section is divided into 3-4 groups of main flow channels and multiple small straight flows. The main flow channel serves as the main transport channel for the cooling medium and is arranged in a streamline shape according to the main flow direction of the cooling plate to ensure that most of the flow quickly enters the core area of the plate body. The small flow channels are evenly distributed between the main flow channels and are used to compensate for the insufficient cooling coverage in the edge and corner areas due to high flow resistance in conventional designs. In this way, the "main-branch" composite flow channel structure not only improves the universality and coverage of the flow, but also enhances the heat exchange capacity by the disturbance flow formed by the small flow channels to strengthen the boundary layer destruction.

[0039] The cooling plate topology optimization method of the embodiment minimizes the temperature value of the target temperature point of the cooling plate as the optimization target, the pressure drop of the cooling medium in the cooling plate does not exceed the head of the cooling water pump as the constraint condition, constructs an optimization function related to the topology parameters of the cooling medium flow channel in the cooling plate, and thus based on the optimization function, the cooling medium flow channel in the cooling plate is topologically optimized. The cooling medium flow channel after topology optimization is more reasonable, can better adapt to the heat source distribution characteristics of the equipment, realize efficient flow of the cooling medium and uniform heat transfer, and thus reduce the generation of local overheating points.

[0040] It should be noted that each embodiment of the present application can be freely combined, the order can be changed or executed alone, and does not need to rely on or depend on a fixed execution order.

[0041] In some embodiments, based on the optimization function, the cooling medium flow channel in the cooling plate is topologically optimized, comprising: obtaining the temperature distribution and pressure drop of the cooling plate under the current topology parameters; determining the sensitivity coefficient under the current topology parameters based on the temperature distribution and pressure drop of the cooling plate under the current topology parameters; updating the topology parameters based on the sensitivity coefficient, and performing density filtering on the updated topology parameters; projecting the density filtered topology parameters through a hyperbolic tangent function to obtain the topologically optimized cooling medium flow channel.

[0042] First, the temperature distribution and pressure drop of the cooling plate under the current topology parameters are obtained through forward calculation.

[0043] In practical applications, the heat conduction equation of the cooling plate can be solved under the current topology parameter by using finite element or finite volume method to obtain the temperature distribution of the cooling plate under the current topology parameter.

[0044] It should be understood that the heat conduction positive solution equation refers to a mathematical equation describing the heat conduction phenomenon of the cooling plate, i.e. the heat conduction equation. This equation is used to simulate and analyze the process of heat transfer within the cooling plate or between objects. The heat conduction equation used in this embodiment is consistent with the prior art, and will not be described in detail here.

[0045] By discretizing the continuous heat conduction equation into a set of algebraic equations using finite element method or finite volume method under the given topology parameter, the temperature distribution of the cooling plate under the current topology parameter can be solved.

[0046] Similarly, in practical applications, the fluid dynamics equation of the cooling plate can be solved under the current topology parameter by using finite element or finite volume method to obtain the pressure drop of the cooling plate under the current topology parameter. Here, the fluid dynamics equation usually includes continuity equation and momentum equation. These equations describe the flow characteristics of the fluid, including velocity, pressure and density, etc. The fluid dynamics equation used in this embodiment is consistent with the prior art, and will not be described in detail here.

[0047] Then, based on the temperature distribution and pressure drop of the cooling plate under the current topology parameter, the sensitivity coefficient under the current topology parameter is determined through adjoint sensitivity analysis.

[0048] Specifically, the original optimization function and constraint condition are combined into a Lagrange function, and the influence of the constraint condition is represented by introducing a Lagrange multiplier (or called adjoint variable) to construct an adjoint function. Then the adjoint equation under the current topology parameter is solved to obtain the value of the Lagrange multiplier, i.e. the sensitivity coefficient.

[0049] Further, after obtaining the sensitivity coefficient, the topology parameter is updated using an optimization algorithm, such as GCMMA (Generalized Conjugate Method for Moving Asymptotes) method, according to the sensitivity coefficient.

[0050] Then, the updated topology parameter is subjected to density filtering. It should be understood that density filtering is a technique for processing topology optimization results, aiming to improve the continuity and manufacturability of the parameter variable.

[0051] In practical applications, the updated topological parameters can be subjected to density filtering through the Helmholtz equation. For example, a filter is defined according to the Helmholtz equation, the filter is applied to the updated topological parameters, and the filter equation is solved using a numerical method (such as the finite element method or the finite difference method), so that the topological parameters subjected to density filtering are obtained.

