Use method of load locking device

Abstract

The invention relates to a method for using a load locking device. A load lock device includes a load lock chamber and a substrate holding structure that holds a substrate in the load lock chamber. The substrate holding structure has a facing surface facing the substrate, and is configured so that gas can flow in a space between the substrate and the facing surface. In a state in which the substrate is held by the substrate holding structure, a distance between a portion located further inward than an outer edge of the facing surface and the substrate is greater than a distance between the outer edge of the facing surface and the substrate.

Description

[0001] This application is a divisional application of the patent application entitled "Load lock device", international application No. PCT / JP2020 / 033161, filed on September 2, 2020, national application No. 202080051124.6. TECHNICAL FIELD

[0002] The present application relates to a method for using a load lock device. BACKGROUND

[0003] A vacuum processing device is disclosed in Patent Literature 1, which has a load lock chamber, a wafer stage arranged in the load lock chamber, and a mechanism that lifts the wafer stage. The wafer stage has a convex shape.

[0004] In the substrate holding configuration having the configuration of the wafer stage described in Patent Literature 1, when a gas flow is formed toward the load lock chamber, a standing vortex can be generated in the wafer stage. Such a standing vortex can cause, for example, particles to fly from the lower side of the substrate to the upper side of the substrate, and thus can cause the particles to adhere to the substrate.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Publication No. H5-140743 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present application provides a technology that is advantageous in preventing particles from adhering to a substrate.

[0010] One aspect of the present application is a load lock device that has a load lock chamber and a substrate holding configuration that holds a substrate in the load lock chamber, the substrate holding configuration having a facing surface that faces the substrate and being configured to enable a gas to flow in a space between the substrate and the facing surface, and in a state in which the substrate is held by the substrate holding configuration, a distance between a portion of the facing surface that is located inward of an outer edge of the facing surface and the substrate is greater than a distance between the outer edge of the facing surface and the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a diagram that schematically shows a configuration of a processing device including a load lock device of a first embodiment of the present application.

[0012] Figure 2 is a diagram that illustrates an operation of a processing device including a load lock device of the first embodiment of the present application.

[0013] Figure 3 is a view illustrating an operation of a processing device including a load lock device of the first embodiment of the present application.

[0014] Figure 4 is a view illustrating an operation of a processing device including a load lock device of the first embodiment of the present application.

[0015] Figure 5 is a view illustrating an operation of a processing device including a load lock device of the first embodiment of the present application.

[0016] Figure 6 is a view illustrating an operation of a processing device including a load lock device of the second embodiment of the present application.

[0017] Figure 7 is a view illustrating an operation of a processing device including a load lock device of the third embodiment of the present application.

[0018] Figure 8 is a view illustrating an operation of a processing device including a load lock device of the fourth embodiment of the present application.

[0019] Figure 9 is a schematic plan view of a first member in a load lock device of a fifth embodiment of the present application.

[0020] Figure 10 is a schematic side view of a substrate holding configuration in a load lock device of the first and fifth embodiments of the present application, enlarged.

[0021] Figure 11 is a view illustrating a problem.

[0022] Figure 12 is a view illustrating a problem.

[0023] Figure 13A is a view illustrating a substrate holding configuration.

[0024] Figure 13B is a view illustrating a shape of a first member or a facing surface of a substrate holding configuration. Figure 13A

[0025] Figure 14A is a view showing an example of a substrate.

[0026] Figure 14B is a view showing another example of a substrate.

[0027] Figure 15 is a plan view showing a configuration of a load lock chamber, an extension chamber, and a gas dispersing portion. DETAILED DESCRIPTION ​

[0028] Embodiments will be described below in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the application described in the claims. In the embodiments, a plurality of features can be described; however, not all of the features are essential to the application, and a plurality of features can be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and repeated explanation is omitted.

