Chip overturning and conveying equipment and chip overturning and conveying method

Abstract

The invention relates to the technical field of semiconductor processing, and discloses chip overturning and conveying equipment and a chip overturning and conveying method. Wherein the chip overturning and conveying equipment comprises two chip conveying mechanisms which are arranged at an interval; the chip conveying mechanism comprises a rotary driving part, a base and a pickup device, and the rotary driving part is in driving connection with the base; the pick-up device is arranged on the base, and the rotary driving piece of the first chip conveying mechanism is used for driving the base to rotate, so that the pick-up device of the first chip conveying mechanism rotates to a feeding position and a first connecting position; the rotation driving part of the second chip conveying mechanism is used for driving the base to rotate, so that the picking device of the second chip conveying mechanism rotates to a discharging position and a second handover position; the picking device located at the feeding position can pick up chips. The picking device located at the first handover position and the picking device located at the second handover position are arranged oppositely and can adsorb the two sides of the chip respectively; the picking device located at the discharging position can convey the chips to the working carrier plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a chip overturning conveying device and a chip overturning conveying method. BACKGROUND

[0002] In the field of semiconductor manufacturing and advanced packaging, efficient and accurate wafer transfer is a key link to ensure production yield and efficiency. In the prior art, the wafer transfer device usually adopts a vertical layout design, that is, the blue film and the work carrier plate are vertically arranged on the two sides of the device, the wafer on the blue film is adsorbed by the suction nozzle and horizontally conveyed to the work carrier plate, and the wafer is transferred from the storage to the processing station. However, this technical solution has significant limitations: since the blue film and the carrier plate are kept in a fixed posture, the suction nozzle can only complete one-sided adsorption and planar handling, and cannot overturn the wafer, which requires manual intervention or the cooperation of multiple devices, thereby increasing the risk of contamination and operation complexity, and reducing production efficiency and increasing production cost.

[0003] Therefore, there is an urgent need for a chip overturning conveying device and a chip overturning conveying method to solve the above problems. SUMMARY

[0004] Based on the above, the purpose of the present application is to provide a chip overturning conveying device and a chip overturning conveying method, which can convey the chips on the blue film to the work carrier plate and overturn the chips, meeting the working requirements.

[0005] To achieve the above purpose, the technical scheme adopted by the present application is as follows:

[0006] On the one hand, a chip overturning conveying device is provided, which comprises two spaced-apart chip conveying mechanisms; the chip conveying mechanism comprises a rotating drive, a base and a pickup device, the rotating drive is drivingly connected to the base; the pickup device is arranged on the base, the rotating drive of the first chip conveying mechanism is used to drive the base to rotate, so that the pickup device of the first chip conveying mechanism rotates to a feeding position and a first transfer position; the rotating drive of the second chip conveying mechanism is used to drive the base to rotate, so that the pickup device of the second chip conveying mechanism rotates to a discharging position and a second transfer position;

[0007] The pickup device at the feeding position can pick up the chips; the pickup device at the first transfer position and the pickup device at the second transfer position are arranged opposite to each other and can respectively adsorb the two sides of the chips, so as to transfer the chips; the pickup device at the discharging position can convey the chips to the work carrier plate.

[0008] As a preferred technical scheme of the chip flip conveying device, the chip conveying mechanism comprises four pickup devices, and the four pickup devices are uniformly and circumferentially spaced on the base.

[0009] As a preferred technical scheme of the chip flip conveying device, the pickup device comprises a suction nozzle, a driving assembly, and sequentially connected first, second and third adjusting assemblies, the suction nozzle is slidably connected to the third adjusting assembly along the Y-axis direction, the driving assembly is drivingly connected to the suction nozzle, the driving assembly is used for driving the suction nozzle to reciprocate along the Y-axis direction, so that the suction nozzle is close to or away from the chip, and the first adjusting assembly is connected to the base; the first adjusting assembly is used for adjusting the displacement of the suction nozzle along the Z-axis direction, the second adjusting assembly is used for adjusting the displacement of the suction nozzle along the X-axis direction, and the third adjusting assembly is used for adjusting the angle of the suction nozzle relative to the Z-axis and the angle of the suction nozzle relative to the X-axis.

[0010] As a preferred technical scheme of the chip flip conveying device, the first adjusting assembly comprises a first adjusting block and two first adjusting screws, the first adjusting block is provided with two first waist-shaped holes which are spaced along the Z-axis direction and extend along the Z-axis direction, the base is provided with first threaded holes corresponding to the two first waist-shaped holes, and the first adjusting screws are arranged in the first waist-shaped holes and are threadedly connected to the first threaded holes.

