Wafer cleaning equipment with flow velocity regulation and control function

Abstract

The invention discloses wafer cleaning equipment with a flow velocity regulation and control function, and relates to the technical field of cleaning equipment.The cleaning equipment comprises an ultrasonic strong acid cleaning mechanism, a circulating waterway cleaning mechanism, a drying cleaning mechanism, a temperature control mechanism and a cleaning machine body, the circulating water path cleaning mechanism, the drying cleaning mechanism and the temperature control mechanism are in fastening connection with the cleaning machine body, and the strong acid cleaning mechanism is located at the bottommost portion to complete preliminary decontamination and avoid leakage of acid liquor; constant-temperature ultrapure water rinsing is achieved through the middle circulating water path cleaning mechanism, and thorough cleaning is guaranteed; the upper drying mechanism dries the surface of the wafer through hot air to prevent water stains from remaining; and the temperature control mechanism keeps the cleaning temperature stable. The vertical flow design conforms to the gravity flow direction, the structure is compact, the sealing performance is high, and the cleaning efficiency and reliability are remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cleaning equipment, and particularly relates to a wafer cleaning equipment with flow rate regulation function. BACKGROUND

[0002] With the continuous miniaturization of semiconductor manufacturing processes, the influence of wafer surface cleanliness on the performance of the final device is increasingly significant, and the cleaning process has become a key link in process control. At present, the wafer cleaning technology widely adopts a multi-stage process, including pre-cleaning, pickling, rinsing, drying and other processes, and cooperates with ultrapure water, high-efficiency chemical liquid and ultrasonic wave and other means to comprehensively remove particles, organic matter and metal ions.

[0003] In the existing wafer cleaning equipment, some systems adopt fixed spraying devices combined with static liquid tanks to realize the segmented cleaning of strong acid and ultrapure water.

[0004] Firstly, the existing technology generally lacks the multivariate linkage regulation capability of liquid flow direction, flow rate and temperature, and lacks self-adaptive controllable regulation of flow rate; secondly, the cleaning medium switching structure in the traditional device is not designed in cooperation with the strong acid-resistant ball switching disc and the hydraulic lifting device, and cannot realize the vertical switching with high sealing performance in the strong acid and ultrapure water environment, therefore, the technical personnel in the field provide a wafer cleaning equipment with flow rate regulation function to solve the problems raised in the above background. SUMMARY

[0005] The present application aims to provide a wafer cleaning equipment with flow rate regulation function to solve the problems raised in the prior art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: The cleaning equipment comprises an ultrasonic strong acid cleaning mechanism, a circulating waterway cleaning mechanism, a drying cleaning mechanism, a temperature control mechanism and a cleaning body, the ultrasonic strong acid cleaning mechanism and the cleaning body are fixedly connected, the circulating waterway cleaning mechanism and the cleaning body are fixedly connected, the drying cleaning mechanism and the cleaning body are fixedly connected, the temperature control mechanism and the cleaning body are fixedly connected, the ultrasonic strong acid cleaning mechanism is located below the circulating waterway cleaning mechanism, the drying cleaning mechanism is located above the circulating waterway cleaning mechanism, the cleaning equipment further comprises a pre-cleaning frame, a cleaning rack, a cleaning gear set and a pre-cleaning motor, the pre-cleaning frame and the drying cleaning mechanism are fixedly connected, the pre-cleaning motor and the pre-cleaning frame are fixedly connected, the pre-cleaning motor and the cleaning gear set are in transmission connection, and the cleaning gear set and the cleaning rack are in transmission connection.

[0007] By adopting the technical scheme, the cleaning equipment realizes vertical process arrangement from strong acid pre-cleaning, ultrapure water circulation cleaning to hot air drying in structural configuration, and improves wafer cleaning efficiency and pollution isolation capacity. The ultrasonic strong acid cleaning mechanism is arranged at the lowermost position and is used for realizing preliminary strong acid decontamination. The ultrasonic strong acid cleaning mechanism is fastened to the cleaning body to ensure stability of the acid cleaning tank structure and avoid strong acid liquid leakage and vibration interference. The middle part is provided with a circulating water path cleaning mechanism. The circulating water path cleaning mechanism is fastened to the cleaning body and can provide a constant temperature flushing environment under temperature control adjustment to ensure cleaning thoroughness and water temperature uniformity. The top is provided with a drying cleaning mechanism. The drying cleaning mechanism is fastened to the cleaning body rigidly to improve whole machine shock resistance and rigidity. The temperature control mechanism is arranged at one side of the body and is fastened to the body. The temperature control mechanism is used for maintaining temperature stability of each cleaning medium in the whole cleaning process through circulating water or a heating module to effectively prevent thermal stress damage to the wafer caused by temperature difference impact. The pre-cleaning motor drives the cleaning gear set through the motor shaft to drive the cleaning rack on the cleaning gear set to rotate, thereby driving the wafer to rotate, using centrifugal force to effectively shake off impurities and liquid drops attached to the wafer surface, improving cleaning and drying efficiency, and making the wafer connected with the cleaning rack rotate continuously to realize "rotating while cleaning", so that the cleaning equipment forms a cleaning-rinsing-drying process flow from bottom to top, conforms to gravity cooperative conveying logic, improves cleaning efficiency and system compactness, and significantly enhances cleaning quality, consistency and reliability of the equipment through rigid connection among the multiple mechanisms to improve overall structural stability and sealing performance.

[0008] Further, the ultrasonic strong acid cleaning mechanism includes a wafer cleaning glass tank, an ultrasonic cleaning tank, an ultrasonic device, and a wafer lifting assembly. The wafer cleaning glass tank and the ultrasonic cleaning tank are fastened together. The ultrasonic cleaning tank is provided with an ultrapure water inlet and an ultrapure water outlet. The cross-sectional area of the ultrapure water inlet is larger than that of the ultrapure water outlet. The wafer cleaning glass tank is used for strong acid cleaning liquid accommodation. The ultrasonic cleaning tank is used for ultrapure water medium accommodation. The ultrapure water inlet and the ultrasonic cleaning tank are communicated. The ultrasonic cleaning tank and the ultrapure water outlet are communicated. The wafer lifting assembly and the ultrasonic cleaning tank are fastened together. The ultrasonic device and the ultrasonic cleaning tank are fastened together. The ultrasonic device is located in the ultrasonic cleaning tank.

