Vacuum switching device for a chip mounter

By designing a vacuum switching device in the pick-and-place machine and utilizing the switching and cleaning components of the adsorption zone, the problem of adsorption hole clogging was solved, thereby improving processing accuracy and efficiency.

CN120812930BActive Publication Date: 2026-01-16SHANGHAI RISE ELECTRONIC&TECH CO LTD
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Patent Information

Application Number
CN202510960548.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-07-11
Publication Date
2026-01-16
Estimated Expiration
2045-07-11

AI Technical Summary

Technical Problem

In existing pick-and-place machines, the adsorption holes are easily clogged by component residues and dust, resulting in reduced adsorption efficiency and affecting processing accuracy.

Method used

A vacuum switching device for a pick-and-place machine is designed, comprising a base plate and a limiting plate, and setting first and second adsorption zones. The device achieves rapid switching and cleaning of the adsorption zones through adjustment and cleaning components. The device utilizes the positive and negative pressure of a vacuum pump to control the expansion and contraction of an elastic tube, thereby achieving automatic switching and cleaning of the adsorption zones.

Benefits of technology

It enables rapid switching and cleaning when the adsorption pores are clogged, ensuring stable adsorption of the substrate, improving processing accuracy and efficiency, and reducing the impact on the processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to chip production technical field, especially a kind of vacuum switching device of chip mounter, comprising: bottom plate and limit board, the limit board is set on bottom plate upside, and two openings are opened in limit board, the bottom plate is provided with a plurality of adsorption holes, a plurality of the adsorption holes are respectively communicated by two groups of air pipes, and first adsorption area and second adsorption area are formed in the two openings of limit board respectively, the number of adsorption hole in the first adsorption area is more than the number in the second adsorption area;The middle part of the bottom plate is provided with mounting port, and the bottom plate bottom is connected with the mounting pipe that is communicated with mounting port, the inside of the mounting port is provided with adjusting assembly, the adjusting assembly includes adjusting pipe, elastic tube, adjusting port and two cleaning ports, the adjusting pipe is rotatably arranged in the inside of mounting port, the elastic tube is folding pipe.The present application provides two different adsorption areas of suction force, and the adsorption area on both sides can be cleaned simultaneously.
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Description

TECHNICAL FIELD

[0001] The present application relates to the chip production technical field, especially to a vacuum switching device of a chip mounter. BACKGROUND

[0002] The chip mounter is the core equipment of surface mount technology and advanced packaging process, and is responsible for high-precision mounting of bare chips, wafer-level packaging elements, multi-chip modules and other precision devices on a substrate or lead frame. In the process of mounting, the position of the substrate needs to be fixed.

[0003] The patent with publication number CN114760773A discloses a displacement-preventing patch device for an SMT chip mounter, relating to the technical field of chip mounters, comprising a base and a guide seat. A conveying assembly is movably installed on the front and rear sides of the base. The guide seat is located below the conveying assembly. The top of the guide seat is provided with a sliding rail, and a sliding plate is movably installed on the sliding rail through a sliding block. The sliding plate is provided with multiple groups. The top of each group of the sliding plate is provided with an electric telescopic rod, and the output end of the electric telescopic rod is provided with a supporting box. The top of the supporting box is provided with a suction hole, and multiple groups of suction holes are provided. The patch device transmits the substrate through the conveying assembly, provides suction force through the suction pump and the stretching pipe, and fixes and prevents displacement of the substrate through the suction force acting on the substrate from the suction hole. The entire fixing process does not use hard clamping, thereby avoiding damage to the substrate.

[0004] During the process of adsorbing the substrate by the suction hole, some component residues may block the suction nozzle hole or environmental dust may enter the air path, thereby reducing the adsorption effect of the suction hole and making it difficult to effectively fix the substrate during processing, which affects the processing precision. SUMMARY

[0005] The purpose of the present application is to solve the problem that some component residues may block the suction nozzle hole or environmental dust may enter the air path in the prior art, thereby reducing the adsorption effect of the suction hole and making it difficult to effectively fix the substrate during processing, which affects the processing precision. A vacuum switching device of a chip mounter is provided.