[0011] As a preferred technical scheme of the chip flip conveying device, the second adjusting assembly comprises a second adjusting block and a second adjusting screw, the second adjusting block is provided with a second waist-shaped hole extending along the X-axis direction, the first adjusting block is provided with a second threaded hole corresponding to the second waist-shaped hole, and the second adjusting screw is arranged in the second waist-shaped hole and is threadedly connected to the second threaded hole.

[0012] As a preferred technical scheme of the chip flip conveying device, one of the bottom of the second adjusting block and the top of the first adjusting block is provided with a guide groove extending along the X-axis direction, and the other is provided with a guide boss extending along the X-axis direction, and the guide groove and the guide boss are slidably connected.

[0013] As a preferred technical scheme of the chip flip conveying device, the third adjusting assembly comprises a third adjusting block and two third adjusting screws, the third adjusting block is provided with two third waist-shaped holes which are spaced along the Y-axis direction and extend along the X-axis direction, the top of the second adjusting block is provided with third threaded holes corresponding to the two third waist-shaped holes, and the third adjusting screws are arranged in the third waist-shaped holes and are threadedly connected to the third threaded holes.

[0014] As a preferred technical scheme of the chip flip conveying device, the third adjusting assembly further comprises a connecting block and two fourth adjusting screws, the third adjusting block is further provided with two fourth waist-shaped holes which are spaced apart along the Y-axis direction and extend along the Z-axis direction, the connecting block is provided with fourth threaded holes corresponding to the two fourth waist-shaped holes, the fourth adjusting screws are arranged in the fourth waist-shaped holes and are threadedly connected to the fourth threaded holes, and the suction nozzle is connected to the connecting block.

[0015] As a preferred technical scheme of the chip flip conveying device, the driving assembly comprises a first driving component, an elastic member and a buffer block, the first driving component is arranged on the base and is drivingly connected to the buffer block, the first driving component is used to drive the buffer block to reciprocate along the Y-axis direction, the buffer block is provided with an abutting portion, the abutting portion and the suction nozzle are spaced apart along the Y-axis direction, one end of the elastic member is connected to the abutting portion, and the other end of the elastic member is connected to one end of the suction nozzle which is away from the chip.

[0016] In another aspect, a chip flip conveying method is provided, which adopts the chip flip conveying device according to any one of the above schemes, and the chip flip conveying method comprises the following steps.

[0017] The first chip conveying mechanism performs the following steps.

[0018] The rotating driving member drives the pickup device to rotate to the loading position, and the pickup device picks the front surface of the chip;

[0019] The rotating driving member drives the pickup device to rotate to the first transfer position;

[0020] The second chip conveying mechanism performs the following steps.

[0021] The rotating driving member drives the pickup device to rotate to the second transfer position, the pickup device at the second transfer position picks the chip on the pickup device at the first transfer position, and the pickup device picks the back surface of the chip;

[0022] The rotating driving member drives the pickup device to rotate to the unloading position, and the pickup device pastes the front surface of the chip on the work carrier, thereby completing the flip conveying of the chip.

[0023] The chip flip conveying device has the following beneficial effects.

[0024] The application provides a chip turnover conveying device and a chip turnover conveying method, wherein the blue film carrying a wafer is vertically arranged on one side of a first chip conveying mechanism loading position, and a work carrier is vertically arranged on one side of a second chip conveying mechanism unloading position, when the wafer needs to be turned over and transported, the first chip conveying mechanism performs the following steps: a rotating drive member drives a pickup device to rotate to the loading position, at this time, the pickup device picks up the front surface of the chip on the blue film; then, the rotating drive member drives the pickup device to rotate to a first transfer position; the second chip conveying mechanism performs the following steps: a rotating drive member drives a pickup device to rotate to a second transfer position, the pickup device at the second transfer position picks up the chip on the pickup device at the first transfer position, and the pickup device picks up the back surface of the chip; finally, the rotating drive member drives the pickup device to rotate to the unloading position, and the pickup device pastes the front surface of the chip on the work carrier, thereby completing the turnover conveying of the chip. The application realizes conveying the chip on the blue film to the work carrier, and realizes turning over the chip, thereby meeting the work requirement. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the application. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art according to the contents of the embodiments of the application and the drawings without any creative effort.

[0026] Figure 1 is a structural schematic diagram of the chip turnover conveying device provided by the specific embodiment of the application;

[0027] Figure 2 is a structural schematic diagram of the chip conveying mechanism provided by the specific embodiment of the application;

[0028] Figure 3 is one of the partial structural schematic diagrams of the chip conveying mechanism provided by the specific embodiment of the application;

[0029] Figure 4 is an exploded view of the chip conveying mechanism provided by the specific embodiment of the application;

[0030] Figure 5 is the second partial structural schematic diagram of the chip conveying mechanism provided by the specific embodiment of the application;

[0031] Figure 6 is Figure 2 is an enlarged view at A.