[0009] By adopting the technical scheme, the ultrasonic strong acid cleaning mechanism realizes efficient switching and segmented cleaning operation of the wafer in strong acid and ultrapure water media. The wafer cleaning glass tank is used as a strong acid cleaning liquid containing tank body, adopts acid-resistant transparent material, is convenient for observing the cleaning process and bearing high corrosive liquid; the ultrasonic cleaning tank is used for containing ultrapure water medium, and is provided with an ultrapure water inlet and an ultrapure water outlet. The inlet cross-sectional area is larger than the outlet cross-sectional area, an internal pressure difference is formed during the cleaning process, the ultrapure water forms a stable flow field from top to bottom, the flushing efficiency is improved, and liquid stagnation is avoided; the ultrapure water inlet is in communication with the ultrasonic cleaning tank, the high-purity water source is quickly injected into the cleaning tank, the outlet is connected with an external discharge channel, and impurities are beneficial to being carried out with water flow in time; the ultrasonic device is tightly installed in the ultrasonic cleaning tank, liquid cavitation effect is excited by high-frequency oscillation, and the wafer surface micro-particles and residues are stripped and dispersed; the wafer lifting assembly is tightly connected with the ultrasonic cleaning tank, the wafer realizes up-down switching operation between the glass tank and the ultrasonic cleaning tank, segmented cleaning is realized in different liquid environments, the multi-level cleaning and the complete decontamination are improved, and the overall cleaning precision and cleanliness level are improved.

[0010] Further, the wafer lifting assembly includes a lifting rod, a lifting hydraulic cylinder, a switching disc and a first suction disc, the lifting rod, the switching disc and the first suction disc are made of strong acid-resistant material, the lifting hydraulic cylinder is tightly connected with the ultrasonic cleaning tank, the lifting hydraulic cylinder and the lifting rod are in transmission connection, the lifting rod and the first suction disc are in transmission connection, the switching disc and the lifting rod are tightly connected, the switching disc and the circulating water path cleaning mechanism are in abutment, and the switching disc is in a spherical segment shape.

[0011] By adopting the above technical scheme, the wafer lifting assembly realizes high-precision vertical switching and position docking between the strong acid cleaning tank and the circulating water path cleaning mechanism, and improves the continuity and linkage efficiency of the cleaning process. The lifting hydraulic cylinder is tightly connected with the ultrasonic cleaning tank, and serves as a driving core. The lifting hydraulic cylinder drives the lifting rod to move up and down through a hydraulic drive mode. The lifting rod is made of strong acid-resistant material, which ensures long-term operation without corrosion and deformation in a strong acid environment. One end of the lifting rod is in transmission connection with the hydraulic cylinder, and the other end is in transmission connection with the first suction cup, so that the suction cup can be lifted synchronously with the lifting rod. The first suction cup is also made of strong acid-resistant material and has a vacuum adsorption function, which is used to stably hold the wafer and avoid displacement or damage during cleaning. The switching disc is tightly connected with the lifting rod and moves together with the lifting rod. The switching disc has a spherical segment shape and can be accurately butted with the circulating water path cleaning mechanism above during vertical lifting, so as to realize liquid environment conversion and structure alignment in the cleaning process. The spherical segment structure of the switching disc has self-guiding capability during docking and separation, which improves the stability and sealing performance of linkage transition. The overall structure ensures efficient lifting, transfer and sealing adaptation of the wafer in the multi-medium cleaning path, and achieves the technical effects of improving cleaning efficiency, reducing pollution transfer risk and enhancing system automatic control.

[0012] Further, the circulating water path cleaning mechanism includes an iris assembly, a circulating box and an adjusting assembly. The iris assembly and the adjusting assembly are tightly connected. The adjusting assembly is in communication with the circulating box and the temperature control mechanism. The circulating box is tightly connected with the cleaning body. The circulating box is provided with a circulating cavity. The circulating cavity has a spherical segment shape. The adjusting assembly is located in the circulating cavity.

[0013] By adopting the above technical scheme, the circulating water path cleaning mechanism can realize accurate control of the flow, direction and temperature of the cleaning liquid, thereby ensuring the stability and cleanliness of the wafer during rinsing. The circulating box as the main structure is tightly connected with the cleaning body, provides rigid support and carries the cleaning liquid circulating system. The circulating box is provided with a circulating cavity. The circulating cavity has a spherical segment structure, so that the internal liquid flow path is uniformly distributed and avoids turbulent accumulation, which helps to realize flow field stability and efficient flushing. The adjusting assembly is arranged in the circulating cavity and realizes internal flow regulation through spatial cooperation with the circulating cavity. The adjusting assembly is in communication with the circulating box and the temperature control mechanism, and realizes temperature regulation of the cleaning liquid entering the circulating cavity. The iris assembly is tightly connected with the adjusting assembly, and plays a role in aperture transformation and precise flow control. The flushing intensity can be adjusted in real time according to the cleaning requirements. The overall structure realizes multivariate linkage control of the ultrapure water flushing path through the dynamic response of the adjusting assembly in the circulating cavity. Combined with the mechanical flow limiting function of the iris assembly and the thermal regulation ability of the temperature control mechanism, the entire rinsing process is carried out under stable temperature, constant flow rate and uniform distribution, thereby effectively improving the wafer surface residual liquid removal efficiency, reducing the risk of particle deposition, and improving the controllability and repeatability of the cleaning process.

[0014] Further, the adjusting assembly comprises a rotating block, a sliding block, a rotating motor and a magnetoelastic element, the rotating block is in a spherical segment shape, the rotating block is rotatably connected with the circulating cavity, the sliding block is slidably connected with the rotating block, the iris assembly is fixedly connected with the sliding block, the rotating block is provided with a sliding groove in a circular arc shape, the sliding block is located in the sliding groove, the sliding block is four in number, every two sliding blocks are fixedly connected with the magnetoelastic element, the sliding block is in communication with the circulating cavity, the rotating motor is fixedly connected with the circulating box, and the rotating motor is in transmission connection with the rotating block.

[0015] By adopting the above technical scheme, the adjusting assembly realizes dynamic controllable adjustment of the circulating water flow passage and flow rate through mechanical linkage and magnetoelastic adjustment mechanism, so that the flow rate consistency and temperature control precision in the cleaning process are further improved. The rotating block is in a spherical segment shape and is rotatably connected with the circulating cavity, and serves as a core rotating shaft component of the adjusting assembly, and rotation of the rotating block drives the internal structure to realize flow passage adjustment; the rotating block is provided with a circular arc sliding groove, four sliding blocks are arranged in the sliding groove, the sliding blocks can slide in a tangential direction along the circular arc groove, and the radial displacement unit of the adjusting structure is formed; every two sliding blocks are rigidly connected through the magnetoelastic element, and when the magnetoelastic element is in extension and contraction response under the action of an external temperature control signal, the connected sliding blocks are driven to slide synchronously, so that fine control of the flow passage opening degree is realized. The sliding block is in communication with the circulating cavity and can directly affect the liquid flow passage, and cooperates with the flow limiting aperture of the iris assembly to jointly complete grading control of the flushing intensity. The iris assembly is fixedly connected with the sliding block in a fastening manner, the iris through hole position moves accurately with the sliding block, and dynamic variable diameter of the flow passage is formed. The rotating motor is fixedly installed on the circulating box and is in transmission connection with the rotating block, drives the rotating block to rotate, and thus drives the sliding block to realize preliminary positioning and coarse adjustment; fine adjustment is completed by the magnetoelastic element to realize micro displacement correction. The above structure forms a multi-stage cooperative adjustment mechanism of "rotating block driving + sliding block displacement + magnetoelastic response + iris flow limiting", not only realizes composite control of the cleaning liquid flow rate, passage angle and cross section shape, but also improves the response speed and flexible adjustment ability of the system to different cleaning stages, effectively enhances the cleaning uniformity and liquid thermal field stability.

