Modular sound absorption and heat dissipation structure for photovoltaic panel and photovoltaic panel

Abstract

The invention relates to the technical field of acoustic design of photovoltaic power generation, and discloses a modular sound absorption and heat dissipation structure for a photovoltaic panel and the photovoltaic panel. A plurality of modular sound absorption and heat dissipation structures are spliced into a back plate of the photovoltaic panel, each modular sound absorption and heat dissipation structure comprises a rectangular groove, a micro-perforated plate and a mixed film resonator, the micro-perforated plate covers a notch of the rectangular groove and is used for absorbing part of noise penetrating through the micro-perforated plate, and the mixed film resonator is suspended in the rectangular groove and is used for absorbing the noise penetrating through the micro-perforated plate. The energy converter is used for converting energy of noise penetrating through the micro-perforated plate into vibration so as to drive air in the rectangular groove to circulate; the photovoltaic panel comprises a back plate and a plurality of solar cells, the back plate comprises a plurality of modularized sound absorption and heat dissipation structures in any embodiment, the modularized sound absorption and heat dissipation structures are spliced together, and the solar cells are laid on the back plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of acoustic design of photovoltaic power generation, in particular to a modular sound absorption and heat dissipation structure for a photovoltaic panel and a photovoltaic panel. BACKGROUND

[0002] At present, power facilities are increasingly integrated with residential areas, and the importance of noise control of substations and integration of green energy is increasingly highlighted. According to the Industrial Enterprise Boundary Environmental Noise Emission Standard (GB12348-2008) 2, the daytime noise of substations needs to be controlled within 60dB(A), and the nighttime noise should not exceed 50dB(A).

[0003] However, the conventional photovoltaic backboard has a relatively dense structure and lacks targeted acoustic design, so its sound insulation effect is not satisfactory and cannot effectively block the noise inside the substation from spreading outside. More importantly, the photovoltaic backboard generates a large amount of heat during operation, and the existing heat dissipation methods are mostly inefficient, causing the backboard temperature to be too high, which in turn leads to a decrease in photovoltaic power generation efficiency, which greatly limits the comprehensive benefits of photovoltaic and building integration technology.

[0004] To solve the sound insulation and heat dissipation problems, the existing technology attempts to design the sound absorption and heat dissipation functions separately, which makes the sound absorption structure need to occupy valuable building space, conflicting with the installation and layout of the photovoltaic backboard. Heat dissipation devices such as forced air cooling systems generate secondary noise due to the operation of mechanical parts during operation, which in turn weakens the overall noise reduction effect.

[0005] Therefore, a new design scheme is needed to comprehensively solve the coupling problem of sound insulation and heat dissipation. SUMMARY

[0006] The technical problem to be solved by the present application is how to comprehensively solve the coupling problem of sound insulation and heat dissipation.

[0007] To solve the above technical problems, the present application provides a modular sound absorption and heat dissipation structure for a photovoltaic panel and a photovoltaic panel.

[0008] In a first aspect, the present application provides a modular sound absorption and heat dissipation structure for a photovoltaic panel, a plurality of modular sound absorption and heat dissipation structures being spliced into a backboard of a photovoltaic panel, the modular sound absorption and heat dissipation structure comprising: a rectangular groove; a micro-perforated plate, the micro-perforated plate being covered on a slot of the rectangular groove, for absorbing part of the noise passing through the micro-perforated plate; and a hybrid film resonator, the hybrid film resonator being suspended in the rectangular groove, for converting the energy of the noise passing through the micro-perforated plate into vibration to drive the air circulation in the rectangular groove.

[0009] In an embodiment, the micro-perforated plate has a thickness of 1-1.5 mm, the micro-perforated plate has a hole diameter of 0.1-0.5 mm, and the micro-perforated plate has a perforation rate of 4-8%.