[0029] Figure 1 The structure of a processing apparatus including a load lock apparatus 100 of the first embodiment of the present application is schematically shown. The load lock apparatus 100 can have a load lock chamber 110 disposed between a load chamber 30 and a transfer chamber 20. The load chamber 30 can be maintained at an atmospheric environment. In the load chamber 30, a substrate S can be supplied from a carrier, for example. Alternatively, the substrate S can be supplied to the load chamber 30 from a pre-processing apparatus. The load chamber 30 can have a filter 32 at its top portion, and a downflow can be supplied to an inner space of the load chamber 30 through the filter 32. A transfer robot 34 can be disposed in the load chamber 30, and the substrate S can be carried by the transfer robot 34. The transfer robot 34 can carry the substrate S from the load chamber 30 to the load lock chamber 110 through a valve 50. The load lock chamber 110 to which the substrate S is carried is sufficiently depressurized. Thereafter, a transfer robot 22 disposed in the transfer chamber 20 can carry the substrate S from the load lock chamber 110 to the transfer chamber 20 through a valve 40. Thereafter, the transfer robot 22 can carry the substrate S from the transfer chamber 20 to a depressurized processing apparatus 10 through a valve 60. The depressurized processing apparatus 10 can be any one of a CVD apparatus, a PVD apparatus, an etching apparatus, a plasma processing apparatus, and an electron beam drawing apparatus, for example.

[0030] The load lock chamber 110 can have a first carrying port 111 connected to the transfer chamber 20 and a second carrying port 112 connected to the load chamber 30. The transfer chamber 20 is connected to the depressurized processing apparatus 10. In one example, the height of the first carrying port 111 (e.g., the height of the lower end of the first carrying port 111) is lower than the height of the second carrying port 112 (e.g., the height of the lower end of the second carrying port 112). The first carrying port 111 is disposed so as to be communicable with an inner space of the transfer chamber 20 through the valve 40. The second carrying port 112 is disposed so as to be communicable with an inner space of the load chamber 30 through the valve 50.

[0031] The load lock apparatus 100 may include a gas inlet portion 160 for introducing gas (e.g., clean dry air or nitrogen) into the load lock chamber 110. The gas inlet portion 160 may be disposed, for example, above the path between the substrate holding structure 120 and the transfer chamber 20 when the substrate S is being transferred to the transfer chamber 20 via the first transfer port 111. In one example, the gas inlet portion 160 may be disposed above the first transfer port 111. The gas inlet portion 160 may include a gas dispersion portion 162 for dispersing gas into the interior space of the load lock chamber 110. At least a portion of the gas dispersion portion 162 may be disposed within the load lock chamber 110. The gas dispersion portion 162 may be disposed at a position facing the second transfer port 112. The gas inlet portion 160 may include a flow rate adjustment valve 164 for adjusting the introduction of gas. The gas dispersion portion 162 may have a columnar portion, and the inner side surface of the load lock chamber 110 may include a curved surface that is separate from and follows the columnar portion. The columnar portion may have a cylindrical shape, and the curved surface may constitute a part of a cylindrical surface.

[0032] The load lock apparatus 100 may include a substrate holding structure 120 for holding the substrate S in the load lock chamber 110. The substrate holding structure 120 may have an opposing surface OS facing the substrate S and may be configured to allow gas to flow in a space between the substrate S and the opposing surface OS. Figure 10 As shown in the enlarged view, the substrate holding structure 120 can have the following structure: when the substrate S is held by the substrate holding structure 120, the distance between the portion PP located inside the outer edge EE of the facing surface OS and the substrate S is greater than the distance between the outer edge EE of the facing surface OS and the substrate S. Figure 10 As schematically indicated by the dashed arrows, this structure effectively suppresses the formation of trapped vortices in the gas flow within the interior space of the load lock chamber 110. Gas flow can be generated by introducing gas into the interior space of the load lock chamber 110 via the gas inlet 160 and / or by exhausting gas from the interior space using a pump 150, etc., as described later. Therefore, gas flow can be consistently generated within the load lock chamber 110, where pressure varies widely from atmospheric pressure to high vacuum.