[0016] Further, the circulating box is provided with a partition plate, and the partition plate is located at the center of the circulating cavity.

[0017] By adopting the technical scheme, the partition plate structure arranged on the circulating box makes the internal liquid flow form stable distribution when flowing through the circulating cavity, effectively improving the uniform distribution effect of the cleaning liquid. The partition plate is arranged at the spherical center section of the circulating cavity, serving as a geometric reference surface of flow field symmetry, which can divide the liquid regulated by the regulating assembly into two symmetrical flow areas, avoiding local turbulent flow aggregation or impact deviation. In specific implementation, the partition plate is made of rigid temperature-resistant material and is fixed to the inner wall of the circulating box by embedding groove or welding, and its position is accurately located at the spherical center section of the circulating cavity, ensuring that it plays a role in stabilizing the central flow direction and straightening the guide in the flow path. In the working process, the cleaning liquid enters the circulating cavity after being regulated by the regulating assembly, and is guided by the partition plate to enter multiple uniform paths, thereby improving the hydraulic symmetry and surface coverage range in the washing process, effectively avoiding cleaning dead angles or uneven washing. This structure further improves the control accuracy of the regulating assembly on the fluid direction and flow rate, cooperates with the iris assembly to form a spatial multi-point distributed spraying mode, significantly improves the cleaning efficiency and repeatability, and ensures that the wafer surface is uniformly stressed and the cleanliness consistency is consistent.

[0018] Further, the drying cleaning mechanism includes a rotary motor, a rotating rod, a second suction disc, a lower moving hydraulic cylinder, a gear set, a gear frame, a fan and a drying box, the rotary motor and the gear frame are fastened, the rotary motor and the gear set are rotationally connected, the gear set and the rotating rod are transmissionally connected, the second suction disc and the rotating rod are fastened, the lower moving hydraulic cylinder and the drying box are fastened, the lower moving hydraulic cylinder and the gear frame are transmissionally connected, and the drying box and the cleaning body are fastened.

[0019] By adopting the above technical scheme, the drying and cleaning mechanism realizes rapid, efficient and uniform drying treatment of the cleaned wafer through the combination of rotary clamping and hot air drying. The rotary motor is fixed on the gear frame and serves as a power source to realize rotary connection with the gear set through the rotary output shaft. The gear set transmits rotary power to the rotating rod to drive the second suction cup fixedly connected thereto to rotate, thereby realizing synchronous rotation operation of the clamped wafer. The rotary action can make the wafer surface liquid quickly discharge under the action of centrifugal force, reducing the drying time and residual liquid amount. The lower displacement hydraulic cylinder is fixedly connected with the drying box and is in transmission connection with the gear frame, and bears the lifting action of vertically moving the gear frame and the connected rotating structure into or out of the drying box, realizing accurate positioning and height adjustment of the wafer from the cleaning position to the drying cavity. The fan as a hot air supply device is arranged on one side of the drying box to provide directional airflow to the inside of the drying cavity, promoting the evaporation and removal of residual moisture on the wafer surface, and realizing uniform blowing and drying of the whole surface in cooperation with the rotary action. The drying box and the cleaning body are fixedly connected to form a closed drying space, which has good heat preservation and dust prevention performance, effectively avoiding secondary pollution during the drying process. The overall structure forms a multi-effect linkage drying system of "vertical transfer + rotary drive + hot air drying", which not only improves the drying efficiency and uniformity, but also ensures the stable operation of the whole equipment through the compact mechanical layout, further ensuring the cleanliness and integrity of the wafer at the end of the cleaning process.

[0020] Further, the temperature control mechanism includes a temperature sensor, a circulation pipe, a cooling box, a circulation pump and a heating box. The temperature sensor is fixedly connected with the cleaning body. The circulation pipe is spiral. The circulation pipe and the sliding block are in communication. The circulation pipe and the circulation pump are in communication. The circulation pump and the heating box are in communication. The heating box and the cooling box are in communication. The cooling box and the circulation pipe are in communication.

[0021] By adopting the technical scheme, the temperature sensor is fastened to the cleaning machine body, the temperature state in the key area of the equipment is monitored in real time, and data is fed back to the control system for closed-loop adjustment; the circulating pipe is in a spiral structure, the heat transfer area is increased and the heat exchange path is prolonged, the cooling or heating efficiency is improved, one end of the circulating pipe is communicated with the sliding block, the heat regulating liquid flowing through can directly act on the adjusting assembly, and fine adjustment control of the temperature of the cleaning liquid passage is realized. The circulating pipe is communicated with the circulating pump, the circulating pump provides continuous power to drive the temperature control liquid to circulate in the system, the circulating pump is connected to the heating box, the heating box is used as a high temperature source to heat the circulating liquid, and when the temperature is lower than the set value, heating is started to improve the overall temperature of the system; the heating box is communicated with the cooling box, the cooling box realizes the cooling effect through the built-in refrigerant or the heat exchange plate, when the temperature of the system is too high, the circulating liquid is guided into the cooling section to release heat, and finally the cooled liquid returns to the circulating pipe to form a constant temperature closed loop adjustment circuit. The structure utilizes the local feedback node composed of the temperature sensor and the spiral circulating pipe, combines the double-channel heat source adjustment of the heating box and the cooling box, improves the temperature control precision, has good response speed and heat inertia control ability, thereby effectively avoiding the thermal stress impact on the wafer caused by the cold and hot fluctuation of the cleaning liquid, and further improves the cleaning stability and process consistency.