[0010] In an embodiment, the rectangular groove includes a first side, a second side, a third side, a fourth side, and a bottom, the first side and the third side are opposite to each other, and the second side and the fourth side are opposite to each other; the hybrid film resonator includes a thin film, a mass block is arranged at a middle portion of the thin film, the thin film is fixedly connected between the first side and the third side, a spacing is left between the thin film and the second side and between the thin film and the third side, a spacing between an end of the thin film close to the second side and the bottom is greater than a spacing between an end of the thin film close to the fourth side and the bottom.

[0011] In an embodiment, the thin film has a thickness of 0.1-0.5 mm, and the spacing between the thin film and the second side and the spacing between the thin film and the third side are 2-5 mm.

[0012] In an embodiment, the mass block is made of a copper alloy, the mass block has a mass of 0.1-5 g, the mass block is fixed on the thin film, and a distance between the mass block and the end of the thin film close to the fourth side accounts for one-third of a length of the thin film.

[0013] In an embodiment, the spacing between the end of the thin film close to the second side and the bottom is 30 mm, and the spacing between the end of the thin film close to the fourth side and the bottom is 10 mm.

[0014] In an embodiment, a first C-shaped member is arranged on an outer side corresponding to the second side, a second C-shaped member is arranged on an outer side corresponding to the fourth side, an opening direction of the first C-shaped member is opposite to an opening direction of the second C-shaped member, a recess is arranged at a middle portion of the first C-shaped member, and a protrusion matching the recess is arranged at a middle portion of the second C-shaped member; adjacent modular sound-absorbing and heat-dissipating structures are spliced by buckling of the first C-shaped member and the second C-shaped member.

[0015] In an embodiment, an end of the third side close to the second side is lower than an end of the third side close to the fourth side, a drainage groove is arranged on the third side, and a drainage hole is arranged on the second side, a position of the drainage hole corresponding to a position of the drainage groove.

[0016] In an embodiment, an angle between the third side and a horizontal plane is 2.5-3.5 degrees.

[0017] In a second aspect of the present application, a photovoltaic panel is provided, which includes: a back plate including a plurality of modular sound-absorbing and heat-dissipating structures provided by the first aspect of the present application spliced together; and a plurality of solar cell pieces laid on the back plate.

[0018] Compared with the prior art, the modular sound-absorbing and heat-dissipating structure for the photovoltaic panel and the photovoltaic panel have the following beneficial effects:

[0019] The modular sound absorption and heat dissipation structure of the embodiment of the present application integrates the micro-perforated plate and the hybrid film resonator in a smaller structure. The micro-perforated plate can not only serve as a protective plate of the modular sound absorption and heat dissipation structure, but also absorb the medium-high frequency noise passing through the micro-perforated plate. At this time, the main noise entering the rectangular groove is medium-low frequency noise, and the frequency of the medium-low frequency noise is suitable for driving the resonator. Further, the hybrid film resonator can convert the sound wave energy into vibration energy, thereby driving the gas flow in the rectangular groove, converting the negative noise into gas flow, and further achieving a positive heat dissipation effect.

[0020] Meanwhile, the modular design enables the modular sound absorption and heat dissipation structure of the embodiment of the present application to adapt to solar panels of various sizes, without the need to design separate sound insulation and heat dissipation structures for photovoltaic power plants of different specifications, greatly improving the versatility. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of a modular sound absorption and heat dissipation structure exemplarily shown by the embodiment of the present application.

[0022] Figure 2 is a structural sectional view of a modular sound absorption and heat dissipation structure exemplarily shown by the embodiment of the present application.

[0023] Figure 3 is a vibration schematic diagram of a hybrid film resonator exemplarily shown by the embodiment of the present application.

[0024] Figure 4 is a vibration schematic diagram of a hybrid film resonator in another direction exemplarily shown by the embodiment of the present application.

[0025] Figure 5 is a schematic diagram of the sound absorption spectrum of a hybrid film resonator under different acoustic boundary conditions exemplarily shown by the embodiment of the present application.

