Wafer transfer device

Abstract

The invention provides a wafer transfer device, and belongs to the field of semiconductor processing equipment, and the device specifically comprises a positioning assembly which can be connected with a wafer and is used for driving the wafer to move; the positioning assembly comprises a main fork arm, a horizontal pulling assembly and a negative pressure vacuumizing device, and a gas flow channel is formed in the main fork arm; the negative pressure vacuumizing device is connected with the gas flow channel and is used for generating suction force at the overflowing opening, so that the wafer is adsorbed and positioned by the horizontal pulling assembly; compared with the prior art, when the fork head is moved to the position where the wafer is located in the positioning opening and the wafer is in contact with the positioning plate, the negative-pressure vacuumizing device works to enable the flat barrel to drive the positioning plate to move, then the wafer is adsorbed, and when the positioning plate moves, the limiting strips are matched with the clamping plates, so that the wafer is clamped. When the wafer is clamped, the clamping plate applies certain auxiliary clamping force to the wafer, the wafer is positioned mainly through adsorption force at the moment, the clamping force borne by the clamping plate is relatively small, the wafer can have stability, and clamping deformation is avoided.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer transfer device. BACKGROUND

[0002] Wafer processing is a midstream manufacturing link of the entire semiconductor industry chain, which requires placing a wafer on a processing table, then etching the wafer, and after the etching processing is completed, the wafer needs to be taken off from the etching processing table and transferred to other positions.

[0003] In the prior art, a wafer is generally clamped by a mechanical hand, and then the wafer is transferred by moving the mechanical hand. However, when the wafer is clamped by the mechanical hand, the wafer is only subjected to the clamping force of the mechanical hand. In order to ensure that the wafer does not separate from the mechanical hand during the transfer process, there is a certain requirement for the size of the clamping force. In particular, when the thickness of the wafer is small, the wafer is easily deformed after being subjected to the clamping force, and the wafer needs to be corrected subsequently, which affects the processing efficiency. SUMMARY

[0004] The purpose of the present application is to provide a wafer transfer device that can stably transfer the wafer and reduce the stress deformation.

[0005] To achieve the above purpose, the technical solution adopted by the present application is a wafer transfer device, which comprises a positioning assembly capable of connecting with a wafer for driving the wafer to move. The positioning assembly comprises a main fork arm, a fork head, a positioning opening, a flat pulling assembly, and a negative pressure vacuum device. The main fork arm is internally provided with a gas flow channel. The fork head is connected to the end of the main fork arm. The positioning opening is arranged on the fork head. The flat pulling assembly is connected to the fork head and one end of the flat pulling assembly is located in the gas flow channel, and the other end is located in the positioning opening. An overflow port is arranged on the flat pulling assembly, so that the gas can flow into the gas flow channel after passing through the overflow port. The negative pressure vacuum device is connected with the gas flow channel, and is used to generate suction force at the overflow port to enable the flat pulling assembly to adsorb and position the wafer.

[0006] Further, the flat pulling assembly comprises a flat cylinder, a blocking plate, and a positioning plate. The flat cylinder is movably connected with the fork head. The blocking plate is fixed to the inner end of the flat cylinder and located in the gas flow channel. The positioning plate is fixed to the outer end of the flat cylinder and located in the positioning opening. The overflow port is arranged on the positioning plate. A gap is arranged on the flat cylinder, so that the gas can flow into the gas flow channel after flowing out of the gap.

[0007] Further, the fork head is provided with an adsorption channel, the flat cylinder passes through the adsorption channel, and the flat cylinder can move axially in the adsorption channel.

[0008] Further, the flat pulling assembly further comprises: A clamping plate is hingedly connected to the end of the positioning plate for applying a clamping force to the wafer.

[0009] Further, the clamping plate is matched with the limiting strip, the limiting strip is arranged in the positioning opening, and the clamping plate can swing inwards through the limiting strip during movement of the flat cylinder into the gas flow channel.

[0010] Further, a torsion spring is connected between the clamping plate and the positioning plate, a restoring force is applied to the clamping plate through the torsion spring, and a glue layer is arranged on the clamping plate.

