Semiconductor heating and heat dissipation integrated device

Abstract

The invention discloses a semiconductor heating and heat dissipation integrated device, and relates to the technical field of heat dissipation devices. Comprising a semiconductor chip module which comprises at least one semiconductor chilling plate. Through the bidirectional heat conduction characteristic of the semiconductor chilling plate, intelligent switching between a refrigerating mode and a heating mode is achieved, the problem that a traditional single-function heat dissipation system is insufficient in adaptability in the environment with the large temperature difference is solved, the compact heat exchange module is combined with the flow guide pipe, the spiral copper pipe and the U-shaped air channel design, cooling liquid circulation and an airflow path are optimized, and the heat dissipation efficiency is improved. The heat exchange efficiency is obviously improved; an insulation protection layer, modular installation and heat conduction paste attaching technology are adopted, safety, maintenance convenience and heat conduction efficiency are considered, the control unit dynamically regulates and controls the operation mode based on a temperature sensor, condensation risks are avoided, energy consumption is reduced, the system is particularly suitable for small equipment, efficient temperature control can be achieved without a complex liquid cooling module, and the cost is reduced. The equipment stability and the operation and maintenance cost are effectively balanced.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of heat dissipation devices, in particular to a semiconductor heating and heat dissipation integrated device. BACKGROUND

[0002] With the wide application of new energy technology in various fields, such as low-altitude equipment, automobile industry, electric forklifts, energy storage fields, and the like, heat management generated in the working process of the battery pack has become a key problem.

[0003] Traditional heat dissipation methods can only solve the heat dissipation demand singly, and existing small pack modules (such as two-wheeled vehicles, motorcycles, forklifts and the like) cannot effectively meet the requirements in some application scenarios which need to have both heating and heat dissipation functions (for example, using energy storage battery packs or automobile battery packs in places with large temperature differences between winter and summer), in addition, the existing liquid cooling heating and heat dissipation devices have problems such as low efficiency, high energy consumption and complex structure, and can only be used in large energy storage or equipment, and cannot meet the requirements of small equipment, but large equipment increases the operation cost and maintenance difficulty, and the use effect is not ideal. SUMMARY

[0004] To achieve the above-mentioned purpose, the application provides the following technical scheme: a semiconductor heating and heat dissipation integrated device, comprising: A semiconductor chip module comprises a plurality of semiconductor refrigeration pieces, the semiconductor refrigeration pieces are provided with refrigeration surfaces and heating surfaces, the side ends are connected to positive and negative electrodes, and the periphery is provided with an insulating protective layer; A heat exchange module is used for mounting the semiconductor chip module, and the heat exchange module comprises heat dissipation fins and a heating and cooling assembly; A control unit is used for controlling the operation of the heating and cooling assembly according to a temperature signal.

[0005] As a preferred technical scheme of the application, the number of semiconductor refrigeration pieces is not less than two, the top surfaces of the two semiconductor refrigeration pieces are respectively a refrigeration surface and a heating surface, and are respectively used for refrigerating or heating a product.

[0006] As a preferred technical scheme of the application, the heat exchange module further comprises a heat dissipation base plate, the top of the heat dissipation base plate is provided with a groove position matched with the semiconductor refrigeration piece, and the bottom of the inner wall of the groove position is tightly combined with the refrigeration surface or the heating surface of the semiconductor refrigeration piece through heat-conducting paste.

[0007] As a preferred technical scheme of the application, the number of heat dissipation fins is several, the several heat dissipation fins are distributed on the bottom of the heat dissipation base plate, two adjacent heat dissipation fins are connected in communication through a flow guide pipe, and the flow guide pipes on the two sides of the heat dissipation fin are diagonally distributed.

[0008] As a preferred technical solution of the present application, the heating and cooling assembly comprises a heat dissipation air duct, a heating wire, a cooling liquid, a circulating pump and a fan, one side of the plurality of heat dissipation fins is provided with a heat dissipation air duct, the heat dissipation air duct is U-shaped, and the two ends of the heat dissipation air duct extend to the bottom of the two ends of the heat dissipation base plate respectively.

