Powder semiconductor material resistor and processing method thereof
The powder semiconductor material resistor processing device and method solves the problem of difficulty in compacting the wire and powder raw materials into shape at one time, achieves stable combination of the wire and powder semiconductor material and improves the mechanical strength, and ensures the stability of the resistor in long-term use.
Patent Information
- Application Number
- CN202511020482.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-24
- Publication Date
- 2025-10-17
AI Technical Summary
In the manufacturing process of traditional powder semiconductor resistors, the connection between the wire and the resistor body is difficult to achieve one-time compaction and molding, resulting in unstable contact resistance and insufficient mechanical strength. During long-term use, the connection may fail due to vibration or thermal stress.
A powder semiconductor material resistor processing device is used to compact the wire and powder raw materials at one time through a module and die groove structure. Combined with a hydraulic system and vibration cutting technology, the wire and powder raw materials are stably combined, and the resistor thickness is trimmed through scraping and grinding processes.
A stable combination of the wire and the powdered semiconductor material is achieved, the mechanical strength of the resistor and the stability of the contact resistance are improved, and connection failure due to vibration or thermal stress is avoided.
Smart Images
Figure CN120809405A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to high-precision resistor devices, and more particularly to a powder semiconductor material resistor and a processing method thereof. BACKGROUND
[0002] In the manufacturing process of a conventional powder semiconductor resistor, the connection between the wire and the resistor body usually relies on post-processing steps such as welding or crimping, and it is difficult to realize one-time compaction molding of the wire and the powder raw material. The current mainstream process needs to first press and sinter the powder raw material, and then connect the wire through welding or mechanical crimping. This step-by-step operation is prone to form unstable contact resistance and insufficient mechanical strength at the interface between the wire and the resistor body, and the connection may fail due to vibration or thermal stress in long-term use. The existing technology has bottlenecks in the integrated molding of the wire and the powder raw material. SUMMARY
[0003] In order to overcome the shortcomings of the prior art, the present application provides a powder semiconductor material resistor and a processing method thereof, which has the beneficial effect that the wire and the powder raw material can be one-time compacted into a powder semiconductor blank.
[0004] A powder semiconductor material resistor processing device comprises two modules arranged in front and back, a mold groove is arranged between the two modules, two protrusions are fixed on each side of each module, two protrusions on the same side are slidingly connected to a guide rod, a baffle is fixed on both ends of the guide rod, a compression spring is sleeved on both ends of the guide rod, the compression spring is located between the corresponding protrusion and the baffle, and a wire groove is arranged on the left and right parts of the opposite surfaces of the two modules.
[0005] A baffle is arranged on the left and right ends of the upper side of each module, the baffles are located on both sides of the mold groove, tracks are arranged on the left and right ends of the upper side of the flat plate, and each module is slidingly connected to the two tracks in the front and back directions.
[0006] Supporting legs are fixed at the four corners of the lower side of the flat plate, a circular rod is fixed on each of the two protrusions on the same side, an L-shaped frame is fixed on the lower side of the flat plate, a lifting column is slidingly connected to the L-shaped frame in the vertical direction, the lifting column is driven to lift by a hydraulic cylinder, two V-shaped rods are fixed on the lifting column, one of the V-shaped rods is arranged above the two circular rods, and the other V-shaped rod is arranged below the two circular rods.
[0007] A powder semiconductor material resistor processing method comprises the following steps: S1: preparing zinc oxide powder and glass binder; S2: pouring the zinc oxide powder and the glass binder into the mold groove between the two modules; S3: closing the upper part of the mold groove by the pressing plate; S4: lifting and pressing the mold groove by the movable plate; S5: trimming the pressed blank body to the required thickness by the pressing plate; S6: sintering the blank body to form the powder semiconductor material resistor.
[0008] A powder semiconductor material resistor formed by sintering zinc oxide powder and glass binder. BRIEF DESCRIPTION OF DRAWINGS
[0009] The application will be further described in detail below in combination with the drawings and specific implementation methods.
[0010] Figure 1 Structure diagram of a powder semiconductor material resistor processing device Figure 1 ; Figure 2 Structure diagram of a powder semiconductor material resistor processing device Figure 2 ; Figure 3 Structure diagram of a powder semiconductor material resistor processing device Figure 3 ; Figure 4 Structure diagram of a flat plate Figure 1 ; Figure 5 Structure diagram of a flat plate Figure 2 ; Figure 6 Structure diagram of a module Figure 1 ; Figure 7 Structure diagram of a module Figure 2 ; Figure 8 Structure diagram of a top rod Figure 9 Structure diagram of a pressing plate Figure 1 ; Figure 10 Structure diagram of a pressing plate Figure 2 .