[0026] Figure 6 is a schematic diagram of a drainage structure of a modular sound absorption and heat dissipation structure exemplarily shown by the embodiment of the present application.

[0027] Figure 7 is an assembly schematic diagram of adjacent modular sound absorption and heat dissipation structures exemplarily shown by the embodiment of the present application.

[0028] Figure 8 is a schematic diagram of a bottom drainage structure of a modular sound absorption and heat dissipation structure exemplarily shown by the embodiment of the present application.

[0029] Figure 9 is a structural schematic diagram of a photovoltaic panel exemplarily shown by the embodiment of the present application.

[0030] REFERENCE NUMERALS:

[0031] 1. Photovoltaic panel, 10. Backsheet, 11. Modular sound-absorbing heat dissipation structure, 12. Solar cell, 111. Rectangular groove, 112. Micro-perforated plate, 113. Hybrid film resonator, 114. First C-shaped member, 115. Second C-shaped member, 1111. First side, 1112. Second side, 1113. Third side, 1114. Fourth side, 1115. Bottom surface, 1131. Thin film, 1132. Mass, 1141. Groove, 1151. Protrusion, 11131. Drainage groove, 11121. Drainage hole. DETAILED DESCRIPTION

[0032] The specific embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0033] In the description of the present application, it should be understood that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are intended to distinguish similar objects, and are not intended to describe a specific structure. It should be understood that under appropriate circumstances, such terms can be interchanged, so that the embodiments of the present application can be implemented in structures other than those shown or described. In addition, "include", "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a product or device including a series of components or units need not be limited to only those components or units explicitly listed, but can also include other components or units not explicitly listed but inherent to such products or devices.

[0034] At present, with the increasing integration of power facilities and residential area planning, the importance of substation noise control and green energy integration is increasingly highlighted. According to the "Industrial Enterprise Boundary Environmental Noise Emission Standard" (GB12348-2008) 2 regional requirements, the daytime noise of substation should be controlled within 60dB(A), and the nighttime noise should not exceed 50dB(A).

[0035] However, the conventional photovoltaic backsheet is relatively dense in structure and lacks targeted acoustic design, so its sound insulation effect is not satisfactory and cannot effectively block the noise inside the substation from spreading outside. More importantly, the photovoltaic backsheet generates a large amount of heat during operation, and the existing heat dissipation means is mostly inefficient, resulting in high temperature of the backsheet, which in turn leads to the decrease of photovoltaic power generation efficiency, which to a large extent limits the comprehensive benefits of photovoltaic and building integration technology.

[0036] For sound insulation and heat dissipation problems, the prior art always separates the sound absorption and heat dissipation functions for design, so that the sound absorption structure needs to occupy the valuable building space, which conflicts with the installation layout of the photovoltaic backboard. The heat dissipation device such as forced air cooling system will produce secondary noise due to the operation of mechanical parts during operation, which will weaken the overall noise reduction effect.

[0037] Based on this, as shown in the preferred embodiment of the present application, a modular sound absorption and heat dissipation structure 11 for a photovoltaic panel 1 is provided, and a plurality of modular sound absorption and heat dissipation structures 11 are spliced into the backboard 10 of the photovoltaic panel 1. The modular sound absorption and heat dissipation structure 11 can include a rectangular groove 111, a micro-perforated plate 112, and a hybrid film resonator 113. Figure 1

[0038] The micro-perforated plate 112 covers the slot of the rectangular groove 111 and is used to absorb part of the noise passing through the micro-perforated plate 112. The hybrid film resonator 113 is suspended in the rectangular groove 111 and is used to convert the energy of the noise passing through the micro-perforated plate 112 into vibration to drive the air circulation in the rectangular groove 111.

[0039] Through the above scheme, by means of the micro-perforated plate 112 which has both noise absorption and structural strength, and the hybrid film resonator 113 which is sensitive to vibration, noise can be absorbed and converted. Compared with traditional single sound insulation devices, this absorption and conversion structure can provide better noise reduction effect and has larger noise reduction capacity.