[0009] As a preferred technical solution of the present application, the inside of the heat dissipation air duct is fixedly provided with a plurality of spiral copper pipes, the two ends of the plurality of spiral copper pipes are commonly provided with a connecting head, and the cross section of the spiral copper pipe is oval.

[0010] As a preferred technical solution of the present application, the inside of the heat dissipation air duct is fixedly provided with a circulating pump, the inside of the plurality of heat dissipation fins and spiral copper pipes is filled with a cooling liquid, the plurality of heat dissipation fins and the flow guide pipe commonly constitute a cooling liquid circulation path, the outlet of the spiral copper pipe is communicated with the inlet of the cooling liquid circulation path through the circulating pump, and the outlet of the cooling liquid circulation path is communicated with the inlet of the spiral copper pipe through the circulating pump.

[0011] As a preferred technical solution of the present application, the two sides of the heat dissipation air duct are provided with fans, the two fans are opposite to the two ends of the spiral copper pipe respectively, a partition plate is fixedly arranged at the middle position of the inside of the heat dissipation air duct, and the surface of the spiral copper pipe is fixed to the inside of the partition plate.

[0012] As a preferred technical solution of the present application, the control unit comprises a control board and a plurality of temperature sensors arranged in the slot and the bottom of the heat dissipation base plate.

[0013] As a preferred technical solution of the present application, a power module is further included, the power module comprises a direct current power supply and a power management circuit, and is used for providing power for the semiconductor chip module, the heating wire, the circulating pump and the control unit.

[0014] Compared with the prior art, the present application provides a semiconductor heating and cooling integrated device, which has the following beneficial effects: The semiconductor heating and cooling integrated device realizes intelligent switching of refrigeration and heating modes through the bidirectional heat conduction characteristics of the semiconductor refrigeration fin, solves the problem of insufficient adaptability of the traditional single-function heat dissipation system in a large temperature difference environment, optimizes the cooling liquid circulation and airflow path through the compact heat exchange module combined with the flow guide pipe, spiral copper pipe and U-shaped air duct design, and significantly improves the heat exchange efficiency; the safety, maintenance convenience and heat conduction efficiency are considered through the insulation protective layer, modular installation and thermal paste bonding technology, the control unit dynamically controls the operation mode based on the temperature sensor, avoids the condensation risk, reduces the energy consumption, and is especially suitable for small equipment, and high-efficiency temperature control can be realized without complex liquid cooling modules, effectively balancing the equipment stability and operation and maintenance cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 2 This is a schematic structural diagram of a heat exchange module of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 3 This is a schematic diagram of the slot structure of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 4 This is a schematic diagram of the structure of a semiconductor chip module of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 5 A top-down cross-sectional view of the heat sink structure of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 6 for Figure 5 A magnified view of the structure at point A; Figure 7 This is a cross-sectional view of the spiral copper tube structure of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 8 A schematic diagram of a coolant circulation path for a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 9 A schematic diagram of the air flow path of a semiconductor heating and heat dissipation integrated device proposed by the present invention; Figure 10 This is an electrical schematic diagram of the overall circuit of a semiconductor integrated heating and heat dissipation device proposed by the present invention.

[0016] In the figure: 1. Semiconductor chip module; 11. Semiconductor refrigeration plate; 12. Cooling surface; 13. Heating surface; 14. Positive and negative electrodes; 2. Heat exchange module; 21. Heat sink; 22. Heating and cooling assembly; 221. Heat dissipation duct; 222. Heating wire; 223. Circulation pump; 224. Fan; 225. Spiral copper tube; 226. Connector; 227. Partition; 23. Heat dissipation substrate; 24. Slot; 25. Guide tube; 3. Control unit; 31. Control board; 32. Temperature sensor; 4. Power module. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] Please refer to Figures 1-10 A semiconductor heating and cooling integrated device, comprising a semiconductor chip module 1, comprising a number of not less than one semiconductor refrigeration sheet 11, the semiconductor refrigeration sheet 11 is provided with refrigeration surface 12 and heating surface 13, the side end has a connection positive and negative electrode 14, the surrounding is equipped with insulation protective layer, the insulation protective layer can adopt high temperature resistant insulation ceramic coating, PVD nanometer coating, PVDF insulation coating, composite ceramic film coating.