[0011] In the figure: flat plate 101; track 102; movable plate 103; support leg 104; L-shaped frame 105; lifting column 106; V-shaped rod 107; square column 108; door-shaped frame 109; Module 201; stop rib 202; wire groove 203; protruding block 204; round rod 205; guide rod 206; stop sheet 207; mold groove 208; Top rod 301; screw rod 302; motor 303; electric pressing rod 304; side frame 305; linear vibration motor 306; side sheet 307; Pressing plate 401; missing slot 402; scraping blade 403; hollow rod 404; solid rod 405; sliding pin 406; strip-shaped slot 407; stop block 408. DETAILED DESCRIPTION
[0012] As Figures 6-7 shown; Since the powder semiconductor material resistor processing device comprises the modules 201, two modules 201 are arranged in front and back, a mold groove 208 is arranged between the two modules 201, and protrusions 204 are welded on both sides of each module 201. The two protrusions 204 on the same side are slidingly connected to a guide rod 206, and the two ends of the guide rod 206 are connected to a stop sheet 207 through a bolt. The two ends of the guide rod 206 are sleeved with a compression spring, and the compression spring is located between the corresponding protrusion 204 and the stop sheet 207. The left and right parts of the opposite faces of the two modules 201 are provided with wire grooves 203. When the resistor is made, the powder semiconductor material is placed in the mold groove 208, and then two wires are inserted into the two wire grooves 203, respectively. The opposite ends of the two wires are inserted into the powder semiconductor material, and then the powder semiconductor material in the mold groove 208 is compacted. In this way, the wire and the powder semiconductor material can be compacted into a powder semiconductor blank at one time, so that the combination between the wire and the powder semiconductor material is stable. The current enters the powder semiconductor material from one wire, and then the current comes out from the other wire, thereby realizing the effect of resistance. The two compression springs on the same side respectively give the two protrusions 204 a force of approaching each other, so that the two protrusions 204 and the two modules 201 always have a tendency to approach each other. When the compacted powder semiconductor blank needs to be taken out, the two modules 201 are separated by overcoming the elastic force of the compression spring. At this time, the powder semiconductor blank in the mold groove 208 can be conveniently taken out.
[0013] As Figures 4-7 shown; Since the left and right ends of the upper side of each module 201 are provided with stop edges 202, the stop edges 202 are located on both sides of the mold groove 208, and the left and right ends of the upper side of the flat plate 101 are provided with rails 102. Each module 201 is slidingly connected to the two rails 102 in the front and back directions. The plurality of stop sheets 207 are fixed on the flat plate 101. The two modules 201 can slide on the two rails 102 on the flat plate 101 in the front and back directions, thereby conveniently and stably approaching and moving away from each other. The two modules 201 are prevented from deforming after being separated and closed. The powder raw material needs to be introduced into the mold groove 208 from the upper side of the two modules 201. The two stop edges 202 on the upper side of the module 201 prevent the area of the powder raw material from being too large when the powder raw material is poured on the upper side of the module 201, thereby facilitating the cleaning of the upper side of the module 201.
[0014] As Figures 4-7 shown; Since the lower side of the flat plate 101 is bolted with support legs 104 at four corners, the same side of two protrusions 204 are welded with round rods 205, the lower side of the flat plate 101 is fixed with L-shaped frames 105, the L-shaped frames 105 are vertically slidably connected with lifting columns 106, the lifting columns 106 are driven to lift by hydraulic cylinders, the lifting columns 106 are fixed with two V-shaped rods 107, one of which is arranged above the two round rods 205, and the other is arranged below the two round rods 205, the lifting columns 106 can be driven to lift on the L-shaped frames 105, and in turn drive the two V-shaped rods 107 to lift, when the two V-shaped rods 107 are lowered, the lower side of the V-shaped rod 107 on the upper side is pressed to the two round rods 205, so that the two round rods 205 are close to each other, and in turn the two protrusions 204 and the two modules 201 are pressed tightly together; when the two V-shaped rods 107 are lifted, the upper side of the V-shaped rod 107 on the lower side is inserted between the two round rods 205, so that the two round rods 205 are separated from each other, and in turn the two modules 201 are tightly pressed together, or the two modules 201 are separated, and the pressed blank is conveniently taken out.