[0033] On the other hand, Figure 11 As schematically shown by the dotted arrow in the figure, if the substrate holding structure SH holding the substrate S has a wall that obstructs the flow of gas, a trapped vortex may be formed in the flow of gas. Such a trapped vortex may cause particles to fly and adhere to the substrate S. In addition, it was confirmed by simulation that: Figure 12As schematically shown by the dotted arrows, even in the case where the substrate holding mechanism SH' holding the substrate S has the facing surface OS' which is a plane parallel to the lower surface of the substrate S, a stationary vortex is formed in the flow of the gas. Such a stationary vortex can cause particles to fly and adhere to the substrate S.

[0034] Returning to Figure 1 The substrate holding mechanism 120 can include a first member 125 having a facing surface OS and a second member 126 having an upper surface US facing the lower surface LS of the first member 125. The substrate holding mechanism 120 can include a plurality of contact portions 124 in contact with the substrate S in a manner to support the substrate S. The second member 126 can support the first member 125 and the plurality of contact portions 124. The upper surface US of the second member 126 can have a shape following the lower surface LS of the first member 125. Such a configuration can allow the gas to flow smoothly. Here, in a configuration in which a space defined by the first member 125 (lower surface LS) and the second member 126 (upper surface US) facing each other does not exist as a flow path of the gas, i.e., in a configuration in which the space is filled with a solid, the flow of the gas is hindered, and a stationary vortex can be generated. On the other hand, the configuration in which the first member 125 (lower surface LS) and the second member 126 (upper surface US) face each other is advantageous in suppressing generation of a stationary vortex.

[0035] The load lock apparatus 100 can include a drive mechanism 130. The drive mechanism 130 can be disposed below the load lock chamber 110 in a manner to raise and lower the substrate holding mechanism 120. The drive mechanism 130 can be coupled to the substrate holding mechanism 120 via the link member 122.

[0036] The load lock chamber 110 can be provided with an extension chamber 140 extending laterally from the lower portion of the load lock chamber 110 and a pump 150 disposed below the extension chamber 140 and exhausting the gas of the load lock chamber 110 via the extension chamber 140. The extension chamber 140 can have a bottom surface 144 having an opening 142 at a position deviated from the vertical below the substrate holding mechanism 120. The pump 150 can be connected to the opening 142. Although not shown, a valve can be disposed between the pump 150 and the opening 142.

[0037] The pump 150 can include, for example, a rotary pump and a turbo molecular pump disposed between the rotary pump and the opening 142. The turbo of the turbo molecular pump rotates at high speed when in operation. When a particle drawn by the turbo molecular pump collides with the turbo, it can be bounced off the turbo. In addition, the pump 150 itself can generate particles regardless of whether the pump 150 is a turbo molecular pump. Therefore, it is preferable to connect the pump 150 to the opening 142 provided to the bottom surface 144 of the extension chamber 140 extending laterally from the lower portion of the load lock chamber 110. Thereby, it is possible to reduce the case where particles from the pump 150 reach the upper space of the substrate S through the gap G between the side surface of the substrate holding mechanism 120 and the inner side surface of the load lock chamber and adhere to the substrate S.

[0038] A gas exhaust line 52 can be connected to the valve 50 disposed between the second transfer port 112 of the load lock chamber 110 and the load chamber 30. The gas in the space near the second transfer port 112 can be exhausted to the outside space of the load lock chamber 110 through the gas exhaust line 52. A pump not shown can be connected to the gas exhaust line 52.

[0039] At least a portion of the second transfer port 112 can be disposed above (vertically above) the extension chamber 140. Alternatively, at least a portion of the extension chamber 140 can be disposed between the second transfer port 112 and the pump 150. Such a configuration is advantageous in reducing the occupied space of the load lock apparatus 100.