[0011] Further, the positioning assembly is connected with a detection assembly, and the two can move synchronously; when the positioning assembly drives the detection assembly to move, the wafer on the positioning assembly is detected through the detection assembly.

[0012] Further, the detection assembly comprises a detection disc, a light emitting element and a photoelectric conversion disc, the detection disc is located below the fork head, the light emitting element is installed on the detection disc and can emit light to the wafer on the fork head, and the photoelectric conversion disc is located above the wafer and is connected with the fork head.

[0013] Further, a straight groove is arranged on the workbench, a matching rail is arranged in the straight groove, the detection disc can move along the length direction of the matching rail, and when the detection disc moves, the light emitting element can make a circular motion.

[0014] Further, the detection device further comprises a translation seat and a gear transmission assembly, the translation seat is connected with the detection disc and the matching rail and can drive the detection disc to move, the gear transmission assembly is arranged on the translation seat, the gear transmission assembly is matched with a gear rack, and the gear rack is located in the straight groove; during linear movement of the translation seat and the detection disc, the detection disc is rotated through the gear transmission assembly.

[0015] Compared with the prior art, the beneficial effects of the present application are as follows: when the fork head is moved to the position where the wafer is located in the positioning opening and the wafer is in contact with the positioning plate, the flat cylinder drives the positioning plate to move through the work of the negative pressure vacuum device, and then the wafer is adsorbed; at the same time when the positioning plate moves, the limiting strip cooperates with the clamping plate to make the clamping plate exert a certain auxiliary clamping force on the wafer; since the wafer is mainly positioned by adsorption force at this time, the clamping force received by the wafer is relatively small, so that the wafer has stability and is prevented from being deformed by clamping. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the mechanical fork cross-section structure of the present application; Figure 3 It is a schematic diagram of the flat cylinder structure of the present application; Figure 4 It is a schematic diagram of the connection between the detection assembly and the workbench of the present application; Figure 5 Structure diagram of the translation seat of the present application; Figure 6 Structure diagram of the detection disc of the present application; Figure 7 Structure diagram of the photoelectric conversion disc and the fork head of the present application; Figure 8 Structure diagram of the translation seat and the main fork arm of the present application; Wherein, 1-workbench, 2-moving arm, 3-main fork arm, 4-fork head, 5-positioning opening, 6-gas flow channel, 7-suction channel, 8-vacuum pipeline, 9-negative pressure vacuum device, 10-tray, 11-flat cylinder, 12-blocking plate, 13-gap, 14-positioning plate, 15-flowing port, 16-clamping plate, 17-limiting strip, 18-compression return spring, 19-straight slot, 20-matching rail, 21-translation seat, 22-detection disc, 23-light emitting element, 24-photoelectric conversion disc, 25-hanging disc body, 26-supporting pull rod, 27-micro cover, 28-positioning insertion column, 29-positioning insertion slot, 30-square seat, 31-transmission gear disc, 32-side gear disc, 33-rack, 34-hanging arm, 35-circular rod, 36-hanging plate, 37-return clamping plate, 38-guiding hole, 39-base body, 40-pushing plate, 41-positioning base disc, 42-tightening spring, 43-anti-disengagement block, 44-disc body. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will combine the drawings in the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0018] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms “mounting”, “connection” and “linking” should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0019] Reference Figures 1 to 2As shown, a wafer transfer device includes a workbench 1 and a positioning assembly, the positioning assembly is connected with the workbench 1 through a guide rail, so that the positioning assembly can move on the workbench 1, and the etched wafer is taken down by the positioning assembly and transported to a collection area.