[0019] Heat exchange module 2, for installing the semiconductor chip module 1, the heat exchange module 2 comprises fin 21 and heating cooling assembly 22.

[0020] Control unit 3, for controlling the operation of heating cooling assembly 22 according to temperature signal.

[0021] As a specific technical scheme of the embodiment, the number of semiconductor refrigeration sheets 11 is not less than two, the top surface of two semiconductor refrigeration sheets 11 is refrigeration surface 12 and heating surface 13 respectively, which is used for refrigeration or heating of products.

[0022] In the embodiment, two semiconductor refrigeration sheets 11 are used for refrigeration and heating respectively, which cannot be used at the same time, and are used for scene automatic switching to solve the above-mentioned problem that only large can be achieved in existing equipment, and realize efficient and flexible heating and cooling function switching to improve the working stability and efficiency of semiconductor devices, reduce energy consumption and equipment maintenance and replacement.

[0023] As a specific technical scheme of the embodiment, the heat exchange module 2 further comprises a heat dissipation substrate 23, the top of the heat dissipation substrate 23 is provided with a groove position 24 matched with the semiconductor refrigeration sheet 11, and the bottom of the inner wall of the groove position 24 is tightly combined with the refrigeration surface 12 or the heating surface 13 of the semiconductor refrigeration sheet 11 through heat conductive paste.

[0024] In the embodiment, the setting of the heat-conducting paste improves the fitting effect of the refrigeration surface 12 or the heating surface 13 of the semiconductor refrigeration sheet 11 and the inner wall of the slot 24, guarantees the heat-conducting and heat-dissipating efficiency, and the four corners of the heat-dissipating substrate 23 are internally provided with screw grooves. After the heat-dissipating substrate 23 is connected with the equipment, the side of the equipment needing heat dissipation or heating is matched with the heat-dissipating substrate 23 to compress the refrigeration surface 12 or the heating surface 13 of the semiconductor refrigeration sheet 11. The heat-conducting paste can also be coated on the refrigeration surface 12 and the heating surface 13 of the semiconductor refrigeration sheet 11 facing the equipment, so that the contact between the semiconductor refrigeration sheet 11 and the equipment is more compact, the heat-conducting and heat-dissipating efficiency is improved, the semiconductor refrigeration sheet 11 as a whole is deformable, the design makes the semiconductor refrigeration sheet 11 keep a state of not moving after being compressed at the top, and the semiconductor refrigeration sheet 11 will not shake, so that the use is more stable. After the heat-dissipating substrate 23 and the equipment are separated, the semiconductor refrigeration sheet 11 can be directly taken down, so that the maintenance is more convenient.

[0025] As a specific technical solution of the embodiment, the number of the heat-dissipating fins 21 is several, the several heat-dissipating fins 21 are distributed at the bottom of the heat-dissipating substrate 23, two adjacent heat-dissipating fins 21 are connected through the flow guide pipes 25, and the flow guide pipes 25 on the two sides of the heat-dissipating fin 21 are diagonally distributed.

[0026] In the embodiment, the flow guide pipes 25 on the two sides of the heat-dissipating fin 21 are diagonally arranged, which can make the cooling liquid entering the inside of the heat-dissipating fin 21 fully flow and maximize the circulation of the cooling liquid in the heat-dissipating fin 21, so that the heat can be fully taken away. The heat-dissipating fin 21 is made of a metal material with high heat-conducting coefficient, which can be copper or aluminum. The shape is designed to have a large heat-dissipating surface area, preferably a long strip shape, occupies a small space, and is tightly matched with the refrigeration surface 12 or the heating surface 13 of the semiconductor chip module 1 through the heat-dissipating substrate 23, so that the heat or cold is transmitted through heat conduction.

