Wafer etching auxiliary device

By designing multiple adjustment mechanisms and air cavity structures in the wafer etching auxiliary device, cooling gas is used to dissipate heat from the electrodes and the bottom of the wafer, which solves the problem of uneven wafer temperature and improves etching quality and production efficiency.

CN120809619AActive Publication Date: 2025-10-17SUZHOU WINMAX TECH CORP
View PDF 4 Cites 0 Cited by

Patent Information

Application Number
CN202510934203.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-08
Publication Date
2025-10-17
Estimated Expiration
2045-07-08

Smart Images

  • Figure CN120809619A_ABST
    Figure CN120809619A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of wafer etching, and discloses a wafer etching auxiliary device which comprises a shell, an interface is fixedly connected to the bottom of the shell, a controller is fixedly mounted in the shell, a control valve is fixedly mounted in the controller, a base is fixedly connected to the upper surface of the shell, and a clamping plate is fixedly connected to the upper surface of the base. And a plurality of electrodes are fixedly mounted on the lower surface of the clamping plate. An electromagnet is electrified to attract an iron sheet under the electromagnet, so that a fan-shaped plate is driven to move downwards, a groove for cooling gas to pass through is formed, the fan-shaped plate further drives a baffle to move downwards through a sliding block, a movable plate drives a sealing ring to slide downwards, and therefore gas in a gas outlet sleeve can be exhausted and enters the groove; and the cooled gas flows towards the outer side along the groove until being exhausted, so that the cooled gas can uniformly dissipate heat of the bottom of the wafer, and the problem that the heat dissipation effect of the contact area of the wafer and the equipment is poor in the existing equipment is solved.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Wafer temperature controller, wafer temperature control system, wafer temperature controller method and plasma processing device

    CN113053775A

  • Bottom electrode slide holder of sculpture machine

    CN206432233U

  • Special quartz combined outer ring for semiconductor etching process

    CN222281947U

  • Plasma processing apparatus

    US20190051501A1