[0032] The figures are marked as follows:

[0033] 100, chip conveying mechanism; 101, upper loading position; 102, first transfer position; 103, second transfer position; 104, lower unloading position;

[0034] 1, rotating driving member;

[0035] 2, base; 21, first threaded hole;

[0036] 3, pickup device; 31, first adjusting assembly; 311, first adjusting block; 3111, first waist-shaped hole; 3112, second threaded hole; 3113, guide boss; 32, second adjusting assembly; 321, second adjusting block; 3211, second waist-shaped hole; 3212, guide groove; 3213, third threaded hole; 33, third adjusting assembly; 331, third adjusting block; 3311, third waist-shaped hole; 3312, fourth waist-shaped hole; 332, connecting block; 3321, fourth threaded hole; 34, suction nozzle; 341, positioning groove; 342, first stop pin; 35, driving assembly; 351, elastic member; 352, buffer block; 3521, long strip hole; 3522, abutment part; 3523, positioning column; 353, first driving component; 3531, driving motor; 3532, cam; 3533, sliding seat; 3534, first follower; 3535, second follower; 3536, tension spring; 354, fourth adjusting block; 3541, fifth threaded hole; 3542, second stop pin; 4, support plate. DETAILED DESCRIPTION

[0037] The application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the application, and not to limit the application. In addition, it should be noted that, for the convenience of description, only the parts related to the application are shown in the drawings, not all the structures.

[0038] In the description of the application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0039] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature is "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature is "under", "below" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0040] In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0041] As shown in Figure 1 and Figure 2 The present embodiment provides a chip flip conveying device, which comprises two spaced-apart chip conveying mechanisms 100; the chip conveying mechanism 100 comprises a rotating driving member 1, a base 2 and a pickup device 3, the rotating driving member 1 is drivingly connected to the base 2; the pickup device 3 is arranged on the base 2, the rotating driving member 1 of the first chip conveying mechanism 100 is used to drive the base 2 to rotate, so that the pickup device 3 of the first chip conveying mechanism 100 is turned to a feeding position 101 and a first transfer position 102; the rotating driving member 1 of the second chip conveying mechanism 100 is used to drive the base 2 to rotate, so that the pickup device 3 of the second chip conveying mechanism 100 is turned to a discharging position 104 and a second transfer position 103; the pickup device 3 located at the feeding position 101 can pick up a chip; the pickup device 3 located at the first transfer position 102 and the pickup device 3 located at the second transfer position 103 are arranged opposite to each other and can respectively adsorb two sides of a chip, so as to transfer the chip; the pickup device 3 located at the discharging position 104 can convey the chip to a work carrier plate.

[0042] In operation, the blue film carrying the wafer is vertically arranged on one side of the first chip conveying mechanism 100 at the loading position 101, and the work carrier is vertically arranged on one side of the second chip conveying mechanism 100 at the unloading position 104. When it is necessary to turn over the wafer for transfer, the first chip conveying mechanism 100 performs the following steps: the rotary drive member 1 drives the pickup device 3 to rotate to the loading position 101, at which time the pickup device 3 picks up the front side of the chip on the blue film; then, the rotary drive member 1 drives the pickup device 3 to rotate to the first transfer position 102; the second chip conveying mechanism 100 performs the following steps: the rotary drive member 1 drives the pickup device 3 to rotate to the second transfer position 103, the pickup device 3 at the second transfer position 103 picks up the chip on the pickup device 3 at the first transfer position 102, and the pickup device 3 picks up the back side of the chip; finally, the rotary drive member 1 drives the pickup device 3 to rotate to the unloading position 104, and the pickup device 3 pastes the front side of the chip on the work carrier, thereby completing the turnover and conveying of the chip. The present application realizes the conveying of the chip on the blue film to the work carrier and the turnover of the chip, thereby meeting the work requirements.

[0043] Preferably, the chip conveying mechanism 100 comprises four pickup devices 3, which are uniformly and circumferentially spaced apart on the base 2. In this embodiment, when the rotary drive member 1 drives the base 2 to rotate, each chip conveying mechanism 100 uses the four pickup devices 3 to convey the chip, thereby improving the work efficiency.

[0044] As shown in Figures 2-6 The pickup device 3 comprises a suction nozzle 34, a driving assembly 35, and a first adjusting assembly 31, a second adjusting assembly 32, and a third adjusting assembly 33 connected in sequence, the suction nozzle 34 is slidably connected to the third adjusting assembly 33 along the Y-axis direction, the driving assembly 35 is drivingly connected to the suction nozzle 34, the driving assembly 35 is used to drive the suction nozzle 34 to reciprocally slide along the Y-axis direction, so as to make the suction nozzle 34 approach or move away from the chip, and the first adjusting assembly 31 is connected to the base 2; the first adjusting assembly 31 is used to adjust the displacement of the suction nozzle 34 along the Z-axis direction, the second adjusting assembly 32 is used to adjust the displacement of the suction nozzle 34 along the X-axis direction, and the third adjusting assembly 33 is used to adjust the angle of the suction nozzle 34 relative to the Z-axis and the angle relative to the X-axis. In this embodiment, the Z-axis extends along the vertical direction, the Y-axis extends along the radial direction of the base 2, and the X-axis, the Y-axis, and the Z-axis are perpendicular to each other.