[0040] At least a portion of the load chamber 30 can be disposed above (vertically above) the extension chamber 140. Alternatively, at least a portion of the extension chamber 140 can be disposed between the load chamber 30 and the pump 150. Such a configuration is also advantageous in reducing the occupied space of the load lock apparatus 100.

[0041] Figure 15 is a plan view showing the disposition of the load lock chamber 110, the extension chamber 140, and the gas dispersing portion 162. The plan view can also be understood as a front projection with respect to a floor on which the load lock apparatus 100 is disposed. The substrate holder 120 can be located between the gas dispersing portion 162 and the extension chamber 140 in the plan view or the front projection. Alternatively, the opening 142 can be located between the gas dispersing portion 162 and the extension chamber 140 in the plan view or the front projection.

[0042] The area of the gap G between the side surface of the substrate holding mechanism 120 and the inner side surface of the load lock chamber 110 is preferably smaller than the cross-sectional area of the second transfer port 112. The area of the gap G is more preferably smaller than 1 / 2, 1 / 3, or 1 / 4 of the cross-sectional area of the second transfer port 112. Such a configuration is effective in suppressing the intrusion of particles from the load chamber 30 into the inner space of the load lock chamber 110 through the second transfer port 112, because the amount of gas introduced from the gas dispersion section 162 into the inner space of the load lock chamber 110 through the second transfer port 112 and the gas exhaust line 52 is greater than the amount of gas exhausted from the space above the substrate S to the space below the substrate holding mechanism 120 through the gap G when the substrate S is transferred from the load chamber 30 to the inner space of the load lock chamber 110 through the second transfer port 112.

[0043] The area of the gap G between the side surface of the substrate holding mechanism 120 and the inner side surface of the load lock chamber 110 is preferably smaller than the cross-sectional area of the opening 142 provided in the bottom surface 144 of the extension chamber 140. Such a configuration is effective in reducing the cases where particles from the pump 150 reach the space above the substrate S through the gap G and adhere to the substrate S. The area of the gap G is preferably smaller than the cross-sectional area (cross-sectional area in the vertical plane) of the connecting portion 146 between the load lock chamber 110 and the extension chamber 140. Such a configuration is also effective in reducing the cases where particles from the pump 150 reach the space above the substrate S through the gap G and adhere to the substrate S.

[0044] In the processing apparatus shown in Figure 2 , Figure 3 , Figure 4 and Figure 5 , the operation of the processing apparatus shown in Figure 1 is exemplarily described. First, gas is introduced (supplied) from the gas introduction section 160 to the inner space of the load lock chamber 110 while the gas in the inner space is exhausted to the outer space of the load lock chamber 110 by the pump 150. At this time, the amount of gas introduced from the gas introduction section 160 to the inner space is made greater than the amount of gas exhausted based on the pump 150, so that the pressure in the inner space is increased. If the pressure in the inner space becomes equal to or greater than the atmospheric pressure, the valve 50 is opened as shown in Figure 2 , and the gas is started to be exhausted by the gas exhaust line 52. Thereafter, the substrate S is transferred from the load chamber 30 to the substrate holding mechanism 120 in the inner space of the load lock chamber 110 by the transfer robot 34.

[0045] Thereafter, as shown in Figure 3As shown, valve 50 is closed, and substrate holding structure 120 can be driven upward by drive mechanism 130. Furthermore, while gas is being introduced into the interior of load lock chamber 110 from gas inlet 160, the amount of gas discharged from the interior by pump 150 increases, reducing the pressure in the interior. Subsequently, stopping the introduction of gas into the interior by gas inlet 160 can further increase the amount of gas discharged from the interior by pump 150.

