Chip mounting equipment for mobile phone production

Abstract

The invention relates to the field of chip mounters, and discloses chip mounting equipment for mobile phone production, which comprises a main body and a suction head assembly arranged on the main body through a guide rail and a mounting assembly, a plastic assembly is arranged above the main body, and the plastic assembly and the suction head assembly are arranged in the same working area. The plastic assembly does not make contact with the suction head assembly when the suction head assembly takes materials and corrects elements, the plastic assembly can be assembled with the suction head assembly only during work and work together with the suction head assembly, and the position where the plastic assembly is not assembled with the suction head assembly is the standby position of the plastic assembly. The chip mounting equipment for mobile phone production provided by the invention is provided with the plastic component, adopts the raised pattern mold with the Archimedes curve diversion trench and the pressure plate, actively regulates and controls the plasticity of the solder paste, reduces the tension, improves the mounting precision and reduces the defective rate by utilizing the spiral diversion trench, and is simple in structure, replaceable, capable of adaptively regulating the solder paste amount and capable of reducing missing solder.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of a patch machine, in particular to a chip mounting device for mobile phone production. BACKGROUND

[0002] In the patent application with the application publication number CN220155515U, a connecting piece is connected with a patch machine, a heat insulation layer is connected with the connecting piece, and a suction accessory is connected with the heat insulation layer and used for adsorbing a chip; wherein the thermal conductivity of the heat insulation layer is smaller than that of the suction accessory, and the hardness of the suction accessory is greater than that of the heat insulation layer. The advantages are that the heat insulation layer with small thermal conductivity is arranged between the connecting piece and the suction accessory, the transmission of heat in the suction nozzle of the patch machine is blocked, the influence of the suction nozzle of the patch machine on the temperature of the welding area is reduced, and the consistency of the welding quality is improved. In addition, the suction accessory with large hardness has good wear resistance and prolongs the service life of the suction nozzle of the patch machine.

[0003] In the prior art including the above-mentioned patent, the current improvements of the suction nozzle of the patch machine are mainly concentrated on temperature control, dust reduction, speed improvement and positioning accuracy improvement; however, the effect of improving the positioning accuracy is limited to the patching link itself; in the subsequent processing flow, especially in the reflow soldering process, the change of the physical properties after the melting of the solder paste will directly affect the position of the element; the surface tension generated by the liquid solder paste will pull the element, which is a common phenomenon in the industry, and is called "solder climbing"; in view of the problem of solder climbing, the existing solutions mainly adopt the point paste process or optimize the steel mesh design of the printed solder paste, aiming to pre-control the shape of the solder paste; but this kind of method still has certain limitations: the element is pressed during patching, which will destroy the preset shape of the solder paste and weaken the optimization effect; even under the interference of other factors, the scheme may completely fail; on the contrary, the existing technology is relatively scarce in actively regulating the plastic state of the solder paste during the patching process; therefore, it is necessary to propose a new improvement direction to more effectively solve the element deviation problem in the reflow soldering stage. SUMMARY

[0004] The problem to be solved by the application is to suppress the phenomenon of element deviation (solder climbing) caused by the surface tension of liquid solder paste in reflow soldering, actively regulate the plastic state of the solder paste in the patching link, and avoid the disadvantages caused by the early plasticity.

[0005] To solve the above technical problems, the technical solution of the present invention is as follows: a chip placement device for mobile phone production, comprising a main body, a suction head assembly arranged on the main body via a guide rail and a mounting assembly, a plastic component arranged above the main body, the plastic component and the suction head assembly being arranged in the same working area, the plastic component not contacting the suction head assembly when the suction head assembly is retrieving materials and calibrating components, the plastic component can be assembled with the suction head assembly and work together only when working, the position of the plastic component when not assembled with the suction head assembly is the standby position of the plastic component, a cleaning component is arranged below the standby position of the plastic component, the main body of the cleaning component is located inside the main body, and only a small part is located outside the main body and contacts the lower end of the plastic component; The plastic component mainly includes a sleeve, a pressure plate, a sliding sleeve and a positive mold. A pressure plate is fixedly provided at the lower end of the sleeve. The size of the pressure plate needs to be increased or decreased synchronously according to the size of the mounted component. A positive mold is provided at the lower end of the pressure plate. The positive mold is used to press the lines on the solder paste. There are four positive molds in total. The positive molds are arranged in an Archimedean curve and rotate counterclockwise around the center of the pressure plate.