[0045] When the picking device 3 is located at the upper loading position 101, the driving assembly 35 drives the suction nozzle 34 to approach the chip so that the suction nozzle 34 can adsorb the chip, and then the driving assembly 35 drives the suction nozzle 34 to reset away from the chip to wait for the next process. When the picking device 3 located at the first transfer position 102 and the picking device 3 located at the second transfer position 103 perform chip transfer, the driving assemblies 35 of the two picking devices 3 respectively drive the suction nozzles 34 to approach each other, the suction nozzle 34 located at the second transfer position 103 adsorbs the chip after abutting against the chip, the suction nozzle 34 located at the first transfer position 102 stops vacuumizing, and then the two suction nozzles 34 reset to complete the chip transfer. When the picking device 3 is located at the lower loading position 104, the driving assembly 35 drives the suction nozzle 34 carrying the chip to approach the work carrier plate, the chip is installed on the work carrier plate, the suction nozzle 34 stops vacuumizing, and then the driving assembly 35 drives the suction nozzle 34 to reset away from the chip to realize the flip and transfer of the chip. Furthermore, in the embodiment, the picking device 3 adjusts the position of the suction nozzle 34 along the Z-axis direction through the first adjusting assembly 31, adjusts the position of the suction nozzle 34 along the X-axis direction through the second adjusting assembly 32, and adjusts the angle of the suction nozzle 34 relative to the Z-axis (i.e. the up-down inclination angle of the suction nozzle 34) and the angle of the suction nozzle 34 relative to the X-axis (i.e. the left-right inclination angle of the suction nozzle 34) through the third adjusting assembly 33, so that the suction nozzle 34 can face and be perpendicular to the chip, the suction force of the suction nozzle 34 is uniformly distributed when the suction nozzle 34 adsorbs the chip, the picking success rate of the chip is improved, and the continuity and stability of the production process are ensured.

[0046] In the embodiment, the chip transfer mechanism 100 further comprises a detection assembly, which is arranged on one side of the base 2 along the X-axis direction. When the rotating driving member 1 drives the picking device 3 carrying the chip to move to the front of the detection assembly, the detection assembly can detect the chip. It should be noted that the detection assembly can adopt a visual detection sensor, which is a prior art and will not be described here.

[0047] In the embodiment, the blue film carrying the wafer, the first chip transfer mechanism 100, the second chip transfer mechanism 100 and the work carrier plate are arranged at intervals along one direction. After the suction nozzle 34 of the first chip transfer mechanism 100 adsorbs the chip on the blue film, the rotating driving member 1 drives the base 2 to rotate by 90°, at this time, the chip is transferred to the front of the detection assembly, the detection assembly detects the back of the chip, after the detection is completed, the rotating driving member 1 drives the base 2 to continue to rotate by 90° to perform chip flip transfer, then the rotating driving member 1 of the second chip transfer mechanism 100 drives the base 2 to rotate by 90°, at this time, the chip is transferred to the front of the detection assembly, the detection assembly detects the front of the chip, after the detection is completed, the rotating driving member 1 drives the base 2 to continue to rotate by 90° to the lower loading position 104, and the chip is transferred to the work carrier plate through the suction nozzle 34. The embodiment realizes the detection of two sides of the chip.

[0048] Preferably, the rotating driving member 1 is a servo motor, which facilitates control of the rotating speed and rotating precision of the base 2.

[0049] In the embodiment, the suction surface of the suction nozzle 34 is vertically arranged, which can suck the chip arranged vertically and transfer the chip to the work carrier arranged vertically.

[0050] Further, the first adjusting assembly 31 comprises a first adjusting block 311 and two first adjusting screws, the first adjusting block 311 is provided with two first waist-shaped holes 3111 arranged along the Z-axis direction, the first waist-shaped holes 3111 extend along the Z-axis direction, the base 2 is provided with first screw holes 21 corresponding to the two first waist-shaped holes 3111, and the first adjusting screws are arranged in the first waist-shaped holes 3111 and are threadedly connected to the first screw holes 21. When it is necessary to adjust the position of the suction nozzle 34 along the Z-axis direction, the two first adjusting screws are loosened, the position of the first adjusting block 311 along the Z-axis direction can be adjusted due to the fact that the first waist-shaped holes 3111 can slide along the Z-axis direction relative to the first adjusting screws, and thus the position of the suction nozzle 34 along the Z-axis direction is adjusted. After the adjustment is completed, the two first adjusting screws are finally tightened, and the first adjusting block 311 is fixed to the base 2.

