Semiconductor processing equipment and method and storage medium
By using docking casters with zero rotational torque and a positioning laser system in semiconductor processing equipment, the problem of insufficient docking accuracy between the transmission cavity and the process cavity was solved, achieving high-precision cavity docking, avoiding rotational twisting, and improving docking accuracy.
Patent Information
- Application Number
- CN202510874944.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-26
- Publication Date
- 2025-10-17
AI Technical Summary
In the existing technology, during the docking process between the transfer cavity and the process cavity of semiconductor processing equipment, the docking accuracy is insufficient due to the manual pushing method and the rotation and twisting of the universal casters, making it difficult to achieve high-precision docking.
By employing docking casters with zero rotational torque and a positioning laser system, and using position data obtained through measurement, a moving device supported by spherical rollers is used to achieve precise docking between the process cavity and the transmission cavity.
This improves the accuracy of cavity docking, avoids the rotation and twisting of the universal casters, and ensures high precision and stability of cavity docking.
Smart Images
Figure CN120809609A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor device processing, and in particular, to a semiconductor processing device, a semiconductor processing method, and a computer readable storage medium. BACKGROUND
[0002] In the prior art, during the docking process of the transmission cavity and the process cavity, the transmission cavity is usually positioned first, and the process cavity is moved to the docking position by the attached casters under the power of manpower. The docking operation is completed by relying on visual observation of position information and through password command. However, since the positioning pin and the pin hole are located on the docking plane during the docking process, as the docking cooperation proceeds, the docking plane gradually becomes smaller until it disappears, resulting in a reduction in the visual observable position and space, and ultimately the final position information cannot be obtained, making it difficult to accurately describe the docking state. Therefore, this way of power driving is difficult to meet the size requirements of high-precision docking, resulting in a serious lack of docking precision. In addition, the existing caster is a conventional universal caster, which has a rotation radius and will appear a rotation twist during operation, thereby affecting the docking precision.
[0003] In order to overcome the above-mentioned defects existing in the prior art, there is an urgent need in the field for an improved semiconductor processing device for avoiding the rotation twist of the existing universal caster, thereby further improving the accuracy of the docking between the cavities. SUMMARY
[0004] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
[0005] In order to overcome the above-mentioned defects existing in the prior art, the present application provides a semiconductor processing device, a semiconductor processing method and a computer readable storage medium, which can move the process cavity to the docking position of the transmission cavity by using the moving device installed with the docking caster with a rotation torque of 0 according to the position data obtained by measurement, for avoiding the rotation twist of the existing universal caster, thereby further improving the accuracy of the docking between the cavities.
[0006] Specifically, the semiconductor processing equipment according to the first aspect of the present application comprises a first cavity, a second cavity and a cavity docking device. The second cavity is to be docked with the first cavity. The cavity docking device is used to move the first cavity to a docking position of the second cavity. The cavity docking device comprises a docking body and a plurality of docking casters. The docking body is arranged below the first cavity and is used to move the first cavity to the docking position of the second cavity according to a movement adjustment signal indicating the docking position between the first cavity and the second cavity. The plurality of docking casters are arranged below the docking body and each is provided with at least one spherical roller. The spherical roller has a rotational moment of 0 on the support shaft of the docking caster.
[0007] Further, in some embodiments of the present application, the plurality of spherical rollers are clamped at the bottom of each docking caster, wherein a first diameter of the mounting position of the bottom of the docking caster is smaller than a second diameter of each spherical roller.
[0008] Further, in some embodiments of the present application, each spherical roller is centrally distributed on the docking caster, so as to keep the docking caster balanced in the horizontal direction.
[0009] Further, in some embodiments of the present application, the step of moving the first cavity to the docking position of the second cavity according to the movement adjustment signal indicating the docking position between the first cavity and the second cavity comprises directly controlling the movement of the docking casters to the docking position according to the movement adjustment signal, so as to avoid the rotational distortion of the docking body and the first cavity during the movement.