[0022] Compared with the prior art, the beneficial effects of the present application are: The cleaning equipment is composed of a dynamic adjusting assembly formed by a circulating cavity, a ball-like missing rotating block and a sliding block in a circular sliding groove, and a linkage regulating system formed by an iris assembly and a magnetoelastic element. The four sliding blocks are connected in pairs by the magnetoelastic element and are synchronously displaced along the sliding groove under the rotary drive of the rotating block, so that the gradual opening adjustment of the flow-through passage is realized. The sliding block is in communication with the circulating cavity and accurately drives the iris assembly to change the flushing through-hole form, and in combination with the heat exchange effect of the spiral circulating pipe, linkage adjustment can be realized in three aspects of liquid flow direction, speed and heat conduction path, and the flow field uniformity and temperature control stability are significantly improved. The multi-level structure with the ball-like missing rotating block as the core is superior to the traditional linear throttle plate in control accuracy and flexible response; the wafer lifting assembly drives the lifting rod to move vertically by a lifting hydraulic cylinder, the first suction cup clamps the wafer and connects the circulating waterway cleaning mechanism through a switching disc. The switching disc is designed in a ball-like missing shape, and in combination with the rigid abutting characteristics between the switching disc and the circulating cavity, a stable and self-guiding sealing positioning can be formed during the up-and-down movement of the wafer, so that the seamless transition of the cleaning medium and the minimum positioning error are ensured. The structure relies on geometric self-matching and anti-interference ball-and-groove positioning to replace the photoelectric or sensing identification mode, realizes the accurate transfer of the wafer from strong acid to pure water environment, effectively avoids cross contamination and liquid interference, and is suitable for multi-stage liquid phase processing scenes; the rotary motor in the drying and cleaning mechanism drives the gear set to drive the rotating rod, so that the second suction cup clamps the wafer to rotate at high speed, and in combination with the fan providing directional hot air from one side of the drying box, a composite drying mode of "rotary centrifugation + hot air surrounding flow" is formed. The rotary action centrifugally separates the water, and the drying air flow covers the wafer in the radial direction, so that the drying efficiency is significantly improved. The gear frame is in transmission connection with the lower displacement hydraulic cylinder, so that the wafer assembly can be accurately moved into the closed space in the drying box, so that the hot air is prevented from escaping and the risk of external particle pollution is reduced. Compared with the static hot air drying device, the mechanical linkage structure has the advantages of short drying time, uniform coverage and low pollution risk, and is especially suitable for wafer manufacturing scenes with extremely high cleanliness requirements. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a general structure schematic diagram of the present application; Figure 2 It is a cleaning rack structure schematic diagram of the present application; Figure 3 It is an ultrasonic strong acid cleaning mechanism structure schematic diagram of the present application; Figure 4 It is an ultrasonic cleaning tank structure schematic diagram of the present application; Figure 5 It is a wafer lifting assembly structure schematic diagram of the present application; Figure 6 It is a circulating waterway cleaning mechanism structure schematic diagram of the present application; Figure 7 It is an adjusting assembly structure schematic diagram of the present application; Figure 8A schematic diagram of the rotating motor structure of the present application is shown in the figure. Figure 9 A schematic diagram of the drying cleaning mechanism structure of the present application is shown in the figure.

[0024] In the figure: 1, ultrasonic strong acid cleaning mechanism; 11, wafer cleaning glass tank; 12, ultrasonic cleaning tank; 121, ultrapure water inlet; 122, ultrapure water outlet; 13, ultrasonic device; 14, wafer lifting assembly; 141, lifting rod; 142, lifting hydraulic cylinder; 143, switching disc; 144, first suction disc; 2, circulating waterway cleaning mechanism; 21, iris assembly; 22, circulating tank; 221, circulating cavity; 222, partition plate; 23, adjusting assembly; 231, rotating block; 2311, sliding groove; 232, sliding block; 233, rotating motor; 234, magnetoelastic element; 3, drying cleaning mechanism; 31, rotating motor; 32, rotating rod; 33, second suction disc; 34, downward moving hydraulic cylinder; 35, gear set; 36, gear frame; 37, fan; 38, drying tank; 4, temperature control mechanism; 41, temperature sensor; 42, circulating pipe; 43, cooling tank; 44, circulating pump; 45, heating tank; 5, cleaning machine body; 6, cleaning rack; 7, cleaning rack gear; 8, cleaning gear set; 9, pre-cleaning motor. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0026] Please refer to Figure 1 - Figure 9 As shown in the figure, the present application provides a wafer cleaning equipment technical solution with flow rate regulation function: The cleaning equipment includes ultrasonic strong acid cleaning mechanism 1, circulating waterway cleaning mechanism 2, drying cleaning mechanism 3, temperature control mechanism 4 and cleaning machine body 5, the ultrasonic strong acid cleaning mechanism 1 and the cleaning machine body 5 are fastened and connected, the circulating waterway cleaning mechanism 2 and the cleaning machine body 5 are fastened and connected, the drying cleaning mechanism 3 and the cleaning machine body 5 are fastened and connected, the temperature control mechanism 4 and the cleaning machine body 5 are fastened and connected, the ultrasonic strong acid cleaning mechanism 1 is located below the circulating waterway cleaning mechanism 2, the drying cleaning mechanism 3 is located above the circulating waterway cleaning mechanism 2, the cleaning equipment further includes pre-cleaning rack 6, cleaning rack gear 7, cleaning gear set 8 and pre-cleaning motor 9, the pre-cleaning rack 6 and the drying cleaning mechanism 3 are fastened and connected, the pre-cleaning motor 9 and the pre-cleaning rack 6 are fastened and connected, the pre-cleaning motor 9 and the cleaning gear set 8 are in transmission connection, the cleaning gear set 8 and the cleaning rack gear 7 are in transmission connection.

[0027] By adopting the above technical scheme, the cleaning equipment realizes vertical process arrangement from strong acid pre-cleaning, ultrapure water circulation cleaning to hot air drying in the structural configuration, and improves the wafer cleaning efficiency and pollution isolation capacity. The ultrasonic strong acid cleaning mechanism 1 is arranged at the lowermost position and is used for realizing preliminary strong acid decontamination. The ultrasonic strong acid cleaning mechanism 1 is fastened and connected with the cleaning body 5, so as to ensure the stability of the acid cleaning tank structure and avoid strong acid liquid leakage and vibration interference. The middle part is provided with a circulating water path cleaning mechanism 2, which is fastened and connected with the cleaning body 5 and can provide a constant temperature washing environment under temperature control adjustment, so as to ensure the thoroughness and water temperature uniformity of cleaning. The top is provided with a drying cleaning mechanism 3, which is fastened and connected with the cleaning body 5 rigidly, and improves the anti-shock performance and rigidity of the whole machine. The temperature control mechanism 4 is arranged on one side of the machine body and is fastened and connected with the machine body, and is used for maintaining the temperature stability of each cleaning medium in the whole cleaning process through the circulating water or heating module, so as to effectively prevent the thermal stress damage to the wafer caused by temperature difference impact. The pre-cleaning motor 9 drives the cleaning gear set 8 through the motor shaft, so as to drive the cleaning rack 7 on the cleaning gear set 8 to rotate, thereby driving the wafer to rotate, using the centrifugal force to effectively shake off the impurities and liquid drops attached to the surface of the wafer, improving the cleaning and drying efficiency, and making the wafer connected with the cleaning rack 7 rotate continuously, realizing "rotating while cleaning", so that the cleaning equipment forms a cleaning-washing-drying process flow from bottom to top, which conforms to the gravity cooperative conveying logic, improves the cleaning efficiency and system compactness, and improves the overall structural stability and sealing performance through the rigid connection between the multiple mechanisms, thereby significantly enhancing the cleaning quality, consistency and reliability of the equipment.