[0006] Preferably, the plastic component also includes a slide rail slidably set on the guide rail, a mounting seat is slidably set on the outer surface of the slide rail, a coil winding is built into the slide rail, and when the coil winding is energized, it can drive the mounting seat to move to the standby position, and a guide rod is provided at the lower side of the slide rail.

[0007] Preferably, the guide rod is fixedly connected to the main body, the slide rail and the guide rod are slidably connected via a slider, a spring 1 is provided around the guide rod, the two ends of the spring 1 are respectively fixedly connected to the main body and the slider on one side of the slide rail, and the spring 1 is used to pull the slide rail to the standby position.

[0008] Preferably, a mounting rail is fixedly provided on the outer surface of the mounting base close to the suction head assembly, the number of the mounting rails is consistent with the number of suction heads in the suction head assembly, a second spring is provided in the middle of the mounting rail, the second spring is used to lift the movable block on the mounting rail, and a connecting frame is fixedly provided on one side of the movable block in the mounting rail.

[0009] Preferably, the cross-section of the connecting frame is in a mountain shape, and a sleeve is fixedly provided on the lower side of the connecting frame. The sleeve is connected to the connecting frame through a limiting slide rail, and the connecting frame can be connected to the fixed angle steel of the suction head in the suction head assembly.

[0010] As preferred, the outer surface of the sleeve is slidingly provided with sliding sleeves, the thickness of the sliding sleeves is twice the thickness of the pressing plate, the inner side of the lower end of the sliding sleeves is provided with annular grooves, the inside of the sliding sleeves is slidingly provided with counterweights, the upper end of the sliding sleeves is fixedly provided with limit blocks, one side of the inside of the sleeve is fixedly provided with a vibration motor, the vibration motor is used to improve the flowability of the solder paste, and the vibration motor can be selectively mounted according to the flowability of the solder paste.

[0011] As preferred, the limit blocks are provided with two, the upper end of the limit blocks is fixedly provided with a magnet, the outer side of the sleeve is provided with a sliding groove around the limit blocks, the sliding groove and the limit block are slidingly connected, the upper end of the sliding groove is also provided with a magnet, and the magnet in the sliding groove and the magnet at the upper end of the limit block repel each other.

[0012] As preferred, the cleaning assembly is used to clean the residual solder paste on the pressing plate and suck out part of the solder paste in the sliding sleeve, the cleaning assembly mainly comprises a mounting box above the main body, the upper end of the mounting box is in contact with the sliding sleeve, the upper end of the mounting box is provided with a steel mesh, the size of the steel mesh is consistent with the size of the sliding sleeve, the number of the steel mesh is consistent with the number of the sliding sleeve, the middle upper end of the steel mesh is fixedly provided with a brush, and the brush can be in contact with the pressing plate.

[0013] As preferred, the inside of the mounting box is provided with a motor below the brush for driving the brush to rotate, and the lower end of the motor is provided with an electric push rod for pushing the motor and the brush upwards.

[0014] As preferred, the lower end of the mounting box is provided with a vacuum pump inside the main body, the vacuum pump is directly connected to the lower end of the steel mesh through a vacuum pipe, and the cross-sectional area of the vacuum pipe at the lower end of the steel mesh is consistent with the area of the steel mesh.