[0015] As Figures 4-5 shown; Since the center gap of the flat plate 101 is matched with the movable plate 103, the lower side of the movable plate 103 is welded with two square columns 108, the lower side of the flat plate 101 is bolted with door-shaped frames 109, the two square columns 108 are vertically slidably connected with the door-shaped frames 109, the two square columns 108 are driven to lift by hydraulic cylinders, the movable plate 103 is located below the mold groove 208, after the powder raw material is poured into the mold groove 208, the upper side of the mold groove 208 is closed, then the two square columns 108 and the movable plate 103 are driven to slide upward, so that the movable plate 103 is pressed into the mold groove 208, and in turn the powder raw material in the mold groove 208 is compacted to form a powder semiconductor material resistor blank.
[0016] As Figures 6-7 and 9-10 shown; Due to the upper part of the two modules 201 is provided with a pressing plate 401, one side of the pressing plate 401 is provided with a scraping blade 403, the scraping blade 403 is uniformly provided with a plurality of missing grooves 402 from left to right, and the lower side of the pressing plate 401 is provided with a rough surface. The function of the pressing plate 401 is to press on the upper side of the mold groove 208, and the upper side of the mold groove 208 is closed, at this time the movable plate 103 can be pressed into the mold groove 208 to compact the powder raw material in the mold groove 208; when the powder raw material is compacted, the pressing plate 401 is removed, so that the two modules 201 are separated by a gap, which facilitates the lifting of the lead wire in the gap, and then the movable plate 103 is continuously lifted, at this time the compacted blank can be pushed out upward, if the amount of powder raw material put in is large, which causes the thickness of the blank to be not correct, the upper side of the blank can be scraped off a layer by the scraping blade 403 on the pressing plate 401, the blank is pushed out upward relative to the module 201, so that the thickness of the blank protruding from the upper side of the module 201 is the thickness that needs to be scraped off, and then the scraping blade 403 is abutted on the upper side of the module 201 to scrape, so that the blank is trimmed to the required thickness. The scraping blade 403 is uniformly provided with a plurality of missing grooves 402 from left to right, so that the scraping blade 403 becomes serrated, which is more easy to scrape off a layer of blank; after scraping is completed, the upper side of the blank is polished flat by the rough surface on the lower side of the pressing plate 401. In the case of a certain amount of powder raw material, the thickness of the blank determines the size of the resistance.
[0017] Further, a piezoelectric ceramic transducer is installed at the root of the scraping blade 403 to generate high-frequency vibration of 20-40 kHz. The adhesion between the blank and the scraping blade is destroyed, which is especially suitable for high-viscosity glass adhesive systems; vibration cutting makes the debris in the form of powder, avoiding the traditional scraping of strip-shaped debris blocking the missing groove.
[0018] Further, micro-holes are opened on the edge of the pressing plate 401, connected with a micro vacuum pump, and the debris dust is adsorbed synchronously during scraping.
[0019] Further, the scraping blade and the pressing plate 401 are connected by a neodymium iron boron magnet, and a plurality of groups of different tooth-shaped scraping blades are preset, such as coarse teeth, fine teeth and arc teeth, which are replaced by a mechanical hand to adapt to different resistor surface process requirements, such as mirror polishing and anti-skid line processing.
[0020] As shown in Figures 9-10 ; and The upper side of the pressing plate 401 is provided with a hinge seat, the lower end of the hollow rod 404 is hinged on the hinge seat, the upper side of the pressing plate 401 is fixed with two stoppers 408, the two stoppers 408 are respectively located on the two sides of the hollow rod 404, the pressing plate 401 can rotate at the lower end of the hollow rod 404 through the hinge seat, when one of the stoppers 408 is in contact with the hollow rod 404, the pressing plate 401 is in a horizontal state, at this time, it is convenient for the pressing plate 401 to press on the upper side of the mold groove 208, when the other stopper 408 is in contact with the hollow rod 404, the pressing plate 401 is in an inclined state, at this time, it is convenient for the blank to be scraped into the required thickness through the scraping blade 403.