[0006] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0007] A vacuum switching device of a chip mounter, comprising a base plate and a limiting plate, the limiting plate is arranged on the upper side of the base plate, and two openings are formed in the limiting plate. A plurality of suction holes are arranged on the base plate. The plurality of suction holes are communicated by two groups of air pipes. The first suction area and the second suction area are formed in the two openings of the limiting plate. The number of suction holes in the first suction area is more than that in the second suction area.

[0008] The middle of the bottom plate is provided with a mounting port, and the bottom of the bottom plate is connected with a mounting pipe communicated with the mounting port, the inside of the mounting port is provided with an adjusting assembly, the adjusting assembly comprises an adjusting pipe, an elastic pipe, an adjusting port and two cleaning ports, the adjusting pipe is rotationally arranged in the inside of the mounting port, the elastic pipe is a folding pipe and is rotationally connected at the bottom of the adjusting pipe for driving the adjusting pipe to move up and down, the adjusting port is formed in the side edge of the adjusting pipe, the adjusting rod is rotated to make the adjusting port communicated with the elastic pipe in the first adsorption area and the second adsorption area, and the two cleaning ports are symmetrically formed in the adjusting pipe and symmetrically arranged below the adjusting port for communicating the first adsorption area and the second adsorption area.

[0009] Preferably, the bottom of the mounting pipe is provided with a partition ring, the middle of the partition ring is provided with an opening communicated with the bottom of the adjusting pipe, the opening is provided in the shape of an inverted circular truncated cone, and a plurality of guide ports communicated with the elastic pipe are formed in the side edge of the partition ring.

[0010] Preferably, a rotating rod is fixed to the upper end of the adjusting pipe, and the rotating rod is used to drive the adjusting pipe to rotate.

[0011] Preferably, a limiting assembly is arranged between the mounting pipe and the elastic pipe, the limiting assembly is used to limit the rotation of the adjusting pipe, the limiting assembly comprises two limiting rings and a pressing ring, the pressing ring is fixedly connected to the bottom end of the adjusting pipe, the two limiting rings are fixedly connected to the inner wall of the mounting pipe, and the pressing ring is located between the two limiting rings.

[0012] Preferably, the diameter of the upper segment of the mounting port is larger than that of the lower segment, a sealing ring is arranged at the top end of the adjusting pipe, the sealing ring is arranged in the upper segment of the mounting port, and the sealing ring is used to limit the downward position of the adjusting pipe.

[0013] Preferably, a sliding port is formed in the middle of the limiting plate between the first adsorption area and the second adsorption area, a cleaning assembly is arranged in the inside of the sliding port, and the cleaning assembly is used to clean the bottom plate.

[0014] Preferably, the cleaning assembly comprises a telescopic pipe, a sliding block, two side frames and two cleaning sheets, the telescopic pipe is fixedly installed at one end of the sliding port, the sliding block is fixedly connected to the other end of the telescopic pipe and is slidably arranged in the inside of the sliding port, the two side frames are symmetrically fixedly connected to the two sides of the sliding block, and the two cleaning sheets are respectively fixedly connected to the end portions of the two side frames and are in contact with the bottom plate.

[0015] Preferably, the sliding port is a strip-shaped port, the middle of the sliding port is circular, the two sides of the sliding port are downwardly inclined strip-shaped ports, and the diameter of the middle of the sliding port is larger than the diameter of the telescopic pipe after contraction.

[0016] Preferably, the adjusting pipe is provided with a connecting port at the top, and a connecting assembly is arranged in the connecting port, which is used for connecting the adjusting pipe and the telescopic pipe.

[0017] Preferably, the connecting assembly comprises a rotating piece, a mounting piece and a communicating pipe, the rotating piece is rotatably arranged in the connecting port, the mounting piece is fixedly connected to the side edge of the limiting plate and fixedly connected with the telescopic pipe, and the communicating pipe is fixedly connected between the rotating piece and the mounting piece.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] 1. By arranging the first and second adsorption areas on the base plate, when the adsorption area on one side is blocked, the adjusting port can be transferred from the adsorption area on one side to the adsorption area on the other side through the rotation of the adjusting pipe, so that the adsorption area can be quickly replaced. In addition, due to the different weights of the base plates, in order to ensure the adsorption and fixation of base plates with different weights, when the mass of the base plate is small, the first adsorption area with more adsorption holes and greater suction force can be selected for adsorption and fixation, and when the mass of the base plate is large, the second adsorption area can be selected for adsorption and fixation, so that the base plate can be selected automatically according to the adsorption.