[0051] Still further, the second adjusting assembly 32 comprises a second adjusting block 321 and a second adjusting screw, the second adjusting block 321 is provided with a second waist-shaped hole 3211 extending along the X-axis direction, the first adjusting block 311 is provided with a second screw hole 3112 corresponding to the second waist-shaped hole 3211, and the second adjusting screw is arranged in the second waist-shaped hole 3211 and is threadedly connected to the second screw hole 3112. When it is necessary to adjust the position of the suction nozzle 34 along the X-axis direction, the second adjusting screw is loosened, the position of the second adjusting block 321 along the X-axis direction can be adjusted due to the fact that the second waist-shaped hole 3211 can slide along the X-axis direction relative to the second adjusting screw, and thus the position of the suction nozzle 34 along the X-axis direction is adjusted. After the adjustment is completed, the second adjusting screw is finally tightened, and the second adjusting block 321 is fixed to the first adjusting block 311.

[0052] Preferably, one of the bottom of the second adjusting block 321 and the top of the first adjusting block 311 is provided with a guide groove 3212 extending along the X-axis direction, and the other is provided with a guide boss 3113 extending along the X-axis direction, and the guide groove 3212 and the guide boss 3113 are in sliding connection. In the embodiment, the guide groove 3212 and the guide boss 3113 are both square, the bottom of the second adjusting block 321 is provided with the guide groove 3212, and the top of the first adjusting block 311 is provided with the guide boss 3113. When the second adjusting screw is loosened, the first adjusting block 311 can slide along the X-axis direction relative to the guide boss 3113, improving the moving accuracy of the second adjusting block 321, and the guide boss 3113 can limit the rotation of the second adjusting block 321 relative to the first adjusting block 311 around the X-axis. Finally, the second adjusting screw is tightened, and after adjustment, only one second adjusting screw needs to be tightened and fixed, and the limiting of the guide boss 3113 can realize the fixation of the second adjusting block 321 on the first adjusting block 311.

[0053] Further, the third adjusting assembly 33 comprises a third adjusting block 331 and two third adjusting screws, the third adjusting block 331 is provided with two third waist-shaped holes 3311 spaced apart along the Y-axis direction, the third waist-shaped holes 3311 extend along the X-axis direction, the top of the second adjusting block 321 is provided with third threaded holes 3213 corresponding to the two third waist-shaped holes 3311, and the third adjusting screws are threaded into the third waist-shaped holes 3311 and the third threaded holes 3213. When it is necessary to adjust the angle of the suction nozzle 34 relative to the Z-axis, the two third adjusting screws are loosened. Since the third waist-shaped holes 3311 can slide along the X-axis direction relative to the third adjusting screws, when the two third waist-shaped holes 3311 slide in opposite directions relative to the two third adjusting screws, the angle of the third adjusting block 331 relative to the Z-axis can be adjusted, thereby realizing the adjustment of the angle of the suction nozzle 34 relative to the Z-axis. After adjustment, the two third adjusting screws are finally tightened to realize the fixation of the third adjusting block 331 on the second adjusting block 321. Furthermore, when the two third waist-shaped holes 3311 slide in the same direction relative to the two third adjusting screws, the position of the suction nozzle 34 along the X-axis direction can be adjusted.

[0054] Furthermore, the third adjustment assembly 33 also includes a connecting block 332 and two fourth adjustment screws. The third adjustment block 331 is further provided with two fourth waist-shaped holes 3312 spaced apart along the Y-axis direction. The fourth waist-shaped holes 3312 extend along the Z-axis direction. The connecting block 332 is provided with fourth threaded holes 3321 corresponding to the two fourth waist-shaped holes 3312. The fourth adjustment screw passes through the fourth waist-shaped holes 3312 and is threadedly connected to the fourth threaded holes 3321. The suction nozzle 34 is connected to the connecting block 332. When it is necessary to adjust the angle of the suction nozzle 34 relative to the X-axis, the two fourth adjustment screws are loosened. Since the fourth waist-shaped holes 3312 can slide along the Z-axis relative to the fourth adjustment screws, when the two fourth waist-shaped holes 3312 slide in opposite directions relative to the two fourth adjustment screws, the angle of the connecting block 332 relative to the X-axis can be adjusted, thereby adjusting the angle of the suction nozzle 34 relative to the X-axis. After the adjustment is completed, the two fourth adjustment screws are finally tightened to fix the connecting block 332 to the third adjustment block 331. Furthermore, when the two fourth waist-shaped holes 3312 slide in the same direction relative to the two fourth adjusting screws, the position of the suction nozzle 34 along the Z-axis direction can be adjusted.