[0010] Further, in some embodiments of the present application, the semiconductor processing equipment further comprises a positioning element arranged on the first cavity and / or the second cavity, and used to obtain position data between the first cavity and the second cavity. The position data at least comprises the distance, angle and height difference between the first cavity and the second cavity.
[0011] Further, in some embodiments of the present application, the semiconductor processing apparatus further comprises a positioning point disposed outside the first cavity. The first cavity is provided with a first positioning element. The second cavity is provided with a second positioning element. The step of obtaining the position data between the first cavity and the second cavity comprises: the first positioning element and the second positioning element respectively vertically downwardly emitting a first positioning laser and a second positioning laser; and determining the position of the first cavity according to the relative position between a first projection point of the first positioning laser and the positioning point, and determining the position of the second cavity according to the relative position between a second projection point of the second positioning laser and the positioning point, thereby determining the position data between the first cavity and the second cavity.
[0012] Further, in some embodiments of the present application, the docking body is used to drive the first cavity to move in four degrees of freedom.
[0013] Further, in some embodiments of the present application, the first cavity comprises a transfer cavity. The second cavity comprises at least one process cavity.
[0014] In addition, the above-mentioned semiconductor processing apparatus according to the second aspect of the present application comprises a first cavity, a second cavity, and a cavity docking device according to the first aspect of the present application. The second cavity is to be docked with the first cavity. The cavity docking device is used to move the first cavity to a docking position of the second cavity.
[0015] Further, in some embodiments of the present application, the first cavity is selected from one of a transfer cavity and a process cavity. The second cavity is selected from the transfer cavity and the process cavity.
[0016] In addition, the above-mentioned semiconductor processing method according to the second aspect of the present application comprises the following steps: obtaining position data of a first cavity and a second cavity of a semiconductor processing apparatus according to the first aspect of the present application. The first cavity is selected from one of a transfer cavity and a process cavity, and the second cavity is selected from the transfer cavity and the process cavity; generating a movement adjustment signal for indicating a docking position between the first cavity and the second cavity according to the position data of the first cavity and the second cavity; and moving the first cavity to the docking position of the second cavity by using a cavity docking device according to the movement adjustment signal.
[0017] In addition, the above-mentioned computer readable storage medium according to the third aspect of the present application has computer instructions stored thereon. The computer instructions are executed by a processor to implement the semiconductor processing method according to the second aspect of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0018] The above features and advantages of the present application will be better understood by reading the detailed description of the embodiments of the present application in conjunction with the drawings, in which: In the drawings, the components are not necessarily drawn to scale, and components of similar or identical function or structure can be designated with the same or similar reference signs.
[0019] Figure 1 A structural schematic diagram of a semiconductor processing device according to some embodiments of the present application is shown.
[0020] Figure 2 A connection structural schematic diagram of a cavity docking device and a first cavity according to some embodiments of the present application is shown.
[0021] Figure 3A A structural schematic diagram of a cavity docking device according to some embodiments of the present application is shown.
[0022] Figure 3B A cross-sectional structural schematic diagram of a cavity docking device according to some embodiments of the present application is shown.
[0023] Figure 3C A cross-sectional schematic diagram of a cavity docking device according to some embodiments of the present application is shown.
[0024] Figure 4A A force analysis schematic diagram of a spherical roller during movement according to some embodiments of the present application is shown.
[0025] Figure 4B A force analysis schematic diagram of a spherical roller during movement according to some embodiments of the present application is shown.
[0026] Figure 4C A force analysis schematic diagram of a spherical roller during movement according to some embodiments of the present application is shown.
[0027] Figure 5 A schematic diagram of a first cavity movement according to some embodiments of the present application is shown.
[0028] Figure 6 A schematic diagram of a docking caster according to a reference example is shown.
[0029] Figure 7 A principle schematic diagram of a docking caster rotation twist according to a reference example is shown.
[0030] Figure 8 A flow schematic diagram of a cavity docking method according to some embodiments of the present application is shown.