[0020] 2. When the first and second adsorption areas are cleaned regularly, the positive and negative pressures of the vacuum pump are selected, and air is introduced into the adjusting pipe through the vacuum pump. At this time, the cleaning ports on both sides are in communication with the first and second adsorption areas, so that the air pipe and the adsorption holes can be quickly cleaned.

[0021] 3. By the inflation and suction of the vacuum pump, the positive and negative pressures in the elastic pipe are adjusted, so that the extension and contraction states of the elastic pipe are controlled, and the adjusting pipe is driven to move up and down. When the elastic pipe is in a negative pressure state, the adjusting pipe is used for negative pressure adsorption, and when the elastic pipe is in a positive pressure state, the adjusting pipe is used for cleaning.

[0022] 4. By arranging two limiting rings in the mounting pipe and an extrusion ring at the upper end of the adjusting pipe, when the elastic pipe is in a contraction state, the extrusion ring below the adjusting pipe elastically extrudes the limiting ring below, and when the elastic pipe is in an elongation state, the extrusion ring below the adjusting pipe elastically extrudes the limiting ring above. Therefore, in the working state, the limiting assembly generates a vertical force to limit the position of the adjusting pipe, and the adjusting interval of the adjusting pipe is limited.

[0023] 5、When the vacuum pump is inflated, the normal ventilation is first cleaned, the dust and impurities in the adsorption hole and the ventilation pipe are cleaned, after a period of time, the power of the vacuum pump is improved, because the adsorption hole is small, the continuously inhaled gas cannot be quickly discharged, which will make the excess gas extrude into the telescopic pipe, thereby driving the telescopic pipe to expand and extend, pushing the sliding block, and the sliding block slides in the sliding hole, the moving sliding block drives the cleaning pieces on both sides to move on the surface of the bottom, the cleaning pieces on both sides push the cleaned dust and impurities in a direction, and the dust and impurities are pushed to one side, thereby facilitating the later cleaning. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a front structure schematic view of a patch machine vacuum switching device provided by the application;

[0025] Figure 2 It is a bottom structure schematic view of a patch machine vacuum switching device provided by the application;

[0026] Figure 3 It is an adsorption hole structure schematic view of a patch machine vacuum switching device provided by the application;

[0027] Figure 4 It is an adjusting pipe structure schematic view of a patch machine vacuum switching device provided by the application;

[0028] Figure 5 It is a bottom plate cross-section structure schematic view of a patch machine vacuum switching device provided by the application;

[0029] Figure 6 It is Figure 5 It is an enlarged structure schematic view of A in the middle;

[0030] Figure 7 It is an adjusting assembly cross-section structure schematic view of a patch machine vacuum switching device provided by the application;

[0031] Figure 8 It is a connecting assembly cross-section structure schematic view of a patch machine vacuum switching device provided by the application;

[0032] Figure 9 It is a cleaning assembly structure schematic view of a patch machine vacuum switching device provided by the application.

[0033] In the figure: 1, bottom plate; 2, limiting plate; 3, adsorption hole; 4, mounting pipe; 5, adjusting assembly; 51, adjusting pipe; 52, elastic pipe; 53, adjusting port; 54, cleaning port; 6, limiting assembly; 61, limiting ring; 62, extrusion ring; 7, cleaning assembly; 71, telescopic pipe; 72, sliding block; 73, side frame; 74, cleaning piece; 8, connecting assembly; 81, rotating piece; 82, mounting piece; 83, communication pipe; 9, spacer ring; 10, rotating rod. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0035] The terms such as "upper", "lower", "left", "right", "middle" and "one" cited in the present application are only for the convenience of clear description, not to limit the scope of the present application, and the change or adjustment of the relative relationship is also regarded as the implementable scope of the present application without substantial change of the technical content.

[0036] Reference Figures 1-9 A vacuum switching device of a patch machine, comprising: a bottom plate 1 and a limiting plate 2, the limiting plate 2 is arranged on the upper side of the bottom plate 1, and two openings are formed in the limiting plate 2, a plurality of adsorption holes 3 are arranged on the bottom plate 1, the plurality of adsorption holes 3 are communicated through two groups of air pipes, and a first adsorption area and a second adsorption area are respectively formed in the two openings of the limiting plate 2, and the number of the adsorption holes 3 in the first adsorption area is more than that in the second adsorption area.