[0046] If the pressure in the internal space of the load lock chamber 110 is sufficiently reduced, Figure 4 As shown, the substrate holding structure 120 can be driven downward by the driving mechanism 130 to a height for conveying the substrate S to the transfer chamber 20. Figure 5 As shown, the valve 40 is opened, and the substrate S is transferred from the interior space of the load lock chamber 110 to the transfer chamber 20 by the transfer robot 22, and then to the reduced pressure treatment apparatus 10. Then, the valve 40 is closed, and the substrate S is processed in the reduced pressure treatment apparatus 10.

[0047] Afterwards, valve 40 is opened, as shown in FIG. Figure 5 As shown, the substrate S in the decompression treatment apparatus 10 can be transferred to the inner space of the load lock chamber 110 by the transfer robot 22. Thereafter, the valve 40 can be closed.

[0048] After that, gas can be introduced into the internal space of the load lock chamber 110 from the gas inlet 160 while the gas in the internal space is discharged to the external space of the load lock chamber 110 by the pump 150. At this time, the amount of gas introduced into the internal space from the gas inlet 160 can be made greater than the amount of gas discharged by the pump 150, so that the pressure in the internal space is increased. If the pressure in the internal space becomes higher than the atmospheric pressure, then Figure 2 As shown, the valve 50 is opened and gas exhaust begins through the gas exhaust line 52. The transfer robot 34 can then transfer the substrate S from the substrate holding structure 120 in the interior space of the load lock chamber 110 to the loader chamber 30. The valve 50 is then closed, and gas exhaust through the gas exhaust line 52 can be stopped.

[0049] like Figure 1 、 Figure 3 、 Figure 4 As illustrated, the substrate holding structure 120 can hold the substrate S so that at least a portion of the side surface (outer peripheral surface) of the substrate S faces the inner surface of the load lock chamber 110. Here, at least a portion of the side surface (outer peripheral surface) of the substrate S held by the substrate holding structure 120 can hold the substrate S so that it faces the inner surface of the load lock chamber 110 in a direction parallel to the surface of the substrate S.

[0050] likeFigures 1 to 5 As illustrated, the substrate holding structure 120 can be arranged at a plurality of positions in the internal space of the load lock chamber 110. Figure 1 As illustrated, the plurality of positions may include a position where a portion of the side surface of the substrate S held by the substrate holding structure 120 faces the gas dispersion unit 162. Here, the portion of the side surface (outer peripheral surface) of the substrate S held by the substrate holding structure 120 may face the gas dispersion unit 162 in a direction parallel to the surface of the substrate S.

[0051] like Figure 13A As illustrated, the substrate holding structure 120 may be configured such that the dimension DH of the facing surface OS of the substrate holding structure 120 in the surface direction (direction parallel to the XY plane) along the surface of the substrate S is smaller than the dimension DS of the substrate S in the surface direction. Figure 13A 、 Figure 13B As illustrated, portion PP of the substrate holding mechanism 120 can be located inward of outer edge EE of the opposing surface OS in a predetermined direction (Y direction) within a horizontal plane (XY plane). Cross-sections of the opposing surface OS taken along each of a plurality of planes (plural planes parallel to the YZ plane) perpendicular to the horizontal plane (XY plane) and parallel to the predetermined direction (Y direction) can have the same shape.

[0052] like Figure 14A As shown, the substrate S held by the substrate holding structure 120 can have a rectangular shape. Alternatively, as shown in FIG. Figure 14B As illustrated, the substrate S held by the substrate holding structure 120 can have a circular shape having a notch NT indicating a reference orientation. However, the substrate S held by the substrate holding structure 120 may have other shapes.

[0053] Figure 6 The structure of a processing apparatus including a load lock apparatus 100 according to a second embodiment of the present invention is schematically illustrated. Any matters not described in the second embodiment can be handled in accordance with the first embodiment. In the load lock apparatus 100 of the second embodiment, the top of the load lock chamber 110 includes a portion 601 facing the inner region of the outer edge of the substrate S and a portion 602 facing the outer edge of the substrate S. The distance between the portion 601 and the substrate S is greater than the distance between the portion 602 and the substrate S.