[0015] Compared with the prior art, the technical scheme of the present application has the following advantages: (1) Under the action of the plastic assembly, the plastic state of the tin paste can be actively regulated to solve the problem of element deviation in reflow soldering. By cooperating the male die and the pressure plate, the Archimedes curve guide groove is pressed out on the surface of the tin paste. In this way, during reflow soldering, the tin paste can be forced to rotate counterclockwise under the action of the Archimedes curve, and the tin paste is forced to flow directionally by using the spiral guide groove, thereby suppressing the deviation caused by surface tension, reducing the surface tension generated by the tin paste, and controlling the flow direction of the tin paste, thereby reducing the impact on the element, improving the mounting accuracy of the element, and reducing the scrap rate. Moreover, the active regulation scheme adopted by the present application has the advantages of lower cost, convenient disassembly and maintenance, and the shape of the tin paste will not be damaged by pressing during mounting. In addition, when the tin paste is plasticized, the plastic assembly can collect or supplement the excess tin paste according to different situations, which can reduce the probability of empty welding and ensure the success rate of tin paste plasticity, avoid the adverse effects of the pressure plate on the tin paste, and finally, through the setting of the pressure plate and the male die in the plastic assembly, the core components of the plastic assembly have high customization potential, so that the plastic assembly can adapt to electronic components of different sizes. (2) Under the action of the cleaning assembly, firstly, the residual tin paste on the pressure plate can be cleaned in time to avoid contaminating the equipment surface or the PCB board, and secondly, the excess tin paste can be collected for secondary use, reducing production loss and production cost. It is worth mentioning that when collecting the tin paste, the tin paste in the sliding sleeve will not be completely cleaned, and a part will always remain, which not only ensures that the sliding sleeve can collect excess tin paste every time it works, but also prevents the phenomenon of the sliding sleeve being unable to supplement the tin paste. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present application; Figure 2 It is a schematic diagram of the rear view structure of the present application; Figure 3 It is a schematic diagram of the mounting seat structure in the plastic assembly of the present application; Figure 4 It is a schematic diagram of the structure of a single plastic mechanism in the plastic assembly of the present application; Figure 5 It is a schematic diagram of the rear view structure of a single plastic mechanism of the present application; Figure 6 It is a schematic diagram of the cross-sectional structure of the sliding sleeve in the plastic mechanism of the present application; Figure 7 It is a schematic diagram of the structure of the present application Figure 6 It is a schematic diagram of the enlarged structure at A in the present application; Figure 8 It is a schematic diagram of the bottom view structure of the plastic mechanism of the present application; Figure 9 Figure 1 is a schematic diagram of the installation position of the cleaning assembly in the device of the present application; Figure 10 Figure 2 is a schematic diagram of the device of the present application Figure 9 Figure 3 is a schematic diagram of the enlarged structure at B in the device of the present application; Figure 11 Figure 4 is a schematic diagram of the structure of a small-size version of the plasticizing mechanism in the device of the present application; Figure 12 Figure 5 is a schematic diagram of the enlarged structure of the suction head assembly in the device of the present application.

[0017] Figure 1 is a schematic diagram of the installation position of the cleaning assembly in the device of the present application; Figure 2 is a schematic diagram of the device of the present application Figure 3 is a schematic diagram of the enlarged structure at B in the device of the present application; Figure 4 is a schematic diagram of the structure of a small-size version of the plasticizing mechanism in the device of the present application; Figure 5 is a schematic diagram of the enlarged structure of the suction head assembly in the device of the present application. DETAILED DESCRIPTION

[0018] So that the objects, technical solutions and advantages of the embodiments of the present disclosure are more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of the present disclosure.

[0019] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning of the terms to a person of ordinary skill in the art to which the present disclosure belongs. The terms such as “comprise” or “include” and the like used in the present disclosure mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms such as “connect” or “connected” and the like are not limited to physical or mechanical connections, but can also include electrical connections, whether direct or indirect. The terms “upper”, “lower”, “left”, “right” and the like are only used to indicate relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships can also be changed accordingly.

[0020] As Figures 1 to 12As shown, the mobile phone production chip mounting equipment provided by the application comprises a main body 1, a suction head assembly 2 arranged on the main body 1 through a guide rail and a mounting assembly, a plastic assembly 3 arranged above the main body 1, the plastic assembly 3 and the suction head assembly 2 being arranged in the same working area, the plastic assembly 3 not being in contact with the suction head assembly 2 when the suction head assembly 2 takes materials and corrects elements, the plastic assembly 3 being assembled with the suction head assembly 2 and working together only during working, the position of the plastic assembly 3 when not assembled with the suction head assembly 2 being a standby position of the plastic assembly 3, a cleaning assembly 4 arranged below the standby position of the plastic assembly 3, the body of the cleaning assembly 4 being located inside the main body 1, only a small part of the cleaning assembly 4 being located outside the main body 1 and being in contact with the lower end of the plastic assembly 3. The plastic assembly 3 mainly comprises a sleeve 308, a pressing disc 309, a sliding sleeve 310 and a male text die 315, the lower end of the sleeve 308 is fixedly provided with the pressing disc 309, the size of the pressing disc 309 needs to be increased or decreased synchronously according to the size of the elements to be mounted, the lower end of the pressing disc 309 is provided with the male text die 315, the male text die 315 is used for pressing the texture on the tin paste, the male text die 315 is provided with four, the male text die 315 is provided with an Archimedes curve and rotates counterclockwise around the center of the pressing disc 309.