[0040] At the same time, since the hybrid film resonator 113 can convert sound wave energy into vibration, the negative effect of noise is converted into driving effect on the air in the rectangular groove 111, thereby improving the air flow in the micro-perforated plate 112 and the rectangular groove 111, and enhancing the heat dissipation effect.

[0041] Through the above scheme, the structural strength, noise reduction and heat dissipation are integrated. Since the size of the hybrid film resonator 113 is much smaller than that of the traditional axial flow fan and other electrical appliances, the integration degree is high and the occupied space is small.

[0042] In order to improve the structural strength and the heat dissipation effect of air circulation, and appropriately consider the weight, preferably, the micro-perforated plate 112 in the present application can be made of aluminum alloy material.

[0043] Furthermore, in order to further subdivide the filtering gradient of noise, in an embodiment of the present application, the thickness of the micro-perforated plate 112 can be 1 to 1.5 mm, the aperture on the micro-perforated plate 112 is 0.1 to 0.5 mm, and the perforation rate of the micro-perforated plate 112 is 4 to 8 percent.

[0044] ​It can be understood that the perforation rate refers to the ratio of the total area of all perforations on the plate to the total area of the plate.

[0045] Through the cooperation of these parameters, the aperture design of 0.1 to 0.5 millimeters forms a reasonable match with the wavelength of the medium-high frequency noise: when the sound wave passes through the small hole, it will produce significant frictional damping due to the small aperture, and the energy of the medium-high frequency sound wave is more easily consumed by this damping, thereby achieving effective attenuation.

[0046] The plate thickness of 1 to 1.5 millimeters cooperates with the perforation rate of 4 to 8 percent, which not only ensures that the sound wave can smoothly enter the small hole to form resonance noise reduction (too low perforation rate makes it difficult for the sound wave to enter, and too high perforation rate results in insufficient damping), but also increases the propagation path of the sound wave in the hole through the plate thickness, further strengthening energy loss, and ultimately achieving precise filtering of medium-high frequency noise.

[0047] The presence of the micro-perforated plate 112 filters out high-frequency noise that damages the structure of the hybrid film resonator 113 and has low conversion efficiency, effectively protecting the core structure of the hybrid film resonator 113 and prolonging its service life. High-frequency noise is concentrated and vibrates violently, and if it directly acts on the hybrid film resonator 113, it may cause fatigue damage (such as cracks and deformation) to the diaphragm due to long-term high-frequency vibration. The micro-perforated plate 112 attenuates such noise in advance, reducing the invalid vibration load of the hybrid film resonator 113 and reducing the risk of structural loss.

[0048] At the same time, this design can improve the energy conversion efficiency of the hybrid film resonator 113: after filtering out the high-frequency components with low conversion efficiency, the hybrid film resonator 113 can focus more on processing its adapted medium-low frequency noise, reducing invalid energy consumption, and making the overall system more targeted in energy recovery or signal processing, thereby optimizing performance output.

[0049] In addition, the cooperation of the micro-perforated plate 112 and the hybrid film resonator 113 can also widen the applicable frequency band of the overall noise reduction system: the micro-perforated plate 112 is responsible for the high frequency band, and the hybrid film resonator 113 focuses on the medium-low frequency band, forming a complementary noise processing coverage range, avoiding the performance shortcoming of a single structure in a wide frequency noise environment, and improving the system's ability to adapt to complex noise scenarios.

[0050] It can be understood that the hybrid film resonator 113 in this application refers to any kind of thin film 1131 structure that mixes two or more materials and can achieve stable resonance characteristics through the synergistic effect of the materials.

[0051] Therefore, in order to further improve the heat dissipation effect, such as Figure 1As shown in the embodiment of the present application, the rectangular groove 111 can include a first side 1111, a second side 1112, a third side 1113, a fourth side 1114 and a bottom 1115, the first side 1111 and the third side 1113 are opposite, and the second side 1112 and the fourth side 1114 are opposite.