[0031] Reference signs:
[0032] 11 first cavity
[0033] 12 second cavity
[0034] 13 skilled person
[0035] 21 docking body
[0036] 22 docking caster
[0037] 23 spherical roller
[0038] 141 first positioning element
[0039] 142 second positioning element
[0040] 15 positioning point DETAILED DESCRIPTION
[0041] The present application is herein described, by way of example only, with reference to the accompanying drawings, wherein:
[0042] In the description of the present application, it is necessary to explain that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0043] In addition, "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" used in the following description should be understood as the orientation shown in the paragraph and the related drawings. The relative terms are only used for the convenience of description, and they do not mean that the device described should be manufactured or operated in a particular orientation, so they should not be understood as a limitation of the present application.
[0044] It will be understood that, although the terms "first", "second", "third", etc. can be used herein to describe various components, regions, layers and / or sections, these components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one component, region, layer or section from another. Therefore, components, regions, layers and / or sections discussed below as first components, regions, layers and / or sections can be referred to as second components, regions, layers and / or sections without departing from some embodiments of the present application.
[0045] As described above, since the positioning pin and the pin hole are located in the docking plane during the docking process, the docking plane gradually becomes smaller until it disappears as the docking fitting progresses, resulting in a reduction in the visually observable position and space, and ultimately the inability to obtain the final position information, making it difficult to accurately describe the docking state. Therefore, this manual pushing method cannot meet the size requirements of high-precision docking, resulting in a serious lack of docking precision. In addition, the existing casters are conventional universal casters, which have a rotation radius and will appear a rotating twist during operation, thereby affecting the docking precision.
[0046] In order to overcome the above-mentioned defects of the prior art, the present application provides a semiconductor processing equipment, a semiconductor processing method and a computer readable storage medium, which can move the process cavity to the docking position of the transmission cavity by using the moving device with the docking caster with a rotation torque of 0 according to the position data obtained by measurement, so as to avoid the rotating twist of the existing universal caster, thereby further improving the accuracy of the docking between the cavities.
[0047] In some non-limiting embodiments, the above-mentioned semiconductor processing method provided by the second aspect of the present application can be implemented based on the above-mentioned semiconductor processing equipment provided by the first aspect of the present application.
[0048] For a more complete understanding of the present application, reference is made to the following Figure 1 . Figure 1 The structure schematic diagram of the semiconductor processing equipment provided by some embodiments of the present application is shown.
[0049] In Figure 1 the embodiment shown, the above-mentioned semiconductor processing equipment provided by the first aspect of the present application includes a first cavity 11, a second cavity 12 and a cavity docking device. Here, the second cavity 12 is to be docked with the first cavity 11. The cavity docking device is used to move the first cavity 11 to the docking position of the second cavity 12.
[0050] Further, in some embodiments, the first cavity 11 is a transmission cavity, and the second cavity 12 is a process cavity.
[0051] As Figure 1As shown, technician 13 observes the docking situation between the first cavity 11 and the second cavity 13 along the direction of the arrow. During the above docking process, since the docking positioning pin hole and the pin are located in the docking plane, the docking plane finally becomes smaller as the docking process progresses, and then disappears. The visual position and space gradually become smaller, and finally cannot be seen, and the final position information cannot be described.
[0052] Please refer to further Figure 2 and Figure 3. Figure 2 A schematic diagram of the connection structure between the cavity docking device and the first cavity provided according to some embodiments of the present invention is shown. Figure 3A A schematic structural diagram of a cavity docking device provided according to some embodiments of the present invention is shown. Figure 3B A schematic cross-sectional structure diagram of a cavity docking device provided according to some embodiments of the present invention is shown. Figure 3C A schematic cross-sectional view according to the present invention is shown.
[0053] exist Figure 2 In the illustrated embodiment, the cavity docking device includes a docking body 21 and a plurality of docking casters 22. Here, the docking body 21 is disposed below the first cavity 11, and is used to move the first cavity 11 to the docking position of the second cavity 12 according to a movement adjustment signal indicating the docking position between the first cavity 11 and the second cavity 12. A plurality of docking casters 22 are disposed below the docking body, and their rotational torque is 0. Here, at least one spherical roller 23 is provided below each docking caster 22 for achieving sliding of the docking body 21 and the first cavity 11. Here, the first cavity 11 includes a transfer cavity. The second cavity 12 includes at least one process cavity.