[0052] Finally, the topological parameters subjected to density filtering are projected through a hyperbolic tangent function to enhance the contrast of the design variables and make the topological structure of the cooling medium flow channel clearer and more intuitive.

[0053] In some embodiments, the method further comprises: In a case where a temperature difference between a first temperature value of the target temperature point of the cooling plate after the current topological optimization and a second temperature value of the target temperature point of the cooling plate after the last topological optimization converges, it is determined that the topological optimization is completed.

[0054] In a case where the temperature difference between the first temperature value of the target temperature point of the cooling plate after the current topological optimization and the second temperature value of the target temperature point of the cooling plate after the last topological optimization does not converge, the step of obtaining the temperature distribution and the pressure drop of the cooling plate under the current topological parameters is returned to be executed continuously.

[0055] In the topological optimization process, it is usually determined whether the optimization is completed depending on a convergence criterion. The convergence criterion is a standard for determining whether an optimization function has reached a state close enough to an optimal solution, so that iteration can be stopped.

[0056] In the present embodiment, the temperature difference between the two topological optimizations is used as a condition for determining whether the topological optimization is completed. Specifically, after each iteration, the temperature difference between the target temperature points of the current iteration and the last iteration is calculated. If the calculated temperature difference is stable within a very small range, it indicates that the further optimization has a very limited effect on the target temperature point, and the temperature difference between the target temperature points of the current iteration and the last iteration has converged, so it is determined that the topological optimization is completed. Otherwise, the step of obtaining the temperature distribution and the pressure drop of the cooling plate under the current topological parameters is returned to be executed continuously, and the next iteration is executed.

[0057] In some embodiments, the method further comprises: constructing a three-dimensional simulation cooling plate corresponding to the cooling medium flow channel after the current topological optimization; performing three-dimensional simulation verification on the three-dimensional simulation cooling plate; in a case where the three-dimensional simulation verification result is that the pressure drop of the simulated cooling medium in the three-dimensional simulation cooling plate is within a preset range, and the temperature peak of the three-dimensional simulation cooling plate does not exceed a preset temperature threshold, it is determined that the topological optimization is successful.

[0058] In this embodiment, after determining that the topology optimization is completed, the two-dimensional topology parameters obtained by the topology optimization are converted into a three-dimensional model to perform more realistic physical simulation.

[0059] In actual applications, a CAD software can be used to construct a three-dimensional simulation cooling plate according to the optimized topology parameters. Then, it is verified whether the performance of the three-dimensional simulation cooling plate meets the design requirements, including pressure drop and temperature distribution. If the simulation result shows that the pressure drop is within the preset range and the temperature peak does not exceed the preset temperature threshold, it is determined that the topology optimization is successful.

[0060] The cooling plate topology optimization method of this embodiment can more accurately evaluate the performance of the design and ensure that the design meets the needs of actual applications through three-dimensional simulation verification.

[0061] Further, the embodiment of the present application also provides a cooling method, comprising the following steps: The flow path of the cooling medium is adjusted through the cooling medium flow channel in the cooling plate at the cooling device, and the pressure drop of the cooling plate is controlled within a preset range, so that the temperature peak of the cooling device does not exceed the preset temperature threshold.

[0062] In this embodiment, by adjusting the flow path of the cooling medium at the cooling position of the cooling device through the cooling medium flow channel in the cooling plate at the cooling position of the cooling device, the heat transfer efficiency of the cooling medium is improved and the cooling flow field is uniformly distributed, thereby effectively suppressing the local overheating phenomenon of the cooling device, and the temperature peak of the surface of the device is controlled within the set safety range.

[0063] Specifically, the topology structure of the cooling medium flow channel of the cooling plate is obtained based on the cooling plate topology optimization method described above, and will not be described in detail here.

[0064] The cooling method of this embodiment can better adapt to the heat source distribution characteristics of the device through the cooling medium flow channel designed by the above cooling plate topology optimization method, realize efficient flow of the cooling medium and uniform heat transfer, and thereby reduce the generation of local overheating points.

[0065] The cooling plate topology optimization device provided by the present application will be described below. The cooling plate topology optimization device described below can be correspondingly referred to the cooling plate topology optimization method described above.

[0066] The cooling plate topology optimization device of the embodiment of the present application, as shown in Figure 3 includes the following modules: a first cooling plate topology optimization module 310 and a second cooling plate topology optimization module 320.