[0021] As shown in Figures 9-10 ; The upper side of the pressing plate 401 is provided with a strip-shaped groove 407, the hollow rod 404 is fixed with a hydraulic cylinder, the end of the hydraulic cylinder is fixed with a sliding pin 406, the sliding pin 406 is inserted on the strip-shaped groove 407, the hollow rod 404 is vertically and slidingly connected with a solid rod 405, the hollow rod 404 and the solid rod 405 are driven to slide through the hydraulic cylinder, the hollow rod 404 can slide up and down on the solid rod 405, thereby controlling the pressing plate 401 to press down or lift up, when the sliding pin 406 is driven to rise and fall, the sliding pin 406 slides on the strip-shaped groove 407, thereby driving the pressing plate 401 to rotate at the lower end of the hollow rod 404, thereby controlling the angle of the pressing plate 401, when the pressing plate 401 is in a horizontal state, it is convenient for the pressing plate 401 to press on the upper side of the mold groove 208, when the pressing plate 401 is inclined, it is convenient for the blank to be scraped into the required thickness through the scraping blade 403.
[0022] As shown in Figures 8-10 ; Because the front and back sides of the pressing plate 401 are fixed with the side frames 305, the front and back ends of the top rod 301 are respectively slidingly connected to the upper parts of the two side frames 305, the front and back ends of the top rod 301 are fixed with the side sheets 307, the upper part of the solid rod 405 is slidingly connected to the top rod 301, the front side sheet 307 is fixed with the motor 303, the output shaft of the motor 303 is fixed with the lead screw 302, the solid rod 405 is provided with a nut corresponding to the lead screw 302, the lead screw 302 is threadedly matched with the nut, the two side sheets 307 are respectively fixed with the linear vibration motors 306, the side sheets 307 are fixed with the compression springs, the compression springs are located between the side frames 305 and the side sheets 307, one of the side frames 305 is fixed with the electric pressing rod 304, the electric pressing rod 304 can press on the top rod 301, the motor 303 can drive the lead screw 302 to rotate, thereby driving the solid rod 405 to move forward and backward on the top rod 301, thereby driving the hollow rod 404 and the pressing plate 401 to move forward and backward, facilitating the driving of the pressing plate 401 to move forward and backward to scrape the blank; the electric pressing rod 304 normally presses on the top rod 301, at this time the top rod 301 is fixed on the two side frames 305, when it is needed to polish the upper side of the blank by the pressing plate 401, the pressing rod 304 is separated from the top rod 301, so that the top rod 301 can slide forward and backward on the two side frames 305, at this time the linear vibration motors 306 drive the top rod 301 to vibrate forward and backward, so that the top rod 301 rapidly moves forward and backward, the compression springs between the side frames 305 and the side sheets 307 help the top rod 301 to return to the original position, thereby driving the pressing plate 401 to rapidly move forward and backward, and thereby the pressing plate 401 polishes the scraped part on the upper side of the blank by the rough surface on the lower side.
[0023] Further, the electric pressing rod 304 is loosened, the linear vibration motor 306 drives the top rod 301 to vibrate at a frequency of 20-100 Hz, the amplitude is controlled by the compression spring stiffness (different elastic coefficient springs can be replaced), (0.1-2mm adjustable), to realize micro-impact polishing, suitable for nano-level surface polishing; Further, combined with the angle adjustment of the hollow rod 404, the compound motion of "inclined scraping + horizontal movement + vibration" can be realized, to process bevel resistors or stepped structures.
[0024] Further, an electrically conductive layer is plated on the lower surface of the pressing plate 401, an electrostatic generator is connected, positive charges are turned on before scraping to adsorb dust on the surface of the blank, negative charges are switched during polishing to enhance the holding force of the rough surface on the blank, to prevent the displacement of the blank during vibration, especially suitable for processing bare blanks without wire fixation.
[0025] A powder semiconductor material resistor processing method, comprising the following steps: S1: preparing zinc oxide powder and glass binder; S2: pouring the zinc oxide powder and the glass binder into the mold groove 208 between the two modules 201; S3: closing the upper part of the die 208 by the pressing plate 401; S4: lifting the pressing plate 401 by the movable plate 103; S5: trimming the pressed green body to the required thickness by the pressing plate 401; S6: sintering the green body to form the powder semiconductor material resistor.
[0026] A powder semiconductor material resistor formed by sintering zinc oxide powder and glass binder.
Claims
1. A powder semiconductor material resistor processing device, comprising a module (201), characterized in that: Two modules (201) are arranged front and back, and a mold groove (208) is provided between the two modules (201). A protrusion (204) is fixed on both sides of each module (201), and the two protrusions (204) on the same side are slidably connected to a guide rod (206). A baffle (207) is fixed at both ends of the guide rod (206). Compression springs are sleeved at both ends of the guide rod (206), and the compression springs are located between the corresponding protrusions (204) and the baffle (207). A wire groove (203) is provided on the left and right parts of the opposite surfaces of the two modules (201).