[0054] Specifically, in Figure 2 and Figure 3A - Figure 3C In the embodiment shown, a docking caster 22 is provided under each docking body 21 in the cavity docking device, and each docking caster 22 is provided with at least three spherical rollers 23 for supporting the docking body 21 and the first cavity 11 and driving them to slide.
[0055] exist Figure 3A - Figure 3C In the embodiment shown, the plurality of ball rollers 23 are clamped to the bottom of each docking caster 22. Here, the first diameter of the mounting position of the bottom of the docking caster 22 is smaller than the second diameter of each ball roller 23.
[0056] Specifically, the material of the mounting portion at the bottom of the docking caster 22 can be selected from steel or ceramic, which has a low friction coefficient with the spherical roller 23. Alternatively, the material of the mounting portion can be a self-lubricating material (e.g., PTFE) to reduce friction between the mounting portion at the bottom of the docking caster 22 and the spherical roller 23.
[0057] Further, each spherical roller 23 is centrally distributed on the docking caster 22, so as to balance the docking caster 22 in the horizontal direction.
[0058] Please further refer to Figure 4A - Figure 4C . Figure 4A A force analysis diagram of the spherical roller during movement is shown according to some embodiments of the present application. Figure 4B A force analysis diagram of the spherical roller during movement is shown according to some embodiments of the present application. Figure 4C A force analysis diagram of the spherical roller during movement is shown according to some embodiments of the present application.
[0059] In Figure 4A - Figure 4C the embodiment shown, three spherical rollers 231-233 are arranged on the docking caster 22.
[0060] Specifically, in Figure 4A the embodiment shown, the line connecting the spherical rollers 231-233 and the center of the base of the docking caster 22 is parallel to the moving direction.
[0061] Here, the rotational moment T of the docking caster 22 is the sum of the rotational moments of the three spherical rollers 231-233:
[0062] T=T1+T2+T3
[0063] wherein T1 is the rotational moment of the spherical roller 231, T2 is the rotational moment of the spherical roller 232, and T3 is the rotational moment of the spherical roller 233.
[0064] For the spherical roller 231, the rotational moment T1=F1×L1. Here, since the force arm L1 of the spherical roller 231 is 0, the rotational moment T1=0.
[0065] For the spherical roller 232 and the spherical roller 233, the rotational moment T2=F2×L2, and the rotational moment T3=F3×L3. Here, since F2=F3 and L2=-L3, T2+T3=0.
[0066] Therefore, the rotational moment T of the docking caster 22 is the sum of the rotational moments of the three spherical rollers 231-233, T=0.
[0067] Alternatively, in Figure 4B the embodiment shown, the line connecting the spherical rollers 231-233 and the center of the base of the docking caster 22 is at an angle θ to the moving direction.
[0068] Here, the rotational moment T of the docking caster 22 is the sum of the rotational moments of the three spherical rollers 231-233:
[0069] T = T1 + T2 + T3
[0070] Wherein, T1 is the rotational moment of the spherical roller 231, T2 is the rotational moment of the spherical roller 232, and T3 is the rotational moment of the spherical roller 233.
[0071] For each spherical roller 231-233, the force can be decomposed into sinθ component and cosθ component. For the three spherical rollers distributed in the center, the interval angle is 120° and 240° respectively, and the rotational moment T is:
[0072] T = (F1sinθ + F1cosθ) x L1 + (F2sin(θ + 120°) + F2cos(θ + 120°)) x L2 + (F2sin(θ + 240°) + F2cos(θ + 240°)) x L3 = 0
[0073]
[0074] Or, in the embodiment shown in Figure 4C , if the spherical roller of the docking caster 22 is simplified to only the spherical roller 231, the rotational moment T1 = F1 x L1. Since the bottom of the spherical roller 231 is point contact, the friction in the direction of the rotational moment of the spherical roller 231 is smaller than when the rotational moment, the docking caster 22 must rotate, resulting in eccentricity.