[0020] The positioning assembly includes a moving arm 2 and a mechanical fork, and the two are connected to form a positioning pickup arm. A sliding seat is arranged on the workbench 1 and connected with the guide rail. The moving arm 2 on the positioning pickup arm is fixed on the sliding seat and moves on the guide rail through the sliding seat, driving the mechanical fork to move. When the mechanical fork contacts the wafer, the wafer can be positioned, and then the mechanical fork is continuously moved to take down the etched wafer. The above-mentioned mechanical fork includes a main fork arm 3 and a fork head 4. The main fork arm 3 is connected with the moving arm 2, and the fork head 4 is connected with the end of the main fork arm 3. The fork head 4 is provided with a positioning opening 5, so that the wafer can enter the positioning opening 5 of the fork head 4, and then the wafer is positioned through the connection between the fork head 4 and the wafer. The positioning of the wafer can be adsorptive positioning. For example, a gas flow channel 6 is arranged in the main fork arm 3, and an adsorption channel 7 is arranged on the fork head 4, which is in communication with the gas flow channel 6 and the positioning opening 5. A rubber pad is arranged at the adsorption channel 7 to increase the connection tightness between the fork head 4 and the wafer. The main fork arm 3 is connected with a negative pressure vacuum device 9 through a vacuum pipeline 8. The working of the negative pressure vacuum device 9 reduces the air pressure in the gas flow channel 6 and the adsorption channel 7, so that suction force is generated at the port of the adsorption channel 7, and the wafer can be adsorptively positioned. It should be noted that the negative pressure vacuum device 9 should move synchronously with the moving arm 2, so that the length of the vacuum pipeline 8 does not need to be changed. For example, a tray 10 is arranged on the moving arm 2, and the negative pressure vacuum device 9 is arranged on the tray 10. However, if there is excessive corrosion or other defects on the circumference of the wafer, it is difficult to adsorptively position the wafer when the circumference of the wafer is adsorbed through the adsorption channel 7. Figures 1 to 3As shown, a flat cylinder 11 can be arranged in the adsorption channel 7, the inner end of the flat cylinder 11 is located in the gas flow channel 6, the cross-sectional area of the gas flow channel 6 is larger than that of the adsorption channel 7, the flat cylinder 11 can move axially in the adsorption channel 7, but a sealing rubber pad is connected between the adsorption channel 7 and the flat cylinder 11, the inner end of the flat cylinder 11 is fixed with a blocking plate 12, the blocking plate 12 is located in the gas flow channel 6 and has a gap with the inner wall of the gas flow channel 6 at the edge, and the blocking plate 12 blocks the adsorption channel 7 at the beginning. At this time, the negative pressure vacuum device 9 is started to drive the flat cylinder 11 to move into the gas flow channel 6, a notch 13 is arranged on the flat cylinder 11, the notch 13 is located in the adsorption channel 7 when the blocking plate 12 blocks the adsorption channel 7, and the notch 13 is exposed after the flat cylinder 11 moves into the gas flow channel 6. At this time, the gas flow enters from the outer end of the flat cylinder 11, then flows through the notch 13 to the flow channel, and if the complete wafer is placed in the positioning opening 5 and contacts the outer end of the flat cylinder 11, the wafer can be adsorbed and positioned; In order to ensure that the wafer can be positioned, an arc-shaped positioning plate 14 is fixed to the outer end of the flat cylinder 11, the positioning plate 14 can cover the gap between the flat cylinder 11 and the adsorption channel 7, and the positioning plate 14 is provided with a flow port 15, an air suction is generated at the flow port 15 after the negative pressure vacuum device 9 is started, at this time, the flat cylinder 11, the positioning plate 14 and the blocking plate 12 form a flat pulling assembly, air can enter the flat cylinder 11 from the flow port 15, and the two ends of the positioning plate 14 are hingedly connected with clamping plates 16, the inner side of the clamping plates 16 is provided with a glue layer with a thickness of 1-3 mm, the clamping plates 16 are located in the positioning opening 5 of the fork head 4, and limiting strips 17 are arranged in the positioning opening 5, the limiting strips 17 are two and are located on the sides of the positioning plate 14, and the limiting strips 17 are located on the movement path of the clamping plates 16. During the movement of the flat cylinder 11 into the gas flow channel 6, the positioning plate 14 is driven to move, and the clamping plates 16 are synchronously moved during the movement, the clamping plates 16 are in contact with the corresponding limiting strips 17, the clamping plates 16 can be swung inward by the limiting action of the limiting strips 17, that is, the distance between the two clamping plates 16 becomes smaller, at this time, the wafer is clamped by the clamping plates 16, so that the stability of the wafer is increased, and torsional springs are connected between the clamping plates 16 and the positioning plate 14, the clamping plates 16 are provided with a restoring force by the torsional springs, that is, when the two clamping plates 16 clamp the wafer, the torsional springs are deformed to generate a restoring force, and when the limiting action of the limiting strips 17 is lost, the two clamping plates 16 are reset under the action of the restoring force of the torsional springs, the distance between the two clamping plates 16 becomes larger during the process, so that the wafer is released, and the work of the negative pressure vacuum device 9 is stopped, so that the adsorption and positioning of the wafer are stopped; The compression reset spring 18 is sleeved on the flat cylinder 11 and is located between the positioning plate 14 and the suction channel 7 of the fork head 4. When the negative pressure vacuum device 9 works, the flat cylinder 11 is moved, and the compression reset spring 18 is compressed. At this time, the compression reset spring 18 has a restoring force. When the negative pressure vacuum device 9 stops working, the flat cylinder 11 is reset under the action of the restoring force of the compression reset spring 18. At this time, the reset force of the torsion spring is matched, and the wafer is loosened by the clamping plate 16.