[0037] A mounting port is arranged in the middle of the bottom plate 1, and a mounting pipe 4 connected with the mounting port is connected to the bottom of the bottom plate 1, an adjusting assembly 5 is arranged in the mounting port, the adjusting assembly 5 comprises an adjusting pipe 51, an elastic pipe 52, an adjusting port 53 and two cleaning ports 54, the adjusting pipe 51 is rotationally arranged in the mounting port, the elastic pipe 52 is a folding pipe and is rotationally connected to the bottom of the adjusting pipe 51, for driving the adjusting pipe 51 to move up and down, the adjusting port 53 is formed in the side of the adjusting pipe 51, the adjusting rod is rotated to make the adjusting port 53 switch the communication of the air pipes in the first adsorption area and the second adsorption area, and the two cleaning ports 54 are symmetrically formed on the adjusting pipe 51 and symmetrically arranged below the adjusting port 53, for communicating the first adsorption area and the second adsorption area.

[0038] In the embodiment of the application, during the vacuum adsorption of the substrate, residues at the bottom of the substrate and dust in the environment will be transferred to the inside of the adsorption hole 3, causing the adsorption hole 3 to be blocked, and after the adsorption hole 3 is blocked, timely cleaning is required, otherwise the adsorption effect on the substrate will be affected, but the cleaning will affect the processing efficiency of the chip mounter.

[0039] When the substrate is placed above the limiting plate 2, the two adsorption areas below are located below the substrate, and a vacuum adsorption area can be formed, by arranging the first adsorption area and the second adsorption area on the bottom plate 1, after the adsorption area on one side is blocked, the adjusting pipe 51 is rotated to transfer the adjusting opening 53 from the communication of the adsorption area on one side to the communication of the adsorption area on the other side, and the adsorption area is quickly replaced, and because the weights of the substrates are different, in order to ensure the adsorption and fixation of substrates with different weights, when the mass of the substrate is small, the first adsorption area with more adsorption holes 3 and large suction force can be selected for adsorption and fixation, and when the mass of the substrate is large, the second adsorption area can be selected for adsorption and fixation, and the substrate is automatically selected according to the adsorption;

[0040] At the same time, when the first adsorption area and the second adsorption area are cleaned regularly, the positive and negative pressures of the vacuum pump are adjusted, the inside of the adjusting pipe 51 is ventilated through the vacuum pump, and the cleaning openings 54 on both sides are in communication with the first adsorption area and the second adsorption area at the same time, and the air pipe and the adsorption hole 3 are quickly cleaned.

[0041] The application provides two adsorption areas with different suction forces, which can be quickly switched to the other side for adsorption when the adsorption hole 3 on one side is blocked and the adsorption force is insufficient, ensuring the adsorption of the substrate during long-time processing, and the adsorption areas on both sides can be cleaned regularly at the same time.

[0042] The preferred technical solutions in the embodiment are as follows:

[0043] Referring to Figure 6 The mounting pipe 4 is provided with a partition ring 9 at the bottom, the middle of the partition ring 9 is provided with an opening in communication with the bottom of the adjusting pipe 51, the opening is in the shape of an inverted circular truncated cone, and a plurality of guide openings in communication with the elastic pipes 52 are arranged on the side of the partition ring 9.

[0044] The partition ring 9 divides the mounting pipe 4 into a central through opening part and an outer blocking part, and divides the air flow formed during the air suction and inflation of the vacuum pump. When the vacuum pump is not working, the elastic pipe 52 is used to support the adjusting pipe 51 due to the elasticity of the elastic pipe 52. The outer side of the elastic pipe 52 is a folded elastic ring, and the ring has an air cavity inside. An elastic member (which can be a spring or an elastic strip) is arranged inside to support and prolong the service life of the elastic pipe 52. The elastic pipe 52 is arranged staggered with the adjusting opening 53 and the two cleaning openings 54 on the side, which reduces the dust in the air from entering the inside of the adjusting pipe 51 and avoids blocking the connection position of the mounting pipe 4 and the vacuum pump when not in use.