[0075] Please refer to Figure 5 . Figure 5 A schematic diagram of the movement of the first cavity is shown according to some embodiments of the present application.
[0076] As shown in Figure 5 , the docking body 21 can drive the first cavity 11 to move in four degrees of freedom. Here, the four degrees of freedom include movement along the X-axis, movement along the Y-axis, movement along the H-axis, and rotation, which can cover all movement requirements of the first cavity 11.
[0077] In this way, the cavity docking device can use the four degrees of freedom of the docking body 21 to send the first cavity 11 to the accurate docking position, thereby avoiding the problem of damage to the pin hole due to inaccurate manual pushing of the first cavity 11 position, multiple attempts, and failure.
[0078] Please refer to Figure 6 and Figure 7 . Figure 6 A schematic diagram of a docking caster is shown according to a reference example. Figure 7 A schematic diagram of the principle of rotation and torsion of the docking caster is shown according to a reference example.
[0079] As shown in Figure 6 and Figure 7 As shown, the existing universal docking caster has a rotation torque. When the previous adjustment action of the process cavity is right front, and is converted into a left front direction, the existing docking caster will make a caster rotation radius rotation movement, and thus cannot achieve accurate positioning when the first cavity 11 moves.
[0080] In addition, in some non-limiting embodiments, the above-mentioned semiconductor processing equipment provided by the first aspect of the present application comprises a memory and a controller. Here, the memory includes but is not limited to the computer readable storage medium provided by the third aspect described above, and the computer instructions are stored on the computer readable storage medium. The controller is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the semiconductor processing method provided by the first aspect of the present application.
[0081] The working principle of the above-mentioned semiconductor processing equipment will be described below in combination with some embodiments of the semiconductor processing method. Those skilled in the art can understand that these embodiments of the semiconductor processing method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific schemes for facilitating the public to implement, rather than limit the overall function or overall working mode of the semiconductor processing equipment. Similarly, the semiconductor processing equipment is also only a non-limiting embodiment provided by the present application, which does not limit the execution subject and execution order of each step in these semiconductor processing methods.
[0082] Please refer to Figure 8 . Figure 8 A flowchart of a semiconductor processing method provided by some embodiments of the present application is shown.
[0083] As Figure 8 shown, the semiconductor processing equipment can obtain position data of the first cavity 11 and the second cavity 12. Here, the first cavity 11 is a transfer cavity, and the second cavity 12 is a process cavity.
[0084] Then, the semiconductor processing equipment can generate a movement adjustment signal for indicating the docking position between the first cavity 11 and the second cavity 12 according to the position data of the first cavity 11 and the second cavity 12.
[0085] After that, the semiconductor processing equipment can move the first cavity 11 to the docking position of the second cavity 12 by using the cavity docking device according to the movement adjustment signal.
[0086] Specifically, the semiconductor processing equipment can directly control the docking caster 22 to move to the docking position according to the movement adjustment signal, so as to avoid the rotation and distortion of the docking body 21 and the first cavity 11 during the movement.
[0087] In addition, in Figure 1In the embodiment shown, the semiconductor processing apparatus further comprises a positioning element. The positioning element is mounted on the first cavity 11 and / or the second cavity 12, and is configured to obtain position data between the first cavity 11 and the second cavity 12. Here, the position data at least includes the distance, angle and height difference between the first cavity 11 and the second cavity 12.
[0088] In Figure 1 In the embodiment shown, the semiconductor processing apparatus further comprises a positioning point 15 outside the first cavity 11, and the first cavity 11 is provided with a first positioning element 141, and the second cavity 12 is provided with a second positioning element 142. Specifically, the first positioning element 141 and the second positioning element 142 respectively vertically downwardly emit first positioning laser and second positioning laser.
[0089] Subsequently, the semiconductor processing apparatus can determine the position of the first cavity 11 according to the relative position between the first positioning laser and the positioning point, and determine the position of the second cavity 12 according to the relative position between the second positioning laser and the positioning point, so as to determine the position data between the first cavity 11 and the second cavity 12.