[0021] The plastic assembly 3 further comprises a sliding rail 301 slidingly arranged on the guide rail, the outer surface of the sliding rail 301 is slidingly provided with a mounting seat 302, the sliding rail 301 is built-in with a coil winding, the mounting seat 302 can be driven to move to the standby position when the coil winding is powered, and the guide rail 303 is arranged below one side of the sliding rail 301.

[0022] The guide rail 303 is fixedly connected with the main body 1, the sliding rail 301 is slidingly connected with the guide rail 303 through a sliding block, the guide rail 303 is provided with a spring I 304 around, the two ends of the spring I 304 are fixedly connected with the main body 1 and the sliding block on one side of the sliding rail 301 respectively, and the spring I 304 is used for pulling the sliding rail 301 to the standby position.

[0023] The outer surface of the mounting seat 302 close to one side of the suction head assembly 2 is fixedly provided with a mounting rail 305, the number of the mounting rail 305 is consistent with the number of the suction heads in the suction head assembly 2, the middle part of the mounting rail 305 is provided with a spring II 3051, the spring II 3051 is used for lifting the movable block on the mounting rail 305, and the movable block is fixedly provided with a connecting frame 306 on one side.

[0024] The cross section of the connecting frame 306 is arranged in a mountain shape, the sleeve 308 is fixedly arranged on the lower side of the connecting frame 306, the sleeve 308 is connected with the connecting frame 306 through a limiting sliding rail 307, and the connecting frame 306 can be connected with the fixed angle steel of the suction head in the suction head assembly 2.

[0025] The outer surface of the sleeve 308 is slidingly provided with a sliding sleeve 310, the thickness of the sliding sleeve 310 is twice the thickness of the pressing disc 309, an annular groove is formed in the inner side of the lower end of the sliding sleeve 310, a counterweight 311 is slidingly arranged in the inner part of the sliding sleeve 310, a limiting block 312 is fixedly arranged at the upper end of the sliding sleeve 310, and a vibration motor is fixedly arranged on one side of the inner part of the sleeve 308, the vibration motor is used for improving the flowability of the solder paste, and the vibration motor can be selectively arranged according to the flowability of the solder paste.

[0026] The limiting block 312 is provided with two limiting blocks 312, a magnet 313 is fixedly arranged at the upper end of the limiting block 312, and a sliding groove 314 is formed around the outer side of the sleeve 308 and located at the limiting block 312, the sliding groove 314 is in sliding connection with the limiting block 312, and the upper end of the sliding groove 314 is also provided with a magnet 313, and the magnet 313 located in the sliding groove 314 and the magnet 313 located at the upper end of the limiting block 312 repel each other.

[0027] The cleaning assembly 4 is used for cleaning the residual solder paste on the pressing disc 309 and sucking out part of the solder paste in the sliding sleeve 310, and the cleaning assembly 4 mainly comprises a mounting box 401 located above the main body 1, the upper end of the mounting box 401 is in contact with the sliding sleeve 310, a steel mesh 402 is formed in the upper end of the mounting box 401, the size of the steel mesh 402 is consistent with the size of the sliding sleeve 310, the number of the steel mesh 402 is consistent with the number of the sliding sleeve 310, and a brush 403 is fixedly arranged at the middle upper end of the steel mesh 402, and the brush 403 can be in contact with the pressing disc 309.

[0028] A motor for driving the brush 403 to rotate is arranged below the brush 403 in the inner part of the mounting box 401, and an electric push rod is arranged below the motor, for pushing the motor and the brush 403 upwards A vacuum pump is arranged in the part of the mounting box 401 below the main body 1, the vacuum pump is directly connected to the lower part of the steel mesh 402 through a vacuum pipe, and the cross-sectional area of the vacuum pipe below the steel mesh 402 is consistent with the area of the steel mesh 402.