[0055] In this embodiment, the connecting block 332 is provided with a first slide rail extending along the Y-axis direction, the suction nozzle 34 is connected to the first slider, and the first slider is slidably connected to the first slide rail, so that the suction nozzle 34 is slidably connected to the third adjustment component 33 along the Y-axis direction.

[0056] like Figure 2 、 Figure 5 and Figure 6 As shown, in order to prevent the suction nozzle 34 from being in hard contact with the chip and causing damage to the chip when the suction nozzle 34 adsorbs or transfers the chip, preferably, the driving component 35 includes a first driving component 353, an elastic component 351 and a buffer block 352. The first driving component 353 is arranged on the base 2 and is driven and connected to the buffer block 352. The first driving component 353 is used to drive the buffer block 352 to move back and forth along the Y-axis direction. The buffer block 352 is provided with an abutment portion 3522. The abutment portion 3522 and the suction nozzle 34 are spaced apart along the Y-axis direction. One end of the elastic component 351 is connected to the abutment portion 3522, and the other end is connected to the end of the suction nozzle 34 away from the chip. When the chip needs to be adsorbed, the chip is located in front of the suction nozzle 34 along the Y-axis direction, and the first driving component 353 drives the buffer block 352 to move toward the chip. The buffer block 352 drives the suction nozzle 34 to move toward the chip through the elastic member 351. The suction nozzle 34 abuts against the chip and vacuum-adsorbs the chip. When the abutment force of the suction nozzle 34 on the chip is too large, the suction nozzle 34 slides relative to the third adjustment component 33 along the Y-axis direction and compresses the elastic member 351 to prevent the suction nozzle 34 from hard contact with the chip, forming overload protection and improving the chip yield. Moreover, the suction nozzle 34 is elastically connected to the buffer block 352 through the elastic member 351, and there will be no over-constraint when the suction nozzle 34 adjusts its posture.

[0057] Further preferably, the driving assembly 35 further comprises a fourth adjusting block 354 and two fifth adjusting screws, the first driving part 353 is drivingly connected to the fourth adjusting block 354, the buffer block 352 is provided with an elongated hole 3521 extending along the Y-axis direction, the fourth adjusting block 354 is provided with two fifth threaded holes 3541 spaced along the Y-axis direction, and the two fifth adjusting screws are respectively threaded into the elongated hole 3521 and the two fifth threaded holes 3541. When the two fifth adjusting screws are loosened, the elongated hole 3521 can slide along the Y-axis direction relative to the two fifth adjusting screws, the position of the abutting portion 3522 along the Y-axis direction is adjusted, and then the elastic force of the elastic member 351 is adjusted, so that the suction nozzle 34 has sufficient abutting force to adsorb the chip.

[0058] In the embodiment, the chip conveying mechanism 100 further comprises a support plate 4, the rotary driving member 1 is connected to the support plate 4, the first driving component 353 comprises a driving motor 3531, a cam 3532, a sliding seat 3533, a first follower 3534, a second follower 3535 and a tension spring 3536, the driving motor 3531 is connected to the support plate 4, the driving motor 3531 is drivingly connected to the cam 3532 and is configured to drive the cam 3532 to rotate, the sliding seat 3533 is slidingly connected to the support plate 4 along the Y-axis direction, one end of the tension spring 3536 is connected to the base 2 and the other end is connected to a fourth adjusting block 354, the first follower 3534 and the second follower 3535 are respectively arranged on the sliding seat 3533, the first follower 3534 is attached to one side of the cam 3532 close to the chip, the tension spring 3536 pulls the fourth adjusting block 354 inward to provide a force for the first follower 3534 to tightly adhere to the cam 3532, and the second follower 3535 is located on the side of the fourth adjusting block 354 away from the chip. When the cam 3532 rotates, the cam 3532 drives the sliding seat 3533 to move in the direction close to the chip through the first follower 3534, thereby driving the second follower 3535 to push the fourth adjusting block 354, so that the fourth adjusting block 354 and the buffer block 352 move in the direction close to the chip, and further drive the suction nozzle 34 to move in the direction close to the chip. When the cam 3532 resets, the tension spring 3536 can pull the fourth adjusting block 354 inward to reset the suction nozzle 34. In the embodiment, when the base 2 rotates, the driving motor 3531, the cam 3532, the sliding seat 3533, the first follower 3534 and the second follower 3535 are kept stationary on the support plate 4, therefore, the suction nozzles 34 of the plurality of pickup devices 3 can share the structures of the driving motor 3531, the cam 3532, the sliding seat 3533, the first follower 3534 and the second follower 3535, and the driving motor 3531, the cam 3532, the sliding seat 3533, the first follower 3534 and the second follower 3535 only need to be arranged at the loading position 101 and the first transfer position 102, the unloading position 104 and the second transfer position 103, thereby reducing the cost of the equipment and eliminating the problem of cable winding of the first driving component 353 when the base 2 rotates, and reducing the design difficulty. In other embodiments, the first driving component 353 can also be a linear motor, a pneumatic cylinder or other mechanism capable of linear reciprocating driving.