[0028] Further, the ultrasonic strong acid cleaning mechanism 1 comprises a wafer cleaning glass tank 11, an ultrasonic cleaning tank 12, an ultrasonic device 13 and a wafer lifting assembly 14. The wafer cleaning glass tank 11 and the ultrasonic cleaning tank 12 are fastened and connected. The ultrasonic cleaning tank 12 is provided with an ultrapure water inlet 121 and an ultrapure water outlet 122. The cross-sectional area of the ultrapure water inlet 121 is greater than that of the ultrapure water outlet 122. The wafer cleaning glass tank 11 is used for containing strong acid cleaning liquid, and the ultrasonic cleaning tank 12 is used for containing ultrapure water medium. The ultrapure water inlet 121 and the ultrasonic cleaning tank 12 are communicated, and the ultrasonic cleaning tank 12 and the ultrapure water outlet 122 are communicated. The wafer lifting assembly 14 and the ultrasonic cleaning tank 12 are fastened and connected, the ultrasonic device 13 and the ultrasonic cleaning tank 12 are fastened and connected, and the ultrasonic device 13 is located in the ultrasonic cleaning tank 12.

[0029] By adopting the technical scheme, the ultrasonic strong acid cleaning mechanism 1 realizes efficient switching and segmented cleaning operation of the wafer in strong acid and ultrapure water media. The wafer cleaning glass tank 11 is used as a strong acid cleaning liquid containing tank body, adopts acid-resistant transparent material, is convenient for observing the cleaning process and can withstand high corrosive liquid. The ultrasonic cleaning tank 12 is used for containing ultrapure water medium, and is provided with an ultrapure water inlet 121 and an ultrapure water outlet 122. The inlet cross-sectional area is larger than the outlet cross-sectional area, an internal pressure difference is formed during the cleaning process, the ultrapure water forms a stable flow field from top to bottom, the flushing efficiency is improved, and liquid stagnation is avoided. The ultrapure water inlet 121 is in communication with the ultrasonic cleaning tank 12, the high-purity water source is quickly injected into the cleaning tank, the outlet is connected to the external discharge channel, and the impurities are carried out with the water flow in time. The ultrasonic device 13 is tightly installed in the ultrasonic cleaning tank 12, and the liquid is excited to produce cavitation effect through high-frequency oscillation, and the wafer surface micro-particles and residues are stripped and dispersed. The wafer lifting assembly 14 is tightly connected with the ultrasonic cleaning tank 12, so that the wafer realizes up-down switching operation between the glass tank and the ultrasonic cleaning tank 12, and is segmented cleaned in different liquid environments, the multi-level cleaning and the complete decontamination are improved. The rigid support is constructed through the fastening connection mode between the parts, the structural stability and the sealing reliability in the cleaning process are ensured, and then the combined removal of the wafer surface particle pollution, organic pollution and chemical residues is realized, and the overall cleaning precision and cleanliness level are significantly improved.

[0030] Further, the wafer lifting assembly 14 includes a lifting rod 141, a lifting hydraulic cylinder 142, a switching disc 143 and a first suction disc 144. The lifting rod 141, the switching disc 143 and the first suction disc 144 are made of strong acid-resistant material. The lifting hydraulic cylinder 142 is tightly connected with the ultrasonic cleaning tank 12. The lifting hydraulic cylinder 142 and the lifting rod 141 are in transmission connection. The lifting rod 141 and the first suction disc 144 are in transmission connection. The switching disc 143 and the lifting rod 141 are tightly connected. The switching disc 143 and the circulating water path cleaning mechanism 2 are in abutment. The switching disc 143 is in a spherical shape.

[0031] By adopting the above technical scheme, the wafer lifting assembly 14 realizes high-precision vertical switching and position docking between the strong acid cleaning tank and the circulating water path cleaning mechanism 2, improving the continuity and linkage efficiency of the cleaning process. The lifting hydraulic cylinder 142 is tightly connected with the ultrasonic cleaning tank 12 and serves as the driving core. The lifting hydraulic cylinder 142 drives the lifting rod 141 to move up and down through hydraulic drive. The lifting rod 141 is made of strong acid-resistant material, ensuring long-term operation without corrosion and deformation in a strong acid environment. One end of the lifting rod 141 is connected with the hydraulic cylinder, and the other end is connected with the first suction cup 144, so that the suction cup can be lifted synchronously with the lifting rod 141. The first suction cup 144 is also made of strong acid-resistant material and has a vacuum adsorption function, which is used to firmly hold the wafer to avoid displacement or damage during cleaning. The switching disc 143 is tightly connected with the lifting rod 141 and moves with the lifting rod 141. The switching disc 143 has a spherical segment shape and can accurately abut against the circulating water path cleaning mechanism 2 above during vertical lifting, realizing liquid environment conversion and structure alignment in the cleaning process. The spherical segment structure of the switching disc 143 has self-guiding capability during docking and separation, improving the stability and sealing performance of linkage transition. The overall structure ensures efficient lifting, transfer and sealing adaptation of the wafer in the multi-medium cleaning path, achieving the technical effects of improving cleaning efficiency, reducing pollution transfer risk and enhancing system automatic control.

[0032] Further, the circulating water path cleaning mechanism 2 includes an iris assembly 21, a circulating box 22 and an adjusting assembly 23. The iris assembly 21 and the adjusting assembly 23 are tightly connected, the adjusting assembly 23 and the circulating box 22 are communicated, the adjusting assembly 23 and the temperature control mechanism 4 are communicated, the circulating box 22 and the cleaning body 5 are tightly connected, the circulating box 22 is provided with a circulating cavity 221, the circulating cavity 221 is in a spherical segment shape, and the adjusting assembly 23 is located in the circulating cavity 221.