[0067] The first cooling plate topology optimization module 310 is configured to: take minimizing a temperature value of a target temperature point of a cooling plate as an optimization target, take a pressure drop of a cooling medium in the cooling plate not exceeding a lift of a cooling water pump as a constraint condition, and construct an optimization function related to a topology parameter of a cooling medium flow channel in the cooling plate; and the target temperature point of the cooling plate is a highest temperature point in a temperature distribution of the cooling plate. The second cooling plate topology optimization module 320 is configured to perform topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function.

[0068] The cooling plate topology optimization device provided in the embodiment takes minimizing a temperature value of a target temperature point of a cooling plate as an optimization target, takes a pressure drop of a cooling medium in the cooling plate not exceeding a lift of a cooling water pump as a constraint condition, and constructs an optimization function related to a topology parameter of a cooling medium flow channel in the cooling plate, so as to perform topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function. The cooling medium flow channel after the topology optimization is more reasonable, can better adapt to a heat source distribution feature of a device, and can realize efficient flow of the cooling medium and uniform heat transfer, thereby reducing generation of local overheating points.

[0069] Figure 4 An example of a schematic diagram of a physical structure of an electronic device is shown in FIG. 1. Figure 4 As shown in FIG. 1, the electronic device can include a processor 410, a communications interface 420, a memory 430, and a communications bus 440, wherein the processor 410, the communications interface 420, and the memory 430 can complete mutual communication through the communications bus 440. The processor 410 can invoke a logical instruction in the memory 430 to execute a cooling plate topology optimization method, and the method includes: taking minimizing a temperature value of a target temperature point of a cooling plate as an optimization target, taking a pressure drop of a cooling medium in the cooling plate not exceeding a lift of a cooling water pump as a constraint condition, and constructing an optimization function related to a topology parameter of a cooling medium flow channel in the cooling plate; and the target temperature point of the cooling plate is a highest temperature point in a temperature distribution of the cooling plate. performing topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function.

[0070] The processor 410 can also invoke a logical instruction in the memory 430 to execute a cooling method, and the method includes: adjusting a flow path of the cooling medium through the cooling medium flow channel in the cooling plate at a device to be cooled, and controlling a pressure drop of the cooling plate in a preset range, so that a temperature peak of the device to be cooled does not exceed a preset temperature threshold. The topology of the cooling medium flow channel of the cooling plate is obtained based on the cooling plate topology optimization method described above.

[0071] In addition, the logical instructions in the memory 430 described above can be implemented in the form of a software function unit and sold or used as an independent product, and can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the parts that contribute to the prior art or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and each kind of medium that can store program codes.

[0072] On the other hand, the present application also provides a computer program product, which comprises a computer program, the computer program can be stored on a non-transitory computer readable storage medium, and the computer program can be executed by a processor, so that the computer can execute the cooling plate topology optimization method provided by each of the above methods. The method comprises: The optimization function related to the topology parameters of the cooling medium flow channel in the cooling plate is constructed, with the temperature value of the target temperature point of the cooling plate being minimized as the optimization objective, and the pressure drop of the cooling medium in the cooling plate being not more than the lift of the cooling water pump as the constraint condition. The target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate. The topology of the cooling medium flow channel in the cooling plate is optimized based on the optimization function.

[0073] The computer program can be executed by a processor, so that the computer can also execute the cooling method provided by each of the above methods. The method comprises: The flow path of the cooling medium is adjusted through the cooling medium flow channel in the cooling plate at the device to be cooled, and the pressure drop of the cooling plate is controlled within a preset range, so that the temperature peak of the device to be cooled does not exceed a preset temperature threshold. The topology of the cooling medium flow channel of the cooling plate is obtained based on the cooling plate topology optimization method described above.

[0074] In another aspect, the present application also provides a non-transitory computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the cooling plate topology optimization method provided by each of the above methods. The method comprises: An optimization function related to the topological parameters of the cooling medium flow channel in the cooling plate is constructed, with the temperature value of the target temperature point of the cooling plate as the optimization target, and the pressure drop of the cooling medium in the cooling plate not exceeding the lift of the cooling water pump as the constraint condition; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate; The topological optimization of the cooling medium flow channel in the cooling plate is performed based on the optimization function.

[0075] Wherein, the computer program is further executed by the processor to implement the execution of the cooling method provided by each of the above methods, and the method comprises: The flow path of the cooling medium is adjusted through the cooling medium flow channel in the cooling plate at the device to be cooled, and the pressure drop of the cooling plate is controlled within a preset range, so that the temperature peak of the device to be cooled does not exceed a preset temperature threshold; Wherein, the topological structure of the cooling medium flow channel of the cooling plate is obtained based on the cooling plate topological optimization method described above.