[0027] As a specific technical solution of the embodiment, the heating and cooling assembly 22 includes a heat-dissipating air duct 221, heating wires 222, cooling liquid, a circulating pump 223 and a fan 224. One side of the several heat-dissipating fins 21 is commonly provided with the heat-dissipating air duct 221, the heat-dissipating air duct 221 is in a U shape, and the two ends of the heat-dissipating air duct 221 respectively extend to the bottom of the two ends of the heat-dissipating substrate 23.

[0028] In the embodiment, the U-shaped heat-dissipating air duct 221 provides a mounting position for the circulating pump 223 and simultaneously provides a heat-dissipating passage for the spiral copper pipe 225. The heat-dissipating air duct 221 is integrated on one side of the several heat-dissipating fins 21, occupies a small space, and is suitable for some small equipment and is more convenient to install.

[0029] As a specific technical solution of the embodiment, the interior of the heat dissipation air duct 221 is fixedly provided with a plurality of spiral copper pipes 225, both ends of the plurality of spiral copper pipes 225 are commonly provided with a connecting head 226, and the cross section of the spiral copper pipe 225 is oval.

[0030] In the embodiment, the spiral copper pipe 225 is designed to form a turbulent flow by increasing the surface curvature of the copper pipe, improve the heat exchange efficiency of the air flow and the pipe wall, and prolong the air flow contact time. The fan 224 is started, the fan 224 sucks air from the outside to the inside of the heat dissipation air duct 221, the air is in full contact with the surface of the spiral copper pipe 225, effectively taking away the heat on the spiral copper pipe 225, improving the heat dissipation efficiency, so that the high-temperature cooling liquid in the spiral copper pipe 225 is quickly cooled and put into the heat dissipation fin 21 for circulation. The cross section of the spiral copper pipe 225 is oval or rectangular, which replaces the circular cross section to increase the windward area under the same volume and strengthen the convective heat dissipation effect. The number of spiral copper pipes 225 is not less than two. The double spiral copper pipe 225 design is suitable for parts of compact space, which can effectively improve the heat dissipation efficiency of the cooling liquid.

[0031] As a specific technical solution of the embodiment, the interior of the heat dissipation air duct 221 is fixedly provided with a plurality of spiral copper pipes 225, both ends of the plurality of spiral copper pipes 225 are commonly provided with a connecting head 226, and the cross section of the spiral copper pipe 225 is oval.

[0032] In the embodiment, referring to Figure 8 , the cooling liquid circulates in the direction of the arrow. When the device needs to be cooled, the semiconductor refrigeration fin 11 of the refrigeration surface 12 facing the device is started to cool the device. The refrigeration surface 12 of the semiconductor refrigeration fin 11 transmits heat to the heat dissipation substrate 23 and the heat dissipation fin 21. When the temperature sensor 32 detects that the temperature of the refrigeration surface 12 of the semiconductor refrigeration fin 11 is too high or the BMS set threshold upper limit is started, the circulating pump 223 drives the cooling liquid to circulate, referring to Figure 9 , the fan 224 is started to dissipate heat from the spiral copper pipe 225. The air after the spiral copper pipe 225 is cooled directly enters the gap between the plurality of heat dissipation fins 21 to dissipate heat from the heat dissipation fin 21, and finally is discharged. The air is fully utilized, and the structure is simple and ingenious.

[0033] As a specific technical solution of the embodiment, the heat dissipation air duct 221 is provided with a fan 224 on each side, and the two fans 224 are opposite to the two ends of the spiral copper pipe 225, respectively. The heat dissipation air duct 221 is fixedly provided with a partition plate 227 at the middle position inside.