[0059] In the embodiment, the elastic member 351 applies an elastic force in the direction close to the chip to the suction nozzle 34, the suction nozzle 34 is further provided with a first stop pin 342, the fourth adjusting block 354 is provided with a second stop pin 3542, the second stop pin 3542 is located on the side of the first stop pin 342 close to the chip, and the elastic force of the elastic member 351 can drive the first stop pin 342 of the suction nozzle 34 to abut against the second stop pin 3542, and the second stop pin 3542 can limit the maximum displacement of the suction nozzle 34.

[0060] Preferably, the abutting part 3522 is provided with a positioning column 3523, the elastic member 351 is a spring, and the spring is sleeved on the positioning column 3523 to prevent the spring from being deflected relative to the abutting part 3522; and / or the end of the suction nozzle 34 away from the chip is provided with a positioning groove 341, and the spring is embedded in the positioning groove 341 to prevent the spring from being deflected relative to the suction nozzle 34, thereby improving the working reliability of the chip conveying mechanism 100 and improving the assembly convenience of the spring.

[0061] In the embodiment, the chip conveying mechanism 100 adopts a servo motor as a rotating driving member 1 to drive the four suction nozzles 34 to rotate, and the suction nozzles 34 are adjusted in position along the X axis, position along the Z axis, angle relative to the X axis, and angle relative to the Z axis through the first adjusting assembly 31, the second adjusting assembly 32, and the third adjusting assembly 33, so as to realize multi-dimensional adjustment of the suction nozzles 34. The pickup device 3 can reduce the rotating radius of the suction nozzles 34 to 65 mm, thereby improving the position accuracy of the suction nozzles 34.

[0062] The embodiment also provides a chip overturning and conveying method, which adopts the chip overturning and conveying device.

[0063] The first chip conveying mechanism 100 performs the following steps:

[0064] The rotating driving member 1 drives the pickup device 3 to rotate to the feeding position 101, and the pickup device 3 picks up the front surface of the chip. The rotating driving member 1 drives the pickup device 3 to rotate to the first transfer position 102.

[0065] The second chip conveying mechanism 100 performs the following steps:

[0066] The rotating driving member 1 drives the pickup device 3 to rotate to the second transfer position 103, the pickup device 3 located at the second transfer position 103 picks up the chip on the pickup device 3 located at the first transfer position 102, and the pickup device 3 picks up the back surface of the chip. The rotating driving member 1 drives the pickup device 3 to rotate to the discharging position 104, and the pickup device 3 pastes the front surface of the chip on the working carrier plate, thereby completing the overturning and conveying of the chip.

[0067] The embodiment completes the overturning and conveying of the chip through the two chip conveying mechanisms 100, without manual participation, thereby improving the production efficiency and reducing the production cost.

[0068] Note that the above merely describes preferred embodiments of the present application and the principles of the technology applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, modifications and substitutions can be made without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. A chip flipping and conveying device, characterized in that: The invention relates to a chip conveying mechanism (100) comprising two spaced-apart chip conveying mechanisms (100); the chip conveying mechanism (100) comprises a rotary drive member (1), a base (2) and a pickup device (3); the rotary drive member (1) is drivably connected to the base (2); the pickup device (3) is arranged on the base (2); the rotary drive member (1) of the first chip conveying mechanism (100) is used to drive the base (2) to rotate, so that the pickup device (3) of the first chip conveying mechanism (100) rotates to a loading position (101) and a first handover position (102); the rotary drive member (1) of the second chip conveying mechanism (100) is used to drive the base (2) to rotate, so that the pickup device (3) of the second chip conveying mechanism (100) rotates to a unloading position (104) and a second handover position (103); The picking device (3) located at the upper material position (101) is capable of picking up chips; the picking device (3) located at the first handover position (102) and the picking device (3) located at the second handover position (103) are arranged opposite to each other and are capable of respectively adsorbing both sides of the chip to hand over the chip; the picking device (3) located at the lower material position (104) is capable of transferring the chip to a working carrier.

2. The chip flipping and conveying equipment according to claim 1, characterized in that: The chip conveying mechanism (100) comprises four picking devices (3), and the four picking devices (3) are evenly spaced and arranged on the base (2) along the circumferential direction.