[0045] During the air suction of the vacuum pump through the mounting pipe 4, the elastic pipe 52 is used to support the adjusting pipe 51 due to the elasticity of the elastic pipe 52. The outer side of the elastic pipe 52 is a folded elastic ring, and the ring has an air cavity inside. An elastic member (which can be a spring or an elastic strip) is arranged inside to support and prolong the service life of the elastic pipe 52. The elastic pipe 52 is arranged staggered with the adjusting opening 53 and the two cleaning openings 54 on the side, which reduces the dust in the air from entering the inside of the adjusting pipe 51 and avoids blocking the connection position of the mounting pipe 4 and the vacuum pump when not in use.

[0046] During the air suction of the vacuum pump through the mounting pipe 4, the elastic pipe 52 is used to support the adjusting pipe 51 due to the elasticity of the elastic pipe 52. The outer side of the elastic pipe 52 is a folded elastic ring, and the ring has an air cavity inside. An elastic member (which can be a spring or an elastic strip) is arranged inside to support and prolong the service life of the elastic pipe 52. The elastic pipe 52 is arranged staggered with the adjusting opening 53 and the two cleaning openings 54 on the side, which reduces the dust in the air from entering the inside of the adjusting pipe 51 and avoids blocking the connection position of the mounting pipe 4 and the vacuum pump when not in use.

[0047] Through the air suction and inflation of the vacuum pump, the positive and negative pressures in the elastic pipe 52 are adjusted, so as to control the stretching and contracting state of the elastic pipe 52 and drive the adjusting pipe 51 to move up and down. When the elastic pipe 52 is in a negative pressure state, the adjusting pipe 51 is used for negative pressure adsorption. When the elastic pipe 52 is in a positive pressure state, the adjusting pipe 51 is used for cleaning.

[0048] Referring to Figure 7 , the upper end of the adjusting pipe 51 is fixed with a rotating rod 10, and the rotating rod 10 is used to drive the adjusting pipe 51 to rotate.

[0049] Since the position of the adjusting opening 53 in the adjusting pipe 51 needs to be rotated and connected to the corresponding air pipe position, the rotating rod 10 can be manually rotated. At this time, the rotating rod 10 can be arranged in an L shape, or an electric push rod can be arranged outside to push the rotating rod 10. The rotating rod 10 drives the adjusting pipe 51 to rotate, so as to realize the rapid adjustment of the adsorption area.

[0050] With reference to Figure 7 , a limiting assembly 6 is arranged between the mounting pipe 4 and the elastic pipe 52, the limiting assembly 6 is used for limiting the rotation of the adjusting pipe 51, the limiting assembly 6 comprises two limiting rings 61 and a pressing ring 62, the pressing ring 62 is fixedly connected to the bottom end of the adjusting pipe 51, and the two limiting rings 61 are fixedly connected to the inner wall of the mounting pipe 4, and the pressing ring 62 is located between the two limiting rings 61.

[0051] In order to facilitate the rotation of the adjusting pipe 51, the adjusting pipe 51 is rotatably connected with the inside of the mounting cavity, and there is a small gap, but during the process of gas extraction or inflation, the horizontal movement of the gas between the adjusting pipe 51 and the vent pipe may push the adjusting pipe 51 in the gap, so that the adjusting pipe 51 is deflected, the vent area between the adjusting port 53 and the vent pipe is changed, and the flow speed of the gas is affected, thereby affecting the adsorption effect.

[0052] By arranging the two limiting rings 61 in the mounting pipe 4 and arranging the pressing ring 62 at the upper end of the adjusting pipe 51, when the elastic pipe 52 is in a contracted state, the pressing ring 62 below the adjusting pipe 51 elastically presses the limiting ring 61 below, and when the elastic pipe 52 is in an elongated state, the pressing ring 62 below the adjusting pipe 51 elastically presses the limiting ring 61 above, so that in the working state, the limiting assembly 6 generates a vertical force to limit the position of the adjusting pipe 51, and the adjusting distance of the adjusting pipe 51 is limited.

[0053] With reference to Figure 6 , the diameter of the upper section of the mounting port is greater than that of the lower section, and the adjusting pipe 51 is provided with a sealing ring at the top end, and the sealing ring is arranged on the upper section of the mounting port and is used for limiting the downward position of the adjusting pipe 51.