2. The device for processing a resistor made of a powdered semiconductor material according to claim 1, wherein: Each module (201) is provided with a blocking edge (202) at both ends of the upper side, and the blocking edge (202) is located on both sides of the mold groove (208). The left and right ends of the upper side of the flat plate (101) are provided with a track (102). Each module (201) is slidably connected to the two tracks (102) in the front-back direction, and a plurality of blocking pieces (207) are fixed on the flat plate (101).
3. The device for processing a resistor made of a powdered semiconductor material according to claim 2, wherein: Support legs (104) are fixed at the four corners of the lower side of the flat plate (101), and round rods (205) are fixed on the two protrusions (204) on the same side. An L-shaped frame (105) is fixed on the lower side of the flat plate (101), and a lifting column (106) is vertically slidably connected to the L-shaped frame (105). The lifting column (106) is driven to rise and fall by a hydraulic cylinder. Two upper and lower V-shaped rods (107) are fixed on the lifting column (106), one of the V-shaped rods (107) is arranged above the two round rods (205), and the other V-shaped rod (107) is arranged below the two round rods (205).
4. The device for processing a resistor made of a powdered semiconductor material according to claim 3, wherein: A movable plate (103) is inserted into the central gap of the flat plate (101), two square columns (108) are fixed on the lower side of the movable plate (103), a portal frame (109) is fixed on the lower side of the flat plate (101), the two square columns (108) are vertically slidably connected to the portal frame (109), the two square columns (108) are driven to rise and fall by a hydraulic cylinder, and the movable plate (103) is located below the die groove (208).
5. The device for processing a resistor made of a powdered semiconductor material according to claim 4, characterized in that: A pressing plate (401) is provided above the two modules (201), a scraping blade (403) is provided on one side of the pressing plate (401), a plurality of notches (402) are evenly distributed on the scraping blade (403) from left to right, and a rough surface is provided on the lower side of the pressing plate (401).
6. The device for processing a resistor made of a powdered semiconductor material according to claim 5, characterized in that: The upper side of the pressing plate (401) is provided with a hinge seat, the lower end of the hollow rod (404) is hinged on the hinge seat, and two stoppers (408) are fixed on the upper side of the pressing plate (401), and the two stoppers (408) are respectively located on both sides of the hollow rod (404).
7. The device for processing a resistor made of a powdered semiconductor material according to claim 6, characterized in that: A strip groove (407) is provided on the upper side of the pressing plate (401), a hydraulic cylinder is fixed on the hollow rod (404), a sliding pin (406) is fixed on the end of the hydraulic cylinder, the sliding pin (406) is inserted into the strip groove (407), a solid rod (405) is vertically slidably connected to the hollow rod (404), and the hollow rod (404) and the solid rod (405) are driven to slide by the hydraulic cylinder.
8. The device for processing a resistor made of a powdered semiconductor material according to claim 7, characterized in that: Side frames (305) are fixed to the front and rear sides of the pressure plate (401), the front and rear ends of the push rod (301) are respectively slidably connected to the upper parts of the two side frames (305), the front and rear ends of the push rod (301) are fixed to side pieces (307), the upper part of the solid rod (405) is slidably connected to the push rod (301), the motor (303) is fixed to the side piece (307) at the front, and the screw rod (302) is fixed to the output shaft of the motor (303). A nut corresponding to the screw rod (302) is provided on the solid rod (405), and the screw rod (302) and the nut are engaged with each other through a thread. A linear vibration motor (306) is fixed on each of the two side plates (307), and a compression spring is fixed on the side plate (307). The compression spring is located between the side frame (305) and the side plate (307). An electric pressure rod (304) is fixed on one of the side frames (305), and the electric pressure rod (304) can press on the top rod (301).
9. A method for processing a resistor made of powdered semiconductor material, characterized in that: The following steps are involved: S1: Prepare zinc oxide powder and glass binder; S2: Pour zinc oxide powder and glass binder into the mold cavity (208) between the two modules (201); S3: The upper portion of the die cavity (208) is closed by a pressing plate (401); S4: Lifting and pressing the movable plate (103) toward the die cavity (208); S5: trimming the pressed green body by the pressing plate (401) to a desired thickness; S6: Sintering the green body to form a powdered semiconductor material resistor.
10. A resistor made of powdered semiconductor material, characterized in that: The powder semiconductor material resistor is formed by sintering zinc oxide powder and glass binder.