[0021] After the wafer is positioned by the fork head 4, the sliding seat is moved to move the wafer. In this process, the wafer can be detected by the detection assembly. Referring to Figure 1 , Figures 4 to 6 The detection assembly is arranged on the workbench 1. Specifically, the linear groove 19 is arranged on the workbench 1. When the sliding seat moves, the fork head 4 can move above the linear groove 19, that is, the fork head 4 moves along the length direction of the linear groove 19. The detection assembly is arranged in the linear groove 19, so that the wafer on the fork head 4 is detected by the detection assembly. The detection assembly in the technical solution is mainly used for detecting the regularity of the wafer, that is, whether the wafer is warped or the edge is excessively etched after etching. Figures 4 to 7 As shown in the figure, the detection assembly includes the matching rail 20 arranged in the linear groove 19. The matching rail 20 extends along the length direction of the linear groove 19. The translation seat 21 is arranged on the matching rail 20. The translation seat 21 is connected with the matching rail 20 and can move on the translation rail. The detection disc 22 is detachably connected to the translation seat 21. The light emitting element 23 is arranged on the detection disc 22. The light emitting element 23 can emit light to the wafer and work with the photoelectric conversion disc 24 arranged above the wafer to detect whether the wafer is circular. When it is detected that the wafer is not circular, it indicates that the wafer is deformed or excessively etched.

[0022] Specifically, the detection disc 22 comprises a disc body 44, the light emitting element 23 is installed on the disc body 44, light can be emitted through the light emitting element 23, the straight line distance between the light emitting element 23 and the center of the disc body 44 is equal to the radius of the wafer, and at this time the wafer and the disc body 44 are coaxial, that is, the light emitted by the light emitting element 23 can be shot at the edge of the wafer, at this time the light is blocked by the edge of the wafer and cannot be received by the photoelectric conversion disc 24, the photoelectric conversion disc 24 cannot generate an electrical signal output, if the wafer has been deformed (for example, warping occurs), the wafer is no longer circular, but becomes elliptical, at this time after the detection disc 22 rotates, the optical fiber emitting element makes a circular motion, when the wafer is circular, the wafer can block the light, but at this time the wafer is deformed and cannot block the optical fiber at some positions, so that the light can be shot on the photoelectric conversion disc 24, at this time the photoelectric conversion disc 24 receives the light and converts the energy of the light into an electrical signal and outputs the electrical signal to the display, forming a distribution image on the display, so that whether the measured wafer is in a qualified state can be intuitively displayed.