[0052] As shown in the embodiment of the present application, the rectangular groove 111 can include a first side 1111, a second side 1112, a third side 1113, a fourth side 1114 and a bottom 1115, the first side 1111 and the third side 1113 are opposite, and the second side 1112 and the fourth side 1114 are opposite. Figure 2 As shown in the embodiment of the present application, the rectangular groove 111 can include a first side 1111, a second side 1112, a third side 1113, a fourth side 1114 and a bottom 1115, the first side 1111 and the third side 1113 are opposite, and the second side 1112 and the fourth side 1114 are opposite.

[0053] Through the above scheme, the distance between the end of the thin film 1131 close to the second side 1112 and the bottom 1115 is greater than the distance between the end of the thin film 1131 close to the fourth side 1114 and the bottom 1115, so that the thin film 1131 is placed in the rectangular groove 111 in a diagonal direction, so that the thin film 1131 is placed in the rectangular groove 111 in a diagonal direction. Figures 2-4 For example, the perspective view of the rectangular groove can be divided into two spaces with trapezoidal cross sections.

[0054] Further referring to Figure 3 When the mass block 1132 vibrates towards the direction close to the bottom 1115, the right trapezoidal space becomes larger and the pressure becomes smaller, and the cold air that has not contacted the solar cell 12 enters from here. At the same time, the left trapezoidal space in the figure becomes smaller and the pressure becomes larger, and the hot air in the trapezoidal space is discharged at the same time, realizing one-way heat exchange.

[0055] Further, referring to Figure 4 When the mass block 1132 vibrates towards the direction close to the micro-perforated plate 112, the left trapezoidal space becomes larger and the pressure becomes smaller, and Figure 3 The cold air in the left trapezoidal space further enters the left trapezoidal space, and the cold air contacts the solar cell 12 to achieve cooling. Due to the characteristics of sound waves, the mass block 1132 can be continuously driven to vibrate back and forth, and the thin film 1131 can be continuously driven to drive the flow of cold air and hot air, thereby achieving continuous heat dissipation.

[0056] In the prior art, sound insulation cotton, sound insulation wall and the like form strong reflection of noise energy, and basically do not project, that is, an AHBC (Acoustic Hard Boundary Condition) is formed.

[0057] In the present application, the separation pumping effect of the hybrid membrane resonator 113 forms an ASBC (Acoustic Soft Boundary Condition). The difference between the hybrid membrane resonator 113 and the conventional thin film 1131 type acoustic metamaterial lies in that the hybrid membrane resonator 113 usually combines multiple materials or structures (such as the thin film 1131 and the mass block 1132, the cavity design), and achieves wideband or tunable acoustic wave regulation through multi-physical field coupling (mechanical-acoustic interaction). The resonance mechanism is more complex, and the frequency limitation of the single thin film 1131 structure can be broken through. While the conventional thin film 1131 type acoustic metamaterial is based on the single thin film 1131 vibration mode, and relies on the tension and mass distribution of the thin film 1131 itself to realize acoustic wave reflection and absorption, and the regulation frequency band is narrow and the structure design is relatively single.

[0058] From the technical mechanism, the prior art relies on the strong reflection characteristics of the acoustic hard boundary (AHBC) to noise, although it can block noise to some extent, but the essence is “passive blocking”, which cannot effectively regulate low-frequency noise (such as 50-200Hz), and is easy to cause secondary reflection interference due to energy concentration. While the present application constructs an acoustic soft boundary (ASBC) through the hybrid membrane resonator 113, and realizes the transformation from “passive reflection” to “active regulation” by combining the “separation pumping” effect.