[0034] In the embodiment, the partition plate 227 can separate the heat dissipation air duct 221, avoid the vortex generated by the two fans 224, and destroy the stability of the original one-way flow. The partition plate 227 can also fix the spiral copper pipe 225, and ensure the stability of the spiral copper pipe 225.

[0035] As a specific technical solution of the embodiment, the control unit 3 includes a control board 31 and a plurality of temperature sensors 32 arranged inside the slot 24 and at the bottom of the heat dissipation substrate 23.

[0036] In the embodiment, the temperature sensors 32 are also arranged on the device battery module, and the temperature sensors 32 on the device convert the temperature signal into an electrical signal, which is used to monitor the temperature change in real time and transmitted to the control unit 3. When the temperature of the device battery module is too high or the upper limit of the BMS setting threshold is monitored, the control unit 3 starts the semiconductor refrigeration sheet 11 for refrigeration, conducts heat to the heat dissipation substrate 23 and the heat dissipation fin 21, and starts the fan 224 and the circulating pump 223 for liquid cooling. When the temperature of the device battery module is too low (such as in the starting stage or in a low-temperature environment), the control unit 3 starts the semiconductor refrigeration sheet 11 for heating according to the temperature threshold preset by the BMS, and the cold energy is conducted to the heat dissipation fin 21 through the heat dissipation substrate 23. The heating wire 222 is started to heat the heat dissipation fin 21 to avoid condensation on the heat dissipation fin 21. Until the temperature of the device battery module reaches the normal working range or the BMS setting threshold, the control unit 3 can also dynamically adjust the refrigeration and heating time according to the temperature change to realize accurate temperature control.

[0037] As a specific technical solution of the embodiment, the power module 4 is also included, which includes a direct current power supply and a power management circuit, and is used to provide power for the semiconductor chip module 1, the heating wire 222, the circulating pump 223 and the control unit 3.

[0038] In the embodiment, the direct current power supply and the power management circuit are included, the direct current power supply provides stable power supply for the semiconductor chip module 1 and the control circuit, and the power management circuit is responsible for the distribution and management of the power supply, ensures that each component works under appropriate voltage and current, and has functions such as overcurrent and overvoltage protection, to improve the safety and reliability of the device.

[0039] During use, when the device battery module needs to dissipate heat, the temperature sensor 32 on the device battery module converts the temperature signal into an electrical signal and transmits it to the control unit 3. When the device battery pack temperature is detected to be too high or the BMS sets an upper threshold, the control unit 3 activates the semiconductor cooling plate 11 for cooling to cool the device battery module. At the same time, the semiconductor cooling plate 11 transfers heat to the heat dissipation substrate 23 and the heat sink 21, and activates the fan 224 and the circulation pump 223 for liquid cooling and heat dissipation. When the device battery module needs to be heated, when it is monitored that the temperature of the device battery module is too low (such as in the startup stage or in a low temperature environment), the control unit 3 starts the semiconductor refrigeration plate 11 for heating according to the temperature threshold preset by the BMS, and performs heating. The cooling side conducts the cold energy to the heat sink 21 through the heat dissipation substrate 23, and starts the heating wire 222 to heat the heat sink 21, thereby avoiding condensation on the heat sink 21, until the temperature of the device battery module reaches the normal operating range or the threshold set by the BMS. At the same time, the control unit 3 can also dynamically adjust the cooling and heating time according to temperature changes to achieve precise temperature control.

[0040] To sum up, the semiconductor heating and heat dissipation integrated device realizes the intelligent switching of cooling and heating modes through the bidirectional heat conduction characteristics of the semiconductor refrigeration plate 11, and solves the problem of insufficient adaptability of traditional single-function heat dissipation systems in environments with large temperature differences. Its compact heat exchange module 2 combines the guide tube 25, the spiral copper tube 225 and the U-shaped air duct design to optimize the coolant circulation and airflow path, significantly improving the heat exchange efficiency; it adopts an insulating protective layer, modular installation and thermal paste bonding technology to take into account safety, maintenance convenience and heat conduction efficiency. The control unit 3 dynamically adjusts the operating mode based on the temperature sensor 32 to avoid condensation risks and reduce energy consumption. It is especially suitable for small equipment and can achieve efficient temperature control without a complex liquid cooling module, effectively balancing equipment stability and operation and maintenance costs.