[0054] In order to avoid the influence of the gap between the adjusting pipe 51 and the mounting cavity on the normal flow of the gas, the elastic sealing ring is arranged above to seal the upper part of the gap, and the limiting ring 61 and the pressing ring 62 are elastically pressed to seal the lower part of the gap, so that a large amount of gas is prevented from entering the gap and affecting the normal flow of the gas.

[0055] With reference to Figure 8 and Figure 9 , the limiting plate 2 between the first adsorption area and the second adsorption area is provided with a sliding port in the middle, and the sliding port is provided with a cleaning assembly 7, and the cleaning assembly 7 is used for cleaning the bottom plate 1.

[0056] The cleaning assembly 7 comprises a telescopic pipe 71, a sliding block 72, two side frames 73 and two cleaning sheets 74, the telescopic pipe 71 is fixedly installed at one end of the sliding port, the sliding block 72 is fixedly connected at the other end of the telescopic pipe 71 and is slidingly arranged in the sliding port, the two side frames 73 are symmetrically fixedly connected at two sides of the sliding block 72, and the two cleaning sheets 74 are respectively fixedly connected at end portions of the two side frames 73 and are in contact with the bottom plate 1;

[0057] The sliding port is a strip-shaped port, the middle portion of the sliding port is circular, and the two sides are downwardly inclined strip-shaped ports, and the diameter of the middle portion of the sliding port is greater than the diameter of the telescopic pipe 71 after contraction;

[0058] The adjusting pipe 51 is provided with a connecting port at the top, and the connecting port is provided with a connecting assembly 8, which is used for connecting the adjusting pipe 51 and the telescopic pipe 71;

[0059] The connecting assembly 8 comprises a rotating piece 81, a mounting piece 82 and a communication pipe 83, the rotating piece 81 is rotatably installed in the connecting port, the mounting piece 82 is fixedly connected at the side edge of the limiting plate 2 and is fixedly connected with the telescopic pipe 71, and the communication pipe 83 is fixedly connected between the rotating piece 81 and the mounting piece 82.

[0060] During the adsorption of the substrate, residues such as solder paste and glue on the bottom of the substrate are transferred to the adsorption hole 3, causing the adsorption hole 3 to be blocked, and due to the negative pressure suction, floating dust in the air is transferred to the air pipe, causing the air pipe to be blocked, causing the suction force to fluctuate, affecting the adsorption effect of the substrate bottom, so the adsorption hole 3 and the air pipe need to be cleaned regularly.

[0061] During cleaning, the two cleaning ports 54 are communicated with the two air pipes through the expansion elastic pipe 52, and air is introduced into the air pipe and the adsorption hole 3 through the inflation of the vacuum pump, so that the dust in the air pipe is guided out from the adsorption hole 3 position, and at the same time for inflation, the blockage in the adsorption hole 3 can be sprayed and cleaned, and a continuous upward push is formed to avoid dust and debris from falling back.

[0062] When the vacuum pump is pumping, the gas in the telescopic pipe 71 is pumped out through the communication pipe 83, so that the telescopic pipe 71 is contracted, and the cleaning pieces 74 on both sides are moved to the position close to the mounting piece 82. When the vacuum pump is inflated, the dust and impurities in the adsorption hole 3 and the air pipe are cleaned normally. After a period of cleaning, the power of the vacuum pump is increased. Because the diameter of the adsorption hole 3 is small, the continuously pumped gas cannot be quickly discharged, which will make the excess gas extrude into the telescopic pipe 71, so as to drive the telescopic pipe 71 to expand and extend, push the sliding block 72, and make the sliding block 72 slide in the sliding hole. The moving sliding block 72 drives the cleaning pieces 74 on both sides to move on the surface of the bottom, and the dust and impurities cleaned out are pushed to one side through the cleaning pieces 74 on both sides, so as to facilitate the later cleaning.