[0090] In summary, the semiconductor processing apparatus, the semiconductor processing method and the computer readable storage medium provided by the present application can all use the moving device with the docking caster wheel with a mounting radius of 0 to move the process cavity to the docking position of the transfer cavity according to the position data obtained by measurement, so as to avoid the rotation and distortion of the existing universal caster wheel, thereby further improving the accuracy of the docking between the cavities.
[0091] Although the methods are illustrated and described as a series of acts for simplicity, it will be appreciated that the methods are not limited by the order of acts as some acts can, in accordance with one or more embodiments, occur simultaneously or in different order than shown and described herein, or can be omitted entirely, depending on the circumstances. For example, the methods described herein can be performed in any suitable order or concurrently.
[0092] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the generic principles defined herein can be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A semiconductor processing equipment, characterized in that include: a first cavity; A second cavity, to be docked with the first cavity; as well as A cavity docking device, used to move the first cavity to the docking position of the second cavity, wherein the cavity docking device includes a docking body and a plurality of docking casters, the docking body is arranged below the first cavity, and is used to move the first cavity to the docking position of the second cavity according to a movement adjustment signal indicating the docking position between the first cavity and the second cavity, the plurality of docking casters are arranged below the docking body, and each of them is provided with at least one spherical roller, wherein the rotational torque of the spherical roller on the support shaft of the docking caster is 0.
2. The semiconductor processing equipment according to claim 1, wherein The plurality of spherical rollers are clamped to the bottom of each docking caster, wherein a first diameter of an installation position of the bottom of the docking caster is smaller than a second diameter of each spherical roller.
3. The semiconductor processing equipment according to claim 1, wherein The spherical rollers are centrally distributed on the docking casters, so as to keep the docking casters balanced in the horizontal direction.
4. The semiconductor processing equipment according to claim 1, wherein The step of moving the first cavity to the docking position of the second cavity according to the movement adjustment signal indicating the docking position between the first cavity and the second cavity includes: According to the movement adjustment signal, the docking caster is directly controlled to move toward the docking position, so as to prevent the docking body and the first cavity from rotating and twisting during the movement.
5. The semiconductor processing equipment according to claim 1, wherein Also includes: A positioning element is installed on the first cavity and / or the second cavity, and is used to obtain position data between the first cavity and the second cavity, wherein the position data at least includes the distance, angle and height difference between the first cavity and the second cavity.
6. The semiconductor processing equipment according to claim 5, wherein The semiconductor processing equipment further includes a positioning point provided outside the first cavity, a first positioning element is provided on the first cavity, and a second positioning element is provided on the second cavity, wherein the step of obtaining position data between the first cavity and the second cavity includes: The first positioning element and the second positioning element respectively emit a first positioning laser and a second positioning laser vertically downward; and The position of the first cavity is determined according to the relative position between the first projection point of the first positioning laser and the positioning point, and the position of the second cavity is determined according to the relative position between the second transmission point of the second positioning laser and the positioning point, thereby determining the position data between the first cavity and the second cavity.
7. The semiconductor processing equipment according to claim 1, wherein The docking body is used to drive the first cavity to move in four degrees of freedom.
8. The semiconductor processing equipment according to claim 1, wherein The first chamber is selected from one of a transfer chamber and a process chamber, and the second chamber is selected from the transfer chamber and the process chamber.
9. A semiconductor processing method, characterized in that: The following steps are involved: Acquiring position data of a first chamber and a second chamber of the semiconductor processing equipment according to any one of claims 1 to 8, wherein the first chamber is selected from one of a transfer chamber and a process chamber, and the second chamber is selected from the transfer chamber and the process chamber; generating a movement adjustment signal for indicating a docking position between the first cavity and the second cavity according to the position data of the first cavity and the second cavity; and According to the movement adjustment signal, the first cavity is moved to a docking position of the second cavity using a cavity docking device.
10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the semiconductor processing method according to claim 9 is implemented.