[0059] The hybrid membrane resonator 113 and the micro-perforated panel 112 form a Helmholtz resonance for low-frequency noise, and the hybrid membrane resonator 113 and the bottom surface 1115 are coupled through the thin film 1131 opening and the surrounding structure to absorb medium and high frequency noise, thereby realizing full-band sound absorption of 50-4000Hz, and the average sound absorption coefficient is above 0.7.

[0060] As shown in Figure 5 Compared with the acoustic hard boundary (AHBC) case, the absorption peak of the hybrid membrane resonator 113 with the acoustic soft boundary (ASBC) considered not only has a lower frequency, but also shows a wider sound absorption band.

[0061] Therefore, when the acoustic wave is incident, the micro-perforated panel 112 first filters the medium and high frequency noise, the low frequency acoustic wave (50-200Hz) excites the resonant system formed by the thin film 1131 and the mass block 1132 to resonate, and the strip-shaped opening of the acoustic soft boundary guides the vibration energy to the air turbulence to avoid energy concentration caused by the rigid fixation of the thin film 1131.

[0062] It can be understood that in the present application, the size parameters and position parameters of the micro-perforated panel 112 and the thin film 1131 can be adjusted.

[0063] By adjusting the position of the mass 1132 and the tilt angle of the film 1131, the resonance frequency can be precisely tuned to the target low frequency band (such as 100 Hz power frequency noise), the sound absorption coefficient is increased to 25-30 dB, and the frequency band width is expanded to 50-500 Hz (traditional AHBC structure is only 50-200 Hz).

[0064] In the preferred parameters of the application, the thickness of the film 1131 can be 0.1 to 0.5 mm, and the distance between the film 1131 and the second side 1112 and the distance between the film 1131 and the third side 1113 is 2 to 5 mm.

[0065] The adjustability of the thickness (0.1-0.5 mm) and the distance (2-5 mm) of the film 1131 further enhances the adaptability of the structure to different scene noise, and significantly improves the flexibility and efficiency of low-frequency noise reduction.

[0066] In an embodiment, the mass 1132 is a copper alloy, the mass of the mass 1132 is 0.1 to 5 grams, the mass 1132 is fixed on the film 1131, and the distance between the mass 1132 and the end of the film 1131 close to the fourth side 1114 is one-third of the length of the film 1131.

[0067] In this embodiment, the copper alloy mass 1132 has strong stability, provides a stable inertial load for the "film 1131-mass 1132" resonance system, and ensures consistent vibration response. The mass range of 0.1-5 grams can flexibly match the stiffness of the film 1131 to achieve precise tuning of the 50-500 Hz low frequency band. Fixed at one-third of the length of the film 1131, it optimizes the vibration mode, enhances the energy capture and transfer efficiency to air turbulence, and reduces invalid reflection. The three work together to improve low-frequency sound absorption performance, and further widen the noise reduction frequency band with the micro-perforated plate 112.

[0068] In an embodiment, the distance between the end of the film 1131 close to the second side 1112 and the bottom surface 1115 is 30 mm, and the distance between the end of the film 1131 close to the fourth side 1114 and the bottom surface 1115 is 10 mm.

[0069] The inclined structure strengthens the energy transfer efficiency to air turbulence, reduces invalid reflection, and works with the mass 1132 position and parameters to further improve low-frequency sound absorption performance and widen the application range of the noise reduction system.

[0070] Correspondingly, in an embodiment of the application, a unique drainage structure is designed for the above-mentioned structure. For example, Figure 6 and Figure 7As shown, the outer side of the second side 1112 is provided with a first C-shaped member 114, and the outer side of the fourth side 1114 is provided with a second C-shaped member 115. The opening direction of the first C-shaped member 114 is opposite to that of the second C-shaped member 115. The middle part of the first C-shaped member 114 is provided with a groove 1141, and the middle part of the second C-shaped member 115 is provided with a protrusion 1151 matched with the groove 1141. Adjacent modular sound-absorbing and heat-dissipating structures 11 are spliced by the buckling of the first C-shaped member 114 and the second C-shaped member 115.