[0054] Figure 7The structure of the processing device of the load lock device 100 including the third embodiment of the present application is schematically shown. Matters not mentioned as the third embodiment can follow the first embodiment. In the load lock device 100 of the third embodiment, the top of the load lock chamber 110 includes a portion 601 facing the inner side region of the outer edge of the substrate S and a portion 602 facing the outer edge of the substrate S, the distance of the portion 601 from the substrate S is larger than the distance of the portion 602 from the substrate S. In the third embodiment, the portion 601 is constituted by a smooth curved surface.

[0055] Figure 8 The structure of the processing device of the load lock device 100 including the fourth embodiment of the present application is schematically shown. Matters not mentioned as the fourth embodiment can follow the first embodiment. In the fourth embodiment, the first member 125 has a corrugated blade shape. The corrugated blade shape is, for example, advantageous in suppressing a large vortex flow throughout the space between the facing surface OS and the substrate S.

[0056] Figure 9 A plan view of the first member 125 in the load lock device 100 of the fifth embodiment of the present application is schematically shown. In Figure 10 A side view of the first member 125 in the load lock device 100 of the fifth embodiment of the present application is schematically shown. Matters not mentioned as the fifth embodiment can follow the first embodiment. In the fifth embodiment, in a state where the substrate S is held by the substrate holding mechanism 120, a portion PP located at a position inward of the outer edge EE of the facing surface OS is located at a position inward of the outer edge EE of the facing surface OS in a predetermined direction DIR, and the first member 125 is divided into a plurality of portions 125a, 125b in a direction orthogonal to the predetermined direction DIR.

[0057] The present application is not limited to the above-described embodiments, and various modifications and alterations can be made without departing from the spirit and scope of the application. Therefore, a claim is added for the scope of the present application.

[0058] Explanation of Reference Numerals

[0059] 100: load lock device, 110: load lock chamber, 111: first transfer port, 112: second transfer port, 120: substrate holding mechanism, 140: extension chamber, 142: opening, 144: bottom surface, 150: pump, 160: gas introduction portion, 162: gas dispersion portion, PP: portion, EE: outer edge, OS: facing surface.

Claims

1. A method for using a load lock apparatus, the load lock apparatus comprising a load lock chamber and a substrate holding structure for holding a substrate in the load lock chamber, wherein: The substrate holding structure includes a contact portion that contacts the substrate in a manner that supports the substrate, and a first member having an opposing surface that faces the substrate in a manner that does not contact the substrate, and the substrate holding structure is configured to allow gas to flow in a space between the substrate and the opposing surface. When the substrate is held by the substrate holding structure, a distance between a portion located inside the outer edge of the facing surface and the substrate is greater than a distance between the outer edge of the facing surface and the substrate. The outer edge of the facing surface is defined by the exposed side surface of the outer side of the first member. The method of use includes the step of introducing a gas into the internal space of the load lock chamber while the substrate is held by the substrate holding structure, and flowing the gas into the space between the substrate and the facing surface.

2. The method for using the load lock device according to claim 1, wherein: The substrate holding structure includes a first member having the facing surfaces and a second member having an upper surface facing a lower surface of the first member.

3. The method for using the load lock device according to claim 2, wherein: The second member supports the first member and the plurality of contact portions.

4. The method for using the load lock device according to claim 3, wherein: The upper surface of the second member has a shape along the lower surface of the first member.

5. The method for using the load lock device according to claim 3, wherein: The first member has a corrugated blade shape.

6. The method for using the load lock device according to claim 3, wherein: The portion is located inward of the outer edge of the facing surface in a predetermined direction, The first member is divided into a plurality of parts in a direction orthogonal to the predetermined direction.