[0023] Similarly, when the wafer has a notch at the edge due to over-etching, it can also be detected, the light emitting element 23 in the technical solution is preferably an infrared light emitting element, and the photoelectric conversion disc 24 comprises a hanging disc body 25 connected to the fork head 4 through a support rod 26, the hanging disc body 25 is provided with a photoelectric detector (such as a photodiode) for receiving light, since the original electrical signal generated by the photoelectric detector is very weak (may be a microampere level or even smaller current or a millivolt level voltage), a micro cover 27 can be arranged on the upper surface of the hanging disc body 25, a signal amplifier is installed in the micro cover 27, the signal first passes through an amplifier circuit to enhance it to a level that can be processed by the subsequent circuit, at the same time the signal amplifier is connected with a processor / microcontroller, the amplified signal will be sent to the processing chip.

[0024] The detection disc 22 and the photoelectric conversion disc 24 are matched components, and need to be replaced when the wafer is replaced, so the positioning plug 28 is fixed on the lower surface of the disc body 44, the cross section of the positioning plug 28 is triangular or quadrilateral or polygonal, and the positioning plug groove 29 is arranged on the translation seat 21, the positioning plug 28 can be inserted into the positioning plug groove 29, at this time the detection disc 22 is connected with the translation seat 21, and the hanging disc body 25 and the supporting pull rod 26 are also detachably connected, for example, the square seat 30 is fixed on the end of the supporting pull rod 26, the horizontal through hole and the limiting blind hole are arranged on the square seat 30, the locking rod and the limiting column are arranged on the hanging disc body 25, after the locking rod passes through the horizontal through hole, the limiting column can be inserted into the limiting blind hole, the external thread is arranged on the locking rod, and the locking disc is screwed through the external thread, at this time the square seat 30 is clamped through the locking disc and the hanging disc body 25, so that the installation of the hanging disc body 25 is realized.

[0025] Referring to Figures 4 to 8 In order to increase the stability of detection, the rotation speed of the detection disc 22 is slow, and the detection disc 22 can rotate in the process that the translation seat 21 moves linearly in the linear groove 19, specifically, the translation seat 21 comprises a base body 39, the base body 39 is square and has a sliding groove on the bottom surface, the base body 39 is adaptively connected with the matching rail 20, for example, the cross sections of the matching rail 20 and the sliding groove are both "T" shaped, the center groove is arranged on the upper surface of the base body 39, the transmission gear disc 31 is arranged in the center groove, the intermediate gear disc and the side gear disc 32 are arranged in the base body 39, the intermediate shaft is connected with the base body 39, the outer ring pinion is fixed on the intermediate shaft and engaged with the transmission gear disc 31, the flat opening is arranged on the side surface of the base body 39, the edge of the side gear disc 32 extends from the flat opening, the side gear disc 32 is engaged with the intermediate gear disc, and the transmission ratio between the two is 5:1, that is, the side gear disc 32 rotates five times, and the intermediate gear disc rotates one time, the transmission gear assembly is composed of the transmission gear disc 31, the intermediate gear disc and the side gear disc 32, the rack 33 is arranged on the inner surface of the linear groove 19, the rack 33 extends along the length direction of the linear groove 19, and the rack 33 is engaged with the side gear disc 32, so that the side gear disc 32 can rotate when the base body 39 moves along the matching rail 20, and the intermediate gear disc is driven to rotate, the positioning plug groove 29 is arranged at the center position of the transmission gear disc 31, after the detection disc 22 is connected with the transmission gear disc 31, the translation seat 21 moves in the linear groove 19, so that the detection disc 22 can rotate.