[0041] It should be noted that, in this document, terms such as "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0042] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. A semiconductor heating and heat dissipation integrated device, characterized in that: include: A semiconductor chip module (1) comprises at least one semiconductor refrigeration plate (11), wherein the semiconductor refrigeration plate (11) is provided with a cooling surface (12) and a heating surface (13), has positive and negative electrodes (14) connected to the side ends, and is surrounded by an insulating protective layer; A heat exchange module (2) for mounting the semiconductor chip module (1), the heat exchange module (2) comprising a heat sink (21) and a heating and cooling assembly (22); The control unit (3) is used to control the operation of the heating and cooling component (22) according to the temperature signal.

2. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: The number of the semiconductor refrigeration sheets (11) is no less than two, and the top surfaces of the two semiconductor refrigeration sheets (11) are respectively a cooling surface (12) and a heating surface (13), which are used to cool or heat the product respectively.

3. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: The heat exchange module (2) further comprises a heat dissipation substrate (23), the top of which is provided with a slot (24) matching the semiconductor refrigeration plate (11), and the bottom of the inner wall of the slot (24) is tightly fitted to the cooling surface (12) or the heating surface (13) of the semiconductor refrigeration plate (11) via thermal paste.

4. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: There are a plurality of heat sinks (21), and the plurality of heat sinks (21) are distributed at the bottom of the heat dissipation substrate (23). Two adjacent heat sinks (21) are connected via a flow guide tube (25), and the flow guide tubes (25) on both sides of the heat sink (21) are distributed diagonally.

5. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: The heating and cooling assembly (22) includes a heat dissipation duct (221), a heating wire (222), a coolant, a circulation pump (223) and a fan (224). A heat dissipation duct (221) is provided on one side of a plurality of heat dissipation fins (21). The heat dissipation duct (221) is U-shaped, and two ends of the heat dissipation duct (221) extend to the bottom of both ends of the heat dissipation substrate (23).

6. The semiconductor heating and heat dissipation integrated device according to claim 5, characterized in that: A plurality of spiral copper tubes (225) are fixedly arranged inside the heat dissipation duct (221), and a connector (226) is commonly provided at both ends of the plurality of spiral copper tubes (225). The cross section of the spiral copper tubes (225) is elliptical.

7. The semiconductor heating and heat dissipation integrated device according to claim 5, characterized in that: Circulation pumps (223) are provided inside both ends of the heat dissipation duct (221), and the interiors of a plurality of the heat sinks (21) and the spiral copper tube (225) are filled with coolant. The plurality of heat sinks (21) and the guide tube (25) together form a coolant circulation path. The liquid outlet of the spiral copper tube (225) is connected to the liquid inlet of the coolant circulation path through the circulation pump (223), and the liquid outlet of the coolant circulation path is connected to the liquid inlet of the spiral copper tube (225) through the circulation pump (223).

8. The semiconductor heating and heat dissipation integrated device according to claim 5, characterized in that: Fans (224) are provided on both sides of the heat dissipation duct (221), and the two fans (224) are respectively opposite to the two ends of the spiral copper tube (225). A partition (227) is fixedly provided in the middle position inside the heat dissipation duct (221), and the surface of the spiral copper tube (225) is fixed to the inside of the partition (227).

9. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: The control unit (3) includes a control board (31) and a plurality of temperature sensors (32) arranged inside the slot (24) and at the bottom of the heat dissipation substrate (23).

10. The semiconductor heating and heat dissipation integrated device according to claim 1, characterized in that: A power supply module (4) is also included, and the power supply module (4) includes a DC power supply and a power management circuit, and is used to provide power to the semiconductor chip module (1), the heating wire (222), the circulation pump (223) and the control unit (3).

Images