[0071] Through this embodiment, the first C-shaped member 114 and the second C-shaped member 115 not only realize the stable connection of adjacent modular sound-absorbing and heat-dissipating structures 11, but also further form a water drainage channel penetrating up and down, thereby improving the utilization rate of space.

[0072] Furthermore, in a further embodiment, as shown in Figure 8 The end of the third side 1113 close to the second side 1112 can be lower than the end of the third side 1113 close to the fourth side 1114. A water drainage groove 11131 is opened on the third side 1113, and a water drainage hole 11121 is opened on the second side 1112. The position of the water drainage hole 11121 corresponds to the position of the water drainage groove 11131.

[0073] Since the third side 1113 is inclined (closer to the second side 1112 end is lower), it can guide the water flow to converge. In combination with the water drainage groove 11131 on the third side 1113 and the corresponding water drainage hole 11121 on the second side 1112, the accumulated water can be efficiently drained. This avoids the erosion of the core components such as the film 1131 and the mass 1132, ensures the stable operation of the resonance system, improves the applicability of the device in humid or rainy environments, and synergistically enhances the overall reliability with the noise reduction function.

[0074] Specifically, the angle between the third side 1113 and the horizontal plane is 2.5 to 3.5 degrees.

[0075] Correspondingly, as shown in Figure 9 The application also provides a photovoltaic panel 1, which can include a back plate 10 and a plurality of solar cell pieces 12. The back plate 10 includes a plurality of modular sound-absorbing and heat-dissipating structures 11 in any of the embodiments spliced together, and the plurality of solar cell pieces 12 are laid on the back plate 10.

[0076] The photovoltaic panel 1 in the application includes all the technical features of the modular sound-absorbing and heat-dissipating structure 11 in the application. Therefore, the embodiments and advantages of the modular sound-absorbing and heat-dissipating structure 11 are applicable to the photovoltaic panel 1 in the application, and will not be described again.

[0077] The modular sound absorption and heat dissipation structure 11 for the photovoltaic panel 1 and the photovoltaic panel 1 have the beneficial effects compared with the prior art that:

[0078] The modular sound absorption and heat dissipation structure 11 integrates the micro-perforated plate 112 and the hybrid film resonator 113 in a small structure, the micro-perforated plate 112 can not only serve as a protective plate of the modular sound absorption and heat dissipation structure 11, but also absorb the medium-high frequency noise passing through the micro-perforated plate 112, at this time, the main low-frequency noise enters the rectangular groove 111, and the frequency of the low-frequency noise is suitable for driving the resonator, further, the hybrid film resonator 113 is adopted, which can convert the sound wave energy into vibration energy, and further drive the gas flow in the rectangular groove 111, and convert the negative noise into the gas flow, thereby achieving the positive heat dissipation effect.

[0079] Meanwhile, the modular design enables the modular sound absorption and heat dissipation structure 11 to adapt to solar panels of various sizes, without the need to separately design sound insulation and heat dissipation structures for photovoltaic power plants of different specifications, greatly improving the universality.

[0080] The above is only the preferred embodiment of the present application, and it should be pointed out that for ordinary skilled persons in the art, some improvements and replacements can be made without departing from the technical principles of the present application, and these improvements and replacements should be regarded as the protection scope of the present application.

Claims

1. A modular sound absorption and heat dissipation structure for photovoltaic panels, characterized in that: A plurality of the modular sound-absorbing and heat-dissipating structures (11) are spliced ​​together to form a back plate (10) of the photovoltaic panel (1), and the modular sound-absorbing and heat-dissipating structure (11) comprises: rectangular groove (111); A micro-perforated plate (112), the micro-perforated plate (112) covering the notch of the rectangular groove (111) and used to absorb part of the noise passing through the micro-perforated plate (112); A hybrid film resonator (113) is suspended in the rectangular groove (111) and is used to convert the energy of the noise passing through the micro-perforated plate (112) into vibration to drive the air circulation in the rectangular groove (111).