7. The method for using the load lock device according to any one of claims 1 to 6, characterized in that: The load lock chamber has a first transfer port connected to the transfer chamber and a second transfer port connected to the loading chamber. The transfer chamber is connected to the decompression treatment device. The load lock device further comprises: a gas introduction portion disposed above a path between the substrate holding structure and the transfer chamber when the substrate is transferred to the transfer chamber through the first transfer port; as well as A gas exhaust portion is configured to exhaust gas through a space below the substrate holding structure.

8. The method for using the load lock device according to claim 7, wherein: The first transfer port has a lower height than the second transfer port.

9. The method for using the load lock device according to claim 7, wherein: The gas introduction part includes a gas dispersion part for dispersing the gas. The gas dispersion unit is disposed at a position facing the second transfer port.

10. The method for using the load lock device according to claim 9, wherein: The gas dispersion portion has a columnar portion, and the inner side surface of the load lock chamber includes a curved surface that is separated from the columnar portion and follows the columnar portion.

11. The method for using the load lock device according to claim 10, wherein: The columnar portion has a cylindrical shape, and the curved surface constitutes a part of a cylindrical surface.

12. The method for using the load lock device according to claim 9, wherein: The gas introduction unit and the gas exhaust unit are controlled so as to reduce the pressure of the load lock chamber when the substrate held by the substrate holding structure is arranged at a position higher than the central axis of the gas dispersion unit, and to reduce the pressure of the load lock chamber when the substrate held by the substrate holding structure is arranged at a position lower than the central axis of the gas dispersion unit.

13. The method for using the load lock device according to claim 7, wherein: The load lock apparatus further includes a gas exhaust line disposed to exhaust gas from a space near the second transfer port.

14. The method for using the load lock device according to claim 1, wherein: The substrate holding structure holds the substrate so that at least a portion of a side surface of the substrate faces an inner surface of the load lock chamber.

15. The method for using the load lock device according to claim 1, wherein: The load lock apparatus further includes a gas dispersion unit for dispersing gas in the internal space of the load lock chamber. The substrate holding structure holds the substrate so that at least a portion of a side surface of the substrate faces the inner surface of the load lock chamber. Positions where the substrate holding structure can be arranged include a position where a portion of a side surface of the substrate held by the substrate holding structure faces the gas dispersion portion.

16. The method for using the load lock device according to claim 1, wherein: A size of the facing surface in a surface direction along the surface of the substrate is smaller than a size of the substrate in the surface direction.

17. The method for using the load lock device according to claim 1, wherein: The portion is located inward of the outer edge of the facing surface in a predetermined direction in a horizontal plane, Cross sections of the facing surfaces taken at each of at least three planes that are perpendicular to the horizontal plane, parallel to the predetermined direction, and separated from each other have the same shape as one another.

18. The method for using a load lock device according to any one of claims 1 to 17, wherein: The substrate held by the substrate holding structure has a rectangular shape.

19. The method for using a load lock device according to any one of claims 1 to 17, wherein: The substrate held by the substrate holding structure has a circular shape having a cutout portion indicating a reference orientation.

20. A method for using a load lock apparatus, the load lock apparatus comprising a load lock chamber and a substrate holding structure for holding a substrate in the load lock chamber, wherein: The substrate holding structure has a facing surface facing the substrate and is configured to allow gas to flow in a space between the substrate and the facing surface. When the substrate is held by the substrate holding structure, a distance between a portion located inside the outer edge of the facing surface and the substrate is greater than a distance between the outer edge of the facing surface and the substrate. The portion is located inward of the outer edge of the facing surface in a predetermined direction in a horizontal plane, The cross sections of the facing surfaces taken at each of at least three planes perpendicular to the horizontal plane and parallel to the predetermined direction and separated from each other have the same shape as each other, The method of use includes the step of introducing a gas into the internal space of the load lock chamber while the substrate is held by the substrate holding structure, and flowing the gas into the space between the substrate and the facing surface.

Images