[0063] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A patcher vacuum switching device, comprising: The application discloses a bottom plate (1) and a limiting plate (2), characterized in that the limiting plate (2) is arranged on the upper side of the bottom plate (1), two openings are formed in the limiting plate (2), a plurality of adsorption holes (3) are arranged on the bottom plate (1), the plurality of adsorption holes (3) are communicated through two groups of air pipes, and a first adsorption area and a second adsorption area are formed in the two openings of the limiting plate (2), respectively. The middle part of the bottom plate (1) is provided with a mounting port, and the bottom plate (1) is connected with a mounting pipe (4) which is communicated with the mounting port, the inside of the mounting port is provided with an adjusting assembly (5), the adjusting assembly (5) comprises an adjusting pipe (51), an elastic pipe (52), an adjusting port (53) and two cleaning ports (54), the adjusting pipe (51) is rotatably arranged in the mounting port, the elastic pipe (52) is a folding pipe and is rotatably connected to the bottom of the adjusting pipe (51) and is used for driving the adjusting pipe (51) to move up and down, the adjusting port (53) is arranged on the side of the adjusting pipe (51), and the adjusting rod is rotatable, so that the adjusting port (53) is switched and communicated with the elastic pipe (52) in the first adsorption area and the second adsorption area, and the two cleaning ports (54) are symmetrically arranged on the adjusting pipe (51) and are symmetrically arranged below the adjusting port (53) and are used for communicating the first adsorption area and the second adsorption area. The upper end of the adjusting pipe (51) is fixedly connected with a rotating rod (10), and the rotating rod (10) is used for driving the adjusting pipe (51) to rotate. The middle part of the limiting plate (2) between the first adsorption area and the second adsorption area is provided with a sliding port, and the inside of the sliding port is provided with a cleaning assembly (7), and the cleaning assembly (7) is used for cleaning the bottom plate (1). The cleaning assembly (7) comprises a telescopic pipe (71), a sliding block (72), two side frames (73) and two cleaning pieces (74), the telescopic pipe (71) is fixedly installed at one end of the sliding port, the sliding block (72) is fixedly connected to the other end of the telescopic pipe (71) and is slidably arranged in the sliding port, the two side frames (73) are fixedly connected to the two sides of the sliding block (72), and the two cleaning pieces (74) are fixedly connected to the end portions of the two side frames (73) and are in contact with the bottom plate (1). The top of the adjusting pipe (51) is provided with a connecting port, and the inside of the connecting port is provided with a connecting assembly (8), and the connecting assembly (8) is used for connecting the adjusting pipe (51) and the telescopic pipe (71). The connecting assembly (8) comprises a rotating piece (81), a mounting piece (82) and a communicating pipe (83), the rotating piece (81) is rotatably installed in the connecting port, the mounting piece (82) is fixedly connected to the side of the limiting plate (2) and is fixedly connected with the telescopic pipe (71), and the communicating pipe (83) is fixedly connected between the rotating piece (81) and the mounting piece (82).

2. The vacuum switching device of claim 1, wherein, The bottom of the installation pipe (4) is provided with a partition ring (9), an opening communicated with the bottom of the adjusting pipe (51) is formed in the middle of the partition ring (9), the opening is provided in the shape of an inverted circular truncated cone, and a plurality of guide openings communicated with the elastic pipe (52) are formed in the side edges of the partition ring (9).

3. The vacuum switching device of claim 1, wherein, A limiting assembly (6) is arranged between the installation pipe (4) and the elastic pipe (52), the limiting assembly (6) is used for limiting the rotation of the adjusting pipe (51), the limiting assembly (6) comprises two limiting rings (61) and a pressing ring (62), the pressing ring (62) is fixedly connected to the bottom end of the adjusting pipe (51), and the two limiting rings (61) are fixedly connected to the inner wall of the installation pipe (4); the pressing ring (62) is located between the two limiting rings (61).

4. The vacuum switching device of claim 1, wherein, The diameter of the upper section of the installation port is greater than that of the lower section, a sealing ring is arranged at the top end of the adjusting pipe (51), and the sealing ring is arranged on the upper section of the installation port and used for limiting the downward position of the adjusting pipe (51).

5. The vacuum switching device of claim 1, wherein, The sliding port is a strip-shaped port, the middle part of the sliding port is provided in the shape of a circle, and the two sides are provided in the shape of downwardly inclined strip-shaped ports; the diameter of the middle part of the sliding port is greater than the diameter of the telescopic pipe element (71) after contraction.

Citation Information

Patent Citations

  • Anti-displacement chip mounting device for SMT chip mounter

    CN114760773A

  • Chip mounter vacuum adsorption device

    CN208445937U