[0026] When the above translation seat 21 moves in the linear slot 19, the mechanical fork simultaneously moves linearly, that is, the mechanical fork and the translation seat 21 move simultaneously, for example, the lower surface of the main fork arm 3 is butted against a vertically arranged hoist arm 34, the lower end of the hoist arm 34 is butted against a horizontal push arm, the horizontal push arm is connected with the translation seat 21, when the main fork arm 3 moves towards the wafer, the translation seat 21 is pushed by the horizontal push arm, so that the two move synchronously and in the same direction, on the contrary, when the main fork arm 3 moves to reset the fork head 4, the translation seat 21 is pulled by the horizontal push arm, so that the two reset simultaneously; The horizontal push arm is composed of two round rods 35 and a hanging plate 36, the two round rods 35 are parallel to each other and are horizontally arranged, the cooperating rail 20 is parallel to the round rods 35, one end of the two round rods 35 on the same side is fixed on the hanging plate 36, the other end of the two round rods 35 is fixed with a reset clamping plate 37, and the hanging plate 36 is fixed on the lower end of the hoist arm 34, meanwhile, two guide holes 38 are arranged on the base body 39, the two guide holes 38 penetrate the base body 39, the two round rods 35 are arranged in the corresponding guide holes 38 respectively, an extrusion plate 40 and a positioning base disc 41 are connected with the two round rods 35, the extrusion plate 40 is movably connected with the round rods 35, so that the base body 39 is located between the extrusion plate 40 and the reset clamping plate 37, a tight spring 42 is sleeved on each round rod 35, the tight spring 42 is a spring with restoring force after compression, the tight spring 42 is located between the extrusion plate 40 and the positioning base disc 41, the front end of the cooperating rail 20 has an anti-disengagement block 43, which can avoid the base body 39 from disengaging from the cooperating rail 20 during forward movement; At the initial time, the detection disc 22 on the translation seat 21 is located directly below the prong head 4, and when the prong head 4 is moved towards the wafer (at this time, the wafer is completed with etching processing, and the wafer is located on the processing table), the prong head 4 and the detection disc 22 on the translation seat 21 are moved simultaneously, and when the translation seat 21 abuts against the anti-disengagement block 43, the translation seat 21 cannot continue to move, at this time, the prong head 4 can continue to move forward, so that the close spring 42 is in a compressed state, and then the prong head 4 can be extended into the etching bin, and after the positioning plate 14 on the prong head 4 contacts the wafer, the wafer is positioned through the work of the negative pressure vacuum device 9, and then the sliding seat is reset and moved, so as to drive the main fork arm 3 and the prong head 4 to reset and move, at the initial stage of the reset movement, the wafer on the prong head 4 cannot be vertically aligned with the detection disc 22, and with the reset movement of the main fork arm 3, the translation seat 21 cannot move when it is reset under the action of the restoring force of the close spring 42, and when the return clamping plate 37 contacts the translation seat 21, the detection disc 22 on the translation seat 21 is located directly below the wafer on the prong head 4, and then with the continuous reset movement of the main fork arm 3, the translation seat 21 moves in the straight slot 19, in this process, the detection disc 22 on the translation seat 21 rotates, so as to drive the light emitting element 23 to make circular motion, thereby detecting the wafer, that is, the wafer can be detected during the transfer process, and the processing efficiency is improved.

[0027] In the technical solution, the sliding seat is controlled to move through the driving assembly, the driving assembly is arranged on the workbench 1, specifically, the driving assembly comprises a driving motor, the driving motor is connected with a synchronous belt through a driving wheel, a synchronous wheel is arranged on the workbench 1, the synchronous belt is connected with the driving wheel and the synchronous wheel at the same time, at this time, the synchronous belt forms a closed state, the sliding seat is connected with the synchronous belt through a positioning clamping piece, and the sliding seat can be moved through the work of the driving motor, according to the rotating direction of the driving wheel, the moving direction of the sliding seat can be changed, and finally the straight reciprocating movement of the sliding seat is realized. In order to increase safety, the anti-collision rod is arranged on the sliding seat, the anti-collision rod has a shock-absorbing telescopic structure, a stop seat is arranged on the workbench 1, when the sliding seat moves close to the stop seat, the anti-collision rod contacts the stop seat, limit position sensors are arranged on the stop seat, the limit position sensors are connected with the driving motor, when the anti-collision rod contacts the stop seat, the limit position sensors output control signals to the driving motor, at this time, the driving motor stops working, and damage to the equipment is avoided.