[0029] The working principle and use process of the present application are as follows: the suction head assembly 2 of the patch machine picks up the component from the flying pickup, and after visual correction, it is positioned to the plastic assembly 3 work station. The butt joint is realized through the angle steel mechanism and the connecting frame 306, so that the plastic assembly 3 enters the follow-up driving mode. The system executes the following sequence: Contact stage: the suction head assembly 2 carries the plastic assembly 3 downward, the sliding sleeve 310 firstly contacts the PCB to form an annular closed cavity, the pressing disc 309 in the target pad area is then pressed, and the bottom male die 315 of the pressing disc 309 implements plastic on the solder paste, and the excess solder paste is radially squeezed into the buffer cavity of the sliding sleeve 310; Dynamic compensation: high-frequency micro-vibration motor is embedded in sleeve 308, and the rheological properties of high-viscosity solder paste are optimized through controllable mechanical vibration. The weight block 311 cooperates with the vibration system to realize real-time redistribution of the solder paste, and eliminate local vacancy defects. The process parameters can be accurately corrected by stroke control of the limiting slide rail 307 and the weight block module of the sleeve 308. Component mounting: when the platen 309 maintains plastic pressure, the suction head performs mounting through the central guide hole, and limits the component to the geometric center of the plastic solder paste. Closed-loop cleaning and recycling: during the reset process, the sliding sleeve 310 is coupled with the mounting box 401 to form a negative pressure cavity, and the rotating brush 403 cleans the surface of the platen 309. Synchronously, the vacuum pump recycles the solder paste remaining on the platen 309 and the solder paste in the sliding sleeve 310. It is worth noting that in the actual use of the plastic assembly 3, different flowability of the solder paste needs to be considered. If the solder paste has good flowability, the small vibration motor inside the sleeve 308 can be detached. When the solder paste has poor flowability, vibration can not only enhance the flowability of the solder paste, but also reduce the solder paste remaining at the lower end of the platen 309. It is worth mentioning that the pressing time can be changed by changing the length of the limiting slide rail 307, and the force can be changed by changing the weight of the sleeve 308. The sliding sleeve 310 in the suction head assembly 2 can not only collect excess solder paste to prevent it from overflowing to other locations, but also supplement the parts lacking solder paste under the synergistic action of the vibration motor and the weight block 311, thereby reducing the probability of voids or plastic failure. It is worth mentioning that when the sliding sleeve 310 contacts the mounting box 401, a relatively closed space can be formed. By using this, part of the solder paste in the sliding sleeve 310 can be extracted and collected for secondary use.

[0030] The above examples are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present application within the spirit and protection scope of the present application, and such modifications or equivalent replacements shall also be considered to fall within the protection scope of the present application.

Claims

1. A chip mounting device for mobile phone production, comprising a main body (1), a suction head assembly (2) arranged on the main body (1) via a guide rail and a mounting assembly, characterized in that: A plastic component (3) is provided above the main body (1), and the plastic component (3) and the suction head component (2) are provided in the same working area. The plastic component (3) does not contact the suction head component (2) when the suction head component (2) is taking materials and calibrating components. The plastic component (3) can be assembled with the suction head component (2) and work together only when working. The position of the plastic component (3) when not assembled with the suction head component (2) is the standby position of the plastic component (3). A cleaning component (4) is provided below the standby position of the plastic component (3). The main body of the cleaning component (4) is located inside the main body (1), and only a small part is located outside the main body (1) and contacts the lower end of the plastic component (3); The plastic component (3) mainly includes a sleeve (308), a pressure plate (309), a sliding sleeve (310) and a positive mold (315). The lower end of the sleeve (308) is fixedly provided with a pressure plate (309). The size of the pressure plate (309) needs to be increased or decreased synchronously according to the size of the mounted component. The lower end of the pressure plate (309) is provided with a positive mold (315). The positive mold (315) is used to press the lines on the solder paste. The positive mold (315) is provided with four lines. The positive molds (315) are arranged in an Archimedean curve and rotate counterclockwise around the center of the pressure plate (309).