3. The chip flipping and conveying equipment according to claim 1, characterized in that: The picking device (3) includes a suction nozzle (34), a driving component (35) and a first adjusting component (31), a second adjusting component (32) and a third adjusting component (33) connected in sequence, wherein the suction nozzle (34) is connected to the third adjusting component (33) by sliding along the Y-axis direction, the driving component (35) is connected to the suction nozzle (34), and the driving component (35) is used to drive the suction nozzle (34) to slide back and forth along the Y-axis direction so that the suction nozzle (34) is close to or away from the chip, and the first adjusting component (31) is connected to the base (2); the first adjusting component (31) is used to adjust the displacement of the suction nozzle (34) along the Z-axis direction, the second adjusting component (32) is used to adjust the displacement of the suction nozzle (34) along the X-axis direction, and the third adjusting component (33) is used to adjust the angle of the suction nozzle (34) relative to the Z-axis and the angle relative to the X-axis.

4. The chip flipping and conveying equipment according to claim 3, characterized in that: The first adjustment assembly (31) comprises a first adjustment block (311) and two first adjustment screws. The first adjustment block (311) is provided with two first waist-shaped holes (3111) spaced apart along the Z-axis direction. The first waist-shaped holes (3111) extend along the Z-axis direction. The base (2) is provided with first threaded holes (21) corresponding to the two first waist-shaped holes (3111). The first adjustment screw is passed through the first waist-shaped holes (3111) and is threadedly connected to the first threaded holes (21).

5. The chip flipping and conveying equipment according to claim 4, characterized in that: The second adjustment assembly (32) includes a second adjustment block (321) and a second adjustment screw, wherein the second adjustment block (321) is provided with a second waist-shaped hole (3211) extending along the X-axis direction, the first adjustment block (311) is provided with a second threaded hole (3112) corresponding to the second waist-shaped hole (3211), and the second adjustment screw is passed through the second waist-shaped hole (3211) and is threadedly connected to the second threaded hole (3112).

6. The chip flipping and conveying equipment according to claim 5, characterized in that: One of the bottom of the second adjustment block (321) and the top of the first adjustment block (311) is provided with a guide groove (3212) extending along the X-axis direction, and the other is provided with a guide boss (3113) extending along the X-axis direction, and the guide groove (3212) is slidably connected to the guide boss (3113).

7. The chip flipping and conveying equipment according to claim 5, characterized in that: The third adjustment assembly (33) comprises a third adjustment block (331) and two third adjustment screws. The third adjustment block (331) is provided with two third waist-shaped holes (3311) spaced apart along the Y-axis direction. The third waist-shaped holes (3311) extend along the X-axis direction. The top of the second adjustment block (321) is provided with a third threaded hole (3213) corresponding to the two third waist-shaped holes (3311). The third adjustment screw is passed through the third waist-shaped hole (3311) and is threadedly connected to the third threaded hole (3213).

8. The chip flipping and conveying equipment according to claim 7, characterized in that: The third adjustment assembly (33) further includes a connecting block (332) and two fourth adjustment screws. The third adjustment block (331) is further provided with two fourth waist-shaped holes (3312) spaced apart along the Y-axis direction. The fourth waist-shaped holes (3312) extend along the Z-axis direction. The connecting block (332) is provided with a fourth threaded hole (3321) corresponding to the two fourth waist-shaped holes (3312). The fourth adjustment screw is passed through the fourth waist-shaped hole (3312) and is threadedly connected to the fourth threaded hole (3321). The suction nozzle (34) is connected to the connecting block (332).

9. The chip flipping and transferring device according to claim 3, characterized in that: The driving assembly (35) includes a first driving component (353), an elastic component (351) and a buffer block (352). The first driving component (353) is arranged on the base (2) and is driven and connected to the buffer block (352). The first driving component (353) is used to drive the buffer block (352) to move back and forth along the Y-axis direction. The buffer block (352) is provided with an abutment portion (3522). The abutment portion (3522) and the suction nozzle (34) are spaced apart along the Y-axis direction. One end of the elastic component (351) is connected to the abutment portion (3522), and the other end is connected to the end of the suction nozzle (34) away from the chip.

10. A chip flipping and transferring method, characterized in that: The chip flipping and conveying device according to any one of claims 1 to 9 is used; the chip flipping and conveying method comprises the following steps: The first chip transfer mechanism (100) performs the following steps: The rotary drive member (1) drives the picking device (3) to rotate to the loading position (101), and the picking device (3) picks up the front side of the chip; The rotary drive member (1) drives the picking device (3) to rotate to a first handover position (102); The second chip transfer mechanism (100) performs the following steps: The rotary drive member (1) drives the pickup device (3) to rotate to the second handover position (103), and the pickup device (3) located at the second handover position (103) picks up the chip on the pickup device (3) located at the first handover position (102), and the pickup device (3) picks up the back side of the chip; The rotary drive member (1) drives the picking device (3) to rotate to the unloading position (104), and the picking device (3) sticks the front side of the chip on the working carrier to complete the flipping and transmission of the chip.

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