[0076] The device embodiments described above are only schematic, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e. they can be located in one place, or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs. Those skilled in the art can understand and implement without creative labor.

[0077] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be realized by means of software plus the necessary general hardware platform, and of course, it can also be realized by hardware. Based on such understanding, the above technical solutions can be embodied in the form of software products, which can be stored in a computer readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including a plurality of instructions to make a computer device (which can be a personal computer, server, or network device, etc.) execute the method described in each embodiment or some parts of the embodiment.

[0078] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in each of the foregoing embodiments, or make equivalent replacement for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of each embodiment of the present application.

Claims

1. A cooling plate topology optimization method, characterized in that: include: An optimization function related to the topological parameters of the cooling medium flow channel in the cooling plate is constructed with minimizing the temperature value of the target temperature point of the cooling plate as the optimization objective and the pressure drop of the cooling medium in the cooling plate not exceeding the head of the cooling water pump as the constraint condition; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate; Based on the optimization function, topology optimization is performed on the cooling medium flow channel in the cooling plate.

2. The cooling plate topology optimization method according to claim 1, characterized in that: Based on the optimization function, topology optimization is performed on the cooling medium flow channel in the cooling plate, including: Obtaining the temperature distribution and pressure drop of the cooling plate under current topology parameters; determining a sensitivity coefficient under the current topology parameters based on the temperature distribution and pressure drop of the cooling plate under the current topology parameters; Based on the sensitivity coefficient, updating the topology parameters, and performing density filtering on the updated topology parameters; The topological parameters after density filtering are projected using the hyperbolic tangent function to obtain the cooling medium flow channel after topology optimization.

3. The cooling plate topology optimization method according to claim 2, characterized in that: Also includes: When the temperature difference between the first temperature value of the target temperature point of the cooling plate after the current topology optimization and the second temperature value of the target temperature point of the cooling plate after the previous topology optimization converges, it is determined that the topology optimization is terminated.

4. The cooling plate topology optimization method according to claim 3, characterized in that: Also includes: Construct a three-dimensional simulation cooling plate corresponding to the cooling medium flow channel after the current topology optimization; Performing three-dimensional simulation verification on the three-dimensional simulated cooling plate; The three-dimensional simulation verification result shows that the pressure drop of the simulated cooling medium in the three-dimensional simulated cooling plate is within a preset range, and the temperature peak of the three-dimensional simulated cooling plate does not exceed the preset temperature threshold, and the topology optimization is determined to be successful.

5. The cooling plate topology optimization method according to claim 2, characterized in that: Also includes: If the temperature difference between the first temperature value of the target temperature point of the cooling plate after the current topology optimization and the second temperature value of the target temperature point of the cooling plate after the previous topology optimization has not converged, return to continue executing the step of obtaining the temperature distribution and pressure drop of the cooling plate under the current topology parameters.

6. A cooling method, characterized in that: include: Adjusting the flow path of the cooling medium through the cooling medium flow channel in the cooling plate at the device to be cooled, and controlling the pressure drop of the cooling plate within a preset range so that the temperature peak of the device to be cooled does not exceed a preset temperature threshold; Wherein, the topological structure of the cooling medium flow channel of the cooling plate is obtained based on the cooling plate topology optimization method according to any one of claims 1 to 5.

7. A cooling plate topology optimization device, characterized in that: include: A first cooling plate topology optimization module is configured to construct an optimization function related to the topological parameters of the cooling medium flow channel in the cooling plate, with minimizing the temperature value of a target temperature point of the cooling plate as an optimization objective and the pressure drop of the cooling medium in the cooling plate not exceeding the head of the cooling water pump as a constraint; the target temperature point of the cooling plate is the highest temperature point in the temperature distribution of the cooling plate; The second cooling plate topology optimization module is configured to perform topology optimization on the cooling medium flow channel in the cooling plate based on the optimization function.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that: When the processor executes the computer program, the cooling plate topology optimization method according to any one of claims 1 to 5 or the cooling method according to claim 6 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the cooling plate topology optimization method according to any one of claims 1 to 5 or the cooling method according to claim 6 is implemented.

10. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the cooling plate topology optimization method according to any one of claims 1 to 5 or the cooling method according to claim 6 is implemented.

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