2. The chip placement equipment for mobile phone production according to claim 1, characterized in that: The plastic component (3) further comprises a slide rail (301) slidably arranged on the guide rail, a mounting seat (302) being slidably arranged on the outer surface of the slide rail (301), a coil winding being built into the slide rail (301), and when the coil winding is energized, the mounting seat (302) can be driven to move to a standby position, and a guide rod (303) is arranged below one side of the slide rail (301).

3. The chip placement equipment for mobile phone production according to claim 2, characterized in that: The guide rod (303) is fixedly connected to the main body (1), and the slide rail (301) and the guide rod (303) are slidably connected via a slider. A spring (304) is provided around the guide rod (303), and the two ends of the spring (304) are respectively fixedly connected to the main body (1) and the slider on one side of the slide rail (301). The spring (304) is used to pull the slide rail (301) to the standby position.

4. The chip placement equipment for mobile phone production according to claim 2, characterized in that: A mounting rail (305) is fixedly provided on the outer surface of the mounting seat (302) on one side close to the suction head assembly (2), the number of the mounting rails (305) being consistent with the number of suction heads in the suction head assembly (2), a second spring (3051) is provided in the middle of the mounting rail (305), the second spring (3051) being used to lift the movable block on the mounting rail (305), and a connecting frame (306) is fixedly provided on one side of the movable block in the mounting rail (305).

5. The chip mounting equipment for mobile phone production according to claim 4, characterized in that: The cross section of the connecting frame (306) is in the shape of a mountain. A sleeve (308) is fixedly provided on one side below the connecting frame (306). The sleeve (308) is connected to the connecting frame (306) via a limiting slide rail (307). The connecting frame (306) can be connected to the fixed angle steel of the suction head in the suction head assembly (2).

6. The chip mounting equipment for mobile phone production according to claim 5, characterized in that: A sliding sleeve (310) is slidably provided on the outer surface of the sleeve (308), the thickness of the sliding sleeve (310) is twice the thickness of the pressure plate (309), an annular groove is provided on the inner side of the lower end of the sliding sleeve (310), a counterweight block (311) is slidably provided inside the sliding sleeve (310), a limit block (312) is fixedly provided on the upper end of the sliding sleeve (310), and a vibration motor is fixedly provided on one side of the interior of the sleeve (308), the vibration motor is used to improve the fluidity of the solder paste, and the vibration motor can be selected according to the fluidity of the solder paste.

7. The chip mounting equipment for mobile phone production according to claim 6, characterized in that: There are two limit blocks (312) in total. A magnet (313) is fixedly provided at the upper end of each limit block (312). A sliding groove (314) is provided on the outer side of the sleeve (308) and around the limit block (312). The sliding groove (314) and the limit block (312) are in sliding connection. A magnet (313) is also provided at the upper end of the sliding groove (314). The magnet (313) in the sliding groove (314) and the magnet (313) at the upper end of the limit block (312) repel each other.

8. The chip mounting equipment for mobile phone production according to claim 1, characterized in that: The cleaning component (4) is used to clean the residual solder paste on the pressure plate (309) and to suck out part of the solder paste in the sliding sleeve (310). The cleaning component (4) mainly includes an installation box (401) located on the main body (1). The upper end of the installation box (401) contacts the sliding sleeve (310). A steel mesh (402) is provided on the upper end of the installation box (401). The size of the steel mesh (402) is consistent with the size of the sliding sleeve (310). The number of the steel meshes (402) is consistent with the number of the sliding sleeves (310). A brush (403) is fixedly provided on the upper middle end of the steel mesh (402). The brush (403) can contact the pressure plate (309).

9. The chip mounting equipment for mobile phone production according to claim 8, characterized in that: A motor for driving the brush (403) to rotate is provided inside the installation box (401) and is located directly below the brush (403), and an electric push rod is provided below the motor for pushing the motor and the brush (403) upward.

10. The chip mounting equipment for mobile phone production according to claim 8, characterized in that: A vacuum pump is provided in the portion located inside the main body (1) below the installation box (401), and the vacuum pump is directly connected to the bottom of the steel mesh (402) through a vacuum tube. The cross-sectional area of ​​the vacuum tube below the steel mesh (402) is consistent with the area of ​​the steel mesh (402).

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