[0033] By adopting the above technical scheme, the circulating water path cleaning mechanism 2 can realize accurate control of the cleaning liquid flow, direction and temperature, thereby guaranteeing the stability and cleanliness of the wafer in the rinsing process. The circulating box 22 is fastened to the cleaning machine body 5 as the main structure, provides rigid support and carries the cleaning liquid circulating system, is provided with a circulating cavity 221, the circulating cavity 221 is a spherical segment structure, the internal liquid flow path is uniformly distributed and avoids turbulent accumulation, which helps to realize flow field stability and efficient flushing. The adjusting assembly 23 is arranged inside the circulating cavity 221 and realizes internal flow regulation through spatial cooperation with the circulating cavity 221. The assembly is in communication with the circulating box 22 and at the same time in communication with the temperature control mechanism 4, realizing temperature regulation of the cleaning liquid entering the circulating cavity 221. The iris assembly 21 is fastened to the adjusting assembly 23, plays a role in aperture transformation and precise flow control, and can adjust the flushing intensity in real time according to the cleaning requirements. The overall structure realizes multivariable linkage control of the ultrapure water flushing path through the dynamic response of the adjusting assembly 23 in the circulating cavity 221, and combines the mechanical flow limiting function of the iris assembly 21 and the thermal regulation ability of the temperature control mechanism 4, so that the whole rinsing process is carried out at a stable temperature, constant flow rate and uniform distribution, thereby effectively improving the wafer surface residual liquid removal efficiency, reducing the risk of particle deposition, and improving the controllability and repeatability of the cleaning process.

[0034] Further, the adjusting assembly 23 includes a rotating block 231, a sliding block 232, a rotating motor 233 and a magnetoelastic element 234. The rotating block 231 is a spherical segment shape. The rotating block 231 is rotatably connected to the circulating cavity 221. The sliding block 232 is slidably connected to the rotating block 231. The iris assembly 21 is fastened to the sliding block 232. The rotating block 231 is provided with a sliding groove 2311 in the form of a circular arc. The sliding block 232 is located in the sliding groove 2311. The sliding block 232 has four sliding blocks. Each two sliding blocks 232 are fastened to the magnetoelastic element 234. The sliding block 232 is in communication with the circulating cavity 221. The rotating motor 233 is fastened to the circulating box 22. The rotating motor 233 is in transmission connection with the rotating block 231.

[0035] By adopting the above technical scheme, the adjusting assembly 23 realizes dynamic controllable adjustment of the circulating water flow passage and flow rate through mechanical linkage and magnetoelastic adjusting mechanism, thereby further improving flow rate consistency and temperature control precision in the cleaning process. The rotating block 231 is a spherical segment structure and is rotationally connected with the circulating cavity 221, serving as a core rotating shaft component of the adjusting assembly 23. Rotation of the rotating block 231 drives the internal structure to realize flow passage adjustment. The rotating block 231 is provided with an arc-shaped sliding groove 2311, and four sliding blocks 232 are arranged in the groove. The sliding blocks 232 can slide in the tangential direction of the arc-shaped groove for adjustment, thereby constituting a radial displacement unit of the adjusting structure. Each two sliding blocks 232 are rigidly connected through a magnetoelastic element 234. When the magnetoelastic element 234 is subjected to extension and contraction response under the action of an external temperature control signal, the connected sliding blocks 232 are synchronously driven to slide, thereby realizing fine control of the flow passage opening degree. The sliding blocks 232 are in communication with the circulating cavity 221 and can directly affect the liquid flow passage, and cooperate with the flow-limiting apertures of the iris assembly 21 to jointly complete staged control of the flushing intensity. The iris assembly 21 is fixed to the sliding block 232 in a fastening manner, so that the position of the iris through hole is accurately moved with the sliding block 232, thereby forming dynamic variable diameter of the flow passage. The rotating motor 233 is fixedly installed on the circulating box 22 and is drivingly connected with the rotating block 231, thereby driving the rotating block 231 to rotate and drive the sliding blocks 232 to realize preliminary positioning and coarse adjustment. Fine adjustment is completed by the magnetoelastic element 234 for micro-displacement correction. The above structure forms a multi-stage coordinated adjusting mechanism of “rotating block 231 driving + sliding block 232 displacement + magnetoelastic response + iris flow limiting”, which not only realizes composite control of the cleaning liquid flow rate, passage angle and cross-sectional shape, but also improves the response speed and flexible adjusting capability of the system to different cleaning stages, thereby effectively enhancing cleaning uniformity and liquid thermal field stability.

[0036] Further, the circulating box 22 is provided with a partition plate 222, and the cross section where the partition plate 222 is located is located at the center of the circulating cavity 221.

[0037] By adopting the above technical scheme, the partition plate 222 arranged on the circulating box 22 forms stable flow distribution when the internal liquid flows through the circulating cavity 221, effectively improving the uniform distribution effect of the cleaning liquid. The partition plate 222 is arranged at the spherical center section of the circulating cavity 221, serving as a geometric reference surface of flow field symmetry, which can divide the liquid regulated by the adjusting assembly 23 into two symmetrical flow areas, avoiding local turbulent flow aggregation or impact deviation. In specific implementation, the partition plate 222 is made of rigid temperature-resistant material and is fixed in the inner wall of the circulating box 22 by embedding groove or welding, and its position is accurately located at the spherical center section of the circulating cavity 221, ensuring that it plays a role in stabilizing the central flow direction and guiding the flow. In the working process, the cleaning liquid regulated by the adjusting assembly 23 enters the circulating cavity 221 and is guided by the partition plate 222 to flow into multiple uniform paths, thereby improving the hydraulic symmetry and surface coverage range in the washing process, effectively avoiding cleaning dead angles or uneven washing. This structure further improves the control accuracy of the adjusting assembly 23 on the fluid direction and flow rate, cooperates with the iris assembly 21 to form a spatial multi-point distributed spraying mode, significantly improves the cleaning efficiency and repeatability, and ensures that the wafer surface is uniformly stressed and the cleanliness consistency is consistent.

[0038] Further, the dry cleaning mechanism 3 comprises a rotating motor 31, a rotating rod 32, a second suction cup 33, a lower moving hydraulic cylinder 34, a gear set 35, a gear frame 36, a fan 37 and a drying box 38. The rotating motor 31 and the gear frame 36 are fastened, the rotating motor 31 and the gear set 35 are rotationally connected, the gear set 35 and the rotating rod 32 are transmissionally connected, the second suction cup 33 and the rotating rod 32 are fastened, the lower moving hydraulic cylinder 34 and the drying box 38 are fastened, the lower moving hydraulic cylinder 34 and the gear frame 36 are transmissionally connected, and the drying box 38 and the cleaning body 5 are fastened.