2. The modular sound absorption and heat dissipation structure according to claim 1, characterized in that: The thickness of the micro-perforated plate (112) is 1 to 1.5 mm, the aperture of the micro-perforated plate (112) is 0.1 to 0.5 mm, and the perforation rate of the micro-perforated plate (112) is 4 to 8 percent.

3. The modular sound-absorbing and heat-dissipating structure (11) according to claim 1, characterized in that: The rectangular groove (111) comprises a first side surface (1111), a second side surface (1112), a third side surface (1113), a fourth side surface (1114) and a bottom surface (1115), wherein the first side surface (1111) and the third side surface (1113) are opposite to each other, and the second side surface (1112) and the fourth side surface (1114) are opposite to each other; The hybrid membrane resonator (113) includes a thin film (1131), a mass block (1132) is provided in the middle of the thin film (1131), the thin film (1131) is fixedly connected between the first side surface (1111) and the third side surface (1113), and there is a gap between the thin film (1131) and the second side surface (1112), and between the thin film (1131) and the third side surface (1113), and the gap between the end of the thin film (1131) close to the second side surface (1112) and the bottom surface (1115) is greater than the gap between the end of the thin film (1131) close to the fourth side surface (1114) and the bottom surface (1115).

4. The modular sound absorption and heat dissipation structure according to claim 3, characterized in that: The thickness of the film (1131) is 0.1 to 0.5 mm, and the distance between the film (1131) and the second side surface (1112) and between the film (1131) and the third side surface (1113) is 2 to 5 mm.

5. The modular sound absorption and heat dissipation structure according to claim 3, characterized in that: The mass block (1132) is made of copper alloy, and the mass of the mass block (1132) is 0.1 to 5 grams. The mass block (1132) is fixed on the film (1131), and the distance between the mass block (1132) and the end of the film (1131) close to the fourth side surface (1114) is one third of the length of the film (1131).

6. The modular sound absorption and heat dissipation structure according to claim 3, characterized in that: The distance between the end of the film (1131) close to the second side surface (1112) and the bottom surface (1115) is 30 mm, and the distance between the end of the film (1131) close to the fourth side surface (1114) and the bottom surface (1115) is 10 mm.

7. The modular sound absorption and heat dissipation structure according to claim 3, characterized in that: A first C-shaped member (114) is provided on the outer side corresponding to the second side surface (1112), and a second C-shaped member (115) is provided on the outer side corresponding to the fourth side surface (1114). The opening direction of the first C-shaped member (114) is opposite to the opening direction of the second C-shaped member (115). A groove (1141) is provided in the middle of the first C-shaped member (114), and a protrusion (1151) matching the groove (1141) is provided in the middle of the second C-shaped member (115). Adjacent modular sound-absorbing and heat-dissipating structures (11) are spliced ​​together by fastening the first C-shaped member (114) and the second C-shaped member (115).

8. The modular sound absorption and heat dissipation structure according to claim 7, characterized in that: An end of the third side surface (1113) close to the second side surface (1112) is lower than an end of the third side surface (1113) close to the fourth side surface (1114); a drainage groove (11131) is provided on the third side surface (1113); a drainage hole (11121) is provided on the second side surface (1112); and the position of the drainage hole (11121) corresponds to the position of the drainage groove (11131).

9. The modular sound absorption and heat dissipation structure according to claim 8, characterized in that: The angle between the third side surface (1113) and the horizontal plane is 2.5 to 3.5 degrees.

10. A photovoltaic panel, characterized in that: The photovoltaic panel (1) comprises: A back panel (10), the back panel (10) comprising a plurality of modular sound-absorbing and heat-dissipating structures (11) according to any one of claims 1 to 9 spliced ​​together; A plurality of solar cell sheets (12), wherein the plurality of solar cell sheets (12) are laid on the back plate (10).

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