[0028] In addition, the upper surface of the detection disc 22 in the technical solution is not a plane, but a spherical surface. Even if there is residual liquid on the wafer, the liquid can flow downward after dropping on the detection disc 22. However, it should be noted that the bottom surface area of the detection disc 22 is larger than the top surface area of the translation seat 21, and a liquid discharge groove is arranged in the straight groove 19, so that the liquid can flow into the liquid discharge groove and finally flow out of the liquid discharge groove. The specific structure of the liquid discharge groove is a prior art, so it will not be described again.

[0029] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separated, and the components displayed as units can or can not be physical units, i.e., they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiments according to actual needs. Those skilled in the art can understand and implement without creative labor.

[0030] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer transfer device, characterized in that: include: A positioning component, which can be connected to the wafer to drive the wafer to move; The positioning component includes: A main fork arm (3) is provided with a gas flow channel (6) therein; A fork head (4) is docked at the end of the main fork arm (3); A positioning opening (5) is provided on the fork head (4); A flat pull assembly connected to the fork (4) with one end located in the gas flow channel (6) and the other end located in the positioning opening (5); The flow port (15) is provided on the flat pull assembly so that the gas can pass through the flow port (15) and enter the gas flow channel (6); The negative pressure vacuum device (9) is connected to the gas flow channel (6) and is used to generate suction at the flow port (15) so that the flat pulling component can absorb and position the wafer.

2. The wafer handling device according to claim 1, wherein: The flat pull assembly comprises: A flat cylinder (11) movably connected to the fork (4); A sealing plate (12) is fixed to the inner end of the flat cylinder (11) and is located in the gas flow channel (6); A positioning plate (14) is fixed to the outer end of the flat cylinder (11) and is located in the positioning opening (5), and the flow port (15) is provided on the positioning plate (14); The notch (13) is provided on the flat cylinder (11), so that the gas can flow out from the notch (13) and enter the gas flow channel (6).

3. The wafer handling device according to claim 2, wherein: The fork head (4) is provided with an adsorption channel (7), the flat cylinder (11) passes through the adsorption channel (7), and the flat cylinder (11) can move axially within the adsorption channel (7).

4. The wafer handling device according to claim 2, wherein: The flat pull assembly also includes: A clamping plate (16) is hinged to the end of the positioning plate (14) and is used to apply a clamping force to the wafer.

5. The wafer handling device according to claim 4, wherein: The clamping plate (16) cooperates with a limiting strip (17), and the limiting strip (17) is arranged in the positioning opening (5). When the flat cylinder (11) moves into the gas flow channel (6), the clamping plate (16) can swing inward through the limiting strip (17).

6. The wafer handling device according to claim 5, wherein: A torsion spring is connected between the clamping plate (16) and the positioning plate (14), and a restoring force is applied to the clamping plate (16) by the torsion spring. A glue layer is provided on the clamping plate (16).

7. The wafer handling device according to claim 1, wherein: The positioning component is connected to the detection component, and the two can move synchronously. When the positioning component drives the detection component to move, the wafer on the positioning component is detected by the detection component.

8. The wafer handling device according to claim 7, wherein: The detection component includes: A detection plate (22) is located below the fork (4); A light emitting element (23) is mounted on the detection plate (22) and is capable of emitting light toward the wafer on the fork head (4); The photoelectric conversion disk (24) is located above the wafer and connected to the fork (4).

9. The wafer handling device according to claim 8, wherein: The workbench (1) is provided with a linear groove (19), a matching rail (20) is provided in the linear groove (19), and the detection disk (22) can move along the length direction of the matching rail (20). When the detection disk (22) moves, the light emitting element (23) can perform a circular motion.

10. The wafer handling device according to claim 9, wherein: The detection device also includes: A translation seat (21) is connected to the detection plate (22) and the matching rail (20) and is capable of driving the detection plate (22) to move; A gear transmission assembly is arranged on the translation seat (21); The gear transmission assembly is coupled with a rack (33), which is located in the linear groove (19); When the translation seat (21) drives the detection disk (22) to move linearly, the detection disk (22) is rotated via the gear transmission assembly.

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