[0039] By adopting the above technical scheme, the drying and cleaning mechanism 3 realizes rapid, efficient and uniform drying treatment of the cleaned wafer through the combination of rotary clamping and hot air drying. The rotary motor 31 is fixed on the gear frame 36 and serves as a power source to realize rotary connection with the gear set 35 through a rotary output shaft. The gear set 35 transmits rotary power to the rotary rod 32 to drive the second suction cup 33 fixedly connected thereto to rotate, thereby realizing synchronous rotation operation of the clamped wafer. The rotary action can make the wafer surface liquid quickly discharge under the action of centrifugal force, reducing the drying time and residual liquid amount. The lower displacement hydraulic cylinder 34 is fixedly connected with the drying box 38 and is in transmission connection with the gear frame 36, and bears the lifting action of vertically moving the gear frame 36 and the connected rotary structure into or out of the drying box 38, realizing precise positioning and height adjustment of the wafer from the cleaning position to the drying cavity. The fan 37 as a hot air supply device is arranged on one side of the drying box 38 to provide directional airflow to the inside of the drying cavity, promote the evaporation and removal of the residual moisture on the wafer surface, and realize uniform blowing and drying of the whole surface in cooperation with the rotary action. The drying box 38 is fixedly connected with the cleaning body 5 to form a closed drying space, which has good heat preservation and dust prevention performance, effectively avoiding secondary pollution during drying. The overall structure forms a multi-effect linkage drying system of "vertical transfer + rotary drive + hot air drying", which not only improves the drying efficiency and uniformity, but also ensures the stable operation of the whole equipment through the compact mechanical layout, further ensuring the cleanliness and integrity of the wafer at the end of the cleaning process.

[0040] Further, the temperature control mechanism 4 includes a temperature sensor 41, a circulation pipe 42, a cooling box 43, a circulation pump 44 and a heating box 45. The temperature sensor 41 is fixedly connected with the cleaning body 5. The circulation pipe 42 is spiral. The circulation pipe 42 is in communication with the sliding block 232. The circulation pipe 42 is in communication with the circulation pump 44. The circulation pump 44 is in communication with the heating box 45. The heating box 45 is in communication with the cooling box 43. The cooling box 43 is in communication with the circulation pipe 42.

[0041] By adopting the technical scheme, the temperature sensor 41 is fastened to the cleaning machine body 5, the temperature state in the key area of the equipment is monitored in real time, and data is fed back to the control system for closed-loop regulation; the circulating pipe 42 has a spiral structure, the heat transfer area is increased and the heat exchange path is prolonged, the cooling or heating efficiency is improved, one end of the circulating pipe 42 is communicated with the sliding block 232, the heat regulating liquid flowing through can directly act on the adjusting assembly 23, and fine adjustment control of the temperature of the cleaning liquid channel is realized. The circulating pipe 42 is communicated with the circulating pump 44 at the same time, the circulating pump 44 provides continuous power to drive the temperature control liquid to circulate in the system; the circulating pump 44 is connected to the heating box 45, the heating box 45 is used as a high-temperature source to heat the circulating liquid, and heating is started when the temperature is lower than the set value, so that the overall temperature of the system is improved; the heating box 45 is communicated with the cooling box 43, the cooling box 43 realizes the cooling effect through the built-in refrigerant or the heat exchange plate, and when the temperature of the system is too high, the circulating liquid is guided into the cooling section to release heat, and finally the cooled liquid returns to the circulating pipe 42, forming a constant-temperature closed-loop regulation loop. The structure utilizes the local feedback node composed of the temperature sensor 41 and the spiral circulating pipe 42, combines the double-channel heat source regulation of the heating box 45 and the cooling box 43, improves the temperature control precision, has good response speed and heat inertia control ability at the same time, thereby effectively avoiding the thermal stress impact on the wafer caused by the cold and hot fluctuation of the cleaning liquid, and further improving the cleaning stability and process consistency.

[0042] The working principle of the present application is as follows: The cleaning device realizes the process sequence of cleaning, rinsing and drying from bottom to top in the structural layout. The ultrasonic strong acid cleaning mechanism 1 is placed at the bottom, which can remove stubborn contamination of the wafer in the strong acid liquid by ultrasonic action. The circulating water cleaning mechanism 2 is placed above the ultrasonic strong acid cleaning mechanism 1, which is convenient for rinsing and cleaning with ultrapure water immediately after strong acid cleaning, avoiding corrosion or pollution caused by acid residue. The drying cleaning mechanism 3 is placed at the top, which can quickly dry the cleaned wafer through the fan 37 and the rotating assembly, avoiding water stains. The wafer cleaning glass tank 11 is used to hold strong acid cleaning liquid, which has good acid resistance and observation. The ultrasonic cleaning tank 12 is used to hold ultrapure water, which is provided with an ultrasonic device 13 to excite liquid to produce high-frequency vibration. The inlet 121 and outlet of the ultrapure water form directional flow, and the cross-sectional area of the inlet is larger than that of the outlet to form a liquid pressure difference, which improves the cleaning flow rate and impurity discharge efficiency. The lifting rod 141 in the wafer lifting assembly 14 is driven by the lifting hydraulic cylinder 142 to move up and down, driving the acid-resistant first suction cup 144 to lift to clamp the wafer. The switching disc 143 is fastened with the lifting rod 141 and is in the shape of a spherical segment, which ensures the sealing and positioning between the circulating water cleaning mechanism 2 and the wafer lifting assembly 14. In the circulating water cleaning mechanism 2, the iris assembly 21 is used to adjust the size of the flushing aperture, and the adjusting assembly 23 is used to realize dynamic water flow control. The adjusting assembly 23 is composed of a rotating block 231, a sliding block 232 and a magnetoelastic element 234. The rotating block 231 is in the shape of a spherical segment and is rotatably connected with the circulating cavity 221. The sliding block 232 is embedded in the circular arc sliding groove 2311 and moves coordinately under the drive of the magnetoelastic element 234 to realize the aperture linkage adjustment of the iris assembly 21. The rotating motor 233 provides continuous power, and the sliding block 232 is in communication with the circulating cavity 221 to form a complete water path. The circulating cavity 221 is provided with a partition plate 222, and the cross section of the partition plate 222 is located at the center of the sphere to split and stabilize the pressure, realizing the symmetry of the flow field. The drying cleaning mechanism 3 drives the rotating rod 32 through the rotating motor 31 to drive the gear set 35, so that the second suction cup 33 clamps the wafer to rotate and dry. The lower hydraulic cylinder 34 drives the gear frame 36 to drive the wafer to enter and exit the drying box 38. The fan 37 provides dry air flow to ensure that there is no residual liquid drop on the surface of the wafer. The temperature control mechanism 4 detects the temperature of the cleaning area in real time through the temperature sensor 41. The circulating pipe 42 is spirally arranged in the cleaning path and is connected to the cooling box 43 and the heating box 45 to form a bidirectional temperature adjustment path. The circulating pump 44 drives the medium to circulate to ensure that the cleaning liquid is always in the ideal temperature zone, and the iris adjusting assembly 23 realizes closed-loop control of the cleaning temperature. In summary, the cleaning device can realize a multi-stage, quantitative and constant-temperature efficient wafer cleaning process, which has many advantages such as strong acid resistance, uniform cleaning, strong automatic adjustment capability and high drying efficiency.

[0043] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics of the present application. The embodiments should therefore be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims should be considered as limiting the scope of the claims with respect to the figures of the patent document.

Claims

1. A wafer cleaning device with flow rate control function, characterized in that: The cleaning device comprises an ultrasonic strong acid cleaning mechanism (1), a circulating water cleaning mechanism (2), a drying cleaning mechanism (3), a temperature control mechanism (4) and a cleaning body (5), wherein the ultrasonic strong acid cleaning mechanism (1) and the cleaning body (5) are tightly connected, the circulating water cleaning mechanism (2) and the cleaning body (5) are tightly connected, the drying cleaning mechanism (3) and the cleaning body (5) are tightly connected, the temperature control mechanism (4) and the cleaning body (5) are tightly connected, and the ultrasonic strong acid cleaning mechanism (1) is located in the circulating water cleaning mechanism. The drying cleaning mechanism (3) is located below the waterway cleaning mechanism (2), and the drying cleaning mechanism (3) is located above the circulating waterway cleaning mechanism (2). The cleaning device further comprises a pre-cleaning rack (6), a cleaning rack (7), a cleaning gear set (8) and a pre-cleaning motor (9). The pre-cleaning rack (6) and the drying cleaning mechanism (3) are fastened together, the pre-cleaning motor (9) and the pre-cleaning rack (6) are fastened together, the pre-cleaning motor (9) and the cleaning gear set (8) are transmission-connected, and the cleaning gear set (8) and the cleaning rack (7) are transmission-connected.

2. The wafer cleaning device with flow rate control function according to claim 1, characterized in that: The ultrasonic strong acid cleaning mechanism (1) comprises a wafer cleaning glass tank (11), an ultrasonic cleaning tank (12), an ultrasonic device (13) and a wafer lifting assembly (14); the wafer cleaning glass tank (11) and the ultrasonic cleaning tank (12) are fastened together; an ultrapure water inlet (121) is provided on the ultrasonic cleaning tank (12); an ultrapure water outlet (122) is provided on the ultrasonic cleaning tank (12); the cross-sectional area of ​​the ultrapure water inlet (121) is larger than the cross-sectional area of ​​the ultrapure water outlet (122); The wafer cleaning glass tank (11) is used to contain strong acid cleaning liquid, the ultrasonic cleaning tank (12) is used to contain ultrapure water medium, the ultrapure water inlet (121) is connected to the ultrasonic cleaning tank (12), the ultrasonic cleaning tank (12) is connected to the ultrapure water outlet (122), the wafer lifting assembly (14) is tightly connected to the ultrasonic cleaning tank (12), the ultrasonic device (13) is tightly connected to the ultrasonic cleaning tank (12), and the ultrasonic device (13) is located in the ultrasonic cleaning tank (12).

3. The wafer cleaning device with flow rate control function according to claim 2, characterized in that: The wafer lifting assembly (14) includes a lifting rod (141), a lifting hydraulic cylinder (142), a switching disk (143) and a first suction cup (144). The lifting rod (141), the switching disk (143) and the first suction cup (144) are all made of a strong acid-resistant material. The lifting hydraulic cylinder (142) and the ultrasonic cleaning tank (12) are fastened together. The lifting hydraulic cylinder (142) and the lifting rod (141) are transmission-connected. The lifting rod (141) and the first suction cup (144) are transmission-connected. The switching disk (143) and the lifting rod (141) are fastened together. The switching disk (143) and the circulating water cleaning mechanism (2) are in contact. The switching disk (143) is spherical.

4. The wafer cleaning device with flow rate control function according to claim 3, characterized in that: The circulating water cleaning mechanism (2) comprises an iris assembly (21), a circulation box (22) and an adjustment assembly (23); the iris assembly (21) and the adjustment assembly (23) are fastened together; the adjustment assembly (23) and the circulation box (22) are in communication; the adjustment assembly (23) and the temperature control mechanism (4) are in communication; the circulation box (22) and the cleaning body (5) are fastened together; a circulation cavity (221) is provided on the circulation box (22); the circulation cavity (221) is in a spherical segment shape; and the adjustment assembly (23) is located in the circulation cavity (221).

5. The wafer cleaning device with flow rate control function according to claim 4, characterized in that: The regulating assembly (23) includes a rotating block (231), a sliding block (232), a rotating motor (233) and a magnetoelastic member (234). The rotating block (231) is spherical. The rotating block (231) is rotatably connected to the circulation cavity (221). The sliding block (232) is slidably connected to the rotating block (231). The iris assembly (21) and the sliding block (232) are tightly connected. The rotating block (231) is provided with a sliding groove (234). 311), the sliding groove (2311) is arc-shaped, the sliding block (232) is located in the sliding groove (2311), there are four sliding blocks (232), every two sliding blocks (232) are fastened to the magnetoelastic member (234), the sliding blocks (232) are communicated with the circulation chamber (221), the rotating motor (233) is fastened to the circulation box (22), and the rotating motor (233) is transmission-connected to the rotating block (231).

6. The wafer cleaning device with flow rate control function according to claim 5, characterized in that: A partition plate (222) is provided on the circulation box (22), and the cross section of the partition plate (222) is located at the center of the circulation cavity (221).

7. The wafer cleaning device with flow rate control function according to claim 6, characterized in that: The drying and cleaning mechanism (3) comprises a rotating motor (31), a rotating rod (32), a second suction cup (33), a downward hydraulic cylinder (34), a gear set (35), a gear rack (36), a fan (37) and a drying box (38), wherein the rotating motor (31) and the gear rack (36) are fastened, the rotating motor (31) and the gear set (35) are rotationally connected, the gear set (35) and the rotating rod (32) are transmission-connected, the second suction cup (33) and the rotating rod (32) are fastened, the downward hydraulic cylinder (34) and the drying box (38) are fastened, the downward hydraulic cylinder (34) and the gear rack (36) are transmission-connected, and the drying box (38) and the cleaning body (5) are fastened.

8. The wafer cleaning device with flow rate control function according to claim 7, characterized in that: The temperature control mechanism (4) includes a temperature sensor (41), a circulation pipe (42), a cooling box (43), a circulation pump (44) and a heating box (45). The temperature sensor (41) is tightly connected to the cleaning body (5). The circulation pipe (42) is spiral. The circulation pipe (42) is connected to the sliding block (232). The circulation pipe (42) is connected to the circulation pump (44). The circulation pump (44) is connected to the heating box (45). The heating box (45) is connected to the cooling box (43). The cooling box (43) is connected to the circulation pipe (42).

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